JP2020063909A - Characteristic measuring device, component mounting device, characteristic measuring method and component mounting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a characteristic measuring device, a component mounting device, a characteristic measuring method, and a component mounting method capable of accurately measuring an electric characteristic of an electronic component.
A characteristic measuring device includes a plurality of electrodes 61 for measuring electric characteristics of an electronic component D, and an anisotropic conductive sheet 53 that covers at least a part of the plurality of electrodes 61. Of the electrically conductive sheet 53, the electronic component D placed on any one of the plurality of measurement positions P1 to P9 set on the surface opposite to the plurality of electrodes 61 and the electronic component D while applying pressure between the plurality of electrodes 61. The electrical characteristics of are measured.
[Selection diagram] Fig. 16

Description

  The present invention relates to a characteristic measuring device that measures an electrical characteristic of an electronic component mounted on a board, a component mounting device including the characteristic measuring device, a characteristic measuring method, and a component mounting method.

  2. Description of the Related Art As a component mounting apparatus for mounting an electronic component on a board, there is known a component measuring apparatus that measures an electrical characteristic of the electronic component and that measures the electrical characteristic of the electronic component when the electronic component is replenished. (See, for example, Patent Documents 1 and 2). The characteristic measuring device (characteristic inspection unit) described in Patent Document 1 is anisotropic on a measurement substrate (inspection substrate) on which electrodes are formed in an arrangement shape corresponding to the arrangement shape of terminals of an electronic component to be measured. Conductive conductive sheet (anisotropic conductive rubber connector) is arranged. Then, the electronic component is placed on the anisotropic conductive sheet, pressure is applied to the electronic component from above, and the electrical characteristics are measured by a measuring instrument connected to the electrode of the measurement substrate.

  In the component mounting apparatus described in Patent Document 2, a characteristic measuring device (inspection device) is provided in the main body of the circuit board transport holding device via a trash can, and the inspection device places an electronic component between the stator and the mover. It grasps and measures the electrical characteristics of electronic components. After the measurement, the electronic component is released from the grip, dropped into the lower opening with compressed air, and further stored in the trash can through the L-shaped waste passage.

Japanese Utility Model Publication No. 5-34573 JP, 2017-27971, A

  However, in the conventional techniques including Patent Documents 1 and 2, since the position of the characteristic measuring device side in contact with the terminal of the electronic component to be measured is fixed, in the process of repeatedly measuring the electrical characteristic of the electronic component. There is a problem that the anisotropic conductive sheet or the electrode on the side of the characteristic measuring device is deteriorated due to abrasion and the contact resistance is increased to increase a measurement error or make the measurement unstable.

  Therefore, an object of the present invention is to provide a characteristic measuring device, a component mounting device, a characteristic measuring method, and a component mounting method capable of accurately and stably measuring the electrical characteristics of an electronic component.

  The characteristic measuring device of the present invention includes a plurality of electrodes for measuring electrical characteristics of an electronic component, and an anisotropic conductive sheet that covers at least a part of the plurality of electrodes. The electrical characteristics of the electronic component are measured while applying pressure between the electronic component placed on any of a plurality of measurement positions set on the surface opposite to the plurality of electrodes and the plurality of electrodes. To be done.

  A component mounting apparatus according to the present invention holds a characteristic measuring device according to any one of claims 1 to 10, a component supply unit for supplying an electronic component, and an electronic component supplied by the component supply unit for mounting on a substrate. And a characteristic measuring device that receives an electronic component held by the mounting head and measures an electrical characteristic of the electronic component.

  A characteristic measuring method of the present invention is a characteristic measuring method for measuring an electric characteristic of an electronic component by the characteristic measuring device according to any one of claims 1 to 10, wherein the electronic component is placed at any of a plurality of measuring positions. A component placing step of placing, a pressurizing step of applying a pressure between the electronic component placed at the measurement position and a plurality of electrodes, and an electrical operation of the electronic component while applying the pressure in the pressurizing step. Characteristic measuring step of measuring the physical characteristics.

  A component mounting method according to the present invention holds a characteristic measuring device according to any one of claims 1 to 10, a component supply unit for supplying an electronic component, and an electronic component supplied by the component supply unit for mounting on a substrate. A mounting head for mounting an electronic component on a substrate by a component mounting apparatus including: a mounting head for removing an electronic component supplied from the component supply unit by the mounting head; Measurement position determining step of determining which of the measurement positions to place, the component installation step of placing the electronic component at the determined measurement position, and between the electronic component placed at the measurement position and the plurality of electrodes. And a characteristic measuring step of measuring an electric characteristic of the electronic component while applying the pressure in the pressing step.

  According to the present invention, the electrical characteristics of an electronic component can be measured accurately and stably.

Structure explanatory drawing of the component mounting system of one embodiment of this invention The top view which shows the structure of the component mounting apparatus of one embodiment of this invention. 1 is a side view of a probe unit included in a characteristic measuring device according to an embodiment of the present invention. Structure explanatory drawing of the probe unit with which the characteristic measuring device of one embodiment of this invention is equipped. Structure explanatory drawing of the probe unit with which the characteristic measuring device of one embodiment of this invention is equipped. Structure explanatory drawing of the probe unit with which the characteristic measuring device of one embodiment of this invention is equipped. Structure explanatory drawing of the measurement unit with which the characteristic measuring device of one embodiment of this invention is equipped. (A) Plan view (b) Side view (c) Bottom view of the substrate for measurement included in the characteristic measuring device of one embodiment of the present invention (A) Plan view (b) Side view (c) Front view (d) Rear view of the measuring unit included in the characteristic measuring device of one embodiment of the present invention (A) (b) Explanatory drawing of the function of the anisotropic conductive sheet with which the characteristic measuring device of one embodiment of this invention is equipped. 1 is a perspective view of a collection box included in a characteristic measuring device according to an embodiment of the present invention. (A) Plan view (b) Side view of the collection box provided in the characteristic measuring device of one embodiment of the present invention (A) (b) Partial sectional view of a probe unit included in the characteristic measuring device according to one embodiment of the present invention. (A) (b) (c) Explanatory drawing of electronic component disposal in the probe unit with which the characteristic measuring device of one Embodiment of this invention is equipped. (A) Explanatory diagram of a plurality of measurement positions set in the characteristic measuring device according to one embodiment of the present invention (b) Diagram showing a relationship between the plurality of measurement positions and the size of an electronic component (A) (b) The figure which shows the example in which the electronic component of a measurement object was put in the measurement position set to the characteristic measuring device of one embodiment of this invention. Block diagram showing the configuration of the control system of the component mounting apparatus of one embodiment of the present invention Flowchart of measurement preparation in the characteristic measuring device according to one embodiment of the present invention Flow diagram of component mounting in the component mounting apparatus according to the embodiment of the present invention Flowchart of characteristic measurement in the component mounting apparatus according to the embodiment of the present invention (A) (b) (c) Process explanatory drawing of the characteristic measurement in the component mounting apparatus of one Embodiment of this invention. (A) (b) (c) (d) Process explanatory drawing of the characteristic measurement in the component mounting apparatus of one embodiment of this invention.

  An embodiment of the present invention will be described in detail below with reference to the drawings. The configurations, shapes, etc. described below are examples for description, and can be appropriately changed according to the specifications of the component mounting system, the component mounting apparatus, and the characteristic measuring apparatus. In the following, corresponding elements are denoted by the same reference numerals in all the drawings, and overlapping description will be omitted. In FIG. 2 and a part to be described later, as the biaxial directions orthogonal to each other in the horizontal plane, the X direction of the substrate transfer direction (left and right direction in FIG. 2) and the Y direction orthogonal to the substrate transfer direction (up and down direction in FIG. 2). Is shown. In FIG. 3 and a part described later, the Z direction (vertical direction in FIG. 3) is shown as the height direction orthogonal to the horizontal plane. The Z direction is the vertical direction when the component mounting apparatus is installed on a horizontal plane.

  First, the component mounting system 1 will be described with reference to FIG. The component mounting system 1 includes a component mounting device M1, a component mounting device M2, and a component mounting device M3 in order from the upstream side (left side in FIG. 1) in the board transport direction. The component mounting apparatuses M1 to M3 are connected to the host computer CP via a wired or wireless communication network NW, and can send and receive data to and from the host computer CP. The host computer CP receives the status of each device and controls the manufacture of the mounting board.

  The component mounting apparatuses M1 to M3 form a component mounting line L that sequentially mounts components on the substrate while transferring the substrate from the upstream side to manufacture the mounted substrate. The number of component mounting apparatuses M1 to M3 forming the component mounting line L does not have to be three, and may be one, two, four or more.

  Next, the configuration of the component mounting apparatuses M1 to M3 will be described with reference to FIG. The component mounting apparatuses M1 to M3 have the same configuration, and the component mounting apparatus M1 will be described below. In FIG. 2, the substrate transfer mechanism 3 is installed in the X direction at the center of the base 2. The board carrying mechanism 3 carries the board B carried in from the upstream side in the X direction, and positions and holds the board B at a mounting work position by a mounting head described below. In addition, the board transport mechanism 3 carries out the board B on which the component mounting work has been completed to the downstream side. A component supply unit 4 is installed on each side of the board transfer mechanism 3.

  A plurality of tape feeders 5 are mounted on the component supply unit 4 in parallel in the X direction. The tape feeder 5 pitch-feeds a carrier tape having pockets for storing electronic components in the direction from the outside of the component supply unit 4 toward the substrate transport mechanism 3 (tape feeding direction), so that the mounting head mounts the electronic components. Electronic parts are supplied to pick-up parts pick-up positions. When the remaining number of electronic components supplied by the tape feeder 5 becomes less than a predetermined number, splicing in which a new carrier tape is joined to the rear end of the carrier tape supplied to the tape feeder 5 by an operator or a new carrier tape is supplied to the tape feeder 5. The replenishment work is performed to insert.

  In FIG. 2, Y-axis tables 6 having a linear drive mechanism are arranged at both ends in the X direction on the upper surface of the base 2. A beam 7 also having a linear mechanism is coupled to the Y-axis table 6 so as to be movable in the Y direction. A mounting head 8 is mounted on the beam 7 so as to be movable in the X direction. A suction nozzle 8a (see FIG. 21) holding an electronic component is detachably attached to the lower end of the mounting head 8.

  In FIG. 2, the Y-axis table 6 and the beam 7 constitute a mounting head moving mechanism 9 that moves the mounting head 8 in the horizontal direction (X direction, Y direction). The mounting head moving mechanism 9 and the mounting head 8 hold the electronic components supplied to the component take-out position of the tape feeder 5 mounted on the component supply unit 4 by vacuum suction by the suction nozzle 8a and hold them. The series of turns of the component mounting operation of transferring to the mounting position of the board B held by the mounting and mounting is repeatedly performed.

  In FIG. 2, the beam 7 is equipped with a head camera 10 located on the lower surface side of the beam 7 and moving integrally with the mounting head 8. As the mounting head 8 moves, the head camera 10 moves above the substrate B positioned at the mounting work position of the substrate transport mechanism 3 and images a substrate mark (not shown) provided on the substrate B. And recognize the position of the substrate B. Further, the head camera 10 moves above the probe unit 13 to be described later, images the electrode mark 64 (see FIG. 9) provided so as to be visible from the upper surface of the probe unit 13, and recognizes the position of the electrode mark 64. To do.

  A component recognition camera 11 is installed between the component supply unit 4 and the board transport mechanism 3. When the mounting head 8 that picks up an electronic component from the component supply unit 4 moves above the component recognition camera 11, the component recognition camera 11 images the electronic component held by the mounting head 8 and recognizes the shape. In the component mounting work of the electronic component on the substrate B by the mounting head 8, the mounting position is corrected in consideration of the recognition result of the substrate B by the head camera 10 and the recognition result of the electronic component by the component recognition camera 11.

  In FIG. 2, a touch panel 12 operated by the worker is installed at the position where the worker works on the front surface of the component mounting apparatus M1. The touch panel 12 displays various information and warning information on its display section, and an operator inputs data and operates the component mounting apparatus M1 by using operation buttons displayed on the display section.

  In FIG. 2, a probe unit 13 is installed between the component supply unit 4 and the board transfer mechanism 3 and next to the component recognition camera 11. The probe unit 13 includes a plurality of electrodes that are electrically connected to the terminals of the electronic component. The plurality of electrodes of the probe unit 13 are connected to the measuring instrument 15 via the cable 14. The measuring instrument 15 measures electrical characteristics such as resistance, capacitance, and inductance of electronic components electrically connected to the electrodes of the probe unit 13. The probe unit 13 having a plurality of electrodes electrically connected to the terminals of the electronic component, the measuring device 15 for measuring the electrical characteristics of the electronic component, and the cable 14 connecting the plurality of electrodes and the measuring device 15 are A characteristic measuring device 16 for measuring electric characteristics is configured.

  When the type of electronic component supplied by the tape feeder 5 is changed or when the electronic component is replenished to the tape feeder 5, the mounting head 8 takes out the electronic component to be measured from the tape feeder 5 and transfers it to the probe unit 13. The measuring device 15 measures the electrical characteristics of the electronic component. The measurement result is transmitted to the device control unit 90 (see FIG. 17) included in the component mounting apparatus M1 or the host computer CP, and whether or not the electronic component changed or replenished based on the measured electrical characteristics is correct or not. To be judged.

  Next, the configuration of the probe unit 13 will be described with reference to FIGS. In FIG. 3, the probe unit 13 includes a fixed portion 30, a measurement unit 50, and a recovery box 70. The fixed portion 30 is installed on the base 2. The measurement unit 50 and the collection box 70 are detachably attached to the fixed unit 30. FIG. 3 shows a side view of the probe unit 13. 4 shows a state in which the measurement unit 50 and the collection box 70 are attached to the fixed part 30, FIG. 5 shows a state in which the collection box 70 is removed from the fixed part 30, and FIG. 6 shows a state in which the measurement unit 50 is removed from the fixed part 30. Is shown in a broken state.

  The probe unit 13 is installed at a position where an operator can easily attach and detach the measurement unit 50 and the collection box 70 from outside the component mounting apparatuses M1 to M3. Hereinafter, the side on which the worker works with respect to the probe unit 13 is referred to as “front side”, and the side opposite to the front side is referred to as “rear side”.

  In FIG. 6, a mounting surface 31 on which the measurement unit 50 is detachably mounted is installed above the fixed portion 30. On the upper surface of the mounting surface 31, there are arranged a plurality of pins 32 formed of a conductor that is biased upward by an elastic body such as a spring. The upper portion of each pin 32 projects upward from the mounting surface 31. That is, each pin 32 is urged in the direction of protruding from the mounting surface 31. Each pin 32 is connected to the measuring instrument 15 via the cable 14. In this way, the plurality of pins 32 are arranged on the mounting surface 31 and form a plurality of fixed contacts that are connected to the measuring device 15 that measures the electrical characteristics of the electronic component.

  On the rear side of the mounting surface 31 of the fixed portion 30, an air ejection portion 33 to which the measurement unit 50 is connected is arranged. At the center of the front surface of the air ejecting portion 33, a protruding portion 33a protruding forward is formed. A plurality of jets 34 of compressed air are formed on the front surface of the protrusion 33a. The plurality of ejection ports 34 are formed side by side in the vertical direction (Z direction). That is, the air ejection part 33 includes a plurality of ejection ports 34 in the vertical direction. The plurality of ejection ports 34 are connected to a compressed air source (not shown) via an air valve 35. When the air valve 35 is opened, compressed air is ejected from the ejection ports 34.

  In FIG. 6, in the center of the rear surface of the measuring unit 50, a connecting portion 50a that is recessed in the front side is formed. When the measurement unit 50 is mounted on the mounting surface 31, the worker pushes the measurement unit 50 rearward from the front side so that the lower surface of the measurement unit 50 slides on the upper surface of the mounting surface 31. As a result, the connecting portion 50a of the measuring unit 50 is connected to the protruding portion 33a of the air ejection portion 33 (see FIG. 5). As described above, the measuring unit 50 is formed with the connecting portion 50a connected to the air ejection portion 33.

  In FIGS. 3 to 5, the fixing unit 30 is provided with a pressing unit 36 that pushes downward an electronic component placed in a measurement position set in the measurement unit 50, which will be described later. The pressing portion 36 includes a pressing member 37 that comes into contact with the electronic component from above, an elevating mechanism 38a that elevates and lowers the pressing member 37 in the up-down direction (Z direction) (arrow a in FIG. 4), and the pressing member 37 in the left-right direction (X direction). And a reciprocating mechanism 38b that reciprocates in the direction (arrow b in FIG. 4). The pressing member 37 is made of an insulating material such as hard plastic.

  As described above, the elevating mechanism 38a and the reciprocating mechanism 38b constitute the pressing member moving mechanism 38 that moves the pressing member 37 up and down and reciprocates in at least one direction (X direction) within the horizontal plane. The pressing member moving mechanism 38 is controlled by a unit controller 39 (see FIG. 17) included in the probe unit 13. The pressing member moving mechanism 38 has a pressure adjusting means 38c that presses the electronic component downward with a constant pressure without depending on the position (height) at which the pressing member 37 contacts the electronic component due to magnetic force or the like. The pressure adjusting means 38c may be realized by measuring the pressure applied to the pressing member 37 with a pressure sensor and adjusting the descending amount of the elevating mechanism 38a by the unit controller 39.

  In FIG. 5, a box holding unit 40 that holds the collection box 70 is installed on the front side of the fixed unit 30. The box holding unit 40 has a pair of guide plates 41 that support both side surfaces of the collection box 70 held by the box holding unit 40 from the outside. Each guide plate 41 is formed with a notch portion 41a that is obliquely cut up toward the front side. Further, a holding-side inclined surface 41b is formed on the front side of the cutout portion 41a. A pair of flat plate-shaped connecting portions 71 are installed on both side surfaces of the collection box 70. Each connecting portion 71 is formed with an inserting portion 71a that extends obliquely so as to be inserted into the cutout portion 41a of the guide plate 41. A box-side inclined surface 71b is formed on the front side of the insertion portion 71a.

  At the center of the front surface of the measurement unit 50, a discharge port 51 through which electronic components are discharged together with compressed air is formed so as to project forward. At the upper part of the rear surface of the collection box 70, a collection port 72 is formed which is fitted to the discharge port 51 of the measurement unit 50 while the collection box 70 is held by the box holding unit 40 (see FIG. 11). A detection sensor 42 including a light emitting portion 42a that emits detection light and a light receiving portion 42b that receives the detection light is installed in the center of the lower rear portion of the box holding portion 40. The detection signal of the detection sensor 42 is transmitted to the unit controller 39. A dog 73 that blocks the detection light of the detection sensor 42 when the collection box 70 is held in the normal posture by the box holding unit 40 is installed below the rear surface of the collection box 70 (see FIG. 11).

  In FIG. 5, when the collection box 70 is attached to the box holding unit 40, the operator slides the box-side slope 71b of the collection box 70 along the holding-side slope 41b of the box holding unit 40 from diagonally above the front side. The insertion portion 71a of the collection box 70 is inserted into the notch portion 41a of the box holding portion 40. When the collection box 70 is held by the box holder 40 in a normal posture, the discharge port 51 of the measurement unit 50 is fitted into the collection port 72 of the collection box 70, and the dog 73 of the collection box 70 detects the detection light of the detection sensor 42. Shade out.

  In this way, the collection box 70 has the collection port 72 fitted to the discharge port 51 of the measurement unit 50, and the box that slides along the holding side slope 41b of the box holding unit 40 on both side surfaces of the collection box 70. Side slopes 71b are respectively formed, and are attachable to and detachable from the fixed portion 30. The box holding unit 40 is provided on the fixed unit 30 and has a pair of guide plates 41 that support both side surfaces of the collection box 70 from the outside. The pair of guide plates 41 includes the collection box 70 in the box holding unit 40. Holding-side inclined surfaces 41b are formed so as to be slanted toward the insertion side, and hold the recovery box 70 with the recovery port 72 fitted in the discharge port 51. As a result, the collection box 70 can be attached to and detached from the probe unit 13 without using a tool, and the operator can easily collect the electronic components D discarded in the collection box 70 with the collection box 70 removed from the apparatus. can do.

  The collection box 70 is provided with a dog 73 that blocks detection light when the collection box 70 is held in a normal posture by the box holding unit 40. Further, the box holding section 40 is provided with a detection sensor 42 including a light emitting section 42a for irradiating detection light for detecting the recovery box 70 held in a normal posture and a light receiving section 42b for receiving the detection light. . Thereby, it is possible to detect whether or not the collection box 70 is mounted in the box holding unit 40 in a normal posture. The detection sensor 42 is not limited to an optical sensor, and may be, for example, a proximity sensor that detects the collection box 70 due to a change in magnetism or electrostatic capacity, or a limit switch that detects that the collection box 70 is in contact. Good.

  In FIG. 3, the recovery box 70 has a ceiling plate 74, which is formed above the recovery port 72 and overlaps the upper part of the recovery port 72 in a state where the recovery port 72 is fitted to the discharge port 51 of the measurement unit 50. The center of gravity G of the collection box 70 is set at a position where the collection port 72 side is lowered downward while being held by the box holding unit 40. That is, the center of gravity G of the collection box 70 is set behind the fulcrum F of the collection box 70 on the pair of guide plates 41 of the box holding unit 40. As a result, a force is generated in the recovery box 70 so that the rear side of the recovery box 70 is lowered downward (arrow c). This makes it possible to prevent the ceiling plate 74 from coming into close contact with the upper surface of the discharge port 51 and preventing electronic components discharged from the discharge port 51 from jumping out of the recovery port 72.

  Next, the configuration of the measurement unit 50 will be described with reference to FIGS. In FIG. 7, the measuring unit 50 includes a substrate holding member 52, an anisotropic conductive sheet 53, and a measuring substrate 60. The function of the anisotropic conductive sheet 53 will be described later. In FIG. 8, a plurality of (here, two) electrodes 61 that are electrically connected to the terminals Dt (see FIG. 10) of the electronic component D are formed on the upper surface 60a of the measurement substrate 60. On the lower surface 60b of the measurement substrate 60, a plurality of (here, two) unit-side contacts 62 electrically connected to the plurality of pins 32 (fixed-side contacts) arranged on the mounting surface 31 of the fixed portion 30 are provided. Has been formed. Each electrode 61 is internally electrically connected to the corresponding unit-side contact 62 via the internal electrode 63.

  That is, the measurement substrate 60 has a plurality of electrodes 61 electrically connected to the electronic component D on the upper surface 60a (one surface) and a plurality of electrodes 61 on the lower surface 60b (another surface different from the one surface). A plurality of unit side contacts 62 that are electrically connected to the electrode 61 and the plurality of fixed side contacts (pins 32) are formed. A front substrate cutout 60c is formed on the front side of the measurement substrate 60, and a rear substrate cutout 60d is formed on the rear side of the measurement substrate 60. Two electrode marks 64 for recognizing the positions of the plurality of electrodes 61 are formed at diagonal positions on the upper surface 60a (the surface on which the plurality of electrodes 61 are formed) of the measurement substrate 60. A mounting hole 65 that penetrates vertically is formed at a diagonal position different from that on which the electrode mark 64 of the measurement substrate 60 is formed.

  In FIG. 7, the measurement substrate 60 is attached to the lower portion of the substrate holding member 52 from below with the anisotropic conductive sheet 53 placed so as to cover the upper surfaces of the plurality of electrodes 61. The measurement substrate 60 is fixed to the substrate holding member 52 with the screw 54 inserted into the mounting hole 65.

  7 and 9, the substrate holding member 52 is provided with a measurement opening 52a penetrating upward from the electrode 61 of the mounted measurement substrate 60. In the measurement unit 50, the electronic component D is placed with a plurality of electrodes 61 of the measurement substrate 60 mounted on the substrate holding member 52 sandwiching the anisotropic conductive sheet 53 so that the terminals Dt of the electronic component D face each other. The measurement position P to be measured is set. That is, the measurement position P at which the electronic component D whose electrical characteristics are measured is placed is set on the upper surface (the surface opposite to the plurality of electrodes 61) of the anisotropic conductive sheet 53 that covers the plurality of electrodes 61. The substrate holding member 52 is formed with a measurement opening 52a penetrating to the measurement position P.

  The substrate holding member 52 is formed with a recognition opening 52b that penetrates to the electrode mark 64 of the mounted measurement substrate 60. When the measurement unit 50 is viewed from above, the electrode mark 64 of the measurement substrate 60 can be seen through the recognition opening 52b. On the other hand, since the anisotropic conductive sheet 53 is opaque, the electrode 61 of the measurement substrate 60 mounted on the substrate holding member 52 cannot be seen through the measurement opening 52a. Therefore, with the measurement unit 50 mounted on the mounting surface 31 of the fixed portion 30, the head camera 10 images the electrode mark 64 from above to perform recognition processing, thereby calculating the position of the electrode 61 that cannot be directly recognized. can do.

  In FIG. 9, on the upper part of the substrate holding member 52, a moving groove 52c is formed in which the pressing member 37 of the pressing portion 36 moves from the measurement opening 52a to one side surface. When the reciprocating mechanism 38b is operated with the measuring unit 50 mounted on the mounting surface 31 of the fixed portion 30, the pressing member 37 reciprocates along the moving groove 52c from outside the measuring unit 50 to above the measuring opening 52a. To do. A rear holding notch 52d is formed in the center of the rear surface of the substrate holding member 52. When the measurement substrate 60 is mounted on the substrate holding member 52, the rear holding cutout 52d of the substrate holding member 52 and the rear substrate cutout 60d of the measurement substrate 60 are integrated to form a connection portion of the measurement unit 50. It constitutes 50a.

  The substrate holding member 52 is formed with a rear through groove 52e that penetrates from the measurement opening 52a to the rear surface of the rear holding notch 52d. The rear through-groove 52e has a ceiling and a side surface formed by the substrate holding member 52, and the floor is open. When the measurement substrate 60 is attached to the substrate holding member 52, the upper surface 60a of the measurement substrate 60 becomes the floor surface, and the substrate holding member 52 and the measurement substrate 60 form a through passage that surrounds the upper, lower, left and right sides. The substrate holding member 52 is formed with a front through passage 52f penetrating the substrate holding member 52 from the measurement opening 52a to the front surface of the discharge port 51. The front substrate cutout 60c of the measurement substrate 60 is formed so as to be integrated with the front through passage 52f.

  In FIG. 9, the rear through-groove 52e, the measurement opening 52a, and the front through-passage 52f are set in the measurement opening 52a from the rear surface of the connecting portion 50a with the measurement substrate 60 mounted on the substrate holding member 52. A discharge path 50b passing through the position P to the front surface of the discharge port 51 is formed. With the measurement unit 50 mounted on the mounting surface 31 of the fixed portion 30, the discharge passage 50b of the measurement unit 50 allows the compressed air ejected from the ejection port 34 of the air ejection portion 33 to flow from the connection portion 50a to the measurement position. The measurement unit 50 is passed in the horizontal direction to the outlet 51 via P (see also FIG. 14). The discharge path 50b may be configured only by the substrate holding member 52, may be configured in combination with the measurement substrate 60, or may be configured in combination with the mounting surface 31 of the fixed portion 30.

  With the measurement substrate 60 mounted on the substrate holding member 52, the unit-side contact 62 formed on the lower surface 60b of the measurement substrate 60 is exposed from the bottom of the measurement unit 50. When the measurement unit 50 is mounted on the mounting surface 31 of the fixed portion 30, the unit side contact 62 is electrically connected to the pin 32 (fixed side contact) arranged on the mounting surface 31. That is, the plurality of electrodes 61 formed on the upper surface 60 a of the measurement substrate 60 are in a state of being connected to the measuring instrument 15. In this way, by making the measurement unit 50 detachable from the probe unit 13, the operator can easily replace the anisotropic conductive sheet 53 or the measurement substrate 60 with the measurement unit 50 removed. You can do it.

  Next, the function of the anisotropic conductive sheet 53 placed so as to cover at least a part of the plurality of electrodes 61 formed on the upper surface 60a of the measurement substrate 60 will be described with reference to FIG. 10A and 10B are enlarged cross-sectional views including the electronic component D placed at the measurement position P in the AA cross section of the probe unit 13 shown in FIG. In this example, the electronic component D is a chip component having two terminals Dt, such as a resistor, a capacitor, and an inductor. The electronic component D is placed at the measurement position P where the two terminals Dt face the two electrodes 61 with the anisotropic conductive sheet 53 interposed therebetween. The anisotropic conductive sheet 53 has a characteristic that when pressure is applied, the conductivity in the pressure direction decreases and the conductivity in the directions other than the pressure direction remains high.

  FIG. 10A shows a state in which the pressing member 37 of the pressing portion 36 is above the electronic component D. In this state, no pressure is applied to the anisotropic conductive sheet 53, and the conductivity of the anisotropic conductive sheet 53 is high in all directions. FIG. 10B shows a state (arrow d) in which the elevating mechanism 38a of the pressing portion 36 is operated to lower the pressing member 37 and press the electronic component D downward with a predetermined pressure. In this state, pressure is applied to the anisotropic conductive sheet 53 in the vertical direction from the terminal Dt of the electronic component D toward the electrode 61 of the measurement substrate 60.

  That is, the pressure direction in FIG. 10B is the vertical direction, and the resistance R of the portion of the anisotropic conductive sheet 53 sandwiched between the opposing terminal Dt and the electrode 61 is low (the conductivity is low). , Between the terminals Dt adjacent to the left and right, and between the electrodes 61, the high resistance (high electrical conductivity) remains. In this state, the terminal Dt of the electronic component D is electrically connected to the measuring instrument 15, and the measuring instrument 15 can measure the electrical characteristics of the electronic component D.

  As described above, the pressing portion 36 causes the electronic component D placed at the measurement position P where the terminal Dt of the electronic component D faces the plurality of electrodes 61 with the anisotropic conductive sheet 53 interposed therebetween in the direction of the plurality of electrodes 61. Push. Then, in the characteristic measuring device 16, the electric characteristic of the electronic component D placed at the measurement position P is measured by the measuring instrument 15 in a state where pressure is applied between the terminal Dt of the electronic component D and the plurality of electrodes 61. . By inserting the anisotropic conductive sheet 53 between the electronic component D and the electrode 61, electrically stable between the terminal Dt of the electronic component D and the electrode 61 even if the shape of the electronic component D varies. The connection can be made, and the variation in the measurement result can be reduced.

  Next, the internal configuration of the collection box 70 will be described with reference to FIGS. 5 and 11 to 13. 13A is a cross-sectional view of the probe unit 13 including the recovery box 70 in the BB cross section of FIG. 3, and FIG. 13B is a cross sectional view of the probe unit 13 including the recovery box 70 in the CC cross section of FIG. FIG.

  In FIG. 13B, when the measurement unit 50 is mounted on the mounting surface 31 of the fixed portion 30 of the probe unit 13 in the normal posture and the collection box 70 is held in the box holding portion 40 in the normal posture, the measurement is performed. The rear side of the discharge path 50b of the unit 50 is connected to the air ejection portion 33, and the front side of the discharge path 50b is connected to the recovery port 72 of the recovery box 70. That is, the probe unit 13 sandwiches the air ejection portion 33 including the ejection port 34, the measurement area U in which the measurement position P where the electronic component D whose electrical characteristic is measured is placed, and the measurement position P are sandwiched. The recovery box 70 is disposed at a position facing the outlet 34. In the measurement area U, a discharge path 50b is formed that horizontally extends from the ejection port 34 to the collection box 70 via the measurement position P.

  In FIG. 13B, a first air filter 75 that allows air to pass therethrough but does not let the electronic component D pass is attached to the front surface of the collection box 70 at a position facing the ejection port 34 across the measurement position P. The first exhaust port 76 is installed. Inside the recovery box 70, in front of the ejection port 34 side (recovery port 72 side) of the first air filter 75, the electronic component blown away from the measurement position P by the compressed air ejected from the ejection port 34. A component drop part V having a drop port 77a for dropping D downward is installed.

  13 (a) and 13 (b), inside the collection box 70, below the component drop portion V, a storage portion 78 for storing the electronic component D dropped from the drop port 77a is installed. There is. The component drop portion V has a floor surface 79a and both side surfaces 79b extending from the discharge path 50b, and an extension portion 79 extending to a position covering at least a portion above the drop port 77a is formed. . In the component drop portion V, a funnel-shaped drop wall 77 whose upper portion 77b is larger than the drop opening 77a and whose diameter decreases toward the drop opening 77a is formed. In the component drop portion V, a crescent-shaped upper opening 77c is formed between the extending portion 79 and the first air filter 75 (see also FIG. 12A). The electronic component D blown off from the measurement position P falls from the tip of the extending portion 79 into the upper opening 77c, and is further accommodated in the accommodating portion 78 via the drop opening 77a.

  In FIGS. 13A and 13B, in the housing portion 78, a backflow preventing portion 80 that protrudes upward toward the drop opening 77a is formed below the drop opening 77a. The backflow prevention unit 80 has a cylindrical lower portion and a conical upper portion. On the front surface of the collection box 70 and the front surface of the accommodation portion 78, a second exhaust port 82, in which a second air filter 81 that allows air to pass but does not allow the electronic component D to pass, is formed. The collection box 70 may also be provided with an exhaust port having an air filter attached to the side surface of the accommodation section 78. As described above, the collection box 70 has an exhaust port (first exhaust port 76) in which the air filters (the first air filter 75 and the second air filter 81) through which the air passes but the electronic component D does not pass are attached. , A second exhaust port 82) is installed.

  In FIG. 12 and FIG. 13, the recovery box 70 is provided with a component drop part V having an extension part 79 and a drop wall 77, a first exhaust port 76 having a first air filter 75 mounted therein, and a discharge path 50b. The upper recovery part 70a is connected, and the lower recovery part 70b is provided with a backflow prevention part 80 and a storage part 78 having a second exhaust port 82 to which a second air filter 81 is attached. That is, the collection box 70 has a two-tiered configuration of an upper collection part 70a and a lower collection part 70b, and the upper collection part 70a and the lower collection part 70b are connected by a drop port 77a.

  Next, referring to FIG. 13B and FIG. 14, in the probe unit 13, compressed air is ejected from the ejection port 34 of the air ejection unit 33, and the electronic component D at the measurement position P is blown off to recover the recovery box 70. The electronic component discarding process for discarding in the housing portion 78 will be described. As shown in FIG. 13B, first, it is assumed that the electronic component D is placed at the measurement position P. In FIG. 14A, when compressed air is ejected from the ejection port 34, the electronic component D blown away by the compressed air moves from the measurement area U (measurement unit 50) to the recovery box 70 through the discharge path 50b ( Arrow e).

  In FIG. 14B, the electronic component D further reaching the front of the first air filter 75 through the extending portion 79 falls from the upper opening 77 c into the falling wall 77, collides with the falling wall 77, and falls into the falling opening. It goes to the accommodation part 78 via 77a (arrow f). In FIG. 14C, when the ejection of the compressed air from the ejection port 34 is stopped, the electronic component D that has reached the accommodation portion 78 is stopped in the accommodation portion 78 (arrow g). The compressed air ejected from the ejection port 34 is exhausted to the outside of the recovery box 70 from the first exhaust port 76 through the first air filter 75 or the second exhaust port 82 through the second air filter 81. (FIG. 14 (a), FIG. 14 (b)).

  The air ejection unit 33 ejects compressed air from the two (plural) ejection ports 34 arranged above and below, so that even electronic components D having different sizes (heights) can be reliably recovered from the measurement position P. It can be blown off toward the box 70. Further, since the extending portion 79 extends to a position that covers a portion above the dropping port 77a, the discarded electronic component D can be reliably dropped from the upper opening 77c toward the housing portion 78. . Further, by arranging the backflow preventing portion 80 that projects upward below the drop port 77a, it is possible to prevent the electronic component D already housed in the housing part 78 from blowing up and flowing back from the drop port 77a to the component drop part V. can do.

  Next, with reference to FIG. 15 and FIG. 16, the measurement position P where the electronic component D whose electrical characteristics are measured is placed will be described. The length Q (length in the left-right direction in the drawing) of the facing sides of the two facing electrodes 61 formed on the measurement substrate 60 shown in FIG. 15A is set across the two electrodes 61. It is longer than the component width W (length of the electronic component) of the cut electronic component D, and nine measurement positions P1 to P9 are set in the direction along the opposing sides of the electrode 61 (direction of the component width W). The measurement positions P1 to P9 where the electronic component D to be measured is placed are set based on the component width W of the electronic component D to be measured. In FIG. 15A, the anisotropic conductive sheet 53 installed so as to cover the electrodes 61 is omitted for convenience.

  FIG. 15B shows an example of the relationship between the component width W of the electronic component D to be measured and the measurement positions P1 to P9. The small-sized electronic component D (W ≦ W1) is placed at all of the nine measurement positions P1 to P9 (FIG. 16A). The medium-sized electronic component D (W1 <W ≦ W2) is placed at three measurement positions P3, P5, and P7 (FIG. 16B). The large-sized electronic component D (W2 <W ≦ W3) is placed at the central measurement position P5 (FIG. 15A).

  In this way, the length Q of the facing sides of the plurality of electrodes 61 facing each other is determined by the component width W of the electronic component D placed at the measurement positions P1 to P9 across the plurality of electrodes 61 (on the sides facing the electrodes). A plurality of measurement positions P1 to P9 are set based on the component width W of the electronic component D in the direction along the opposite sides of the electrode 61. Further, the electronic component D to be measured is placed at each of the measurement positions P1 to P9 so that the number of times it is placed is equal. By dispersely mounting the electronic component D to be measured at a plurality of measurement positions P1 to P9, the damage that the anisotropic conductive sheet 53 receives when mounting the electronic component D is reduced, and the anisotropic conductive sheet 53 is anisotropically conductive. The deterioration of the sheet 53 can be suppressed.

  Next, the configuration of the control system of the component mounting apparatuses M1 to M3 will be described in detail with reference to FIG. The component mounting apparatuses M1 to M3 have the same configuration, and the component mounting apparatus M1 will be described here. The device control unit 90 included in the component mounting apparatus M1 includes a board transfer mechanism 3, a component supply unit 4, a mounting head 8, a mounting head moving mechanism 9, a head camera 10, a component recognition camera 11, a touch panel 12, and a characteristic measuring device 16. It is connected. The device control unit 90 includes a mounting control unit 91, a measurement control unit 92, a recognition processing unit 93, a measurement position determination unit 94, a component acceptance / rejection determination unit 95, a production data storage unit 96, a component information storage unit 97, and a measurement information storage unit 98. Is equipped with.

  The production data storage unit 96 is a storage device, and stores production data including a component name (type) of the electronic component D referred to when the electronic component D is mounted on the board B, a mounting position (XY coordinates), and the like. The component information storage unit 97 is a storage device, and identifies the component name, size (component width W) of the electronic component D mounted on the board B, standard value of electrical characteristics, and the tape feeder 5 that supplies the electronic component D. In addition to the information and the remaining number of electronic components D, the measurement positions P1 to P9 placed when the characteristics are measured are stored. The measurement information storage unit 98 is a storage device, and stores the positions (XY coordinates) of the measurement positions P1 to P9 with the electrode mark 64 formed on the measurement substrate 60 as a base point. In addition, the measurement information storage unit 98 stores the number of times the characteristic-measured electronic component D is placed in association with the component name and the measurement positions P1 to P9.

  In FIG. 17, the mounting control unit 91 controls the substrate transport mechanism 3, the component supply unit 4, the mounting head 8, the mounting head moving mechanism 9, the head camera 10, and the component recognition camera 11 to place the electronic component D on the substrate B. Execute the component mounting work to be mounted. Further, when the electronic component D is taken out from the tape feeder 5, the mounting control unit 91 subtracts the remaining number of the electronic component D stored in the component information storage unit 97. The measurement control unit 92 controls the component supply unit 4, the mounting head 8, the mounting head moving mechanism 9, the head camera 10, the component recognition camera 11, and the characteristic measuring device 16 so that the suction nozzle 8a of the mounting head 8 from the tape feeder 5 is controlled. The electronic component D to be measured is taken out, is placed at the measurement position P, and a series of characteristic measurement for measuring the electrical characteristic by the measuring instrument 15 is integrated.

  The recognition processing unit 93 recognizes the image of the electronic component D held by the suction nozzle 8a captured by the component recognition camera 11 and recognizes the position of the electronic component D held by the suction nozzle 8a. Further, the recognition processing unit 93 recognizes the position of the electrode mark 64 by performing a recognition process on the image of the electrode mark 64 of the measurement substrate 60 mounted on the measurement unit 50 captured by the head camera 10. When placing the electronic component D sucked by the suction nozzle 8a at the measurement position P, the measurement control unit 92 determines the position of the electronic component D held by the suction nozzle 8a recognized by the recognition processing unit 93 and the position of the electrode mark 64. Based on this, the position where the electronic component D is placed is corrected. By performing correction based on the position of the electrode mark 64, it is possible to accurately align the electrode 61 covered with the anisotropic conductive sheet 53 and not directly visible.

  The measurement position determination unit 94 determines the number of times the electronic component D stored in the measurement information storage unit 98 is placed in one of the plurality of measurement positions P1 to P9, based on the number of times the electronic component D is placed in each of the measurement positions P1 to P9. The measurement positions P1 to P9 on which the electronic components D to be measured are placed are determined so that The component acceptance / rejection determination unit 95 compares the electrical characteristic of the electronic component D measured by the measuring device 15 with the standard value of the electrical characteristic of the electronic component D stored in the component information storage unit 97, and determines the tape feeder. It is determined whether the electronic component D taken out from 5 is correct. If the electronic component D is incorrect, the component acceptance / rejection determination unit 95 causes the touch panel 12 to notify that the electronic component D is incorrect.

  In FIG. 17, the characteristic measuring device 16 includes a probe unit 13 and a measuring device 15. The probe unit 13 includes a unit controller 39, a pressing member moving mechanism 38, a detection sensor 42, and an air valve 35. The detection sensor 42 includes a light emitting unit 42a and a light receiving unit 42b. The unit controller 39 controls the pressing member moving mechanism 38, the air valve 35, and the measuring instrument 15 to control the characteristic measurement of the electronic component D in the characteristic measuring device 16.

  Specifically, when the electronic component D is placed at the measurement position P on the anisotropic conductive sheet 53, the unit controller 39 causes the pressing member 37 to interfere with the electronic component D held by the suction nozzle 8a or the like. The pressing member moving mechanism 38 is controlled to move to the retracted position. When measuring the electrical characteristics of the electronic component D placed at the measurement position P, the unit controller 39 controls the pressing member moving mechanism 38 to move the pressing member 37 above the electronic component D. Then, the pressing member 37 applies pressure between the terminal Dt of the electronic component D and the electrode 61. As described above, the unit controller 39 is a controller that controls the pressing member moving mechanism 38.

  Further, the unit controller 39 controls the air valve 35 to eject the compressed air from the ejection port 34 to discard the electronic component D at the measurement position P in the recovery box 70. In addition, the unit controller 39 determines whether or not the recovery box 70 is attached to the box holder 40 in a normal posture based on the detection result of the detection sensor 42 when the operator attaches the collection box 70 to the box holder 40. To judge. When the collection box 70 is not normally mounted, the unit controller 39 causes the touch panel 12 of the component mounting apparatus M1 to notify that the collection box 70 has an abnormal posture.

  In FIG. 17, the measurement result of the electrical characteristics by the measuring device 15 is transmitted to the device control unit 90 of the component mounting device M1, and the component acceptance / rejection determination unit 95 determines whether the electronic component D supplied by the tape feeder 5 is correct. Is determined. Alternatively, the host computer CP may be provided with the component pass / fail determination unit 95, and the measuring instrument 15 may transmit the measurement result to the host computer CP so that the host computer CP determines whether the electronic component D is correct.

  As described above, the component mounting apparatuses M1 to M3 according to the present embodiment mount the component supply unit 4 for supplying the electronic component D and the electronic component D supplied by the component supply unit 4 on the board B while holding them. The head 8 and the characteristic measuring device 16 that receives the electronic component D held by the mounting head 8 and measures the electrical characteristic of the electronic component D are provided. It should be noted that what mounts the electronic component D on the measurement position P of the characteristic measuring device 16 is not limited to the mounting head 8. For example, the electronic component D may be placed at the measurement position P by a dedicated transfer means different from the mounting head 8.

  Next, along with the flow of FIG. 18, with reference to FIGS. 5 to 7, the preparation for measurement for measuring the electrical characteristics of the electronic component D in the characteristic measuring device 16 will be described. In FIG. 18, first, the anisotropic conductive sheet 53 is placed so as to cover the plurality of electrodes 61, and then the measurement substrate 60 is attached to the substrate holding member 52 (ST1: measurement substrate attachment step) ( (Fig. 7). Next, the measurement unit 50 to which the measurement substrate 60 is attached is attached to the attachment surface 31 of the fixed portion 30, and the connection portion 50a of the measurement unit 50 is connected to the air ejection portion 33 (ST2: measurement unit attachment step) (FIG. 6).

  Next, the collection box 70 is mounted on the box holding unit 40, and the collection port 72 of the collection box 70 is fitted to the discharge port 51 of the measurement unit 50 (ST3: collection box mounting step) (FIG. 5). After the collection box mounting step (ST3), the detection sensor 42 detects whether or not the collection box 70 is mounted on the box holding unit 40 in a normal posture (ST4: collection box mounting posture detection step). When the collection box 70 is not mounted in a normal posture (No in ST4), the unit controller 39 causes the touch panel 12 to report an abnormality (ST5: abnormality notification step). The worker who recognizes the posture abnormality reattaches the collection box 70 to the box holding unit 40 (ST3). When the collection box 70 is mounted in the correct posture (Yes in ST4), the measurement preparation is completed.

  Next, a component mounting method for mounting the electronic component D on the board B by the component mounting apparatuses M1 to M3 will be described along the flow of FIG. When the remaining number of electronic components D supplied by the tape feeder 5 decreases while the component mounting work is continued in the component mounting apparatuses M1 to M3, the worker replenishes the tape feeder 5 with a new carrier tape. Is performed (ST11). When the supply of the electronic component D from the replenished tape feeder 5 is continued (No in ST12) and the first replenished electronic component D is supplied to the component take-out position of the tape feeder 5 (Yes in ST12), the component A series of characteristic measuring steps (ST13) in which the characteristic measuring device 16 measures the electrical characteristics of the electronic component D supplied to the take-out position is executed.

  When the electrical characteristics of the electronic component D are measured, the component pass / fail determination unit 95 causes the characteristic measurement result of the electronic component D and the standard value of the electrical characteristics of the electronic component D expected to be supplied from the tape feeder 5. To determine whether the supplied electronic component D is correct (ST14: component pass / fail determination step). When the supplied electronic component D is correct (Yes in ST14), the component mounting work is restarted (ST15). If the supplied electronic component D is incorrect (No in ST14), the component acceptance / rejection determination unit 95 notifies the touch panel 12 that a different electronic component D is supplied (ST16). The worker who recognizes the supply error performs the supply operation again (ST11). This prevents the wrong electronic component D from being mounted on the board B.

  Next, the details of the characteristic measuring step (ST13) (characteristic measuring method) in the component mounting apparatuses M1 to M3 will be described with reference to FIGS. 21 and 22 along the flow of FIG. In FIG. 20, first, the electronic component D supplied by the component supply unit 4 (the first electronic component D that has been replenished) is taken out by the suction nozzle 8a of the mounting head 8 (ST21: component taking-out step). Next, the head camera 10 (camera) that images the probe unit 13 (characteristic measuring device 16) from above moves to above the measurement unit 50, the head camera 10 takes an image of the electrode mark 64, and the electrode mark 64 is obtained based on the taken image. Is recognized (ST22: electrode mark imaging step) (FIG. 21A).

  Next, the measurement position determination unit 94 determines one of the plurality of measurement positions P1 to P9 based on the size of the electronic component D (component width W) and the number of times the electronic component D is placed at each measurement position P1 to P9. The measurement positions P1 to P9 of the electronic component D are determined so that the number of times of placement is equal (ST23: measurement position determination step). Next, the pressing member 37 moves to a retracted position where it does not interfere with the electronic component D held by the suction nozzle 8a of the mounting head 8 (ST24: pressing portion retracting step) (FIG. 21 (b)). As a result, the measurement opening 52a above the measurement position P is opened. The pressing portion retracting step (ST24) may be executed in parallel with the measurement position determining step (ST23).

  In FIG. 20, next, the electronic component D taken out by the suction nozzle 8a of the mounting head 8 is placed at any of the plurality of measurement positions P1 to P9 determined in the measurement position determination step (ST23) (ST25: component installation step). ) (FIG. 21 (c)). That is, the electronic component D is placed at any of the plurality of measurement positions P1 to P9 so that the number of times it is placed at the measurement positions P1 to P9 becomes equal. In the component installation step (ST25), the position where the electronic component D is placed is corrected based on the imaging result of the electrode mark 64 in the board mark imaging step (ST22). Before placing the electronic component D at the measurement positions P1 to P9, the component recognition camera 11 recognizes the position of the electronic component D held by the suction nozzle 8a (suction position shift), and places the electronic component D based on the recognition result. The position may be corrected (correction of the suction position shift).

  Next, the pressing member 37 is moved from the retracted position to a position above the electronic component D (FIG. 22A), and the pressing member 37 is lowered so that the terminal Dt of the electronic component D placed at the measurement position P and the plurality of electrodes 61. Pressure is applied between them (ST26: pressurizing step) (FIG. 22 (b)). While the pressure is being applied in the pressurizing step (ST26), the electrical characteristics of the electronic component D are measured by the measuring instrument 15 (ST27: characteristic measuring step).

  When the characteristic measurement is completed, the number of times the electronic component D stored in the measurement information storage unit 98 is placed at each measurement position P1 to P9 is updated based on the measurement positions P1 to P9 where the electronic component D is placed. (ST28). Next, the pressing member 37 is raised (FIG. 22 (c)). Next, compressed air is ejected from the ejection port 34 of the air ejection unit 33 to blow off the electronic component D at the measurement position P, and the compressed air is ejected from the ejection port 51 together with the compressed air through the ejection passage 50b to be discarded in the accommodation unit 78 of the recovery box 70. (ST29: Electronic component disposal process) (FIG. 22 (d)). The compressed air may be ejected continuously or intermittently a plurality of times. As a result, a series of characteristic measuring steps (ST13) is completed.

  In the characteristic measuring method shown in FIG. 20, the electronic component D placed at the measuring position P is pressed by the pressing member 37 during the measurement of the electric characteristic, but the pressing method is not limited to this. There is no. For example, after the electronic component D held by the suction nozzle 8a is placed at the measurement position P (ST25), while the electronic component D is being held, the suction nozzle 8a pushes the electronic component D downward while pressing the electronic component D. You may make it press.

  As described above, the characteristic measuring device 16 of the present embodiment includes the plurality of electrodes 61 for measuring the electrical characteristics of the electronic component D and the anisotropic conductive sheet that covers at least a part of the plurality of electrodes 61. 53, and between the plurality of electrodes 61 and the electronic component D placed at any of the plurality of measurement positions P1 to P9 set on the surface of the anisotropic conductive sheet 53 opposite to the plurality of electrodes 61. The electrical characteristics of the electronic component D are measured while applying pressure to the. As a result, the electrical characteristics of the electronic component D can be accurately measured.

  The characteristic measuring device, the component mounting apparatus, the characteristic measuring method, and the component mounting method of the present invention have the effect that the electrical characteristics of an electronic component can be accurately and stably measured, and the electronic component is mounted on the substrate. It is useful in the field.

4 Component Supply Section 8 Mounting Head 10 Head Camera (Camera)
15 Measuring instrument 16 Characteristic measuring device 36 Pressing part 37 Pressing member 38 Pressing member moving mechanism 38c Pressure adjusting means 53 Anisotropic conductive sheet 60 Measurement substrate 60a Upper surface 61 Electrode 64 Electrode mark B Substrate D Electronic component M1-M3 Component mounting device P, P1 to P9 Measurement position Q Side length W Component width (length of electronic component)

Claims (18)

A plurality of electrodes for measuring the electrical characteristics of electronic components,
An anisotropic conductive sheet covering at least a part of the plurality of electrodes,
The electronic component while applying pressure between the plurality of electrodes and the electronic component placed at any of a plurality of measurement positions set on the surface of the anisotropic conductive sheet opposite to the plurality of electrodes. A characteristic measuring device for measuring the electrical characteristics of the. The length of the opposite sides of the plurality of electrodes is longer than the length in the direction along the sides of the electronic component placed at the measurement position,
The characteristic measurement device according to claim 1, wherein a plurality of measurement positions are set in a direction along the side.   The characteristic measurement device according to claim 2, wherein the plurality of measurement positions are set based on a length of the electronic component.   The characteristic measuring device according to claim 1, further comprising a pressing unit that presses the electronic component placed at the measurement position toward the plurality of electrodes. The pressing portion is
A pressing member that abuts the electronic component,
5. The characteristic measuring device according to claim 4, further comprising a pressing member moving mechanism that moves the pressing member up and down and reciprocates in at least one direction within a horizontal plane. The pressing member moving mechanism,
The characteristic measuring device according to claim 5, further comprising a pressure adjusting unit that presses the electronic component toward the plurality of electrodes with a constant pressure without depending on a position where the pressing member contacts the electronic component. apparatus.   The characteristic measuring device according to claim 5, wherein the pressing member is an insulator. Further comprising a control unit for controlling the pressing member moving mechanism,
8. The control unit controls the pressing member moving mechanism so that the pressing member moves to a position where the pressing member does not interfere with the electronic component when the electronic component is placed at the measurement position. The characteristic measuring device described in Crab.   9. The characteristic measuring device according to claim 1, further comprising a measuring instrument that is connected to the plurality of electrodes and that measures an electrical characteristic of the electronic component. The plurality of electrodes are formed on the measurement substrate,
The characteristic measuring device according to claim 1, wherein an electrode mark for recognizing the positions of the plurality of electrodes is formed on the measurement substrate. A characteristic measuring device according to any one of claims 1 to 10,
A component supply unit for supplying electronic components,
A mounting head that holds an electronic component supplied by the component supply unit and mounts the electronic component on a substrate;
The characteristic measuring device is a component mounting device that receives an electronic component held by the mounting head and measures an electrical characteristic of the electronic component. A characteristic measuring method for measuring an electric characteristic of an electronic component by the characteristic measuring device according to claim 1.
A component installation process in which electronic components are placed at any of a plurality of measurement positions,
A pressurizing step of applying a pressure between the plurality of electrodes and the electronic component placed at the measurement position,
A characteristic measuring step of measuring an electric characteristic of the electronic component while applying the pressure in the pressurizing step.   13. The electronic component according to claim 12, wherein in the component installation step, the electronic component is placed at one of the plurality of measurement positions so that the number of times of placement at one of the plurality of measurement positions is equalized. Characteristic measurement method.   The pressurizing step presses the electronic component placed at the measurement position in the direction of the plurality of electrodes by a pressing member to apply pressure between the electronic component and the plurality of electrodes. Characteristics measurement method. A component comprising: the characteristic measuring device according to claim 1; a component supply unit that supplies an electronic component; and a mounting head that holds an electronic component supplied by the component supply unit and mounts the electronic component on a substrate. A component mounting method for mounting electronic components on a board by a mounting device,
A component take-out step of taking out an electronic component supplied by the component supply section by the mounting head;
A measurement position determining step of determining which of a plurality of measurement positions the electronic component is placed,
A component installation step of placing the electronic component at the determined measurement position,
A pressurizing step of applying a pressure between the plurality of electrodes and the electronic component placed at the measurement position,
And a characteristic measuring step of measuring electric characteristics of the electronic component while applying the pressure in the pressurizing step.   16. The component mounting method according to claim 15, wherein in the measurement position determining step, the measurement position of the electronic component is determined so that the number of times the electronic component is placed at one of the plurality of measurement positions becomes equal.   17. The component mounting method according to claim 15, further comprising a pressing portion retracting step of moving the pressing member to a position that does not interfere with the electronic component held by the mounting head before the component installation step. The component mounting device includes a camera for capturing an image of the characteristic measuring device,
Prior to the component installation step, an electrode mark imaging step of imaging an electrode mark with the camera is further included.
The component mounting method according to any one of claims 15 to 17, wherein, in the component installation step, the electronic component is placed at the measurement position based on an imaging result of the electrode mark.

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