CN217768409U

CN217768409U - Ultraviolet LED packaging structure

Info

Publication number: CN217768409U
Application number: CN202221854736.1U
Authority: CN
Inventors: 蔡俊
Original assignee: Shanxi Huawei Uv Semiconductor Technology Co ltd
Current assignee: Shanxi Huawei Uv Semiconductor Technology Co ltd
Priority date: 2022-07-18
Filing date: 2022-07-18
Publication date: 2022-11-08
Anticipated expiration: 2032-07-18

Abstract

The utility model provides an ultraviolet LED packaging structure, it is including forming accommodating space's base plate, metal dam limit, glass jointly, it is still including accept in accommodating space's chipset and being fixed in the base plate and exposing outer padgroup, the chipset includes first UVA chip, second UVA chip, UVB chip, UVC chip, first UVA chip, after the second UVA chip series connection with UVB chip, UVC chip parallel connection, padgroup is including the first UVA chip of electricity connection, the first pad of the two poles of the earth after the second UVA chip series connection, the second pad, padgroup is including the third pad of the two poles of the earth of electricity connection UVB chip, the fourth pad, padgroup is still including the fifth pad, the sixth pad of the two poles of the earth of electricity connection UVC chip. The utility model discloses a multichannel control chip has been realized to the cooperation of first UVA chip, UVB chip, UVC chip and pad group to realize single wave band, multiband demand, simple structure and practice thrift the cost.

Description

Ultraviolet LED packaging structure

Technical Field

The utility model relates to a LED packaging structure technical field, concretely relates to ultraviolet LED packaging structure.

Background

An LED (Light Emitting Diode) is a commonly used Light Emitting device, emits Light by energy released by recombination of electrons and holes, and is widely used in the field of illumination. The LED package refers to a package of a light emitting chip, and functions to provide sufficient protection to the chip, and prevent the chip from failing due to long-term exposure or mechanical damage in the air, so as to improve the stability of the chip.

The ultraviolet LED refers to an ultraviolet semiconductor light source using the LED light emission principle, and includes all electromagnetic radiation wavelengths between 200nm and 400nm, and can be further classified into UVA (320 nm to 400nm, long-wavelength ultraviolet), UVB (280 nm to 315nm, medium-wavelength ultraviolet), and UVC (200 nm to 280nm, short-wavelength ultraviolet) bands according to the light emission wavelength. The UVC wave band can be used for sterilization, the UVA can realize a photocatalyst, and the UVB can realize plant growth and medical use. However, the ultraviolet LED packages on the market generally only realize a single wavelength band and have a single purpose.

Therefore, there is a need to provide a new uv LED package structure to solve the above technical problems.

SUMMERY OF THE UTILITY MODEL

To the deficiency that prior art exists, the utility model aims to provide an accessible multiple control realizes single wave band or multiband ultraviolet LED packaging structure.

In order to realize the above-mentioned purpose, the utility model provides an ultraviolet LED packaging structure, it is including forming accommodating space's base plate, metal box dam limit, glass jointly, it is still including accept in accommodating space's chipset and being fixed in the base plate just exposes outer pad group, the chipset includes first UVA chip, second UVA chip, UVB chip, UVC chip, after first UVA chip, second UVA chip series connection with the UVB chip parallel connection, pad group is including the electricity connection first pad, the second pad of the two poles of the earth after first UVA chip, second UVA chip establish ties, pad group is including the electricity connection third pad, the fourth pad of the two poles of the earth of the UVB chip, pad group is still including the electricity connection fifth pad, the sixth pad of the two poles of the earth of UVC chip.

Preferably, the chip set further comprises a first zener diode connected in parallel with the UVB chip and a second zener diode connected in parallel with the UVC chip.

Preferably, the substrate includes a first surface, a second surface, and a plurality of conductive holes penetrating through the substrate, and the first surface includes a plurality of electrode portions corresponding to the chip sets and arranged at intervals.

Preferably, the second surface includes a protection region, a heat dissipation region, and a plurality of conductive portions electrically connected to the plurality of electrode portions through the plurality of conductive holes, and the pad group is fixed to the plurality of corresponding conductive portions.

Preferably, the plurality of electrode parts include a first electrode part, a second electrode part and a third electrode part which are arranged at intervals, the first UVA chip is connected with the first electrode part and the second electrode part, and the second UVA chip is electrically connected with the second electrode part and the third electrode part.

Preferably, the first pad is electrically connected to the first electrode portion, and the second pad is electrically connected to the third electrode portion.

Preferably, the plurality of electrode parts comprise a fourth electrode part and a fifth electrode part which are arranged at intervals, and the UVB chip and the first zener diode are electrically connected with the fourth electrode part and the fifth electrode part.

Preferably, the third pad is electrically connected to the fourth electrode portion, and the fourth pad is electrically connected to the fifth electrode portion.

Preferably, the plurality of electrode portions include a sixth electrode portion and a seventh electrode portion, and the UVC chip and the second zener diode are electrically connected to the sixth electrode portion and the seventh electrode portion.

Preferably, the fifth pad is electrically connected to the sixth electrode portion, and the sixth pad is electrically connected to the seventh electrode portion.

The utility model discloses a multichannel control chip has been realized to the cooperation of first UVA chip, UVB chip, UVC chip and pad group to realize single wave band, multiband demand, simple structure and practice thrift the cost.

Drawings

Fig. 1 is a top view of an ultraviolet LED package structure of the present invention;

fig. 2 is a bottom view of the ultraviolet LED package structure of the present invention;

FIG. 3 isbase:Sub>A cross-sectional view taken along line A-A of FIG. 1;

fig. 4 is a cross-sectional view taken along line B-B of fig. 1.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

As shown in fig. 1 to fig. 4, the present invention provides an ultraviolet LED package structure 100, which includes a substrate 1, a metal dam edge 2, and a glass 3, which jointly form an accommodating space 10, and further includes a chip set 4 accommodated in the accommodating space 10 and a pad set 5 fixed on the substrate 1 and exposed to the outside.

The substrate 1 is a ceramic substrate, and the glass member 3 is a flat plate glass or a hemispherical quartz glass, but not limited thereto.

The substrate 1 comprises a first surface 11, a second surface 12 and a plurality of conductive holes 13 penetrating through the substrate 1, wherein conductive metal is arranged in the conductive holes 13.

The chip set 2 is disposed on the first surface 11, and the pad set 5 is disposed on the second surface 12. Specifically, the chip set 2 is soldered to the first surface 11, and the pad set 5 is soldered to the second surface 12.

The metal dam edge 2 is disposed on the first surface 11 around the chip package 4. The glass 3 is provided with a welding layer 31 on one side close to the substrate 1, and the glass 3 and the metal dam edge 2 are welded and fixed through the welding layer 31.

The chipset 4 includes a first UVA chip 41, a second UVA chip 42, a UVB chip 43, and a UVC chip 44. The first UVA chip 41 and the second UVA chip 42 are connected in series and then connected in parallel to the UVB chip 42 and the UVC chip 44. The working voltage of a single UVA chip is 3V, and the voltage of a single UVB chip and a single UVC chip is 6V. Therefore, the voltage of the first UVA chip 41 and the second UVA chip 42 after being connected in series is 6V, so that the voltage can be ensured to be connected in parallel with the UVB chip 43 and the UVC chip 44, and the power is supplied by a constant voltage power supply together.

The chip set 4 further comprises a first zener diode 45 in parallel with the UVB chip 43 and a second zener diode 46 in parallel with the UVC chip 44. The first zener diode 45 provides electrostatic protection for the UVB chip 43 and the second zener diode 46 provides electrostatic protection for the UVC chip 44.

Specifically, the first surface 11 includes a plurality of electrode portions 6 corresponding to the chipset 4 and disposed at intervals, and the second surface 12 includes a heat dissipation area 121, a protection area 122, and a plurality of conductive portions 7 electrically connected to the plurality of electrode portions 6 through a plurality of conductive holes 13. The pad group 5 is fixed on the corresponding conductive parts 7, and the pad group 5 is electrically connected with the chip group 4 through the conductive parts 7 and the electrode parts 6.

The heat dissipation region 121 is a thermoelectric separation layer, and the protection region 122 is a solder resist layer.

Specifically, the pad group 5 includes a first pad 51 and a second pad 52 electrically connected to two poles of the first UVA chip 41 and the second UVA chip 42 in series, the pad group 5 includes a third pad 53 and a fourth pad 54 electrically connected to two poles of the UVB chip 43, and the pad group further includes a fifth pad 55 and a sixth pad 56 electrically connected to two poles of the UVC chip 44.

Specifically, the plurality of electrode portions 6 include a first electrode portion 61, a second electrode portion 62, and a third electrode portion 63 that are disposed at intervals, the first UVA chip 41 is connected to the first electrode portion 61 and the second electrode portion 62, and the second UVA chip 42 is electrically connected to the second electrode portion 62 and the third electrode portion 63. The first pad 51 is electrically connected to the first electrode portion 61, and the second pad 52 is electrically connected to the third electrode portion 63.

Specifically, the first electrode portion 61, the second electrode portion 62, and the third electrode portion 63 are three rectangles arranged in parallel.

Specifically, the plurality of electrode parts comprise a fourth electrode part 64 and a fifth electrode part 65 which are arranged at intervals, and the UVB chip 43 and the first Zener diode 45 are electrically connected with the fourth electrode part 64 and the fifth electrode part 65. The third pad 53 is electrically connected to the fourth electrode portion 64, and the fourth pad 54 is electrically connected to the fifth electrode portion 65.

Specifically, the fourth electrode portion 64 is rectangular, and the fifth electrode portion 65 is L-shaped.

Specifically, the plurality of electrode portions include a sixth electrode portion 66 and a seventh electrode portion 67, and the uvc chip 44 and the second zener diode 45 are electrically connected to the sixth electrode portion 66 and the seventh electrode portion 67. The fifth pad 55 is electrically connected to the sixth electrode portion 66, and the sixth pad 56 is electrically connected to the seventh electrode portion 67.

Specifically, the sixth electrode portion 66 is L-shaped, and the seventh electrode portion 67 is rectangular.

The utility model relates to an ultraviolet LED packaging structure 100's theory of operation does: when the first bonding pad 51 and the second bonding pad 52 are turned on and voltage is input, the first UVA chip 41 and the second UVA chip 42 can be turned on, so that a UVA band is realized;

when the third pad 53 and the fourth pad 54 are turned on and voltage is input, the UVB chip 43 can be turned on, so that a UVB band is realized;

when the fifth pad 55 and the sixth pad 56 are turned on and a voltage is input, the UVC chip 44 can be turned on, so that a UVC band is realized;

and can be arbitrarily combined by the pad group 5,

when the first bonding pad 51, the second bonding pad 52, the third bonding pad 53 and the fourth bonding pad 54 are conducted, voltage is input, and a mixed wave band of UVA and UVB can be realized;

when the first bonding pad 51, the second bonding pad 52, the fifth bonding pad 55 and the sixth bonding pad 56 are conducted, voltage is input, and a mixed wave band of UVA + UVC can be realized;

when the third bonding pad 53, the fourth bonding pad 54, the fifth bonding pad 55 and the sixth bonding pad 56 are conducted, a voltage is input, and a mixed band of UVB and UVC can be realized;

when the first pad 51, the second pad 52, the third pad 53, the fourth pad 54, the fifth pad 55 and the sixth pad 56 are turned on, a voltage is input, and a full band of UVA + UVB + UVC can be realized.

Therefore, the utility model discloses an ultraviolet LED packaging structure 100 is through setting up UVA \ UVB \ UVC chip and six pads in a encapsulation to realize UVA \ UVB \ UVC's single wave band demand or multiband demand.

To sum up, the utility model relates to an ultraviolet LED packaging structure 100's beneficial effect does: but it has realized multichannel control chip through the cooperation of first UVA chip, second UVA chip, UVB chip, UVC chip and pad group to realize single wave band, multiband demand, compare traditional product, effectual saving cost.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not necessarily depart from the spirit and scope of the corresponding technical solutions in the embodiments of the present application.

Claims

1. The ultraviolet LED packaging structure is characterized by further comprising a chip set contained in the containing space and a pad set fixed on the substrate and exposed outside, wherein the chip set comprises a first UVA chip, a second UVA chip, a UVB chip and a UVC chip, the first UVA chip and the second UVB chip are connected in series and then connected in parallel, the pad set comprises a first pad and a second pad which are electrically connected with the two poles of the first UVA chip and the second UVC chip in series, the pad set comprises a third pad and a fourth pad which are electrically connected with the two poles of the UVB chip, and the pad set further comprises a fifth pad and a sixth pad which are electrically connected with the two poles of the UVC chip.

2. The uv LED package structure of claim 1, wherein said chip set further comprises a first zener diode connected in parallel with said UVB chip and a second zener diode connected in parallel with said UVC chip.

3. The UV LED package structure of claim 2, wherein the substrate comprises a first surface, a second surface, and a plurality of conductive vias penetrating through the substrate, and the first surface comprises a plurality of electrode portions corresponding to the chip sets and disposed at intervals.

4. The UV LED package structure of claim 3, wherein the second surface comprises a protection region, a heat dissipation region, and a plurality of conductive portions electrically connected to the plurality of electrode portions through the plurality of conductive holes, and the pad set is fixed to the corresponding plurality of conductive portions.

5. The ultraviolet LED package structure of claim 4, wherein the electrode portions comprise a first electrode portion, a second electrode portion and a third electrode portion which are arranged at intervals, the first UVA chip is connected with the first electrode portion and the second electrode portion, and the second UVA chip is electrically connected with the second electrode portion and the third electrode portion.

6. The UV LED package structure of claim 5, wherein the first bonding pad is electrically connected to the first electrode portion, and the second bonding pad is electrically connected to the third electrode portion.

7. The UV LED package structure of claim 6, wherein the plurality of electrode portions comprise a fourth electrode portion and a fifth electrode portion which are arranged at intervals, and the UVB chip and the first Zener diode are electrically connected with the fourth electrode portion and the fifth electrode portion.

8. The uv LED package structure according to claim 7, wherein the third pad is electrically connected to the fourth electrode portion, and the fourth pad is electrically connected to the fifth electrode portion.

9. The ultraviolet LED package structure of claim 8, wherein the plurality of electrode portions comprises a sixth electrode portion and a seventh electrode portion, and the UVC chip and the second Zener diode are electrically connected with the sixth electrode portion and the seventh electrode portion.

10. The uv LED package structure according to claim 9, wherein the fifth pad is electrically connected to the sixth electrode portion, and the sixth pad is electrically connected to the seventh electrode portion.