CN107968858A - Output module and electronic device - Google Patents

Abstract

The invention discloses an output module and an electronic device. The output module comprises an encapsulation shell, a structured light projector, a first infrared light source and a second infrared light source arranged around the first infrared light source. The packaging shell comprises a packaging substrate, and the structured light projector, the first infrared light source and the second infrared light source are packaged in the packaging shell and are borne on the packaging substrate. When the second infrared light source is closed and the first infrared light source emits infrared light to the outside of the packaging shell with first power, the output module is used for infrared distance measurement. When the first infrared light source and the second infrared light source are both started and emit infrared light to the outside of the packaging shell by second power, the output module is used for infrared light supplement. The output module has assembled the function of transmission infrared light with infrared range finding, infrared light filling and three-dimensional imaging, and the integrated level of output module is higher, and the volume is less. In addition, the packaging efficiency of the output module is high.

Description

Output modules and electronics

technical field

The present invention relates to the technical field of consumer electronics, and more specifically, to an output module and an electronic device.

Background technique

As the functions supported by mobile phones become more and more diverse, the types and quantities of functional devices that need to be installed on mobile phones are also increasing. In order to realize functions such as distance detection, ambient light detection and user's facial 3D feature recognition, it is necessary Functional devices such as proximity sensors, ambient light sensors, infrared cameras, and structured light projectors are configured in the mobile phone, but in order to arrange many functional devices, it will take up too much space on the mobile phone.

Contents of the invention

Embodiments of the present invention provide an output module and an electronic device.

The output module according to the embodiment of the present invention includes a package casing, a structured light projector, a first infrared light source, and a second infrared light source arranged around the first infrared light source, the package casing includes a package substrate, and the structure The light projector, the first infrared light source and the second infrared light source are packaged in the packaging case and carried on the packaging substrate. When the second infrared light source is turned off, the first infrared light source When a power emits infrared light to the outside of the packaging shell, the output module is used for infrared distance measurement; when the first infrared light source and the second infrared light source are both turned on and send the second power When the infrared light is emitted outside the body, the output module is used for infrared supplementary light.

In some embodiments, the first infrared light source is a point light source, and the second infrared light source is a point light source and the number is multiple; or

The first infrared light source is a point light source, and the second infrared light source is a ring light source; or

The first infrared light source is a plurality of ring-shaped point light sources, and the second infrared light source is a ring-shaped light source; or

The first infrared light source is a plurality of circular point light sources, and the second infrared light source is a plurality of point light sources; or

The first infrared light source is a ring light source; the second infrared light source is a point light source and the number is multiple; or

The first infrared light source is a ring light source; the second infrared light source is a ring light source.

In some embodiments, the output module further includes a chip, and the structured light projector, the first infrared light source and the second infrared light source are formed on one chip.

In some embodiments, the package housing further includes a package side wall and a package top, the package side wall extends from the package substrate and is connected between the package top and the package substrate, the package A first light exit window and a second light exit window are formed on the top, the first light exit window corresponds to the first infrared light source and the second infrared light source, and the second light exit window corresponds to the structured light projector.

In some implementations, the output module further includes a lens, which is disposed in the package housing and corresponds to the first infrared light source and the second infrared light source.

In some embodiments, the output module further includes an optical enclosure made of a light-transmitting material, the optical enclosure is formed on the packaging substrate and located in the packaging housing, the optical enclosure wrapping the first infrared light source and the second infrared light source.

In some embodiments, the output module further includes a metal shielding plate, the metal shielding plate is located in the package housing, the first infrared light source and the second infrared light source are located on the metal shielding plate On one side, the structured light projector is located on the other side of the metal shielding plate.

An electronic device according to an embodiment of the present invention includes:

chassis; and

The output module described in any one of the above embodiments, the output module is arranged in the casing.

In some embodiments, the electronic device further includes a light-transmitting cover plate, the casing is provided with an organic casing infrared through hole and a casing structured light through hole, and the first infrared light source and the second infrared light source The light source corresponds to the infrared through hole of the casing, the structured light projector corresponds to the structured light through hole of the casing, and the cover plate is arranged on the casing.

In some embodiments, the surface of the cover plate combined with the casing is formed with an infrared transparent ink that only transmits infrared light, and the infrared transparent ink blocks the infrared through hole of the casing and the casing. At least one of the shell structured light through holes.

In some embodiments, the electronic device further includes a receiving module and an imaging module, the receiving module is integrated with a proximity sensor and a light sensor, the imaging module includes a mirror base, and is installed on the mirror base The lens barrel and the image sensor accommodated in the lens seat, the lens seat includes a mounting surface between the lens barrel and the image sensor, and the receiving module is arranged on the mounting surface.

In some embodiments, the electronic device further includes a proximity sensor, a light sensor, and an imaging module, and the imaging module includes a mirror base, a lens barrel installed on the mirror base, and a The image sensor in the mirror seat, the mirror seat includes a mounting surface between the lens barrel and the image sensor, at least one of the proximity sensor and the light sensor is arranged on the mounting surface.

In some embodiments, the imaging module includes at least one of a visible light camera and an infrared light camera.

In some embodiments, the electronic device also includes a receiver, an infrared camera, a visible light camera, and a light-transmitting cover plate. hole, the position of the receiver corresponds to the sound hole of the cover plate and the sound hole of the casing, the centers of the output module, the infrared camera and the visible light camera are located on the same line segment, and the A receiver is located between the line segment and the top of the housing.

The output module and electronic device of the embodiment of the present invention can be used for infrared distance measurement when only the first infrared light source is turned on, and can be used for infrared supplementary light when the first infrared light source and the second infrared light source are turned on at the same time, and combined with structured light projection The output module integrates the functions of emitting infrared light for infrared distance measurement, infrared supplementary light and stereoscopic imaging. Therefore, the output module has a high degree of integration and a small volume. The space for the functions of fill light and stereoscopic imaging. In addition, since the structured light projector, the first infrared light source and the second infrared light source are carried on the same packaging substrate, compared with the traditional crafted structured light projector, near-infrared lamp, and infrared supplementary light, different wafers are required Manufacture packages that are reassembled onto the PCB substrate, improving packaging efficiency.

Additional aspects and advantages of embodiments of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of embodiments of the invention.

Description of drawings

The above and/or additional aspects and advantages of the present invention will become apparent and comprehensible from the description of the embodiments in conjunction with the following drawings, wherein:

FIG. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present invention;

2 is a schematic perspective view of an output module of an electronic device according to an embodiment of the present invention;

3 is a schematic diagram of the status of an output module of an electronic device according to an embodiment of the present invention;

4 is a schematic diagram of the state of the output module of the electronic device according to the embodiment of the present invention;

5 is a schematic cross-sectional view of an output module of an electronic device according to an embodiment of the present invention;

6 is a schematic perspective view of an output module of an electronic device according to an embodiment of the present invention;

7 to 9 are schematic distribution diagrams of the first infrared light source and the second infrared light source of the output module according to the embodiment of the present invention;

10 is a partial cross-sectional schematic view of an electronic device according to an embodiment of the present invention;

11 is a perspective view of a receiving module and an imaging module of an electronic device according to an embodiment of the present invention;

12 is a schematic diagram of arrangement of electronic components of the electronic device according to the embodiment of the present invention;

13 is a schematic cross-sectional view of an output module of an electronic device according to an embodiment of the present invention;

14 is a schematic perspective view of a proximity sensor and an imaging module of an electronic device according to an embodiment of the present invention;

15 is a schematic structural diagram of an electronic device according to an embodiment of the present invention;

16 is a partial cross-sectional schematic view of an electronic device according to an embodiment of the present invention;

17 is a partial cross-sectional schematic view of an electronic device according to an embodiment of the present invention;

18 to 26 are three-dimensional schematic diagrams of the receiving module and the imaging module of the electronic device according to the embodiments of the present invention.

Detailed ways

Embodiments of the present invention will be further described below in conjunction with the accompanying drawings. The same or similar reference numerals in the drawings represent the same or similar elements or elements having the same or similar functions throughout.

In addition, the embodiments of the present invention described below in conjunction with the accompanying drawings are exemplary, and are only used to explain the embodiments of the present invention, and should not be construed as limiting the present invention.

In the present invention, unless otherwise clearly specified and limited, the first feature may be in direct contact with the first feature or the first and second feature may be in direct contact with the second feature through an intermediary. touch. Moreover, "above", "above" and "above" the first feature on the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. "Below", "beneath" and "beneath" the first feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is less horizontally than the second feature.

Referring to FIG. 1 , an electronic device 100 according to an embodiment of the present invention includes a housing 20 , a cover 30 and electronic components. The electronic components include an output module 10 , a receiving module 50 (as shown in FIG. 11 ), an imaging module 60 (as shown in FIG. 11 ) and a receiver 70 . The electronic device 100 can be a mobile phone, a tablet computer, a notebook computer, a smart watch, a smart bracelet, an teller machine, etc. The embodiment of the present invention takes the electronic device 100 as an example for illustration. It can be understood that the specific form of the electronic device 100 can be other , without limitation here.

Referring to FIG. 2 and FIG. 5 , the output module 10 is a single package structure, including a package housing 11 , a first infrared light source 12 , a second infrared light source 13 and a structured light projector 14 .

The packaging case 11 is used to package the first infrared light source 12, the second infrared light source 13 and the structured light projector 14 at the same time, or in other words, the first infrared light source 12, the second infrared light source 13 and the structured light projector 14 are packaged in the package at the same time. Inside the housing 11. The package case 11 includes a package substrate 111 , a package sidewall 112 and a package top 113 . The packaging case 11 can be made of electromagnetic interference (EMI) shielding material, so as to prevent external electromagnetic interference from affecting the output module 10 .

Please refer to FIG. 5 , the packaging substrate 111 is used to carry the first infrared light source 12 , the second infrared light source 13 and the structured light projector 14 . When manufacturing the output module 10, the first infrared light source 12, the second infrared light source 13 and the structured light projector 14 can be formed on the chip 15, and then the first infrared light source 12, the second infrared light source 13, the structured light projector 14 and the chip 15 are disposed together on the package substrate 111 , specifically, the chip 15 can be bonded on the package substrate 111 . At the same time, the packaging substrate 111 can also be used to connect with other components of the electronic device 100 (such as the casing 20 of the electronic device 100 , the main board, etc.), so as to fix the output module 10 in the electronic device 100 .

The package side wall 112 can be arranged around the first infrared light source 12, the second infrared light source 13 and the structured light projector 14, the package side wall 112 extends from the package substrate 111, the package side wall 112 can be combined with the package substrate 111, preferably, The package side wall 112 is detachably connected to the package substrate 111 , so that the first infrared light source 12 , the second infrared light source 13 and the structured light projector 14 can be repaired after the package side wall 112 is removed. The material of the package sidewall 112 may be a material that does not transmit infrared light, so as to prevent the infrared light emitted by the first infrared light source 12 , the second infrared light source 13 or the structured light projector 14 from passing through the package sidewall 112 .

The package top 113 is opposite to the package substrate 111 , and the package top 113 is connected to the package sidewall 112 . The package top 113 is formed with a first light exit window 1131 and a second light exit window 1132, the first light exit window 1131 corresponds to the first infrared light source 12 and the second infrared light source 13, and the infrared light emitted by the first infrared light source 12 and the second infrared light source 13 Light passes through the first light exit window 1131 ; the second light exit window 1132 corresponds to the structured light projector 14 , and the structured light (infrared light) emitted by the structured light projector 14 passes through the second light exit window 1132 . The package top 113 and the package sidewall 112 can be formed integrally or separately. In one example, the first light exit window 1131 and the second light exit window 1132 are through holes, and the material of the package top 113 is a material that does not transmit infrared light. In another example, the package top 113 is made of a material that does not transmit infrared light and a material that transmits infrared light. Specifically, the first light exit window 1131 and the second light exit window 1132 are made of a material that transmits infrared light. The remaining parts are made of materials that are not transparent to infrared light. Further, the first light exit window 1131 and the second light exit window 1132 can be formed with a lens structure to improve the infrared light emitted from the first light exit window 1131 and the second light exit window 1132. For example, the second light exit window 1132 is formed with a concave lens structure, so that the light passing through the second light exit window 1132 is divergent and emitted outward; the first light exit window 1131 is formed with a convex lens structure, so that the light passing through the first light exit window 1131 The light is focused and emitted outward.

Please continue to refer to FIG. 5 , the first infrared light source 12 and the second infrared light source 13 can be formed on one chip 15 , further reducing the integrated volume of the first infrared light source 12 and the second infrared light source 13 , and the manufacturing process is relatively simple. The first infrared light source 12 and the second infrared light source 13 can emit infrared light. When both the first infrared light source 12 and the second infrared light source 13 are turned on and emit infrared light to the outside of the package housing 11 (as shown in FIG. 3 ), the infrared light passes through the first light exit window 1131 to be projected onto the surface of the object, and the electronic device The infrared camera 62 of 100 (as shown in FIG. 1 ) receives the infrared light reflected by the object to obtain the image information of the object. At this time, the output module 10 is used as an infrared supplementary light (that is, for infrared supplementary light), and The first infrared light source 12 and the second infrared light source 13 jointly emit the infrared light for supplementary light to cover a larger luminous area, and the angle of view α of the infrared light for supplementary light can be 60 degrees-90 degrees, for example: supplementary light The viewing angle α of infrared light is 60 degrees, 65 degrees, 70 degrees, 75 degrees, 80 degrees, 82 degrees, 85 degrees, 87 degrees, or 90 degrees. When the second infrared light source 13 is turned off and the first infrared light source 12 emits infrared light to the outside of the package housing 11 (as shown in FIG. 4 ), the infrared light passes through the first light exit window 1131 and reaches the surface of the object, and the approach of the electronic device 100 The sensor 51 (as shown in FIG. 11 ) receives the infrared light reflected by the object to detect the distance from the object to the electronic device 100. At this time, the output module 10 is used for proximity infrared distance measurement, and the first infrared light source 12 emits for The luminous area covered by the infrared light for infrared distance measurement is small, and the field angle β of infrared light for infrared distance measurement is 10 degrees to 30 degrees. For example, the field angle β of infrared light for infrared distance measurement is 10 degrees and 15 degrees. , 20 degrees, 25 degrees, or 30 degrees, etc. In the embodiment of the present invention, the viewing angle refers to the covered range where the infrared light passes through the first light exit window 1131 and exits from the package housing 11 .

The output module 10 can emit infrared light to the outside of the packaging case 11 at different powers when it is used for infrared supplementary light and when it is used for near-infrared distance measurement. The output module 10 is used to emit infrared light to the outside of the packaging casing 11 with the first power when approaching infrared distance measurement, and emits infrared light to the outside of the packaging casing 11 with the second power when the output module 10 is used for infrared supplementary light, wherein , the first power may be smaller than the second power.

The second infrared light source 13 is arranged around the first infrared light source 12 . The first infrared light source 12 and the second infrared light source 13 may be in the form of a circle, a ring, a square or a regular polygon as a whole. Can be: the first infrared light source 12 is a point light source, the second infrared light source 13 is also a point light source and the number is multiple (as shown in Figure 7); or the first infrared light source 12 is a point light source, and the second infrared light source 13 is Ring-shaped light source (as shown in Figure 8); or the first infrared light source 12 is a plurality of ring-shaped point sources of light, and the second infrared light source 13 is a ring-shaped light source; or the first infrared light source 12 is a plurality of ring-shaped point sources of light , the second infrared light source 13 is a point light source and the number is multiple (as shown in Figure 9); or the first infrared light source 12 is a ring light source; the second infrared light source 13 is a point light source and the number is multiple; or the first infrared light source The light source 12 is a ring light source; the second infrared light source 13 is a ring light source.

Please refer to FIG. 5 , the structured light projector 14 and the first infrared light source 12 and the second infrared light source 13 can be formed on a chip 15, further reducing the structure light projector 14 and the first infrared light source 12 and the second infrared light source 13. The volume after integration, and the preparation process is relatively simple. The structured light projector 14 can emit structured light outward, and the structured light can form an infrared laser speckle pattern, and the structured light is projected onto the surface of the target object, and the structure modulated by the target object is collected by the infrared light camera 62 (as shown in FIG. 1 ). The light pattern is obtained by analyzing and calculating the modulated structured light pattern to obtain a depth image of the target object (at this time, the structured light projector 14 is used for stereoscopic imaging). In the embodiment of the present invention, the structured light projector 14 includes a projector light source 141 , a mirror frame 142 , a projector lens 143 and a diffractive optical element (diffractive optical elements, DOE) 144 . The light beam emitted by the projector light source 141 is collimated or converged by the projector lens 143 and then expanded by the diffractive optical element 144 and emitted outward with a certain beam pattern. Specifically, the projector light source 141 may be formed on the chip 15, and the projector lens 143 and the diffractive optical element 144 may be fixed on the frame 1422, for example, fixed on the frame 142 by gluing.

The first infrared light source 12, the second infrared light source 13, and the structured light projector 14 can emit infrared light to the outside of the package housing 11 with different powers. Specifically, the structured light projector 14 and the first infrared light source 12 can emit infrared light at the same time. Infrared light and the second infrared light source 13 does not emit light, and the output module 10 is used for stereoscopic imaging and infrared distance measurement at the same time; it is also possible that the structured light projector 14 emits light while the first infrared light source 12 and the second infrared light source 13 do not emit light , the output module 10 is only used for stereoscopic imaging; it is also possible that the structured light projector 14 and the second infrared light source 13 do not emit light while the first infrared light source 12 emits light, and the output module 10 is only used for infrared distance measurement; it can also be The first infrared light source 12 and the second infrared light source 13 simultaneously emit infrared light while the structured light projector 14 does not emit light, and the output module 10 is only used for infrared supplementary light during infrared imaging.

Please refer to FIG. 6 , in the embodiment of the present invention, the output module 10 is formed with a ground pin 1a, a fill light pin 1b, a proximity light pin 1c, and a structured light pin 1d. The ground pin 1a, the fill light pin 1b, the proximity light pin 1c, and the structured light pin 1d can be formed on the package substrate 111. When the ground pin 1a and the fill light pin 1b are enabled (ie , when the ground pin 1a and the fill light pin 1b are connected to the circuit and conduct), the first infrared light source 12 and the second infrared light source 13 emit infrared light; when the ground pin 1a and the proximity light pin 1c are enabled (That is, when the grounding pin 1a and the proximity lamp pin 1c are connected to the circuit conduction), the first infrared light source 12 emits infrared light. When the ground pin 1a and the structured light pin 1d are enabled (that is, when the ground pin 1a and the structured light pin 1d are connected to the circuit conduction), the structured light projector 14 emits infrared light. When the ground pin 1a, the proximity light pin 1c, and the structured light pin 1d are enabled (that is, when the ground pin 1a, the proximity light pin 1c, and the structured light pin 1d are connected to the circuit conduction), The structured light projector 14 emits infrared light while the first infrared light source 12 emits infrared light.

Please refer to FIG. 1 and FIG. 10 , the casing 20 can be used as an installation carrier of the output module 10 , or in other words, the output module 10 can be set in the casing 20 . The casing 20 can be the casing of the electronic device 100. In the embodiment of the present invention, the display screen 90 of the electronic device 100 can also be arranged inside the casing 20. Since the output module 10 in the embodiment of the present invention occupies a small volume, Therefore, the volume used for disposing the display screen 90 in the case 20 can be correspondingly increased, so as to increase the screen-to-body ratio of the electronic device 100 . Specifically, the casing 20 includes a top 21 and a bottom 22, and the display screen 90 and the output module 10 are arranged between the top 21 and the bottom 22. When the user normally uses the electronic device 100, the top 21 is located above the bottom 22. As shown in FIG. 1 , the output module 10 can be disposed between the display screen 90 and the top 21 . In other embodiments, the display screen 90 may be a full screen with a gap, the display screen 90 surrounds the output module 10 , and the output module 10 is exposed from the gap of the display screen 90 .

The casing 20 also defines an organic casing infrared through hole 23 and a casing structured light through hole 24 . When the output module 10 is installed in the casing 20 , the first infrared light source 12 and the second infrared light source 13 correspond to the infrared through hole 23 of the casing, and the structured light projector 14 corresponds to the structured light through hole 24 of the casing. Wherein the first infrared light source 12 and the second infrared light source 13 all correspond to the infrared through hole 23 of the casing, which means that the light emitted by the first infrared light source 12 and/or the second infrared light source 13 can pass through the infrared through hole 23 of the casing, specifically Specifically, both the first infrared light source 12 and the second infrared light source 13 may face the infrared through hole 23 of the casing, or the light emitted by the first infrared light source 12 and the second infrared light source 13 passes through the light guide device after being acted on. Through the infrared through hole 23 of the casing. The structured light projector 14 corresponds to the structured light through hole 24 of the casing in the same way, and details are not described here. In the embodiment shown in FIG. 10, the infrared through hole 23 of the casing and the structured light through hole 24 of the casing may be spaced apart from each other. Of course, in other embodiments, the infrared through hole 23 of the casing and the structured light of the casing The through holes 24 may also be interconnected.

The cover plate 30 may be transparent, and the material of the cover plate 30 may be transparent glass, resin, plastic, and the like. The cover plate 30 is arranged on the casing 20. The cover plate 30 includes an inner surface 32 combined with the casing 20, and an outer surface 31 opposite to the inner surface 32. The light emitted by the output module 10 passes through the inner surface 32 and the inner surface 32 in turn. The outer surface 31 passes through the cover plate 30 behind. In the embodiment shown in Figure 10, the cover plate 30 covers the infrared through hole 23 of the casing and the structural light through hole 24 of the casing, and the inner surface 32 of the cover plate 30 is coated with an infrared transparent ink 40, and the infrared transparent ink 40 Ink 40 has a higher transmittance to infrared light, for example, it can reach 85% or more, and it has a higher attenuation rate to visible light, for example, it can reach more than 70%, so that it is difficult for users to see the electrons with the naked eye in normal use. The area of the device 100 covered by the infrared transparent ink 40 . In particular, infrared transparent ink 40 may cover areas of inner surface 32 that do not correspond to display screen 90 .

The infrared transparent ink 40 can also block at least one of the infrared through hole 23 and the structured light through hole 24 of the casing, that is, the infrared transparent ink 40 can simultaneously block the infrared through hole 23 and the structured light through hole of the casing 24 (as shown in Figure 10), it is difficult for the user to see the internal structure of the electronic device 100 through the infrared through hole 23 of the casing and the light through hole 24 of the casing structure, and the appearance of the electronic device 100 is more beautiful; the infrared transparent ink 40 can also The infrared through hole 23 of the case is covered, and the structural light through hole 24 of the case is not covered;

Referring to FIG. 11 , the receiving module 50 is integrated with a proximity sensor 51 and a light sensor 52 , and the proximity sensor 51 and the light sensor 52 together form a single package. The infrared light emitted by the output module 10 for infrared distance measurement is reflected by the external object and received by the proximity sensor 51. The proximity sensor 51 judges the external object and the electronic device 100 according to the intensity of the received reflected infrared light. the distance between. The light sensor 52 receives visible light in the ambient light, and detects the intensity of the visible light as a basis for controlling the display brightness of the display screen 90 . The proximity sensor 51 and the light sensor 52 are packaged together to form the receiving module 50 , which reduces the gap when the two are assembled separately and saves the installation space in the electronic device 100 .

Please refer to FIG. 1 and FIG. 11 , the imaging module 60 may be one or both of the visible light camera 61 and the infrared light camera 62 . The imaging module 60 includes a lens base 63 , a lens barrel 64 and an image sensor 65 . The lens barrel 64 is installed on the lens holder 63 , and the image sensor 65 is accommodated in the lens holder 63 . The lens mount 63 includes a mounting surface 631 located between the lens barrel 64 and the image sensor 65 . In the embodiment shown in FIG. 11 , the receiving module 50 is arranged on the installation surface 631. Specifically, the orthographic projection of the receiving module 50 on the plane where the installation surface 631 is located at least partially falls on the installation surface 631, so, The receiving module 50 and the imaging module 60 are arranged relatively compactly, and the horizontal space occupied by them is relatively small.

Please refer to FIG. 1 , the receiver 70 is used to emit a sound wave signal when being excited by a power source, and the user can communicate through the receiver 70 .

In the embodiment shown in FIG. 1, the imaging module 60 includes a visible light camera 61 and an infrared light camera 62, and the centers of the output module 10, the infrared light camera 62, the visible light camera 61 and the receiver 70 are located on the same line segment. Specifically, output module 10, visible light camera 61, receiver 70, and infrared camera 62 (as shown in Figure 12 ) are sequentially arranged from one end of the line segment to the other end; , receiver 70, visible light camera 61, infrared camera 62 (as shown in Figure 1); Of course, the arrangement of the output module 10, the infrared camera 62, the receiver 70 and the visible light camera 61 is not limited to the above-mentioned examples, and there may be others, for example, the centers of the electronic components are arranged in an arc shape, the centers are arranged in a rectangle, etc. shape.

Further, please refer to FIG. 11 , the receiving module 50 may be arranged on the installation surface 631 of the infrared camera 62, or on the installation surface 631 of the visible light camera 61. Of course, the receiving module 50 may not be arranged on the installation surface. On the surface 631, the receiving module 50 can be arranged adjacent to the output module 10, and the proximity sensor 51 can easily receive the infrared light emitted by the output module 10 for approaching infrared distance measurement and reflected back by external objects; The group 50 can also be arranged adjacent to the receiver 70, and when the user answers the phone, the proximity sensor 51 can easily detect that the user's ear is close to the receiver 70.

To sum up, the electronic device 100 according to the embodiment of the present invention can be used for infrared distance measurement when only the first infrared light source 12 is turned on, and can be used for infrared supplementary light when the first infrared light source 12 and the second infrared light source 13 are turned on at the same time. The structured light projector 14 and the output module 10 integrate the functions of emitting infrared light for infrared distance measurement, infrared supplementary light and stereoscopic imaging. It provides a space for realizing the functions of infrared ranging, infrared supplementary light and stereoscopic imaging. In addition, since the structured light projector 14, the first infrared light source 12, and the second infrared light source 13 are carried on a packaging substrate 111, compared with the traditional crafted structured light projector, near-infrared lamp, and infrared supplementary light, it is necessary to use Different wafers are manufactured and then combined into packages on the PCB substrate, which improves the packaging efficiency.

Please refer to FIG. 5 , in some embodiments, the output module 10 further includes an infrared lens 17 . The infrared lens 17 is disposed in the package housing 11 and corresponds to the first infrared light source 12 and the second infrared light source 13 . The infrared light emitted by the first infrared light source 12 or/and the second infrared light source 13 is converged into the first light exit window 1131 under the action of the infrared lens 17 to be emitted, reducing the amount of light emitted to other areas of the package side wall 112 and the package top 113 , it only needs to satisfy that the field angle α of the infrared light used for supplementary light emitted by the first infrared light source 12 and the second infrared light source 13 after passing through the infrared lens 17 is 60 degrees-90 degrees, and the emission of the first infrared light source 12 The field angle β of the infrared light used for infrared ranging after passing through the infrared lens 17 is 10°-30°. Specifically, the infrared lens 17 can be located on a transparent base, and more specifically, the infrared lens 17 can be integrally formed with the transparent base. Certainly, the output module 10 may not be provided with the infrared lens 17 .

Please refer to FIG. 5. In some embodiments, the output module 10 further includes a metal shielding plate 16, the metal shielding plate 16 is located in the package housing 11, and the metal shielding plate 16 is located between the structured light projector 14 and the second infrared light source. 13, that is, the first infrared light source 12 and the second infrared light source 13 are located on one side of the metal shielding plate 16, and the structured light projector 14 is located on the other side of the metal shielding plate 16. On the one hand, the metal shielding plate 16 can shield the electromagnetic interference between the structured light projector 14 and the first infrared light source 12 and the second infrared light source 13. The luminous intensity and timing will not affect each other. On the other hand, the metal shielding plate 16 can be used to isolate the cavity where the structured light projector 14 is located from the cavity where the first infrared light source 12 and the second infrared light source 13 are located. cavity into another cavity.

Referring to FIG. 13 , in some embodiments, the output module 10 further includes an optical enclosure 18 . The optical enclosure 18 is made of light-transmitting material, and the optical enclosure 18 is formed on the package substrate 111 and located in the package housing 11 . The optical enclosure 18 wraps the first infrared light source 12 and the second infrared light source 13 . Specifically, the optical enclosure 18 can be formed by a glue injection molding process, and the optical enclosure 18 can be made of transparent thermosetting epoxy resin, so as not to soften easily during use, and the optical enclosure 18 can fix the first infrared light source 12 The position of the second infrared light source 13 and the first infrared light source 12 and the second infrared light source 13 are not easy to shake in the packaging casing 11 .

Please refer to FIG. 14 , in some implementations, the proximity sensor 51 and the light sensor 52 may not be integrated in the receiving module 50 , or in other words, the proximity sensor 51 and the light sensor 52 are set separately. At this time, the proximity sensor 51 can be arranged on the mounting surface 631 of the mirror base 63; the light sensor 52 can also be set on the mounting surface 631 of the mirror base 63; or the proximity sensor 51 and the light sensor 52 can be arranged on the mirror base 63 at the same time on the mounting surface 631 of the The mirror mount 63 may be the mirror mount 63 of the infrared camera 62 , or the mirror mount 63 of the visible light camera 61 .

Please refer to FIG. 15 , in some embodiments, the casing 20 is also provided with a casing sound hole (not shown), the cover plate 30 is also provided with a cover plate sound hole 35, and the receiver 70 and the cover plate sound hole 35 corresponds to the position of the casing sound hole. The centers of the output module 10 , the infrared camera 62 and the visible light camera 61 are located on the same line segment, and the receiver 70 is located between the line segment and the top 21 of the casing 20 .

The center of the receiver 70 is not located on the line segment, which saves the lateral space occupied by the electronic components (output module 10 , infrared camera 62 , visible light camera 61 , etc.) on the cover 30 . In the embodiment shown in FIG. 15 , the sound outlet hole 35 of the cover plate is opened at the edge of the cover plate 30 , and the sound outlet hole of the casing is opened near the top 21 .

Please refer to FIG. 16 , in some embodiments, the cover plate 30 can also be provided with a cover plate infrared through hole 33, the cover plate infrared through hole 33 corresponds to the casing infrared through hole 23, the first infrared light source 12 and/or The infrared light emitted by the second infrared light source 13 can pass through the infrared through hole 23 of the housing and exit the electronic device 100 through the infrared through hole 33 of the cover plate. At this time, infrared transparent ink 40 can be provided on the cover plate 30 corresponding to the structured light hole 24 of the casing, so that it is difficult for the user to see the structured light projector 14 inside the electronic device 100 through the structured light hole 24 of the casing. The appearance of the electronic device 100 is more beautiful.

Please refer to FIG. 17 , in some embodiments, the cover plate 30 can also be provided with a cover plate structured light through hole 34, the cover plate structured light through hole 34 corresponds to the casing structured light through hole 24, and the structured light projector 14 emits The infrared light can go out of the electronic device 100 through the structural light hole 34 of the cover plate after passing through the structural light hole 24 of the casing. At this time, infrared transparent ink 40 can be provided on the cover plate 30 corresponding to the infrared through hole 23 of the casing, so that it is difficult for the user to see the first infrared light source 12 and the second infrared light source 12 inside the electronic device 100 through the infrared through hole 23 of the casing. The infrared light source 13 and the appearance of the electronic device 100 are more beautiful.

Please refer to FIG. 18 , in some embodiments, the imaging module 60 further includes a substrate 66 on which the image sensor 65 is disposed, and the receiving module 50 can also be fixed on the substrate 66 . Specifically, the substrate 66 is provided with an FPC, a part of the substrate 66 is located in the mirror seat 63, and the other part protrudes from the mirror seat 63, one end of the FPC is located in the mirror seat 63 and is used to carry the image sensor 65, and the other end can be connected to the mirror seat 63. The mainboard of the electronic device 100 is connected. When the receiving module 50 is arranged on the substrate 66 , the receiving module 50 is arranged outside the mirror base 63 , and the receiving module 50 can also be connected to the FPC.

Further, the receiving module 50 arranged on the substrate 66 includes a proximity sensor 51 and a photoreceptor 52. The proximity sensor 51 and the photoreceptor 52 together form a single package structure, which reduces the gap between the two when they are assembled separately, and saves electronics. The installation space within the device 100. In other embodiments, the receiving module 50 disposed on the substrate 66 includes a proximity sensor 51 or/and a photosensor 52, and the proximity sensor 51 and the photosensor 52 are each in a single package structure. That is, the receiving module 50 arranged on the substrate 66 is a proximity sensor 51 of a single-package structure; or, the receiving module 50 arranged on the substrate 66 is a photosensor 52 of a single-package structure; The receiving module 50 is a proximity sensor 51 with a single-package structure and a light sensor 52 with a single-package structure.

The imaging module 60 can be one or both of the visible light camera 61 and the infrared light camera 62 . Specifically, the receiving module 50 can be fixed on the substrate 66 of the visible light camera 61 ; the receiving module 50 can be fixed on the substrate 66 of the infrared camera 62 . When the proximity sensor 51 and the photoreceptor 52 are separately packaged, the proximity sensor 51 can be fixed on the substrate 66 of the visible light camera 61, and the photoreceptor 52 can be fixed on the substrate 66 of the infrared camera 62; or, the photoreceptor 52 can be fixed on the substrate 66 of the visible light camera 61, and the proximity sensor 51 can be fixed on the substrate 66 of the infrared camera 62; or, the proximity sensor 51 and the light sensor 52 are both fixed on the substrate 66 of the visible light camera 61; or, Both the proximity sensor 51 and the light sensor 52 are fixed on the substrate 66 of the infrared camera 62 .

Further, the substrate 66 also includes a reinforcing plate, which is arranged on the side opposite to the receiving module 50 to increase the overall strength of the substrate 66, so that the FPC is not easy to be folded, and the receiving module 50 (or close to it) When the sensor 51 or photoreceptor 52) is arranged on the substrate 66, shaking is not easy to occur. In one example, the receiving module 50 (or the proximity sensor 51 or the light sensor 52 ) can also be fixed on the outer wall of the mirror base 63 , for example, by bonding.

Please refer to FIG. 19 , in some embodiments, the electronic device 100 and the imaging module 60 in the above embodiments can be replaced with the following structure: the imaging module 60 includes an image sensor 65 , a camera housing 67 and a lens module 68 . The top surface 670 of the camera housing 67 is a stepped surface, and the top surface 670 includes a first sub-top surface 671, a second sub-top surface 672, and a third sub-top surface 673, and the second sub-top surface 672 and the first sub-top surface 671 is obliquely connected and forms a cutout 675 with the first sub-top surface 671, the third sub-top surface 673 is obliquely connected with the second sub-top surface 672, and the second sub-top surface 672 is located between the first sub-top surface 671 and the third sub-top surface 673 to connect the first sub-top surface 671 and the third sub-top surface 673 . The included angle between the second sub-top surface 672 and the first sub-top surface 671 may be an obtuse angle or a right angle, and the included angle between the second sub-top surface 672 and the third sub-top surface 673 may be an obtuse angle or a right angle. The cutout 675 is opened on one end of the camera housing 67 , that is to say, the cutout 675 is located at the edge of the top surface 670 . The third sub-top surface 673 defines a light exit hole 674 , and the lens module 68 is accommodated in the camera housing 67 and corresponds to the light exit hole 674 . The image sensor 65 is accommodated in the camera housing 67 and corresponds to the lens module 68. The light outside the electronic device 100 can pass through the light exit hole 674 and the lens module 68 and be transmitted to the image sensor 65. The image sensor 65 transmits the light signal converted into an electrical signal. The receiving module 50 is disposed on the first sub-top surface 671 , and the receiving module 50 includes a proximity sensor 51 and a light sensor 52 . In this embodiment, the imaging module 60 may be a visible light camera 61 , and the receiving module 50 is a single package formed by the proximity sensor 51 and the light sensor 52 . The direction of the center line between the proximity sensor 51 and the photoreceptor 52 may be consistent with the extension direction of the notch 675 (as shown in FIG. 19 ); The direction is perpendicular or the angle formed by the two is acute or obtuse. In other embodiments, the imaging module 60 may be an infrared camera 62 .

The imaging module 60 of this embodiment is provided with a cutout 675, and the receiving module 50 is arranged on the first sub-top surface 671, so that the receiving module 50 and the imaging module 60 are arranged more compactly. The space is small, which saves the installation space in the electronic device 100; at the same time, the proximity sensor 51 and the light sensor 52 are packaged together to form the receiving module 50, which reduces the gap when the two are assembled separately, and saves the installation space in the electronic device 100.

Please continue to refer to FIG. 19 , in some embodiments, the receiving module 50 of the above-mentioned embodiment is arranged on the first sub-top surface 671 and is located outside the camera housing 67 , specifically, the entire receiving module 50 is perpendicular to The projections of the first sub-top surface 671 can all be located in the first sub-top surface 671 (as shown in Figure 19); or, part of the receiving module 50 is located on the first sub-top surface along the projection perpendicular to the first sub-top surface 671 Within 671. That is to say, at least a part of the receiving module 50 is located directly above the first sub-top surface 671. In this way, the receiving module 50 and the imaging module 60 are arranged more compactly, and the horizontal space occupied by the two together is small, further saving The installation space in the electronic device 100 is reduced. In other embodiments, the receiving module 50 includes a proximity sensor 51 and a light sensor 52, but the proximity sensor 51 and the light sensor 52 are two separate single packages. At this time, each of the proximity sensor 51 and the light sensor of a single package The devices 52 can also be arranged on the first sub-top surface 671.

Please refer to FIG. 20 , in some embodiments, the receiving module 50 of the above-mentioned embodiment only includes a proximity sensor 51, and does not include a photoreceptor 52. At this time, the proximity sensor 51 (or receiving module 50) and the photoreceptor 52 are each a single package structure, the proximity sensor 51 is disposed on the first sub-top surface 671 , and the photoreceptor 52 is disposed at any other position except the first sub-top surface 671 .

Please continue to refer to FIG. 20 , in some embodiments, the receiving module 50 of the above-mentioned embodiment only includes a photoreceptor 52, and does not include a proximity sensor 51. At this time, the photoreceptor 52 (or receiving module 50) and Each of the proximity sensors 51 is a single package structure, the light sensor 52 is disposed on the first sub-top surface 671 , and the proximity sensor 51 is disposed at any other position except the first sub-top surface 671 .

Please refer to FIG. 21 , the first sub-top surface 671 of the above embodiment is provided with a light-transmitting hole 676 , and the receiving module 50 is located in the camera housing 67 and corresponds to the light-transmitting hole 676 . Specifically, when the receiving module 50 only includes the proximity sensor 51 without the photoreceptor 52, and the photoreceptor 52 is arranged outside the camera housing 67, the number of the light-transmitting hole 676 can be one, and the light outside the electronic device 100 It can pass through the light-transmitting hole 676 and be transmitted to the proximity sensor 51 . The receiving module 50 of this embodiment is arranged in the camera casing 67 , which makes the structure of the receiving module 50 and the camera casing 67 more stable and facilitates the installation of the receiving module 50 and the imaging module 60 on the casing 20 .

Please continue to refer to FIG. 21 , the first sub-top surface 671 of the above embodiment is provided with a light-transmitting hole 676 , and the receiving module 50 is located in the camera housing 67 and corresponds to the light-transmitting hole 676 . Specifically, when the receiving module 50 only includes the light sensor 52 without the proximity sensor 51, and the proximity sensor 51 is arranged outside the camera housing 67, the number of the light transmission hole 676 can be one, and the light outside the electronic device 100 It can pass through the light-transmitting hole 676 and be transmitted to the photoreceptor 52 . The receiving module 50 of this embodiment is arranged in the camera casing 67 , which makes the structure of the receiving module 50 and the camera casing 67 more stable and facilitates the installation of the receiving module 50 and the imaging module 60 on the casing 20 .

Please refer to FIG. 22 , in some embodiments, the first sub-top surface 671 of the above embodiment is provided with a light-transmitting hole 676 , and the receiving module 50 is located in the camera housing 67 and corresponds to the light-transmitting hole 676 . Specifically, when the receiving module 50 is integrated with the proximity sensor 51 and the light sensor 52, the light transmission hole 676 can be one light transmission hole corresponding to both the proximity sensor 51 and the light sensor 52 or two spaced apart from each other and respectively connected to the light sensor 52. The light transmission hole corresponding to the proximity sensor 51 and the light sensor 52 , light outside the electronic device 100 can pass through the light transmission hole 676 and be transmitted to the proximity sensor 51 and the light sensor 52 in the receiving module 50 . In other embodiments, the receiving module 50 includes a proximity sensor 51 and a light sensor 52, but the proximity sensor 51 and the light sensor 52 are two separate single packages. At this time, each of the proximity sensor 51 and the light sensor of a single package The detectors 52 can also be arranged in the camera housing 67 and correspond to the light-transmitting holes 676 . The receiving module 50 of this embodiment is arranged in the camera casing 67 , which makes the structure of the receiving module 50 and the camera casing 67 more stable and facilitates the installation of the receiving module 50 and the imaging module 60 on the casing 20 .

Please refer to FIG. 22 , in some embodiments, the first sub-top surface 671 of the above embodiment is provided with a light-transmitting hole 676 , and the receiving module 50 is located in the camera housing 67 and corresponds to the light-transmitting hole 676 . The imaging module 60 also includes a substrate 66 on which the image sensor 65 is disposed. The receiving module 50 can also be fixed on the substrate 66 and accommodated in the camera housing 67 . Specifically, an FPC is disposed on the substrate 66 , one end of the FPC is located in the camera housing 67 and used to carry the image sensor 65 , and the other end of the FPC can be connected to the main board of the electronic device 100 . In other implementation manners, the receiving module 50 can also be connected with the FPC. In this embodiment, the receiving module 50 disposed on the substrate 66 includes a proximity sensor 51 and a light sensor 52, and the proximity sensor 51 and the light sensor 52 together form a single package structure, which reduces the gap between the two when they are assembled separately. The installation space in the electronic device 100 is saved.

In other embodiments, the receiving module 50 only includes the proximity sensor 51, and the light sensor 52 is not integrated in the receiving module 50, that is to say, the receiving module 50 is a single package structure of the proximity sensor 51, and the light sensor The device 51 is also a single package structure, and the proximity sensor 51 can be fixed on the substrate 66 and accommodated in the camera housing 67; or, when a part of the substrate 66 is located in the camera housing 67, the other part extends from the camera housing 67 When out, the light sensor 52 can also be fixed on the substrate 66 and be located outside the camera housing 67.

In yet another embodiment, the receiving module 50 only includes the photoreceptor 52, and the proximity sensor 51 is not integrated in the receiving module 50, that is, the receiving module 50 is a single package structure of the photoreceptor 52 , the proximity sensor 51 is also a single package structure, and the proximity sensor 51 can be fixed on the substrate 66 and accommodated in the camera housing 67; When protruding in, the proximity sensor 51 can also be fixed on the base plate 66 and located outside the camera housing 67 .

The receiving module 50 of this embodiment is arranged in the camera housing 67, so that the structure of the receiving module 50 and the camera housing 67 is more stable and facilitates the installation of the receiving module 50 and the imaging module 60 on the casing 20; , the imaging module 60 is provided with a substrate 66 and the receiving module 50 is arranged on the substrate 66 , so that the receiving module 50 can be stably installed in the camera housing 67 .

Please refer to FIG. 23 , in some embodiments, the electronic device 100 and the imaging module 60 of the above-mentioned embodiments can be replaced with the following structure: the imaging module 60 is a dual-camera module, including two image sensors 65, a camera housing 67 and two lens modules 68. The top surface 670 of the camera housing 67 is a stepped surface, and the top surface 670 includes a first stepped surface 677 , a second stepped surface 678 lower than the first stepped surface 677 , and a first connecting surface 679 a. The first connecting surface 679a is obliquely connected to the second stepped surface 678 and forms a cutout 675 with the second stepped surface 678, the first connecting surface 679a is obliquely connected to the first stepped surface 677, and the first connecting surface 679a is located between the first stepped surface 677 and the first stepped surface 677. The second stair surface 678 is connected to the first stair surface 677 and the second stair surface 678 . The included angle between the first connecting surface 679a and the first stepped surface 677 may be an obtuse angle or a right angle, and the included angle between the first connecting surface 679a and the second stepped surface 678 may be an obtuse angle or a right angle. The cutout 675 is opened on one end of the camera housing 67 , that is to say, the cutout 675 is located at the edge of the top surface 670 . The two light exit holes 674 are both set on the first stepped surface 677 and located on the same side of the cutout 675 , and the line connecting the centers of the two light exit holes 674 is perpendicular to the extending direction of the cutout 675 . The two lens modules 68 are accommodated in the camera housing 67 and correspond to the two light exit holes 674 respectively, the two image sensors 65 are accommodated in the camera housing 67 and correspond to the two lens modules 68 respectively, and the electronic device The light outside 100 can pass through the light exit hole 674 and the lens module 68 and be transmitted to the image sensor 65 . In this embodiment, the imaging module 60 may be a visible light camera 61 , and at this time, the two lens modules 68 are lens modules corresponding to the visible light camera 61 . The receiving module 50 is disposed on the second step 678 and outside the camera housing 67 . The receiving module 50 is a single package formed by the proximity sensor 51 and the light sensor 52 . The direction of the center line between the proximity sensor 51 and the photoreceptor 52 can be consistent with the extension direction of the notch 675; or, the direction of the center line between the proximity sensor 51 and the photoreceptor 52 can be perpendicular to the extension direction of the notch 675 (as shown in Figure 23 shown) or the angle formed by the two is acute or obtuse. In other embodiments, the imaging module 60 may be an infrared camera 62 , and at this time, the two lens modules 68 are lens modules corresponding to the infrared camera 62 . In yet another embodiment, the imaging module 60 includes a visible light camera 61 and an infrared light camera 62. At this time, one of the lens modules 68 is a lens module corresponding to the infrared light camera 62, and the other lens module 68 is a visible light camera 61. Corresponding lens module.

The imaging module 60 of this embodiment is provided with a cutout 675, and the receiving module 50 is arranged on the second step surface 678, so that the receiving module 50 and the imaging module 60 are arranged more compactly, and the horizontal space occupied by both Smaller, saving the installation space in the electronic device 100; at the same time, the proximity sensor 51 and the light sensor 52 are packaged together to form the receiving module 50, which reduces the gap between the two when they are assembled separately, and saves the installation space in the electronic device 100.

Please refer to FIG. 24 , in some embodiments, the slit 675 of the above-mentioned embodiment is set at the middle position of the top surface 670, and the first step surface 677 is separated into a first sub-step surface 677a and a second sub-step surface by the cutout 675. 677b, the first sub-step surface 677a and the second sub-step surface 677b are respectively located on opposite sides of the cutout 675, and two light-emitting through holes 674 are opened on the first sub-step surface 677a and the second sub-step surface 677b respectively, and are installed on the The lens module 68 inside the camera housing 67 is also located on opposite sides of the cutout 675 . At this time, the cutout 675 is surrounded by the second step surface 678, the first connecting surface 679a and the second connecting surface 679b, and the first connecting surface 679a obliquely connects the first sub-top surface 677a and the second step surface 678 and is located on the first sub-top surface 677a. Between the top surface 677 a and the second step surface 678 , the second connecting surface 679 b obliquely connects the second sub-top surface 677 b and the second step surface 678 and is located between the second sub-top surface 677 b and the second step surface 678 . In this embodiment, the first step surface 677 is parallel to the second step surface 678, the angle between the first connection surface 679a and the first sub-step surface 677a is an obtuse angle, and the angle between the second connection surface 679b and the second sub-step surface 677b The angle is obtuse. In other embodiments, the included angle between the first connecting surface 679a and the first sub-step surface 677a is a right angle, and the included angle between the second connecting surface 679b and the second sub-step surface 677b is a right angle. Compared with setting the cutout 675 at the edge of the top surface 670, setting the cutout 675 in the middle of the top surface 670 in this embodiment can make the width of the cutout 675 wider, thereby facilitating the installation of the receiving module 50 on the second step surface 678 on.

Please refer to FIG. 23 and FIG. 24 , in some embodiments, the receiving module 50 of the above embodiments is disposed on the second step 678 and located outside the camera housing 67 . Specifically, when the notch 675 is set at the edge of the top surface 670, the entire receiving module 50 can be located in the second step 678 along the projection perpendicular to the second step 678; or, part of the receiving module 50 can be located in the vertical The projection on the second step surface 678 is located inside the second step surface 678 (as shown in FIG. 23 ). That is to say, at least a part of the receiving module 50 is located directly above the second step surface 678 . When the cutout 675 is provided in the middle of the top surface 670 , the entire receiving module 50 can be located in the second stepped surface 678 along the projection perpendicular to the second stepped surface 678 (as shown in FIG. 24 ). In this way, the receiving module 50 and the imaging module 60 are arranged more compactly, and the horizontal space occupied by both is small, which further saves the installation space in the electronic device 100 . In other embodiments, the receiving module 50 includes a proximity sensor 51 and a light sensor 52, but the proximity sensor 51 and the light sensor 52 are two separate single packages. At this time, each of the proximity sensor 51 and the light sensor of a single package The devices 52 can also be arranged on the second step surface 678.

Please refer to FIG. 24 , in some embodiments, the receiving module 50 of the above-mentioned embodiment only includes a proximity sensor 51, and the receiving module 50 does not include a light sensor 52. At this time, the proximity sensor 51 (or the receiving module 50 ) and the photoreceptor 52 are each in a single package structure, the proximity sensor 51 is disposed on the second step surface 678 , and the photoreceptor 52 is disposed on the casing 20 outside the imaging module 60 .

Please refer to FIG. 24 , in some embodiments, the receiving module 50 of the above-mentioned embodiment only includes a photoreceptor 52, and the receiving module 50 does not include a proximity sensor 51. At this time, the photoreceptor 52 (or the receiving module 50 ) and the proximity sensor 51 are each a single package structure, the light sensor 52 is disposed on the second step 678 , and the proximity sensor 51 is disposed on the housing 20 outside the imaging module 60 .

Please refer to FIG. 25 , the second step surface 678 of the above embodiment is provided with a light-transmitting hole 676 , and the receiving module 50 is located in the camera housing 67 and corresponds to the light-transmitting hole 676 . Specifically, when the receiving module 50 only includes the proximity sensor 51 without the photoreceptor 52, and the photoreceptor 52 is arranged outside the camera housing 67, the number of the light-transmitting hole 676 can be one, and the light outside the electronic device 100 It can pass through the light-transmitting hole 676 and be transmitted to the proximity sensor 51 . The receiving module 50 of this embodiment is arranged in the camera casing 67 , which makes the structure of the receiving module 50 and the camera casing 67 more stable and facilitates the installation of the receiving module 50 and the imaging module 60 on the casing 20 .

Please continue to refer to FIG. 25 , the second step surface 678 of the above embodiment is provided with a light-transmitting hole 676 , and the receiving module 50 is located in the camera housing 67 and corresponds to the light-transmitting hole 676 . Specifically, when the receiving module 50 only includes the light sensor 52 without the proximity sensor 51, and the proximity sensor 51 is arranged outside the camera housing 67, the number of the light transmission hole 676 can be one, and the light outside the electronic device 100 It can pass through the light-transmitting hole 676 and be transmitted to the photoreceptor 52 . The receiving module 50 of this embodiment is arranged in the camera casing 67 , which makes the structure of the receiving module 50 and the camera casing 67 more stable and facilitates the installation of the receiving module 50 and the imaging module 60 on the casing 20 .

Please refer to FIG. 26 , in some embodiments, the second step surface 678 of the above embodiment is provided with a light-transmitting hole 676 , and the receiving module 50 is located in the camera housing 67 and corresponds to the light-transmitting hole 676 . Specifically, when the receiving module 50 is integrated with the proximity sensor 51 and the light sensor 52, the light transmission hole 676 can be one light transmission hole corresponding to both the proximity sensor 51 and the light sensor 52 or two spaced apart from each other and respectively connected to the light sensor 52. The light transmission hole corresponding to the proximity sensor 51 and the light sensor 52 , light outside the electronic device 100 can pass through the light transmission hole 676 and be transmitted to the proximity sensor 51 and the light sensor 52 in the receiving module 50 . In other embodiments, the receiving module 50 includes a proximity sensor 51 and a light sensor 52, but the proximity sensor 51 and the light sensor 52 are two separate single packages. At this time, each of the proximity sensor 51 and the light sensor of a single package The detectors 52 can also be arranged in the camera housing 67 and correspond to the light-transmitting holes 676 . The receiving module 50 of this embodiment is arranged in the camera casing 67 , which makes the structure of the receiving module 50 and the camera casing 67 more stable and facilitates the installation of the receiving module 50 and the imaging module 60 on the casing 20 .

Please continue to refer to FIG. 26 , in some embodiments, the second step surface 678 of the above embodiment is provided with a light-transmitting hole 676 , and the receiving module 50 is located in the camera housing 67 and corresponds to the light-transmitting hole 676 . The imaging module 60 also includes a substrate 66 on which the image sensor 65 is disposed. The receiving module 50 can also be fixed on the substrate 66 and accommodated in the camera housing 67 . Specifically, an FPC is disposed on the substrate 66 , one end of the FPC is located in the camera housing 67 and used to carry the image sensor 65 , and the other end of the FPC can be connected to the main board of the electronic device 100 . In other implementation manners, the receiving module 50 can also be connected with the FPC. In this embodiment, the receiving module 50 disposed on the substrate 66 includes a proximity sensor 51 and a light sensor 52, and the proximity sensor 51 and the light sensor 52 together form a single package structure, which reduces the gap between the two when they are assembled separately. The installation space in the electronic device 100 is saved.

In other embodiments, the receiving module 50 only includes the proximity sensor 51, and the light sensor 52 is not integrated in the receiving module 50, that is to say, the receiving module 50 is a single package structure of the proximity sensor 51, and the light sensor The device 51 is also a single package structure, and the photoreceptor 52 can be fixed on the substrate 66 and accommodated in the camera housing 67; When extended, the light sensor 52 can also be fixed on the base plate 66 and be located outside the camera housing 67 .

In yet another embodiment, the receiving module 50 only includes the photosensor 52, and the proximity sensor 51 is not integrated in the receiving module 50, that is, the receiving module 50 is a single package structure of the photosensor 52, The proximity sensor 51 is also a single package structure, and the photoreceptor 52 can be fixed on the substrate 66 and accommodated in the camera housing 67; When protruding in, the proximity sensor 51 can also be fixed on the base plate 66 and located outside the camera housing 67 .

The receiving module 50 of this embodiment is arranged in the camera housing 67, so that the structure of the receiving module 50 and the camera housing 67 is more stable and facilitates the installation of the receiving module 50 and the imaging module 60 on the casing 20; , the imaging module 60 is provided with a substrate 66 and the receiving module 50 is arranged on the substrate 66 , so that the receiving module 50 can be stably installed in the camera housing 67 .

In the description of this specification, references to the terms "certain embodiments," "one embodiment," "some embodiments," "exemplary embodiments," "examples," "specific examples," or "some examples" To describe means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the described specific features, structures, materials or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include at least one of said features. In the description of the present invention, "plurality" means at least two, such as two, three, unless otherwise specifically defined.

Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present invention, those skilled in the art can make the above-mentioned The embodiments are subject to changes, modifications, substitutions and variations, the scope of the present invention is defined by the claims and their equivalents.

Claims (14)

1. An output module, characterized in that, the output module includes a package housing, a structured light projector, a first infrared light source, and a second infrared light source arranged around the first infrared light source, the package The housing includes a packaging substrate, the structured light projector, the first infrared light source and the second infrared light source are packaged in the packaging housing and carried on the packaging substrate, when the second infrared light source is turned off , when the first infrared light source emits infrared light to the outside of the packaging casing with the first power, the output module is used for infrared distance measurement; when both the first infrared light source and the second infrared light source are turned on and The output module is used for supplementary infrared light when emitting infrared light to the outside of the packaging shell with the second power. 2. The output module according to claim 1, characterized in that, The first infrared light source is a point light source, and the second infrared light source is a point light source and the number is multiple; or The first infrared light source is a point light source, and the second infrared light source is a ring light source; or The first infrared light source is a plurality of ring-shaped point light sources, and the second infrared light source is a ring-shaped light source; or The first infrared light source is a plurality of circular point light sources, and the second infrared light source is a plurality of point light sources; or The first infrared light source is a ring light source; the second infrared light source is a point light source and the number is multiple; or The first infrared light source is a ring light source; the second infrared light source is a ring light source. 3. The output module according to claim 1, characterized in that, the output module further comprises a chip, and the structured light projector, the first infrared light source and the second infrared light source are formed on a single chip. on the chip. 4. The output module according to claim 3, wherein the package housing further comprises a package side wall and a package top, and the package side wall extends from the package substrate and is connected between the package top and the package top. Between the packaging substrates, a first light exit window and a second light exit window are formed on the top of the package, the first light exit window corresponds to the first infrared light source and the second infrared light source, and the second light exit window corresponds to the first infrared light source and the second infrared light source. The window corresponds to the structured light projector. 5. The output module according to claim 3, characterized in that, the output module further comprises a lens, the lens is arranged in the package housing and is connected to the first infrared light source and the second infrared light source. corresponding to the light source. 6. The output module according to claim 1, characterized in that, the output module further comprises an optical enclosure made of a light-transmitting material, the optical enclosure is formed on the packaging substrate and located on the In the package housing, the optical enclosure wraps the first infrared light source and the second infrared light source. 7. The output module according to claim 1, characterized in that, the output module further comprises a metal shielding plate, the metal shielding plate is located in the package housing, the first infrared light source and the second infrared light source Two infrared light sources are located on one side of the metal shielding plate, and the structured light projector is located on the other side of the metal shielding plate. 8. An electronic device, characterized in that the electronic device comprises: chassis; and The output module according to any one of claims 1-7, wherein the output module is arranged in the casing. 9. The electronic device according to claim 8, characterized in that, the electronic device also includes a light-transmitting cover plate, and the casing is provided with an organic casing infrared through hole and a casing structured light through hole, and the first Both an infrared light source and the second infrared light source correspond to the infrared through hole of the casing, the structured light projector corresponds to the structured light through hole of the casing, and the cover plate is arranged on the casing. 10. The electronic device according to claim 9, wherein the surface of the cover plate combined with the casing is formed with an infrared transparent ink that only transmits infrared light, and the infrared transparent ink blocks the At least one of the infrared through hole of the casing and the structural light through hole of the casing. 11. The electronic device according to claim 8, further comprising a receiving module and an imaging module, the receiving module is integrated with a proximity sensor and a light sensor, and the imaging module includes a mirror A base, a lens barrel mounted on the mirror base, and an image sensor housed in the mirror base, the mirror base includes a mounting surface between the lens barrel and the image sensor, and the receiving module group is provided on the mounting surface. 12. The electronic device according to claim 8, characterized in that, the electronic device further comprises a proximity sensor, a light sensor, and an imaging module, and the imaging module includes a mirror base mounted on the mirror base The lens barrel, and the image sensor accommodated in the lens seat, the lens seat includes a mounting surface between the lens barrel and the image sensor, at least one of the proximity sensor and the photosensor One is provided on the mounting surface. 13. The electronic device according to claim 11 or 12, wherein the imaging module comprises at least one of a visible light camera and an infrared light camera. 14. The electronic device according to claim 8, wherein the electronic device further comprises a receiver, an infrared camera, a visible light camera and a light-transmitting cover plate, and the casing is provided with an organic casing sound hole, so The cover plate is provided with a cover plate sound hole, the receiver corresponds to the positions of the cover plate sound hole and the shell sound hole, the output module, the infrared camera and the visible light camera The centers of are located on the same line segment, and the receiver is located between the line segment and the top of the casing.