CN116679096A - Double-bending type semiconductor test probe - Google Patents
Double-bending type semiconductor test probe Download PDFInfo
- Publication number
- CN116679096A CN116679096A CN202310697478.3A CN202310697478A CN116679096A CN 116679096 A CN116679096 A CN 116679096A CN 202310697478 A CN202310697478 A CN 202310697478A CN 116679096 A CN116679096 A CN 116679096A
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- China
- Prior art keywords
- needle
- needle tube
- double
- test probe
- semiconductor test
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 48
- 238000005452 bending Methods 0.000 title claims abstract description 45
- 239000004065 semiconductor Substances 0.000 title claims abstract description 33
- 239000000523 sample Substances 0.000 title claims abstract description 32
- 238000003780 insertion Methods 0.000 claims description 8
- 230000037431 insertion Effects 0.000 claims description 8
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06722—Spring-loaded
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
The invention discloses a double-bending type semiconductor test probe which comprises a bending type needle tube, wherein one end of the bending type needle tube is provided with a first needle tube, a first needle head and a first spring are arranged in the first needle tube, the first spring is positioned between the tail part of the first needle head and the bottom part of the first needle tube, the other end of the bending type needle tube is provided with a second needle tube, a second needle head and a second spring are arranged in the second needle tube, and the second spring is positioned between the tail part of the second needle head and the bottom part of the second needle tube. The double-bending type semiconductor test probe solves the problem that the prior semiconductor test probe is difficult to realize electric connection test when being used if coaxial arrangement cannot be met between a contact point of a test machine and a product to be tested.
Description
Technical Field
The invention belongs to the technical field of semiconductor detection, and particularly relates to a double-bending type semiconductor test probe.
Background
The semiconductor test probe is widely applied to the technical fields of mobile phones, automobiles, medical treatment, aerospace and the like, and is a high-end electronic element.
The dual-ended semiconductor test probe generally consists of a needle tube and two needles at both ends of the needle tube. When the double-ended semiconductor test probe is used, the needle head at one end of the double-ended semiconductor test probe is connected with the tester, and the needle head at the other end of the double-ended semiconductor test probe is connected with a product to be tested, and because the two needle heads are generally coaxially assembled together, if the contact point of the tester and the product to be tested cannot be coaxially arranged, the electric connection test is difficult to be carried out through the two needle heads.
Disclosure of Invention
The invention aims to provide a double-bending type semiconductor test probe, which solves the problem that the prior semiconductor test probe is difficult to realize electric connection test when being used if coaxial arrangement cannot be met between a contact point of a tester and a product to be tested.
In order to solve the technical problems, the invention discloses a double-bending type semiconductor test probe which comprises a bending type needle tube, wherein one end of the bending type needle tube is provided with a first needle tube, a first needle head and a first spring are arranged in the first needle tube, the first spring is positioned between the tail part of the first needle head and the bottom part of the first needle tube, the other end of the bending type needle tube is provided with a second needle tube, a second needle head and a second spring are arranged in the second needle tube, and the second spring is positioned between the tail part of the second needle head and the bottom part of the second needle tube.
The technical scheme of the invention also has the following characteristics:
as a preferable mode of the invention, two ends of the bending needle tube are provided with insertion holes, and the first needle tube and the second needle tube are respectively arranged in the two insertion holes.
As a preferable mode of the invention, the port of the jack is formed with a necking, and the first needle tube and the second needle tube are limited in the necking.
As a preferable scheme of the invention, the port of the first needle tube and the port of the second needle tube are respectively provided with a necking, and the tail part of the first needle head and the tail part of the second needle head are limited in the necking.
As a preferable scheme of the invention, the bending needle tube comprises a transverse part, two ends of the transverse ratio are respectively provided with a vertical part which bends downwards and upwards, and the first needle tube and the second needle tube are respectively arranged in the two vertical parts.
Compared with the prior art: according to the double-bending type semiconductor test probe, in the use process, the bending shape of the double-bending type needle tube can be adjusted according to different distances between the trigger point of the test machine and a product to be tested, so that the test environment required by application is achieved, the test precision is ensured, and the test performance of the semiconductor test probe is ensured, so that the double-bending type semiconductor test probe has a very wide application prospect.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and do not constitute a limitation on the invention. In the drawings:
fig. 1 is a schematic structural diagram of a dual-bending semiconductor test probe according to the present invention.
In the figure: 1. the needle tube comprises a bending needle tube body, wherein the bending needle tube body comprises a first needle tube body, a first needle head, a first spring, a second needle tube body, a second needle head and a second spring.
Detailed Description
Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the invention.
In the description of the present invention, unless explicitly defined otherwise, terms such as arrangement, installation, connection, etc. should be construed broadly and the specific meaning of the terms in the present invention can be reasonably determined by a person skilled in the art in combination with the specific contents of the technical scheme.
Example 1
As shown in fig. 1, the double-bending type semiconductor test probe comprises a bending type needle tube 1, wherein a first needle tube 2 is arranged at one end of the bending type needle tube 1, a first needle head 3 and a first spring 4 are arranged in the first needle tube 2, the first spring 4 is positioned between the tail part of the first needle head 3 and the bottom part of the first needle tube 2, a second needle tube 5 is arranged at the other end of the bending type needle tube 1, a second needle head 6 and a second spring 7 are arranged in the second needle tube 5, and the second spring 7 is positioned between the tail part of the second needle head 6 and the bottom part of the second needle tube 5.
The buckling type needle tube 1 is used for bearing a first needle tube 2 and a second needle tube 5.
The first needle cannula 2 is for a first spring 4 and a first needle 3. The first spring 4 is installed inside the first needle tube 2, one end of which is in contact with the bottom of the first needle tube 2, and the other end of which is in contact with the first needle head 3. The first needle 3 is installed inside the first needle tube 2, one end of the first needle is contacted with the first spring 4, and the first needle is limited in the first needle tube 2 in a needle tube wrapping way.
The second needle cannula 5 is arranged to carry a second spring 7 and a second needle 6. The second spring 7 is installed inside the second needle tube 5, one end of which is in contact with the bottom of the second needle tube 5, and the other end of which is in contact with the second needle 6. The second needle 6 is installed inside the second needle tube 5, one end of the second needle is contacted with the second spring 7, and the second needle is limited in the second needle tube 5 by a needle tube wrapping way.
This achieves the restriction of the first needle 3, the second needle 6, the first needle cannula 2 and the second needle cannula 5 to the designated area to quickly complete the stable fitting relationship.
Since the second spring 7 and the second needle 6 are arranged in the second needle tube 5 and are fastened in a wrapping way by using the second needle tube 5; the first spring 4 and the first needle head 3 are arranged in the first needle tube 2 and are fastened in a wrapping way by using the first needle tube 2; the first needle head 3 and the second needle head 6 are arranged at two ends of the bending needle tube 1. When the semiconductor test probe is used, the whole double-bending type semiconductor test probe is arranged in the test jig, the second needle head 6 is reliably contacted with the tail end of the test machine, and the first needle head 3 is contacted with the product to be tested when the test jig is close to the product to be tested, so that the test requirement of non-axial position connection can be met.
Example 2
As shown in fig. 1, unlike in embodiment 1, in a double-bending type semiconductor test probe of the present invention, insertion holes are provided at both ends of a bending type needle tube 1, a first needle tube 2 and a second needle tube 5 are respectively disposed in both insertion holes, and then a shrinkage cavity is processed at a port of each insertion hole, and both the first needle tube 2 and the second needle tube 5 are restricted in the shrinkage cavity, thereby completing rapid assembly.
Example 3
As shown in fig. 1, unlike in embodiment 1, in a double-bending type semiconductor test probe of the present invention, the port of the first needle tube 2 and the port of the second needle tube 5 are formed with a reduced mouth, and the tail of the first needle 3 and the tail of the second needle 6 are restricted in the reduced mouth, so that the first needle 3 and the second needle 6 can be quickly and stably assembled in the port of the first needle tube 2 and the second needle tube 5, respectively.
Example 4
As shown in fig. 1, unlike in embodiment 1, in a double-bending type semiconductor test probe of the present invention, a structure in which a bending type needle tube 1 is specifically defined includes a lateral portion, both ends of the lateral ratio are respectively provided with vertical portions bent downward and bent upward, and a first needle tube 2 and a second needle tube 5 are respectively provided in both vertical portions.
The positions and the bending degrees of the two vertical parts and the transverse part can be adjusted, and the vertical parts can be designed into arc shapes, so that the main purpose of the device is to adapt to the deformation of the related shapes according to different product design requirements.
Therefore, compared with the prior art, the double-bending type semiconductor test probe has the advantages that: in the use process, the bending shape of the double-bending needle tube can be adjusted according to the difference of the distance between the trigger point of the testing machine and the product to be tested so as to achieve the required testing environment, thereby ensuring the testing precision and the testing performance of the semiconductor testing probe, and the double-bending semiconductor testing probe has very wide application prospect.
While the foregoing description illustrates and describes several preferred embodiments of the invention, it is to be understood that the invention is not limited to the forms disclosed herein, but is not to be construed as limited to other embodiments, and is capable of use in various other combinations, modifications and environments and is capable of changes or modifications within the spirit of the invention described herein, either as a result of the foregoing teachings or as a result of the knowledge or skill of the relevant art. And that modifications and variations which do not depart from the spirit and scope of the invention are intended to be within the scope of the appended claims.
Claims (5)
1. The utility model provides a double bending type semiconductor test probe, its characterized in that, including buckling type needle tubing (1), the one end of buckling type needle tubing (1) is provided with first needle tubing (2), is provided with first syringe needle (3) and first spring (4) in first needle tubing (2), and first spring (4) are located between the afterbody of first syringe needle (3) and the bottom of first needle tubing (2), and the other end of buckling type needle tubing (1) is provided with second needle tubing (5), is provided with second syringe needle (6) and second spring (7) in second needle tubing (5), second spring (7) are located between the afterbody of second syringe needle (6) and the bottom of second needle tubing (5).
2. The double-bending semiconductor test probe according to claim 1, wherein two ends of the bending needle tube (1) are provided with insertion holes, and the first needle tube (2) and the second needle tube (5) are respectively arranged in the two insertion holes.
3. The double-bending semiconductor test probe according to claim 2, wherein the port of the insertion hole is formed with a constriction, and the first needle tube (2) and the second needle tube (5) are both limited in the constriction.
4. A double-bending semiconductor test probe according to claim 3, characterized in that the port of the first needle tube (2) and the port of the second needle tube (5) are both formed with a constriction, the tail of the first needle (3) and the tail of the second needle (6) being limited in the constriction.
5. The double-bending semiconductor test probe according to claim 4, wherein the bending needle tube (1) comprises a transverse portion, two ends of the transverse ratio are respectively provided with vertical portions bent downwards and bent upwards, and the first needle tube (2) and the second needle tube (5) are respectively arranged in the two vertical portions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310697478.3A CN116679096A (en) | 2023-06-13 | 2023-06-13 | Double-bending type semiconductor test probe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310697478.3A CN116679096A (en) | 2023-06-13 | 2023-06-13 | Double-bending type semiconductor test probe |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116679096A true CN116679096A (en) | 2023-09-01 |
Family
ID=87790573
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310697478.3A Pending CN116679096A (en) | 2023-06-13 | 2023-06-13 | Double-bending type semiconductor test probe |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116679096A (en) |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4799007A (en) * | 1985-11-01 | 1989-01-17 | Hewlett-Packard Company | Bendable pin board test fixture |
| KR100430621B1 (en) * | 2003-11-28 | 2004-05-08 | 프롬써어티 주식회사 | Probe of apparatus for testing semiconductor |
| TWM254599U (en) * | 2003-10-24 | 2005-01-01 | Cing-Cang Chen | A new test probe |
| US20050151556A1 (en) * | 2004-01-08 | 2005-07-14 | Chung-Shan Lee | Testing probe and testing jig |
| KR20100034142A (en) * | 2008-09-23 | 2010-04-01 | 리노공업주식회사 | Probe |
| KR20100110069A (en) * | 2009-04-02 | 2010-10-12 | (주)메리테크 | Needle for semiconductor probe card |
| KR101973392B1 (en) * | 2017-11-06 | 2019-04-29 | 주식회사 오킨스전자 | L-type PION pin of test scoket |
| CN113125816A (en) * | 2020-01-10 | 2021-07-16 | 跃澐科技股份有限公司 | Double-ended test probe structure |
| WO2021151524A1 (en) * | 2020-01-30 | 2021-08-05 | Ingun Prüfmittelbau Gmbh | High-frequency test contact element and test probe device |
| CN215989330U (en) * | 2021-08-26 | 2022-03-08 | 深圳永探电子有限公司 | POGOPIN spring pin connector with arc-shaped tail |
| CN114200178A (en) * | 2021-11-11 | 2022-03-18 | 渭南高新区木王科技有限公司 | A Double Linkage Probe with Overpressure Buffer for Overweight Loads |
| CN115856371A (en) * | 2022-12-13 | 2023-03-28 | 渭南木王智能科技股份有限公司 | Thread-mounted detachable semiconductor test probe |
-
2023
- 2023-06-13 CN CN202310697478.3A patent/CN116679096A/en active Pending
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4799007A (en) * | 1985-11-01 | 1989-01-17 | Hewlett-Packard Company | Bendable pin board test fixture |
| TWM254599U (en) * | 2003-10-24 | 2005-01-01 | Cing-Cang Chen | A new test probe |
| KR100430621B1 (en) * | 2003-11-28 | 2004-05-08 | 프롬써어티 주식회사 | Probe of apparatus for testing semiconductor |
| US20050151556A1 (en) * | 2004-01-08 | 2005-07-14 | Chung-Shan Lee | Testing probe and testing jig |
| KR20100034142A (en) * | 2008-09-23 | 2010-04-01 | 리노공업주식회사 | Probe |
| KR20100110069A (en) * | 2009-04-02 | 2010-10-12 | (주)메리테크 | Needle for semiconductor probe card |
| KR101973392B1 (en) * | 2017-11-06 | 2019-04-29 | 주식회사 오킨스전자 | L-type PION pin of test scoket |
| CN113125816A (en) * | 2020-01-10 | 2021-07-16 | 跃澐科技股份有限公司 | Double-ended test probe structure |
| WO2021151524A1 (en) * | 2020-01-30 | 2021-08-05 | Ingun Prüfmittelbau Gmbh | High-frequency test contact element and test probe device |
| CN215989330U (en) * | 2021-08-26 | 2022-03-08 | 深圳永探电子有限公司 | POGOPIN spring pin connector with arc-shaped tail |
| CN114200178A (en) * | 2021-11-11 | 2022-03-18 | 渭南高新区木王科技有限公司 | A Double Linkage Probe with Overpressure Buffer for Overweight Loads |
| CN115856371A (en) * | 2022-12-13 | 2023-03-28 | 渭南木王智能科技股份有限公司 | Thread-mounted detachable semiconductor test probe |
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