CN111024279B - Pressure sensor unit and pressure sensor - Google Patents
Pressure sensor unit and pressure sensor Download PDFInfo
- Publication number
- CN111024279B CN111024279B CN201911398507.6A CN201911398507A CN111024279B CN 111024279 B CN111024279 B CN 111024279B CN 201911398507 A CN201911398507 A CN 201911398507A CN 111024279 B CN111024279 B CN 111024279B
- Authority
- CN
- China
- Prior art keywords
- layer
- pressure sensor
- sensor unit
- flexible conductive
- conductive film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000010410 layer Substances 0.000 claims description 133
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 17
- 239000011256 inorganic filler Substances 0.000 claims description 14
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 14
- -1 polydimethylsiloxane Polymers 0.000 claims description 12
- 239000002861 polymer material Substances 0.000 claims description 10
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 9
- 229920005570 flexible polymer Polymers 0.000 claims description 9
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 9
- 239000004433 Thermoplastic polyurethane Substances 0.000 claims description 8
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims description 8
- 229920000459 Nitrile rubber Polymers 0.000 claims description 7
- 229920001084 poly(chloroprene) Polymers 0.000 claims description 7
- 239000012790 adhesive layer Substances 0.000 claims description 5
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 4
- 229910021389 graphene Inorganic materials 0.000 claims description 4
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 4
- 229920003048 styrene butadiene rubber Polymers 0.000 claims description 4
- 239000002041 carbon nanotube Substances 0.000 claims description 3
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 3
- 230000035945 sensitivity Effects 0.000 abstract description 15
- 239000010408 film Substances 0.000 description 35
- 239000010409 thin film Substances 0.000 description 27
- 238000004806 packaging method and process Methods 0.000 description 10
- 238000001514 detection method Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 7
- 238000013329 compounding Methods 0.000 description 5
- 239000003292 glue Substances 0.000 description 5
- 239000002131 composite material Substances 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000002048 multi walled nanotube Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/02—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
压力传感器单元及压力传感器，该压力传感器单元包括依次设置的微结构层、柔性导电薄膜层及叉指电极层，在结构层朝向柔性导电薄膜层一侧的表面上形成有多个凸凹微结构。该压力传感器单元具有较高的本征重复性、灵敏度及分辨率。
A pressure sensor unit and a pressure sensor, the pressure sensor unit includes a microstructure layer, a flexible conductive film layer and an interdigital electrode layer arranged in sequence, and a plurality of convex and concave microstructures are formed on the surface of the structure layer facing the side of the flexible conductive film layer. The pressure sensor unit has high intrinsic repeatability, sensitivity and resolution.
Description
Technical Field
The invention relates to the technical field of flexible equipment, in particular to a pressure sensor unit and a pressure sensor.
Background
The commercial three-layer flexible pressure sensor has the characteristics of simple manufacture, low cost and strong designability due to the characteristic of being assembled after being manufactured separately. Fig. 1 is a schematic structural diagram of a pressure sensor unit in the prior art, and fig. 2 is a pressure-resistance relationship diagram of a plurality of detection results of the pressure sensor unit shown in fig. 1. As shown in fig. 1 and fig. 2, a pressure sensor unit in the prior art generally includes a rigid back plate 91 for protection, a conductive thin film 92, and an interdigital electrode 93, wherein the conductive thin film 92 is disposed between the rigid back plate 91 and the interdigital electrode 93. The hard back plate 91 is not easy to deform, and the conductive film 92 has high brittleness, so that the pressure sensor unit is difficult to realize uniform deformation along with the change of the applied pressure, so that the intrinsic repeatability (namely, the coincidence degree of a pressure-resistance curve of the same pressure sensor is measured for multiple times), the linearity (namely, the deviation between an input-output curve of the sensor and a selected fitted straight line), the sensitivity (namely, the slope of the pressure-resistance curve of the pressure sensor is selected as the sensitivity of the pressure sensor) and the resolution (namely, the minimum detection limit value) of the existing pressure sensor unit are low, and the requirement for the development of the pressure sensor is not met.
Disclosure of Invention
In view of the above, the present invention provides a pressure sensor unit and a pressure sensor, wherein the pressure sensor unit has high intrinsic repeatability, sensitivity and resolution.
The invention provides a pressure sensor unit, which comprises a microstructure layer, a flexible conductive film layer and an interdigital electrode layer, wherein the flexible conductive film layer is arranged between the microstructure layer and the interdigital electrode layer, a plurality of convex-concave microstructures are formed on the surface of one side of the microstructure layer facing the flexible conductive film layer, the flexible conductive film layer is a flexible pressure-sensitive film, adhesive layers are also arranged between the microstructure layer and the flexible conductive film layer and between the flexible conductive film layer and the interdigital electrode layer, the bonding layer is arranged in a non-working area between the microstructure layer and the flexible conductive thin film layer and between the flexible conductive thin film layer and the interdigital electrode layer, and forming clearance layers in working areas between the microstructure layer and the flexible conductive thin film layer and between the flexible conductive thin film layer and the interdigital electrode layer.
Further, the convex-concave microstructure is in a frustum pyramid shape, a sawtooth shape, a wave shape, a semi-circle shape or a pyramid shape.
Further, the microstructure layer is formed by polydimethylsiloxane, Eco-flex, thermoplastic polyurethane, polyvinyl alcohol, chloroprene rubber or nitrile rubber.
Furthermore, the flexible conductive film layer is formed by compounding a flexible high polymer material and a conductive inorganic filler.
Further, the flexible high polymer material and the conductive inorganic filler are respectively 75-95% and 5-25% by mass of the flexible conductive film layer.
Further, the flexible high polymer material is styrene-butadiene block copolymer, thermoplastic polyurethane, polydimethylsiloxane, chloroprene rubber or nitrile rubber.
Further, the conductive inorganic filler is carbon nanotubes, activated carbon or reduced graphene oxide.
The invention also provides a pressure sensor which comprises the pressure sensor unit.
In summary, the convex-concave microstructure is formed on the surface of the side, facing the flexible conductive film, of the microstructure layer, so that when the pressure sensor unit is subjected to pressure, the microstructure layer can be deformed more easily, and the sensitivity and the resolution of the pressure sensor unit are improved; through set up the flexible conductive thin layer between microstructured layer and interdigital electrode, the flexible conductive thin layer can electrically conduct on the one hand, and on the other hand also can support microstructured layer, guarantees that pressure sensor unit can realize even deformation along with the change of applied pressure. Further, the flexible conductive film layer is formed by compounding the flexible high polymer and the conductive inorganic filler, so that the pressure sensor unit can detect a low-pressure range and a medium-pressure range, the detection range of the pressure sensor unit is increased, and the pressure sensor unit is suitable for pressure requirements in the fields of robots, consumer electronics, medical detection equipment, wearable equipment and the like.
The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical means of the present invention more clearly understood, the present invention may be implemented in accordance with the content of the description, and in order to make the above and other objects, features, and advantages of the present invention more clearly understood, the following preferred embodiments are described in detail with reference to the accompanying drawings.
Drawings
Fig. 1 is a schematic structural diagram of a pressure sensor unit in the prior art.
Fig. 2 is a pressure-resistance relationship diagram showing a result of a plurality of times of detection by the pressure sensor unit shown in fig. 1.
Fig. 3 is a schematic structural diagram of a pressure sensor unit according to an embodiment of the present invention.
Fig. 4 to 8 are pressure-resistance relationship diagrams showing the results of a plurality of detections by the pressure sensor unit in the first to fifth embodiments of the present invention.
Detailed Description
To further explain the technical means and effects of the present invention adopted to achieve the predetermined objects, the following detailed description is given with reference to the accompanying drawings and preferred embodiments.
The invention provides a pressure sensor unit and a pressure sensor.
Fig. 3 is a schematic structural diagram of a pressure sensor unit according to an embodiment of the present invention. As shown in fig. 3, the pressure sensor unit provided in the embodiment of the present invention includes a microstructure layer 10, a flexible conductive thin film layer 20, and an interdigital electrode layer 30, where the microstructure layer 10, the flexible conductive thin film layer 20, and the interdigital electrode layer 30 are sequentially disposed, that is, the flexible conductive thin film layer 20 is disposed between the microstructure layer 10 and the interdigital electrode layer 30, and a plurality of convex-concave microstructures 11 are formed on a surface of the microstructure layer 10 facing the flexible conductive thin film layer 20.
In the present embodiment, by forming the convex-concave microstructure 11 on the surface of the microstructure layer 10 facing the flexible conductive film, when the pressure sensor unit is subjected to pressure, the microstructure layer 10 can be deformed more easily, and the sensitivity and resolution of the pressure sensor unit are improved; through set up flexible conductive thin film layer 20 between microstructured layer 10 and interdigital electrode layer 30, flexible conductive thin film layer 20 can electrically conduct on the one hand, and on the other hand also can support microstructured layer 10, guarantees that the pressure sensor unit can realize even deformation along with the change of applied pressure. Therefore, the pressure sensor unit provided by the embodiment of the invention has higher intrinsic repeatability, sensitivity and resolution.
Further, in the present embodiment, the convex-concave microstructure 11 may have a frustum shape, a wave shape, a sawtooth shape, a semicircular shape, or a pyramidal shape. The plurality of convex-concave microstructures 11 are uniformly distributed on the microstructure layer 10 in an array shape, the diameter of each convex-concave microstructure 11 can be 10 micrometers-1 mm, and the distance between every two adjacent convex-concave microstructures 11 can be 0-2.5 times the diameter of each convex-concave microstructure 11.
The microstructure layer 10 may be formed of polydimethylsiloxane, Eco-flex, thermoplastic polyurethane, polyvinyl alcohol, neoprene, or nitrile rubber.
During manufacturing, a template with specific holes and grooves can be printed by a 3D printer, and then the material of the microstructure layer 10 is filled in the template and cast. The thickness of the micro-structural layer 10 after molding may be 100 μm to 5 mm.
The flexible conductive thin film layer 20 is a pressure-sensitive composite layer formed by compounding a flexible polymer material and a conductive inorganic filler. In this embodiment, the flexible polymer material may be styrene-butadiene block copolymer, thermoplastic polyurethane, polydimethylsiloxane, neoprene or nitrile rubber; the conductive inorganic filler may be carbon nanotubes, activated carbon, reduced graphene oxide, or the like.
The components of the flexible high polymer material are 75-95% and the components of the conductive inorganic filler are 5-25% by mass. The thickness of the flexible conductive film layer 20 after molding may be 50 μm to 500 μm.
In this embodiment, the flexible conductive thin film layer 20 is formed by compounding a flexible polymer and a conductive inorganic filler, and the elastic deformation and the elastic modulus of the flexible conductive thin film layer 20 can be controlled by changing the components and the ratio of the flexible polymer material and the conductive inorganic filler. When a small force is applied to the pressure sensor unit in this embodiment, the microstructure layer 10 is deformed; when a large force is applied to the pressure sensor unit, the flexible conductive film layer 20 is also deformed, so that the pressure sensor unit detects a large pressure. Through the combination of the micro-structural layer 10 and the flexible conductive film layer 20, the pressure sensor unit can detect a low-pressure range and a medium-pressure range, and the detection range of the pressure sensor unit is increased.
Furthermore, an adhesive layer 41 is further disposed between two adjacent layers of the microstructure layer 10, the flexible conductive thin film layer 20 and the interdigital electrode layer 30, so as to realize the adhesion and fixation of the three layers. In the present embodiment, the adhesive layer 41 is disposed at the non-working region between the microstructure layer 10 and the flexible conductive film layer 20, and between the flexible conductive film layer 20 and the electrode layer, such as the edge of each film layer.
Through making flexible conductive film layer 20 form gap layer 42 by the complex of flexible polymer and electrically conductive inorganic filler working area position between microstructured layer 10 and the flexible conductive film layer 20 and between the electrode layer, for microstructured layer 10 and flexible conductive film layer 20 provide the deformation space, promote the sensitivity of pressure sensor unit.
The specific structure, composition and exhibited characteristics of the pressure sensor unit are described below with specific embodiments.
Example 1
A polydimethylsiloxane film having a semicircular microstructure was used as the microstructure layer 10, in which the radius size of the semicircular microstructure was 250 micrometers and the uniform arrangement pitch was 500 micrometers. As the flexible conductive thin film layer 20, a highly flexible conductive thin film having a pressure sensitive property is used, wherein the flexible conductive thin film layer 20 is a composite of a styrene-butadiene block copolymer and multi-walled carbon nanotubes. The interdigital electrode layer 30 is an interdigital circuit prepared on a flexible circuit board. And bonding and packaging the three parts along the outer non-working area by using high-strength glue. After the packaging is finished, a constant-load pressure tester is used for calibration, and the calibration result is as shown in fig. 4 (in fig. 4, the abscissa is the pressure applied to the pressure sensor unit, and the ordinate is the resistance measured by the pressure sensor unit under the pressure, the same is applied below); it has very good linearity, sensitivity, resolution and repeatability over commercial pressure sensors.
Example 2
An Eco-flex film having a semicircular microstructure with a radius size of 100 μm and a uniform arrangement pitch of 250 μm was used as the microstructure layer 10. A highly flexible conductive film with pressure sensitive characteristics is used as the flexible conductive film layer 20, and the flexible conductive film layer 20 is a composite of thermoplastic polyurethane and multi-walled carbon nanotubes. The interdigital electrode layer 30 is an interdigital circuit prepared on a flexible circuit board. And bonding and packaging the three parts along the outer non-working area by using high-strength glue. After the packaging is finished, calibrating by using a constant-loading pressure tester, wherein the calibration result is shown in figure 5; it has very good linearity, sensitivity, resolution and intrinsic repeatability over commercial pressure sensors.
Example 3
A thermoplastic polyurethane film with a prismoid microstructure is used as the microstructure layer 10, wherein the side length of the prismoid microstructure is 500 micrometers, the depth is 250 micrometers, and the uniform arrangement interval is 500 micrometers. A highly flexible conductive film having a pressure sensitive property is used as the flexible conductive thin film layer 20, and the flexible conductive thin film layer 20 is a polydimethylsiloxane and activated carbon composite. The interdigital electrode layer 30 is an interdigital circuit prepared on a flexible circuit board. And bonding and packaging the three parts along the outer non-working area by using high-strength glue. After the packaging is finished, calibrating by using a constant-loading pressure tester, wherein the calibration result is shown in figure 6; it has very good linearity, sensitivity, resolution and intrinsic repeatability over commercial pressure sensors.
Example 4
The polyvinyl alcohol film with the sawtooth-shaped microstructure is used as the microstructure layer 10, wherein the width of the sawtooth-shaped microstructure is 800 micrometers, the depth of the sawtooth-shaped microstructure is 200 micrometers, and the uniform arrangement interval is 0 micrometer. A highly flexible conductive film having a pressure sensitive characteristic is used as the flexible conductive thin film layer 20, and the flexible conductive thin film layer 20 is a compound of chloroprene rubber and reduced graphene oxide. The interdigital electrode layer 30 is an interdigital circuit prepared on a flexible circuit board. And bonding and packaging the three parts along the outer non-working area by using high-strength glue. After the packaging is finished, a constant-loading pressure tester is used for calibration, and the calibration result is shown in figure 7; it has very good linearity, sensitivity, resolution and intrinsic repeatability over commercial pressure sensors.
Example 5
A polydimethylsiloxane film with a saw-tooth microstructure was used as the microstructure layer 10, wherein the pyramidal microstructure had a width dimension of 500 microns, a depth of 250 microns, and a uniform pitch of 750 microns. A highly flexible conductive film having a pressure sensitive characteristic is used as the flexible conductive thin film layer 20, and the flexible conductive thin film layer 20 is a compound of nitrile rubber and activated carbon. The interdigital electrode layer 30 is an interdigital circuit prepared on a flexible circuit board. And bonding and packaging the three parts along the outer non-working area by using high-strength glue. After the packaging is finished, a constant-loading pressure tester is used for calibration, and the calibration result is shown in figure 8; it has very good linearity, sensitivity, resolution and intrinsic repeatability over commercial pressure sensors.
As can be seen from the above embodiments, the pressure sensor unit provided by the present invention has very good linearity, sensitivity, resolution and intrinsic repeatability compared to the prior art.
In summary, in the present invention, the convex-concave microstructure 11 is formed on the surface of the microstructure layer 10 facing the flexible conductive film, so that when the pressure sensor unit is subjected to pressure, the microstructure layer 10 can be deformed more easily, and the sensitivity and resolution of the pressure sensor unit are improved; through set up flexible conductive thin film layer 20 between micro-structure layer 10 and interdigital electrode, flexible conductive thin film layer 20 can electrically conduct on the one hand, and on the other hand also can support micro-structure layer 10, guarantees that the pressure sensor unit can realize even deformation along with the change of applied pressure. Further, the flexible conductive film layer 20 is formed by compounding flexible polymers and conductive inorganic fillers, so that the pressure sensor unit can detect a low-pressure range and a medium-pressure range, the detection range of the pressure sensor unit is increased, and the pressure sensor unit is suitable for pressure requirements in the fields of robots, consumer electronics, medical detection equipment, wearable equipment and the like.
The present invention also provides a pressure sensor, which includes the above-mentioned pressure sensor unit, and please refer to the prior art for other technical features of the pressure sensor, which will not be described herein again.
Although the present invention has been described with reference to a preferred embodiment, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (8)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911398507.6A CN111024279B (en) | 2019-12-30 | 2019-12-30 | Pressure sensor unit and pressure sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911398507.6A CN111024279B (en) | 2019-12-30 | 2019-12-30 | Pressure sensor unit and pressure sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111024279A CN111024279A (en) | 2020-04-17 |
| CN111024279B true CN111024279B (en) | 2022-03-18 |
Family
ID=70199880
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911398507.6A Active CN111024279B (en) | 2019-12-30 | 2019-12-30 | Pressure sensor unit and pressure sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111024279B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112504518A (en) * | 2020-09-25 | 2021-03-16 | 杭州电子科技大学 | Flexible capacitive pressure sensor and preparation method thereof |
| CN112697317A (en) * | 2020-12-15 | 2021-04-23 | 嘉兴学院 | Flexible pressure sensor with high sensitivity and wide range and preparation method thereof |
| CN113884224B (en) * | 2021-09-23 | 2024-06-18 | 昆明理工大学 | Flexible capacitive pressure sensor |
| CN115855324B (en) * | 2022-12-26 | 2024-04-30 | 厦门大学 | Film pressure sensor for detecting expansion of lithium battery core and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107145253A (en) * | 2016-02-19 | 2017-09-08 | 苹果公司 | Force Sensing Architecture |
| CN109738095A (en) * | 2018-12-18 | 2019-05-10 | 中北大学 | Flexible wearable sensor and corresponding wearable device and preparation method thereof |
| CN209085810U (en) * | 2019-01-02 | 2019-07-09 | 宁波石墨烯创新中心有限公司 | Graphene composite structure and flexible pressure sensor for flexible pressure sensor |
| CN110440957A (en) * | 2019-07-18 | 2019-11-12 | 浙江清华柔性电子技术研究院 | Flexible dielectric body, pliable pressure sensor and its respective preparation method |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10053326A1 (en) * | 2000-10-27 | 2002-05-08 | Bosch Gmbh Robert | Micro-mechanical component for sensing dew point contains membrane and porous material thermal insulating zone membrane support |
| JP5813103B2 (en) * | 2010-06-11 | 2015-11-17 | スリーエム イノベイティブ プロパティズ カンパニー | Touch position sensor with force measurement |
| JP6021812B2 (en) * | 2010-10-12 | 2016-11-09 | ニューヨーク・ユニバーシティ | Apparatus for sensing using tiles, sensor with a series of plates, object identification and method for multi-touch surfaces |
| US9075095B2 (en) * | 2013-02-27 | 2015-07-07 | Synaptics Incorporated | Device and method for localized force sensing |
| EP3237865B1 (en) * | 2014-12-23 | 2020-02-12 | Haydale Graphene Industries plc | Piezoresistive device |
| CN105136369B (en) * | 2015-05-28 | 2017-11-28 | 合肥工业大学 | A kind of Grazing condition resistance-type touch-pressure sensation detecting sensor and preparation method thereof |
| JP6325639B1 (en) * | 2016-11-22 | 2018-05-16 | Ｎｉｓｓｈａ株式会社 | Pressure sensor |
| CN108007617A (en) * | 2017-12-05 | 2018-05-08 | 浙江大学 | Pressure resistance type flexible touch sensation sensor and its manufacture method with micro- frustum of a cone substrate |
| CN207515931U (en) * | 2017-12-05 | 2018-06-19 | 浙江大学 | A kind of pressure resistance type flexible touch sensation sensor with micro- frustum of a cone substrate |
| CN109323784B (en) * | 2018-09-21 | 2020-07-10 | 浙江大学 | Piezoresistive flexible touch sensor with double-layer buckle type micro-boss |
| CN109238519B (en) * | 2018-10-22 | 2024-03-15 | 河北工业大学 | Hybrid flexible touch sensor |
| CN109540354B (en) * | 2018-12-03 | 2020-10-23 | 深圳先进技术研究院 | Pressure sensor and preparation method thereof |
| CN109799013A (en) * | 2019-01-28 | 2019-05-24 | 江南大学 | A kind of pressure resistance type flexible sensor and preparation method thereof |
| CN109883583B (en) * | 2019-03-28 | 2021-05-04 | 中国科学院长春应用化学研究所 | A kind of elastomer film and its preparation method and flexible pressure sensor comprising the elastomer film |
| CN110118624A (en) * | 2019-04-29 | 2019-08-13 | 深圳先进技术研究院 | A kind of pressure sensor and preparation method thereof |
| CN110057478B (en) * | 2019-05-17 | 2021-03-16 | 深圳市航天新材科技有限公司 | Resistance type high-sensitivity flexible pressure sensing device |
| CN110207866B (en) * | 2019-07-10 | 2021-02-05 | 合肥工业大学 | High-sensitivity flexible pressure sensor based on modified paper base and preparation method thereof |
| CN110501095B (en) * | 2019-07-23 | 2020-11-20 | 复旦大学 | A biomimetic flexible pressure sensor based on lotus leaf microspinous process/MXene composite structure |
| CN110608825B (en) * | 2019-09-12 | 2021-08-20 | 复旦大学 | Flexible pressure sensor based on polyimide substrate microstructure and preparation method thereof |
-
2019
- 2019-12-30 CN CN201911398507.6A patent/CN111024279B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107145253A (en) * | 2016-02-19 | 2017-09-08 | 苹果公司 | Force Sensing Architecture |
| CN109738095A (en) * | 2018-12-18 | 2019-05-10 | 中北大学 | Flexible wearable sensor and corresponding wearable device and preparation method thereof |
| CN209085810U (en) * | 2019-01-02 | 2019-07-09 | 宁波石墨烯创新中心有限公司 | Graphene composite structure and flexible pressure sensor for flexible pressure sensor |
| CN110440957A (en) * | 2019-07-18 | 2019-11-12 | 浙江清华柔性电子技术研究院 | Flexible dielectric body, pliable pressure sensor and its respective preparation method |
Non-Patent Citations (2)
| Title |
|---|
| 电容式柔性触觉传感器的研究与进展;孙英等;《微纳电子技术》;20170914(第10期);全文 * |
| 超薄类皮肤固体电子器件研究进展;陈颖等;《中国科学:信息科学》;20180620(第06期);全文 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111024279A (en) | 2020-04-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111024279B (en) | Pressure sensor unit and pressure sensor | |
| KR102081892B1 (en) | Resistive pressure sensor including piezo-resistive electrode | |
| CN104880206B (en) | Resistance strain gage and resistance strain type sensor | |
| US5652395A (en) | Bending sensor | |
| CN106197772B (en) | Flexible pressure sensor and preparation method thereof | |
| Woo et al. | A thin all-elastomeric capacitive pressure sensor array based on micro-contact printed elastic conductors | |
| Wang et al. | PDMS/MWCNT-based tactile sensor array with coplanar electrodes for crosstalk suppression | |
| US9664717B2 (en) | Flexible tactile sensors and method of making | |
| WO2011065100A1 (en) | Bend sensor and method of measuring deformed shape | |
| EP3921616B1 (en) | Low hysteresis and flexible pressure sensitive composite | |
| WO2015143307A1 (en) | Flexible tactile sensors and method of making | |
| Chen et al. | Improving the sensitivity of elastic capacitive pressure sensors using silver nanowire mesh electrodes | |
| Mousavi et al. | An ultrasensitive 3D printed tactile sensor for soft robotics | |
| EP3980740A1 (en) | Composite structure for a pressure sensor and pressure sensor | |
| JP6257088B2 (en) | Capacitance type three-dimensional sensor and manufacturing method thereof | |
| Jia et al. | Flexible and highly sensitive piezoresistive pressure sensor with sandpaper as a mold | |
| Shao et al. | Flexible force sensor with micro-pyramid arrays based on 3D printing | |
| DK202270046A1 (en) | Tactile Sensor, Matrix of Tactile Sensors; and Methods of Producing Such | |
| Ma et al. | Tunneling piezoresistive tactile sensing array fabricated by a novel fabrication process with membrane filters | |
| JP2016115178A (en) | Flexible laminate, manufacturing method thereof, and capacitive three-dimensional sensor | |
| KR20210139168A (en) | Strain sensor | |
| CN112885956A (en) | PVDF piezoelectric film and preparation method thereof | |
| TWI817634B (en) | Pressure sensor and method of fabricating the same | |
| KR20220062785A (en) | Piezoresistive sensor based on single medium which can detect localized pressure and breakage individually and manufacturing method thereof | |
| JP7663516B2 (en) | Composite structure for pressure sensor and pressure sensor - Patents.com |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |