CN219040507U - A multi-chip LED packaging structure - Google Patents

Abstract

The utility model provides a multi-chip LED packaging structure, which comprises a substrate, a metal dam edge, glass and a chip set, wherein the substrate, the metal dam edge and the glass are jointly formed into an accommodating space, the chip set is accommodated in the accommodating space, the substrate comprises a first surface, a second surface and a plurality of conducting holes penetrating through the substrate, the first surface is provided with a plurality of electrode parts which are arranged at intervals, the second surface is provided with a plurality of bonding pads corresponding to the plurality of electrode parts, the plurality of electrode parts comprise a first positive electrode part, a first negative electrode part and a conducting part, the chip set comprises a first LED chip set electrically connected with the first positive electrode part and the conducting part, the chip set also comprises a second LED chip set electrically connected with the conducting part and the first negative electrode part, and the first LED chip set and the second LED chip set are connected in series. According to the utility model, the serial-parallel circuit is formed by the first positive electrode part, the first negative electrode part, the conductive part and the chip set, so that the effects of amplifying power and mixing wave bands are realized, and compared with the traditional product, the space is effectively saved, and the cost is reduced.

Description

A multi-chip LED packaging structure

technical field

The utility model relates to the technical field of LED packaging structures, in particular to a multi-chip LED packaging structure.

Background technique

LED (Light Emitting Diode, semiconductor light-emitting diode) is a commonly used light-emitting device, which releases energy and emits light through the recombination of electrons and holes. It is widely used in the field of lighting. LED packaging refers to the packaging of light-emitting chips. Its function is to provide sufficient protection for the chip to prevent the chip from failing due to long-term exposure in the air or mechanical damage, so as to improve the stability of the chip. At present, in order to meet the requirements of end products, LED packages are required to be light, thin, short and small. However, the luminous power of a single LED package currently on the market is small, which does not meet the needs of customers.

UVLED refers to an ultraviolet semiconductor light source that adopts the principle of LED light emission, including all electromagnetic radiation wavelengths between 200nm and 400nm. Ultraviolet) and UVC (200nm ~ 280nm, short-wave ultraviolet) bands. UVC band can be used for sterilization and disinfection, UVA can realize photocatalyst, and UVB can realize plant growth and medical use. A single LED package currently on the market has a single wavelength band.

Patent No. CN112089862A discloses a UVC LED all-inorganic or semi-inorganic package structure in parallel with ultraviolet semiconductors, which includes a substrate, at least two UVC chips arranged on the substrate, and the substrate includes an upper surface provided with a UVC chip and an upper surface connected with the upper surface. On the lower surface opposite to the surface, the upper surface is provided with a pair of pads corresponding to the UVC chips, each UVC chip is arranged between a pair of pads and electrically connected to it, and the UVC chips are connected in parallel with each other. In this patent, two UVC chips are used to increase the luminous power, but each UVC chip needs a pair of pads to connect, and if more chips are used, the size of the overall package will be increased.

Therefore, it is necessary to provide a new multi-chip LED packaging structure to solve the above technical problems.

Utility model content

Aiming at the deficiencies in the prior art, the purpose of the utility model is to provide a multi-chip LED packaging structure that can increase luminous power and save space.

In order to achieve the above object, the utility model provides a multi-chip LED packaging structure, which includes a substrate jointly forming a storage space, a metal dam side, glass and a chipset stored in the storage space, the substrate includes a first surface, a second surface, and several conductive holes penetrating through the substrate, the first surface has several electrode portions arranged at intervals, the second surface has several pads corresponding to the several electrode portions, and the several electrode portions The part includes a first positive part, a first negative part, and a conductive part. The chip set includes a first LED chip set electrically connected to the first positive part and the conductive part. The chip set also includes a first LED chip set electrically connected to the The conductive part, the second LED chip group of the first negative part, the first LED chip group and the second LED chip group are connected in series.

Preferably, the plurality of welding pads include a first welding pad electrically connected to the first positive pole part, and a second welding pad electrically connected to the first negative pole part.

Preferably, the chipset further includes an indicator chip, and the plurality of electrode parts further include a second positive part and a second negative part, and the two poles of the indicator chip are electrically connected to the second positive part and the second electrode respectively. Two negative parts.

Preferably, the plurality of welding pads further include a third welding pad electrically connected to the second positive pole part, and a fourth welding pad electrically connected to the second negative pole part.

Preferably, the first LED chip group includes a first LED chip and a second LED chip arranged in parallel, the anodes of the first LED chip and the second LED chip are electrically connected to the first anode part, and the The negative poles of the first LED chip and the second LED chip are electrically connected to the conductive part, the second LED chip group includes a third LED chip and a fourth LED chip arranged in parallel, the third LED chip, the The positive electrode of the fourth LED chip is electrically connected to the conductive portion, and the negative electrodes of the third LED chip and the second LED chip are electrically connected to the first negative electrode portion.

Preferably, the chipset further includes a Zener diode, and the two poles of the Zener diode are respectively electrically connected to the first anode part and the first cathode part.

Preferably, the first positive portion includes a first region extending along a first direction, a second region extending along a second direction, the first direction is perpendicular to the second direction, and the first negative portion including a third area extending along the first direction and a fourth area extending along the second direction, the conductive portion extends along the first direction, and the first area is adjacent to the conductive portion and form a first interval, the third region is adjacent to the conductive portion and forms a second interval, the first region is adjacent to the fourth region and forms a third interval, the first interval , the second interval, and the third interval are equal.

Preferably, the first LED chip and the second LED chip are arranged in the first interval, the third LED chip and the fourth LED chip are arranged in the second interval, and the zener diode set in the third interval.

Preferably, the first positive portion includes a first region extending along a first direction, a second region extending along a second direction, the first direction is perpendicular to the second direction, and the first negative portion including a third area extending along the first direction, a fourth area extending along the second direction, the conductive portion extending along the second direction, and the second area is adjacent to the conductive portion and form a first interval, the fourth region is disposed adjacent to the conductive portion and forms a second interval, the first region is disposed adjacent to the third region and forms a third interval, the first interval , the second interval, and the third interval are equal.

Preferably, the first LED chip and the second LED chip are arranged in the first interval, the third LED chip and the fourth LED chip are arranged in the second interval, and the zener diode set in the third interval.

The utility model forms a series-parallel circuit through the first positive part, the first negative part, the conductive part and the LED chip, thereby realizing the effects of amplifying power and mixing bands, and effectively saving space and reducing costs compared with traditional products.

Description of drawings

Fig. 1 is a front view of Embodiment 1 of a multi-chip LED packaging structure of the present invention;

Fig. 2 is the rear view shown in Fig. 1;

Fig. 3 is a sectional view along line A-A shown in Fig. 1;

Fig. 4 is a front view of Embodiment 2 of a multi-chip LED packaging structure of the present invention.

Detailed ways

The following will clearly and completely describe the technical solutions in the embodiments of the application with reference to the drawings in the embodiments of the application. Apparently, the described embodiments are only some of the embodiments of the application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of this application.

Embodiment one

As shown in Figures 1 to 3, the utility model provides a multi-chip LED packaging structure 100, which includes a substrate 1, a metal dam edge 2, and a glass 3 that jointly form a storage space 10, and it also includes 10 chipset 4 and several pads 5 fixed on the substrate 1 and exposed to the outside.

The substrate 1 is a ceramic substrate, and the glass 3 is flat glass or hemispherical quartz glass, but not limited thereto.

The substrate 1 includes a first surface 11 , a second surface 12 , and a plurality of conductive holes 13 penetrating through the substrate 1 , and conductive metal is disposed in the conductive holes 13 .

The metal dam edge 2 is disposed on the first surface 11 . A welding layer 31 is provided on the side of the glass 3 close to the substrate 1 , and the glass 3 and the metal dam side 2 are welded and fixed by the welding layer 31 .

The first surface 11 has several electrode portions 6 arranged at intervals.

The second surface 12 includes a heat dissipation area 121 , a protection area 122 , and a plurality of conductive portions 123 that are electrically connected to the plurality of electrode portions 6 through a plurality of conductive holes 13 . The pads 5 are fixed to the corresponding conductive portions 123 , and the pads 5 are electrically connected to the chipset 4 through the conductive portions 123 and the electrode portions 6 .

The heat dissipation area 121 is a thermoelectric separation layer, and the protection area 122 is a green oil solder resist layer.

The chipset 4 is fixed on the first surface 11 , and the pad 5 is fixed on the second surface 12 .

The plurality of electrode parts 6 include a first positive pole part 61 , a first negative pole part 62 , and a conductive part 63 . The first positive pole portion 61 and the first negative pole portion 62 are respectively provided with two conductive holes 13 , and the number of the conductive holes 13 is not limited.

The chipset 4 includes a first LED chipset 41 electrically connected to the first positive portion 61 and the conductive portion 63, and the chipset 4 also includes a second LED chipset 42 electrically connected to the conductive portion 63 and the first negative portion 62. The chipset 41 and the second LED chipset 42 are connected in series.

The pads 5 include a first pad 51 electrically connected to the first positive portion 61 and a second pad 52 electrically connected to the first negative portion 62 .

The first LED chip group 41 includes at least one LED chip, and the second LED chip group 42 includes at least one LED chip. The LED chip is an LED flip chip, for example, any one or a combination of UVA/UVB/UVC.

Specifically, the first LED chip group 41 includes a first LED chip 411 and a second LED chip 412 . The anodes of the first LED chip 411 and the second LED chip 412 are electrically connected to the first anode portion 61 , and the cathodes of the first LED chip 411 and the second LED chip 412 are electrically connected to the conductive portion 63 . In other embodiments, the quantity and type of the first LED chip group 41 are not limited.

Specifically, the second LED chip group 42 includes a third LED chip 421 and a fourth LED chip 422 . The anodes of the third LED chip 421 and the fourth LED chip 422 are electrically connected to the conductive portion 63 , and the cathodes of the third LED chip 421 and the fourth LED chip 422 are electrically connected to the first cathode portion 62 . In other embodiments, the quantity and type of the second LED chipset 42 are not limited.

Through such a design, the first LED chipset 41 and the second LED chipset 42 form a series-parallel circuit. Compared with the traditional technology, more chips can be packaged in a limited space, and the overall power is improved.

Specifically, the chipset 4 further includes a Zener diode 45 , and the two poles of the Zener diode 45 are electrically connected to the first anode part 61 and the first cathode part 62 respectively. Zener diode 45 plays the role of electrostatic protection.

Specifically, the chipset 4 also includes an indicator light chip 46, and the plurality of electrode parts 6 also include a second positive pole part 64 and a second negative pole part 65. The two poles of the indicator light chip 46 are respectively connected to the second positive pole part 64 and the second negative pole part 65. . Since some LED chips cannot be seen by human eyes when they are working, it can be judged whether they are working normally through the indicator chip 46 .

A conductive hole 13 is respectively provided on the second positive pole portion 64 and the second negative pole portion 65 , and in other embodiments, the number of the conductive holes 13 is not limited.

The pads 5 further include a third pad 53 electrically connected to the second positive portion 64 and a fourth pad 54 electrically connected to the second negative portion 65 .

The first positive portion 61 includes a first region 611 extending along a first direction, and a second region 612 extending along a second direction. The first direction is perpendicular to the second direction. The first negative portion 62 includes a third region 621 extending along the first direction, and a fourth region 622 extending along the second direction. The conductive portion 63 extends along the first direction. The first region 611 is disposed adjacent to the conductive portion 63 and forms a first interval 71, the third region 621 is disposed adjacent to the conductive portion 63 and forms a second interval 72, the first region 611 is disposed adjacent to the fourth region 622 and forms The third interval 73 . The first interval 71, the second interval 72, and the third interval 73 are equal.

The first LED chip 411 and the second LED chip 412 are disposed in the first interval 71 , the third LED chip 421 and the fourth LED chip 422 are disposed in the second interval 72 , and the Zener diode 45 is disposed in the third interval 73 .

In this embodiment, the first positive portion 61 is L-shaped, the first negative portion 62 is L-shaped, and the conductive portion 63 is rectangular. The first positive pole portion 61 and the first negative pole portion 62 are approximately symmetrically arranged and form an annular area, and the conductive portion 63 is located at the center of the annular area. The first positive pole part 61 , the first negative pole part 62 , the conductive part 63 , the second positive pole part 64 and the second negative pole part 65 together form a square outline. However, in other embodiments, the first positive pole portion 61 , the first negative pole portion 62 , the conductive portion 63 , the second positive pole portion 64 , and the second negative pole portion 65 may jointly form a circular or oval outline.

The working principle of a multi-chip LED packaging structure 100 of the utility model is as follows: the first pad 51 is connected to the positive pole of the power supply, the second pad 52 is respectively electrically connected to the negative pole of the power supply, and the input voltage can realize the first LED chip 411 and the second LED chip 411 The chip 412, the third LED chip 421, and the fourth LED chip 422 are lit at the same time, and the power amplification effect is realized through a series-parallel circuit. Different types of LED chips can be used to achieve mixed bands, such as UVA+UVB+UVC mixed band, but not limited to this.

The third pad 53 is connected to the positive pole of the power supply, and the fourth pad 54 is connected to the negative pole of the power supply. When the voltage is input, the indicator chip 46 can be turned on. Therefore, it can be judged whether the LED chip is working normally through the indicator chip 46 .

Therefore, a multi-chip LED packaging structure 100 of the present invention implements multiple LED chips in one package through a series-parallel circuit, so as to realize power amplification and multi-band requirements.

To sum up, the beneficial effect of a multi-chip LED packaging structure 100 of the present invention is that it forms a series-parallel circuit through the cooperation of the first positive part, the first negative part, the conductive part and a plurality of LED chips, and realizes power amplification, mixing The effect of the band, compared with traditional products, effectively saves space and reduces costs.

Embodiment two

As shown in Figure 4, the utility model provides an LED packaging structure 200, the structure of the substrate, the metal dam, the glass, and the welding pad of the second embodiment is the same as that of the first embodiment, and the difference lies in the chipset 4 and several electrode parts 8 .

The plurality of electrode parts 8 include a first positive pole part 81 , a first negative pole part 82 , and a conductive part 83 .

The chip set 4 includes a first LED chip set 41 electrically connected to the first anode portion 81 and the conductive portion 83 . The chip set 4 further includes a second LED chip set 42 electrically connected to the conductive portion 83 and the first cathode portion 82 , and the first LED chip set 41 and the second LED chip set 42 are connected in series.

The first LED chip group 41 includes a first LED chip 411 and a second LED chip 412 , and the second LED chip group 42 includes a third LED chip 421 and a fourth LED chip 422 .

The chipset 4 further includes a Zener diode 45 , and the two poles of the Zener diode 45 are electrically connected to the first anode part 81 and the first cathode part 82 respectively.

The first anode portion 81 includes a first region 811 extending along a first direction and a second region 812 extending along a second direction, and the first direction is perpendicular to the second direction. The first negative electrode portion 82 includes a third region 821 extending along the first direction, and a fourth region 822 extending along the second direction. The conductive portion 83 extends along the second direction, the second region 812 is adjacent to the conductive portion 83 and forms a first interval 86, the fourth region 822 is adjacent to the conductive portion 83 and forms a second interval 87, the first region 811 and The third regions 821 are adjacently disposed and form a third interval 88 , the first interval 86 , the second interval 87 , and the third interval 88 are equal.

The first LED chip 411 and the second LED chip 412 are disposed in the first interval 86 , the third LED chip 421 and the fourth LED chip 422 are disposed in the second interval 87 , and the Zener diode 45 is disposed in the third interval 88 .

The chipset 4 also includes an indicator chip 46 , and the plurality of electrode parts 8 also include a second positive part 84 and a second negative part 85 , and the two poles of the indicator chip 46 are respectively connected to the second positive part 84 and the second negative part 85 .

The beneficial effect of a multi-chip LED packaging structure 200 of the present invention is that it forms a series-parallel circuit through the cooperation of the first positive part, the first negative part, the conductive part and several LED chips, and realizes the effect of amplifying power and mixing bands , Compared with traditional products, it effectively saves space and reduces costs.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, but not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: it can still Modifications are made to the technical solutions described in the foregoing embodiments, or equivalent replacements are made to some of the technical features; and these modifications or replacements do not drive the essence of the corresponding technical solutions away from the spirit and scope of the technical solutions of the various embodiments of the present application.

Claims (10)

1. The utility model provides a multicore piece LED packaging structure, its includes the base plate that forms accommodation space jointly, metal box dam limit, glass and accept in accommodation space's chipset, the base plate includes first surface, second surface and runs through a plurality of conductive holes of base plate, its characterized in that, the first surface has a plurality of electrode portions that the interval set up, the second surface has a plurality of pads that correspond with a plurality of electrode portions, a plurality of electrode portions include first positive pole portion, first negative pole portion, electrically conductive part, the chipset includes the first LED chipset of electrically connected first positive pole portion electrically conductive part, the chipset still includes the electrically connected second LED chipset of electrically conductive part first negative pole portion, first LED chipset with second LED chipset series connection.

2. The multi-chip LED package structure of claim 1, wherein the plurality of bonding pads comprises a first bonding pad electrically connected to the first positive electrode portion and a second bonding pad electrically connected to the first negative electrode portion.

3. The multi-chip LED package structure of claim 2, wherein the chip set further comprises an indicator light chip, the plurality of electrode portions further comprises a second positive electrode portion and a second negative electrode portion, and two poles of the indicator light chip are electrically connected to the second positive electrode portion and the second negative electrode portion, respectively.

4. The multi-chip LED package structure of claim 3, wherein the plurality of bonding pads further comprises a third bonding pad electrically connected to the second positive electrode portion, and a fourth bonding pad electrically connected to the second negative electrode portion.

5. The multi-chip LED package structure of claim 4, wherein the first LED chip set comprises a first LED chip and a second LED chip arranged in parallel, the anodes of the first LED chip and the second LED chip are electrically connected with the first anode portion, the cathodes of the first LED chip and the second LED chip are electrically connected with the conductive portion, the second LED chip set comprises a third LED chip and a fourth LED chip arranged in parallel, the anodes of the third LED chip and the fourth LED chip are electrically connected with the conductive portion, and the cathodes of the third LED chip and the second LED chip are electrically connected with the first cathode portion.

6. The multi-chip LED package structure of claim 5, wherein the chipset further comprises a zener diode, and two poles of the zener diode are electrically connected to the first positive pole portion and the first negative pole portion, respectively.

7. The multi-chip LED package structure of claim 6, wherein the first positive electrode portion comprises a first region extending in a first direction and a second region extending in a second direction, the first direction being perpendicular to the second direction, the first negative electrode portion comprises a third region extending in the first direction and a fourth region extending in the second direction, the conductive portion extends in the first direction, the first region is disposed adjacent to the conductive portion and forms a first space, the third region is disposed adjacent to the conductive portion and forms a second space, the first region is disposed adjacent to the fourth region and forms a third space, and the first space, the second space, and the third space are equal.

8. The multi-chip LED package structure of claim 7, wherein the first LED chip and the second LED chip are disposed at the first interval, the third LED chip and the fourth LED chip are disposed at the second interval, and the zener diode is disposed at the third interval.

9. The multi-chip LED package structure of claim 6, wherein the first positive electrode portion comprises a first region extending in a first direction and a second region extending in a second direction, the first direction being perpendicular to the second direction, the first negative electrode portion comprises a third region extending in the first direction and a fourth region extending in the second direction, the conductive portion extends in the second direction, the second region is disposed adjacent to the conductive portion and forms a first space, the fourth region is disposed adjacent to the conductive portion and forms a second space, the first region is disposed adjacent to the third region and forms a third space, and the first space, the second space, and the third space are equal.

10. The multi-chip LED package structure of claim 9, wherein the first LED chip and the second LED chip are disposed at the first interval, the third LED chip and the fourth LED chip are disposed at the second interval, and the zener diode is disposed at the third interval.

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