CN111044807A

CN111044807A - Characteristic measuring device and method, and component mounting device and method

Info

Publication number: CN111044807A
Application number: CN201910961694.8A
Authority: CN
Inventors: 泉田圭三; 纳土章; 内田英树; 浜知朗; 柿岛信幸
Original assignee: Panasonic Intellectual Property Management Co Ltd
Current assignee: Panasonic Intellectual Property Management Co Ltd
Priority date: 2018-10-15
Filing date: 2019-10-10
Publication date: 2020-04-21
Anticipated expiration: 2039-10-10
Also published as: CN111044807B; JP7281620B2; JP2020063909A; CN118884076A

Abstract

The invention provides a characteristic measuring device and method, a component mounting device and method. The characteristic measuring device includes: the anisotropic conductive sheet includes a plurality of electrodes for measuring an electrical characteristic of the electronic component, and an anisotropic conductive sheet covering at least a portion of each of the plurality of electrodes. The characteristic measuring apparatus measures an electrical characteristic of an electronic component by applying a pressure between the electronic component placed at any of a plurality of measurement positions set on a surface of the anisotropic conductive sheet opposite to the plurality of electrodes and the plurality of electrodes.

Description

Characteristic measuring device and method, and component mounting device and method

Technical Field

The present disclosure relates to a characteristic measurement device that measures electrical characteristics of an electronic component mounted on a substrate, a component mounting device having the characteristic measurement device, a characteristic measurement method, and a component mounting method.

Background

As a component mounting apparatus for mounting an electronic component on a substrate, there is known a component mounting apparatus which includes a characteristic measuring device for measuring an electrical characteristic of the electronic component and which measures the electrical characteristic of the electronic component when the electronic component is replenished or the like. In a characteristic measurement device (characteristic inspection unit) described in JP-a 5-34573 (hereinafter, patent document 1), an anisotropic conductive sheet (anisotropic conductive rubber connector) is disposed on a measurement substrate (inspection substrate) on which electrodes are formed in an arrangement shape corresponding to the arrangement shape of terminals of an electronic component to be measured. Then, an electronic component is mounted on the anisotropic conductive sheet, and a measuring device connected to the electrodes of the measuring substrate measures the electrical characteristics of the electronic component while applying pressure to the electronic component from above.

In the component mounting device described in JP 2017-27971 a (hereinafter, patent document 2), a characteristic measuring device (inspection device) is provided to a main body of a circuit board conveyance holding device via a recovery box. The inspection device holds the electronic component between the fixed member and the movable member and measures an electrical characteristic of the electronic component. After the measurement, the electronic component is released from its grip, dropped by compressed air into a downward opening, and further stored in a collection box via an L-shaped disposal passage.

In the conventional techniques including

patent documents

1 and 2, the position of the characteristic measuring device side in contact with the terminal of the electronic component to be measured is fixed. Therefore, in the process of repeatedly performing measurement of the electrical characteristics of the electronic component, the anisotropic conductive sheet and the electrode on the characteristic measuring device side deteriorate due to abrasion or the like, contact resistance increases, measurement error increases, or measurement becomes unstable.

Disclosure of Invention

The present disclosure provides a characteristic measurement device, a component mounting device, a characteristic measurement method, and a component mounting method capable of measuring electrical characteristics of an electronic component with high accuracy and stability.

The characteristic measurement device of the present disclosure has a plurality of electrodes and anisotropic conductive sheets for measuring electrical characteristics of an electronic component. The anisotropic conductive sheet has a 1 st surface and a 2 nd surface on the back side of the 1 st surface. The 1 st face covers at least a portion of each of the plurality of electrodes and is in contact with the plurality of electrodes. On the 2 nd surface of the anisotropic conductive sheet, a plurality of measurement positions are set. The characteristic measurement device applies pressure between an electronic component placed at an arbitrary position among a plurality of measurement positions and a plurality of electrodes and measures an electrical characteristic of the electronic component.

The component mounting device of the present disclosure has the above-described characteristic measurement device, a component supply section that supplies an electronic component, and a mounting head that holds and mounts the electronic component supplied from the component supply section on a substrate. The characteristic measuring device receives the electronic component held by the mounting head and measures an electrical characteristic of the electronic component.

In the characteristic measurement method of the present disclosure, the electrical characteristics of the electronic component are measured by the above-described characteristic measurement device. The characteristic measurement method includes: the method includes a component setting step of placing an electronic component at an arbitrary position among a plurality of measurement positions, a pressurizing step of applying pressure between the electronic component placed at the measurement position and a plurality of electrodes, and a characteristic measuring step of measuring an electrical characteristic of the electronic component while the pressure is applied in the pressurizing step.

In the component mounting method of the present disclosure, an electronic component is mounted on a substrate by a component mounting device having the above-described characteristic measurement device, a component supply section that supplies the electronic component, and a mounting head that holds and mounts the electronic component supplied by the component supply section on the substrate. The component mounting method includes a component taking-out step, a measurement position determining step, a component setting step, a pressing step, and a characteristic measuring step. In the component pickup step, the electronic component supplied from the component supply unit is picked up by the mounting head. In the measurement position determining step, a position at which the electronic component is to be placed is determined. In the component mounting step, an electronic component is placed at the determined measurement position. In the pressurizing step, a pressure is applied between the electronic component placed at the measurement position and the plurality of electrodes. In the characteristic measurement step, the electrical characteristics of the electronic component are measured while the pressure is applied in the pressurization step.

According to the present disclosure, the electrical characteristics of the electronic component can be measured with high accuracy and stability.

Drawings

Fig. 1 is a diagram illustrating a configuration of a component mounting system according to an embodiment of the present disclosure.

Fig. 2 is a plan view showing the structure of the component mounting apparatus according to the embodiment of the present disclosure.

Fig. 3 is a side view of a probe unit included in the characteristic measurement device according to the embodiment of the present disclosure.

Fig. 4 is a perspective view of the detector unit shown in fig. 3.

Fig. 5 is an exploded perspective view of the detector unit shown in fig. 3.

Fig. 6 is an exploded perspective view of the probe unit showing a state in which the measurement unit is further removed from the state shown in fig. 5.

Fig. 7 is an exploded perspective view of the measuring unit shown in fig. 6.

Fig. 8A is a plan view of the measurement substrate shown in fig. 7.

Fig. 8B is a side view of the measuring substrate shown in fig. 7.

Fig. 8C is a bottom view of the measuring board shown in fig. 7.

Fig. 9A is a top view of the measurement unit shown in fig. 6.

Fig. 9B is a side view of the measurement unit shown in fig. 6.

Fig. 9C is a front view of the measuring unit shown in fig. 6.

Fig. 9D is a rear view of the measuring unit shown in fig. 6.

Fig. 10A is an explanatory diagram of the function of the anisotropic conductive sheet included in the characteristic measurement apparatus according to the embodiment of the present disclosure.

Fig. 10B is an explanatory diagram of the function of the anisotropic conductive sheet included in the characteristic measurement apparatus according to the embodiment of the present disclosure.

Fig. 11 is a perspective view of a collection box included in the characteristic measurement device according to the embodiment of the present disclosure.

Fig. 12A is a plan view of the recovery tank shown in fig. 11.

Fig. 12B is a side view of the recovery tank shown in fig. 11.

Figure 13A is a partial cross-sectional view of the detector unit shown in figure 3.

Figure 13B is another partial cross-sectional view of the detector unit shown in figure 3.

Fig. 14A is an explanatory diagram of discarding of electronic components in the probe unit shown in fig. 13B.

Fig. 14B is an explanatory view of discarding of electronic components following fig. 14A.

Fig. 14C is an explanatory view of discarding of electronic components following fig. 14B.

Fig. 15A is an explanatory diagram of a plurality of measurement positions set in the characteristic measurement device according to the embodiment of the present disclosure.

Fig. 15B is a diagram showing a relationship between a plurality of measurement positions set in the characteristic measurement device according to the embodiment of the present disclosure and the size of the electronic component.

Fig. 16A is a diagram showing an example in which an electronic component to be measured is placed at a measurement position set in the characteristic measurement device according to the embodiment of the present disclosure.

Fig. 16B is a diagram showing another example of an electronic component to be measured placed at a measurement position set in the characteristic measurement device according to the embodiment of the present disclosure.

Fig. 17 is a block diagram showing a configuration of a control system of the component mounting apparatus according to the embodiment of the present disclosure.

Fig. 18 is a flowchart of measurement preparation in the characteristic measurement device according to the embodiment of the present disclosure.

Fig. 19 is a flowchart of component mounting in the component mounting device according to the embodiment of the present disclosure.

Fig. 20 is a flowchart of characteristic measurement in the component mounting device according to the embodiment of the present disclosure.

Fig. 21A is an explanatory view of a process of measuring characteristics in the component mounting device according to the embodiment of the present disclosure.

Fig. 21B is a process explanatory diagram following the characteristic measurement of fig. 21A.

Fig. 21C is a process explanatory diagram following the characteristic measurement of fig. 21B.

Fig. 22A is a process explanatory diagram following the characteristic measurement of fig. 21C.

Fig. 22B is a process explanatory diagram following the characteristic measurement of fig. 22A.

Fig. 22C is a process explanatory diagram following the characteristic measurement of fig. 22B.

Fig. 22D is a process explanatory diagram following the characteristic measurement of fig. 22C.

Detailed Description

Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. The configurations, shapes, and the like described below are examples for explanation, and can be changed as appropriate depending on the specifications of the component mounting system, the component mounting apparatus, and the characteristic measurement apparatus. In the following, corresponding elements in all the drawings are denoted by the same reference numerals, and redundant description thereof is omitted.

In fig. 2 and a part described later, an X direction (a direction from left to right in fig. 2) which is a direction in which a substrate is conveyed and a Y direction (a direction from bottom to top in fig. 2) which is a direction perpendicular to the direction in which the substrate is conveyed are shown as 2-axis directions perpendicular to each other in a horizontal plane. Fig. 3 and a part described later show a Z direction (a direction from bottom to top in fig. 3) as a height direction perpendicular to a horizontal plane. The Z direction is a vertical direction in a case where the component mounting device is set on a horizontal plane.

First, a component mounting system 1 will be described with reference to fig. 1. The component mounting system 1 includes a component mounting device M1, a component mounting device M2, and a component mounting device M3 in this order from the upstream side (left side in fig. 1) in the substrate conveying direction. The component mounting devices M1 to M3 are connected to the upper computer CP via a wired or wireless communication network NW, and can transmit and receive data to and from the upper computer CP. The upper computer CP receives the status of each device and totally controls the manufacture of the mounting substrate.

The component mounting apparatuses M1 to M3 constitute a component mounting line L that sequentially delivers substrates from upstream and sequentially mounts components on the substrates to manufacture mounted substrates. The number of the component mounting apparatuses M1 to M3 constituting the component mounting line L is not necessarily 3, and may be 1, 2, or 4 or more.

Next, the structure of the component mounting apparatuses M1 to M3 will be described with reference to fig. 2. The component mounting apparatuses M1 to M3 have the same configuration, and the component mounting apparatus M1 will be described below. In fig. 2, the substrate transfer mechanism 3 is provided in the X direction at the center of the base 2. The substrate transport mechanism 3 transports the substrate B carried in from the upstream side in the X direction, and positions and holds the substrate B at a mounting operation position by a mounting head described below. The substrate transport mechanism 3 transports the substrate B, on which the component mounting operation has been completed, to the downstream side. The component supply units 4 are provided on both sides of the substrate transfer mechanism 3.

At the component supply section 4, a plurality of tape feeders 5 are mounted in line in the X direction. The tape feeder 5 supplies the electronic components to a component pickup position where the mounting head picks up the electronic components by conveying the carrier tape formed with the depressions for storing the electronic components at intervals in a direction (a conveyor belt conveying direction) from the outside of the component supply part 4 toward the substrate conveying mechanism 3. If the remaining number of electronic components supplied from the tape feeders 5 is less than a predetermined number, a worker performs a replenishing operation of splicing a new carrier tape to the rear end of the carrier tape supplied to the tape feeders 5 and inserting the new carrier tape into the tape feeders 5.

In fig. 2, Y-axis tables 6 having linear drive mechanisms are disposed on both ends of the upper surface of the base 2 in the X direction. On the Y-axis table 6, a beam 7 also having a linear mechanism is coupled to be movable in the Y direction. On the beam 7, a mounting head 8 is mounted so as to be movable in the X direction. At the lower end of the mounting head 8, a suction nozzle 8a (see fig. 21C) holding an electronic component is detachably mounted.

In fig. 2, the Y-axis table 6 and the beam 7 constitute a head moving mechanism 9 that moves the mounting head 8 in the horizontal direction (X direction, Y direction). The head moving mechanism 9 and the mounting head 8 vacuum-adsorb and hold the electronic components supplied to the component pickup positions of the tape feeders 5 mounted on the component supply units 4 by the adsorption nozzles 8a, and repeatedly perform a series of cycles of component mounting work for transferring and mounting the electronic components to the mounting positions of the boards B held by the board conveying mechanism 3.

In fig. 2, a head camera 10 that is located on the lower surface side of the beam 7 and moves integrally with the mounting head 8 is mounted on the beam 7. The head camera 10 moves above the substrate B positioned at the mounting work position of the substrate transfer mechanism 3 by the movement of the mounting head 8, and images a substrate mark (not shown) provided on the substrate B to recognize the position of the substrate B. The head camera 10 moves upward of the probe unit 13, which will be described later, and images an electrode mark 64 (see fig. 9A) provided so as to be visually recognizable from the upper surface of the probe unit 13, thereby recognizing the position of the electrode mark 64.

Between the component supply unit 4 and the substrate conveyance mechanism 3, a component recognition camera 11 is provided. When the mounting head 8 that takes out the electronic component from the component supply part 4 moves above the component recognition camera 11, the component recognition camera 11 images the electronic component held by the mounting head 8 and recognizes the shape. In the component mounting operation of the electronic component on the board B by the mounting head 8, the recognition result of the board B by the head camera 10 and the recognition result of the electronic component by the component recognition camera 11 are further added to correct the mounting position.

In fig. 2, the touch panel 12 operated by the operator is provided in front of the component mounting apparatus M1 at a position where the operator performs work. The touch panel 12 displays various information and warning information on its display unit, and the operator inputs data and operates the component mounting apparatus M1 using operation buttons and the like displayed on the display unit.

In fig. 2, a prober unit 13 is provided between the component supply unit 4 and the substrate conveying mechanism 3, i.e., beside the component recognition camera 11. The probe unit 13 has a plurality of electrodes electrically connected to terminals of the electronic component. The plurality of electrodes of the probe unit 13 are connected to a measuring instrument 15 via a cable 14. The measuring device 15 measures electrical characteristics such as resistance, capacitance, and inductance of the electronic components electrically connected to the electrodes of the detector unit 13. A probe unit 13 having a plurality of electrodes electrically connected to terminals of the electronic component, a measuring instrument 15 for measuring electrical characteristics of the electronic component, and a cable 14 connecting the plurality of electrodes and the measuring instrument 15 constitute a characteristic measuring device 16 for measuring electrical characteristics of the electronic component.

When the type of the electronic component supplied from the tape feeder 5 is changed and the electronic component is supplied to the tape feeder 5, the mounting head 8 takes out the electronic component to be measured from the tape feeder 5 and delivers it to the probe unit 13, and the electrical characteristics of the electronic component are measured by the measuring device 15. The measurement result is sent to the device control unit 90 (see fig. 17) of the component mounting device M1 or the upper computer CP, and it is determined whether the changed or replenished electronic component is correct based on the measured electrical characteristics.

Next, the structure of the detector unit 13 will be described with reference to fig. 3 to 6. In fig. 3, the probe unit 13 includes a fixing portion 30, a measurement unit 50, and a recovery tank 70. The fixing portion 30 is provided on the base 2. The measurement unit 50 and the collection box 70 are detachably attached to the fixing portion 30. Fig. 3 shows a side view of the detector unit 13. Fig. 4 shows a state in which the measurement unit 50 and the collection box 70 are attached to the fixing portion 30, fig. 5 shows a state in which the collection box 70 is removed from the fixing portion 30, and fig. 6 shows a state in which the measurement unit 50 is removed from the fixing portion 30.

The probe unit 13 is installed at a position where an operator can easily perform an operation of attaching and detaching the measurement unit 50 and the collection box 70 to and from the outside of the component mounting apparatuses M1 to M3. Hereinafter, the side on which the operator works on the probe unit 13 is referred to as "front side", and the opposite side to the front side is referred to as "rear side".

In fig. 6, a mounting surface 31 to which the measurement unit 50 is detachably attached is provided above the fixing portion 30. A plurality of pins 32 formed of a conductive body biased upward by an elastic body such as a spring are disposed on the upper surface of the mounting surface 31. The upper portions of the pins 32 protrude upward from the mounting surface 31. That is, the plurality of pins 32 are biased in a direction protruding from the mounting surface 31. The pins 32 are connected to the measuring instrument 15 via the cables 14. In this way, the plurality of pins 32 are arranged on the mounting surface 31, and constitute a plurality of fixed-side contacts connected to the measuring instrument 15 for measuring the electrical characteristics of the electronic component.

The fixing portion 30 is provided with an air discharge portion 33 connected to the measurement unit 50 on the rear side of the mounting surface 31. A protrusion 33a protruding forward is formed at the center of the front surface of the air ejection portion 33. A plurality of compressed air discharge ports 34 are formed in front of the projection 33 a. The plurality of ejection ports 34 are formed in a vertical direction (Z direction) in an aligned manner. That is, the air ejection portion 33 has a plurality of ejection ports 34 in the vertical direction. The plurality of discharge ports 34 are connected to a compressed air source, not shown, via an air valve 35. When the air valve 35 is opened, compressed air is discharged from the plurality of discharge ports 34.

In fig. 6, at the center of the rear of the measuring unit 50, a connecting portion 50a recessed to the front side is formed. When attaching the measurement unit 50 to the attachment surface 31, the worker moves the lower surface of the measurement unit 50 from the front side to the rear side so that the lower surface of the measurement unit 50 slides on the upper surface of the attachment surface 31 to press the measurement unit 50 to the rear side. Thereby, the connection portion 50a of the measurement unit 50 is connected to the protruding portion 33a of the air ejection portion 33 (see fig. 5). In this way, the measurement unit 50 is formed with the connection portion 50a connected to the air ejection portion 33.

In fig. 3 to 5, the fixing portion 30 is provided with a pressing portion 36 for pressing downward an electronic component placed at a measurement position set in the measurement unit 50, which will be described later. The pressing part 36 includes a pressing member 37 that contacts the electronic component from above, a lifting mechanism 38a that lifts and lowers the pressing member 37 in the vertical direction (Z direction) (arrow a in fig. 4), and a reciprocating mechanism 38b that reciprocates the pressing member 37 in the left-right direction (X direction) (arrow b in fig. 4). The pressing member 37 is formed of an insulator such as hard plastic.

In this way, the lifting mechanism 38a and the reciprocating mechanism 38b constitute a pressing member moving mechanism 38 that lifts and lowers the pressing member 37 and reciprocates the pressing member in at least one direction (X direction) in the horizontal plane. That is, the pressing member moving mechanism 38 selectively moves the pressing member 37 in any one of the 1 st direction (downward direction) in which the electronic component faces the plurality of electrodes 61 and the 2 nd direction (upward direction) opposite to the 1 st direction. Further, the pressing member moving mechanism 38 reciprocates the pressing member 37 along at least one axis among a plurality of axes passing through a plane intersecting the 1 st direction. The pressing member moving mechanism 38 is controlled by a unit control unit 39 (see fig. 17) included in the probe unit 13. The pressing member moving mechanism 38 includes a pressure adjusting portion 38c that presses the electronic component with a constant pressure below the plurality of electrodes 61 regardless of the position (height) at which the pressing member 37 is in contact with the electronic component by a magnetic force or the like. The pressure adjusting unit 38c may be realized by measuring the pressure applied to the pressing member 37 by a pressure sensor and adjusting the amount of lowering of the lifting mechanism 38a by the unit control unit 39.

In fig. 5, a tank holding portion 40 for holding the recovery tank 70 is provided on the front side of the fixing portion 30. The tank holding portion 40 has a pair of guide plates 41 that support both side surfaces of the recovery tank 70 held by the tank holding portion 40 from the outside. Notches 41a are formed in the guide plates 41 so as to be obliquely cut toward the front side. Further, a holding side inclined surface 41b is formed on the front side of the notch portion 41 a. A pair of flat plate-shaped coupling portions 71 are provided on both side surfaces of the recovery tank 70. The connection portions 71 are formed with insertion portions 71a that extend obliquely to be inserted into the cutout portions 41a of the guide plate 41. A tank-side inclined surface 71b is formed on the front side of the insertion portion 71 a.

In the center of the front surface of the measurement unit 50, a discharge port 51 through which the electronic components are discharged together with the compressed air is formed to protrude forward. A recovery port 72 (see fig. 11) that fits into the discharge port 51 of the measurement unit 50 in a state where the recovery tank 70 is held by the tank holding portion 40 is formed in an upper portion of the rear surface of the recovery tank 70. A detection sensor 42 having a light emitting portion 42a that emits detection light and a light receiving portion 42b that receives the detection light is provided at the center of the rear lower portion of the box holding portion 40. The detection signal of the detection sensor 42 is sent to the unit control section 39. A shutter 73 (see fig. 11) for blocking the detection light of the detection sensor 42 when the recovery tank 70 is held in the tank holding portion 40 in a normal posture is provided at a lower portion of the rear surface of the recovery tank 70.

In fig. 5, when attaching the recovery tank 70 to the tank holding portion 40, the worker inserts the insertion portion 71a of the recovery tank 70 into the notch portion 41a of the tank holding portion 40 so that the tank side inclined surface 71b of the recovery tank 70 slides along the holding side inclined surface 41b of the tank holding portion 40 from obliquely above the front side. When the collection box 70 is held in the box holding portion 40 in a normal posture, the discharge port 51 of the measurement unit 50 is fitted into the collection port 72 of the collection box 70, and the shield 73 of the collection box 70 shields the detection light of the detection sensor 42.

Thus, the recovery box 70 has a recovery port 72 fitted to the discharge port 51 of the measurement unit 50, and box-side inclined surfaces 71b that slide along the holding-side inclined surfaces 41b of the box holding portion 40 are formed on both side surfaces of the recovery box 70, respectively, and are detachable from the fixing portion 30. The tank holding portion 40 is provided at the fixing portion 30, has a pair of guide plates 41 supporting both side surfaces of the recovery tank 70 from the outside, and is formed with holding side inclined surfaces 41b formed by obliquely cutting the pair of guide plates 41 toward the side where the recovery tank 70 is inserted into the tank holding portion 40, respectively, and holds the recovery tank 70 in a state where the recovery port 72 is fitted to the discharge port 51. Thus, the collection box 70 can be attached to and detached from the probe unit 13 without using a tool, and the operator can easily collect the electronic component D discarded in the collection box 70 in a state where the collection box 70 is detached from the apparatus.

The collection box 70 is provided with a shade 73 that shields the detection light when held in the box holding portion 40 in a normal posture. The tank holding unit 40 is provided with a detection sensor 42 having a light emitting unit 42a for emitting detection light for detecting the collection tank 70 held in a normal posture, and a light receiving unit 42b for receiving the detection light. This makes it possible to detect whether or not the collection tank 70 is attached to the tank holding portion 40 in a normal posture. The detection sensor 42 is not limited to an optical sensor, and may be, for example, a proximity sensor that detects the collection tank 70 by a change in magnetic or electrostatic capacitance, or a limit switch that detects contact with the collection tank 70.

In fig. 3, the recovery box 70 is formed with a top plate 74 on the upper portion of the discharge port 51 in a state where the recovery port 72 is fitted to the discharge port 51 of the measurement unit 50, above the recovery port 72. The center of gravity G of the recovery tank 70 is set at a position where the recovery port 72 side is lowered downward in a state of being held by the tank holding portion 40. That is, the center of gravity G of the recovery tank 70 is set to be located further to the rear side than the fulcrum F of the recovery tank 70 on the pair of guide plates 41 of the tank holding portion 40. As a result, a force (arrow c) is generated in the recovery box 70 to rotate and lower the rear side downward around the fulcrum F. Thereby, the top plate 74 is in close contact with the upper surface of the discharge port 51, and the electronic components discharged from the discharge port 51 can be prevented from flying out of the recovery port 72.

Next, the structure of the measurement unit 50 will be described with reference to fig. 7 to 9D. In fig. 7, the measurement unit 50 includes a substrate holding member 52, an anisotropic conductive sheet 53, and a measurement substrate 60. The function of the anisotropic conductive sheet 53 will be described later. In fig. 8A to 8C, a plurality of (2 in this case) electrodes 61 electrically connected to a terminal Dt (see fig. 10A) of an electronic component D are formed on an upper surface 60A of a measurement substrate 60. On the lower surface 60b of the measurement substrate 60, a plurality of (2 in this case) cell-side contacts 62 electrically connected to a plurality of pins 32 (fixed-side contacts) arranged on the mounting surface 31 of the fixing portion 30 are formed. The electrodes 61 are electrically connected to the corresponding cell-side contacts 62 via the internal electrodes 63.

That is, a plurality of electrodes 61 electrically connected to the electronic component D are formed on the upper surface 60a (one surface) of the measurement substrate 60, and a plurality of unit-side contacts 62 electrically connected to the plurality of electrodes 61 and the plurality of fixed-side contacts (the pins 32) are formed on the lower surface 60b (another surface different from the one surface). In fig. 8A, 2 electrodes 61 are shown as the plurality of electrodes 61. A front substrate notch 60c is formed on the front side of the measurement substrate 60, and a rear substrate notch 60d is formed on the rear side of the measurement substrate 60. On the upper surface 60a (the surface on which the plurality of electrodes 61 are formed) of the

measurement substrate

60, 2 electrode marks 64 for identifying the positions of the plurality of electrodes 61 are formed at diagonal positions. A mounting hole 65 penetrating vertically is formed at a diagonal position different from the diagonal position of the measurement substrate 60 where the electrode mark 64 is formed.

In fig. 7, the measurement substrate 60 is mounted on the lower portion of the substrate holding member 52 from below in a state where the anisotropic conductive sheet 53 is placed so as to cover the upper surfaces of the plurality of electrodes 61. The measurement substrate 60 is fixed to the substrate holding member 52 by screws 54 inserted into the mounting holes 65. The anisotropic conductive sheet 53 has a lower surface (1 st surface) and an upper surface (2 nd surface). The lower surface covers at least a part of the plurality of electrodes 61 and is in contact with the plurality of electrodes 61. The upper surface is a face of the backside of the lower surface.

In fig. 7 and 9A, the substrate holding member 52 is formed with a measurement opening 52a that penetrates upward from an electrode 61 of a measurement substrate 60 to be mounted. In the measurement unit 50, a measurement position P where the electronic component D is placed with the anisotropic conductive sheet 53 interposed therebetween is set so that the terminal Dt of the electronic component D faces the plurality of electrodes 61 of the measurement substrate 60 mounted on the substrate holding member 52. That is, a measurement position P where the electronic component D to be measured is placed is set on the upper surface (2 nd surface) of the anisotropic conductive sheet 53 covering the plurality of electrodes 61, and the substrate holding member 52 is formed with a measurement opening 52a penetrating to the measurement position P.

The substrate holding member 52 is formed with a recognition opening 52b penetrating the electrode mark 64 of the mounted measurement substrate 60. When the measurement unit 50 is viewed from above, the electrode mark 64 of the measurement substrate 60 can be seen through the recognition opening 52 b. On the other hand, since the anisotropic conductive sheet 53 is opaque, the electrode 61 of the measurement substrate 60 mounted on the substrate holding member 52 cannot be seen through the measurement aperture 52 a. Therefore, in a state where the measurement unit 50 is attached to the attachment surface 31 of the fixing portion 30, the electrode mark 64 is imaged from above by the head camera 10 and recognition processing is performed, whereby the position of the electrode 61 that cannot be directly recognized can be calculated.

In fig. 9A and 9B, a moving groove 52c in which the pressing member 37 of the pressing portion 36 moves from the measurement opening 52a to one side surface is formed in the upper portion of the substrate holding member 52. When the reciprocating mechanism 38b is operated in a state where the measurement unit 50 is attached to the attachment surface 31 of the fixing portion 30, the pressing member 37 reciprocates along the moving groove 52c from the outside of the measurement unit 50 to above the measurement opening 52 a. A rear holding notch 52d is formed in the center of the rear face of the substrate holding member 52. When the measurement substrate 60 is mounted on the substrate holding member 52, the rear holding notch 52d of the substrate holding member 52 and the rear substrate notch 60d of the measurement substrate 60 are integrated with each other to constitute the connection portion 50a of the measurement unit 50.

A rear side through groove 52e is formed in the substrate holding member 52 so as to penetrate from the measurement opening 52a to the rear side of the rear side holding slit 52 d. The top and side surfaces of the rear through groove 52e are formed by the substrate holding member 52, and the bottom surface is open. When the measurement substrate 60 is mounted on the substrate holding member 52, the upper surface 60a of the measurement substrate 60 becomes a bottom surface, and a through passage is formed so as to surround the substrate holding member 52 and the measurement substrate 60 in the vertical and horizontal directions. The substrate holding member 52 is provided with a front through-passage 52f that penetrates the substrate holding member 52 from the measurement opening 52a to the front surface of the discharge port 51. The front substrate notch 60c of the measurement substrate 60 is formed integrally with the front through-passage 52 f.

In fig. 9A and 9B, in a state where the substrate holding member 52 has the measurement substrate 60 mounted thereon, the rear side through groove 52e, the measurement opening 52a, and the front side through passage 52f constitute a discharge passage 50B that penetrates from the rear surface of the connection portion 50a to the front surface of the discharge port 51 via the measurement position P set in the measurement opening 52 a. In a state where the measurement unit 50 is attached to the attachment surface 31 of the fixing portion 30, the discharge passage 50b of the measurement unit 50 flows the compressed air discharged from the discharge port 34 of the air discharge portion 33 from the connecting portion 50a, and passes through the measurement unit 50 in the horizontal direction to the discharge port 51 via the measurement position P (see also fig. 14A to 14C). The discharge passage 50b may be constituted by the substrate holding member 52 alone, may be constituted by combining with the measurement substrate 60, or may be constituted by combining with the mounting surface 31 of the fixing portion 30.

In a state where the measurement substrate 60 is mounted on the substrate holding member 52, the unit-side contact 62 formed on the lower surface 60b of the measurement substrate 60 is exposed from the bottom of the measurement unit 50. When the measurement unit 50 is attached to the attachment surface 31 of the fixing portion 30, the unit-side contact 62 is electrically connected to the pin 32 (fixing-side contact) disposed on the attachment surface 31. That is, the plurality of electrodes 61 formed on the upper surface 60a of the measurement substrate 60 are connected to the measuring instrument 15. By configuring such that the measurement unit 50 can be removed from the probe unit 13 in this manner, the operator can easily replace the anisotropic conductive sheet 53 and the measurement substrate 60 with the measurement unit 50 removed.

Next, the function of the anisotropic conductive sheet 53 mounted so as to cover at least a part of each of the plurality of electrodes 61 formed on the upper surface 60A of the measurement substrate 60 will be described with reference to fig. 10A and 10B. Fig. 10A and 10B are enlarged cross-sectional views of the probe unit 13 shown in fig. 3, including the electronic component D placed at the measurement position P, in the section a-a. In this example, the electronic component D is a chip component having 2 terminals Dt, such as a resistor, a capacitor, and an inductor. The electronic component D is placed at a measurement position P, which is a position where the 2 terminals Dt face the 2 electrodes 61 with the anisotropic conductive sheet 53 interposed therebetween. The anisotropic conductive sheet 53 has a characteristic of maintaining a state in which the conductivity in the pressure application direction (pressure direction) is low and the conductivity other than the pressure direction is high when pressure is applied.

Fig. 10A shows a state where the pressing member 37 of the pressing portion 36 is positioned above the electronic component D. In this state, no pressure is applied to the anisotropic conductive sheet 53, and the conductivity of the anisotropic conductive sheet 53 is high in all directions. Fig. 10B shows a state where the elevating mechanism 38a of the pressing part 36 operates to lower the pressing member 37 and press the electronic component D downward with a predetermined pressure (arrow D). In this state, a pressure is applied to the anisotropic conductive sheet 53 in the vertical direction from the terminal Dt of the electronic component D to the electrode 61 of the measurement substrate 60.

That is, the pressure direction in fig. 10B is a direction from the top to the bottom, and is a state in which the resistance R of the portion of the anisotropic conductive sheet 53 sandwiched between the opposing terminals Dt and the electrodes 61 is low (the conductivity is low), and the high resistance (the conductivity is high) is maintained between the terminals Dt and the electrodes 61 adjacent to each other on the left and right. In this state, the terminal Dt of the electronic component D is electrically connected to the measuring device 15, and the electrical characteristics of the electronic component D can be measured by the measuring device 15.

In this way, the pressing portion 36 presses the electronic component D placed at the measurement position P where the terminal Dt of the electronic component D faces the plurality of electrodes 61 with the anisotropic conductive sheet 53 interposed therebetween, against the plurality of electrodes 61. In the characteristic measurement device 16, the electrical characteristics of the electronic component D placed at the measurement position P are measured by the measuring instrument 15 in a state where pressure is applied between the terminal Dt of the electronic component D and the plurality of electrodes 61. By inserting the anisotropic conductive sheet 53 between the electronic component D and the electrode 61, even if there is a difference in the shape of the electronic component D, the terminal Dt of the electronic component D and the electrode 61 can be electrically connected stably, and the difference in the measurement result can be reduced.

Next, the internal structure of the recovery tank 70 will be described with reference to fig. 5, 11 to 13B. Fig. 13A is a sectional view of the detector unit 13 including the recovery tank 70 in the section B-B of fig. 3, and fig. 13B is a sectional view of the detector unit 13 including the recovery tank 70 in the section C-C of fig. 4.

In fig. 13B, when the measurement unit 50 is attached to the attachment surface 31 of the fixing portion 30 of the probe unit 13 in a normal posture and the recovery tank 70 is held by the tank holding portion 40 in a normal posture, the rear side of the discharge path 50B of the measurement unit 50 is connected to the air ejection portion 33 and the front side of the discharge path 50B is connected to the recovery port 72 of the recovery tank 70. That is, the detector unit 13 has: an air ejection portion 33 having an ejection port 34, a measurement region U in which a measurement position P where an electronic component D to be measured is placed is set, and a recovery box 70 disposed at a position opposed to the ejection port 34 across the measurement position P. In the measurement region U, a discharge passage 50b is formed which penetrates from the discharge port 34 to the collection tank 70 in the horizontal direction through the measurement position P.

In fig. 13B, a 1 st air outlet 76 to which a 1 st air filter 75 through which air passes without passing through the electronic component D is attached is provided on the front surface of the collection box 70, that is, at a position facing the ejection port 34 with the measurement position P therebetween. A component drop portion V having a drop opening 77a for dropping the electronic component D blown off from the measurement position P by the compressed air jetted from the jet opening 34 downward is provided inside the recovery box 70, that is, in front of the jet opening 34 side (recovery opening 72 side) of the 1 st air filter 75.

In fig. 13A and 13B, a housing portion 78 for housing the electronic component D dropped from the drop opening 77a is provided inside the collection box 70, that is, below the component drop portion V. The component drop part V has a bottom surface 79a and two side surfaces 79b extending from the discharge path 50b, and an extending protrusion 79 extending to a position covering at least a part of the upper side of the drop opening 77a is formed. A funnel-shaped drop wall 77 having an upper portion 77b larger than the drop opening 77a and a diameter decreasing toward the drop opening 77a is formed in the component drop portion V. In the component drop portion V, a crescent-shaped upper opening 77c is formed between the extension protrusion 79 and the 1 st air filter 75 (see also fig. 12A). The electronic component D blown off from the measurement position P falls into the upper opening 77c from the front end of the extension protrusion 79, and is further accommodated in the accommodating portion 78 through the drop opening 77 a.

In fig. 13A and 13B, the receiving portion 78 has a reverse flow preventing portion 80 formed below the drop port 77a and protruding upward toward the drop port 77 a. The reverse flow preventing part 80 has a cylindrical lower part and a conical upper part. A 2 nd air outlet 82 through which air passes and through which the 2 nd air filter 81 of the electronic component D does not pass is formed in the front surface of the collection box 70, that is, in the front surface of the housing portion 78. The recovery tank 70 may be provided with an exhaust port to which an air filter is also attached to the side surface of the housing portion 78. In this way, the recovery box 70 is provided with the exhaust ports (the 1 st exhaust port 76 and the 2 nd exhaust port 82) to which the air filters (the 1 st air filter 75 and the 2 nd air filter 81) that pass the air and do not pass the electronic component D are attached.

In fig. 12A to 13B, the recovery tank 70 includes an upper recovery unit 70a and a lower recovery unit 70B. The upper collection portion 70a is connected to the discharge passage 50 b. In the upper collection unit 70a, a component dropping unit V and a 1 st exhaust port 76 are provided. The component drop V has an extending projection 79 and a drop wall 77. A 1 st air filter 75 is installed at the 1 st exhaust port 76. The lower collection portion 70b has a housing portion 78. The housing portion 78 is provided with a backflow prevention portion 80 and a 2 nd exhaust port 82. At the 2 nd exhaust port 82, a 2 nd air filter 81 is installed. That is, the collection box 70 has a two-stage structure of an upper collection unit 70a and a lower collection unit 70b, and the upper collection unit 70a and the lower collection unit 70b are connected by a drop opening 77 a.

Next, an electronic component discarding step of ejecting compressed air from the ejection port 34 of the air ejection portion 33, blowing open the electronic component D at the measurement position P, and discarding the electronic component D in the storage portion 78 of the collection box 70 in the probe unit 13 will be described with reference to fig. 13B to 14C. As shown in fig. 13B, first, the electronic component D is placed at the measurement position P. In fig. 14A, when compressed air is ejected from the ejection port 34, the electronic component D blown by the compressed air passes through the discharge passage 50b from the measurement region U (measurement unit 50) and moves to the collection box 70 (arrow e).

In fig. 14B, the electronic component D that has further passed through the extension protruding portion 79 and reached the 1 st air filter 75 falls from the upper opening 77c into the falling wall 77, collides with the falling wall 77, and faces the housing portion 78 through the falling opening 77a (arrow f). In fig. 14C, when the ejection of the compressed air from the ejection port 34 is stopped, the electronic component D reaching the housing portion 78 is stopped by the housing portion 78 (arrow g). The compressed air discharged from the discharge port 34 passes through the 1 st air filter 75 and is discharged from the 1 st air outlet 76, or passes through the 2 nd air filter 81 and is discharged from the 2 nd air outlet 82 to the outside of the recovery tank 70 (fig. 14A and 14B).

The air ejection portion 33 ejects compressed air from the 2 (a plurality of) ejection ports 34 arranged vertically and downwardly, thereby reliably blowing off even electronic components D having different sizes (heights) from the measurement position P to the recovery box 70. Further, by extending the extending projection 79 to a position covering a part of the upper side of the drop opening 77a, the discarded electronic component D can be reliably dropped from the upper opening 77c to the housing portion 78. Further, by disposing the backflow prevention portion 80 protruding upward below the drop opening 77a, the electronic component D housed in the housing portion 78 can be prevented from being blown off and flowing backward from the drop opening 77a toward the component drop portion V.

Next, a measurement position P where the electronic component D whose electrical characteristics are to be measured is placed will be described with reference to fig. 15A to 16B. The 2 opposing electrodes 61 formed on the measurement substrate 60 shown in fig. 15A have sides of the same length that face each other. The length Q (the length on the left and right in the drawing) of the opposing sides is longer than the component width W (the length of the electronic component) of the electronic component D placed across 2 electrodes 61, and the measurement positions P1 to P9 are set at 9 positions in the direction along the opposing sides of the electrodes 61 (the extending direction of the component width W). That is, the measurement positions P1 to P9 are arranged along the opposing sides of the electrode 61. The measurement positions P1 to P9 at which the electronic component D to be measured is placed are set based on the component width W of the electronic component D to be measured. In addition, in fig. 15A, the anisotropic conductive sheet 53 provided to cover the electrode 61 is omitted for convenience.

Fig. 15B shows an example of the relationship between the component width W of the electronic component D to be measured and the measurement positions P1 to P9. The small-sized electronic component D (W.ltoreq.W 1) is placed at all of the 9 set measurement positions P1 to P9 (FIG. 16A). The middle-sized electronic component D (W1 < W.ltoreq.W 2) is placed at 3 measurement positions P3, P5, and P7 (FIG. 16B). The large-sized electronic component D (W2 < W.ltoreq.W 3) is placed at the measurement position P5 at the center (FIG. 15A).

In this way, the length Q of the opposing sides of the plurality of electrodes 61 that face each other is longer than the component width W of the electronic component D (the length of the electronic component in the direction along the opposing sides of the electrodes 61) placed at the measurement positions P1 to P9 across the plurality of electrodes 61, and the measurement positions P1 to P9 are set in plural numbers in the direction along the opposing sides of the electrodes 61 based on the component width W of the electronic component D. The electronic components D to be measured are placed at the measurement positions P1 to P9 so that the number of times of placement is equalized. By dispersedly mounting the electronic components D to be measured at the plurality of measurement positions P1 to P9, damage to the anisotropic conductive sheet 53 when the electronic components D are mounted can be reduced, and deterioration of the anisotropic conductive sheet 53 can be suppressed.

Next, the configuration of the control system of the component mounting apparatuses M1 to M3 will be described in detail with reference to fig. 17. The component mounting apparatuses M1 to M3 have the same configuration, and here, the component mounting apparatus M1 will be described. The device control unit 90 included in the component mounting device M1 is connected to the substrate transfer mechanism 3, the component supply unit 4, the mounting head 8, the mounting head moving mechanism 9, the head camera 10, the component recognition camera 11, the touch panel 12, and the characteristic measurement device 16. The apparatus control unit 90 includes a mounting control unit 91, a measurement control unit 92, a recognition processing unit 93, a measurement position determination unit 94, a component acceptance determination unit 95, a production data storage unit 96, a component information storage unit 97, and a measurement information storage unit 98.

The production data storage unit 96 is a storage device that stores production data including the component name (type) and mounting position (XY coordinates) of the electronic component D, which are referred to when the electronic component D is mounted on the substrate B. The component information storage unit 97 is a storage device that stores the component names, sizes (component widths W), standard values of electrical characteristics, information specifying the tape feeders 5 that supply the electronic components D, the remaining number of the electronic components D, and the like of the electronic components D mounted on the substrate B, and the measurement positions P1 to P9 and the like that are placed when the characteristics are measured. The measurement information storage 98 is a storage device that stores the positions (XY coordinates) of the measurement positions P1 to P9 with the electrode mark 64 formed on the measurement substrate 60 as a base point. The measurement information storage 98 stores the number of times the electronic component D whose characteristics are measured is mounted in association with the component name and the measurement positions P1 to P9.

In fig. 17, the mounting control unit 91 controls the substrate transfer mechanism 3, the component supply unit 4, the mounting head 8, the mounting head moving mechanism 9, the head camera 10, and the component recognition camera 11 to execute a component mounting operation for mounting the electronic component D on the substrate B. When the electronic components D are taken out from the tape feeder 5, the mounting control unit 91 subtracts the remaining number of the electronic components D stored in the component information storage unit 97. The measurement control unit 92 controls the component supply unit 4, the mounting head 8, the mounting head moving mechanism 9, the head camera 10, the component recognition camera 11, and the characteristic measurement device 16, takes out the electronic component D to be measured from the tape feeder 5 through the suction nozzle 8a of the mounting head 8 and places it at the measurement position P, and totally controls a series of characteristic measurements in which the electrical characteristics are measured by the measuring instrument 15.

The recognition processing unit 93 performs recognition processing on the image of the electronic component D held by the suction nozzle 8a captured by the component recognition camera 11, and recognizes the position of the electronic component D held by the suction nozzle 8 a. The recognition processing unit 93 recognizes an image of the electrode mark 64 of the measurement substrate 60 attached to the measurement unit 50 captured by the head camera 10, and recognizes the position of the electrode mark 64. When placing the electronic component D sucked by the suction nozzle 8a at the measurement position P, the measurement control unit 92 corrects the position where the electronic component D is placed based on the position of the electronic component D held by the suction nozzle 8a and the position of the electrode mark 64 recognized by the recognition processing unit 93. By performing correction based on the position of the electrode mark 64, the electrode 61 covered with the anisotropic conductive sheet 53 and not directly visible can be accurately positioned.

The measurement position determining unit 94 determines the measurement positions P1 to P9 at which the electronic component D to be measured is placed such that the number of times the electronic component D is placed at one of the plurality of measurement positions P1 to P9 is equalized, based on the number of times the electronic component D stored in the measurement information storage unit 98 is placed at each of the measurement positions P1 to P9. The component acceptance/rejection determination section 95 compares the electrical characteristics of the electronic component D measured by the measuring device 15 with the standard values of the electrical characteristics of the electronic component D stored in the component information storage section 97, and determines whether or not the electronic component D taken out from the tape feeder 5 is correct. When the electronic component D is an error, the component acceptance/rejection determination unit 95 causes the touch panel 12 to report the electronic component D error.

In fig. 17, the characteristic measurement device 16 has a detector unit 13 and a measurer 15. The probe unit 13 includes a unit control unit 39, a pressing member moving mechanism 38, a detection sensor 42, and an air valve 35. The detection sensor 42 includes a light emitting portion 42a and a light receiving portion 42 b. The unit control unit 39 controls the pressing member moving mechanism 38, the air valve 35, and the measuring device 15, and totally controls the characteristic measurement of the electronic component D in the characteristic measurement device 16.

Specifically, when the electronic component D is placed at the measurement position P on the anisotropic conductive sheet 53, the unit controller 39 controls the pressing member moving mechanism 38 so that the pressing member 37 moves to an avoidance position where the electronic component D held by the suction nozzle 8a or the like is not disturbed. When measuring the electrical characteristics of the electronic component D placed at the measurement position P, the unit control unit 39 controls the pressing member moving mechanism 38 to move the pressing member 37 upward and downward relative to the electronic component D, and applies pressure between the terminal Dt of the electronic component D and the electrode 61 via the pressing member 37. Thus, the unit controller 39 is a controller that controls the pressing member moving mechanism 38.

The unit controller 39 controls the air valve 35 to discharge compressed air from the discharge port 34, and discards the electronic component D at the measurement position P in the collection box 70. Further, when the operator mounts the recovery tank 70 to the tank holding portion 40, the unit control portion 39 determines whether or not the recovery tank 70 is mounted to the tank holding portion 40 in a normal posture based on the detection result of the detection sensor 42. When the recovery box 70 is not normally mounted, the unit control unit 39 causes the touch panel 12 of the component mounting device M1 to report that the posture of the recovery box 70 is abnormal.

In fig. 17, the measurement result based on the electrical characteristics of the measurer 15 is sent to the device control part 90 of the component mounting device M1, and the component acceptance/rejection determination part 95 determines whether or not the electronic component D supplied from the tape feeder 5 is correct. The upper computer CP may also have a component acceptance determination unit 95. In this case, the measuring device 15 may transmit the measurement result to the upper computer CP, and the upper computer CP may determine whether the electronic component D is correct or not.

As described above, the component mounting apparatuses M1 to M3 of the present embodiment include: a component supply unit 4 for supplying an electronic component D, a mounting head 8 for holding the electronic component D supplied from the component supply unit 4 and mounting the electronic component D on a substrate B, and a characteristic measurement device 16 for receiving the electronic component D held by the mounting head 8 and measuring an electrical characteristic of the electronic component D. The mounting head 8 is not limited to mounting the electronic component D at the measurement position P of the characteristic measurement device 16. For example, the electronic component D may be placed at the measurement position P by a dedicated transfer mechanism different from the mounting head 8.

Next, preparation for measurement for measuring the electrical characteristics of the electronic component D by the characteristic measurement device 16 will be described with reference to fig. 5 to 7 along the flow of fig. 18. In fig. 18, first, the anisotropic conductive sheet 53 is placed so as to cover the plurality of electrodes 61, and then the measurement substrate 60 is mounted on the substrate holding member 52(ST 1: measurement substrate mounting step) (fig. 7). Next, the measurement unit 50 having the measurement substrate 60 mounted thereon is mounted on the mounting surface 31 of the fixing portion 30, and the connection portion 50a of the measurement unit 50 is connected to the air ejection portion 33 (ST 2: measurement unit mounting step) (fig. 6).

Then, the recovery tank 70 is attached to the tank holding portion 40, and the recovery port 72 of the recovery tank 70 is fitted to the discharge port 51 of the measuring unit 50 (ST 3: recovery tank attachment step) (FIG. 5). After the recovery tank mounting step (ST3), the detection sensor 42 detects whether or not the recovery tank 70 is mounted in the tank holding portion 40 in a normal posture (ST 4: recovery tank mounting posture detection step). When the collection box 70 is not mounted in the normal posture (no in ST 4), the unit control section 39 causes the touch panel 12 to report an abnormality (ST 5: abnormality report step). The worker who recognizes the posture abnormality mounts the collection tank 70 again to the tank holding portion 40(ST 3). When the collection box 70 is mounted in the correct posture (yes in ST 4), the measurement preparation is completed.

Next, a component mounting method for mounting the electronic component D on the board B by the component mounting apparatuses M1 to M3 will be described along the flow of fig. 19. When the remaining number of electronic components D supplied from the tape feeders 5 is reduced while the component mounting operations are continued in the component mounting devices M1 to M3, the worker performs a replenishing operation of replenishing a new carrier tape to the tape feeders 5 (ST 11). The supply of the electronic components D is continued from the replenished tape feeder 5 (no in ST 12), and when the first replenished electronic component D is supplied to the component pickup position of the tape feeder 5 (yes in ST 12), a series of characteristic measurement processes of measuring the electrical characteristics of the electronic component D supplied to the component pickup position by the characteristic measurement device 16 are performed (ST 13).

When the electrical characteristics of the electronic component D are measured, the component acceptance/rejection determination section 95 compares the result of the measurement of the characteristics of the electronic component D with the standard value of the electrical characteristics of the electronic component D expected to be supplied from the tape feeder 5, and determines whether or not the supplied electronic component D is correct (ST 14: component acceptance/rejection determination step). If the supplied electronic component D is correct (yes in ST 14), the component mounting operation is restarted (ST 15). When the electronic component D that has been replenished has an error (no in ST 14), the component acceptance determination unit 95 reports the electronic component D replenished with an error to the touch panel 12 (ST 16). The worker who recognizes the replenishment error performs the replenishment work again (ST 11). This prevents an erroneous electronic component D from being mounted on the substrate B.

Next, the characteristic measurement process (ST13) (characteristic measurement method) in the component mounting apparatuses M1 to M3 will be described in detail with reference to fig. 21A to 22D along the flow of fig. 20. In fig. 20, first, the electronic component D supplied from the component supply unit 4 (the first electronic component D to be supplied) is taken out by the suction nozzle 8a of the mounting head 8(ST 21: component taking-out process). Next, the head camera 10 (camera) of the probe unit 13 (characteristic measurement device 16) is moved from above to above the measurement unit 50, the electrode mark 64 is imaged by the head camera 10, and the position of the electrode mark 64 is recognized based on the captured image (ST 22: electrode mark capturing step) (fig. 21A).

Next, the measurement position determining unit 94 determines the measurement positions P1 to P9 of the electronic component D so that the electronic component D is placed at one of the plurality of measurement positions P1 to P9 in equal number based on the size (component width W) of the electronic component D and the number of times the electronic component D is placed at each of the measurement positions P1 to P9 (ST 23: measurement position determining step). Next, the pressing member 37 is moved to an avoiding position where it does not interfere with the electronic component D held by the suction nozzle 8a of the mounting head 8(ST 24: pressing member avoiding step) (fig. 21B). Thereby, the measurement opening 52a above the measurement position P is opened. The pressing part avoiding step (ST24) may be executed in parallel with the measurement position determining step (ST 23).

In fig. 20, the electronic component D taken out through the suction nozzle 8a of the mounting head 8 is then placed at any of the plurality of measurement positions P1 to P9 determined in the measurement position determining step (ST23) (ST 25: component setting step) (fig. 21C). That is, the electronic component D is placed at any of the plurality of measurement positions P1 to P9 so that the number of times of placement at the measurement positions P1 to P9 is equalized. In the component setting step (ST25), the position where the electronic component D is placed is corrected based on the imaging result of the electrode mark 64 in the substrate mark imaging step (ST 22). Before placing the electronic component D at the measurement positions P1 to P9, the position of the electronic component D held by the suction nozzle 8a (suction position displacement) may be recognized by the component recognition camera 11, and the position where the electronic component D is placed may be corrected based on the recognition result (correction of suction position displacement).

Then, the pressing member 37 is moved from the avoidance position to above the electronic component D (fig. 22A), and the pressing member 37 is lowered to apply pressure between the terminal Dt of the electronic component D placed at the measurement position P and the plurality of electrodes 61 (ST 26: pressing step) (fig. 22B). While the pressure is applied in the pressing step (ST26), the electrical characteristics of the electronic component D are measured by the measuring instrument 15 (ST 27: characteristic measuring step).

When the characteristic measurement is completed, the number of times the electronic component D is placed at each of the measurement positions P1 to P9, which is stored in the measurement information storage 98, is updated based on the measurement positions P1 to P9 at which the electronic component D is placed (ST 28). Next, the pressing member 37 is raised (fig. 22C). Next, compressed air is ejected from the ejection port 34 of the air ejection portion 33, the electronic component D at the measurement position P is blown off and passed through the discharge passage 50b, and is discharged from the discharge port 51 together with the compressed air and discarded in the storage portion 78 of the collection box 70 (ST 29: electronic component discarding step) (fig. 22D). The compressed air may be ejected continuously or intermittently a plurality of times. This completes the series of characteristic measurement processes (ST 13).

In the characteristic measurement method shown in fig. 20, the pressing member 37 is used to press the electronic component D placed at the measurement position P during the measurement of the electrical characteristic, but the pressing method is not limited to this. For example, after the electronic component D held by the suction nozzle 8a is placed at the measurement position P (ST25), the electronic component D may be pressed downward by the suction nozzle 8a and pressurized while the electronic component D is held.

As described above, the characteristic measurement device 16 of the present embodiment includes: the pressure measuring device includes a plurality of electrodes 61 for measuring electrical characteristics of the electronic component D, and an anisotropic conductive sheet 53 covering at least a part of each of the plurality of electrodes 61, and measures the electrical characteristics of the electronic component D by applying pressure between the electronic component D and the plurality of electrodes 61 placed at any of a plurality of measurement positions P1 to P9 set on a surface of the anisotropic conductive sheet 53 opposite to the plurality of electrodes 61. This enables the electrical characteristics of the electronic component D to be measured with high accuracy.

The characteristic measurement device, the component mounting device, the characteristic measurement method, and the component mounting method according to the present disclosure have an effect of being able to stably measure the electrical characteristics of the electronic component with high accuracy, and are useful in the field of mounting the electronic component on a substrate.

Claims

1. A characteristic measurement device is provided with:

a plurality of electrodes for measuring electrical characteristics of the electronic component; and

an anisotropic conductive sheet having a 1 st surface covering at least a part of each of the plurality of electrodes and contacting the plurality of electrodes, and a 2 nd surface on a back side of the 1 st surface,

setting a plurality of measurement positions on the 2 nd surface of the anisotropic conductive sheet,

the characteristic measurement device is configured to: applying pressure between the electronic component placed at any of the plurality of measurement positions and the plurality of electrodes and measuring an electrical characteristic of the electronic component.

2. The characteristic measurement device according to claim 1,

the plurality of electrodes are 2 electrodes facing each other and having sides of the same length,

the length of the side is longer than the length of the electronic component placed at any of the plurality of measurement positions in the direction of the side,

the plurality of measurement positions are arranged along the edge.

3. The characteristic measurement device according to claim 2,

the plurality of measurement positions are set based on a length of the electronic component.

4. The characteristic measurement device according to any one of claims 1 to 3,

the characteristic measurement device further includes a pressing portion that presses the electronic component placed at any of the plurality of measurement positions against the plurality of electrodes.

5. The characteristic measurement device according to claim 4,

the pressing portion has:

a pressing member that abuts against the electronic component; and

and a pressing member moving mechanism configured to selectively move the pressing member in any one of a 1 st direction in which the electronic component faces the plurality of electrodes and a 2 nd direction opposite to the 1 st direction, and to reciprocate the pressing member along at least one axis among a plurality of axes passing through a plane intersecting the 1 st direction.

6. The characteristic measurement device according to claim 5,

the pressing member moving mechanism further includes a pressure adjusting portion that presses the electronic component toward the plurality of electrodes with a constant pressure regardless of a position at which the pressing member abuts against the electronic component.

7. The characteristic measurement device according to claim 5,

the pressing member is an insulator.

8. The characteristic measurement device according to claim 5,

the characteristic measuring device further includes a control unit that controls the pressing member moving mechanism,

the control unit controls the pressing member moving mechanism to move the pressing member to a position not interfering with the electronic component when the electronic component is placed at any of the plurality of measurement positions.

9. The characteristic measurement device according to claim 1,

the characteristic measurement device further includes a measuring instrument connected to the plurality of electrodes and measuring an electrical characteristic of the electronic component.

10. The characteristic measurement device according to claim 1,

the characteristic measuring apparatus further includes a measuring substrate provided with the plurality of electrodes,

a plurality of electrode marks for identifying the positions of the plurality of electrodes are formed on the measurement substrate.

11. A component mounting device is provided with:

the property measurement device of claim 1;

a component supply section that supplies the electronic component; and

a mounting head which holds and mounts the electronic component supplied from the component supply part to a substrate,

the characteristic measuring device receives the electronic component held by the mounting head and measures the electrical characteristic of the electronic component.

12. A characteristic measurement method for measuring an electrical characteristic of an electronic component by the characteristic measurement device according to claim 1,

the characteristic measurement method includes:

a component setting step of placing the electronic component at any position of the plurality of measurement positions;

a pressurizing step of applying pressure between the electronic component placed at any of the plurality of measurement positions and the plurality of electrodes; and

a characteristic measurement step of measuring the electrical characteristic of the electronic component while the pressure is applied in the pressurization step.

13. The characteristic measurement method according to claim 12,

in the component setting step, the electronic component is placed at any one of the plurality of measurement positions so that the number of times of placement at each of the plurality of measurement positions is equal.

14. The characteristic measurement method according to claim 12 or 13,

in the pressing step, the electronic component placed at the measurement position is pressed against the plurality of electrodes by a pressing member, and the pressure is applied between the electronic component and the plurality of electrodes.

15. A component mounting method for mounting an electronic component on a substrate by a component mounting apparatus, the component mounting apparatus comprising: the characteristic measurement device according to any one of claims 1 to 10, a component supply unit that supplies the electronic component, and a mounting head that holds and mounts the electronic component supplied from the component supply unit on a substrate, the component mounting method comprising:

a component pickup step of picking up the electronic component supplied from the component supply unit by the mounting head;

a measurement position determining step of determining a position at which the electronic component is to be placed at the plurality of measurement positions;

a component mounting step of placing the electronic component at the determined measurement position among the plurality of measurement positions;

a pressurizing step of applying pressure between the electronic component placed at the measurement position and the plurality of electrodes; and

16. The component mounting method according to claim 15,

in the measurement position determining step, the measurement positions of the electronic component are determined so that the electronic component is placed at each of the plurality of measurement positions equally.

17. The component mounting method according to claim 15,

in the pressing step, the electronic component placed at the measurement position is pressed against the plurality of electrodes by a pressing member, and the pressure is applied between the electronic component and the plurality of electrodes,

before the component mounting step, a pressing part avoiding step of moving the pressing member to a position where the pressing member does not interfere with the electronic component held by the mounting head is further included.

18. The component mounting method according to claim 15,

the component mounting device includes a camera that photographs the characteristic measurement device,

forming a plurality of electrode marks for identifying positions of the plurality of electrodes on the measurement substrate,

an electrode mark imaging step of imaging the plurality of electrode marks with the camera before the component setting step,

in the component setting step, the electronic component is placed at the measurement position based on the imaging results of the plurality of electrode marks.