CN108040147A - Input/output module and electronic device - Google Patents

Abstract

The invention discloses an electronic device and an input/output module, which comprise a packaging shell, an infrared lamp, a light guide element and a proximity sensor, wherein the packaging shell comprises a packaging substrate, the infrared lamp, the light guide element and the proximity sensor are all packaged in the packaging shell, the infrared lamp and the proximity sensor are all carried on the packaging substrate, the light guide element can be movably arranged on a light emitting light path of the infrared lamp, and when the light guide element is positioned on the light emitting light path of the infrared lamp, infrared light emitted by the infrared lamp is emitted from the packaging shell at a first view angle to serve as an infrared light supplement lamp or a proximity infrared lamp; when the light guide element leaves the light emitting light path of the infrared lamp, infrared light emitted by the infrared lamp is emitted from the packaging shell at a second viewing angle to be used as a near infrared lamp or an infrared light supplement lamp; the proximity sensor is used for receiving infrared light reflected by an object to detect the distance of the object. The input and output module has higher integration level and smaller volume, thereby saving the space for realizing the functions of infrared distance measurement and infrared light supplement.

Description

I/O modules and electronics

technical field

The invention relates to the technical field of consumer electronics, and more specifically, to an input and output module and an electronic device.

Background technique

As the functions supported by mobile phones become more and more diverse, the types and quantities of functional devices that need to be installed on mobile phones are also increasing. In order to realize functions such as distance detection, ambient light detection and user's facial 3D feature recognition, it is necessary Functional devices such as proximity sensors, ambient light sensors, infrared cameras, and structured light projectors are configured in the mobile phone, but in order to arrange many functional devices, it will take up too much space on the mobile phone.

Contents of the invention

Embodiments of the present invention provide an input and output module and an electronic device.

The input and output module according to the embodiment of the present invention includes a package housing, an infrared lamp, a light guide element, and a proximity sensor. The package housing includes a package substrate, and the infrared lamp, the light guide element, and the proximity sensor are all Packaged in the packaging case, the infrared lamp and the proximity sensor are both carried on the packaging substrate, the light guide element is movably arranged on the light emitting path of the infrared lamp, when the light guide When the element is located on the light emitting path of the infrared lamp, the infrared light emitted by the infrared lamp emerges from the package casing at a first viewing angle as an infrared supplementary light or close to the infrared lamp; when the light guide element When leaving the light-emitting light path of the infrared lamp, the infrared light emitted by the infrared lamp is emitted from the packaging shell at a second field of view as a proximity infrared lamp or an infrared supplementary light; the proximity sensor is used to receive Infrared light reflected by an object to detect the distance to the object.

In some embodiments, the light guide element includes a convex lens or a lens group with positive refractive power. When the light guide element is located on the light emitting path of the infrared lamp, the infrared light emitted by the infrared lamp is in the first A field of view emerges from the package housing as a near-infrared lamp; when the light guide element leaves the light-emitting light path of the infrared lamp, the infrared light emitted by the infrared lamp passes through the infrared light at a second field of view emit from the above-mentioned encapsulation shell as an infrared supplementary light; or

The light guide element includes a concave lens or a lens group with negative refractive power. When the light guide element is located on the light emitting path of the infrared lamp, the infrared light emitted by the infrared lamp is emitted from the infrared light at the first viewing angle. The package shell emits as an infrared supplementary light; when the light guide element leaves the light-emitting light path of the infrared lamp, the infrared light emitted by the infrared lamp exits the package shell at a second viewing angle as a near-infrared lamp.

In some embodiments, the input and output module further includes a chip, and both the infrared lamp and the proximity sensor are formed on the chip.

In some embodiments, the package housing further includes a package side wall and a package top, the package side wall extends from the package substrate and is connected between the package top and the package substrate, the package A light-emitting window and a proximity sensing window are formed on the top, the light-emitting window corresponds to the infrared lamp, and the proximity sensing window corresponds to the proximity sensor.

In some embodiments, the input-output module further includes a proximity sensing lens, which is disposed in the package housing and corresponds to the proximity sensor.

In some embodiments, the input and output module further includes a metal shielding plate, and the metal shielding plate is located in the package housing and between the infrared lamp and the proximity sensor.

In some embodiments, the input-output module further includes an optical enclosure made of light-transmitting material, the optical enclosure is formed on the packaging substrate and located in the packaging housing, the optical enclosure A cover encloses the infrared lamp and the proximity sensor.

In some embodiments, the input-output module further includes a light-exit partition formed in the optical enclosure and located between the infrared lamp and the proximity sensor.

In some embodiments, a ground pin, an infrared light pin, and a proximity sensing pin are formed on the input and output module, and when the ground pin and the infrared light pin are enabled, the The infrared light emits infrared light; when the ground pin and the proximity sensing pin are enabled, the proximity sensor receives the infrared light reflected by the object to detect the distance of the object.

An electronic device according to an embodiment of the present invention includes:

chassis; and

In the input-output module described in any one of the above-mentioned embodiments, the input-output module is arranged in the casing.

In some embodiments, the electronic device further includes a light-transmitting cover plate, and the casing is provided with a light source through hole of the casing and a proximity sensing hole of the casing, and the infrared lamp communicates with the light source of the casing. The holes correspond to each other, the proximity sensor corresponds to the proximity sensing through hole of the casing, and the cover plate is arranged on the casing.

In some embodiments, the electronic device further includes a light-transmitting cover plate, and the casing is provided with a light source through hole of the casing and a proximity sensing hole of the casing, and the infrared lamp communicates with the light source of the casing. The proximity sensor corresponds to the proximity sensing through hole of the casing, the cover plate is arranged on the casing, and the surface combined with the cover plate and the casing is formed with a surface that only transmits infrared light Infrared transparent ink, the infrared transparent ink blocks at least one of the light source through hole of the casing and the proximity sensing through hole of the casing.

In some embodiments, the electronic device further includes a photoreceptor and an imaging module, and the imaging module includes a mirror base, a lens barrel installed on the mirror base, and a For an image sensor, the mirror seat includes an installation surface between the lens barrel and the image sensor, and the photoreceptor is arranged on the installation surface.

In some embodiments, the imaging module includes at least one of a visible light camera and an infrared light camera.

In some embodiments, the electronic device further includes an infrared camera, a visible light camera, a receiver, and a structured light projector, the input and output module, the infrared camera, the visible light camera, the receiver and The center of the structured light projector is located on the same line segment, and the order from one end to the other end of the line segment is:

The input-output module, the structured light projector, the receiver, the infrared camera, the visible camera; or

The input-output module, the infrared camera, the receiver, the visible camera, the structured light projector; or

The infrared light camera, the input and output module, the receiver, the visible light camera, the structured light projector; or

The infrared camera, the visible camera, the receiver, the input and output module, and the structured light projector.

In some embodiments, the electronic device also includes a receiver, an infrared camera, a visible light camera, a structured light projector, and a light-transmitting cover plate. There is a cover plate sound hole, the position of the receiver corresponds to the position of the cover plate sound hole and the casing sound hole, the input and output module, the infrared camera, the visible light camera and the The center of the structured light projector is located on the same line segment, and the receiver is located between the line segment and the top of the casing.

In some embodiments, the electronic device further includes a photoreceptor and an imaging module, the imaging module is installed on the casing, the imaging module includes a mirror base, and is installed on the mirror base The lens barrel and the substrate partly arranged in the mirror seat; the photoreceptor is arranged on the substrate.

In some embodiments, the electronic device further includes an imaging module and a light sensor, the imaging module is installed on the housing, the imaging module includes a camera housing and a lens module, the The top surface of the camera housing is a stepped surface and includes a connected first sub-top surface and a second sub-top surface, and the second sub-top surface is inclined relative to the first sub-top surface and connected to the first sub-top surface. A cutout is formed, a light exit hole is opened on the top surface, the lens module is accommodated in the camera housing and corresponds to the light exit hole, and the light sensor is arranged on the first sub-top surface.

In some embodiments, the electronic device further includes an imaging module and a light sensor, the imaging module includes a camera housing and two lens modules, and a cutout is provided on the top surface of the camera housing to A stepped top surface is formed, the top surface includes a first stepped surface and a second stepped surface lower than the first stepped surface, and two light-emitting through holes are opened on the first stepped surface, each of the The light exit hole corresponds to the lens module, and the light sensor is arranged on the second step surface.

The electronic device and the input/output module according to the embodiment of the present invention can be used as a proximity infrared lamp or an infrared supplementary light by moving the position of the light guide element, and the infrared lamp, the light guide element and the proximity sensor are integrated into a single The package structure enables the input and output modules to integrate the functions of emitting and receiving infrared light for infrared distance measurement, and the function of infrared supplementary light. Secondly, compared with the current electronic device that needs to be equipped with both a proximity infrared lamp and an infrared supplementary light, the input and output module of the embodiment of the present invention only needs to install one infrared lamp, and has a smaller volume. Further, the infrared lamp and the proximity sensor are integrated into a single package structure, and the input and output modules have a high degree of integration and a small volume, and the input and output modules save space for the functions of infrared ranging and infrared supplementary light.

Additional aspects and advantages of embodiments of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of embodiments of the invention.

Description of drawings

The above and/or additional aspects and advantages of the present invention will become apparent and comprehensible from the description of the embodiments in conjunction with the following drawings, wherein:

FIG. 1 is a schematic structural diagram of an electronic device according to some embodiments of the present invention;

2 is a perspective view of an input and output module of an electronic device according to some embodiments of the present invention;

3 is a schematic diagram of the state of the input and output modules of the electronic device according to some embodiments of the present invention;

4 is a schematic diagram of the state of the input and output modules of the electronic device according to some embodiments of the present invention;

5 is a schematic cross-sectional view of an input-output module of an electronic device according to some embodiments of the present invention;

6 is a schematic cross-sectional view of an input-output module of an electronic device according to some embodiments of the present invention;

7 is a partial perspective view of an input and output module of an electronic device according to some embodiments of the present invention;

8 is a schematic cross-sectional view of an input-output module of an electronic device according to some embodiments of the present invention;

9 is a schematic perspective view of a photoreceptor and an imaging module of an electronic device according to some embodiments of the present invention;

Fig. 10 is a schematic diagram of arrangement of electronic components of an electronic device according to some embodiments of the present invention;

11 is a schematic cross-sectional view of an input-output module of an electronic device according to some embodiments of the present invention;

Fig. 12 is a schematic structural diagram of an electronic device according to some embodiments of the present invention;

13 is a partial cross-sectional schematic view of an electronic device according to some embodiments of the present invention;

14 is a partial cross-sectional schematic view of an electronic device according to some embodiments of the present invention;

15 to 22 are three-dimensional schematic diagrams of a light sensor and an imaging module of an electronic device according to some embodiments of the present invention.

Detailed ways

Embodiments of the present invention will be further described below in conjunction with the accompanying drawings. The same or similar reference numerals in the drawings represent the same or similar elements or elements having the same or similar functions throughout.

In addition, the embodiments of the present invention described below in conjunction with the accompanying drawings are exemplary, and are only used to explain the embodiments of the present invention, and should not be construed as limiting the present invention.

In the present invention, unless otherwise clearly specified and limited, the first feature may be in direct contact with the first feature or the first and second feature may be in direct contact with the second feature through an intermediary. touch. Moreover, "above", "above" and "above" the first feature on the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. "Below", "beneath" and "beneath" the first feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is less horizontally than the second feature.

Referring to FIG. 1 , an electronic device 100 according to an embodiment of the present invention includes a housing 20 , a cover 30 and electronic components. The electronic components include an input and output module 10 , a light sensor 50 (as shown in FIG. 9 ), an imaging module 60 (as shown in FIG. 9 ), a receiver 70 and a structured light projector 80 . The electronic device 100 can be a mobile phone, a tablet computer, a notebook computer, a smart watch, a smart bracelet, an teller machine, etc. The embodiment of the present invention takes the electronic device 100 as an example for illustration. It can be understood that the specific form of the electronic device 100 can be other , without limitation here.

Please refer to FIG. 2 to FIG. 4 , the input and output module 10 is a single package structure, including a package housing 11 , an infrared lamp 12 , a light guide element 13 and a proximity sensor 1a.

The packaging case 11 is used to package the infrared lamp 12 , the light guide element 13 and the proximity sensor 1 a simultaneously, or in other words, the infrared lamp 12 , the light guide element 13 and the proximity sensor 1 a are packaged in the packaging case 11 at the same time. The package case 11 includes a package substrate 111 , a package sidewall 112 and a package top 113 . The packaging case 11 can be made of electromagnetic interference (Electromagnetic Interference, EMI) shielding material, so as to prevent external electromagnetic interference from affecting the input and output module 10 .

Please refer to FIG. 5 , the packaging substrate 111 is used to carry the infrared lamp 12 and the proximity sensor 1a at the same time. When manufacturing the input-output module 10, the infrared lamp 12 and the proximity sensor 1a can be formed on a chip 14, and then the infrared lamp 12, the proximity sensor 1a and the chip 14 can be arranged on the packaging substrate 111 together. Specifically, the The chip 14 is bonded on the packaging substrate 111 . At the same time, the packaging substrate 111 can also be used to connect with other components of the electronic device 100 (such as the casing 20 of the electronic device 100 , the main board, etc.), so as to fix the input-output module 10 in the electronic device 100 . Both the infrared lamp 12 and the proximity sensor 1a can be formed on one chip 14, further reducing the integrated volume of the infrared lamp 12 and the proximity sensor 1a, and the manufacturing process is relatively simple.

The package side wall 112 can be arranged around the infrared lamp 12, the light guide element 13 and the proximity sensor 1a. The package side wall 112 extends from the package substrate 111, and the package side wall 112 can be combined with the package substrate 111. Preferably, the package side wall 112 and The package substrate 111 is detachably connected, so that the infrared lamp 12 and the proximity sensor 1a can be repaired after the package side wall 112 is removed. The material of the package sidewall 112 may be a material that does not transmit infrared light, so as to prevent the infrared light emitted by the infrared lamp 12 from passing through the package sidewall 112 .

The package top 113 is opposite to the package substrate 111 , and the package top 113 is connected to the package sidewall 112 . The package top 113 is formed with a light-emitting window 1131 and a proximity sensing window 1132, the light-emitting window 1131 corresponds to the infrared lamp 12, and the infrared light emitted by the infrared lamp 12 passes through the light-emitting window 1131; the proximity sensing window 1132 corresponds to the proximity sensor 1a and is The infrared light reflected by the object can pass through the proximity sensing window 1132 and be incident on the proximity sensor 1a. The package top 113 and the package sidewall 112 can be formed integrally or separately. In one example, both the light-emitting window 1131 and the proximity sensing window 1132 are through holes, and the material of the package top 113 is a material that does not transmit infrared light and visible light. In another example, the package top 113 is made of a material that is not transparent to infrared light, a material that is transparent to infrared light, and a material that is not transparent to visible light. The other parts are made of materials that are impermeable to infrared light and visible light. Further, the light emitting window 1131 can be formed with a lens structure to improve the emission angle of infrared light emitted from the light emitting window 1131. For example, the light emitting window 1131 forms There is a concave lens structure, so that the light passing through the light emitting window 1131 is divergent and emitted outward; the light emitting window 1131 is formed with a convex lens structure, so that the light passing through the light emitting window 1131 is gathered and emitted outward; the proximity sensing window 1132 can also be formed with a lens structure to improve the infrared light emission angle incident from the proximity sensing window 1132, for example, the proximity sensing window 1132 has a convex lens structure so that the incident light from the proximity sensing window 1132 is gathered and projected onto the proximity sensor 1a.

The light guide element 13 is movably arranged on the light emitting path of the infrared lamp 12 . Please refer to FIG. 5 and FIG. 6 , the input-output module 10 further includes a driver 17 for driving the light guide element 13 to move so as to be movably arranged on the light emitting path of the infrared lamp 12 . Wherein, the drive member 17 drives the light guide element 13 to move so as to be movably arranged on the light emitting path of the infrared lamp 12, including: under normal conditions, the light guide element 13 is arranged on the light emitting path of the infrared lamp 12, and the infrared lamp 12 is used as an infrared lamp. Fill light (or close to infrared light), when infrared light 12 is used as close to infrared light (or infrared fill light), driver 17 drives light guide element 13 to move to leave the light-emitting light path of infrared light 12; or under normal conditions, The light guide element 13 is not arranged on the light-emitting light path of the infrared lamp 12, and the infrared lamp 12 is used as a near-infrared lamp (or an infrared supplementary light), and when the infrared lamp 12 is used as an infrared supplementary light (or near an infrared lamp), the driver 17 drives the light guide element 13 to move to the light emitting path of the infrared lamp 12 .

Please refer to FIG. 5 , the driver 17 includes a linear motor, the linear motor includes a stator 172 and a mover 174, the stator 172 is installed on the side wall 112 of the package, the mover 174 is connected to the light guide element 13, and the driver 17 drives the mover 174 to move To drive the light guide element 13 to move. Please refer to Fig. 6, the structure of the above-mentioned driving member 17 can be replaced by: the driving member 17 includes a linear motor, the linear motor includes a stator 172 and a mover 174, the stator 172 is installed on the package side wall 112, and the input and output module 10 also includes a rotating shaft 18 and the connecting arm 19, the first end of the connecting arm 19 is connected to the light guide element 13, the mover 174 is connected to the second end of the connecting arm 19 away from the light guiding element 13, the connecting arm 19 is sleeved on the rotating shaft 18, and the rotating shaft 18 Located between the light guide element 13 and the mover 174, the mover 174 of the linear motor drives the second end of the connecting arm 19 to move, and the connecting arm 19 rotates around the rotating shaft 18, thus, the first end of the connecting arm 19 drives the light guide The element 13 rotates around the rotating shaft 18 so that the light guide element 13 is on the light emitting path of the infrared lamp 12 or away from the light emitting path of the infrared lamp 12 . In an embodiment of the present invention, the input-output module 10 may also include a bearing plate (not shown in the figure), and a bearing hole is opened on the bearing plate, the light guide element 13 is installed in the bearing hole, and the driving member 17 is used to drive the bearing plate Move to drive the light guide element 13 to move.

Please refer to Fig. 3, when the light guide element 13 is located on the light-emitting light path of the infrared lamp 12, the infrared light emitted by the infrared lamp 12 passes through the light guide element 13, and under the action of the light guide element 13, the infrared rays from the package shell at the first viewing angle The body 11 emits as an infrared lamp; when the light guide element 13 leaves the light path of the infrared lamp 12, the infrared light emitted by the infrared lamp 12 exits from the package shell 11 at a second viewing angle as an infrared supplementary light, At this time, the first viewing angle is smaller than the second viewing angle, wherein the range of the first viewing angle is 10°-30°, for example, the first viewing angle is 10°, 15°, 20°, 25° , or 30 degrees, etc., the range of the second viewing angle is 60 degrees-90 degrees, for example, the second viewing angle is 60 degrees, 65 degrees, 70 degrees, 75 degrees, 80 degrees, 82 degrees, 85 degrees, 87 degrees degrees, or 90 degrees, etc. The light guide element 13 is used for converging light. The light guide element 13 includes a convex lens or a lens group with positive refractive power. The lens group can be one or more lenses. In the embodiment of the present invention, the viewing angle refers to the range covered by the infrared light passing through the light-emitting window 1131 and exiting the packaging case 11 .

Please refer to Fig. 4, when the light guide element 13 is located on the light-emitting light path of the infrared lamp 12, the infrared light emitted by the infrared lamp 12 passes through the light guide element 13, and under the action of the light guide element 13, the infrared rays from the package shell at the first viewing angle The body 11 emits as an infrared supplementary light; when the light guide element 13 leaves the light-emitting light path of the infrared lamp 12, the infrared light emitted by the infrared lamp 12 exits from the packaging shell 11 at a second viewing angle as a near-infrared lamp, At this time, the first viewing angle is greater than the second viewing angle, wherein the range of the first viewing angle is 60°-90°, for example, the first viewing angle is 60°, 65°, 70°, 75° , 80 degrees, 82 degrees, 85 degrees, 87 degrees, or 90 degrees, etc., the second field of view ranges from 10 degrees to 30 degrees, for example, the second field of view is 10 degrees, 15 degrees, 20 degrees, 25 degrees degrees, or 30 degrees, etc. The light guide element 13 is used for diverging light. The light guide element 13 includes a concave lens or a lens group with negative power, and the lens group can be one or more lenses. In the embodiment of the present invention, the viewing angle refers to the range covered by the infrared light passing through the light-emitting window 1131 and exiting the packaging case 11 .

When the infrared light 12 is turned on and used as an infrared supplementary light to emit infrared light to the outside of the package housing 11, the infrared light passes through the light-emitting window 1131 to project onto the surface of the object, and the infrared light camera 62 (as shown in FIG. 1 ) of the electronic device 100 receives the infrared light. The infrared light reflected by the object is used to obtain the image information of the object (at this time, the infrared lamp 12 is used for infrared supplementary light). When the infrared lamp 12 is turned on and used as a proximity infrared lamp to emit infrared light to the outside of the package housing 11, the infrared light passes through the light-emitting window 1131 and reaches the surface of the object, and the proximity sensor 1a of the electronic device 100 receives the infrared light reflected by the object to detect the arrival of the object. The distance of the electronic device 100 (in this case, the infrared lamp 12 is used for infrared distance measurement).

When the infrared lamp 12 is used as an infrared supplementary light and when it is used as a near-infrared lamp, it can emit infrared light to the outside of the package casing 11 with different powers. Specifically, when the infrared lamp 12 is used as a close-to-infrared lamp, it emits infrared light to the outside of the packaging casing 11 with a first power, and when the infrared lamp 12 is used as an infrared supplementary light, it emits infrared light to the outside of the packaging casing 11 with a second power. Wherein, the first power may be smaller than the second power.

The light sensor 50 (shown in FIG. 9 ) receives visible light in ambient light and detects the intensity of the visible light.

Please refer to FIG. 7 , in the embodiment of the present invention, a ground pin 1e, an infrared lamp pin 1f and a proximity sensing pin 1g are formed on the input/output module 10 . The ground pin 1e, the infrared lamp pin 1f and the proximity sensing pin 1g can all be formed on the package substrate 111. When the ground pin 1e and the infrared lamp pin 1f are enabled (that is, the ground pin 1e and the infrared When the lamp pin 1f is connected to the circuit and is turned on), the infrared lamp 12 emits infrared light; when the ground pin 1e, the proximity sensing pin 1g, and the infrared lamp pin 1f are enabled (that is, the ground pin 1e, When the proximity sensing pin 1g and the infrared lamp pin 1f are connected to the circuit, and the infrared lamp 12 is controlled to emit infrared light for infrared distance measurement, the proximity sensor 1a receives the infrared light reflected by the object to detect the distance of the object.

Referring to FIG. 1 and FIG. 8 , the casing 20 can be used as an installation carrier of the input-output module 10 , or in other words, the input-output module 10 can be set in the casing 20 . The casing 20 can be the casing of the electronic device 100. In the embodiment of the present invention, the display screen 90 of the electronic device 100 can also be arranged inside the casing 20. Since the input-output module 10 of the embodiment of the present invention occupies a small volume Therefore, the volume for setting the display screen 90 in the case 20 can be correspondingly increased, so as to increase the screen-to-body ratio of the electronic device 100 . Specifically, the casing 20 includes a top 21 and a bottom 22, and the display screen 90 and the input/output module 10 are arranged between the top 21 and the bottom 22. When the user normally uses the electronic device 100, the top 21 is located above the bottom 22. , as shown in FIG. 1 , the input and output module 10 may be disposed between the display screen 90 and the top 21 . In other embodiments, the display screen 90 may be a full screen with a gap, the display screen 90 surrounds the input and output module 10 , and the input and output module 10 is exposed from the gap of the display screen 90 .

The casing 20 also defines an organic casing light source through hole 23 and a casing proximity sensing through hole 24 . When the input-output module 10 is arranged in the casing 20 , the infrared lamp 12 corresponds to the light source through hole 23 of the casing, and the proximity sensor 1 a corresponds to the proximity sensing through hole 24 of the casing. Wherein the infrared lamp 12 corresponds to the light source through hole 23 of the casing, which means that the light emitted by the infrared lamp 12 can pass through the light source through hole 23 of the casing. Specifically, the infrared lamp 12 can be directly opposite to the light source through hole 23 of the casing, or The light emitted by the infrared lamp 12 passes through the light source through hole 23 of the casing after being acted on by the light guide element 13 . The proximity sensor 1a corresponds to the proximity sensor hole 24 of the casing, which means that the infrared light reflected by the object can pass through the proximity sensor hole 24 of the casing and be incident on the proximity sensor 1a. The casing proximity sensing through hole 24 is directly opposite, and the incident light of infrared light may pass through the casing proximity sensing through hole 24 and be incident on the proximity sensor 1a after being acted on by the light guide element. The light source through hole 23 of the casing and the proximity sensing through hole 24 of the casing may be spaced apart from each other. Of course, in other embodiments, the light source through hole 23 of the casing and the proximity sensing through hole 24 of the casing may also be connected to each other. .

The cover plate 30 may be transparent, and the material of the cover plate 30 may be transparent glass, resin, plastic, and the like. The cover plate 30 is arranged on the casing 20. The cover plate 30 includes an inner surface 32 combined with the casing 20 and an outer surface 31 opposite to the inner surface 32. The light emitted by the input and output module 10 passes through the inner surface 32 in turn. and the outer surface 31 through the cover plate 30 . In the embodiment shown in FIG. 8 , the cover plate 30 covers the light source through hole 23 of the casing and the proximity sensing through hole 24 of the casing. The ink 40 has a high transmittance to infrared light, for example, it can reach 85% or more, and it has a high attenuation rate to visible light, for example, it can reach more than 70%, making it difficult for users to see it with the naked eye during normal use. The area covered by the infrared transparent ink 40 on the electronic device 100 . In particular, infrared transparent ink 40 may cover areas of inner surface 32 that do not correspond to display screen 90 .

The infrared transparent ink 40 can also block at least one of the casing light source through hole 23 and the casing proximity sensing through hole 24, that is, the infrared transparent ink 40 can simultaneously block the casing light source through hole 23 and the casing proximity sensing Through hole 24 (as shown in FIG. 8 ), it is difficult for the user to see the internal structure of electronic device 100 through the light source through hole 23 of the casing and the proximity sensing through hole 24 of the casing, and the appearance of electronic device 100 is more beautiful; 40 can also block the light source through hole 23 of the casing without blocking the proximity sensing through hole 24 of the casing; or the infrared transparent ink 40 can also block the casing proximity sensing through hole 24 without blocking the light source through hole 23 of the casing .

Please refer to FIG. 9 , the light sensor 50 is a single-package structure. The light sensor 50 receives visible light in ambient light, and detects the intensity of the visible light as a basis for controlling the display brightness of the display screen 90 .

Please refer to FIG. 1 and FIG. 9 , the imaging module 60 may be one or both of the visible light camera 61 and the infrared light camera 62 . The imaging module 60 includes a lens base 63 , a lens barrel 64 and an image sensor 65 . The lens barrel 64 is installed on the lens holder 63 , and the image sensor 65 is accommodated in the lens holder 63 . The lens mount 63 includes a mounting surface 631 located between the lens barrel 64 and the image sensor 65 . In the embodiment shown in FIG. 9 , the photoreceptor 50 is disposed on the installation surface 631. Specifically, the orthographic projection of the photoreceptor 50 on the plane where the installation surface 631 is located at least partially falls on the installation surface 631, so, The photoreceptor 50 and the imaging module 60 are arranged relatively compactly, and the horizontal space occupied by them is relatively small.

Please refer to FIG. 1 , the receiver 70 is used to emit a sound wave signal when being excited by a power source, and the user can communicate through the receiver 70 . The structured light projector 80 is used for emitting structured light outwards, and the structured light is reflected after being projected on the object to be measured. The reflected structured light can be received by the infrared camera 62, and the processor of the electronic device 100 further analyzes it by the infrared camera 62. The received structured light is used to obtain the depth information of the measured object.

In the embodiment shown in FIG. 1 , the imaging module 60 includes a visible light camera 61 and an infrared light camera 62, the center of the input and output module 10, the infrared light camera 62, the visible light camera 61, the receiver 70 and the structured light projector 80 on the same line segment. Specifically, from one end of the line segment to the other end are input and output module 10, structured light projector 80, receiver 70, infrared light camera 62, visible light camera 61 (as shown in Figure 10), at this time, visible light camera 61 and The infrared camera 62 can form a dual-camera (as shown in Figure 19); or from one end of the line segment to the other end, there are input and output modules 10, an infrared camera 62, a receiver 70, a visible light camera 61, and a structured light projector 80. (as shown in Figure 1); or from one end of the line segment to the other end are followed by infrared light camera 62, input and output module 10, receiver 70, visible light camera 61, structured light projector 80; or from one end of the line segment to the other end The sequence is an infrared light camera 62, a visible light camera 61, a receiver 70, an input and output module 10, and a structured light projector 80. At this time, the visible light camera 61 and the infrared light camera 62 can form a dual-camera (as shown in FIG. 19 ). Of course, the arrangement of the input and output module 10, the infrared camera 62, the receiver 70, the visible light camera 61, and the structured light projector 80 is not limited to the above-mentioned examples, and there may be others, for example, the centers of the electronic components are arranged in a circular arc Shape, the center is arranged into a rectangle and other shapes.

Further, please refer to FIG. 9, the light sensor 50 can be arranged on the installation surface 631 of the infrared light camera 62, and can also be arranged on the installation surface 631 of the visible light camera 61. Of course, the light sensor 50 can also not be arranged on the installation surface 631. On the surface 631 , for example, the photoreceptor 50 may be disposed adjacent to the input-output module 10 , or disposed adjacent to the receiver 70 , which is not limited here.

To sum up, in the electronic device 100 of the embodiment of the present invention, by moving the position of the light guide element 13, the input and output module 10 can be used as a proximity infrared lamp or an infrared supplementary light. The infrared lamp 12, the light guide element 13 and the proximity The sensor 1a is integrated into a single package structure, so that the input and output module 10 integrates the function of emitting and receiving infrared light for infrared distance measurement, and the function of infrared supplementary light. Secondly, compared with the current electronic devices that need to be equipped with both a proximity infrared lamp and an infrared supplementary light, the input and output module 10 in the embodiment of the present invention only needs to install one infrared lamp 12 , and has a smaller volume. Furthermore, the infrared lamp 12 and the proximity sensor 1a are integrated into a single package structure, and the input and output module 10 has a high degree of integration and a small volume, thereby saving the space for realizing the functions of infrared ranging and infrared supplementary light. Furthermore, since only one infrared lamp 12 and the proximity sensor 1a need to be packaged on the same packaging substrate 111, compared with the conventional infrared supplementary light, the proximity infrared lamp and the proximity sensor 1a, different crystals need to be used respectively. The circular manufacturing is combined to package on the PCB substrate, which improves the packaging efficiency.

Please refer to FIG. 5 again. In some embodiments, the input-output module 10 further includes a proximity sensing lens 1b. The proximity sensor lens 1b is disposed in the package case 11 and corresponds to the proximity sensor 1a. The proximity sensor lens 1b condenses the infrared light onto the proximity sensor 1a, reducing the amount of infrared light transmitted to areas other than the proximity sensor 1a.

Please refer to FIG. 5 , in some embodiments, the input-output module 10 further includes a metal shielding plate 1c, and the metal shielding plate 1c is located in the package housing 11 and between the infrared lamp 12 and the proximity sensor 1a. The metal shielding plate 1c is located between the infrared lamp 12 and the proximity sensor 1a, which can prevent the infrared light emitted by the infrared lamp 12 from incident on the proximity sensor 1a, and can also shield the electromagnetic interference between the infrared lamp 12 and the proximity sensor 1a.

Referring to FIG. 11 , in some embodiments, the I/O module 10 further includes an optical enclosure 16 . The optical enclosure 16 is made of light-transmitting material, and the optical enclosure 16 is formed on the package substrate 111 and located in the package housing 11 . The optical enclosure 16 encloses the infrared lamp 12 and the proximity sensor 1a. Specifically, the optical encapsulation 16 can be formed through a glue injection molding process, and the optical encapsulation 16 can be made of transparent thermosetting epoxy resin, so as not to be easily softened during use, and the optical encapsulation 16 can fix the infrared lamp 12 and the approaching The relative position between the sensors 1a, and make the infrared lamp 12 and the proximity sensor 1a not easy to shake in the packaging case 11. At this time, the light guide element 13 is disposed outside the optical enclosure 16 and is movably accommodated in the packaging case 11 .

Please refer to FIG. 11 , in some embodiments, the input-output module 10 further includes a light-out partition 1d, which is formed in the optical enclosure 16 and located between the infrared lamp 12 and the proximity sensor 1a. The light-emitting partition 1d can block the infrared light emitted by the infrared lamp 12 from incident on the proximity sensor 1a, and block the infrared light entering from the proximity sensing window 1132 to the proximity sensor 1a from affecting the light emission of the infrared lamp 12.

Please refer to FIG. 9 , in some implementations, the photoreceptor 50 in the above implementations may be disposed on the mounting surface 631 of the mirror base 63 . The mirror mount 63 may be the mirror mount 63 of the infrared camera 62 , or the mirror mount 63 of the visible light camera 61 .

Please refer to FIG. 12 , in some embodiments, the casing 20 is also provided with a casing sound hole (not shown), the cover plate 30 is also provided with a cover plate sound hole 34, and the receiver 70 and the cover plate sound hole 34 corresponds to the position of the casing sound hole. The centers of the input and output module 10 , the infrared camera 62 , the visible light camera 61 and the structured light projector 80 are located on the same line segment, and the receiver 70 is located between the line segment and the top 21 of the casing 20 .

The center of the receiver 70 is not located on the line segment, which saves the horizontal space occupied by the electronic components (input and output module 10, infrared camera 62, visible light camera 61, structured light projector 80, etc.) on the cover plate 30. In the embodiment shown in FIG. 12 , the sound outlet hole 34 of the cover plate is opened at the edge of the cover plate 30 , and the sound outlet hole of the casing is opened near the top 21 .

Please refer to FIG. 13 again. In some embodiments, the cover plate 30 may also be provided with a cover plate light source through hole 33. The cover plate light source through hole 33 corresponds to the casing light source through hole 23. The infrared light emitted by the infrared lamp 12 After passing through the light source through hole 23 of the casing, the electronic device 100 can be passed through the light source through hole 33 of the cover plate.

Please refer to FIG. 14 , in some embodiments, the cover plate 30 can also be provided with a cover plate proximity sensing through hole 35, the cover plate proximity sensing through hole 35 is the same as the casing proximity sensing through hole 24 and the proximity sensor 1a. Correspondingly, the infrared light reflected by objects outside the electronic device 100 can be incident on the proximity sensor 1 a after passing through the proximity sensing through hole 35 of the cover plate and the proximity sensing through hole 24 of the casing.

Please refer to FIG. 15 , in some embodiments, the imaging module 60 further includes a substrate 66 on which the image sensor 65 is disposed, and the photoreceptor 50 may also be fixed on the substrate 66 . Specifically, the substrate 66 is provided with an FPC, a part of the substrate 66 is located in the mirror seat 63, and the other part protrudes from the mirror seat 63, one end of the FPC is located in the mirror seat 63 and is used to carry the image sensor 65, and the other end can be connected to the mirror seat 63. The mainboard of the electronic device 100 is connected. When the photoreceptor 50 is arranged on the substrate 66 , the photoreceptor 50 is arranged outside the mirror base 63 , and the photoreceptor 50 can also be connected to the FPC.

The imaging module 60 can be one or both of the visible light camera 61 and the infrared light camera 62 . Specifically, the light sensor 50 can be fixed on the substrate 66 of the visible light camera 61 ; the light sensor 50 can be fixed on the substrate 66 of the infrared light camera 62 . Further, the substrate 66 also includes a reinforcing plate, which is arranged on the side opposite to the photoreceptor 50 to increase the overall strength of the substrate 66, so that the FPC is not easy to be bent, and the photoreceptor 50 is arranged on the substrate. It is not easy to shake when it is on the 66. In an example, the photoreceptor 50 can also be fixed on the outer wall of the mirror base 63 , for example, fixed on the outer wall of the mirror base 63 by bonding.

Please refer to FIG. 16 , in some embodiments, the electronic device 100 and the imaging module 60 of the above embodiments can be replaced with the following structure: the imaging module 60 includes an image sensor 65 , a camera housing 67 and a lens module 68 . The top surface 670 of the camera housing 67 is a stepped surface, and the top surface 670 includes a first sub-top surface 671, a second sub-top surface 672, and a third sub-top surface 673, and the second sub-top surface 672 and the first sub-top surface 671 is obliquely connected and forms a cutout 675 with the first sub-top surface 671, the third sub-top surface 673 is obliquely connected with the second sub-top surface 672, and the second sub-top surface 672 is located between the first sub-top surface 671 and the third sub-top surface 673 to connect the first sub-top surface 671 and the third sub-top surface 673 . The included angle between the second sub-top surface 672 and the first sub-top surface 671 may be an obtuse angle or a right angle, and the included angle between the second sub-top surface 672 and the third sub-top surface 673 may be an obtuse angle or a right angle. The cutout 675 is opened on one end of the camera housing 67 , that is to say, the cutout 675 is located at the edge of the top surface 670 . The third sub-top surface 673 defines a light exit hole 674 , and the lens module 68 is accommodated in the camera housing 67 and corresponds to the light exit hole 674 . The image sensor 65 is accommodated in the camera housing 67 and corresponds to the lens module 68. The light outside the electronic device 100 can pass through the light exit hole 674 and the lens module 68 and be transmitted to the image sensor 65. The image sensor 65 transmits the light signal converted into an electrical signal. The photoreceptor 50 is disposed at the first sub-top surface 671 . In this embodiment, the imaging module 60 may be a visible light camera 61, and the light sensor 50 has a single-package structure.

The imaging module 60 of this embodiment is provided with a cutout 675, and the photoreceptor 50 is arranged on the first sub-top surface 671, so that the photoreceptor 50 and the imaging module 60 are arranged more compactly, and the horizontal space occupied by the two together The space is small, saving the installation space in the electronic device 100 .

Please continue to refer to FIG. 16 , in some embodiments, the photoreceptor 50 of the above-mentioned embodiment is arranged on the first sub-top surface 671 and is located outside the camera housing 67, specifically, the entire photoreceptor 50 is vertically The projections of the first sub-top surface 671 can all be located in the first sub-top surface 671 (as shown in Figure 15); or, part of the photoreceptor 50 is located on the first sub-top surface along the projection perpendicular to the first sub-top surface 671 Within 671. That is to say, at least a part of the photoreceptor 50 is located directly above the first sub-top surface 671. In this way, the photoreceptor 50 and the imaging module 60 are arranged more compactly, and the horizontal space occupied by the two is small, further saving The installation space in the electronic device 100 is reduced.

Please refer to FIG. 17 , the first sub-top surface 671 of the above embodiment is provided with a light-transmitting hole 676 , and the light sensor 50 is located in the camera housing 67 and corresponds to the light-transmitting hole 676 . The light outside the electronic device 100 can pass through the light hole 676 and be transmitted to the light sensor 50 . The light sensor 50 of this embodiment is arranged in the camera casing 67 , which makes the structure of the light sensor 50 and the camera casing 67 more stable and facilitates the installation of the light sensor 50 and the imaging module 60 on the casing 20 .

Please refer to FIG. 18 , in some embodiments, the first sub-top surface 671 of the above embodiment is provided with a light-transmitting hole 676 , and the light sensor 50 is located in the camera housing 67 and corresponds to the light-transmitting hole 676 . The imaging module 60 also includes a substrate 66 on which the image sensor 65 is disposed. The photoreceptor 50 can also be fixed on the substrate 66 and accommodated in the camera housing 67 . Specifically, an FPC is disposed on the substrate 66 , one end of the FPC is located in the camera housing 67 and used to carry the image sensor 65 , and the other end of the FPC can be connected to the main board of the electronic device 100 . In other embodiments, the photosensor 50 can also be connected to the FPC.

The light sensor 50 of this embodiment is arranged in the camera housing 67, so that the structure of the light sensor 50 and the camera housing 67 is more stable and facilitates the installation of the light sensor 50 and the imaging module 60 on the casing 20; , the imaging module 60 is provided with a substrate 66 and the photoreceptor 50 is arranged on the substrate 66 , so that the photoreceptor 50 can be stably installed in the camera housing 67 .

Please refer to FIG. 19 , in some embodiments, the electronic device 100 and the imaging module 60 of the above embodiments can be replaced with the following structure: the imaging module 60 is a dual-camera module, including two image sensors 65, a camera housing 67 and two lens modules 68. The top surface 670 of the camera housing 67 is a stepped surface, and the top surface 670 includes a first stepped surface 677 , a second stepped surface 678 lower than the first stepped surface 677 , and a first connecting surface 679 a. The first connecting surface 679a is obliquely connected to the second stepped surface 678 and forms a cutout 675 with the second stepped surface 678, the first connecting surface 679a is obliquely connected to the first stepped surface 677, and the first connecting surface 679a is located between the first stepped surface 677 and the first stepped surface 677. The second stair surface 678 is connected to the first stair surface 677 and the second stair surface 678 . The included angle between the first connecting surface 679a and the first stepped surface 677 may be an obtuse angle or a right angle, and the included angle between the first connecting surface 679a and the second stepped surface 678 may be an obtuse angle or a right angle. The cutout 675 is opened on one end of the camera housing 67 , that is to say, the cutout 675 is located at the edge of the top surface 670 . The two light exit holes 674 are both set on the first stepped surface 677 and located on the same side of the cutout 675 , and the line connecting the centers of the two light exit holes 674 is perpendicular to the extending direction of the cutout 675 . The two lens modules 68 are accommodated in the camera housing 67 and correspond to the two light exit holes 674 respectively, the two image sensors 65 are accommodated in the camera housing 67 and correspond to the two lens modules 68 respectively, and the electronic device The light outside 100 can pass through the light exit hole 674 and the lens module 68 and be transmitted to the image sensor 65 . In this embodiment, the imaging module 60 may be a visible light camera 61 , and at this time, the two lens modules 68 are lens modules corresponding to the visible light camera 61 . The light sensor 50 is disposed on the second step surface 678 and outside the camera housing 67 . The photoreceptor 50 is a single package structure. In other embodiments, the imaging module 60 may be an infrared camera 62 , and at this time, the two lens modules 68 are lens modules corresponding to the infrared camera 62 . In yet another embodiment, the imaging module 60 includes a visible light camera 61 and an infrared camera 62. At this time, the lens module 68 is a lens module corresponding to the infrared camera 62, and the other lens module 68 is a corresponding lens module to the visible light camera 61. lens module.

The imaging module 60 of this embodiment is provided with a cutout 675, and the photoreceptor 50 is arranged on the second step surface 678, so that the photoreceptor 50 and the imaging module 60 are arranged more compactly, and the horizontal space occupied by both Smaller, saving the installation space in the electronic device 100 .

Please refer to FIG. 20 , in some embodiments, the slit 675 of the above embodiment is provided at the middle position of the top surface 670, and the first step surface 677 is separated into a first sub-step surface 677a and a second sub-step surface by the cutout 675. 677b, the first sub-step surface 677a and the second sub-step surface 677b are respectively located on opposite sides of the cutout 675, and two light-emitting through holes 674 are opened on the first sub-step surface 677a and the second sub-step surface 677b respectively, and are installed on the The lens module 68 inside the camera housing 67 is also located on opposite sides of the cutout 675 . At this time, the cutout 675 is surrounded by the second step surface 678, the first connecting surface 679a and the second connecting surface 679b, and the first connecting surface 679a obliquely connects the first sub-top surface 677a and the second step surface 678 and is located on the first sub-top surface 677a. Between the top surface 677 a and the second step surface 678 , the second connecting surface 679 b obliquely connects the second sub-top surface 677 b and the second step surface 678 and is located between the second sub-top surface 677 b and the second step surface 678 . In this embodiment, the first step surface 677 is parallel to the second step surface 678, the angle between the first connection surface 679a and the first sub-step surface 677a is an obtuse angle, and the angle between the second connection surface 679b and the second sub-step surface 677b The angle is obtuse. In other embodiments, the included angle between the first connecting surface 679a and the first sub-step surface 677a is a right angle, and the included angle between the second connecting surface 679b and the second sub-step surface 677b is a right angle. Compared with setting the cutout 675 at the edge of the top surface 670, setting the cutout 675 in the middle of the top surface 670 in this embodiment can make the width of the cutout 675 wider, thereby facilitating the installation of the photoreceptor 50 on the second stepped surface. 678 on.

Please refer to FIG. 19 and FIG. 20 , in some embodiments, the light sensor 50 of the above embodiments is disposed on the second step surface 678 and located outside the camera housing 67 . Specifically, when the cutout 675 is provided at the edge of the top surface 670, the entire photoreceptor 50 can be located in the second stepped surface 678 along the projection perpendicular to the second stepped surface 678 (as shown in FIG. 19 ); or, Part of the photoreceptor 50 is located in the second stepped surface 678 along a projection perpendicular to the second stepped surface 678 . That is to say, at least a part of the photoreceptor 50 is located directly above the second stepped surface 678 . When the cutout 675 is provided in the middle of the top surface 670 , the entire photoreceptor 50 along the projection perpendicular to the second stepped surface 678 can be located in the second stepped surface 678 (as shown in FIG. 20 ). In this way, the photoreceptor 50 and the imaging module 60 are arranged more compactly, and the horizontal space occupied by them together is smaller, which further saves the installation space in the electronic device 100 .

Please refer to FIG. 21 , the second step surface 678 of the above embodiment is provided with a light-transmitting hole 676 , and the light sensor 50 is located in the camera housing 67 and corresponds to the light-transmitting hole 676 . The light outside the electronic device 100 can pass through the light hole 676 and be transmitted to the light sensor 50 . The light sensor 50 of this embodiment is arranged in the camera casing 67 , which makes the structure of the light sensor 50 and the camera casing 67 more stable and facilitates the installation of the light sensor 50 and the imaging module 60 on the casing 20 .

Please refer to FIG. 22 , in some embodiments, the second step surface 678 of the above embodiment is provided with a light-transmitting hole 676 , and the light sensor 50 is located in the camera housing 67 and corresponds to the light-transmitting hole 676 . The imaging module 60 also includes a substrate 66 on which the image sensor 65 is disposed. The photoreceptor 50 can also be fixed on the substrate 66 and accommodated in the camera housing 67 . Specifically, an FPC is disposed on the substrate 66 , one end of the FPC is located in the camera housing 67 and used to carry the image sensor 65 , and the other end of the FPC can be connected to the main board of the electronic device 100 . In other embodiments, the photosensor 50 can also be connected to the FPC.

The light sensor 50 of this embodiment is arranged in the camera housing 67, so that the structure of the light sensor 50 and the camera housing 67 is more stable and facilitates the installation of the light sensor 50 and the imaging module 60 on the casing 20; , the imaging module 60 is provided with a substrate 66 and the photoreceptor 50 is arranged on the substrate 66 , so that the photoreceptor 50 can be stably installed in the camera housing 67 .

In the description of this specification, references to the terms "certain embodiments," "one embodiment," "some embodiments," "exemplary embodiments," "examples," "specific examples," or "some examples" To describe means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the described specific features, structures, materials or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include at least one of said features. In the description of the present invention, "plurality" means at least two, such as two, three, unless otherwise specifically defined.

Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present invention, those skilled in the art can make the above-mentioned The embodiments are subject to changes, modifications, substitutions and variations, the scope of the present invention is defined by the claims and their equivalents.

Claims (16)

1. a kind of input and output module, it is characterised in that the input and output module includes encapsulating housing, infrared lamp, guide-lighting member Part and proximity sensor, the encapsulating housing include package substrate, the infrared lamp, the light-guide device and the close biography Sensor is encapsulated in the encapsulating housing, and the infrared lamp and the proximity sensor carry on the package substrate, The light-guide device can be movably arranged in the luminous light path of the infrared lamp, when the light-guide device is positioned at described infrared When in the luminous light path of lamp, the infrared light of infrared lamp transmitting with the first field angle from the encapsulating housing be emitted using as Infrared light compensating lamp or close to infrared lamp；When the light-guide device is left in the luminous light path of the infrared lamp, the infrared lamp The infrared light of transmitting is emitted using as close to infrared lamp or infrared light compensating lamp with the second field angle from the encapsulating housing；It is described Proximity sensor is used to receive the infrared light that is reflected by the object to detect the distance of object.

2. input and output module according to claim 1, it is characterised in that

The light-guide device includes convex lens or the lens group with positive light coke, when the light-guide device is located at the infrared lamp Luminous light path on when, the infrared light of infrared lamp transmitting is emitted using as connecing with the first field angle from the encapsulating housing Near-infrared lamp；When the light-guide device is left in the luminous light path of the infrared lamp, the infrared light of the infrared lamp transmitting It is emitted with the second field angle from the encapsulating housing to be used as infrared light compensating lamp；Or

The light-guide device includes concavees lens or the lens group with negative power, when the light-guide device is located at the infrared lamp Luminous light path on when, the infrared light of infrared lamp transmitting is emitted using as red with the first field angle from the encapsulating housing Outer light compensating lamp；When the light-guide device is left in the luminous light path of the infrared lamp, the infrared light of the infrared lamp transmitting It is emitted with the second field angle from the encapsulating housing using as close to infrared lamp.

3. input and output module according to claim 1, it is characterised in that the input and output module further includes chip, The infrared lamp and the proximity sensor are respectively formed on the chip.

4. input and output module according to claim 3, it is characterised in that the encapsulating housing further include package wall and Encapsulation top, the package wall extend from the package substrate and be connected at the top of the encapsulation and the package substrate it Between, formed with luminescence window and close to sensing window at the top of the encapsulation, the luminescence window is corresponding with the infrared lamp, described It is corresponding with the proximity sensor close to sensing window.

5. input and output module according to claim 3, it is characterised in that the input and output module is further included close to biography Feel lens, the close sensing lens are arranged in the encapsulating housing and corresponding with the proximity sensor.

6. input and output module according to claim 1, it is characterised in that the input and output module further includes metal screening Baffle, the metal shutter are located in the encapsulating housing and between the infrared lamp and the proximity sensor.

7. input and output module according to claim 1, it is characterised in that the input and output module is further included by printing opacity Optics sealing cover made of material, the optics sealing cover is formed on the package substrate and in the encapsulating housing, described Optics sealing cover wraps the infrared lamp and the proximity sensor.

8. input and output module according to claim 7, it is characterised in that the input and output module further include light extraction every Plate, it is described go out light clapboard be formed in the optics sealing cover and between the infrared lamp and the proximity sensor.

9. according to the input and output module described in claim 1-8 any one, it is characterised in that on the input and output module Formed with grounding pin, infrared lamp pin and sensing pin is approached, when the grounding pin and the infrared lamp pin are enabled, The infrared lamp launches infrared light；When the grounding pin and the close sensing pin are enabled, the proximity sensor The infrared light that is reflected by the object is received to detect the distance of object.

10. a kind of electronic device, it is characterised in that the electronic device includes：

Casing；With

Input and output module described in claim 1-9 any one, the input and output module are arranged in the casing.

11. electronic device according to claim 10, it is characterised in that the electronic device further includes the cover board of printing opacity, The casing offers casing light source through holes and casing close to sensing through hole, the infrared lamp and the casing light source through holes pair Should, the proximity sensor is corresponding close to sensing through hole with the casing, and the cover board is set on the housing.

12. electronic device according to claim 10, it is characterised in that the electronic device further includes the cover board of printing opacity, The casing offers casing light source through holes and casing close to sensing through hole, the infrared lamp and the casing light source through holes pair Should, the proximity sensor is corresponding close to sensing through hole with the casing, and the cover board is set on the housing, the cover board Ink is passed through formed with the infrared of infrared light is only transmitted with the surface that the casing is combined, the infrared transmission ink blocks described Casing light source through holes and the casing are at least one in through hole close to sensing.

13. electronic device according to claim 10, it is characterised in that the electronic device further includes optical flame detector and imaging Module, the imaging modules include microscope base, the lens barrel on the microscope base and the image sensing being housed in the microscope base Device, the microscope base include the mounting surface between the lens barrel and described image sensor, and the optical flame detector is arranged on described On mounting surface.

14. electronic device according to claim 10, it is characterised in that the electronic device further includes optical flame detector and imaging Module, on the housing, the imaging modules include microscope base, the lens barrel on the microscope base for the imaging modules installation The substrate being partly arranged in the microscope base；The optical flame detector is set on the substrate.

15. electronic device according to claim 10, it is characterised in that the electronic device further includes imaging modules and light Sensor, on the housing, the imaging modules include camera case and camera lens module, the camera for the imaging modules installation The top surface of housing is for cascaded surface and the first sub- top surface and the second sub- top surface including being connected, the second sub- top surface relatively described the One sub- top surface inclination simultaneously forms notch with the described first sub- top surface, and the top surface offers light extraction through hole, and the camera lens module is received Appearance is in the camera case and corresponding with the light extraction through hole, and the optical flame detector is arranged at the described first sub- top surface.

16. electronic device according to claim 10, it is characterised in that the electronic device further includes imaging modules and light Sensor, the imaging modules include camera case and two camera lens modules, offered on the top surface of the camera case notch with Step-like top surface is formed, the top surface includes the first tread and the second tread less than first tread, first ladder Two light extraction through holes are offered on face, each light extraction through hole is corresponding with the camera lens module, and the optical flame detector is arranged on institute State at the second tread.