CN108040148A - Input/output module and electronic device - Google Patents

Abstract

The invention discloses an electronic device and an input/output module, which comprise a packaging shell, a first infrared light source, a second infrared light source and a proximity sensor, wherein the second infrared light source and the proximity sensor are arranged around the first infrared light source; when the first infrared light source and the second infrared light source are both started and emit infrared light to the outside of the packaging shell at a second power, the input and output module is used for infrared supplementary lighting; the proximity sensor is used for receiving infrared light reflected by an object to detect the distance of the object. First infrared light source, second infrared light source and proximity sensor are integrated to be a single packaging body structure, and the integrated level of input/output module is high, has practiced thrift the space of realizing infrared light filling and infrared range finding's function.

Description

I/O modules and electronics

technical field

The invention relates to the technical field of consumer electronics, and more specifically, to an input and output module and an electronic device.

Background technique

As the functions supported by mobile phones become more and more diverse, the types and quantities of functional devices that need to be installed on mobile phones are also increasing. In order to realize functions such as distance detection, ambient light detection and user's facial 3D feature recognition, it is necessary Functional devices such as proximity sensors, ambient light sensors, infrared cameras, and structured light projectors are configured in the mobile phone, but in order to arrange many functional devices, it will take up too much space on the mobile phone.

Contents of the invention

Embodiments of the present invention provide an input and output module and an electronic device.

The input-output module according to the embodiment of the present invention includes a package casing, a first infrared light source, a second infrared light source arranged around the first infrared light source, and a proximity sensor, the package casing includes a package substrate, and the first The infrared light source, the second infrared light source and the proximity sensor are all packaged in the packaging case and carried on the packaging substrate. When the second infrared light source is turned off, the first infrared light source is powered by the first power When emitting infrared light to the outside of the packaging casing, the input and output module is used for infrared distance measurement; when the first infrared light source and the second infrared light source are both turned on and emit When emitting infrared light, the input and output module is used for infrared supplementary light; the proximity sensor is used for receiving the infrared light reflected by the object to detect the distance of the object.

In some embodiments, the first infrared light source is a point light source, and the second infrared light source is a point light source and the number is multiple; or

The first infrared light source is a point light source, and the second infrared light source is a ring light source; or

The first infrared light source is a plurality of ring-shaped point light sources, and the second infrared light source is a ring-shaped light source; or

The first infrared light source is a plurality of circular point light sources, and the second infrared light source is a plurality of point light sources; or

The first infrared light source is a ring light source; the second infrared light source is a point light source and the number is multiple; or

The first infrared light source is a ring light source; the second infrared light source is a ring light source. .

In some embodiments, the input and output module further includes a chip, the input and output module further includes a chip, and the first infrared light source, the second infrared light source, and the proximity sensor are all formed on one chip on the chip.

In some embodiments, the package housing further includes a package side wall and a package top, the package side wall extends from the package substrate and is connected between the package top and the package substrate, the package A light emitting window and a proximity sensing window are formed on the top, the light emitting window corresponds to the first infrared light source and the second infrared light source, and the proximity sensing window corresponds to the proximity sensor.

In some embodiments, the input-output module further includes a light source lens, the light source lens is disposed in the packaging housing and corresponds to the first infrared light source and the second infrared light source; and/or

The input-output module further includes a proximity sensing lens, which is disposed in the package housing and corresponds to the proximity sensor.

In some embodiments, the input and output module further includes a light source lens and a proximity sensor lens disposed in the package housing, the light source lens corresponds to the first infrared light source and the second infrared light source , the proximity sensing lens corresponds to the proximity sensor, and the light source lens and the proximity sensing lens are located on the same transparent substrate.

In some embodiments, the input and output module further includes a metal shielding plate, and the metal shielding plate is located in the package housing and between the second infrared light source and the proximity sensor.

In some embodiments, the input-output module further includes an optical enclosure made of light-transmitting material, the optical enclosure is formed on the packaging substrate and located in the packaging housing, the optical enclosure The cover encloses the first infrared light source, the second infrared light source, and the proximity sensor.

In some embodiments, the input-output module further includes a light-exit partition formed in the optical enclosure and located between the second infrared light source and the proximity sensor.

In some embodiments, a ground pin, a fill light pin, a proximity light pin, and a proximity sensing pin are formed on the input and output module, and the ground pin and the proximity light pin are controlled by When enabled, the first infrared light source emits infrared light; when the ground pin and the fill light pin are enabled, the first infrared light source and the second infrared light source emit infrared light; When the ground pin and the proximity sensing pin are enabled, the proximity sensor receives the infrared light reflected by the object to detect the distance of the object.

An electronic device according to an embodiment of the present invention includes a casing and the input-output module described in any one of the above-mentioned embodiments, and the input-output module is arranged in the casing.

In some embodiments, the electronic device further includes a light-transmitting cover plate, and the casing is provided with a light source through hole of the casing and a proximity sensing through hole of the casing, and the first infrared light source and the second infrared light source The infrared light source corresponds to the light source through hole of the casing, the proximity sensor corresponds to the proximity sensing through hole of the casing, and the cover plate is arranged on the casing.

In some embodiments, the electronic device further includes a light-transmitting cover plate, and the casing is provided with a light source through hole of the casing and a proximity sensing through hole of the casing, and the first infrared light source and the second infrared light source The infrared light source corresponds to the light source through hole of the casing, the proximity sensor corresponds to the proximity sensing through hole of the casing, the cover plate is arranged on the casing, and the cover plate is combined with the casing Infrared penetrating ink that only transmits infrared light is formed on the surface of the body, and the infrared penetrating ink blocks at least one of the light source through hole of the housing and the proximity sensing through hole of the housing.

In some embodiments, the electronic device further includes a photoreceptor and an imaging module, and the imaging module includes a mirror base, a lens barrel installed on the mirror base, and a For an image sensor, the mirror seat includes an installation surface between the lens barrel and the image sensor, and the photoreceptor is arranged on the installation surface.

In some embodiments, the electronic device further includes an imaging module and a light sensor, the imaging module is installed on the housing, the imaging module includes a camera housing and a lens module, the The top surface of the camera housing is a stepped surface and includes a connected first sub-top surface and a second sub-top surface, and the second sub-top surface is inclined relative to the first sub-top surface and connected to the first sub-top surface. A cutout is formed, a light exit hole is opened on the top surface, the lens module is accommodated in the camera housing and corresponds to the light exit hole, and the light sensor is arranged on the first sub-top surface.

In some embodiments, the electronic device further includes an imaging module and a light sensor, the imaging module includes a camera housing and two lens modules, and a cutout is provided on the top surface of the camera housing to A stepped top surface is formed, the top surface includes a first stepped surface and a second stepped surface lower than the first stepped surface, and two light-emitting through holes are opened on the first stepped surface, each of the The light exit hole corresponds to the lens module, and the light sensor is arranged on the second step surface.

In some embodiments, the electronic device further includes an imaging module and a photoreceptor, and the imaging module includes a mirror base, a lens barrel mounted on the mirror base, and a lens partially disposed in the mirror base. a substrate, the photoreceptor is arranged on the substrate.

The electronic device and the input/output module according to the embodiment of the present invention can be used for proximity infrared distance measurement when the first infrared light source and the proximity sensor are turned on, and can be used for infrared supplementary light when the first infrared light source and the second infrared light source are turned on at the same time. In other words, The first infrared light source, the second infrared light source and the proximity sensor are integrated into a single package structure, so that the input and output module integrates the function of emitting and receiving infrared light for infrared distance measurement, and the function of infrared supplementary light. In addition, the first infrared light source, the second infrared light source and the proximity sensor are integrated into a single package structure, the integration of the input and output modules is relatively high, and the volume is small. functional space.

Additional aspects and advantages of embodiments of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of embodiments of the invention.

Description of drawings

The above and/or additional aspects and advantages of the present invention will become apparent and comprehensible from the description of the embodiments in conjunction with the following drawings, wherein:

FIG. 1 is a schematic structural diagram of an electronic device according to some embodiments of the present invention;

2 is a perspective view of an input and output module of an electronic device according to some embodiments of the present invention;

3 to 4 are schematic diagrams of the states of the input and output modules of the electronic device according to some embodiments of the present invention;

5 is a schematic cross-sectional view of an input-output module of an electronic device according to some embodiments of the present invention;

6 to 8 are schematic diagrams of the distribution of the first infrared light source and the second infrared light source of the input-output module in some embodiments of the present invention;

9 is a partial perspective view of an input-output module of an electronic device according to some embodiments of the present invention;

10 is a partial cross-sectional schematic view of an electronic device according to some embodiments of the present invention;

11 is a schematic perspective view of a light sensor and an imaging module of an electronic device according to some embodiments of the present invention;

Fig. 12 is a schematic diagram of arrangement of electronic components of an electronic device according to some embodiments of the present invention;

13 is a schematic cross-sectional view of an input-output module of an electronic device according to some embodiments of the present invention;

Fig. 14 is a schematic structural diagram of an electronic device according to some embodiments of the present invention;

15 to 16 are partial cross-sectional schematic views of electronic devices according to some embodiments of the present invention

17 to 24 are three-dimensional schematic diagrams of a light sensor and an imaging module of an electronic device according to some embodiments of the present invention.

Detailed ways

Embodiments of the present invention will be further described below in conjunction with the accompanying drawings. The same or similar reference numerals in the drawings represent the same or similar elements or elements having the same or similar functions throughout.

In addition, the embodiments of the present invention described below in conjunction with the accompanying drawings are exemplary, and are only used to explain the embodiments of the present invention, and should not be construed as limiting the present invention.

In the present invention, unless otherwise clearly specified and limited, the first feature may be in direct contact with the first feature or the first and second feature may be in direct contact with the second feature through an intermediary. touch. Moreover, "above", "above" and "above" the first feature on the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. "Below", "beneath" and "beneath" the first feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is less horizontally than the second feature.

Referring to FIG. 1 , an electronic device 100 according to an embodiment of the present invention includes a housing 20 , a cover 30 and electronic components. The electronic components include an input and output module 10 , a light sensor 50 (as shown in FIG. 11 ), an imaging module 60 (as shown in FIG. 11 ), a receiver 70 and a structured light projector 80 . The electronic device 100 can be a mobile phone, a tablet computer, a notebook computer, a smart watch, a smart bracelet, an teller machine, etc. The embodiment of the present invention takes the electronic device 100 as an example for illustration. It can be understood that the specific form of the electronic device 100 can be other , without limitation here.

Please refer to FIG. 2 to FIG. 5 , the input and output module 10 is a single package structure, including a package housing 11 , a first infrared light source 12 , a second infrared light source 13 and a proximity sensor 1a.

The packaging case 11 is used to package the first infrared light source 12, the second infrared light source 13 and the proximity sensor 1a at the same time, or in other words, the first infrared light source 12, the second infrared light source 13 and the proximity sensor 1a are all packaged in the packaging case 11 at the same time. Inside. The package case 11 includes a package substrate 111 , a package sidewall 112 and a package top 113 . The packaging case 11 can be made of electromagnetic interference (EMI) shielding material, so as to prevent external electromagnetic interference from affecting the input and output module 10 .

Please refer to FIG. 5 , the packaging substrate 111 is used to carry the first infrared light source 12 , the second infrared light source 13 and the proximity sensor 1a. When manufacturing the input-output module 10, the first infrared light source 12, the second infrared light source 13 and the proximity sensor 1a can be formed on a chip 14, and then the first infrared light source 12, the second infrared light source 13, the proximity sensor 1a and the The chip 14 is disposed together on the package substrate 111 , specifically, the chip 14 can be bonded on the package substrate 111 . At the same time, the packaging substrate 111 can also be used to connect with other components of the electronic device 100 (such as the casing 20 of the electronic device 100 , the main board, etc.), so as to fix the input-output module 10 in the electronic device 100 .

The package side wall 112 can be arranged around the first infrared light source 12, the second infrared light source 13 and the proximity sensor 1a, the package side wall 112 extends from the package substrate 111, the package side wall 112 can be combined with the package substrate 111, preferably, the package side The wall 112 is detachably connected to the package substrate 111 , so that the first infrared light source 12 , the second infrared light source 13 and the proximity sensor 1 a can be repaired after the package side wall 112 is removed. The material of the package sidewall 112 may be a material that does not transmit infrared light, so as to prevent the infrared light emitted by the first infrared light source 12 and the second infrared light source 13 from passing through the package sidewall 112 .

The package top 113 is opposite to the package substrate 111 , and the package top 113 is connected to the package sidewall 112 . The package top 113 is formed with a light-emitting window 1131 and a proximity sensing window 1132. The light-emitting window 1131 corresponds to the first infrared light source 12 and the second infrared light source 13, and the infrared light emitted by the first infrared light source 12 and the second infrared light source 13 passes through the light-emitting window. 1131 passes through; the proximity sensing window 1132 corresponds to the proximity sensor 1a, and the infrared light reflected by the object can pass through the proximity sensing window 1132 and be incident on the proximity sensor 1a. The package top 113 and the package sidewall 112 can be formed integrally or separately. In one example, both the light emitting window 1131 and the proximity sensing window 1132 are through holes, and the material of the package top 113 is a material that does not transmit infrared light and visible light. In another example, the package top 113 is made of a material that does not transmit infrared light, a material that transmits infrared light, and a material that does not transmit visible light. Specifically, the light emitting window 1131 and the proximity sensing window 1132 are made of a material that transmits infrared light. The remaining parts are made of materials that are impermeable to infrared light and visible light. Further, the light-emitting window 1131 can be formed with a lens structure to improve the emission angle of infrared light emitted from the light-emitting window 1131. For example, the light-emitting window 1131 is formed with a Concave lens structure, so that the light passing through the light emitting window 1131 diverges and emits outward; the light emitting window 1131 is formed with a convex lens structure, so that the light passing through the light emitting window 1131 gathers and emits outward; the proximity sensing window 1132 can also be formed with a lens structure , to improve the infrared light emission angle incident from the proximity sensing window 1132, for example, the proximity sensing window 1132 has a convex lens structure so that the incident light from the proximity sensing window 1132 can be gathered and projected onto the proximity sensor 1a.

The first infrared light source 12, the second infrared light source 13 and the proximity sensor 1a can all be formed on a chip 14, further reducing the integrated volume of the first infrared light source 12, the second infrared light source 13 and the proximity sensor 1a, and the preparation process simpler. The first infrared light source 12 and the second infrared light source 13 can emit infrared light. When both the first infrared light source 12 and the second infrared light source 13 are turned on and emit infrared light to the outside of the package housing 11 (as shown in FIG. 3 ), the infrared light passes through the light-emitting window 1131 to be projected onto the surface of the object, and the electronic device 100 The infrared light camera 62 (as shown in Figure 1) receives the infrared light reflected by the object to obtain the image information of the object. At this time, the input and output module 10 is used for infrared supplementary light, and the first infrared light source 12 and the second infrared light source 13 The infrared light used for supplementary light emitted together covers a large luminous area, and the field angle α of the infrared light for supplementary light can be 60 degrees to 90 degrees. For example, the field angle α of infrared light for supplementary light is 60 degrees. degrees, 65 degrees, 70 degrees, 75 degrees, 80 degrees, 82 degrees, 85 degrees, 87 degrees, or 90 degrees, etc. When the second infrared light source 13 is turned off and the first infrared light source 12 emits infrared light to the outside of the package housing 11 (as shown in FIG. 4 ), the infrared light passes through the light-emitting window 1131 and reaches the surface of the object, and the proximity sensor 1a of the electronic device 100 Receive the infrared light reflected by the object to detect the distance from the object to the electronic device 100. At this time, the input and output module 10 is used for infrared distance measurement, and the infrared light emitted by the first infrared light source 12 is used for infrared distance measurement. The area is small, and the field angle β of infrared light for infrared distance measurement is 10 degrees to 30 degrees. For example, the field angle β of infrared light for infrared distance measurement is 10 degrees, 15 degrees, 20 degrees, 25 degrees, or 30 degrees. degree etc. In the embodiment of the present invention, the viewing angle refers to the range covered by the infrared light passing through the light-emitting window 1131 and exiting the packaging case 11 . The light sensor 50 (shown in FIG. 11 ) receives visible light in ambient light and detects the intensity of the visible light.

When the input and output module 10 is used for infrared supplementary light and for near-infrared distance measurement, it can emit infrared light to the outside of the package casing 11 with different powers. The input and output module 10 is used to emit infrared light to the outside of the package casing 11 with the first power when approaching infrared distance measurement, and emits infrared light to the outside of the package casing 11 with the second power when the input and output module 10 is used for infrared supplementary light. , wherein the first power may be smaller than the second power.

The second infrared light source 13 is arranged around the first infrared light source 12 . The first infrared light source 12 and the second infrared light source 13 may be in the form of a circle, a ring, a square or a regular polygon as a whole. Can be: the first infrared light source 12 is a point light source, the second infrared light source 13 is also a point light source and the number is multiple (as shown in Figure 6); or the first infrared light source 12 is a point light source, and the second infrared light source 13 is Ring-shaped light source (as shown in Figure 7); or the first infrared light source 12 is a plurality of ring-shaped point sources of light, and the second infrared light source 13 is a ring-shaped light source; or the first infrared light source 12 is a plurality of ring-shaped point sources of light , the second infrared light source 13 is a point light source and the number is multiple (as shown in Figure 8); or the first infrared light source 12 is a ring light source; the second infrared light source 13 is a point light source and the number is multiple; or the first infrared light source 12 is a ring light source; The light source 12 is a ring light source; the second infrared light source 13 is a ring light source. The proximity sensor 1 a is disposed on one side of the first infrared light source 12 and the second infrared light source 13 , that is, the proximity sensor 1 a is disposed outside the space surrounded by the second infrared light source 13 .

Please refer to FIG. 9 , in the embodiment of the present invention, a ground pin 15 , a fill light pin 16 , a proximity light pin 17 and a proximity sensing pin 1 c are formed on the input/output module 10 . The ground pin 15, the fill light pin 16, the proximity light pin 17 and the proximity sensing pin 1c may be formed on the package substrate 111. When the ground pin 15 and the fill light pin 16 are enabled (ie , when the ground pin 15 and the fill light pin 16 are connected to the circuit conduction), the first infrared light source 12 and the second infrared light source 13 emit infrared light; when the ground pin 15 and the proximity light pin 17 are enabled (that is, when the ground pin 15 and the proximity lamp pin 17 are connected to the circuit conduction), the first infrared light source 12 emits infrared light; when the ground pin 15 and the proximity sensing pin 1c are enabled (that is, the ground When the pin 15 and the proximity sensing pin 1c are connected to the circuit and conduct, the proximity sensor 1a receives the infrared light reflected by the object to detect the distance of the object.

Referring to FIG. 1 and FIG. 10 , the casing 20 can be used as an installation carrier for the input-output module 10 , or in other words, the input-output module 10 can be set in the casing 20 . The casing 20 can be the casing of the electronic device 100. In the embodiment of the present invention, the display screen 90 of the electronic device 100 can also be arranged inside the casing 20. Since the input-output module 10 of the embodiment of the present invention occupies a small volume Therefore, the volume for setting the display screen 90 in the case 20 can be correspondingly increased, so as to increase the screen-to-body ratio of the electronic device 100 . Specifically, the casing 20 includes a top 21 and a bottom 22, and the display screen 90 and the input/output module 10 are arranged between the top 21 and the bottom 22. When the user normally uses the electronic device 100, the top 21 is located above the bottom 22. , as shown in FIG. 1 , the input and output module 10 may be disposed between the display screen 90 and the top 21 . In other embodiments, the display screen 90 may be a full screen with a gap, the display screen 90 surrounds the input and output module 10 , and the input and output module 10 is exposed from the gap of the display screen 90 .

The casing 20 also defines an organic casing light source through hole 23 and a casing proximity sensing through hole 24 . When the input/output module 10 is installed in the casing 20 , the first infrared light source 12 and the second infrared light source 13 correspond to the light source through hole 23 of the casing, and the proximity sensor 1a corresponds to the proximity sensing through hole 24 of the casing. Wherein the first infrared light source 12 and the second infrared light source 13 correspond to the light source through hole 23 of the casing, which means that the light emitted by the first infrared light source 12 and the second infrared light source 13 can pass through the light source through hole 23 of the casing, specifically, The first infrared light source 12 and the second infrared light source 13 are directly facing the light source through hole 23 of the casing, or the light emitted by the first infrared light source 12 and the second infrared light source 13 passes through the light source of the casing after being acted on by the light guide element. Through hole 23. The proximity sensor 1a corresponds to the proximity sensor hole 24 of the casing, which means that the infrared light reflected by the object can pass through the proximity sensor hole 24 of the casing and be incident on the proximity sensor 1a. The casing proximity sensing through hole 24 is directly opposite, and the incident light of infrared light may pass through the casing proximity sensing through hole 24 and be incident on the proximity sensor 1a after being acted on by the light guide element. The light source through hole 23 of the casing and the proximity sensing through hole 24 of the casing may be spaced apart from each other. Of course, in other embodiments, the light source through hole 23 of the casing and the proximity sensing through hole 24 of the casing may also be connected to each other. .

The cover plate 30 may be transparent, and the material of the cover plate 30 may be transparent glass, resin, plastic, and the like. The cover plate 30 is arranged on the casing 20. The cover plate 30 includes an inner surface 32 combined with the casing 20 and an outer surface 31 opposite to the inner surface 32. The light emitted by the input and output module 10 passes through the inner surface 32 in turn. and the outer surface 31 through the cover plate 30 . In the embodiment shown in FIG. 10 , the cover plate 30 covers the light source through hole 23 of the casing and the proximity sensing through hole 24 of the casing. The ink 40 has a high transmittance to infrared light, for example, it can reach 85% or more, and it has a high attenuation rate to visible light, for example, it can reach more than 70%, making it difficult for users to see it with the naked eye during normal use. The area covered by the infrared transparent ink 40 on the electronic device 100 . In particular, infrared transparent ink 40 may cover areas of inner surface 32 that do not correspond to display screen 90 .

The infrared transparent ink 40 can also block at least one of the casing light source through hole 23 and the casing proximity sensing through hole 24, that is, the infrared transparent ink 40 can simultaneously block the casing light source through hole 23 and the casing proximity sensing Through hole 24 (as shown in FIG. 10 ), it is difficult for the user to see the internal structure of electronic device 100 through the light source through hole 23 of the casing and the proximity sensing through hole 24 of the casing, and the appearance of electronic device 100 is more beautiful; 40 can also block the casing light source through hole 23 without blocking the casing proximity sensing through hole 24;

Please refer to FIG. 11 , the light sensor 50 is a single-package structure. The light sensor 50 receives visible light in ambient light, and detects the intensity of the visible light as a basis for controlling the display brightness of the display screen 90 .

Please refer to FIG. 1 and FIG. 11 , the imaging module 60 may be one or both of the visible light camera 61 and the infrared light camera 62 . The imaging module 60 includes a lens base 63 , a lens barrel 64 and an image sensor 65 . The lens barrel 64 is installed on the lens holder 63 , and the image sensor 65 is accommodated in the lens holder 63 . The lens mount 63 includes a mounting surface 631 located between the lens barrel 64 and the image sensor 65 . In the embodiment shown in FIG. 11 , the photoreceptor 50 is disposed on the installation surface 631. Specifically, the orthographic projection of the photoreceptor 50 on the plane where the installation surface 631 is located at least partially falls on the installation surface 631, so, The photoreceptor 50 and the imaging module 60 are arranged relatively compactly, and the horizontal space occupied by them is relatively small.

Please refer to FIG. 1 , the receiver 70 is used to emit a sound wave signal when being excited by a power source, and the user can communicate through the receiver 70 . The structured light projector 80 is used for emitting structured light outwards, and the structured light is reflected after being projected on the object to be measured. The reflected structured light can be received by the infrared camera 62, and the processor of the electronic device 100 further analyzes it by the infrared camera 62. The received structured light is used to obtain the depth information of the measured object.

In the embodiment shown in FIG. 1 , the imaging module 60 includes a visible light camera 61 and an infrared light camera 62, the center of the input and output module 10, the infrared light camera 62, the visible light camera 61, the receiver 70 and the structured light projector 80 on the same line segment. Specifically, from one end of the line segment to the other end are input and output module 10, structured light projector 80, receiver 70, infrared light camera 62, visible light camera 61 (as shown in Figure 12), at this time, visible light camera 61 and The infrared camera 62 can form a dual-camera (as shown in Figure 21); or from one end of the line segment to the other end, there are input and output modules 10, an infrared camera 62, a receiver 70, a visible light camera 61, and a structured light projector 80. (as shown in Figure 1); or from one end of the line segment to the other end are followed by infrared light camera 62, input and output module 10, receiver 70, visible light camera 61, structured light projector 80; or from one end of the line segment to the other end The sequence is an infrared light camera 62, a visible light camera 61, a receiver 70, an input and output module 10, and a structured light projector 80. At this time, the visible light camera 61 and the infrared light camera 62 can form a dual-camera (as shown in FIG. 21 ). Of course, the arrangement of the input and output module 10, the infrared camera 62, the receiver 70, the visible light camera 61, and the structured light projector 80 is not limited to the above-mentioned examples, and there may be others, for example, the centers of the electronic components are arranged in a circular arc Shape, the center is arranged into a rectangle and other shapes.

Further, please refer to FIG. 11 , the light sensor 50 can be arranged on the installation surface 631 of the infrared light camera 62, or can be arranged on the installation surface 631 of the visible light camera 61. Of course, the light sensor 50 can also not be arranged on the installation surface 631 On the surface 631 , for example, the photoreceptor 50 may be disposed adjacent to the input-output module 10 , or disposed adjacent to the receiver 70 , which is not limited here.

To sum up, the electronic device 100 and the input/output module 10 according to the embodiment of the present invention can be used for proximity infrared distance measurement when the first infrared light source 12 and the proximity sensor 1a are turned on, and when the first infrared light source 12 and the second infrared light source 13 are turned on at the same time , can be used for infrared supplementary light, in other words, the first infrared light source 12, the second infrared light source 13 and the proximity sensor 1a are integrated into a single package structure, so that the input and output module 10 integrates the functions of emitting and receiving infrared light for infrared distance measurement function, and the function of infrared fill light. In addition, the first infrared light source 12, the second infrared light source 13 and the proximity sensor 1a are integrated into a single package structure, the integration of the input and output module 10 is relatively high, and the volume is small. The space of the function of optical and infrared ranging. In addition, since the first infrared light source 12, the second infrared light source 13, and the proximity sensor 1a are all carried on the same packaging substrate 111, compared with the traditional infrared supplementary light, the proximity infrared light, and the proximity sensor 1a, it is necessary to use The manufacturing of different wafers is combined on the PCB substrate for packaging, which improves the packaging efficiency.

Please refer to FIG. 5 again. In some embodiments, the input/output module 10 further includes a light source lens 18 and a proximity sensor lens 1b. The light source lens 18 is disposed in the package housing 11 and corresponds to the first infrared light source 12 and the second infrared light source 13 . The proximity sensor lens 1b is disposed in the package case 11 and corresponds to the proximity sensor 1a. The infrared light emitted by the first infrared light source 12 and the second infrared light source 13 is converged into the light-emitting window 1131 under the action of the light source lens 18 to emit, reducing the amount of light emitted to other areas of the package side wall 112 and the package top 113, only need to meet The field angle α of the infrared light used for supplementary light emitted by the first infrared light source 12 and the second infrared light source 13 after passing through the light source lens 18 is 60 degrees-90 degrees, and the infrared light emitted by the first infrared light source 12 is used for infrared distance measurement. The field angle β of the infrared light after passing through the light source lens 18 is 10°-30°. Similarly, when the infrared light reflected by the object entering through the proximity sensing window 1132 is incident on the proximity sensing lens 1b, the proximity sensing lens 1b will converge the infrared light to the proximity sensor 1a, reducing the transmission of infrared light to the proximity sensor. Amount of light in areas other than 1a. Specifically, the light source lens 18 and the proximity sensing lens 1b can be located on a transparent base, more specifically, the light source lens 18 and the proximity sensing lens 1b can be integrally formed with the transparent base. Certainly, the input-output module 10 may also only be provided with one of the light source lens 18 and the proximity sensor lens 1b; or, the input-output module 10 may not be provided with the light source lens 18 and the proximity sensor lens 1b.

Please refer to FIG. 5. In some embodiments, the input and output module 10 further includes a metal shielding plate 1d, and the metal shielding plate 1d is located in the package housing 11 and between the second infrared light source 13 and the proximity sensor 1a. In other words, The first infrared light source 12 and the second infrared light source 13 are located on one side of the metal shielding plate 1d, and the proximity sensor 1a is located on the other side of the metal shielding plate 1d. The metal shielding plate 1d is located between the second infrared light source 13 and the proximity sensor 1a, which can prevent the infrared rays initially emitted by the first infrared light source 12 and the second infrared light source 13 from incident on the proximity sensor 1a, and can also shield the first infrared light source 12 and the proximity sensor 1a, and shield the electromagnetic interference between the second infrared light source 13 and the proximity sensor 1a.

Please refer to FIG. 13 , in some embodiments, the I/O module 10 further includes an optical enclosure 19 . The optical enclosure 19 is made of light-transmitting material, and the optical enclosure 19 is formed on the packaging substrate 111 and located in the packaging casing 11 . The optical enclosure 19 covers the first infrared light source 12, the second infrared light source 13 and the proximity sensor 1a. Specifically, the optical encapsulation 19 can be formed by a glue injection molding process, the optical encapsulation 19 can be made of transparent thermosetting epoxy resin, so that it is not easy to soften during use, and the optical encapsulation 19 can fix the first infrared light source 12 , the relative position between the second infrared light source 13 and the proximity sensor 1a, and make the first infrared light source 12, the second infrared light source 13 and the proximity sensor 1a difficult to shake in the package housing 11.

Please refer to FIG. 13 , in some embodiments, the input-output module 10 further includes a light-exit partition 1e, which is formed in the optical enclosure 19 and located between the second infrared light source 13 and the proximity sensor 1a. The light-emitting partition 1e can block the infrared light emitted by the first infrared light source 12 and the second infrared light source 13 from incident on the proximity sensor 1a, and block the infrared light entering from the proximity sensing window 1132 and shooting to the proximity sensor 1a from affecting the first infrared light source 12 and the second infrared light source 13. Lighting of an infrared light source 12 and a second infrared light source 13 .

Please refer to FIG. 11 , in some implementations, the photoreceptor 50 of the above implementations may be disposed on the mounting surface 631 of the mirror base 63 . The mirror mount 63 may be the mirror mount 63 of the infrared camera 62 , or the mirror mount 63 of the visible light camera 61 .

Please refer to FIG. 14 , in some embodiments, the casing 20 is also provided with a casing sound hole (not shown), the cover plate 30 is also provided with a cover plate sound hole 34, and the receiver 70 and the cover plate sound hole 34 corresponds to the position of the casing sound hole. The centers of the input and output module 10 , the infrared camera 62 , the visible light camera 61 and the structured light projector 80 are located on the same line segment, and the receiver 70 is located between the line segment and the top 21 of the casing 20 .

The center of the receiver 70 is not located on the line segment, which saves the horizontal space occupied by the electronic components (input and output module 10, infrared camera 62, visible light camera 61, structured light projector 80, etc.) on the cover plate 30. In the embodiment shown in FIG. 14 , the sound outlet hole 34 of the cover plate is opened at the edge of the cover plate 30 , and the sound outlet hole of the casing is opened near the top 21 .

Please refer to FIG. 15 again. In some embodiments, the cover plate 30 may also be provided with a cover plate light source through hole 33, the cover plate light source through hole 33 corresponds to the casing light source through hole 23, the first infrared light source 12 and the second infrared light source The infrared light emitted by the two infrared light sources 13 can pass through the light source through hole 23 of the casing and exit the electronic device 100 through the light source through hole 33 of the cover plate.

Please refer to FIG. 16 , in some embodiments, the cover plate 30 can also be provided with a cover plate proximity sensing through hole 35, the cover plate proximity sensing through hole 35 is the same as the casing proximity sensing through hole 24 and the proximity sensor 1a. Correspondingly, the infrared light reflected by objects outside the electronic device 100 can be incident on the proximity sensor 1 a after passing through the proximity sensing through hole 35 of the cover plate and the proximity sensing through hole 24 of the casing.

Please refer to FIG. 17 , in some embodiments, the imaging module 60 further includes a substrate 66 on which the image sensor 65 is disposed, and the photoreceptor 50 can also be fixed on the substrate 66 . Specifically, the substrate 66 is provided with an FPC, a part of the substrate 66 is located in the mirror seat 63, and the other part protrudes from the mirror seat 63, one end of the FPC is located in the mirror seat 63 and is used to carry the image sensor 65, and the other end can be connected to the mirror seat 63. The mainboard of the electronic device 100 is connected. When the photoreceptor 50 is arranged on the substrate 66 , the photoreceptor 50 is arranged outside the mirror base 63 , and the photoreceptor 50 can also be connected to the FPC.

The imaging module 60 can be one or both of the visible light camera 61 and the infrared light camera 62 . Specifically, the light sensor 50 can be fixed on the substrate 66 of the visible light camera 61 ; the light sensor 50 can be fixed on the substrate 66 of the infrared light camera 62 . Further, the substrate 66 also includes a reinforcing plate, which is arranged on the side opposite to the photoreceptor 50 to increase the overall strength of the substrate 66, so that the FPC is not easy to be bent, and the photoreceptor 50 is arranged on the substrate. It is not easy to shake when it is on the 66. In an example, the photoreceptor 50 can also be fixed on the outer wall of the mirror base 63 , for example, fixed on the outer wall of the mirror base 63 by bonding.

Please refer to FIG. 18 , in some embodiments, the electronic device 100 and the imaging module 60 of the above embodiments can be replaced with the following structure: the imaging module 60 includes an image sensor 65 , a camera housing 67 and a lens module 68 . The top surface 670 of the camera housing 67 is a stepped surface, and the top surface 670 includes a first sub-top surface 671, a second sub-top surface 672, and a third sub-top surface 673, and the second sub-top surface 672 and the first sub-top surface 671 is obliquely connected and forms a cutout 675 with the first sub-top surface 671, the third sub-top surface 673 is obliquely connected with the second sub-top surface 672, and the second sub-top surface 672 is located between the first sub-top surface 671 and the third sub-top surface 673 to connect the first sub-top surface 671 and the third sub-top surface 673 . The included angle between the second sub-top surface 672 and the first sub-top surface 671 may be an obtuse angle or a right angle, and the included angle between the second sub-top surface 672 and the third sub-top surface 673 may be an obtuse angle or a right angle. The cutout 675 is opened on one end of the camera housing 67 , that is to say, the cutout 675 is located at the edge of the top surface 670 . The third sub-top surface 673 defines a light exit hole 674 , and the lens module 68 is accommodated in the camera housing 67 and corresponds to the light exit hole 674 . The image sensor 65 is accommodated in the camera housing 67 and corresponds to the lens module 68. The light outside the electronic device 100 can pass through the light exit hole 674 and the lens module 68 and be transmitted to the image sensor 65. The image sensor 65 transmits the light signal converted into an electrical signal. The photoreceptor 50 is disposed at the first sub-top surface 671 . In this embodiment, the imaging module 60 may be a visible light camera 61, and the light sensor 50 has a single-package structure. In other embodiments, the imaging module 60 may be an infrared camera 62 .

The imaging module 60 of this embodiment is provided with a cutout 675, and the photoreceptor 50 is arranged on the first sub-top surface 671, so that the photoreceptor 50 and the imaging module 60 are arranged more compactly, and the horizontal space occupied by the two together The space is small, saving the installation space in the electronic device 100 .

Please continue to refer to FIG. 18 , in some embodiments, the photoreceptor 50 of the above embodiment is disposed on the first sub-top surface 671 and outside the camera housing 67 , specifically, the entire photoreceptor 50 is vertically The projections of the first sub-top surface 671 can all be located in the first sub-top surface 671 (as shown in Figure 18); or, part of the photoreceptor 50 is located on the first sub-top surface along the projection perpendicular to the first sub-top surface 671 Within 671. That is to say, at least a part of the photoreceptor 50 is located directly above the first sub-top surface 671. In this way, the photoreceptor 50 and the imaging module 60 are arranged more compactly, and the horizontal space occupied by the two is small, further saving The installation space in the electronic device 100 is reduced.

Please refer to FIG. 19 , the first sub-top surface 671 of the above embodiment is provided with a light-transmitting hole 676 , and the light sensor 50 is located in the camera housing 67 and corresponds to the light-transmitting hole 676 . The light outside the electronic device 100 can pass through the light hole 676 and be transmitted to the light sensor 50 . The light sensor 50 of this embodiment is arranged in the camera casing 67 , which makes the structure of the light sensor 50 and the camera casing 67 more stable and facilitates the installation of the light sensor 50 and the imaging module 60 on the casing 20 .

Please refer to FIG. 20 , in some embodiments, the first sub-top surface 671 of the above embodiment is provided with a light-transmitting hole 676 , and the light sensor 50 is located in the camera housing 67 and corresponds to the light-transmitting hole 676 . The imaging module 60 also includes a substrate 66 on which the image sensor 65 is disposed. The photoreceptor 50 can also be fixed on the substrate 66 and accommodated in the camera housing 67 . Specifically, an FPC is disposed on the substrate 66 , one end of the FPC is located in the camera housing 67 and used to carry the image sensor 65 , and the other end of the FPC can be connected to the main board of the electronic device 100 . In other embodiments, the photosensor 50 can also be connected to the FPC. The light sensor 50 of this embodiment is arranged in the camera housing 67, so that the structure of the light sensor 50 and the camera housing 67 is more stable and facilitates the installation of the light sensor 50 and the imaging module 60 on the casing 20; , the imaging module 60 is provided with a substrate 66 and the photoreceptor 50 is arranged on the substrate 66 , so that the photoreceptor 50 can be stably installed in the camera housing 67 .

Please refer to FIG. 21 , in some embodiments, the electronic device 100 and the imaging module 60 of the above embodiments can be replaced with the following structure: the imaging module 60 is a dual-camera module, including two image sensors 65, a camera housing 67 and two lens modules 68. The top surface 670 of the camera housing 67 is a stepped surface, and the top surface 670 includes a first stepped surface 677 , a second stepped surface 678 lower than the first stepped surface 677 , and a first connecting surface 679 a. The first connecting surface 679a is obliquely connected to the second stepped surface 678 and forms a cutout 675 with the second stepped surface 678, the first connecting surface 679a is obliquely connected to the first stepped surface 677, and the first connecting surface 679a is located between the first stepped surface 677 and the first stepped surface 677. The second stair surface 678 is connected to the first stair surface 677 and the second stair surface 678 . The included angle between the first connecting surface 679a and the first stepped surface 677 may be an obtuse angle or a right angle, and the included angle between the first connecting surface 679a and the second stepped surface 678 may be an obtuse angle or a right angle. The cutout 675 is opened on one end of the camera housing 67 , that is to say, the cutout 675 is located at the edge of the top surface 670 . The two light exit holes 674 are both set on the first stepped surface 677 and located on the same side of the cutout 675 , and the line connecting the centers of the two light exit holes 674 is perpendicular to the extending direction of the cutout 675 . The two lens modules 68 are accommodated in the camera housing 67 and correspond to the two light exit holes 674 respectively, the two image sensors 65 are accommodated in the camera housing 67 and correspond to the two lens modules 68 respectively, and the electronic device The light outside 100 can pass through the light exit hole 674 and the lens module 68 and be transmitted to the image sensor 65 . In this embodiment, the imaging module 60 may be a visible light camera 61 , and at this time, the two lens modules 68 are lens modules corresponding to the visible light camera 61 . The light sensor 50 is disposed on the second step surface 678 and outside the camera housing 67 . The photoreceptor 50 is a single package structure. In other embodiments, the imaging module 60 may be an infrared camera 62 , and at this time, the two lens modules 68 are lens modules corresponding to the infrared camera 62 . In yet another embodiment, the imaging module 60 includes a visible light camera 61 and an infrared light camera 62. At this time, one of the lens modules 68 is a lens module corresponding to the infrared light camera 62, and the other lens module 68 is a visible light camera 61. Corresponding lens module.

The imaging module 60 of this embodiment is provided with a cutout 675, and the photoreceptor 50 is arranged on the second step surface 678, so that the photoreceptor 50 and the imaging module 60 are arranged more compactly, and the horizontal space occupied by both Smaller, saving the installation space in the electronic device 100 .

Please refer to FIG. 22 , in some embodiments, the slit 675 of the above embodiment is provided at the middle position of the top surface 670, and the first step surface 677 is separated into a first sub-step surface 677a and a second sub-step surface by the notch 675. 677b, the first sub-step surface 677a and the second sub-step surface 677b are respectively located on opposite sides of the cutout 675, and two light-emitting through holes 674 are opened on the first sub-step surface 677a and the second sub-step surface 677b respectively, and are installed on the The lens module 68 inside the camera housing 67 is also located on opposite sides of the cutout 675 . At this time, the cutout 675 is surrounded by the second step surface 678, the first connecting surface 679a and the second connecting surface 679b, and the first connecting surface 679a obliquely connects the first sub-top surface 677a and the second step surface 678 and is located on the first sub-top surface 677a. Between the top surface 677 a and the second step surface 678 , the second connecting surface 679 b obliquely connects the second sub-top surface 677 b and the second step surface 678 and is located between the second sub-top surface 677 b and the second step surface 678 . In this embodiment, the first step surface 677 is parallel to the second step surface 678, the angle between the first connection surface 679a and the first sub-step surface 677a is an obtuse angle, and the angle between the second connection surface 679b and the second sub-step surface 677b The angle is obtuse. In other embodiments, the included angle between the first connecting surface 679a and the first sub-step surface 677a is a right angle, and the included angle between the second connecting surface 679b and the second sub-step surface 677b is a right angle. Compared with setting the cutout 675 at the edge of the top surface 670, setting the cutout 675 in the middle of the top surface 670 in this embodiment can make the width of the cutout 675 wider, thereby facilitating the installation of the photoreceptor 50 on the second stepped surface. 678 on.

Please refer to FIG. 21 and FIG. 22 , in some embodiments, the light sensor 50 of the above embodiments is disposed on the second step surface 678 and located outside the camera housing 67 . Specifically, when the cutout 675 is set at the edge position of the top surface 670, the entire photoreceptor 50 can be located in the second step surface 678 along the projection perpendicular to the second step surface 678; The projection on the second step surface 678 is located inside the second step surface 678 . That is to say, at least a part of the photoreceptor 50 is located directly above the second stepped surface 678 . When the cutout 675 is set in the middle of the top surface 670 , the projection of the entire photoreceptor 50 perpendicular to the second stepped surface 678 can be located in the second stepped surface 678 (as shown in FIGS. 21 and 22 ). In this way, the photoreceptor 50 and the imaging module 60 are arranged more compactly, and the horizontal space occupied by them together is smaller, which further saves the installation space in the electronic device 100 .

Please refer to FIG. 23 , the second step surface 678 of the above embodiment is provided with a light-transmitting hole 676 , and the light sensor 50 is located in the camera housing 67 and corresponds to the light-transmitting hole 676 . The light outside the electronic device 100 can pass through the light hole 676 and be transmitted to the light sensor 50 . The light sensor 50 of this embodiment is arranged in the camera casing 67 , which makes the structure of the light sensor 50 and the camera casing 67 more stable and facilitates the installation of the light sensor 50 and the imaging module 60 on the casing 20 .

Please continue to refer to FIG. 24 , in some embodiments, the second step surface 678 of the above embodiment is provided with a light-transmitting hole 676 , and the light sensor 50 is located in the camera housing 67 and corresponds to the light-transmitting hole 676 . The imaging module 60 also includes a substrate 66 on which the image sensor 65 is disposed. The photoreceptor 50 can also be fixed on the substrate 66 and accommodated in the camera housing 67 . Specifically, an FPC is disposed on the substrate 66 , one end of the FPC is located in the camera housing 67 and used to carry the image sensor 65 , and the other end of the FPC can be connected to the main board of the electronic device 100 . In other embodiments, the photosensor 50 can also be connected to the FPC.

The light sensor 50 of this embodiment is arranged in the camera housing 67, so that the structure of the light sensor 50 and the camera housing 67 is more stable and facilitates the installation of the light sensor 50 and the imaging module 60 on the casing 20; , the imaging module 60 is provided with a substrate 66 and the photoreceptor 50 is arranged on the substrate 66 , so that the photoreceptor 50 can be stably installed in the camera housing 67 .

In the description of this specification, references to the terms "certain embodiments," "one embodiment," "some embodiments," "exemplary embodiments," "examples," "specific examples," or "some examples" To describe means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the described specific features, structures, materials or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include at least one of said features. In the description of the present invention, "plurality" means at least two, such as two, three, unless otherwise specifically defined.

Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present invention, those skilled in the art can make the above-mentioned The embodiments are subject to changes, modifications, substitutions and variations, the scope of the present invention is defined by the claims and their equivalents.

Claims (17)

1. An input and output module, characterized in that, the input and output module includes a package housing, a first infrared light source, a second infrared light source arranged around the first infrared light source, and a proximity sensor, the package The casing includes a packaging substrate, the first infrared light source, the second infrared light source and the proximity sensor are all packaged in the packaging casing and carried on the packaging substrate, when the second infrared light source is turned off, When the first infrared light source emits infrared light to the outside of the packaging casing with the first power, the input and output module is used for infrared distance measurement; when both the first infrared light source and the second infrared light source are turned on and When the infrared light is emitted out of the package shell with the second power, the input and output module is used for infrared supplementary light; the proximity sensor is used for receiving the infrared light reflected by the object to detect the distance of the object. 2. The input and output module according to claim 1, characterized in that, The first infrared light source is a point light source, and the second infrared light source is a point light source and the number is multiple; or The first infrared light source is a point light source, and the second infrared light source is a ring light source; or The first infrared light source is a plurality of ring-shaped point light sources, and the second infrared light source is a ring-shaped light source; or The first infrared light source is a plurality of circular point light sources, and the second infrared light source is a plurality of point light sources; or The first infrared light source is a ring light source; the second infrared light source is a point light source and the number is multiple; or The first infrared light source is a ring light source; the second infrared light source is a ring light source. 3. The input-output module according to claim 1, wherein the input-output module further comprises a chip, and the first infrared light source, the second infrared light source, and the proximity sensor are all formed on a piece of the chip. 4. The input-output module according to claim 3, wherein the package housing further comprises a package side wall and a package top, and the package side wall extends from the package substrate and is connected to the package top Between the package substrate and the package top, a light-emitting window and a proximity sensing window are formed, the light-emitting window corresponds to the first infrared light source and the second infrared light source, and the proximity sensing window corresponds to the corresponding to the proximity sensor described above. 5. The input-output module according to claim 3, characterized in that, the input-output module further comprises a light source lens, the light source lens is arranged in the package housing and is connected to the first infrared light source and the corresponding to the second infrared light source; and/or The input-output module further includes a proximity sensing lens, which is disposed in the package housing and corresponds to the proximity sensor. 6. The input-output module according to claim 3, characterized in that, the input-output module further comprises a light source lens and a proximity sensing lens disposed in the package housing, the light source lens and the first An infrared light source corresponds to the second infrared light source, the proximity sensing lens corresponds to the proximity sensor, and the light source lens and the proximity sensing lens are located on the same transparent substrate. 7. The input-output module according to claim 1, characterized in that, the input-output module further comprises a metal shielding plate, the metal shielding plate is located in the package housing and is located between the second infrared light source and between the proximity sensors. 8. The input-output module according to claim 1, wherein the input-output module further comprises an optical enclosure made of a light-transmitting material, the optical enclosure is formed on the packaging substrate and Located in the package housing, the optical enclosure wraps the first infrared light source, the second infrared light source, and the proximity sensor. 9. The input-output module according to claim 8, characterized in that, the input-output module further comprises a light-emitting partition, and the light-emitting partition is formed in the optical enclosure and located in the second infrared between the light source and the proximity sensor. 10. The input-output module according to any one of claims 1-9, characterized in that, the input-output module is formed with a ground pin, a supplementary light pin, a proximity light pin and a proximity sensor pin, when the ground pin and the proximity light pin are enabled, the first infrared light source emits infrared light; when the ground pin and the fill light pin are enabled, the The first infrared light source and the second infrared light source emit infrared light; when the ground pin and the proximity sensing pin are enabled, the proximity sensor receives the infrared light reflected by the object to detect the distance of the object . 11. An electronic device, characterized in that the electronic device comprises: A casing and the input-output module according to any one of claims 1-10, wherein the input-output module is arranged in the casing. 12. The electronic device according to claim 11, characterized in that, the electronic device further comprises a light-transmitting cover plate, and the casing is provided with an organic casing light source through hole and a casing proximity sensing through hole, and the The first infrared light source and the second infrared light source correspond to the light source through hole of the casing, the proximity sensor corresponds to the proximity sensing through hole of the casing, and the cover plate is arranged on the casing. 13. The electronic device according to claim 11, characterized in that, the electronic device further comprises a light-transmitting cover plate, and the casing is provided with an organic casing light source through hole and a casing proximity sensing through hole, and the The first infrared light source and the second infrared light source correspond to the light source through hole of the casing, the proximity sensor corresponds to the proximity sensing through hole of the casing, the cover plate is arranged on the casing, and Infrared transparent ink that only transmits infrared light is formed on the combined surface of the cover plate and the casing, and the infrared transparent ink blocks the light source through hole of the casing and the proximity sensor through hole of the casing at least one. 14. The electronic device according to claim 11, characterized in that, the electronic device further comprises a photoreceptor and an imaging module, and the imaging module comprises a mirror base, a lens barrel mounted on the mirror base, and an image sensor accommodated in the mirror seat, the mirror seat includes a mounting surface between the lens barrel and the image sensor, and the light sensor is arranged on the mounting surface. 15. The electronic device according to claim 11, wherein the electronic device further comprises an imaging module and a light sensor, the imaging module is installed on the housing, and the imaging module includes a camera Housing and lens module, the top surface of the camera housing is a stepped surface and includes a connected first sub-top surface and a second sub-top surface, and the second sub-top surface is inclined relative to the first sub-top surface And form a cutout with the first sub-top surface, the top surface is provided with a light exit hole, the lens module is accommodated in the camera housing and corresponds to the light exit hole, and the photosensor is arranged on at the first sub-top surface. 16. The electronic device according to claim 11, wherein the electronic device further comprises an imaging module and a light sensor, the imaging module includes a camera housing and two lens modules, and the camera housing A cutout is provided on the top surface of the body to form a stepped top surface, the top surface includes a first stepped surface and a second stepped surface lower than the first stepped surface, and two Each of the light exit holes corresponds to the lens module, and the light sensor is arranged on the second step surface. 17. The electronic device according to claim 11, further comprising an imaging module and a photoreceptor, the imaging module comprising a mirror base, a lens barrel mounted on the mirror base, and The substrate is partly arranged in the mirror seat, and the photoreceptor is arranged on the substrate.