CN108200235B - Output module and electronic device - Google Patents

Abstract

The invention discloses an output module. The output module comprises a packaging shell, a first infrared light source and a second infrared light source arranged around the first infrared light source. The package housing includes a package substrate. The first infrared light source and the second infrared light source are packaged in the packaging shell and are carried on the packaging substrate. When the second infrared light source is turned off and the first infrared light source emits infrared light to the outside of the packaging shell at a first power, the output module is used as a proximity infrared lamp; when the first infrared light source and the second infrared light source are both started and emit infrared light to the outside of the packaging shell by second power, the output module is used as an infrared light supplement lamp. According to the output module disclosed by the embodiment of the invention, the first infrared light source and the second infrared light source are controlled to be turned on and off, the output module can be used as a proximity infrared lamp and an infrared light supplement lamp, the functions of infrared distance measurement and infrared light supplement by emitting infrared light are integrated, and the occupied space is small. In addition, the invention also discloses an electronic device.

Description

Output modules and electronics

technical field

The present invention relates to the technical field of consumer electronics, and more particularly, to an output module and an electronic device.

Background technique

As the functions supported by mobile phones become more and more diverse, the types and numbers of functional devices that need to be set on mobile phones are also increasing. Proximity sensors, ambient light sensors, infrared light cameras, structured light projectors and other functional devices are configured in the middle of the mobile phone, and in order to arrange many functional devices, it will take up too much space on the mobile phone.

SUMMARY OF THE INVENTION

Embodiments of the present invention provide an output module and an electronic device.

The output module of the embodiment of the present invention includes a package casing, a first infrared light source, and a second infrared light source disposed around the first infrared light source, the package casing includes a package substrate, the first infrared light source is connected to the The second infrared light source is encapsulated in the encapsulation casing and carried on the encapsulation substrate. When the second infrared light source is turned off, the first infrared light source emits infrared light to the outside of the encapsulation casing with the first power. , the output module is used as a proximity infrared light; when both the first infrared light source and the second infrared light source are turned on and emit infrared light to the outside of the package shell with a second power, the output module is used for For infrared fill light.

The electronic device according to the embodiment of the present invention includes:

enclosure; and

In the output module of the embodiment of the present invention, the output module is arranged in the casing.

In the output module and the electronic device according to the embodiment of the present invention, by controlling the opening and closing of the first infrared light source and the second infrared light source, the output module can be used as a near-infrared light or as an infrared fill light. It has the functions of emitting infrared light for infrared ranging and infrared fill light. In addition, the first infrared light source and the second infrared light source are integrated into a single package structure, the output module has a high integration degree and a small volume, and the output module saves the space for realizing infrared fill light and infrared ranging functions. Furthermore, the first infrared light source and the second infrared light source are carried on the same packaging substrate. Compared with the infrared fill light and the near-infrared lamp of the traditional process, different wafers are respectively used to manufacture and then combine them on the PCB substrate for packaging, which improves the performance. packaging efficiency.

Additional aspects and advantages of embodiments of the present invention will be set forth, in part, from the following description, and in part will be apparent from the following description, or learned by practice of embodiments of the invention.

Description of drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily understood from the following description of embodiments taken in conjunction with the accompanying drawings, wherein:

1 is a schematic structural diagram of an electronic device according to an embodiment of the present invention;

2 is a schematic perspective view of an output module of an electronic device according to an embodiment of the present invention;

3 to 4 are schematic state diagrams of an output module of an electronic device according to an embodiment of the present invention;

5 is a schematic cross-sectional view of an output module of an electronic device according to an embodiment of the present invention;

6 to 8 are schematic diagrams of the distribution of the first infrared light source and the second infrared light source of the output module according to the embodiment of the present invention;

9 is a partial perspective view of an output module of an electronic device according to an embodiment of the present invention;

10 is a partial cross-sectional schematic diagram of an electronic device according to an embodiment of the present invention;

11 is a schematic perspective view of a receiving module and an imaging module of an electronic device according to an embodiment of the present invention;

12 is a schematic diagram of an arrangement of electronic components of an electronic device according to an embodiment of the present invention;

13 is a schematic cross-sectional view of an output module of an electronic device according to an embodiment of the present invention;

14 is a schematic perspective view of a proximity sensor and an imaging module according to an embodiment of the present invention;

15 is a schematic structural diagram of an electronic device according to an embodiment of the present invention;

16 is a partial cross-sectional schematic diagram of an electronic device according to an embodiment of the present invention;

17 is a schematic perspective view of a receiving module and an imaging module according to an embodiment of the present invention;

18 to 25 are schematic perspective views of a receiving module and an imaging module of an electronic device according to an embodiment of the present invention.

Detailed ways

The embodiments of the present invention will be further described below with reference to the accompanying drawings. The same or similar reference numbers refer to the same or similar elements or elements having the same or similar functions throughout the drawings.

In addition, the embodiments of the present invention described below in conjunction with the accompanying drawings are exemplary, and are only used to explain the embodiments of the present invention, and should not be construed as limiting the present invention.

In the present invention, unless otherwise expressly specified and limited, a first feature "on" or "under" a second feature may be in direct contact between the first and second features, or the first and second features indirectly through an intermediary touch. Also, the first feature being "above", "over" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is level higher than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature has a lower level than the second feature.

Referring to FIG. 1 , an electronic device 100 according to an embodiment of the present invention includes a casing 20 , a cover 30 and electronic components. The electronic components include an output module 10 , a receiving module 50 (as shown in FIG. 11 ), an imaging module 60 (as shown in FIG. 11 ), a receiver 70 and a structured light projector 80 . The electronic device 100 can be a mobile phone, a tablet computer, a notebook computer, a smart watch, a smart bracelet, an ATM, etc. The embodiment of the present invention is described by taking the electronic device 100 as a mobile phone as an example, and it can be understood that the specific form of the electronic device 100 can be other , which is not limited here.

Please refer to FIGS. 2 to 4 , the output module 10 is a single package structure, including a package housing 11 , a first infrared light source 12 and a second infrared light source 13 .

The packaging casing 11 is used to encapsulate the first infrared light source 12 and the second infrared light source 13 at the same time. The package housing 11 includes a package substrate 111 , a package sidewall 112 and a package top 113 . The package casing 11 may be made of an electromagnetic interference (Electromagnetic Interference, EMI) shielding material to prevent external electromagnetic interference from affecting the output module 10 .

Please refer to FIG. 5 , the package substrate 111 is used to carry the first infrared light source 12 and the second infrared light source 13 . When manufacturing the output module 10 , the first infrared light source 12 and the second infrared light source 13 can be formed on a chip 14 , and then the first infrared light source 12 , the second infrared light source 13 and the chip 14 are arranged on the packaging substrate 111 together , specifically, the chip 14 may be bonded on the package substrate 111 . Meanwhile, the package substrate 111 can also be used to connect with other components of the electronic device 100 (eg, the chassis 20 of the electronic device 100 , the main board, etc.) to fix the output module 10 in the electronic device 100 .

The package sidewall 112 can be arranged around the first infrared light source 12 and the second infrared light source 13 , the package sidewall 112 extends from the package substrate 111 , and the package sidewall 112 can be combined with the package substrate 111 . Preferably, the package sidewall 112 is connected to the package substrate 111 . The base plate 111 is detachably connected, so that the first infrared light source 12 and the second infrared light source 13 can be repaired after the side wall 112 of the package is removed. The packaging side wall 112 may be made of a material that does not transmit infrared light, so as to prevent the infrared light emitted by the first infrared light source 12 and the second infrared light source 13 from passing through the packaging side wall 112 .

The package top 113 is opposite to the package substrate 111 , and the package top 113 is connected to the package sidewall 112 . A light-emitting window 1131 is formed on the package top 113 , and the light-emitting window 1131 corresponds to the first infrared light source 12 and the second infrared light source 13 . The package top 113 and the package side wall 112 can be formed integrally or separately. In one example, the light-emitting window 1131 is a through hole, and the material for making the package top 113 is a material that does not transmit infrared light. In another example, the package top 113 is made of a material that does not transmit infrared light and a material that transmits infrared light. Specifically, the light emitting window 1131 is made of a material that transmits infrared light, and the rest of the package is made of a material that does not transmit infrared light. material, further, the light-emitting window 1131 can be formed with a lens structure to improve the emission angle of infrared light emitted from the light-emitting window 1131, for example, the light-emitting window 1131 is formed with a concave lens structure, so that the light passing through the light-emitting window 1131 scatters outwards Exit; the light-emitting window 1131 is formed with a convex lens structure, so that the light passing through the light-emitting window 1131 is concentrated and emitted outward.

The first infrared light source 12 and the second infrared light source 13 can be formed on a chip 14, which further reduces the integrated volume of the first infrared light source 12 and the second infrared light source 13, and the manufacturing process is relatively simple. The first infrared light source 12 and the second infrared light source 13 may emit infrared light. When both the first infrared light source 12 and the second infrared light source 13 are turned on and emit infrared light to the outside of the package casing 11 (as shown in FIG. 3 ), the infrared light passes through the light-emitting window 1131 to be projected onto the surface of the object, and the electronic device 100 The infrared light camera 62 (as shown in FIG. 1 ) receives the infrared light reflected by the object to obtain the image information of the object. At this time, the output module 10 is used as an infrared fill light (ie, used for infrared fill light), and the first The luminous area covered by the infrared light used for supplementary light emitted by the infrared light source 12 and the second infrared light source 13 together is relatively large, and the field angle α of the infrared light for supplementary light can be 60 degrees to 90 degrees, for example: infrared light for supplementary light The viewing angle α of the light is 60 degrees, 65 degrees, 70 degrees, 75 degrees, 80 degrees, 82 degrees, 85 degrees, 87 degrees, 90 degrees, or the like. When the second infrared light source 13 is turned off and the first infrared light source 12 emits infrared light to the outside of the package casing 11 (as shown in FIG. 4 ), the infrared light passes through the light-emitting window 1131 and reaches the surface of the object, and the proximity sensor 51 of the electronic device 100 (As shown in FIG. 11 ) to receive the infrared light reflected by the object to detect the distance from the object to the electronic device 100 , at this time, the output module 10 is used as a proximity infrared lamp (ie, used for infrared ranging), and the first infrared light source The luminous area covered by the infrared light emitted by 12 for infrared ranging is small, and the field of view angle β of the infrared light for infrared ranging is 10°-30°, for example: the field angle β of the infrared light for infrared ranging is 10 degrees, 15 degrees, 20 degrees, 25 degrees, or 30 degrees, etc. In the embodiment of the present invention, the field of view refers to the range covered by the infrared light emitted from the package casing 11 through the light emitting window 1131 .

The output module 10 can emit infrared light to the outside of the package casing 11 with different powers when it is used as an infrared fill light and when it is used as a near-infrared light. When the output module 10 is used as a near-infrared lamp, it emits infrared light to the outside of the package shell 11 with a first power, and when the output module 10 is used as an infrared fill light, it emits infrared light to the outside of the package shell 11 with a second power, wherein , the first power may be smaller than the second power.

The second infrared light source 13 is arranged around the first infrared light source 12 . The first infrared light source 12 and the second infrared light source 13 can be represented as a circle, a ring, a square or a regular polygon as a whole. It can be: the first infrared light source 12 is a point light source, and the second infrared light source 13 is also a point light source and the number is multiple (as shown in FIG. 6 ); or the first infrared light source 12 is a point light source, and the second infrared light source 13 is Ring light source (as shown in FIG. 7 ); or the first infrared light source 12 is a plurality of point light sources in a ring shape, and the second infrared light source 13 is a ring light source; or the first infrared light source 12 is a plurality of point light sources in a ring shape , the second infrared light source 13 is a point light source and the number is multiple (as shown in FIG. 8 ); or the first infrared light source 12 is a ring light source; the second infrared light source 13 is a point light source and the number is multiple; The light source 12 is a ring light source; the second infrared light source 13 is a ring light source.

Referring to FIG. 9 , in the embodiment of the present invention, the output module 10 is formed with a ground pin 15 , a fill light pin 16 and a proximity light pin 17 . The ground pin 15, the fill light pin 16 and the proximity light pin 17 may be formed on the package substrate 111, when the ground pin 15 and the fill light pin 16 are enabled (ie, the ground pin 15 and the fill light pin 16 are enabled). When the light pin 16 is connected to the circuit and is turned on), the first infrared light source 12 and the second infrared light source 13 emit infrared light; when the ground pin 15 and the proximity light pin 17 are enabled (that is, the ground pin 15 and when the proximity lamp pin 17 is connected to the circuit), the first infrared light source 12 emits infrared light.

Referring to FIG. 1 and FIG. 10 , the casing 20 can be used as a mounting carrier for the output module 10 , or the output module 10 can be disposed in the casing 20 . The casing 20 may be an outer shell of the electronic device 100. In the embodiment of the present invention, the casing 20 can also be used to set the display screen 90 of the electronic device 100. Since the output module 10 in the embodiment of the present invention occupies a small volume, Therefore, the volume for disposing the display screen 90 in the casing 20 can be correspondingly increased, so as to increase the screen ratio of the electronic device 100 . Specifically, the casing 20 includes a top portion 21 and a bottom portion 22. The display screen 90 and the output module 10 are disposed between the top portion 21 and the bottom portion 22. When the user normally uses the electronic device 100, the top portion 21 is located above the bottom portion 22. As shown in FIG. 1 , the output module 10 may be disposed between the display screen 90 and the top 21 . In other embodiments, the display screen 90 may be provided with a notch for the full screen, the display screen 90 surrounds the output module 10 , and the output module 10 is exposed from the notch of the display screen 90 .

The casing 20 also defines an organic casing through hole 23 . When the output module 10 is disposed in the casing 20 , the first infrared light source 12 and the second infrared light source 13 correspond to the through holes 23 of the casing. The correspondence between the first infrared light source 12 and the second infrared light source 13 and the through hole 23 of the casing means that the light emitted by the first infrared light source 12 and the second infrared light source 13 can pass through the through hole 23 of the casing. An infrared light source 12 and a second infrared light source 13 are directly opposite to the casing through hole 23 , or the light emitted by the first infrared light source 12 and the second infrared light source 13 can pass through the casing through hole 23 after being acted by a light guide element.

The cover plate 30 may be transparent, and the material of the cover plate 30 may be transparent glass, resin, plastic, or the like. The cover plate 30 is arranged on the casing 20. The cover plate 30 includes an inner surface 32 combined with the casing 20 and an outer surface 31 opposite to the inner surface 32. The light emitted by the output module 10 passes through the inner surface 32 and the inner surface 32 in turn. The outer surface 31 passes through the cover plate 30 afterward. In the embodiment shown in FIG. 10 , the cover plate 30 covers the through hole 23 of the casing, and the inner surface 32 of the cover plate 30 is coated with infrared transmission ink 40 , and the infrared transmission ink 40 has a higher resistance to infrared light. The transmittance, for example, can reach 85% or more, and has a high attenuation rate for visible light, such as can reach more than 70%, so that it is difficult for the naked eye to see the infrared transmitting ink 40 on the electronic device 100 during normal use. covered area. Specifically, the infrared transmissive ink 40 may cover areas on the inner surface 32 that do not correspond to the display screen 90 .

The infrared transmission ink 40 can also block the casing through hole 23 (as shown in FIG. 10 ), and it is difficult for a user to see the internal structure of the electronic device 100 through the casing through hole 23 , and the electronic device 100 has a beautiful appearance.

Please refer to FIG. 11 , the receiving module 50 integrates a proximity sensor 51 and a photo sensor 52 , and the proximity sensor 51 and the photo sensor 52 together form a single package structure. When the output module 10 is used as a proximity infrared lamp, the infrared light emitted to the outside is reflected by the external object and then received by the proximity sensor 51. The proximity sensor 51 determines the distance between the external object and the electronic device 100 according to the received reflected infrared light. the distance. The light sensor 52 receives the visible light in the ambient light, and detects the intensity of the visible light as a basis for controlling the display brightness of the display screen 90 . The proximity sensor 51 and the light sensor 52 are packaged together to form the receiving module 50 , which reduces the gap when the two are assembled separately and saves the installation space in the electronic device 100 .

Please refer to FIG. 1 and FIG. 11 , the imaging module 60 may be one or both of the visible light camera 61 and the infrared light camera 62 . The imaging module 60 includes a lens holder 63 , a lens barrel 64 and an image sensor 65 . The lens barrel 64 is mounted on the lens holder 63 , and the image sensor 65 is accommodated in the lens holder 63 . The lens mount 63 includes a mounting surface 631 located between the lens barrel 64 and the image sensor 65 . In the embodiment shown in FIG. 11 , the receiving module 50 is arranged on the installation surface 631 . Specifically, the orthographic projection of the receiving module 50 on the plane where the installation surface 631 is located falls at least partially onto the installation surface 631 . In this way, The receiving module 50 and the imaging module 60 are set relatively compactly, and the lateral space occupied by the two is relatively small.

Please refer to FIG. 1 , the receiver 70 is used to send out a sound wave signal when it is excited by a power source, and a user can make a call through the receiver 70 . The structured light projector 80 is used for emitting structured light outward, the structured light is projected on the object to be measured and then reflected, and the reflected structured light can be received by the infrared light camera 62 , and the processor of the electronic device 100 further analyzes the light by the infrared light camera 62 . Received structured light to obtain the depth information of the measured object.

In the embodiment shown in FIG. 1 , the imaging module 60 includes a visible light camera 61 and an infrared light camera 62 , and the centers of the output module 10 , the infrared light camera 62 , the visible light camera 61 , the receiver 70 and the structured light projector 80 are located at the center on the same line segment. Specifically, from one end of the line segment to the other end are the output module 10, the structured light projector 80, the receiver 70, the infrared light camera 62, and the visible light camera 61 (as shown in FIG. 12); or from one end of the line segment to the other end The sequence is the output module 10, the infrared light camera 62, the receiver 70, the visible light camera 61, and the structured light projector 80 (as shown in Figure 1); or from one end of the line segment to the other end, the infrared light camera 62, the output module 10. The receiver 70, the visible light camera 61, the structured light projector 80; or the infrared light camera 62, the visible light camera 61, the receiver 70, the output module 10, and the structured light projector 80 in sequence from one end of the line segment to the other end. Of course, the arrangement of the output module 10, the infrared light camera 62, the receiver 70, the visible light camera 61, and the structured light projector 80 is not limited to the above examples, and other arrangements are possible, for example, the centers of the electronic components are arranged in an arc shape , the center is arranged in a rectangular shape.

Further, please refer to FIG. 11, the receiving module 50 can be arranged on the installation surface 631 of the infrared camera 62, and can also be arranged on the installation surface 631 of the visible light camera 61. Of course, the receiving module 50 can also not be arranged on the installation surface 631. On the surface 631, the receiving module 50 can be arranged adjacent to the output module 10, and the proximity sensor 51 can easily receive the infrared light emitted when the output module 10 is used as a proximity infrared lamp and reflected back by external objects; the receiving module 50 can also be arranged adjacent to the receiver 70 , when the user answers the phone, the proximity sensor 51 can easily detect that the user's ear is close to the receiver 70 .

To sum up, in the electronic device 100 according to the embodiment of the present invention, by controlling the opening and closing of the first infrared light source 12 and the second infrared light source 13 , the output module 10 can be used not only as a near-infrared light, but also as an infrared supplementary light. The lamp integrates the functions of emitting infrared light for infrared ranging and infrared fill light. In addition, the first infrared light source 12 and the second infrared light source 13 are integrated into a single package structure, the output module 10 has a high integration degree and a small volume, and the output module 10 saves the time required to realize infrared fill light and infrared ranging. functional space. In addition, since the first infrared light source 12 and the second infrared light source 13 are carried on the same package substrate 111 , compared with the traditional infrared fill light and the near-infrared light, different wafers are required to be fabricated and assembled on the PCB substrate. packaging, improving packaging efficiency.

Referring to FIG. 5 again, in some embodiments, the output module 10 further includes a lens 18 . The lens 18 is disposed in the package housing 11 and corresponds to the first infrared light source 12 and the second infrared light source 13 . The infrared light emitted by the first infrared light source 12 and the second infrared light source 13 is condensed into the light-emitting window 1131 under the action of the lens 18 and emitted, which reduces the amount of light emitted to other areas of the package sidewall 112 and the package top 113, and only needs to meet the requirements of the first infrared light source. The field angle α of the infrared light emitted by the first infrared light source 12 and the second infrared light source 13 for supplementary light after passing through the lens 18 is 60°-90°, and the infrared light emitted by the first infrared light source 12 for infrared ranging The field angle β of the light passing through the lens 18 is 10°-30°. Specifically, the lens 18 may be located on the transparent base, and more specifically, the lens 18 may be integrally formed with the transparent base. Of course, the output module 10 may not be provided with the lens 18 .

Referring to FIG. 13 , in some embodiments, the output module 10 further includes an optical cover 19 . The optical cover 19 is made of a light-transmitting material, and the optical cover 19 is formed on the package substrate 111 and located in the package case 11 . The optical enclosure 19 encloses the first infrared light source 12 and the second infrared light source 13 . Specifically, the optical cover 19 can be formed by a glue injection molding process, and the optical cover 19 can be made of a transparent thermosetting epoxy resin, so as not to be easily softened in use, and the optical cover 19 can fix the first infrared light source 12 and the position of the second infrared light source 13 , so that the first infrared light source 12 and the second infrared light source 13 are not easily shaken in the package casing 11 .

Referring to FIG. 14 , in some embodiments, the proximity sensor 51 and the light sensor 52 may not be integrated in the receiving module 50 , or the proximity sensor 51 and the light sensor 52 may be disposed separately. At this time, the proximity sensor 51 can be arranged on the mounting surface 631 of the mirror base 63 ; the optical sensor 52 can also be arranged on the installation surface 631 of the mirror holder 63 ; or the proximity sensor 51 and the optical sensor 52 can be arranged on the mirror holder 63 at the same time on the mounting surface 631. The lens mount 63 may be the lens mount 63 of the infrared light camera 62 or the lens mount 63 of the visible light camera 61 .

Please refer to FIG. 15 , in some embodiments, the casing 20 is further provided with a sound outlet hole (not shown in the figure), the cover plate 30 is further provided with a cover plate sound outlet hole 34 , the receiver 70 and the cover plate sound outlet hole 34 corresponds to the position of the sound outlet of the casing. The centers of the output module 10 , the infrared light camera 62 , the visible light camera 61 and the structured light projector 80 are located on the same line segment, and the receiver 70 is located between the line segment and the top 21 of the casing 20 .

The center of the receiver 70 is not located on the line segment, which saves the lateral space occupied by the electronic components (the output module 10, the infrared camera 62, the visible camera 61, the structured light projector 80, etc.) on the cover plate 30. In the embodiment shown in FIG. 15 , the sound outlet hole 34 of the cover plate is opened at the edge position of the cover plate 30 , and the sound outlet hole of the casing is opened near the top 21 .

Please refer to FIG. 16 again, in some embodiments, the cover plate 30 may also be provided with a cover plate through hole 33, the cover plate through hole 33 corresponds to the casing through hole 23, the first infrared light source 12 and the second infrared light source The infrared light emitted by 13 can pass through the through hole 23 of the casing and pass through the electronic device 100 through the through hole 33 of the cover plate.

Referring to FIG. 17 , in some embodiments, the imaging module 60 further includes a substrate 66 , the image sensor 65 is disposed on the substrate 66 , and the receiving module 50 can also be fixed on the substrate 66 . Specifically, an FPC is provided on the base plate 66, a part of the base plate 66 is located in the mirror base 63, and the other part protrudes from the mirror base 63. One end of the FPC is located in the mirror base 63 and is used to carry the image sensor 65, and the other end can be connected to the mirror base 63. The main board of the electronic device 100 is connected. When the receiving module 50 is arranged on the base plate 66, the receiving module 50 is arranged outside the lens holder 63, and the receiving module 50 can also be connected to the FPC.

Further, the receiving module 50 disposed on the substrate 66 includes a proximity sensor 51 and a photoreceptor 52, and the proximity sensor 51 and the photoreceptor 52 together form a single-package structure, which reduces the gap between the two when they are assembled separately and saves electronics. Installation space within the device 100 . In other embodiments, the receiving module 50 disposed on the substrate 66 includes a proximity sensor 51 or/and a light sensor 52, and the proximity sensor 51 and the light sensor 52 are each a single package structure. That is, the receiving module 50 provided on the substrate 66 is the proximity sensor 51 with a single package structure; or, the receiving module 50 provided on the substrate 66 is the photo sensor 52 with a single package structure; The receiving module 50 is a proximity sensor 51 with a single package structure and a photo sensor 52 with a single package structure.

The imaging module 60 may be one or both of the visible light camera 61 and the infrared light camera 62 . Specifically, the receiving module 50 can be fixed on the substrate 66 of the visible light camera 61 ; the receiving module 50 can be fixed on the substrate 66 of the infrared camera 62 . When the proximity sensor 51 and the light sensor 52 are packaged separately, the proximity sensor 51 can be fixed on the substrate 66 of the visible light camera 61, and the light sensor 52 can be fixed on the substrate 66 of the infrared light camera 62; 52 can be fixed on the substrate 66 of the visible light camera 61, and the proximity sensor 51 can be fixed on the substrate 66 of the infrared camera 62; alternatively, both the proximity sensor 51 and the light sensor 52 are fixed on the substrate 66 of the visible light camera 61; or, Both the proximity sensor 51 and the light sensor 52 are fixed on the substrate 66 of the infrared camera 62 .

Further, the base plate 66 also includes a reinforcing plate, and the reinforcing plate is arranged on the side opposite to the receiving module 50 to increase the overall strength of the base plate 66, so that the FPC is not easily folded, and the receiving module 50 (or close to When the sensor 51 or the photoreceptor 52) is installed on the substrate 66, the shaking is less likely to occur. In one example, the receiving module 50 (or the proximity sensor 51 or the light sensor 52 ) may also be fixed on the outer side wall of the mirror base 63 , for example, by bonding.

Referring to FIG. 18 , in some embodiments, the electronic device 100 and the imaging module 60 in the above-mentioned embodiments can be replaced with the following structures: the imaging module 60 includes an image sensor 65 , a camera housing 67 and a lens module 68 . The top surface 670 of the camera housing 67 is a stepped surface. The top surface 670 includes a first sub-top surface 671, a second sub-top surface 672, and a third sub-top surface 673. The second sub-top surface 672 and the first sub-top surface 671 is connected obliquely and forms a cutout 675 with the first sub-top surface 671, the third sub-top surface 673 is connected obliquely with the second sub-top surface 672, and the second sub-top surface 672 is located on the first sub-top surface 671 and the third sub-top surface. 673 to connect the first sub-top surface 671 and the third sub-top surface 673 . The angle between the second sub-top surface 672 and the first sub-top surface 671 may be an obtuse angle or a right angle, and the angle between the second sub-top surface 672 and the third sub-top surface 673 may be an obtuse angle or a right angle. The cutout 675 is opened on one end of the camera housing 67 , that is, the cutout 675 is located at the edge of the top surface 670 . The third sub-top surface 673 defines a light exit hole 674 , and the lens module 68 is accommodated in the camera housing 67 and corresponds to the light exit hole 674 . The image sensor 65 is accommodated in the camera housing 67 and corresponds to the lens module 68. The light outside the electronic device 100 can pass through the light exit hole 674 and the lens module 68 and be transmitted to the image sensor 65. The image sensor 65 transmits the light signal. converted to electrical signals. The receiving module 50 is disposed at the first sub-top surface 671 , and the receiving module 50 includes a proximity sensor 51 and a light sensor 52 . In this embodiment, the imaging module 60 may be a visible light camera 61 , and the receiving module 50 is a single-package structure formed by the proximity sensor 51 and the photosensor 52 . The direction of the line connecting the center of the proximity sensor 51 and the light sensor 52 may be consistent with the extending direction of the cutout 675 (as shown in FIG. 18 ); The angle formed by the vertical direction or the two is an acute angle or an obtuse angle. In other embodiments, the imaging module 60 may be an infrared camera 62 .

The imaging module 60 of the present embodiment is provided with a cutout 675, and the receiving module 50 is disposed on the first sub-top surface 671, so that the receiving module 50 and the imaging module 60 are set more compactly, and the transverse The space is small, which saves the installation space in the electronic device 100 ; at the same time, the proximity sensor 51 and the light sensor 52 are jointly packaged into the receiving module 50 , which reduces the gap when the two are assembled separately and saves the installation space in the electronic device 100 .

Please continue to refer to FIG. 18 , in some embodiments, the receiving module 50 of the above-mentioned embodiments is disposed on the first sub-top surface 671 and is located outside the camera housing 67 . Specifically, the entire receiving module 50 is perpendicular to The projections of the first sub-top surface 671 can all be located in the first sub-top surface 671 (as shown in FIG. 18 ); or, some of the receiving modules 50 are located on the first sub-top surface along the projection perpendicular to the first sub-top surface 671 . Inside 671. That is to say, at least a part of the receiving module 50 is located directly above the first sub-top surface 671. In this way, the receiving module 50 and the imaging module 60 are set more compactly, and the lateral space occupied by the two is small, which further saves The installation space in the electronic device 100 is reduced. In other embodiments, the receiving module 50 includes a proximity sensor 51 and a light sensor 52, but the proximity sensor 51 and the light sensor 52 are two separate single-package structures, in this case, each is a single-package structure of the proximity sensor 51 And the photoreceptor 52 may also be disposed on the first sub-top surface 671 .

Referring to FIG. 19 , in some embodiments, the receiving module 50 of the above-mentioned embodiments only includes the proximity sensor 51 and does not include the photo sensor 52 . In this case, the proximity sensor 51 (or the receiving module 50 ) and the photo sensor 52 are each a single package structure, the proximity sensor 51 is arranged on the first sub-top surface 671 , and the photo sensor 52 is arranged at any position other than the first sub-top surface 671 .

Please continue to refer to FIG. 19 , in some embodiments, the receiving module 50 of the above-mentioned embodiments only includes the light sensor 52 , but does not include the proximity sensor 51 . In this case, the light sensor 52 (or the receiving module 50 ) and the Each of the proximity sensors 51 is a single package structure, the photo sensor 52 is arranged on the first sub-top surface 671 , and the proximity sensor 51 is arranged at any position other than the first sub-top surface 671 .

Referring to FIG. 20 , the first sub-top surface 671 of the above embodiment is provided with a light-transmitting hole 676 , and the receiving module 50 is located in the camera housing 67 and corresponds to the light-transmitting hole 676 . Specifically, when the receiving module 50 only includes the proximity sensor 51 without the light sensor 52, and the light sensor 52 is disposed outside the camera housing 67, the number of light-transmitting holes 676 can be one, and the light outside the electronic device 100 It can pass through the light-transmitting hole 676 and be transmitted to the proximity sensor 51 . The receiving module 50 in this embodiment is disposed in the camera casing 67 , which makes the structures of the receiving module 50 and the camera casing 67 more stable and facilitates the installation of the receiving module 50 and the imaging module 60 on the casing 20 .

Please continue to refer to 20, the first sub-top surface 671 of the above embodiment is provided with a light-transmitting hole 676, and the receiving module 50 is located in the camera housing 67 and corresponds to the light-transmitting hole 676. Specifically, when the receiving module 50 only includes the light sensor 52 without the proximity sensor 51, and the proximity sensor 51 is disposed outside the camera housing 67, the number of light-transmitting holes 676 can be one, and the light outside the electronic device 100 Can pass through the light-transmitting hole 676 and pass to the photoreceptor 52 . The receiving module 50 in this embodiment is disposed in the camera casing 67 , which makes the structures of the receiving module 50 and the camera casing 67 more stable and facilitates the installation of the receiving module 50 and the imaging module 60 on the casing 20 .

Referring to FIG. 21 , in some embodiments, the first sub-top surface 671 of the above-mentioned embodiment is provided with a light-transmitting hole 676 , and the receiving module 50 is located in the camera housing 67 and corresponds to the light-transmitting hole 676 . Specifically, when the receiving module 50 is integrated with the proximity sensor 51 and the light sensor 52, the light-transmitting hole 676 may be a light-transmitting hole corresponding to both the proximity sensor 51 and the light sensor 52 or two spaced apart from each other and corresponding to each other. Proximity to the light-transmitting holes corresponding to the sensor 51 and the light sensor 52 , the light outside the electronic device 100 can pass through the light-transmitting hole 676 and be transmitted to the proximity sensor 51 and the light sensor 52 in the receiving module 50 . In other embodiments, the receiving module 50 includes a proximity sensor 51 and a light sensor 52, but the proximity sensor 51 and the light sensor 52 are two separate single-package structures, in this case, each is a single-package structure of the proximity sensor 51 The light sensor 52 and the light sensor 52 can also be arranged in the camera housing 67 and correspond to the light-transmitting hole 676 . The receiving module 50 in this embodiment is disposed in the camera casing 67 , which makes the structures of the receiving module 50 and the camera casing 67 more stable and facilitates the installation of the receiving module 50 and the imaging module 60 on the casing 20 .

Referring to FIG. 21 , in some embodiments, the first sub-top surface 671 of the above-mentioned embodiment is provided with a light-transmitting hole 676 , and the receiving module 50 is located in the camera housing 67 and corresponds to the light-transmitting hole 676 . The imaging module 60 further includes a substrate 66 on which the image sensor 65 is disposed. The receiving module 50 can also be fixed on the substrate 66 and accommodated in the camera housing 67 . Specifically, the substrate 66 is provided with an FPC, one end of the FPC is located in the camera housing 67 and is used to carry the image sensor 65 , and the other end can be connected to the main board of the electronic device 100 . In other embodiments, the receiving module 50 may also be connected to the FPC. In this embodiment, the receiving module 50 disposed on the substrate 66 includes a proximity sensor 51 and a photoreceptor 52. The proximity sensor 51 and the photoreceptor 52 together form a single package structure, reducing the gap between the two when they are assembled separately. The installation space in the electronic device 100 is saved.

In other embodiments, the receiving module 50 only includes the proximity sensor 51, and the light sensor 52 is not integrated in the receiving module 50, that is to say, the receiving module 50 is a single package structure of the proximity sensor 51, and the light sensor The sensor 52 is also a single package structure, the light sensor 52 can be fixed on the substrate 66 and accommodated in the camera housing 67; When extended, the light sensor 52 may also be fixed to the base plate 66 and located outside the camera housing 67 .

In yet another embodiment, the receiving module 50 only includes the light sensor 52 , and the proximity sensor 51 is not integrated in the receiving module 50 , that is, the receiving module 50 is a single package structure of the light sensor 52 . , the proximity sensor 51 is also a single package structure, the proximity sensor 51 can be fixed on the substrate 66 and accommodated in the camera housing 67; or, when a part of the substrate 66 is located in the camera housing 67, the other part The proximity sensor 51 may also be fixed on the base plate 66 and located outside the camera housing 67 when extended inward.

The receiving module 50 of this embodiment is disposed in the camera casing 67, which makes the structures of the receiving module 50 and the camera casing 67 more stable and facilitates the installation of the receiving module 50 and the imaging module 60 on the casing 20; , the imaging module 60 is provided with a base plate 66 and the receiving module 50 is set on the base plate 66 , so that the receiving module 50 can be stably installed in the camera housing 67 .

Referring to FIG. 22, in some embodiments, the electronic device 100 and the imaging module 60 of the above-mentioned embodiments can be replaced with the following structures: the imaging module 60 is a dual-camera module, including two image sensors 65, a camera housing 67 and two lens modules 68. The top surface 670 of the camera housing 67 is a stepped surface, and the top surface 670 includes a first stepped surface 677 , a second stepped surface 678 lower than the first stepped surface 677 , and a first connecting surface 679 a. The first connecting surface 679a is connected obliquely with the second stepped surface 678 and forms a cutout 675 with the second stepped surface 678. The first connecting surface 679a is connected with the first stepped surface 677 obliquely. Between the second stepped surfaces 678 , the first stepped surface 677 and the second stepped surface 678 are connected. The included angle between the first connecting surface 679a and the first stepped surface 677 may be an obtuse angle or a right angle, and the included angle between the first connecting surface 679a and the second stepped surface 678 may be an obtuse angle or a right angle. The cutout 675 is opened on one end of the camera housing 67 , that is, the cutout 675 is located at the edge of the top surface 670 . The two light-exit through holes 674 are both opened on the first step surface 677 and located on the same side of the cutout 675 . The two lens modules 68 are accommodated in the camera housing 67 and correspond to the two light exit holes 674 respectively. The two image sensors 65 are accommodated in the camera housing 67 and correspond to the two lens modules 68 respectively. The electronic device The light outside 100 can pass through the light exit hole 674 and the lens module 68 and be transmitted to the image sensor 65 . In this embodiment, the imaging module 60 may be a visible light camera 61 , and in this case, the two lens modules 68 are both lens modules corresponding to the visible light camera 61 . The receiving module 50 is disposed on the second step surface 678 and is located outside the camera housing 67 . The receiving module 50 is a single package structure formed by the proximity sensor 51 and the photo sensor 52 . The direction of the line connecting the center of the proximity sensor 51 and the photoreceptor 52 may be consistent with the extending direction of the incision 675; shown) or the angle formed by the two is an acute angle or an obtuse angle. In other embodiments, the imaging module 60 may be an infrared light camera 62 , and in this case, the two lens modules 68 are lens modules corresponding to the infrared light camera 62 . In yet another embodiment, the imaging module 60 includes a visible light camera 61 and an infrared light camera 62 , and one of the lens modules 68 is a lens module corresponding to the infrared light camera 62 , and the other lens module 68 is a visible light camera 61 The corresponding lens module.

The imaging module 60 of this embodiment is provided with a cutout 675, and the receiving module 50 is disposed on the second stepped surface 678, so that the receiving module 50 and the imaging module 60 are set more compactly, and the lateral space occupied by the two together At the same time, the proximity sensor 51 and the light sensor 52 are packaged together to form the receiving module 50, which reduces the gap when the two are assembled separately and saves the installation space in the electronic device 100.

Referring to FIG. 23 , in some embodiments, the cutout 675 of the above embodiment is opened at the middle position of the top surface 670 , and the first step surface 677 is divided into a first sub-step surface 677a and a second sub-step surface by the cutout 675 677b, the first sub-ladder surface 677a and the second sub-ladder surface 677b are located on opposite sides of the cutout 675, respectively, and the two light-emitting through holes 674 are respectively opened on the first sub-ladder surface 677a and the second sub-ladder surface 677b, and are installed on the The lens modules 68 in the camera housing 67 are also located on opposite sides of the cutout 675 . At this time, the cutout 675 is surrounded by the second stepped surface 678, the first connecting surface 679a and the second connecting surface 679b, and the first connecting surface 679a is connected obliquely to the first sub-top surface 677a and the second stepped surface 678 and is located in the first sub-surface 679a. Between the top surface 677 a and the second stepped surface 678 , the second connecting surface 679 b connects the second sub top surface 677 b and the second stepped surface 678 obliquely and is located between the second sub top surface 677 b and the second stepped surface 678 . In this embodiment, the first stepped surface 677 and the second stepped surface 678 are parallel, the included angle between the first connecting surface 679a and the first sub-stepped surface 677a is an obtuse angle, and the included angle between the second connecting surface 679b and the second sub-stepped surface 677b is an obtuse angle. The angle is obtuse. In other embodiments, the included angle between the first connecting surface 679a and the first sub-step 677a is a right angle, and the included angle between the second connecting surface 679b and the second sub-step 677b is a right angle. Compared with opening the cutout 675 at the edge position of the top surface 670 , the opening of the cutout 675 in the middle position of the top surface 670 in this embodiment can make the width of the cutout 675 wider, thereby facilitating the setting of the receiving module 50 on the second stepped surface. 678 on.

Referring to FIGS. 22 and 23 , in some embodiments, the receiving module 50 of the above-mentioned embodiments is disposed on the second step surface 678 and is located outside the camera housing 67 . Specifically, when the cutout 675 is opened at the edge of the top surface 670, the entire receiving module 50 can be located in the second stepped surface 678 along the projection perpendicular to the second stepped surface 678; The projection on the second stepped surface 678 is located within the second stepped surface 678 (as shown in FIG. 22 ). That is, at least a part of the receiving module 50 is located directly above the second stepped surface 678 . When the cutout 675 is opened at the middle position of the top surface 670 , the entire receiving module 50 can be located in the second stepped surface 678 along the projection perpendicular to the second stepped surface 678 (as shown in FIG. 23 ). In this way, the receiving module 50 and the imaging module 60 are set more compactly, and the lateral space occupied by the two is small, which further saves the installation space in the electronic device 100 . In other embodiments, the receiving module 50 includes a proximity sensor 51 and a light sensor 52, but the proximity sensor 51 and the light sensor 52 are two separate single-package structures, in this case, each is a single-package structure of the proximity sensor 51 And the photoreceptor 52 may also be disposed on the second step surface 678 .

Referring to FIG. 23 , in some embodiments, the receiving module 50 of the above-mentioned embodiments only includes the proximity sensor 51 , and the receiving module 50 does not include the photo sensor 52 . In this case, the proximity sensor 51 (or the receiving module 50 ) and the light sensor 52 are each a single package structure, the proximity sensor 51 is arranged on the second step surface 678 , and the light sensor 52 is arranged on the casing 20 outside the imaging module 60 .

Referring to FIG. 23 , in some embodiments, the receiving module 50 of the above-mentioned embodiment only includes the photo sensor 52 , and the receiving module 50 does not include the proximity sensor 51 . In this case, the photo sensor 52 (or the receiving module 50) The proximity sensor 51 and the proximity sensor 51 are each in a single package structure, the photo sensor 52 is arranged on the second step surface 678 , and the proximity sensor 51 is arranged on the casing 20 outside the imaging module 60 .

Referring to FIG. 24 , the second stepped surface 678 of the above embodiment is provided with a light-transmitting hole 676 , and the receiving module 50 is located in the camera housing 67 and corresponds to the light-transmitting hole 676 . Specifically, when the receiving module 50 only includes the proximity sensor 51 without the light sensor 52, and the light sensor 52 is disposed outside the camera housing 67, the number of light-transmitting holes 676 can be one, and the light outside the electronic device 100 It can pass through the light-transmitting hole 676 and be transmitted to the proximity sensor 51 . The receiving module 50 in this embodiment is disposed in the camera casing 67 , which makes the structures of the receiving module 50 and the camera casing 67 more stable and facilitates the installation of the receiving module 50 and the imaging module 60 on the casing 20 .

Please continue to refer to FIG. 24 , the second step surface 678 of the above embodiment is provided with a light-transmitting hole 676 , and the receiving module 50 is located in the camera housing 67 and corresponds to the light-transmitting hole 676 . Specifically, when the receiving module 50 only includes the light sensor 52 without the proximity sensor 51, and the proximity sensor 51 is disposed outside the camera housing 67, the number of light-transmitting holes 676 can be one, and the light outside the electronic device 100 Can pass through the light-transmitting hole 676 and pass to the photoreceptor 52 . The receiving module 50 in this embodiment is disposed in the camera casing 67 , which makes the structures of the receiving module 50 and the camera casing 67 more stable and facilitates the installation of the receiving module 50 and the imaging module 60 on the casing 20 .

Referring to FIG. 25 , in some embodiments, the second step surface 678 of the above-mentioned embodiment is provided with a light-transmitting hole 676 , and the receiving module 50 is located in the camera housing 67 and corresponds to the light-transmitting hole 676 . Specifically, when the receiving module 50 is integrated with the proximity sensor 51 and the light sensor 52, the light-transmitting hole 676 may be a light-transmitting hole corresponding to both the proximity sensor 51 and the light sensor 52 or two spaced apart from each other and corresponding to each other. Proximity to the light-transmitting holes corresponding to the sensor 51 and the light sensor 52 , the light outside the electronic device 100 can pass through the light-transmitting hole 676 and be transmitted to the proximity sensor 51 and the light sensor 52 in the receiving module 50 . In other embodiments, the receiving module 50 includes a proximity sensor 51 and a light sensor 52, but the proximity sensor 51 and the light sensor 52 are two separate single-package structures, in this case, each is a single-package structure of the proximity sensor 51 The light sensor 52 and the light sensor 52 can also be arranged in the camera housing 67 and correspond to the light-transmitting hole 676 . The receiving module 50 in this embodiment is disposed in the camera casing 67 , which makes the structures of the receiving module 50 and the camera casing 67 more stable and facilitates the installation of the receiving module 50 and the imaging module 60 on the casing 20 .

Please continue to refer to FIG. 25 , in some embodiments, the second stepped surface 678 of the above-mentioned embodiment is provided with a light-transmitting hole 676 , and the receiving module 50 is located in the camera housing 67 and corresponds to the light-transmitting hole 676 . The imaging module 60 further includes a substrate 66 on which the image sensor 65 is disposed. The receiving module 50 can also be fixed on the substrate 66 and accommodated in the camera housing 67 . Specifically, the substrate 66 is provided with an FPC, one end of the FPC is located in the camera housing 67 and is used to carry the image sensor 65 , and the other end can be connected to the main board of the electronic device 100 . In other embodiments, the receiving module 50 may also be connected to the FPC. In this embodiment, the receiving module 50 disposed on the substrate 66 includes a proximity sensor 51 and a photoreceptor 52. The proximity sensor 51 and the photoreceptor 52 together form a single package structure, reducing the gap between the two when they are assembled separately. The installation space in the electronic device 100 is saved.

In other embodiments, the receiving module 50 only includes the proximity sensor 51, and the light sensor 52 is not integrated in the receiving module 50, that is to say, the receiving module 50 is a single package structure of the proximity sensor 51, and the light sensor The sensor 52 is also a single package structure, the light sensor 52 can be fixed on the substrate 66 and accommodated in the camera housing 67; When extended, the light sensor 52 may also be fixed to the base plate 66 and located outside the camera housing 67 .

In yet another embodiment, the receiving module 50 only includes the light sensor 52, and the proximity sensor 51 is not integrated in the receiving module 50, that is, the receiving module 50 is a single package structure of the light sensor 52, The proximity sensor 51 is also a single package structure. The proximity sensor 51 can be fixed on the substrate 66 and accommodated in the camera housing 67; When extended, the proximity sensor 51 may also be fixed to the base plate 66 and located outside the camera housing 67 .

The receiving module 50 of this embodiment is disposed in the camera casing 67, which makes the structures of the receiving module 50 and the camera casing 67 more stable and facilitates the installation of the receiving module 50 and the imaging module 60 on the casing 20; , the imaging module 60 is provided with a base plate 66 and the receiving module 50 is set on the base plate 66 , so that the receiving module 50 can be stably installed in the camera housing 67 .

In the description of this specification, reference is made to the terms "some embodiments," "one embodiment," "some embodiments," "exemplary embodiments," "examples," "specific examples," or "some examples." Described means that a particular feature, structure, material, or characteristic described in connection with the described embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

In addition, the terms "first" and "second" are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, features delimited with "first", "second" may expressly or implicitly include at least one of said features. In the description of the present invention, "plurality" means at least two, such as two, three, unless expressly and specifically defined otherwise.

Although the embodiments of the present invention have been shown and described above, it should be understood that the above-mentioned embodiments are exemplary and should not be construed as limiting the present invention. Embodiments are subject to changes, modifications, substitutions and alterations, and the scope of the present invention is defined by the claims and their equivalents.

Claims (14)

1. An output module is characterized by comprising a packaging shell, a first infrared light source and a second infrared light source arranged around the first infrared light source, wherein the packaging shell comprises a packaging substrate, the first infrared light source and the second infrared light source are packaged in the packaging shell and are carried on the packaging substrate, and when the second infrared light source is turned off and the first infrared light source emits infrared light to the outside of the packaging shell with first power, the output module is used as a proximity infrared lamp; when the first infrared light source and the second infrared light source are both started and emit infrared light rays to the outside of the packaging shell together at a second power, the output module is used as an infrared light supplement lamp;

the output module further comprises an optical sealing cover made of a light-transmitting material, the optical sealing cover is formed on the packaging substrate and is positioned in the packaging shell, and the optical sealing cover wraps the first infrared light source and the second infrared light source and fills the cavity where the first infrared light source and the second infrared light source are located;

the packaging shell further comprises a packaging side wall and a packaging top, the packaging side wall extends from the packaging substrate and is connected between the packaging top and the packaging substrate, a light-emitting window is formed in the packaging top, the light-emitting window corresponds to the first infrared light source and the second infrared light source, and a concave lens structure is formed in the light-emitting window.

2. The output module of claim 1,

the first infrared light sources are point light sources, and the second infrared light sources are multiple point light sources; or

The first infrared light source is a point light source, and the second infrared light source is an annular light source; or

The first infrared light source is a plurality of point light sources which surround into a ring, and the second infrared light source is a ring light source; or

The first infrared light sources are a plurality of point light sources which surround into a ring, and the second infrared light sources are a plurality of point light sources; or

The first infrared light source is an annular light source; the second infrared light sources are point light sources and are multiple in number; or

The first infrared light source is an annular light source; the second infrared light source is an annular light source.

3. The output module of claim 1, further comprising a chip, wherein the first infrared light source and the second infrared light source are formed on one piece of the chip.

4. The output module of claim 3, further comprising a lens disposed within the package housing and corresponding to the first and second infrared light sources.

5. The output module of claim 3, further comprising a lens disposed within the package housing, the lens corresponding to the first and second infrared light sources, the lens being on a transparent substrate.

6. The output module according to any one of claims 1 to 5, wherein a ground pin, a fill light pin and a proximity light pin are formed on the output module, and when the ground pin and the proximity light pin are enabled, the first infrared light source emits infrared light; when the grounding pin and the light supplement lamp pin are enabled, the first infrared light source and the second infrared light source emit infrared light.

7. An electronic device, comprising:

a housing; and

the output module of any of claims 1-6, disposed within the housing.

8. The electronic device of claim 7, further comprising a transparent cover plate, wherein the housing defines a housing opening, the first infrared light source and the second infrared light source correspond to the housing opening, and the cover plate is disposed on the housing.

9. The electronic device according to claim 7, further comprising a transparent cover plate, wherein the housing has a housing through hole, the first infrared light source and the second infrared light source correspond to the housing through hole, the cover plate is disposed on the housing, an infrared transparent ink that only transmits infrared light is formed on a surface of the cover plate that is combined with the housing, and the infrared transparent ink covers the housing through hole.

10. The electronic device according to claim 7, further comprising a receiving module and an imaging module, wherein the receiving module integrates a proximity sensor and a light sensor, the imaging module comprises a lens base, a lens barrel mounted on the lens base, and an image sensor accommodated in the lens base, the lens base comprises a mounting surface between the lens barrel and the image sensor, and the receiving module is disposed on the mounting surface.

11. The electronic device of claim 7, further comprising a proximity sensor, a light sensor, and an imaging module, wherein the imaging module comprises a lens base, a lens barrel mounted on the lens base, and an image sensor housed in the lens base, the lens base comprises a mounting surface located between the lens barrel and the image sensor, and at least one of the proximity sensor and the light sensor is disposed on the mounting surface.

12. The electronic device of claim 10 or 11, wherein the imaging module comprises at least one of a visible light camera and an infrared camera.

13. The electronic device of claim 7, further comprising an infrared camera, a visible light camera, a receiver, and a structured light projector, wherein centers of the output module, the infrared camera, the visible light camera, the receiver, and the structured light projector are located on a same line segment, and sequentially from one end to the other end of the line segment:

the output module, the structured light projector, the receiver, the infrared camera and the visible light camera; or

The output module, the infrared camera, the telephone receiver, the visible light camera and the structured light projector; or

The infrared camera, the output module, the telephone receiver, the visible light camera and the structured light projector; or

The infrared camera, the visible light camera, the telephone receiver, the output module and the structured light projector.

14. The electronic device of claim 7, further comprising a receiver, an infrared camera, a visible light camera, a structured light projector, and a transparent cover plate, wherein the housing has a housing sound outlet, the cover plate has a cover plate sound outlet, the receiver corresponds to the cover plate sound outlet and the housing sound outlet, the centers of the output module, the infrared camera, the visible light camera, and the structured light projector are located on a same line, and the receiver is located between the line and the top of the housing.

Images