CN221303392U - Double-head single-action concentric double-spring semiconductor test probe capable of preventing instantaneous break - Google Patents
Double-head single-action concentric double-spring semiconductor test probe capable of preventing instantaneous break Download PDFInfo
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- CN221303392U CN221303392U CN202323071149.2U CN202323071149U CN221303392U CN 221303392 U CN221303392 U CN 221303392U CN 202323071149 U CN202323071149 U CN 202323071149U CN 221303392 U CN221303392 U CN 221303392U
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Abstract
The utility model discloses a double-head single-action concentric double-spring semiconductor test probe capable of preventing instantaneous interruption, which comprises a needle tube, wherein one end of the needle tube is provided with a test needle in a telescopic way, the other end of the needle tube is provided with a fixed needle, a first spring and a second spring are arranged in the needle tube, the first spring and the second spring are arranged between the test needle and the fixed needle, and the first spring is concentrically arranged outside the second spring. The double-head single-action concentric double-spring semiconductor test probe capable of preventing instantaneous disconnection solves the problems that when the traditional semiconductor test probe is used, the instantaneous disconnection phenomenon generated between a test needle head and a spring causes inaccurate test data such as test process current, resistance and the like, thereby seriously affecting the test precision and the test applicable range of the semiconductor test probe, and the test probe cannot be used in a precise test environment.
Description
Technical Field
The utility model belongs to the technical field of semiconductor detection, and particularly relates to a double-head single-action concentric double-spring semiconductor test probe capable of preventing instantaneous interruption.
Background
The semiconductor test probe is widely applied to the technical fields of chips, mobile phones, computers, consumer electronics and the like, and is a high-end electronic element with very strict test requirements.
The structure of the semiconductor test probe is generally composed of a needle shaft, a needle tube and a spring, wherein the needle shaft and the spring are arranged in the needle tube, and the needle shaft and the spring are kept in the needle tube to form an integral structure by a compression riveting necking mode or a dotting mode with one end compressed necking and the other end. When the device is used, the spring is tested in the needle tube under the stress of the needle shaft, the elastic force generated by the spring props against the needle shaft, and the needle shaft is in good contact with a tested piece for testing.
However, when the conventional semiconductor test probe is used, the current, the resistance and other test data in the test process are inaccurate due to the instantaneous disconnection phenomenon generated between the test needle and the spring, so that the test precision and the test applicable range of the semiconductor test probe are seriously affected, and the problem that the semiconductor test probe cannot be used in a precise test environment is caused.
Disclosure of utility model
The utility model aims to provide a double-head single-action concentric double-spring semiconductor test probe capable of preventing instantaneous disconnection, and solves the problems that when the traditional semiconductor test probe is used, the current, resistance and other test data in the test process are inaccurate due to the instantaneous disconnection phenomenon generated between a test needle head and a spring, so that the test precision and the test applicable range of the semiconductor test probe are seriously affected, and the semiconductor test probe cannot be used in a precise test environment.
In order to solve the technical problems, the utility model discloses a double-head single-action concentric double-spring semiconductor test probe capable of preventing instantaneous interruption, which comprises a needle tube, wherein one end of the needle tube is provided with a test needle in a telescopic way, the other end of the needle tube is provided with a fixed needle, a first spring and a second spring are arranged in the needle tube, the first spring and the second spring are arranged between the test needle and the fixed needle, and the first spring is concentrically arranged outside the second spring.
The technical scheme of the utility model also has the following characteristics:
As a preferable scheme of the utility model, blind holes are formed at the tail parts of the test needle head and the fixed needle head, and two ends of the second spring are respectively arranged in the two blind holes.
As a preferable mode of the utility model, the first spring and the second spring are both compression springs, and the elastic coefficient of the first spring is larger than that of the second spring.
As a preferable scheme of the utility model, a necking is formed at one end of the needle tube, the outer diameter of the tail part of the test needle is larger than the inner diameter of the necking, and the outer diameter of the rod part of the test needle is smaller than the inner diameter of the necking.
As a preferable scheme of the utility model, the other end of the needle tube is provided with a fixed needle head in the needle tube in a riveting and compressing mode.
The utility model has the beneficial effects that: according to the double-head single-action concentric double-spring semiconductor test probe capable of preventing instantaneous disconnection, in the use process, no matter how the pressing down speed or the rebound speed is changed, the needle heads at the two ends are reliably contacted with the connecting springs at any time, so that the phenomenon of instantaneous disconnection is avoided; the test spring provides test elasticity for the probe so as to ensure the test service life of the probe, so that the semiconductor test probe can meet the applicable requirements of certain vibration environments and quick test environments, and the test performance and the application range of the semiconductor test probe can be well ensured.
Drawings
The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the utility model and do not constitute a limitation on the utility model. In the drawings:
FIG. 1 is a schematic diagram of a dual-head single-action concentric dual-spring semiconductor test probe capable of preventing transient breaking.
In the figure: 1. needle tubing, 2, fixed syringe needle, 3, second spring, 4, first spring, 5, test syringe needle.
Detailed Description
Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the utility model.
In the description of the present utility model, unless explicitly defined otherwise, terms such as arrangement, installation, connection, etc. should be construed broadly and the specific meaning of the terms in the present utility model can be reasonably determined by a person skilled in the art in combination with the specific contents of the technical scheme.
Example 1
As shown in FIG. 1, the double-ended single-action concentric double-spring semiconductor test probe capable of preventing instant breaking comprises a needle tube 1, wherein one end of the needle tube 1 is provided with a test needle 5 in a telescopic manner, the other end of the needle tube 1 is provided with a fixed needle 2, a first spring 4 and a second spring 3 are arranged in the needle tube 1, the first spring 4 and the second spring 3 are arranged between the test needle 5 and the fixed needle 2, and the first spring 4 is concentrically arranged outside the second spring 3.
Wherein: the needle tube 1 is a carrier of a semiconductor test probe and is used for bearing and fixing a needle head 2, a second spring 3, a first spring 4 and a test needle head 5; the fixed needle head 2 is placed in the needle tube 1, one end of the fixed needle head is respectively contacted with the connecting spring 3 and the testing spring 4, and the fixed needle head is limited in the needle tube 1 in a compression riveting way; the second spring 3 is arranged in the needle tube 1, and two ends of the second spring 3 are respectively in close contact with the fixed needle head 2 and the test needle head 5; the first spring 4 is arranged in the needle tube 1, and two ends of the first spring 4 are respectively contacted with the fixed needle head 2 and the test needle head 5; the test needle 5 is retractably arranged inside the needle tube 1, one end of the test needle is respectively contacted with the second spring 3 and the first spring 4, and the test needle is limited in the needle tube 1 in a mode of wrapping the mouth of the needle tube 1.
During the use, the semiconductor test probe is installed and is constituteed test module in test fixture, fixed syringe needle 2 and fixed contact, test syringe needle 5 and the contact of product that awaits measuring when test module is close to the product that awaits measuring, this process continues to carry out and keeps away from the product that awaits measuring gradually after reaching the settlement pressure value, because the blind hole tight fit of second spring 3 both ends with fixed syringe needle 2 and test syringe needle 5 one side respectively, consequently can keep reliable contact constantly and can not take place the phenomenon of instantaneous disconnection, and can satisfy the application requirement of certain vibrations environment, consequently test performance and application scope of assurance semiconductor test probe that can be fine.
Example 2
As shown in fig. 1, unlike the embodiment 1, the dual-head single-action concentric dual-spring semiconductor test probe capable of preventing the instant breaking according to the present utility model is provided with blind holes at the tail portions of the test needle 5 and the fixed needle 2 in the embodiment 2, and both ends of the second spring 3 are respectively provided in the two blind holes.
This design ensures that the second spring 3 is always constrained between the test needle 5 and the fixed needle 2, ensuring the stability of the connection between the two.
Example 3
As shown in fig. 1, unlike in embodiment 1, in embodiment 3, the first spring 4 and the second spring 3 are both compression springs, and the elastic coefficient of the first spring 4 is larger than that of the second spring 3.
The elastic coefficient of the second spring 3 is far smaller than that of the first spring 4, the second spring 3 is used for guaranteeing that the fixed needle head 2 and the test needle head 5 are in a tight fit state at any time in the probe test process, further guaranteeing that the transient disconnection phenomenon can not occur in the test process, and the first spring 4 is used for providing test elastic force for the semiconductor test probe.
The second spring 3 has small force, and the force generated in the testing process is negligible, so that the elastic force of the semiconductor testing probe in the testing process cannot be influenced under any testing condition, and the testing precision of the semiconductor testing probe is further ensured. It should be noted that the second spring 3 is gold-plated and has a very low resistance value, so that the test accuracy of the semiconductor test probe can be further ensured. The two ends of the second spring 3 are respectively in tight fit with the blind holes of the inner end surfaces of the fixed needle head 2 and the test needle head 5, and the falling phenomenon can not occur in the test process under any condition, so that the semiconductor test probe can be ensured to be in good contact between the needle heads at two sides in the use process, the instant breaking phenomenon can not occur, and the test precision of the semiconductor test probe can be further ensured.
The first spring is mainly used for providing test elasticity for the probe, and guaranteeing that the needles at two ends can smoothly finish the test in the test process and can recover to a free state after the test is finished, so that the test service life and the test performance of the semiconductor test probe can be well guaranteed. It should be noted that: because the elastic coefficient of the first spring is far greater than that of the second spring, the elastic force generated by the second spring in the test process can be ignored, so that the test precision of the probe is ensured under the combined action of the two springs, and the probe can be ensured to have a wider test environment.
Example 4
As shown in fig. 1, unlike in embodiment 1, in embodiment 4, a shrinkage port is formed at one end of the needle tube 1, the outer diameter of the tail portion of the test needle 5 is larger than the inner diameter of the shrinkage port, and the outer diameter of the stem portion of the test needle 5 is smaller than the inner diameter of the shrinkage port.
By such design, it is possible to ensure that the test needle assembly is completed quickly at the lowest cost, ensuring that both are telescopically assembled at both ends of the needle tube 1, respectively.
Therefore, compared with the existing test probes, the double-head single-action concentric double-spring semiconductor test probe capable of preventing instantaneous disconnection has the advantages that in the use process, no matter how the pressing down speed or the rebound speed changes, the needle heads at the two ends are reliably contacted with the connecting springs at any time, so that the phenomenon of instantaneous disconnection can not occur; the test spring provides test elasticity for the probe so as to ensure the test service life of the probe, so that the semiconductor test probe can meet the applicable requirements of certain vibration environments and quick test environments, and the test performance and the application range of the semiconductor test probe can be well ensured.
While the foregoing description illustrates and describes several preferred embodiments of the utility model, it is to be understood that the utility model is not limited to the forms disclosed herein, but is not to be construed as limited to other embodiments, and is capable of use in various other combinations, modifications and environments and is capable of changes or modifications within the spirit of the utility model described herein, either as a result of the foregoing teachings or as a result of the knowledge or skill of the relevant art. And that modifications and variations which do not depart from the spirit and scope of the utility model are intended to be within the scope of the appended claims.
Claims (5)
1. The utility model provides a can prevent concentric double spring semiconductor test probe of double-end single action of instantaneous break, its characterized in that, including needle tubing (1), the one end of needle tubing (1) is provided with test needle (5) telescopically, and the other end is provided with fixed syringe needle (2), is provided with first spring (4) and second spring (3) in needle tubing (1), and first spring (4) and second spring (3) are arranged between test needle (5) and fixed syringe needle (2) to first spring (4) concentric arrangement is in the outside of second spring (3).
2. The double-ended single-action concentric double-spring semiconductor test probe capable of preventing instantaneous interruption according to claim 1, wherein the tail parts of the test needle head (5) and the fixed needle head (2) are provided with blind holes, and two ends of the second spring (3) are respectively arranged in the two blind holes.
3. The double-ended single-action concentric double-spring semiconductor test probe capable of preventing instant breaking according to claim 2, wherein the first spring (4) and the second spring (3) are both compression springs, and the elastic coefficient of the first spring (4) is larger than that of the second spring (3).
4. The double-ended single-action concentric double-spring semiconductor test probe capable of preventing instantaneous interruption according to claim 3, wherein a necking is formed at one end of the needle tube (1), the outer diameter of the tail part of the test needle head (5) is larger than the inner diameter of the necking, and the outer diameter of the rod part of the test needle head (5) is smaller than the inner diameter of the necking.
5. The double-head single-action concentric double-spring semiconductor test probe capable of preventing instantaneous interruption according to claim 4, wherein the other end of the needle tube (1) is provided with a fixed needle head (2) in the needle tube (1) in a riveting and compressing way.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323071149.2U CN221303392U (en) | 2023-11-14 | 2023-11-14 | Double-head single-action concentric double-spring semiconductor test probe capable of preventing instantaneous break |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323071149.2U CN221303392U (en) | 2023-11-14 | 2023-11-14 | Double-head single-action concentric double-spring semiconductor test probe capable of preventing instantaneous break |
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| Publication Number | Publication Date |
|---|---|
| CN221303392U true CN221303392U (en) | 2024-07-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202323071149.2U Active CN221303392U (en) | 2023-11-14 | 2023-11-14 | Double-head single-action concentric double-spring semiconductor test probe capable of preventing instantaneous break |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221303392U (en) |
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2023
- 2023-11-14 CN CN202323071149.2U patent/CN221303392U/en active Active
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