CN118884076A - Component mounting device and component mounting method - Google Patents

Abstract

The present invention provides a component mounting device and a component mounting method, wherein the component mounting device comprises: a characteristic measuring device, comprising: a fixing portion; a measuring unit, which is arranged at the fixing portion, and at a measuring position where an electronic component having electrical characteristics to be measured is placed, and discharges the electronic component at the measuring position together with compressed air; a recovery box, which can be freely loaded and unloaded at the fixing portion, and recovers the discharged electronic components; and an air blowing portion, which blows out compressed air; a component supplying portion, which supplies electronic components; and a mounting head, which holds the electronic components supplied by the component supplying portion and mounts them on a substrate, after a replenishment operation of supplying new electronic components to the component supplying portion is performed, the supplied new electronic components are supplied to a component removal position of the component supplying portion, the characteristic measuring device measures the electrical characteristics of the new electronic components received from the mounting head, and the air blowing portion discharges the measured new electronic components together with compressed air and discards them into the recovery box.

Description

Component mounting device and component mounting method

This application is a divisional application of the invention patent application with the application date of October 10, 2019, application number 201910961694.8, and invention name "Characteristic measurement device and method thereof, component installation device and method thereof".

Technical Field

The present disclosure relates to a characteristic measurement device for measuring electrical characteristics of an electronic component mounted on a substrate, a component mounting device having the characteristic measurement device, a characteristic measurement method, and a component mounting method.

Background Art

As a component mounting device for mounting electronic components on a substrate, there is known a device that has a characteristic measuring device for measuring the electrical characteristics of the electronic components, and measures the electrical characteristics of the electronic components when the electronic components are replenished, etc. In the characteristic measuring device (characteristic inspection unit) described in JP Utility Model Publication No. 5-34573 (hereinafter, Patent Document 1), an anisotropic conductive sheet (anisotropic conductive rubber connector) is arranged on a measurement substrate (inspection substrate) on which electrodes are formed in a configuration shape corresponding to the configuration shape of the terminals of the electronic component to be measured. Then, the electronic components are placed on the anisotropic conductive sheet, pressure is applied to the electronic components from above, and a measuring device connected to the electrodes of the measurement substrate measures the electrical characteristics of the electronic components.

In the component mounting device described in JP Patent Publication No. 2017-27971 (hereinafter, Patent Document 2), a characteristic measuring device (inspection device) is provided on the main body of the circuit board conveying and holding device via a collection box. The inspection device holds the electronic component between the fixed part and the movable part and measures the electrical characteristics of the electronic component. Furthermore, after the measurement, the electronic component is opened and the electronic component is dropped to the lower opening by compressed air, and is further received in the collection box via an L-shaped waste passage.

In the prior art including Patent Documents 1 and 2, the position of the characteristic measurement device side that contacts the terminal of the electronic component to be measured is fixed. Therefore, during the repeated measurement of the electrical characteristics of the electronic component, the anisotropic conductive sheet and the electrode on the characteristic measurement device side deteriorate due to wear and the like, the contact resistance increases, the measurement error increases, or the measurement becomes unstable.

Summary of the invention

The present disclosure provides a characteristic measurement device, a component mounting device, a characteristic measurement method, and a component mounting method capable of measuring electrical characteristics of an electronic component with high accuracy and stability.

The characteristic measuring device disclosed in the present invention has a plurality of electrodes and an anisotropic conductive sheet for measuring the electrical characteristics of an electronic component. The anisotropic conductive sheet has a first surface and a second surface on the back side of the first surface. The first surface covers at least a portion of each of the plurality of electrodes and contacts the plurality of electrodes. A plurality of measurement positions are set on the second surface of the anisotropic conductive sheet. The characteristic measuring device applies pressure between the electronic component placed at any position of the plurality of measurement positions and the plurality of electrodes and measures the electrical characteristics of the electronic component.

The component mounting device disclosed in the present invention comprises the above-mentioned characteristic measurement device, a component supply unit for supplying electronic components, and a mounting head for holding the electronic components supplied by the component supply unit and mounting them on a substrate. The characteristic measurement device receives the electronic components held by the mounting head and measures the electrical characteristics of the electronic components.

In the characteristic measurement method disclosed herein, the electrical characteristics of an electronic component are measured by the characteristic measurement device described above. The characteristic measurement method includes: a component setting step of placing the electronic component at any position of a plurality of measurement positions, a pressurizing step of applying pressure between the electronic component placed at the measurement position and a plurality of electrodes, and a characteristic measurement step of measuring the electrical characteristics of the electronic component during the period of applying pressure in the pressurizing step.

In the component mounting method disclosed in the present invention, electronic components are mounted on a substrate by a component mounting device, and the component mounting device has the above-mentioned characteristic measurement device, a component supply unit for supplying electronic components, and a mounting head for holding the electronic components provided by the component supply unit and mounting them on the substrate. The component mounting method includes a component removal process, a measurement position determination process, a component setting process, a pressurization process, and a characteristic measurement process. In the component removal process, the electronic components provided by the component supply unit are taken out by the mounting head. In the measurement position determination process, it is determined at which of a plurality of measurement positions the electronic components are to be placed. In the component setting process, the electronic components are placed at the determined measurement positions. In the pressurization process, pressure is applied between the electronic components placed at the measurement positions and a plurality of electrodes. In the characteristic measurement process, the electrical characteristics of the electronic components are measured while pressure is applied in the pressurization process.

According to the present disclosure, it is possible to measure the electrical characteristics of electronic components with high accuracy and stability.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a diagram for explaining the structure of a component mounting system according to an embodiment of the present disclosure.

FIG. 2 is a plan view showing the structure of the component mounting device according to the embodiment of the present disclosure.

FIG. 3 is a side view of a probe unit included in the characteristic measurement device according to the embodiment of the present disclosure.

FIG. 4 is a perspective view of the detector unit shown in FIG. 3 .

FIG. 5 is an exploded perspective view of the detector unit shown in FIG. 3 .

FIG. 6 is an exploded perspective view of the probe unit showing a state in which the measurement unit is further removed from the state shown in FIG. 5 .

FIG. 7 is an exploded perspective view of the measurement unit shown in FIG. 6 .

FIG. 8A is a top view of the measurement substrate shown in FIG. 7 .

FIG. 8B is a side view of the measurement substrate shown in FIG. 7 .

FIG. 8C is a bottom view of the measurement substrate shown in FIG. 7 .

FIG. 9A is a top view of the measurement unit shown in FIG. 6 .

FIG. 9B is a side view of the measurement unit shown in FIG. 6 .

FIG. 9C is a front view of the measurement unit shown in FIG. 6 .

FIG. 9D is a rear view of the measurement unit shown in FIG. 6 .

FIG. 10A is an explanatory diagram of the function of an anisotropic conductive sheet included in the characteristic measurement apparatus according to the embodiment of the present disclosure.

10B is an explanatory diagram of the function of the anisotropic conductive sheet included in the characteristic measurement apparatus according to the embodiment of the present disclosure.

FIG. 11 is a perspective view of a recovery box included in the characteristic measurement device according to the embodiment of the present disclosure.

FIG. 12A is a top view of the recovery box shown in FIG. 11 .

FIG. 12B is a side view of the recovery box shown in FIG. 11 .

FIG. 13A is a partial cross-sectional view of the detector unit shown in FIG. 3 .

FIG. 13B is another partial cross-sectional view of the detector unit shown in FIG. 3 .

FIG. 14A is an explanatory diagram of the disposal of electronic components in the probe unit shown in FIG. 13B .

FIG. 14B is an explanatory diagram of electronic component disposal following FIG. 14A .

FIG. 14C is an explanatory diagram of electronic component disposal following FIG. 14B .

FIG. 15A is an explanatory diagram of a plurality of measurement positions set in the characteristic measurement device according to the embodiment of the present disclosure.

15B is a diagram showing the relationship between a plurality of measurement positions set in the characteristic measurement apparatus according to the embodiment of the present disclosure and the size of the electronic component.

16A is a diagram showing an example in which an electronic component to be measured is placed at a measurement position set in a characteristic measurement apparatus according to an embodiment of the present disclosure.

16B is a diagram showing another example in which an electronic component to be measured is placed at a measurement position set in the characteristic measurement apparatus according to the embodiment of the present disclosure.

FIG. 17 is a block diagram showing a configuration of a control system of the component mounting device according to the embodiment of the present disclosure.

FIG. 18 is a flowchart of measurement preparation in the characteristic measurement device according to the embodiment of the present disclosure.

FIG. 19 is a flowchart of component mounting in the component mounting device according to the embodiment of the present disclosure.

FIG. 20 is a flowchart of characteristic measurement in the component mounting device according to the embodiment of the present disclosure.

FIG. 21A is a diagram for explaining a process of measuring characteristics in the component mounting device according to the embodiment of the present disclosure.

FIG. 21B is a diagram for explaining the process of characteristic measurement following FIG. 21A .

FIG. 21C is a diagram for explaining the process of characteristic measurement following FIG. 21B .

FIG. 22A is a diagram for explaining the process of characteristic measurement following FIG. 21C .

FIG. 22B is a diagram for explaining the process of characteristic measurement following FIG. 22A .

FIG. 22C is a diagram for explaining the process of characteristic measurement following FIG. 22B .

FIG. 22D is a diagram for explaining the process of characteristic measurement following FIG. 22C .

DETAILED DESCRIPTION

Hereinafter, the embodiments of the present disclosure will be described in detail using the accompanying drawings. The structures, shapes, etc. described below are examples for illustration and can be appropriately changed according to the specifications of the component mounting system, component mounting device, and characteristic measuring device. Hereinafter, the same symbols are given to the corresponding elements in all the accompanying drawings, and repeated descriptions are omitted.

In FIG. 2 and a part described later, as two axial directions orthogonal to each other in the horizontal plane, the X direction (the direction from left to right in FIG. 2) in which the substrate is conveyed, and the Y direction (the direction from bottom to top in FIG. 2) orthogonal to the direction of conveying the substrate are shown. In FIG. 3 and a part described later, as a height direction orthogonal to the horizontal plane, the Z direction (the direction from bottom to top in FIG. 3) is shown. The Z direction is the up-down direction when the component mounting device is installed on the horizontal plane.

First, referring to FIG. 1 , the component mounting system 1 is described. The component mounting system 1 includes a component mounting device M1, a component mounting device M2, and a component mounting device M3 in order from the upstream side (left side in FIG. 1 ) in the substrate conveying direction. The component mounting devices M1 to M3 are connected to a host computer CP via a wired or wireless communication network NW, and can send and receive data with the host computer CP. The host computer CP receives the status of each device and performs overall control of the manufacturing of the mounting substrate.

The component mounting devices M1 to M3 constitute a component mounting line L that sequentially receives substrates from upstream and sequentially mounts components on the substrates to manufacture mounted substrates. The component mounting devices M1 to M3 constituting the component mounting line L do not necessarily need to be three, but may be one, two, or four or more.

Next, the structure of the component mounting devices M1 to M3 will be described with reference to FIG2 . The component mounting devices M1 to M3 are set to the same structure, and the component mounting device M1 will be described below. In FIG2 , the substrate conveying mechanism 3 is arranged in the X direction at the center of the base 2. The substrate conveying mechanism 3 conveys the substrate B brought in from the upstream side in the X direction, positions and holds it at the mounting operation position based on the mounting head described below. In addition, the substrate conveying mechanism 3 carries out the substrate B after the component mounting operation is completed to the downstream side. Component providing parts 4 are respectively arranged on both sides of the substrate conveying mechanism 3.

In the component supply section 4, a plurality of tape feeders 5 are arranged and installed in the X direction. The tape feeders 5 supply electronic components to the component removal position where the mounting head selects the electronic components by conveying the carrier tape formed with recesses for storing electronic components from the outside of the component supply section 4 to the substrate conveying mechanism 3 (the conveyor conveying direction) at intervals. If the remaining number of electronic components supplied by the tape feeder 5 is less than a specified number, an operator performs a replenishment operation of splicing a new carrier tape to the rear end of the carrier tape supplied to the tape feeder 5 and inserting a new carrier tape into the tape feeder 5.

In FIG2 , a Y-axis table 6 having a linear drive mechanism is disposed at both ends of the upper surface of the base 2 in the X direction. A beam 7 having a linear mechanism is coupled to the Y-axis table 6 so as to be freely movable in the Y direction. A mounting head 8 is mounted on the beam 7 so as to be freely movable in the X direction. At the lower end of the mounting head 8, a suction nozzle 8a (see FIG21C ) for holding electronic components is mounted so as to be freely attachable and detachable.

In Fig. 2, the Y-axis table 6 and the crossbeam 7 constitute a mounting head moving mechanism 9 that moves the mounting head 8 in the horizontal direction (X direction, Y direction). The mounting head moving mechanism 9 and the mounting head 8 vacuum adsorb and hold the electronic component provided to the component removal position of the tape feeder 5 mounted on the component supply unit 4 through the adsorption nozzle 8a, and repeatedly perform a series of cycles of component mounting operations of transferring and mounting the electronic component to the mounting position of the substrate B held by the substrate transport mechanism 3.

In FIG2 , a head camera 10 is installed on the beam 7, which is located on the lower surface side of the beam 7 and moves integrally with the mounting head 8. As the mounting head 8 moves, the head camera 10 moves above the substrate B positioned at the mounting operation position of the substrate transport mechanism 3, photographs a substrate mark (not shown) provided on the substrate B, and recognizes the position of the substrate B. In addition, the head camera 10 moves above the probe unit 13 described later, photographs an electrode mark 64 (see FIG9A ) provided so as to be visually recognized from the upper surface of the probe unit 13, and recognizes the position of the electrode mark 64.

A component recognition camera 11 is provided between the component supply unit 4 and the substrate conveying mechanism 3. When the mounting head 8 that takes out the electronic component from the component supply unit 4 moves above the component recognition camera 11, the component recognition camera 11 takes an image of the electronic component held by the mounting head 8 and recognizes the shape. In the component mounting operation of the electronic component on the substrate B by the mounting head 8, the recognition result of the substrate B by the head camera 10 and the recognition result of the electronic component by the component recognition camera 11 are further added to correct the mounting position.

In Fig. 2, a touch panel 12 operated by the operator is provided in front of the component mounting device M1 at a position where the operator performs the operation. The touch panel 12 displays various information and warning information on its display portion, and the operator inputs data and operates the component mounting device M1 using operation buttons displayed on the display portion.

In FIG2 , a probe unit 13 is provided between the component supply unit 4 and the substrate conveying mechanism 3, that is, next to the component recognition camera 11. The probe unit 13 has a plurality of electrodes electrically connected to the terminals of the electronic component. The plurality of electrodes of the probe unit 13 are connected to a measuring device 15 via a cable 14. The measuring device 15 measures electrical characteristics such as resistance, electrostatic capacitance, and inductance of the electronic component electrically connected to the electrodes of the probe unit 13. The probe unit 13 having a plurality of electrodes electrically connected to the terminals of the electronic component, the measuring device 15 for measuring the electrical characteristics of the electronic component, and the cable 14 connecting the plurality of electrodes and the measuring device 15 constitute a characteristic measuring device 16 for measuring the electrical characteristics of the electronic component.

When the type of electronic components provided by the tape feeder 5 is changed or when electronic components are replenished to the tape feeder 5, the mounting head 8 takes out the electronic components to be measured from the tape feeder 5 and hands them over to the probe unit 13, and the electrical characteristics of the electronic components are measured by the measuring device 15. The measurement results are sent to the device control unit 90 (see FIG. 17 ) or the host computer CP of the component mounting device M1, and it is determined whether the changed or replenished electronic components are correct based on the measured electrical characteristics.

Next, the structure of the detector unit 13 is described with reference to Figures 3 to 6. In Figure 3, the detector unit 13 has a fixing portion 30, a measuring unit 50, and a recovery box 70. The fixing portion 30 is provided on the base 2. The measuring unit 50 and the recovery box 70 are detachably mounted on the fixing portion 30. Figure 3 shows a side view of the detector unit 13. Figure 4 shows a state in which the measuring unit 50 and the recovery box 70 are mounted on the fixing portion 30, Figure 5 shows a state in which the recovery box 70 is removed from the fixing portion 30, and Figure 6 shows a state in which the measuring unit 50 is removed from the fixing portion 30.

The probe unit 13 is provided at a position where the operator can easily load and unload the measurement unit 50 and the collection box 70 from the outside of the component mounting devices M1 to M3. Hereinafter, the side where the operator operates the probe unit 13 is referred to as the "front side", and the side opposite to the front side is referred to as the "rear side".

In FIG6 , a mounting surface 31 to which a measuring unit 50 is detachably mounted is provided on the upper portion of the fixing portion 30. A plurality of pins 32 formed of a conductor that is biased upward by an elastic body such as a spring are arranged on the upper surface of the mounting surface 31. The upper portion of each of the pins 32 protrudes upward from the mounting surface 31. That is, the plurality of pins 32 are biased in a direction protruding from the mounting surface 31. The pins 32 are connected to the measuring device 15 via the cables 14, respectively. In this way, the plurality of pins 32 are arranged on the mounting surface 31, and constitute a plurality of fixed-side contacts connected to the measuring device 15 that measures the electrical characteristics of the electronic component.

In the fixing part 30, on the rear side of the mounting surface 31, an air ejection part 33 connected to the measuring unit 50 is arranged. In the center of the front of the air ejection part 33, a protrusion 33a protruding forward is formed. In front of the protrusion 33a, a plurality of compressed air ejection ports 34 are formed. The plurality of ejection ports 34 are arranged in the up-down direction (Z direction). That is, the air ejection part 33 has a plurality of ejection ports 34 in the up-down direction. The plurality of ejection ports 34 are connected to a compressed air source (not shown) via an air valve 35. If the air valve 35 is opened, compressed air is ejected from the plurality of ejection ports 34.

In FIG6 , a connection portion 50a that is recessed toward the front is formed at the center of the rear surface of the measuring unit 50. When the measuring unit 50 is mounted on the mounting surface 31, the operator moves the lower surface of the measuring unit 50 from the front to the rear so that the lower surface of the measuring unit 50 slides on the upper surface of the mounting surface 31 to press the measuring unit 50 toward the rear. As a result, the connection portion 50a of the measuring unit 50 is connected to the protrusion 33a of the air ejection portion 33 (see FIG5 ). In this way, the connection portion 50a connected to the air ejection portion 33 is formed in the measuring unit 50.

In FIGS. 3 to 5 , a pressing portion 36 is provided on the fixing portion 30 to press downward the electronic component placed at a measurement position (described later) set in the measurement unit 50. The pressing portion 36 includes a pressing member 37 that contacts the electronic component from above, a lifting mechanism 38a that raises and lowers the pressing member 37 in the vertical direction (Z direction) (arrow a in FIG. 4 ), and a reciprocating mechanism 38b that reciprocates the pressing member 37 in the horizontal direction (X direction) (arrow b in FIG. 4 ). The pressing member 37 is formed of an insulator such as hard plastic.

In this way, the lifting mechanism 38a and the reciprocating mechanism 38b constitute a pressing member moving mechanism 38 that lifts and lowers the pressing member 37 and reciprocates it in at least one direction (X direction) in the horizontal plane. That is, the pressing member moving mechanism 38 selectively moves the pressing member 37 in any direction of the first direction (downward direction) in which the electronic component faces the plurality of electrodes 61 and the second direction (upward direction) opposite to the first direction. Furthermore, the pressing member moving mechanism 38 reciprocates the pressing member 37 along at least one axis among the plurality of axes in the plane intersecting the first direction. The pressing member moving mechanism 38 is controlled by the unit control unit 39 (refer to FIG. 17 ) possessed by the probe unit 13. The pressing member moving mechanism 38 has a pressure adjustment unit 38c that presses the electronic component below the plurality of electrodes 61 by a certain pressure, regardless of the position (height) at which the pressing member 37 abuts against the electronic component by magnetic force or the like. The pressure adjustment unit 38 c may also be realized by measuring the pressure applied to the pressing member 37 using a pressure sensor and adjusting the descending amount of the lifting mechanism 38 a using the unit control unit 39 .

In FIG5 , a box holding portion 40 for holding a recovery box 70 is provided on the front side of the fixing portion 30. The box holding portion 40 has a pair of guide plates 41 for supporting the two side surfaces of the recovery box 70 held by the box holding portion 40 from the outside. A cutout portion 41a which is cut obliquely toward the front side is formed on the guide plates 41. In addition, a holding side inclined surface 41b is formed on the front side of the cutout portion 41a. A pair of flat-plate-shaped connecting portions 71 are provided on the two side surfaces of the recovery box 70. An insertion portion 71a which is obliquely extended to be inserted into the cutout portion 41a of the guide plate 41 is formed on the connecting portion 71. A box side inclined surface 71b is formed on the front side of the insertion portion 71a.

In the center of the front of the measuring unit 50, an exhaust port 51 through which electronic components are discharged together with compressed air is formed to protrude forward. In the upper portion of the rear of the recovery box 70, a recovery port 72 is formed to engage with the exhaust port 51 of the measuring unit 50 when the recovery box 70 is held in the box holding portion 40 (refer to FIG. 11). In the center of the lower rear portion of the box holding portion 40, a detection sensor 42 having a light emitting portion 42a for irradiating detection light and a light receiving portion 42b for receiving the detection light is provided. The detection signal of the detection sensor 42 is sent to the unit control portion 39. In the lower portion of the rear of the recovery box 70, a shielding member 73 is provided to shield the detection light of the detection sensor 42 when the recovery box 70 is held in the box holding portion 40 in a normal posture (refer to FIG. 11).

In Fig. 5, when the recovery box 70 is mounted on the box holding portion 40, the operator inserts the insertion portion 71a of the recovery box 70 into the cutout portion 41a of the box holding portion 40 so that the box side inclined surface 71b of the recovery box 70 slides from the front side obliquely upward along the holding side inclined surface 41b of the box holding portion 40. If the recovery box 70 is held on the box holding portion 40 in a normal posture, the discharge port 51 of the measurement unit 50 is engaged with the recovery port 72 of the recovery box 70, and the shielding member 73 of the recovery box 70 shields the detection light of the detection sensor 42.

Thus, the recovery box 70 has a recovery port 72 that fits with the discharge port 51 of the measurement unit 50, and box side slopes 71b that slide along the holding side slopes 41b of the box holding portion 40 are formed on both sides of the recovery box 70, so that the recovery box 70 can be freely loaded and unloaded from the fixing portion 30. In addition, the box holding portion 40 is provided on the fixing portion 30, and has a pair of guide plates 41 that support both sides of the recovery box 70 from the outside, and the holding side slopes 41b that are cut obliquely toward the side where the recovery box 70 is inserted into the box holding portion 40 are formed on the pair of guide plates 41, respectively, so that the recovery box 70 is held in a state where the recovery port 72 fits with the discharge port 51. Thus, the recovery box 70 can be loaded and unloaded from the detector unit 13 without using tools, and the operator can easily collect the electronic components D discarded in the recovery box 70 in a state where the recovery box 70 is removed from the device.

The recovery box 70 is provided with a shielding member 73 that shields the detection light if the recovery box 70 is held in the box holding portion 40 in a normal posture. In addition, the box holding portion 40 is provided with a detection sensor 42 having a light emitting portion 42a that irradiates the detection light for detecting the recovery box 70 held in a normal posture, and a light receiving portion 42b that receives the detection light. Thus, it is possible to detect whether the recovery box 70 is installed in the box holding portion 40 in a normal posture. In addition, the detection sensor 42 is not limited to an optical sensor, and may be, for example, a proximity sensor that detects the recovery box 70 by changes in magnetism or electrostatic capacitance, or a limit switch that detects contact with the recovery box 70.

In FIG3 , the recovery box 70 has a top panel 74 formed at the upper part of the recovery port 72 so as to overlap the upper part of the discharge port 51 when the recovery port 72 is engaged with the discharge port 51 of the measuring unit 50. The center of gravity G of the recovery box 70 is set at a position where the recovery port 72 side drops downward when the recovery box 70 is held in the box holding portion 40. That is, the center of gravity G of the recovery box 70 is set to a position further to the rear side than the fulcrum F of the recovery box 70 of the pair of guide plates 41 of the box holding portion 40. Thus, in the recovery box 70, a force is generated to rotate (arrow c) so that the rear side drops downward with the fulcrum F as the center. Thus, the top panel 74 is in close contact with the upper surface of the discharge port 51, which can prevent the electronic components discharged from the discharge port 51 from flying out from the recovery port 72 to the outside.

Next, the structure of the measurement unit 50 will be described with reference to FIGS. 7 to 9D. In FIG. 7, the measurement unit 50 is composed of a substrate holding member 52, an anisotropic conductive sheet 53, and a measurement substrate 60. The function of the anisotropic conductive sheet 53 will be described later. In FIGS. 8A to 8C, a plurality of (here, two) electrodes 61 electrically connected to the terminal Dt (see FIG. 10A) of the electronic component D are formed on the upper surface 60a of the measurement substrate 60. A plurality of (here, two) unit-side contacts 62 electrically connected to the plurality of pins 32 (fixed-side contacts) arranged on the mounting surface 31 of the fixing portion 30 are formed on the lower surface 60b of the measurement substrate 60. The electrodes 61 are electrically connected to the corresponding unit-side contacts 62 via the internal electrodes 63 inside.

That is, a plurality of electrodes 61 electrically connected to the electronic component D are formed on the upper surface 60a (one surface) of the measuring substrate 60, and a plurality of unit-side contacts 62 electrically connected to the plurality of electrodes 61 and the plurality of fixed-side contacts (pins 32) are formed on the lower surface 60b (the other surface different from the one surface). In FIG. 8A, two electrodes 61 are shown as the plurality of electrodes 61. A front substrate cutout 60c is formed on the front side of the measuring substrate 60, and a rear substrate cutout 60d is formed on the rear side of the measuring substrate 60. Two electrode marks 64 for identifying the positions of the plurality of electrodes 61 are formed at diagonal positions of the upper surface 60a (the surface on which the plurality of electrodes 61 are formed). A mounting hole 65 penetrating vertically is formed at a diagonal position different from the diagonal position of the measuring substrate 60 where the electrode marks 64 are formed.

In FIG7 , the measurement substrate 60 is mounted on the lower part of the substrate holding member 52 from below in a state where the anisotropic conductive sheet 53 is placed to cover the upper surface of the plurality of electrodes 61. The measurement substrate 60 is fixed to the substrate holding member 52 by screws 54 inserted into the mounting holes 65. The anisotropic conductive sheet 53 has a lower surface (first surface) and an upper surface (second surface). The lower surface covers at least a portion of the plurality of electrodes 61 and contacts the plurality of electrodes 61. The upper surface is the back side of the lower surface.

In FIG. 7 and FIG. 9A , a measurement opening 52a extending upward from the electrode 61 of the measurement substrate 60 mounted thereon is formed in the substrate holding member 52. A measurement position P is set in the measurement unit 50 where the electronic component D is placed with the anisotropic conductive sheet 53 interposed therebetween so that the terminal Dt of the electronic component D faces the plurality of electrodes 61 of the measurement substrate 60 mounted on the substrate holding member 52. That is, the measurement position P where the electronic component D whose electrical characteristics are to be measured is placed is set on the upper surface (second surface) of the anisotropic conductive sheet 53 covering the plurality of electrodes 61, and the measurement opening 52a extending to the measurement position P is formed in the substrate holding member 52.

The substrate holding member 52 is provided with an identification opening 52b that penetrates to the electrode mark 64 of the mounted measurement substrate 60. When the measurement unit 50 is viewed from above, the electrode mark 64 of the measurement substrate 60 can be seen through the identification opening 52b. On the other hand, since the anisotropic conductive sheet 53 is not transparent, the electrode 61 of the measurement substrate 60 mounted on the substrate holding member 52 cannot be seen through the measurement opening 52a. Therefore, in a state where the measurement unit 50 is mounted on the mounting surface 31 of the fixing portion 30, by photographing the electrode mark 64 from above using the head camera 10 and performing identification processing, the position of the electrode 61 that cannot be directly identified can be calculated.

In FIG. 9A and FIG. 9B , a moving groove 52c is formed on the upper part of the substrate holding member 52 so that the pressing member 37 of the pressing portion 36 can move from the measurement opening 52a to one side. When the reciprocating mechanism 38b is operated in a state where the measurement unit 50 is mounted on the mounting surface 31 of the fixing portion 30, the pressing member 37 reciprocates along the moving groove 52c from the outside of the measurement unit 50 to the top of the measurement opening 52a. A rear holding notch 52d is formed in the center of the rear of the substrate holding member 52. When the measurement substrate 60 is mounted on the substrate holding member 52, the rear holding notch 52d of the substrate holding member 52 and the rear substrate notch 60d of the measurement substrate 60 are integrated and constitute the connection portion 50a of the measurement unit 50.

The substrate holding member 52 is provided with a rear through groove 52e which passes through from the measurement opening 52a to the rear of the rear holding notch 52d. The top and side surfaces of the rear through groove 52e are formed by the substrate holding member 52 and the bottom surface is open. When the measuring substrate 60 is mounted on the substrate holding member 52, the upper surface 60a of the measuring substrate 60 becomes the bottom surface, and a through passage surrounded by the substrate holding member 52 and the measuring substrate 60 is formed. The substrate holding member 52 is provided with a front through passage 52f which passes through the substrate holding member 52 from the measurement opening 52a to the front of the discharge port 51. The front substrate notch 60c of the measuring substrate 60 is formed to be integrated with the front through passage 52f.

In FIG. 9A and FIG. 9B , in a state where the substrate holding member 52 is mounted with the substrate 60 for measurement, the rear through groove 52e, the measurement opening 52a, and the front through passage 52f constitute an exhaust passage 50b that penetrates from the rear of the connection portion 50a to the front of the exhaust port 51 via the measurement position P set at the measurement opening 52a. In a state where the measurement unit 50 is mounted on the mounting surface 31 of the fixing portion 30, the exhaust passage 50b of the measurement unit 50 flows from the connection portion 50a, and passes through the exhaust port 34 of the air ejection portion 33 through the measurement unit 50 in the horizontal direction via the measurement position P to the exhaust port 51 (see also FIG. 14A to FIG. 14C ). In addition, the exhaust passage 50b may be constituted by only the substrate holding member 52, may be constituted in combination with the substrate 60 for measurement, or may be constituted in combination with the mounting surface 31 of the fixing portion 30.

When the substrate holding member 52 is mounted with the measuring substrate 60, the unit-side contact 62 formed on the lower surface 60b of the measuring substrate 60 is exposed from the bottom of the measuring unit 50. When the measuring unit 50 is mounted on the mounting surface 31 of the fixing portion 30, the unit-side contact 62 is electrically connected to the pin 32 (fixing-side contact) arranged on the mounting surface 31. That is, the plurality of electrodes 61 formed on the upper surface 60a of the measuring substrate 60 are connected to the measuring device 15. In this way, by setting a structure that allows the measuring unit 50 to be removed from the probe unit 13, the operator can easily replace the anisotropic conductive sheet 53 and the measuring substrate 60 in the state where the measuring unit 50 is removed.

Next, the function of the anisotropic conductive sheet 53 placed so as to cover at least a portion of each of the plurality of electrodes 61 formed on the upper surface 60a of the measurement substrate 60 will be described with reference to Figs. 10A and 10B. Figs. 10A and 10B are enlarged cross-sectional views of the probe unit 13 shown in Fig. 3, including the electronic component D placed at the measurement position P, in the A-A section. In this example, the electronic component D is a chip component having two terminals Dt, such as a resistor, a capacitor, or an inductor. The electronic component D is placed at the measurement position P, where the two terminals Dt sandwich the anisotropic conductive sheet 53 and face the two electrodes 61, respectively. The anisotropic conductive sheet 53 has a characteristic that when pressure is applied, the conductivity in the direction of pressure application (pressure direction) is kept low and the conductivity in the direction other than the pressure direction is high.

FIG. 10A shows a state where the pressing member 37 of the pressing portion 36 is located above the electronic component D. In this state, no pressure is applied to the anisotropic conductive sheet 53, and the conductivity of the anisotropic conductive sheet 53 is high in all directions. FIG. 10B shows a state where the lifting mechanism 38a of the pressing portion 36 is operated to lower the pressing member 37, and the electronic component D is pressed downward by a predetermined pressure (arrow d). In this state, pressure is applied to the anisotropic conductive sheet 53 in the vertical direction from the terminal Dt of the electronic component D to the electrode 61 of the measurement substrate 60.

That is, the pressure direction in FIG10B is from top to bottom, and the resistance R of the portion sandwiched between the opposing terminal Dt and the electrode 61 in the anisotropic conductive sheet 53 becomes low (the conductivity becomes low), and a high resistance (high conductivity) is maintained between the left and right adjacent terminals Dt and between the electrodes 61. In this state, the terminal Dt of the electronic component D is electrically connected to the measuring device 15, and the electrical characteristics of the electronic component D can be measured by the measuring device 15.

In this way, the pressing section 36 presses the electronic component D placed at the measurement position P where the terminal Dt of the electronic component D faces the plurality of electrodes 61 with the anisotropic conductive sheet 53 interposed therebetween, toward the plurality of electrodes 61. Then, in the characteristic measurement device 16, the electrical characteristics of the electronic component D placed at the measurement position P are measured by the measuring instrument 15 while pressure is applied between the terminal Dt of the electronic component D and the plurality of electrodes 61. By inserting the anisotropic conductive sheet 53 between the electronic component D and the electrodes 61, even if there is a difference in the shape of the electronic component D, the terminal Dt of the electronic component D and the electrodes 61 can be stably electrically connected, and the difference in the measurement results can be reduced.

Next, the internal structure of the recovery box 70 will be described with reference to Fig. 5 and Fig. 11 to Fig. 13B. Fig. 13A is a cross-sectional view of the detector unit 13 including the recovery box 70 in the B-B section of Fig. 3, and Fig. 13B is a cross-sectional view of the detector unit 13 including the recovery box 70 in the C-C section of Fig. 4.

In FIG. 13B , if the measurement unit 50 is mounted on the mounting surface 31 of the fixing portion 30 of the probe unit 13 in a normal posture, and the recovery box 70 is further held in the box holding portion 40 in a normal posture, the rear side of the exhaust path 50b of the measurement unit 50 is connected to the air ejection portion 33, and the front side of the exhaust path 50b is connected to the recovery port 72 of the recovery box 70. That is, the probe unit 13 has: the air ejection portion 33 having the ejection port 34, the measurement area U having the measurement position P at which the electronic component D having the electrical characteristics to be measured is placed, and the recovery box 70 arranged at a position opposite to the ejection port 34 sandwiching the measurement position P. In the measurement area U, the exhaust path 50b is formed to pass through the horizontal direction from the ejection port 34 to the recovery box 70 via the measurement position P.

In Fig. 13B, in front of the recovery box 70, i.e., at a position opposite to the ejection port 34 sandwiching the measurement position P, a first exhaust port 76 having a first air filter 75 installed thereon that allows air to pass but does not pass the electronic component D is provided. Inside the recovery box 70, i.e., in front of the ejection port 34 side (the recovery port 72 side) of the first air filter 75, a component drop portion V having a drop port 77a is provided to allow the electronic component D blown away from the measurement position P by the compressed air ejected from the ejection port 34 to drop downward.

In FIG. 13A and FIG. 13B, a receiving section 78 for receiving the electronic components D falling from the drop opening 77a is provided inside the recovery box 70, that is, below the component drop section V. The component drop section V has a bottom surface 79a and two side surfaces 79b extending from the discharge path 50b, and an extended protrusion 79 is formed to extend to a position covering at least a portion of the upper side of the drop opening 77a. The component drop section V has a funnel-shaped drop wall 77 whose upper portion 77b is larger than the drop opening 77a and whose diameter decreases toward the drop opening 77a. In the component drop section V, a crescent-shaped upper opening 77c is formed between the extended protrusion 79 and the first air filter 75 (also refer to FIG. 12A). The electronic components D blown away from the measurement position P fall into the upper opening 77c from the front end of the extended protrusion 79, and are further received in the receiving section 78 via the drop opening 77a.

In FIG. 13A and FIG. 13B, a backflow prevention portion 80 is formed below the drop port 77a in the receiving portion 78, and the backflow prevention portion 80 protrudes upward toward the drop port 77a. The lower portion of the backflow prevention portion 80 is cylindrical and the upper portion is conical. In front of the recovery box 70, that is, in front of the receiving portion 78, a second exhaust port 82 is formed on which a second air filter 81 that passes air but does not pass the electronic component D is installed. In addition, the recovery box 70 can also be provided with an exhaust port on which an air filter is also installed on the side of the receiving portion 78. In this way, in the recovery box 70, exhaust ports (the first exhaust port 76 and the second exhaust port 82) on which air filters (the first air filter 75 and the second air filter 81) that pass air but do not pass the electronic component D are installed are provided.

In Figures 12A to 13B, the recovery box 70 has an upper recovery part 70a and a lower recovery part 70b. The upper recovery part 70a is connected to the exhaust path 50b. In the upper recovery part 70a, a component drop part V and a first exhaust port 76 are provided. The component drop part V has an extended protrusion 79 and a drop wall 77. The first air filter 75 is installed in the first exhaust port 76. The lower recovery part 70b has a receiving part 78. In the receiving part 78, a backflow prevention part 80 and a second exhaust port 82 are provided. In the second exhaust port 82, a second air filter 81 is installed. That is, the recovery box 70 is an upper and lower secondary structure of the upper recovery part 70a and the lower recovery part 70b, and the upper recovery part 70a and the lower recovery part 70b are connected through the drop port 77a.

Next, with reference to FIGS. 13B to 14C , an electronic component discarding process is described in which compressed air is ejected from the ejection port 34 of the air ejection portion 33 in the probe unit 13 to blow away the electronic component D at the measurement position P and discard it in the storage portion 78 of the collection box 70. As shown in FIG. 13B , first, the electronic component D is placed at the measurement position P. In FIG. 14A , if compressed air is ejected from the ejection port 34, the electronic component D blown away by the compressed air moves from the measurement area U (measurement unit 50) through the discharge path 50b and moves to the collection box 70 (arrow e).

In FIG. 14B , the electronic component D that has further passed through the extended protrusion 79 and reached the first air filter 75 falls from the upper opening 77c to the lower falling wall 77, collides with the lower falling wall 77, and moves toward the receiving portion 78 via the lower falling port 77a (arrow f). In FIG. 14C , if the ejection of the compressed air from the ejection port 34 stops, the electronic component D that has reached the receiving portion 78 stops passing through the receiving portion 78 (arrow g). In addition, the compressed air ejected from the ejection port 34 passes through the first air filter 75 and is exhausted from the first exhaust port 76, or passes through the second air filter 81 and is exhausted from the second exhaust port 82 to the outside of the recovery box 70 (FIG. 14A, FIG. 14B).

The air ejection unit 33 ejects compressed air from two (plural) ejection ports 34 disposed at the upper and lower parts, so that even electronic components D of different sizes (heights) can be reliably blown away from the measurement position P to the collection box 70. In addition, by extending the protruding portion 79 to a position covering a portion above the drop opening 77a, the discarded electronic components D can be reliably dropped from the upper opening 77c to the storage part 78. In addition, by disposing a backflow prevention portion 80 protruding upward below the drop opening 77a, the electronic components D stored in the storage part 78 can be prevented from being blown away and backflowing from the drop opening 77a to the component drop part V.

Next, the measurement position P where the electronic component D whose electrical characteristics are to be measured is placed is described with reference to FIGS. 15A to 16B. The two opposing electrodes 61 formed on the measurement substrate 60 shown in FIG. 15A have sides that are opposite to each other and have the same length. The length Q of these opposing sides (the length of the left and right sides in the figure) is longer than the component width W (the length of the electronic component) of the electronic component D placed across the two electrodes 61, and nine measurement positions P1 to P9 are set in the direction along the opposing sides of the electrodes 61 (the extension direction of the component width W). That is, the measurement positions P1 to P9 are arranged along the opposing sides of the electrodes 61. The measurement positions P1 to P9 where the electronic component D to be measured is placed are set based on the component width W of the electronic component D to be measured. In addition, in FIG. 15A, the anisotropic conductive sheet 53 that is set to cover the electrodes 61 is omitted for convenience.

FIG15B shows an example of the relationship between the component width W of the electronic component D to be measured and the measurement positions P1 to P9. Small-sized electronic components D (W≤W1) are placed at all of the 9 measurement positions P1 to P9 (FIG. 16A). Medium-sized electronic components D (W1＜W≤W2) are placed at 3 measurement positions P3, P5, and P7 (FIG. 16B). Large-sized electronic components D (W2<W≤W3) are placed at the central measurement position P5 (FIG. 15A).

Thus, the length Q of the opposing sides of the plurality of opposing electrodes 61 is longer than the component width W (the length of the electronic component in the direction of the opposing sides of the electrodes 61) of the electronic component D placed at the measurement positions P1 to P9 across the plurality of electrodes 61, and the measurement positions P1 to P9 are set in plurality based on the component width W of the electronic component D in the direction of the opposing sides of the electrodes 61. In addition, the electronic component D to be measured is placed at each of the measurement positions P1 to P9 so that the number of times it is placed is equal. By distributing the electronic component D to be measured at the plurality of measurement positions P1 to P9, it is possible to reduce damage to the anisotropic conductive sheet 53 when the electronic component D is placed, thereby suppressing degradation of the anisotropic conductive sheet 53.

Next, referring to FIG. 17 , the structure of the control system of the component mounting devices M1 to M3 will be described in detail. The component mounting devices M1 to M3 have the same structure, and here, the component mounting device M1 will be described. The device control unit 90 of the component mounting device M1 is connected to the substrate conveying mechanism 3, the component supply unit 4, the mounting head 8, the mounting head moving mechanism 9, the head camera 10, the component recognition camera 11, the touch panel 12, and the characteristic measurement device 16. The device control unit 90 has a mounting control unit 91, a measurement control unit 92, an identification processing unit 93, a measurement position determination unit 94, a component pass/fail judgment unit 95, a production data storage unit 96, a component information storage unit 97, and a measurement information storage unit 98.

The production data storage unit 96 is a storage device that stores production data including the component name (type) and mounting position (XY coordinates) of the electronic component D, which is referred to when mounting the electronic component D on the substrate B. The component information storage unit 97 is a storage device that stores, in addition to the component name, size (component width W), standard value of electrical characteristics, information for specifying the tape feeder 5 that supplies the electronic component D, and the remaining number of electronic components D, the measurement positions P1 to P9 placed when the characteristics are measured, etc. The measurement information storage unit 98 is a storage device that stores the positions (XY coordinates) of the measurement positions P1 to P9 based on the electrode mark 64 formed on the measurement substrate 60. In addition, the measurement information storage unit 98 associates the number of times the electronic component D to be measured is placed with the component name and the measurement positions P1 to P9 and stores them.

In FIG. 17 , the mounting control unit 91 controls the substrate transport mechanism 3, the component supply unit 4, the mounting head 8, the mounting head moving mechanism 9, the head camera 10, and the component recognition camera 11 to perform a component mounting operation of mounting the electronic component D on the substrate B. In addition, when the mounting control unit 91 takes out the electronic component D from the tape feeder 5, it subtracts the remaining number of the electronic components D stored in the component information storage unit 97. The measurement control unit 92 controls the component supply unit 4, the mounting head 8, the mounting head moving mechanism 9, the head camera 10, the component recognition camera 11, and the characteristic measurement device 16 to take out the electronic component D to be measured from the tape feeder 5 by the suction nozzle 8a of the mounting head 8 and place it at the measurement position P, and to perform overall control of a series of characteristic measurements in which the electrical characteristics are measured by the measuring device 15.

The recognition processing unit 93 performs recognition processing on the image of the electronic component D held by the adsorption nozzle 8a captured by the component recognition camera 11, and recognizes the position of the electronic component D held by the adsorption nozzle 8a. In addition, the recognition processing unit 93 performs recognition processing on the image of the electrode mark 64 of the measurement substrate 60 mounted on the measurement unit 50 captured by the head camera 10, and recognizes the position of the electrode mark 64. When placing the electronic component D adsorbed by the adsorption nozzle 8a at the measurement position P, the measurement control unit 92 corrects the position of the electronic component D based on the position of the electronic component D held by the adsorption nozzle 8a and the position of the electrode mark 64 recognized by the recognition processing unit 93. By performing correction based on the position of the electrode mark 64, the electrode 61 that is covered by the anisotropic conductive sheet 53 and cannot be directly seen can be correctly aligned.

The measurement position determination unit 94 determines the measurement positions P1 to P9 where the electronic component D to be measured is placed, based on the number of times the electronic component D is placed at each of the measurement positions P1 to P9 stored in the measurement information storage unit 98, so that the number of times the electronic component D is placed at one of the plurality of measurement positions P1 to P9 is equal. The component conformity determination unit 95 compares the electrical characteristics of the electronic component D measured by the measuring instrument 15 with the standard value of the electrical characteristics of the electronic component D stored in the component information storage unit 97, and determines whether the electronic component D taken out from the tape feeder 5 is correct. If the electronic component D is wrong, the component conformity determination unit 95 causes the touch panel 12 to report that the electronic component D is wrong.

In FIG17 , the characteristic measurement device 16 includes a probe unit 13 and a measuring device 15. The probe unit 13 includes a unit control unit 39, a pressing member moving mechanism 38, a detection sensor 42, and an air valve 35. The detection sensor 42 includes a light emitting unit 42a and a light receiving unit 42b. The unit control unit 39 controls the pressing member moving mechanism 38, the air valve 35, and the measuring device 15, and performs overall control of the characteristic measurement of the electronic component D in the characteristic measurement device 16.

Specifically, when the electronic component D is placed at the measurement position P on the anisotropic conductive sheet 53, the unit control section 39 controls the pressing member moving mechanism 38 so that the pressing member 37 moves to an avoidance position that does not interfere with the electronic component D held by the adsorption nozzle 8a, etc. In addition, when measuring the electrical characteristics of the electronic component D placed at the measurement position P, the unit control section 39 controls the pressing member moving mechanism 38 so that the pressing member 37 moves upward and downward of the electronic component D, and applies pressure between the terminal Dt of the electronic component D and the electrode 61 through the pressing member 37. In this way, the unit control section 39 is a control section that controls the pressing member moving mechanism 38.

In addition, the unit control unit 39 controls the air valve 35 to eject compressed air from the ejection port 34, so that the electronic component D at the measurement position P is discarded into the collection box 70. In addition, when the operator installs the collection box 70 on the box holding unit 40, the unit control unit 39 determines whether the collection box 70 is installed in the box holding unit 40 in a normal posture based on the detection result of the detection sensor 42. When the collection box 70 is not installed normally, the unit control unit 39 causes the touch panel 12 of the component mounting device M1 to report that the posture of the collection box 70 is abnormal.

In Fig. 17, the measurement result based on the electrical characteristics of the measuring instrument 15 is sent to the device control unit 90 of the component mounting device M1, and the component conformity determination unit 95 determines whether the electronic component D provided by the tape feeder 5 is correct. In addition, the host computer CP may also have the component conformity determination unit 95. In this case, the measuring instrument 15 may also send the measurement result to the host computer CP, and the host computer CP may determine whether the electronic component D is correct.

As described above, the component mounting devices M1 to M3 of the present embodiment include: the component supply section 4 that supplies the electronic component D, the mounting head 8 that holds the electronic component D supplied by the component supply section 4 and mounts it on the substrate B, and the characteristic measurement device 16 that receives the electronic component D held by the mounting head 8 and measures the electrical characteristics of the electronic component D. In addition, the electronic component D is not limited to being placed at the measurement position P of the characteristic measurement device 16 by the mounting head 8. For example, the electronic component D may be placed at the measurement position P by a dedicated transfer mechanism different from the mounting head 8.

Next, along the flow of FIG. 18 , with reference to FIGS. 5 to 7 , the measurement preparation for measuring the electrical characteristics of the electronic component D in the characteristic measurement device 16 will be described. In FIG. 18 , first, after the anisotropic conductive sheet 53 is placed to cover the plurality of electrodes 61, the measurement substrate 60 is mounted on the substrate holding member 52 (ST1: measurement substrate mounting step) ( FIG. 7 ). Next, the measurement unit 50 with the measurement substrate 60 mounted thereon is mounted on the mounting surface 31 of the fixing unit 30, and the connection portion 50a of the measurement unit 50 is connected to the air ejection portion 33 (ST2: measurement unit mounting step) ( FIG. 6 ).

Next, the recovery box 70 is installed in the box holding portion 40, and the recovery port 72 of the recovery box 70 is engaged with the discharge port 51 of the measuring unit 50 (ST3: recovery box installation process) (Figure 5). After the recovery box installation process (ST3), the detection sensor 42 is used to detect whether the recovery box 70 is installed in the box holding portion 40 in a normal posture (ST4: recovery box installation posture detection process). When the recovery box 70 is not installed in a normal posture (No in ST4), the unit control unit 39 causes the touch panel 12 to report an abnormality (ST5: abnormality reporting process). The operator who recognizes the abnormal posture installs the recovery box 70 in the box holding portion 40 again (ST3). If the recovery box 70 is installed in the correct posture (Yes in ST4), the measurement preparation is completed.

Next, a component mounting method for mounting electronic components D on the substrate B by the component mounting devices M1 to M3 will be described along the flow chart of FIG19 . While the component mounting operation is continued in the component mounting devices M1 to M3, if the remaining number of electronic components D supplied by the tape feeder 5 decreases, a replenishment operation of supplying a new carrier tape to the tape feeder 5 is performed by an operator (ST11). Supply of electronic components D continues from the supplied tape feeder 5 (NO in ST12), and if the first supplied electronic components D are supplied to the component removal position of the tape feeder 5 (YES in ST12), a series of characteristic measurement steps are performed to measure the electrical characteristics of the electronic components D supplied to the component removal position by the characteristic measurement device 16 (ST13).

If the electrical characteristics of the electronic component D are measured, the component qualification judgment unit 95 compares the characteristic measurement result of the electronic component D with the standard value of the electrical characteristics of the electronic component D expected to be provided from the tape feeder 5, and judges whether the supplied electronic component D is correct (ST14: component qualification judgment process). If the supplied electronic component D is correct (yes in ST14), the component installation operation is restarted (ST15). If the supplied electronic component D is wrong (no in ST14), the component qualification judgment unit 95 reports on the touch panel 12 that the wrong electronic component D has been supplied (ST16). The operator who realizes the supply error performs the supply operation again (ST11). In this way, the wrong electronic component D is prevented from being mounted on the substrate B.

Next, along the process of FIG. 20 , with reference to FIG. 21A to FIG. 22D , the characteristic measurement process (ST13) (characteristic measurement method) in the component mounting devices M1 to M3 is described in detail. In FIG. 20 , first, the electronic component D (the first electronic component D to be supplied) provided by the component supply unit 4 is taken out by the adsorption nozzle 8a of the mounting head 8 (ST21: component taking out process). Next, the head camera 10 (camera) that photographs the probe unit 13 (characteristic measurement device 16) from above moves to the top of the measurement unit 50, and the electrode mark 64 is photographed by the head camera 10, and the position of the electrode mark 64 is identified based on the photographed image (ST22: electrode mark photographing process) (FIG. 21A).

Next, the measurement position determination unit 94 determines the measurement positions P1 to P9 of the electronic component D based on the size of the electronic component D (component width W) and the number of times the electronic component D is placed at each measurement position P1 to P9, so that the number of times it is placed at one of the multiple measurement positions P1 to P9 is equal (ST23: measurement position determination process). Next, the pressing component 37 moves to an avoidance position (ST24: pressing portion avoidance process) that does not interfere with the electronic component D held by the adsorption nozzle 8a of the mounting head 8 (Figure 21B). As a result, the measurement opening 52a above the measurement position P is opened. In addition, the pressing portion avoidance process (ST24) can also be performed in parallel with the measurement position determination process (ST23).

In FIG. 20 , next, the electronic component D taken out by the adsorption nozzle 8a of the mounting head 8 is placed at any position of the plurality of measurement positions P1 to P9 determined in the measurement position determination step (ST23) (ST25: component setting step) (FIG. 21C). That is, the electronic component D is placed at any position of the plurality of measurement positions P1 to P9 so that the number of times the electronic component D is placed at the measurement positions P1 to P9 is equal. In the component setting step (ST25), the position where the electronic component D is placed is corrected based on the photographing result of the electrode mark 64 in the substrate mark photographing step (ST22). In addition, before the electronic component D is placed at the measurement positions P1 to P9, the position of the electronic component D held by the adsorption nozzle 8a may be recognized by the component recognition camera 11 (adsorption position deviation), and the position where the electronic component D is placed may be corrected based on the recognition result (adsorption position deviation correction).

Next, the pressing member 37 is moved from the avoidance position to the upper side of the electronic component D (FIG. 22A), and the pressing member 37 is lowered to apply pressure between the terminal Dt of the electronic component D placed at the measurement position P and the plurality of electrodes 61 (ST26: pressing step) (FIG. 22B). While the pressure is applied in the pressing step (ST26), the electrical characteristics of the electronic component D are measured by the measuring device 15 (ST27: characteristic measurement step).

If the characteristic measurement is completed, the number of times the electronic component D is placed at each measurement position P1 to P9 stored in the measurement information storage unit 98 is updated based on the measurement positions P1 to P9 where the electronic component D is placed (ST28). Next, the pressing component 37 is raised (Figure 22C). Next, compressed air is ejected from the ejection port 34 of the air ejection unit 33, the electronic component D at the measurement position P is blown away and is discharged from the exhaust port 51 through the exhaust path 50b together with the compressed air and discarded into the storage section 78 of the recovery box 70 (ST29: electronic component disposal process) (Figure 22D). In addition, the compressed air can be ejected continuously or intermittently multiple times. Thus, a series of characteristic measurement processes (ST13) are completed.

In addition, in the characteristic measurement method shown in FIG20, the electronic component D placed at the measurement position P is pressurized by the pressing member 37 during the measurement of the electrical characteristics, but the pressurization method is not limited thereto. For example, after the electronic component D held by the adsorption nozzle 8a is placed at the measurement position P (ST25), the electronic component D may be pressed downward by the adsorption nozzle 8a while the electronic component D is held.

As described above, the characteristic measurement device 16 of the present embodiment includes: a plurality of electrodes 61 for measuring the electrical characteristics of the electronic component D, and an anisotropic conductive sheet 53 covering at least a portion of each of the plurality of electrodes 61, and applies pressure between the plurality of electrodes 61 and the electronic component D placed at any of the plurality of measurement positions P1 to P9 set on the surface of the anisotropic conductive sheet 53 opposite to the plurality of electrodes 61 to measure the electrical characteristics of the electronic component D. Thus, the electrical characteristics of the electronic component D can be measured with high accuracy.

The characteristic measurement device, component mounting device, characteristic measurement method, and component mounting method disclosed herein have the effect of being able to stably measure the electrical characteristics of an electronic component with high accuracy, and are useful in the field of mounting electronic components on substrates.

Claims (7)

1. A component mounting device, comprising: The characteristic measuring device comprises: a fixing part; a measuring unit, which is arranged at the fixing part, and at a measuring position where an electronic component having an electrical characteristic to be measured is placed, and discharges the electronic component at the measuring position together with compressed air; a recovery box, which is freely attached and detached from the fixing part, and recovers the discharged electronic component; and an air ejection part, which ejects compressed air; a component supplying section that supplies electronic components; and A mounting head holds the electronic components supplied by the component supply unit and mounts them on a substrate. After the replenishment operation of the new electronic components is performed on the component supply section, the replenished new electronic components are supplied to the component removal position of the component supply section, the characteristic measurement device measures the electrical characteristics of the new electronic components received from the mounting head, and the air blower discharges the measured new electronic components together with the compressed air and discards them into the collection box. 2. The component mounting device according to claim 1, wherein: The component mounting device further comprises: a box holding portion, which is provided on the fixing portion and holds the collection box; The box holding portion includes a pair of guide plates for supporting both side surfaces of the recovery box from the outside. The pair of guide plates are respectively formed with holding side slopes that are cut obliquely toward a side where the recovery box is inserted into the box holding portion. Box side slopes that slide along the holding side slopes are respectively formed on both side surfaces of the recovery box. 3. The component mounting device according to claim 1 or 2, wherein: The box holding portion is provided with a detection sensor that detects the collection box held in a normal posture. 4. The component mounting device according to claim 3, wherein: The detection sensor comprises: a light emitting unit for emitting detection light; and a light receiving unit for receiving the detection light. The collection box is provided with a shielding member for shielding the detection light when the collection box is held in a normal posture by the box holding portion. 5. The component mounting device according to any one of claims 1 to 4, wherein: The recovery box is provided with an exhaust port on which an air filter is installed. 6. A component mounting method, comprising mounting an electronic component on a substrate using the component mounting device according to any one of claims 1 to 5, The component installation method comprises: A component taking-out step, after the component supplying section is supplied with new electronic components, the first electronic components supplied are supplied to the component taking-out position of the component supplying section, and the mounting head takes out the electronic components supplied by the component supplying section; A component setting step of placing the electronic component taken out by the mounting head at a measurement position; a characteristic measurement step of measuring electrical characteristics of the electronic component; and The electronic component discarding step is to discharge the electronic component at the measuring position together with compressed air and discard it into the collection box. 7. The component mounting method according to claim 6, wherein: The component mounting method further includes a recovery box mounting posture detection step of detecting, after the recovery box is mounted, whether the recovery box is mounted to the box holding portion in a normal posture by a detection sensor.