CN211042547U - High-density distributed flexible pressure sensor - Google Patents
High-density distributed flexible pressure sensor Download PDFInfo
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- CN211042547U CN211042547U CN201921723927.2U CN201921723927U CN211042547U CN 211042547 U CN211042547 U CN 211042547U CN 201921723927 U CN201921723927 U CN 201921723927U CN 211042547 U CN211042547 U CN 211042547U
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Abstract
The utility model relates to a sensor technical field, concretely relates to flexible pressure sensor of high density distributing type, include: a row portion and a column portion; the row part comprises: the array substrate comprises a line film substrate, a line electrode layer printed on the line film substrate in a screen printing mode and a line sensing layer printed on the line electrode layer; the column section includes: the array electrode layer is printed on the array film substrate in a screen printing mode, and the array sensing layer is printed on the array electrode layer; a bonding layer is arranged in a non-sensing area between the row sensing layer and the column sensing layer; and the crossing point between the row electrode layer and the column electrode layer forms each pressure sensing point; the high-density distributed flexible pressure sensor is manufactured in a screen printing mode, is rapid and efficient, and is low in manufacturing cost; in addition, the highest density of the pressure sensor can realize 100 pressure sensing points/square centimeter, the thinnest can reach 0.05mm, and a solution is provided for acquiring high-resolution pressure information.
Description
Technical Field
The utility model belongs to the technical field of the sensor, concretely relates to flexible pressure sensor of high density distributing type.
Background
The sensor is a perception terminal, and along with the development of science and technology, people are higher to the demand in aspects such as performance and the characteristic of sensor, for example wearable electronic product, robot touch perception etc. put forward higher requirement to the sensor, and the sensor needs to possess performances such as flexibility, ultra-thin, sensitivity. Therefore, attention is being focused on whether the flexible pressure sensor has the functions of flexibility and accurate measurement of pressure distribution information.
At present, most pressure testing devices are basically realized based on strain gauges or MEMS sensors, and the mode can achieve high precision corresponding to single-point detection, but is not suitable for high-density array layout and has high cost. The flexible pressure sensor manufactured by the finger electrode inserting mode is limited to have two electrode outgoing lines at each point, so that the problems of difficult electrode arrangement and difficult high-density distribution are easily caused, and the problem of insufficient precision exists in the flexible array pressure sensor manufactured by conductive fibers.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a flexible pressure sensor of high density distributing type to the realization is to the detection of high resolution pressure information.
In order to solve the technical problem, the utility model provides a flexible pressure sensor of high density distributing type, include: a row portion and a column portion; wherein the row section includes: the array substrate comprises a line film substrate, a line electrode layer printed on the line film substrate in a screen printing mode and a line sensing layer printed on the line electrode layer; the column section includes: the array electrode layer is printed on the array film substrate in a screen printing mode, and the array sensing layer is printed on the array electrode layer; a bonding layer is arranged in a non-sensing area between the row sensing layer and the column sensing layer; and the cross points between the row electrode layers and the column electrode layers form all the pressure sensing points.
Further, the area of the pressure sensing point is 1mm at the minimum2。
Further, the material of the row film substrate is one of a PET polyester film, a PI film or a PEN film.
Further, the material of the row film substrate is one of a PET polyester film, a PI film or a PEN film.
Furthermore, the materials of the row electrode layer and the column electrode layer are all conductive silver paste.
Furthermore, the materials of the row sensing layer and the column sensing layer are both semiconductor carbon paste.
Furthermore, the bonding layer adopts packaging glue.
The utility model has the advantages that the high-density distributed flexible pressure sensor is manufactured by the screen printing mode, which is not only fast and efficient, but also has low manufacturing cost; in addition, the highest density of the high-density distributed flexible pressure sensor can realize 100 pressure sensing points/square centimeter, the thinnest can reach 0.05mm, and a solution is provided for acquiring high-resolution pressure information.
Drawings
The present invention will be further explained with reference to the drawings and examples.
Fig. 1 is a schematic structural diagram of a high-density distributed flexible pressure sensor according to the present invention;
fig. 2 is a schematic diagram of an electrode array structure of the high-density distributed flexible pressure sensor of the present invention;
fig. 3 is an enlarged view of the pressure sensing points of the high density distributed flexible pressure sensor of the present invention;
fig. 4 is a graph of the relationship between the external pressure and the resistance of the sensing region experienced by the high density distributed flexible pressure sensor of the present invention;
fig. 5 is a graph showing the relationship between the external pressure applied to the high-density distributed flexible pressure sensor and the reciprocal of the resistance of the sensing area according to the present invention.
Wherein:
Detailed Description
The structure of the present invention will now be described in further detail with reference to the accompanying drawings.
Examples
As shown in fig. 1 and 2, the present embodiment provides a high-density distributed flexible pressure sensor including: a row portion and a column portion; wherein the row section includes: the array substrate comprises a line film substrate, a line electrode layer printed on the line film substrate in a screen printing mode and a line sensing layer printed on the line electrode layer; the column section includes: the array electrode layer is printed on the array film substrate in a screen printing mode, and the array sensing layer is printed on the array electrode layer; a bonding layer is arranged in a non-sensing area between the row sensing layer and the column sensing layer; and the cross points between the row electrode layers and the column electrode layers form all pressure sensing points, and after the pressure sensing points are subjected to pressure, the resistance change information of the pressure sensing points is transmitted out in real time through the row electrode layers and the column electrode layers, so that the pressure information corresponding to the pressure sensing points can be detected.
Further, the area of the pressure sensing point is 1mm at the minimum2。
As shown in FIG. 3, the highest density of the high-density distributed flexible pressure sensor can reach 1mm2One point, namely 1mm regional overall arrangement pressure-sensitive point for this high density distributed flexible pressure sensor can make the distribution mode of big breadth, provides the solution for sole line tracking and high resolution electron pavement etc..
Specifically, the highest density of the high-density distributed flexible pressure sensor can realize 100 pressure sensing points/square centimeter, the thinnest can reach 0.05mm, and a solution is provided for acquiring high-resolution pressure information.
Further, the material of the row film substrate is one of a PET polyester film, a PI film or a PEN film.
Further, the material of the row film substrate is one of a PET polyester film, a PI film or a PEN film.
Specifically, PET is polyethylene terephthalate, PI is polyimide, and PEN is polyethylene naphthalate.
Furthermore, the row electrode layer and the column electrode layer are made of conductive silver paste, and the conductive silver paste has the characteristics of excellent conductivity and good adhesion to a base material.
Furthermore, the materials of the row sensing layer and the column sensing layer are both semiconductor carbon paste.
Specifically, the semiconductor carbon paste mainly comprises a polymer resin binder (epoxy resin, polyester, polyacrylic resin and the like), a small amount of graphene, a small amount of carbon nanotubes and conductive carbon black, and is prepared by grinding semiconductor functional ink.
Specifically, as shown in fig. 4 and 5, the high-density distributed flexible pressure sensor made of the semiconductor carbon paste has special piezoresistive characteristics, the resistance of the sensing region is reduced along with the increase of the pressure, the pressure and the resistance are in a power function relationship, and the pressure and the reciprocal of the resistance are in a linear relationship, which provides a mathematical basis for the accurate calculation of the pressure by the high-density distributed flexible pressure sensor.
Furthermore, the bonding layer adopts packaging glue.
Specifically, the packaging adhesive can be acrylic acid non-setting adhesive or hot melt adhesive bonded by low-temperature hot pressing.
In conclusion, the high-density distributed flexible pressure sensor is manufactured in a screen printing mode, so that the high-density distributed flexible pressure sensor is fast and efficient, and the manufacturing cost is low; in addition, the highest density of the high-density distributed flexible pressure sensor can realize 100 pressure sensing points/square centimeter, the thinnest can reach 0.05mm, and a solution is provided for acquiring high-resolution pressure information.
In light of the foregoing, it will be apparent to those skilled in the art from this disclosure that various changes and modifications can be made without departing from the spirit and scope of the invention. The technical scope of the present invention is not limited to the content of the specification, and must be determined according to the scope of the claims.
Claims (7)
1. A high density distributed flexible pressure sensor, comprising:
a row portion and a column portion; wherein
The row section includes: the array substrate comprises a line film substrate, a line electrode layer printed on the line film substrate in a screen printing mode and a line sensing layer printed on the line electrode layer;
the column section includes: the array electrode layer is printed on the array film substrate in a screen printing mode, and the array sensing layer is printed on the array electrode layer;
a bonding layer is arranged in a non-sensing area between the row sensing layer and the column sensing layer; and
the crossing points between the row electrode layers and the column electrode layers form pressure sensing points.
2. The high density distributed flexible pressure sensor of claim 1,
the area of the pressure sensing point is 1mm at least2。
3. The high density distributed flexible pressure sensor of claim 1,
the material of the row film substrate is one of a PET (polyethylene terephthalate) polyester film, a PI (polyimide) film or a PEN (polyethylene naphthalate) film.
4. The high density distributed flexible pressure sensor of claim 1,
the material of the row film substrate is one of a PET (polyethylene terephthalate) polyester film, a PI (polyimide) film or a PEN (polyethylene naphthalate) film.
5. The high density distributed flexible pressure sensor of claim 1,
and the row electrode layer and the column electrode layer are made of conductive silver paste.
6. The high density distributed flexible pressure sensor of claim 1,
the row sensing layer and the column sensing layer are made of semiconductor carbon paste.
7. The high density distributed flexible pressure sensor of claim 1,
the bonding layer is made of packaging adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921723927.2U CN211042547U (en) | 2019-10-15 | 2019-10-15 | High-density distributed flexible pressure sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921723927.2U CN211042547U (en) | 2019-10-15 | 2019-10-15 | High-density distributed flexible pressure sensor |
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| CN211042547U true CN211042547U (en) | 2020-07-17 |
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| CN201921723927.2U Active CN211042547U (en) | 2019-10-15 | 2019-10-15 | High-density distributed flexible pressure sensor |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111998977A (en) * | 2020-08-25 | 2020-11-27 | 工科思维技术(深圳)有限公司 | High-sensitivity flexible wearable sensor array and preparation method thereof |
| CN116105899A (en) * | 2022-12-30 | 2023-05-12 | 厦门大学 | Off-electricity type flexible pressure sensor for integral screen printing and preparation method |
-
2019
- 2019-10-15 CN CN201921723927.2U patent/CN211042547U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111998977A (en) * | 2020-08-25 | 2020-11-27 | 工科思维技术(深圳)有限公司 | High-sensitivity flexible wearable sensor array and preparation method thereof |
| CN116105899A (en) * | 2022-12-30 | 2023-05-12 | 厦门大学 | Off-electricity type flexible pressure sensor for integral screen printing and preparation method |
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