CN110057478B - Resistance type high-sensitivity flexible pressure sensing device - Google Patents
Resistance type high-sensitivity flexible pressure sensing device Download PDFInfo
- Publication number
- CN110057478B CN110057478B CN201910409890.4A CN201910409890A CN110057478B CN 110057478 B CN110057478 B CN 110057478B CN 201910409890 A CN201910409890 A CN 201910409890A CN 110057478 B CN110057478 B CN 110057478B
- Authority
- CN
- China
- Prior art keywords
- pressure
- sensitive layer
- outer ring
- electrode
- electrode circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 claims abstract description 49
- 230000035945 sensitivity Effects 0.000 claims abstract description 20
- 239000011345 viscous material Substances 0.000 claims abstract description 7
- 239000000463 material Substances 0.000 claims description 32
- 239000004020 conductor Substances 0.000 claims description 16
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 11
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 8
- 239000004800 polyvinyl chloride Substances 0.000 claims description 8
- 238000002156 mixing Methods 0.000 claims description 7
- 239000002861 polymer material Substances 0.000 claims description 7
- -1 polypropylene Polymers 0.000 claims description 7
- 239000004743 Polypropylene Substances 0.000 claims description 6
- 229920006267 polyester film Polymers 0.000 claims description 6
- 229920001721 polyimide Polymers 0.000 claims description 6
- 229920001155 polypropylene Polymers 0.000 claims description 6
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 5
- 239000002041 carbon nanotube Substances 0.000 claims description 5
- 230000000694 effects Effects 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 3
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 3
- 239000004917 carbon fiber Substances 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229910021389 graphene Inorganic materials 0.000 claims description 3
- 229920001568 phenolic resin Polymers 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 229920005749 polyurethane resin Polymers 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 2
- 239000005007 epoxy-phenolic resin Substances 0.000 claims description 2
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 239000010703 silicon Substances 0.000 claims description 2
- 230000008859 change Effects 0.000 abstract description 15
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000012360 testing method Methods 0.000 description 12
- 238000007639 printing Methods 0.000 description 11
- 230000006872 improvement Effects 0.000 description 9
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 239000003795 chemical substances by application Substances 0.000 description 8
- 239000011259 mixed solution Substances 0.000 description 8
- 229920000139 polyethylene terephthalate Polymers 0.000 description 6
- 239000005020 polyethylene terephthalate Substances 0.000 description 6
- 238000004806 packaging method and process Methods 0.000 description 5
- 238000003825 pressing Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000003085 diluting agent Substances 0.000 description 4
- 238000009775 high-speed stirring Methods 0.000 description 4
- 239000004925 Acrylic resin Substances 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- HJOVHMDZYOCNQW-UHFFFAOYSA-N isophorone Chemical compound CC1=CC(=O)CC(C)(C)C1 HJOVHMDZYOCNQW-UHFFFAOYSA-N 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000010615 ring circuit Methods 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
- G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
- G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
- G01L1/2287—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges constructional details of the strain gauges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/02—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning
- G01L9/04—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning of resistance-strain gauges
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Thermistors And Varistors (AREA)
- Force Measurement Appropriate To Specific Purposes (AREA)
Abstract
The invention provides a resistance type high-sensitivity flexible pressure sensing device which comprises a first flexible film substrate, a pressure sensitive layer, an annular electrode layer and a second flexible film substrate which are arranged in a laminated mode, wherein the pressure sensitive layer is located between the first flexible film substrate and the annular electrode layer, the annular electrode layer is located between the pressure sensitive layer and the second flexible film substrate, the annular electrode layer comprises an annular electrode and an electrode leading-out end, the annular electrode is connected with the electrode leading-out end, the first flexible film substrate and the second flexible film substrate are packaged through a viscous material, the pressure sensitive layer comprises an outer ring pressure sensitive layer and an inner ring pressure sensitive layer which are located on the same plane, the diameter of the outer ring pressure sensitive layer is larger than that of the inner ring pressure sensitive layer, and the surface resistance of the inner ring pressure sensitive layer is larger than that of the outer ring pressure sensitive layer. The invention has the beneficial effects that: has higher sensitivity and no sudden change of a measuring range output curve.
Description
Technical Field
The invention relates to a sensing device, in particular to a resistance type high-sensitivity flexible pressure sensing device.
Background
The flexible electronic device is a novel electronic technology for manufacturing organic and/or inorganic electronic devices on a flexible or extensible substrate, and compared with traditional electronics, the flexible electronics can deform to a certain degree to meet the requirements of special working environments and have certain flexibility. The sensor is a device capable of converting a measured signal into an electric signal according to a certain rule and outputting the electric signal, and is widely applied to the fields of spaceflight, ships, medical treatment, military and the like, while the flexible sensor can keep the basic performance of the sensor, and meanwhile, the device can keep flexibility in a certain range. With the arrival of a new technical revolution and the beginning of the world entering the information era, the high-sensitivity flexible pressure sensor can be used as a consumer electronics, and can acquire and record pressure signals in real time to realize human-computer interaction.
Most of the existing flexible film pressure sensors output corresponding measurable resistance based on the contact degree of the interdigital electrodes and the pressure sensitive layer under the action of external force, so that the sensing function is realized. Two problems with this type of sensor:
firstly, the sensitivity and the range regulation are difficult to be compatible: the sensitivity of the sensor is improved by reducing the surface resistance of the pressure sensitive layer, so that the limit output resistance is reduced, and the effective range is too small; conversely, the surface resistance of the pressure sensitive layer is increased, so that the measuring range of the sensor can be increased, but the measuring sensitivity is greatly sacrificed.
In a plurality of application scenes, the stress load of the sensor is diffused from the center to the periphery, and the traditional interdigital pattern electrode has small electrode distance (or large electrode density) at the central part, namely, the central area electrode is contacted with the pressure-sensitive material under slight pressing, so that the output resistance is sharply reduced, and the problem of sudden change of the output is caused.
Therefore, how to obtain a flexible pressure sensor with high sensitivity and no abrupt change in the range output curve is a technical difficulty to be solved urgently at present.
Disclosure of Invention
In order to solve the problems in the prior art, the invention provides a resistance type high-sensitivity flexible pressure sensing device.
The invention provides a resistance type high-sensitivity flexible pressure sensing device which comprises a first flexible film substrate, a pressure sensitive layer, an annular electrode layer and a second flexible film substrate which are arranged in a laminated mode, wherein the pressure sensitive layer is located between the first flexible film substrate and the annular electrode layer, the annular electrode layer is located between the pressure sensitive layer and the second flexible film substrate, the annular electrode layer comprises an annular electrode and an electrode leading-out end, the annular electrode is connected with the electrode leading-out end, the first flexible film substrate and the second flexible film substrate are packaged through a viscous material, the pressure sensitive layer comprises an outer ring pressure sensitive layer and an inner ring pressure sensitive layer which are located on the same plane, the diameter of the outer ring pressure sensitive layer is larger than that of the inner ring pressure sensitive layer, and the surface resistance of the inner ring pressure sensitive layer is larger than that of the outer ring pressure sensitive layer.
As a further improvement of the present invention, the pressure sensitive layer is printed on a surface of the first flexible film substrate, and the annular electrode layer is printed on a surface of the second flexible film substrate.
As a further improvement of the invention, the outer ring pressure sensitive layer and the inner ring pressure sensitive layer are combined to form a complete circle, and a gap is arranged between the pressure sensitive layer and the annular electrode.
As a further improvement of the invention, the pressure-sensitive layer is made of a material with pressure-sensitive effect which deforms synchronously with the first flexible film substrate, and the pressure-sensitive layer is mainly formed by mixing a high polymer material and a conductive material.
As a further improvement of the invention, the doping concentration range of the conductive material of the inner circle pressure-sensitive layer in the pressure-sensitive layer is 2-4wt%, and the doping concentration range of the conductive material of the outer circle pressure-sensitive layer in the pressure-sensitive layer is 4-7.5 wt%.
As a further improvement of the invention, the high molecular material of the pressure-sensitive layer is any one of chlorinated propylene resin, polyurethane resin, epoxy resin, phenolic resin and organic silicon resin, and the conductive material of the pressure-sensitive layer is any one of carbon nano tubes, carbon fibers, conductive carbon powder and graphene.
As a further improvement of the present invention, the ring electrode includes at least one pair of outer ring electrode circuits and at least one pair of center electrode circuits, the pair of outer ring electrode circuits includes a first outer ring electrode circuit and a second outer ring electrode circuit, the pair of center electrode circuits includes a first center electrode circuit and a second center electrode circuit, the electrode leading-out end includes a first electrode leading-out end and a second electrode leading-out end, the first outer ring electrode circuit and the first center electrode circuit are joined and then connected to the first electrode leading-out end, the second outer ring electrode circuit and the second center electrode circuit are joined and then connected to the second electrode leading-out end, the first outer ring electrode circuit and the first center electrode circuit are grounded, and the second outer ring electrode circuit and the second center electrode circuit are grounded.
As a further improvement of the present invention, the first outer ring electrode circuit and the second outer ring electrode circuit are respectively arranged on the periphery along the circumferential direction and are annular, the first center electrode circuit and the second center electrode circuit are respectively arranged on the center along the radial direction, and the distance between the first outer ring electrode circuit and the second outer ring electrode circuit is smaller than the distance between the first center electrode circuit and the second center electrode circuit.
As a further improvement of the present invention, when the resistive high-sensitivity flexible pressure sensing device is pressed, the outer ring pressure-sensitive layer is in contact with the first outer ring electrode circuit and the second outer ring electrode circuit, and the inner ring pressure-sensitive layer is in contact with the first central electrode circuit and the second central electrode circuit.
As a further improvement of the present invention, the first flexible film substrate and the second flexible film substrate are both used for transferring force load, the material of the first flexible film substrate is at least one of a polyester film, a polyimide film, a polypropylene film, a polyvinyl chloride film, and the like, and the material of the second flexible film substrate is at least one of a polyester film, a polyimide film, a polypropylene film, a polyvinyl chloride film, and the like.
The invention has the beneficial effects that: through the scheme, the annular electrode layer is matched with the pressure-sensitive layers with different surface resistances to form the flexible pressure sensor with high sensitivity at the outer ring and low sensitivity at the inner part, and the viscous material with a certain thickness is matched, so that the sensor can output a sensing curve without sudden change and low limit resistance after being pressed, and has higher sensitivity and no sudden change of a range output curve.
Drawings
FIG. 1 is a layered schematic diagram of a resistive high-sensitivity flexible pressure sensing device according to the present invention.
FIG. 2 is a schematic diagram of an annular electrode layer of a resistive high-sensitivity flexible pressure sensing device according to the present invention.
Fig. 3 is a comparison diagram of the positions of the pressure-sensitive layer and the annular electrode layer of the resistive high-sensitivity flexible pressure sensing device.
FIG. 4 is a size diagram of the pressure sensitive layer and the annular electrode layer of the resistive high-sensitivity flexible pressure sensing device according to the present invention.
FIG. 5 is a graph of a sensing curve of a resistive high-sensitivity flexible pressure sensing device according to the present invention.
Detailed Description
The invention is further described with reference to the following description and embodiments in conjunction with the accompanying drawings.
As shown in fig. 1 to 5, a resistive high-sensitivity flexible pressure sensing device (sensor for short) includes a first flexible film substrate 1, a pressure-sensitive layer 20, an annular electrode layer 30 and a second flexible film substrate 7, which are stacked, wherein the pressure-sensitive layer 20 is located between the first flexible film substrate 1 and the annular electrode layer 30, the annular electrode layer 30 is located between the pressure-sensitive layer 20 and the second flexible film substrate 7, the annular electrode layer 30 includes an annular electrode 5 and an electrode lead-out terminal 6, the annular electrode 5 is connected to the electrode lead-out terminal 6, the first flexible film substrate 1 and the second flexible film substrate 7 are encapsulated by a viscous material 3, the pressure-sensitive layer 20 includes an outer ring pressure-sensitive layer 2 and an inner ring pressure-sensitive layer 4, which are located on the same plane, the diameter of the outer ring pressure-sensitive layer 2 is larger than that of the inner ring pressure-sensitive layer 4, the surface resistance of the inner ring pressure sensitive layer 4 is greater than that of the outer ring pressure sensitive layer 2.
As shown in fig. 1 to 5, the outer ring pressure sensitive layer 2 is a low resistance region with a surface resistance range of 10 to 50k Ω/sq, and the inner ring pressure sensitive layer 4 is a high resistance region with a surface resistance range of 50 to 200k Ω/sq.
As shown in fig. 1 to 5, the pressure sensitive layer 20 is printed on the surface of the first flexible film substrate 1, and the annular electrode layer 30 is printed on the surface of the second flexible film substrate 7.
As shown in fig. 1 to 5, the outer ring pressure-sensitive layer 2 and the inner ring pressure-sensitive layer 4 are combined to form a complete circle, and when the resistive high-sensitivity flexible pressure sensing device is not pressed, a gap is formed between the pressure-sensitive layer 20 and the annular electrode 5.
As shown in fig. 1 to 5, the adhesive material 3 is used to encapsulate the first and second flexible film substrates 1 and 7, and the outer and inner pressure- sensitive layers 2 and 4 are held in face-to-face contact with the ring electrode 5 while ensuring a distance therebetween.
As shown in fig. 1 to 5, the pressure-sensitive layer 20 is made of a material having a pressure-sensitive effect and deforming synchronously with the first flexible film substrate 1, and the pressure-sensitive layer 20 is mainly formed by mixing a polymer material and a conductive material.
As shown in fig. 1 to 5, the doping concentration range of the conductive material of the inner ring pressure sensitive layer 4 in the pressure sensitive layer 20 is 2 to 4wt%, and the doping concentration range of the conductive material of the outer ring pressure sensitive layer 2 in the pressure sensitive layer 20 is 4 to 7.5 wt%.
As shown in fig. 1 to 5, the polymer material of the pressure-sensitive layer 20 is at least one of chlorinated acrylic resin, polyurethane resin, epoxy resin, phenolic resin, silicone resin, and the like, and the conductive material of the pressure-sensitive layer 20 is at least one of carbon nanotube, carbon fiber, conductive carbon powder, graphene, and the like.
As shown in fig. 1 to 5, the ring electrode 5 includes at least one pair of outer ring electrode circuits and at least one pair of center electrode circuits, the pair of outer ring electrode circuits includes a first outer ring electrode circuit 10 and a second outer ring electrode circuit 11, the pair of center electrode circuits includes a first center electrode circuit 12 and a second center electrode circuit 13, the electrode terminals include a first electrode terminal 8 and a second electrode terminal 9, the first outer ring electrode circuit 10 and the first center electrode circuit 12 are joined and then connected to the first electrode terminal 8, the second outer ring electrode circuit 11 and the second center electrode circuit 13 are joined and then connected to the second electrode terminal 9, the first outer ring electrode circuit 10 and the first center electrode circuit 12 are connected to the same ground, and the second outer ring electrode circuit 11 and the second center electrode circuit 13 are connected to the same ground.
As shown in fig. 1 to 5, the first outer ring electrode circuit 10 and the second outer ring electrode circuit 11 are respectively arranged along the circumferential direction at the periphery and are annular, the first central electrode circuit 12 and the second central electrode circuit 13 are respectively arranged along the radial direction at the center, and the distance between the first outer ring electrode circuit 10 and the second outer ring electrode circuit 11 is smaller than the distance between the first central electrode circuit 12 and the second central electrode circuit 13.
As shown in fig. 1 to 5, the first central electrode circuit 12 and the second central electrode circuit 13 are in one of simple symmetrical patterns such as concentric circular arcs and parallel line segments.
As shown in fig. 1 to 5, when the resistive high-sensitivity flexible pressure sensing device is pressed, the outer ring pressure-sensitive layer 2 is completely contacted with the first outer ring electrode circuit 10 and the second outer ring electrode circuit 11, the inner ring pressure-sensitive layer 4 is completely contacted with the first center electrode circuit 12 and the second center electrode circuit 13, when the sensor is pressed, the center position is preferentially deformed, the outer ring pressure-sensitive layer 2 is contacted with the first center electrode circuit 12 and the second center electrode circuit 13, the output resistance is relatively slowly reduced, and the output curve has no abrupt change; the pressure of the sensor is further increased, the outer ring pressure-sensitive layer 2 is in contact with the first outer ring electrode circuit 10 and the second outer ring electrode circuit 11, the output resistance is further reduced, and finally, a lower limit output resistance is obtained.
As shown in fig. 1 to 5, the first electrode lead 8 and the second electrode lead 9 correspond to a first test port 14 and a second test port 15, and the first test port 14 and the second test port 15 are exposed for connection and test.
As shown in fig. 1 to 5, the first test port 14 and the second test port 9 are wide and can be used as signal output ports for signal processing modules and/or test equipment.
As shown in fig. 1 to 5, the first flexible film substrate 1 and the second flexible film substrate 7 are both used for transmitting a force load, and under a force condition, a measurable resistance corresponding to a change can be output at a joint of the ring electrode 5 and the pressure-sensitive layer 20, the first flexible film substrate 1 is made of at least one of a polyester film, a polyimide film, a polypropylene film, a polyvinyl chloride film and the like, and the second flexible film substrate 7 is made of at least one of a polyester film, a polyimide film, a polypropylene film, a polyvinyl chloride film and the like.
As shown in fig. 1 to 5, the adhesive material 3 is made of an adhesive PET material, and the thickness of the adhesive PET material is preferably 50-150 μm, so that the adhesive material is not deformed during pressing, and the sensor is kept to have good resilience and long service life.
As shown in fig. 1 to 5, the present invention also provides one of the preferred experimental schemes for preparing the resistive high-sensitivity flexible pressure sensing device, which comprises the following steps:
step 1) preparing a low-resistance region pressure-sensitive material mixed solution: mixing a high polymer material main agent with a diluent, adding a conductive material under the condition of high-speed stirring until the conductive material is uniformly mixed, and adding a curing agent before use;
step 2) preparing an annular low-resistance area pressure-sensitive material layer: printing and/or spraying and/or spin-coating the mixed solution prepared in the step 1) on the surface of the flexible film, wherein the printed pattern is annular, and drying is carried out at a certain temperature;
step 3), preparing a high-resistance area pressure-sensitive material mixed solution: mixing a high polymer material main agent with a diluent, adding a conductive material under the condition of high-speed stirring until the conductive material is uniformly mixed, and adding a curing agent before use;
step 4), preparing a circular high-resistance area pressure-sensitive material layer: printing and/or spraying and/or spin-coating the mixed solution prepared in the step 3) on the surface of the flexible film in the step 2), wherein the printed pattern is circular, the printing position is inside the annular low-resistance area pressure-sensitive material layer pattern, and finally, a complete circular pressure-sensitive material pattern is formed and dried at a certain temperature.
Step 5) printing an electrode layer: printing and/or depositing and/or printing and/or spraying an electrode pattern on the surface of the flexible film;
step 6) packaging the flexible pressure sensor: and (3) carrying out face-to-face laminating packaging on the flexible film substrate printed with the pressure-sensitive material layer and the annular electrode.
As shown in fig. 1 to 5, in the resistance-type high-sensitivity flexible pressure sensor provided by the present invention, the annular electrode layer 30 is matched with the pressure-sensitive layers 20 having different surface resistances to form the outer-ring high-sensitivity and inner-part low-sensitivity flexible pressure sensor, and matched with the viscous material 3 having a certain thickness, after the sensor is pressed, a sensing curve having no abrupt change and low limit resistance can be output. The sensor has high sensitivity and no sudden change of a measuring range output curve.
When the pressure sensor is used, the electrode output interface of the sensor is connected with the pressure signal processor, and meanwhile, the power supply module is used for supplying power to the signal processor. When the sensor has no external force, the pressure-sensitive layer 20 and the annular electrode layer 30 keep a certain distance, and the output resistance of the sensor is infinite; when the sensor is subjected to a small external force, the central position of the sensor is preferentially deformed, so that an electrode at the central position is contacted with the inner ring pressure-sensitive layer 4, and because the central position of the electrode pattern is a central electrode pair and the inner ring pressure-sensitive layer 4 is a high-resistance area, the output resistance of the sensor changes relatively slowly and outputs a voltage change curve without sudden change; when the pressure applied on the surface of the sensor is further increased, the edge area of the outer ring of the sensor is gradually deformed, and the output resistance of the sensor is further reduced due to the fact that the edge position of the electrode pattern is an annular electrode pair and is matched with the low-resistance outer ring pressure-sensitive layer 2; when the pressure applied on the sensor reaches the maximum, the deformation of the sensor film reaches the limit, the annular electrode layer 30 is completely contacted with the pressure-sensitive layer 20, and a lower limit resistance value is output.
Most of the existing flexible pressure sensors are provided with electrode patterns which are of interdigital structures, sensitive areas are located in the center of the sensors, when the sensors receive external force to press, electrodes of the sensitive areas are preferentially contacted with pressure-sensitive materials, the output resistance of the sensors is reduced sharply, the sensing curves are easy to break, in the continuous pressing process, outer ring circuits in the interdigital electrodes are gradually contacted with the pressure-sensitive materials, and the outer ring circuits belong to low-sensitive areas, so that the output resistance changes slightly under high pressure, and the problems that the pressing breaks, the output lines are narrow, the sensitivity is poor and the like exist in the sensors are caused. By adopting the annular electrode structure provided by the invention, the electrode sensitive area is adjusted to the periphery of the sensor, and the annular pressure sensitive material layer and the viscous material with a certain thickness are matched, so that the piezoresistive effect is firstly generated in the low sensitive area (the central position of the sensor) in the pressing process, a non-abrupt change electric signal curve is output, after the pressure is increased, the piezoresistive effect is generated in the high sensitive area (the outer ring position of the sensor), the output resistance is continuously reduced, and finally, the pressure sensor with a large measuring range, high sensitivity and small limit output resistance can be obtained.
Example 1
As shown in fig. 1 to 5, the circuit width of the ring electrode 5 is 0.5mm, the first center electrode circuit 12 and the second center electrode circuit 13 are concentric circular arcs, and both have a radius of R1=2mm, the distance D1=3mm between the first center electrode circuit 12 and the second center electrode circuit 13, the circular arc radius R2=3.5mm between the first outer ring electrode circuit 10 and the circular arc radius R3=4.5mm between the second outer ring electrode circuit 11 and the first center electrode circuit 12, the distance D2=1mm between the first center electrode circuit 12 and the first outer ring electrode circuit 10, and the distance D3=0.5mm between the first outer ring electrode circuit 10 and the second outer ring electrode circuit 11. The first and second electrode leads 8, 9 have a length D4=3mm and the first and second test ports 14, 15 are dimensioned to be D5=3.5mm, D6=1.5 mm.
The inner ring pressure-sensitive layer 4 is of a circular structure with the radius of R5=3.3mm, the outer ring pressure-sensitive layer 2 is of an annular structure, R4=5.2mm, and the inner ring pressure-sensitive layer 4 and the outer ring pressure-sensitive layer 2 are not spaced.
When mounting, the position of the annular pressure-sensitive layer 20 corresponding to the annular electrode 5 is shown in fig. 3.
The embodiment also provides a specific manufacturing process of the flexible pressure sensor, which comprises the following steps:
step 1) preparing a low-resistance region pressure-sensitive material mixed solution: mixing 10g of acrylic resin main agent and 3g of diluent isophorone, adding 4g of carbon nano tube under the condition of high-speed stirring until the mixture is uniformly mixed, and adding 1g of curing agent before use;
step 2) preparing an annular low-resistance area pressure-sensitive material layer: printing the mixed solution prepared in the step 1) on the surface of a PVC film, wherein the printed pattern is annular, and drying for 30min at 70 ℃ for later use;
step 3), preparing a high-resistance area pressure-sensitive material mixed solution: mixing 10g of acrylic resin main agent and 3g of diluent, adding 2.5g of carbon nano tube under the condition of high-speed stirring until the mixture is uniformly mixed, and adding 1g of curing agent before use;
step 4), preparing a circular high-resistance area pressure-sensitive material layer: printing the mixed solution prepared in the step 3) on the surface of the PVC film in the step 2), wherein the printed pattern is circular, the printing position is inside the annular low-resistance area pattern, finally forming a complete circular pressure-sensitive material pattern, and then drying at 70 ℃ for 30 min.
Step 5) printing an electrode layer: printing an annular electrode on the surface of the PET flexible film by using silver conductive paste, and sintering at 130 ℃ until the PET flexible film is conductive;
step 6) packaging the flexible pressure sensor: and (3) carrying out face-to-face laminating and packaging on the flexible film substrate printed with the pressure-sensitive material layer and the annular electrode, wherein the adhesive material is double-sided PET (polyethylene terephthalate) adhesive, and the thickness of the adhesive material is 0.1 mm.
Carrying out the sensor performance test described in example 1:
and connecting the first test port 14 and the second test port 15 in the prepared pressure sensor electrode with a processor module and a power supply module, and testing the output voltage change of the pressure sensor electrode under different pressure states by adopting a Japanese graphic high-speed recorder (GL 900 APS).
In the embodiment, the voltage provided for the sensor is 2.7V, and when no external force acts on the surface of the sensor, the output voltage of the pressure sensor is 2.7V; when the applied external force is less than 20N, the output voltage of the pressure sensor is still about 2.7V and has no obvious change, because the adopted bonding material has certain thickness during packaging, the pressure-sensitive layer and the electrode are separated by a certain distance in the initial state, under the condition of small external force, the pressure-sensitive layer and the electrode are not contacted, and the output voltage is not changed; when the applied external force is larger than 20N, the output voltage of the sensor is remarkably reduced, and within 20N-100N, the output voltage of the sensor and the applied pressure show good negative correlation characteristics; when the pressure is more than 100N, the output voltage of the sensor reaches a limit, and the limit output voltage is low and reaches 0.17V due to the existence of the outer ring electrode and the low-resistance region pressure-sensitive material.
The flexible pressure sensor prepared in the embodiment has good correlation characteristics of output voltage and applied pressure in a measuring range, has lower limit output voltage, and has the advantages of high sensitivity to pressure, no abrupt change of an output curve and the like.
The foregoing is a more detailed description of the invention in connection with specific preferred embodiments and it is not intended that the invention be limited to these specific details. For those skilled in the art to which the invention pertains, several simple deductions or substitutions can be made without departing from the spirit of the invention, and all shall be considered as belonging to the protection scope of the invention.
Claims (9)
1. A resistance-type high-sensitivity flexible pressure sensing device is characterized in that: the flexible film comprises a first flexible film substrate, a pressure-sensitive layer, an annular electrode layer and a second flexible film substrate which are arranged in a laminated mode, wherein the pressure-sensitive layer is located between the first flexible film substrate and the annular electrode layer, the annular electrode layer is located between the pressure-sensitive layer and the second flexible film substrate, the annular electrode layer comprises an annular electrode and an electrode leading-out end, the annular electrode is connected with the electrode leading-out end, the first flexible film substrate and the second flexible film substrate are packaged through a viscous material, the pressure-sensitive layer comprises an outer ring pressure-sensitive layer and an inner ring pressure-sensitive layer which are located on the same plane, the diameter of the outer ring pressure-sensitive layer is larger than that of the inner ring pressure-sensitive layer, and the surface resistance of the inner ring pressure-sensitive layer is larger than that;
a gap is arranged between the pressure-sensitive layer and the annular electrode;
the ring electrode comprises at least one pair of outer ring electrode circuits and at least one pair of central electrode circuits, the pair of outer ring electrode circuits comprises a first outer ring electrode circuit and a second outer ring electrode circuit, and the pair of central electrode circuits comprises a first central electrode circuit and a second central electrode circuit; when the resistance-type high-sensitivity flexible pressure sensing device is pressed, the outer ring pressure-sensitive layer is in contact with the first outer ring electrode circuit and the second outer ring electrode circuit, and the inner ring pressure-sensitive layer is in contact with the first central electrode circuit and the second central electrode circuit.
2. The resistive high sensitivity flexible pressure sensing device of claim 1, wherein: the pressure-sensitive layer is printed on the surface of the first flexible film substrate, and the annular electrode layer is printed on the surface of the second flexible film substrate.
3. The resistive high sensitivity flexible pressure sensing device of claim 1, wherein: the outer ring pressure sensitive layer and the inner ring pressure sensitive layer are combined to form a complete circle.
4. The resistive high sensitivity flexible pressure sensing device of claim 1, wherein: the pressure-sensitive layer is made of a material which deforms synchronously with the first flexible film substrate and has a pressure-sensitive effect, and is mainly formed by mixing a high polymer material and a conductive material.
5. The resistive high sensitivity flexible pressure sensing device of claim 4, wherein: the doping concentration range of the conductive material of the inner ring pressure-sensitive layer in the pressure-sensitive layer is 2-4wt%, and the doping concentration range of the conductive material of the outer ring pressure-sensitive layer in the pressure-sensitive layer is 4-7.5 wt%.
6. The resistive high sensitivity flexible pressure sensing device of claim 4, wherein: the high polymer material of the pressure-sensitive layer is at least one of chlorinated propylene resin, polyurethane resin, epoxy resin, phenolic resin and organic silicon resin, and the conductive material of the pressure-sensitive layer is at least one of carbon nano tubes, carbon fibers, conductive carbon powder and graphene.
7. The resistive high sensitivity flexible pressure sensing device of claim 1, wherein: the electrode leading-out end comprises a first electrode leading-out end and a second electrode leading-out end, the first outer ring electrode circuit and the first central electrode circuit are connected with the first electrode leading-out end after being converged, the second outer ring electrode circuit and the second central electrode circuit are connected with the second electrode leading-out end after being converged, the first outer ring electrode circuit and the first central electrode circuit are grounded, and the second outer ring electrode circuit and the second central electrode circuit are grounded.
8. The resistive high sensitivity flexible pressure sensing device of claim 7, wherein: the first outer ring electrode circuit and the second outer ring electrode circuit are respectively arranged on the periphery along the circumferential direction and are annular, the first central electrode circuit and the second central electrode circuit are respectively arranged on the center along the radial direction, and the distance between the first outer ring electrode circuit and the second outer ring electrode circuit is smaller than that between the first central electrode circuit and the second central electrode circuit.
9. The resistive high sensitivity flexible pressure sensing device of claim 1, wherein: the first flexible film substrate and the second flexible film substrate are both used for transferring force loads, the first flexible film substrate is made of at least one of a polyester film, a polyimide film, a polypropylene film and a polyvinyl chloride film, and the second flexible film substrate is made of at least one of a polyester film, a polyimide film, a polypropylene film and a polyvinyl chloride film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910409890.4A CN110057478B (en) | 2019-05-17 | 2019-05-17 | Resistance type high-sensitivity flexible pressure sensing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910409890.4A CN110057478B (en) | 2019-05-17 | 2019-05-17 | Resistance type high-sensitivity flexible pressure sensing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110057478A CN110057478A (en) | 2019-07-26 |
| CN110057478B true CN110057478B (en) | 2021-03-16 |
Family
ID=67323468
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910409890.4A Expired - Fee Related CN110057478B (en) | 2019-05-17 | 2019-05-17 | Resistance type high-sensitivity flexible pressure sensing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110057478B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111024279B (en) * | 2019-12-30 | 2022-03-18 | 浙江清华柔性电子技术研究院 | Pressure sensor unit and pressure sensor |
| CN111586945B (en) * | 2020-05-29 | 2023-04-21 | 福建星宏新材料科技有限公司 | Single-key touch-press light-adjusting switch |
| CN112787652B (en) * | 2020-12-30 | 2024-11-29 | 苏州能斯达电子科技有限公司 | Flexible sliding touch sensing device |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201317552A (en) * | 2011-10-21 | 2013-05-01 | Univ China Medical | Pressure sensing member |
| CN104062060A (en) * | 2014-07-11 | 2014-09-24 | 中国科学院电子学研究所 | Double-range silicon piezoresistive type pressure sensitive element |
| CN205879411U (en) * | 2016-07-01 | 2017-01-11 | 南昌欧菲光科技有限公司 | Pressure drag sensor and pressure -sensitive element who is used for pressure drag sensor |
| CN106482889A (en) * | 2015-08-28 | 2017-03-08 | 鸿富锦精密工业（深圳）有限公司 | Pressure transducer |
| CN107003190A (en) * | 2014-12-09 | 2017-08-01 | 泰克年研究发展基金会公司 | High-resolution pressure-sensing |
| US9965076B2 (en) * | 2014-05-15 | 2018-05-08 | Bebop Sensors, Inc. | Piezoresistive sensors and applications |
| CN207798303U (en) * | 2018-03-02 | 2018-08-31 | 深圳市慧力迅科技有限公司 | A kind of fexible film pressure sensor |
| CN207976239U (en) * | 2018-04-17 | 2018-10-16 | 深圳市慧力迅科技有限公司 | A kind of novel thin film pressure sensor |
| CN109682508A (en) * | 2018-12-29 | 2019-04-26 | 贝骨新材料科技（上海）有限公司 | A kind of sensitive ink material and pliable pressure thin film sensor and preparation method thereof |
| CN208860503U (en) * | 2018-06-07 | 2019-05-14 | 深圳市力感科技有限公司 | It is a kind of for sensing the diaphragm pressure sensor of stress balance |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102539029B (en) * | 2012-02-29 | 2013-09-25 | 上海交通大学 | Three-dimensional fluid stress sensor based on flexible MEMS (microelectromechanical system) technology and array thereof |
| CN103175639B (en) * | 2013-02-06 | 2016-01-27 | 苏州科技学院 | The dynamic soil stress sensor of piezoresistance type high-frequency and preparation method |
| JP2015197299A (en) * | 2014-03-31 | 2015-11-09 | パナソニックＩｐマネジメント株式会社 | Pressure sensitive element, manufacturing method thereof, touch panel including pressure sensitive element and manufacturing method thereof |
| CN104251751B (en) * | 2014-09-26 | 2017-01-25 | 中国科学院半导体研究所 | Multi-sense organ integrated electronic skin and manufacturing method thereof |
| CN105606270B (en) * | 2016-01-19 | 2018-11-20 | 合肥工业大学 | A kind of Grazing condition touch-pressure sensation sensor based on capacitance resistance combined type |
| WO2018029790A1 (en) * | 2016-08-09 | 2018-02-15 | 株式会社 トライフォース・マネジメント | Force sensor |
| CN106644191A (en) * | 2017-01-23 | 2017-05-10 | 珠海安润普科技有限公司 | Pressure transducer and wearable device |
-
2019
- 2019-05-17 CN CN201910409890.4A patent/CN110057478B/en not_active Expired - Fee Related
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201317552A (en) * | 2011-10-21 | 2013-05-01 | Univ China Medical | Pressure sensing member |
| US9965076B2 (en) * | 2014-05-15 | 2018-05-08 | Bebop Sensors, Inc. | Piezoresistive sensors and applications |
| CN104062060A (en) * | 2014-07-11 | 2014-09-24 | 中国科学院电子学研究所 | Double-range silicon piezoresistive type pressure sensitive element |
| CN107003190A (en) * | 2014-12-09 | 2017-08-01 | 泰克年研究发展基金会公司 | High-resolution pressure-sensing |
| CN106482889A (en) * | 2015-08-28 | 2017-03-08 | 鸿富锦精密工业（深圳）有限公司 | Pressure transducer |
| CN205879411U (en) * | 2016-07-01 | 2017-01-11 | 南昌欧菲光科技有限公司 | Pressure drag sensor and pressure -sensitive element who is used for pressure drag sensor |
| CN207798303U (en) * | 2018-03-02 | 2018-08-31 | 深圳市慧力迅科技有限公司 | A kind of fexible film pressure sensor |
| CN207976239U (en) * | 2018-04-17 | 2018-10-16 | 深圳市慧力迅科技有限公司 | A kind of novel thin film pressure sensor |
| CN208860503U (en) * | 2018-06-07 | 2019-05-14 | 深圳市力感科技有限公司 | It is a kind of for sensing the diaphragm pressure sensor of stress balance |
| CN109682508A (en) * | 2018-12-29 | 2019-04-26 | 贝骨新材料科技（上海）有限公司 | A kind of sensitive ink material and pliable pressure thin film sensor and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110057478A (en) | 2019-07-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110068404B (en) | Resistance-type flexible pressure sensing device, preparation method thereof and sensor array | |
| CN110057478B (en) | Resistance type high-sensitivity flexible pressure sensing device | |
| WO2020155193A1 (en) | Novel tactile sensor | |
| CN102207415B (en) | Conductive-rubber-based flexible array clip pressure sensor and manufacturing method | |
| CN108613761A (en) | A kind of flexible 3 D contact force sensor | |
| CN109839232B (en) | Strain sensor and method of forming the same, strain sensor array and method of forming the same | |
| CN100570301C (en) | Pressure-sensitive conductive sheet and panel switch using the same | |
| CN110716667B (en) | Flexible sensor with positioning and pressure detection functions and manufacturing method thereof | |
| US20240272022A1 (en) | Method for Mechanical Sensing Utilizing Controlled Current | |
| CN111998977B (en) | Flexible wearable sensor array and preparation method thereof | |
| US11469365B2 (en) | Sensing film and method of making same and electronic device using sensing film | |
| KR20200106745A (en) | Pressure Resistive Pressure Sensor with Easy Pressure Distribution Confirmation Structure | |
| CN107340082A (en) | A kind of flexible film pressure sensor | |
| CN111552381A (en) | Capacitive pressure sensor, preparation method thereof and piano gloves | |
| CN114777967A (en) | Wide-range flexible pressure sensor and preparation method thereof | |
| CN108444620A (en) | A kind of multiple stage array pressure sensor of same laminar | |
| KR102442242B1 (en) | Electronic apparatus | |
| CN113916416A (en) | A kind of high permeability strain-insensitive electronic skin and preparation method thereof | |
| CN103210703A (en) | Assembling and packaging a discrete electronic component | |
| CN211373891U (en) | Flexible integrated array sensor | |
| CN115235656A (en) | A kind of highly sensitive flexible piezoresistive sensor and preparation method thereof | |
| CN115235654A (en) | Flexible multi-modal sensor and preparation method thereof | |
| CN211509417U (en) | Circuit board assembly and electronic equipment | |
| CN211042547U (en) | High-density distributed flexible pressure sensor | |
| CN111240528B (en) | Touch panel, manufacturing method thereof and display device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210316 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |