CN112089862A - Ultraviolet semiconductor parallel UVC LED all-inorganic or semi-inorganic packaging structure - Google Patents

Abstract

The invention provides a UVC LED all-inorganic or semi-inorganic encapsulation structure in parallel with ultraviolet semiconductors, comprising a substrate, at least two UVC chips arranged on the substrate, the substrate comprising an upper surface provided with the UVC chips and The lower surface opposite to the upper surface, the upper surface is provided with a pair of pads corresponding to the UVC chip, each of the UVC chips is arranged between a pair of the pad pairs and is electrically connected to it, the The UVC chips are connected in parallel with each other. The all-inorganic or semi-inorganic encapsulation structure of the UVC LEDs provided in parallel with the ultraviolet semiconductors improves the optical power of the UVC LEDs and increases the sterilization and disinfection function; the UVC chips do not interfere with each other, and the working life of the UVC LEDs is improved.

Description

A UVC LED all-inorganic or semi-inorganic encapsulation structure in parallel with ultraviolet semiconductors

technical field

The invention relates to the field of LED packaging, in particular to an all-inorganic or semi-inorganic packaging structure of UVC LEDs connected in parallel with ultraviolet semiconductors.

Background technique

UV LED refers to an ultraviolet semiconductor light source that adopts the principle of LED light emission, including all electromagnetic radiation wavelengths between 200nm and 400nm. Wave ultraviolet) and UVC (200nm ~ 280nm, short-wave ultraviolet) bands. Among them, UVC band has obvious technical advantages and broad application prospects in the field of sterilization and disinfection due to its excellent performance in sterilization and disinfection.

Due to the problem of the electro-optical conversion efficiency of UVC LEDs, the UVC LED devices in the prior art have insufficient optical power. There are already UVC LED devices in the market that use multiple UVC chips in series. For such devices, as long as one UVC chip is broken, other UVC LEDs are damaged. The chips are all in an unusable state, resulting in waste.

SUMMARY OF THE INVENTION

In view of the above problems, the present invention proposes an all-inorganic or semi-inorganic packaging structure for UVC LEDs in parallel with ultraviolet semiconductors to improve the above problems.

In a first aspect, the present invention provides an all-inorganic or semi-inorganic packaging structure for UVC LEDs in parallel with ultraviolet semiconductors, comprising a substrate, at least two UVC chips disposed on the substrate, and the substrate includes an upper surface provided with the UVC chips. a surface and a lower surface opposite to the upper surface, the upper surface is provided with a pair of pads corresponding to the UVC chips, and each of the UVC chips is arranged between a pair of the pads and electrically connected to it connected, the UVC chips are connected in parallel with each other.

Preferably, the number of the UVC chips is two, the pad pair is composed of a pad positive electrode and a pad negative electrode spaced from the pad positive electrode, and the pad pair includes a first pad pair, a The first pad pair is spaced apart from the second pad pair, and the interval formed between the positive electrode of the pad and the negative electrode of the pad is formed between the first pad pair and the second pad pair. interval is equal.

Preferably, two pairs of the pad pairs form a quarter circle arranged at intervals, and the two UVC chips are symmetrically arranged and located in the middle of a pair of the pad pairs.

Preferably, an electrode pair corresponding to the pad pair is provided on the lower surface, and a conductive portion connecting the pad pair and the electrode pair is provided through the substrate.

Preferably, the UVC chip is a flip-chip UVC chip or a vertical UVC chip.

Preferably, it also includes a metal frame fixed on the substrate and surrounding the UVC chip, a glass piece disposed on the side of the metal frame away from the substrate, and a metal frame disposed on the side of the glass piece close to the substrate layer, the metal layer and the metal frame are welded by a welding layer.

Preferably, the metal layer is an Ag layer or a multi-metal alloy, and the soldering layer is a solder paste alloy.

Preferably, the thickness of the metal layer is 5 μm˜500 μm, and the thickness of the welding layer is 5 μm˜500 μm.

Preferably, a notch mark or a graphic mark is provided on the positive electrode of the pad or the negative electrode of the pad of the pad pair.

Preferably, the method further includes Zener diodes disposed on the substrate and corresponding to the number of the UVC chips, and each of the Zener diodes is respectively connected in parallel with one of the UVC chips.

The technical effects of the present invention are as follows: the all-inorganic or semi-inorganic encapsulation structure of the UVC LEDs in parallel with the ultraviolet semiconductors provided by the present invention improves the optical power of the UVC LEDs and increases the sterilization and disinfection function; the UVC chips do not interfere with each other, and the work of the UVC LEDs is improved. life.

In addition, the relative arrangement of the UVC chip and the pad pair in the present invention utilizes a circular bisected structure, so that the UVC LED has a high uniformity of optical power and uniform light emission.

Description of drawings

FIG. 1 is a top view of the internal structure of an all-inorganic or semi-inorganic package of UVC LEDs in parallel with ultraviolet semiconductors according to an embodiment of the present invention;

2 is a bottom view of an all-inorganic or semi-inorganic packaging structure of UVC LEDs in parallel with ultraviolet semiconductors according to an embodiment of the present invention;

Fig. 3 is the sectional view of A-A surface in Fig. 1 combined with glass piece as a whole;

FIG. 4 is a cross-sectional view of the A-A surface combined with the whole glass member in another embodiment;

5 is a top view of the internal structure of an all-inorganic or semi-inorganic package of a UVC LED with UV semiconductors connected in parallel according to another embodiment of the present invention.

Substrate 1 top surface 11 lower surface 12 Insulation area 121 Heat dissipation area 122 UVC chip 2 Zener Diode 3 metal frame 4 Pad pair 5 first pad pair 51 second pad pair 52 Electrode pair 6 The first electrode pair 61 The second electrode pair 62 Solder layer 7 Conductive part 8 glass piece 9 Metal layer 91

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

The present invention provides an all-inorganic or semi-inorganic encapsulation structure of UVC LEDs in parallel with ultraviolet semiconductors, as shown in Figs. Wherein, at least two UVC chips 2 are disposed on the substrate 1, and the UVC chips 2 are connected in parallel with each other. Preferably, the UVC chips 2 are flip-chip UVC chips or vertical UVC chips. The number of Zener diodes 3 is set corresponding to the UVC chip 2 and is connected in parallel with the UVC chip 2 to provide electrostatic protection. The metal frame 4 is fixed on the substrate 1 and is arranged around the UVC chip 2 and the Zener diode 3 . The side of the substrate 1 close to the UVC chip 2 is provided with a pair of pads 5 corresponding to the UVC chip 2. Each UVC chip 2 is arranged between a pair of pads 5 and is electrically connected to the pads 5. The substrate 1 The other side is provided with an electrode pair 6 that is conductive with the pad pair 5 , as shown in FIG. 2 . The glass piece 9 is arranged on the side of the metal frame 4 away from the substrate 1 and forms a cavity with the substrate 1. The glass piece 9 is provided with a metal layer 91 for welding on the side close to the substrate 1, and a welding layer passes between the metal layer 91 and the metal frame 4. 7 Soldering. The glass member 9 is preferably a glass lens, the thickness of the metal layer 91 is preferably 5 μm˜500 μm, and the thickness of the welding layer 7 is preferably 5 μm˜500 μm. The invention provides an all-inorganic or semi-inorganic encapsulation structure of UVC LEDs in parallel with ultraviolet semiconductors, which can replace existing products with insufficient power of UVC chips on the market, greatly increase the efficacy of encapsulated lamp beads, improve the optical power of UVC LEDs, and increase the sterilization and disinfection function. And the UVC chips 2 are connected in parallel with each other so that each UVC chip 2 does not interfere with each other, which increases its service life compared to the UVC LED in the prior art, and has independent voltage, independent current and independent control. At the same time, UVCLEDs with all-inorganic or semi-inorganic encapsulation structure have high stability and long life.

The substrate 1 includes an upper surface 11 provided with a UVC chip 2 and a lower surface 12 opposite to the upper surface 11. The upper surface 11 is provided with a pad pair 5 corresponding to the UVC chip 2, and the lower surface 12 is provided with an insulating area 121 and a heat dissipation area. 122 . An electrode pair 6 corresponding to the pad pair 5 , wherein the heat dissipation area 122 is a thermoelectric separation layer, and a conductive portion 8 connecting the pad pair 5 and the electrode pair 6 is formed through the substrate 1 . Each pair of pads 5 is composed of a positive electrode of a pad and a negative electrode of the pad, and the positive electrode of the pad and the negative electrode of the pad are arranged at an interval. electrical connection between. The substrate 1 is provided with a pair of through-holes penetrating up and down for filling the conductive parts 8 of the conductive pad pair 5 and the electrode pair 6 .

An equally spaced circular structure is formed between the pad pairs, so that each UVC chip is evenly distributed on the substrate. In one embodiment, as shown in FIGS. 1-3 , there are two UVC chips 2 and two Zener diodes 3 , the two UVC chips 2 are connected in parallel, and each of the two Zener diodes 3 is connected to the UVC chip 2 in the corresponding circuit Parallel connection, wherein, two UVC chips 2 connected in parallel can double the optical power of the product and double the power of its air purification. The pad pair 5 includes a first pad pair 51 and a second pad pair 52 spaced apart from the first pad pair 51 . The intervals formed between the pad pair 51 and the second pad pair 52 are equal. Specifically, the substrate 1 is a square, two pairs of pad pairs 5 form a quarter circle arranged at intervals, the center of the substrate 1 coincides with the center of the quarter circle, and the two UVC chips 2 are symmetrically arranged and located in a pair of pads The middle position of pair 5; the upper two left and right opposite quarter circles are the positive and negative poles of the first pad pair 51, and the lower two left and right opposite quarter circles are the positive and negative poles of the second pad pair 52 pole; one UVC chip 2 is arranged on the interval between the two quadrants above and connects the positive and negative poles of the pad pair 5, and the other UVC chip 2 is partially covered between the two quadrants below. The space between the two UVC chips 2 is connected to the positive and negative electrodes of the pad pair 5, and the spacing between the two UVC chips 2 is symmetrical with respect to the pad pair. Each UVC chip 2 is positioned relative to the substrate 1 and its corresponding pad pair. 5. Left and right symmetry, as shown in Figure 1, the above structure can make the power consistency of the UVC LED high and the light emission uniform, and the two UVC chips in parallel with each other double the optical power of the LED, compared with the series or single UVC chips. UVC LEDs last longer. The electrode pair 6 includes a first electrode pair 61 corresponding to the first pad pair 51 and a second electrode pair 62 corresponding to the second pad pair 52. Specifically, marks can be made on the positive or negative poles of the pad pair 5 or the electrode pair 6 to distinguish the positive and negative poles, so as to avoid poor packaging of the UVC LED caused by the connection of the positive and negative poles, such as notch marks or graphic marks, Figure 5 In order to set a notch mark on the negative electrode of the pad of the first pad pair 51, the left side of the figure is the positive pole of the first pad pair 51, and the lower side of the figure is the negative pad of the second pad pair 52. The diagonal side is shown as the pad positive electrode of the second pad pair 52 , correspondingly, it is also convenient to distinguish the positive and negative electrodes of the electrode pair 6 on the other side of the substrate 1 . The metal layer 91 is an Ag layer or a multi-metal alloy layer. Specifically, the Ag layer can be formed by sintering the Ag paste on the glass member 9 through high temperature sintering using Ag paste. Preferably, the soldering layer 7 is a solder paste alloy, the metal frame 4 is a Cu frame, and the substrate 1 is a ceramic substrate; the glass member 9 is a hemispherical quartz glass or a flat plate glass, as shown in Figures 3-4, and Figure 3 is a hemisphere Fig. 4 is a flat plate glass, and the glass member 9 is suspended on the UVC chip 2 of the dual-core parallel connection, wherein the glass member 9 is a hemispherical quartz glass, which can improve the transmittance of UVC light.

To sum up, the present invention provides an all-inorganic or semi-inorganic encapsulation structure for UVC LEDs connected in parallel with ultraviolet semiconductors. The chips are arranged in parallel to at least double the optical power of the UVC LED, increase the sterilization and disinfection function, and the UVC chips do not interfere with each other, improving the working life of the UVC LED. In addition, the relative arrangement of the UVC chip and the pad pair in the present invention utilizes a circular bisector structure, so that the uniformity of the UVC LED light power is high, the light emission is uniform, and it is more convenient to evenly distribute the parallel UVC LEDs.

Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, but not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand: it can still be The technical solutions described in the foregoing embodiments are modified, or some technical features thereof are equivalently replaced; and these modifications or replacements do not drive the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims (10)

1. an all-inorganic or semi-inorganic encapsulation structure of a UVC LED in parallel with an ultraviolet semiconductor, characterized in that it comprises a substrate, at least two UVC chips arranged on the substrate, and the substrate comprises an upper surface provided with a UVC chip and a UVC chip. a lower surface opposite to the upper surface, the upper surface is provided with a pair of pads corresponding to the UVC chips, each of the UVC chips is arranged between a pair of the pad pairs and is electrically connected to it, The UVC chips are connected in parallel with each other. 2. The UVC LED all-inorganic or semi-inorganic encapsulation structure in parallel with ultraviolet semiconductors according to claim 1, wherein the number of the UVC chips is two, and the pad pair consists of a pad anode and a The positive electrode of the disk is composed of the negative electrode of the pad arranged at intervals, the pad pair includes a first pad pair, a second pad pair arranged at an interval from the first pad pair, the positive pad of the pad and the negative electrode of the pad The interval formed therebetween is equal to the interval formed between the first pad pair and the second pad pair. 3. The UVC LED all-inorganic or semi-inorganic encapsulation structure in parallel with ultraviolet semiconductors according to claim 2, characterized in that, two pairs of said pads form a quarter circle arranged at intervals, and two said UVC chips are in phase with each other. Symmetrically arranged and located in the middle of a pair of the pad pairs. 4 . The UVC LED all-inorganic or semi-inorganic packaging structure in parallel with ultraviolet semiconductors according to claim 1 , wherein the lower surface is provided with an electrode pair corresponding to the pad pair, and the substrate is provided with an electrode pair corresponding to the pad pair. 5 . There is a conductive portion connecting the pad pair and the electrode pair. 5 . The all-inorganic or semi-inorganic packaging structure of UVC LED in parallel with ultraviolet semiconductors according to claim 1 , wherein the UVC chip is a flip-chip UVC chip or a vertical UVC chip. 6 . 6 . The all-inorganic or semi-inorganic packaging structure of UVC LEDs connected in parallel with ultraviolet semiconductors according to claim 1 , further comprising a metal frame fixed on the substrate and surrounding the UVC chip, disposed on the metal A glass piece on the side of the frame away from the base plate is provided with a metal layer on the side of the glass piece close to the base plate, and the metal layer and the metal frame are welded by a welding layer. 7 . The all-inorganic or semi-inorganic packaging structure for UVC LEDs connected in parallel with ultraviolet semiconductors according to claim 6 , wherein the metal layer is an Ag layer or a multi-metal alloy, and the soldering layer is a solder paste alloy. 8 . 8 . The all-inorganic or semi-inorganic packaging structure of UVC LEDs connected in parallel with ultraviolet semiconductors according to claim 6 or 7 , wherein the thickness of the metal layer is 5 μm to 500 μm, and the thickness of the solder layer is 5 μm to 500 μm. 9 . . 9 . The all-inorganic or semi-inorganic packaging structure of UVC LEDs connected in parallel with ultraviolet semiconductors according to claim 3 , wherein a notch mark or a graphic mark is provided on the positive electrode of the pad or the negative electrode of the pad of the pad pair. 10 . 10 . The UVC LED all-inorganic or semi-inorganic packaging structure in parallel with ultraviolet semiconductors according to claim 1 , further comprising Zener diodes disposed on the substrate and corresponding to the number of UVC chips, each of which is arranged on the substrate. 11 . The Zener diodes are respectively connected in parallel with one of the UVC chips.

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