CN108023983A - I/O modules and electronics - Google Patents

Abstract

The invention discloses an electronic device and an input/output module, which comprise a packaging shell, a structured light projector, a first infrared light source, a second infrared light source, a proximity sensor and a light sensor, wherein the second infrared light source, the proximity sensor and the light sensor are arranged around the first infrared light source; when the first infrared light source and the second infrared light source are both started and emit infrared light to the outside of the packaging shell at a second power, the input and output module is used for infrared supplementary lighting; the proximity sensor is used for receiving infrared light reflected by an object to detect the distance of the object, and the light sensor is used for receiving visible light in ambient light and detecting the intensity of the visible light. The input and output module has high integration level and small volume.

Description

I/O modules and electronics

technical field

The invention relates to the technical field of consumer electronics, and more specifically, to an input and output module and an electronic device.

Background technique

As the functions supported by mobile phones become more and more diverse, the types and quantities of functional devices that need to be installed on mobile phones are also increasing. In order to realize functions such as distance detection, ambient light detection and user's facial 3D feature recognition, it is necessary Functional devices such as proximity sensors, ambient light sensors, infrared cameras, and structured light projectors are configured in the mobile phone, but in order to arrange many functional devices, it will take up too much space on the mobile phone.

Contents of the invention

Embodiments of the present invention provide an input and output module and an electronic device.

The input-output module according to the embodiment of the present invention includes a package casing, a structured light projector, a first infrared light source, a second infrared light source arranged around the first infrared light source, a proximity sensor, and a light sensor. The package casing Including a packaging substrate, the structured light projector, the first infrared light source, the second infrared light source, the proximity sensor and the light sensor are packaged in the packaging housing and carried on the packaging substrate , when the second infrared light source is turned off and the first infrared light source emits infrared light to the outside of the packaging casing with the first power, the input and output module is used for infrared distance measurement; when the first infrared light source When the second infrared light source is turned on and emits infrared light to the outside of the packaging shell with the second power, the input and output module is used for infrared supplementary light; the proximity sensor is used for receiving infrared light reflected by an object In order to detect the distance of the object, the light sensor is used to receive visible light in ambient light and detect the intensity of the visible light.

In some embodiments, the first infrared light source is a point light source, and the second infrared light source is a point light source and the number is multiple; or

The first infrared light source is a point light source, and the second infrared light source is a ring light source; or

The first infrared light source is a plurality of ring-shaped point light sources, and the second infrared light source is a ring-shaped light source; or

The first infrared light source is a plurality of circular point light sources, and the second infrared light source is a plurality of point light sources; or

The first infrared light source is a ring light source; the second infrared light source is a point light source and the number is multiple; or

The first infrared light source is a ring light source; the second infrared light source is a ring light source.

In some embodiments, the input and output module further includes a chip, and the structured light projector, the first infrared light source, the second infrared light source, the proximity sensor and the light sensor are formed on a piece of the chip.

In some embodiments, the package housing further includes a package side wall and a package top, the package side wall extends from the package substrate and is connected between the package top and the package substrate, the package An infrared light window, a structured light window, a proximity sensing window and a light sensing window are formed on the top, the infrared light window corresponds to the first infrared light source and the second infrared light source, and the structured light window is connected to the structure The light projector corresponds, the proximity sensing window corresponds to the proximity sensor, and the light sensing window corresponds to the light sensor.

In some embodiments, the input-output module further includes an infrared light source lens, the infrared light source lens is disposed in the packaging housing and corresponds to the first infrared light source and the second infrared light source; and/ or

The input-output module further includes a proximity sensing lens, the proximity sensing lens is disposed in the package housing and corresponds to the proximity sensor; and/or

The input-output module further includes a light-sensing lens, the light-sensing lens is arranged in the package housing and corresponds to the light sensor.

In some embodiments, the input-output module further includes an optical enclosure made of light-transmitting material, the optical enclosure is formed on the packaging substrate and located in the packaging housing, the optical enclosure The cover covers the first infrared light source, the second infrared light source, the proximity sensor and the light sensor.

In some embodiments, the input and output module further includes a plurality of metal shielding plates, and the plurality of metal shielding plates are all located in the package housing, and the plurality of metal shielding plates are respectively arranged on the second Between any two of the infrared light source, the structured light projector, the proximity sensor and the light sensor.

An electronic device according to an embodiment of the present invention includes:

chassis; and

In the input-output module described in any one of the above-mentioned embodiments, the input-output module is arranged in the casing.

In some embodiments, the electronic device further includes a light-transmitting cover plate, and the casing is provided with an infrared through hole of the casing, a light through hole of the casing structure, a through hole close to the light receiving of the casing, and a light sensor of the casing. Through holes, the first infrared light source and the second infrared light source correspond to the infrared through holes of the casing, the structured light projector corresponds to the structured light through holes of the casing, and the proximity sensor corresponds to the infrared through holes of the casing. The housing is close to the light-receiving through hole, the light sensor is corresponding to the light sensing through hole of the housing, and the cover plate is arranged on the housing.

In some embodiments, the surface of the cover plate combined with the casing is formed with an infrared transparent ink that only transmits infrared light, and the infrared transparent ink blocks the infrared through hole of the casing, the At least one of the shell structured light through hole and the housing close to the light receiving through hole.

The electronic device according to the embodiment of the present invention can be used for infrared distance measurement when the first infrared light source and the proximity sensor are turned on, and can be used for infrared supplementary light when the first infrared light source and the second infrared light source are turned on at the same time, and is combined with a structured light projector and The light sensor, the input and output module integrates the functions of emitting infrared light for infrared distance measurement, infrared supplementary light, stereoscopic imaging and visible light intensity detection. Therefore, the input and output module has a high degree of integration and a small volume. The group saves the space for realizing the functions of infrared ranging, infrared supplementary light, stereoscopic imaging and visible light intensity detection. In addition, since the structured light projector, the proximity sensor, the light sensor, the first infrared light source and the second infrared light source are carried on a package substrate, compared with the structured light projector, the proximity sensor, the light sensor, the proximity Infrared lamps and infrared supplementary light need to be packaged on different wafers and then combined on the PCB substrate, which improves the packaging efficiency.

Additional aspects and advantages of embodiments of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of embodiments of the invention.

Description of drawings

The above and/or additional aspects and advantages of the present invention will become apparent and comprehensible from the description of the embodiments in conjunction with the following drawings, wherein:

FIG. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present invention;

2 is a schematic perspective view of an input and output module of an electronic device according to an embodiment of the present invention;

3 is a schematic diagram of the state of the input and output modules of the electronic device according to the embodiment of the present invention;

4 is a schematic diagram of the state of the input and output modules of the electronic device according to the embodiment of the present invention;

5 is a schematic cross-sectional view of an input and output module of an electronic device according to an embodiment of the present invention;

6 is a schematic perspective view of an input and output module of an electronic device according to an embodiment of the present invention;

7 to 9 are schematic distribution diagrams of the first infrared light source and the second infrared light source of the input-output module according to the embodiment of the present invention;

10 is a partial cross-sectional schematic view of an electronic device according to an embodiment of the present invention;

11 is a schematic diagram of arrangement of electronic components of the electronic device according to the embodiment of the present invention;

12 is a schematic cross-sectional view of an input and output module of an electronic device according to an embodiment of the present invention;

13 is a schematic structural diagram of an electronic device according to an embodiment of the present invention;

14 to 17 are partial cross-sectional schematic views of an electronic device according to an embodiment of the present invention.

Detailed ways

Embodiments of the present invention will be further described below in conjunction with the accompanying drawings. The same or similar reference numerals in the drawings represent the same or similar elements or elements having the same or similar functions throughout.

In addition, the embodiments of the present invention described below in conjunction with the accompanying drawings are exemplary, and are only used to explain the embodiments of the present invention, and should not be construed as limiting the present invention.

In the present invention, unless otherwise clearly specified and limited, the first feature may be in direct contact with the first feature or the first and second feature may be in direct contact with the second feature through an intermediary. touch. Moreover, "above", "above" and "above" the first feature on the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. "Below", "beneath" and "beneath" the first feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is less horizontally than the second feature.

Referring to FIG. 1 , an electronic device 100 according to an embodiment of the present invention includes a housing 20 , a cover 30 and electronic components. The electronic components include an input and output module 10 , an imaging module 60 and a receiver 70 . The electronic device 100 can be a mobile phone, a tablet computer, a notebook computer, a smart watch, a smart bracelet, an teller machine, etc. The embodiment of the present invention takes the electronic device 100 as an example for illustration. It can be understood that the specific form of the electronic device 100 can be other , without limitation here.

Please refer to Figure 2 and Figure 5, the input and output module 10 is a single package structure, including a package housing 11, a first infrared light source 12, a second infrared light source 13, a structured light projector 14, a proximity sensor 1e and a light sensor 1h.

The packaging case 11 is used to simultaneously package the first infrared light source 12, the second infrared light source 13, the structured light projector 14, the proximity sensor 1e and the light sensor 1h, or in other words, the first infrared light source 12, the second infrared light source 13, The structured light projector 14 , the proximity sensor 1 e and the light sensor 1 h are simultaneously packaged in the packaging case 11 . The package case 11 includes a package substrate 111 , a package sidewall 112 and a package top 113 . The packaging case 11 can be made of electromagnetic interference (EMI) shielding material, so as to prevent external electromagnetic interference from affecting the input and output module 10 . In this embodiment, the center of the structured light projector 14, the center of the first infrared light source 12, the center of the proximity sensor 1e, and the center of the photoreceptor 1h are located on the same line segment, for example: along the line segment from one end to the other end in turn: A structured light projector 14, a first infrared light source 12, a proximity sensor 1e, and a light sensor 1h; or, from one end to the other end of the line segment, the first infrared light source 12, the structured light projector 14, the proximity sensor 1e, and the light sensor or, along the line from one end to the other end are the first infrared light source 12, the proximity sensor 1e, the light sensor 1h, the structured light projector 14, etc., which are not exhaustive here. In other embodiments, the line connecting the centers of the structured light projector 14 , the first infrared light source 12 and the proximity sensor 1e is in the shape of a triangle or a quadrangle.

Please refer to FIG. 5 , the packaging substrate 111 is used to carry the first infrared light source 12 , the second infrared light source 13 , the structured light projector 14 , the proximity sensor 1e and the light sensor 1h. When manufacturing the input-output module 10, the first infrared light source 12, the second infrared light source 13, the structured light projector 14, the proximity sensor 1e and the light sensor 1h can be formed on the chip 15, and then the first infrared light source 12, The second infrared light source 13 , the structured light projector 14 , the proximity sensor 1 e , the light sensor 1 h and the chip 15 are arranged together on the package substrate 111 , specifically, the chip 15 can be bonded on the package substrate 111 . At the same time, the packaging substrate 111 can also be used to connect with other components of the electronic device 100 (such as the casing 20 of the electronic device 100 , the main board, etc.), so as to fix the input-output module 10 in the electronic device 100 .

The package side wall 112 can be arranged around the first infrared light source 12, the second infrared light source 13, the structured light projector 14, the proximity sensor 1e and the light sensor 1h, the package side wall 112 extends from the package substrate 111, and the package side wall 112 can be connected with The packaging substrate 111 is combined. Preferably, the packaging side wall 112 is detachably connected to the packaging substrate 111, so that the first infrared light source 12, the second infrared light source 13, and the structured light projector 14 can be used after the packaging side wall 112 is removed. , Proximity sensor 1e and light sensor 1h for maintenance. The material of the package sidewall 112 may be a material that does not transmit infrared light, so as to prevent the infrared light emitted by the first infrared light source 12 , the second infrared light source 13 or the structured light projector 14 from passing through the package sidewall 112 .

The package top 113 is opposite to the package substrate 111 , and the package top 113 is connected to the package sidewall 112 . The package top 113 is formed with an infrared light window 1131, a structured light window 1132, a proximity sensing window 1133 and a photosensitive window 1134. The infrared light window 1131 corresponds to the first infrared light source 12 and the second infrared light source 13, and the first infrared light source 12 and the second infrared light source The infrared light emitted by the two infrared light sources 13 passes through the infrared light window 1131; the structured light window 1132 corresponds to the structured light projector 14, and the structured light (infrared light) emitted by the structured light projector 14 passes through the structured light window 1132; The sensing window 1133 corresponds to the proximity sensor 1e, and the infrared light reflected by the object can pass through the proximity sensing window 1133 and is incident on the proximity sensor 1e; the photosensitive window 1134 corresponds to the photosensor 1h, and visible light can pass through the photosensitive window 1134 and incident on the photoreceptor 1h. The package top 113 and the package sidewall 112 can be formed integrally or separately. In one example, the infrared light window 1131 , the structured light window 1132 , the proximity sensing window 1133 and the light sensing window 1134 are through holes, and the material of the package top 113 is a material impermeable to infrared light and visible light. In another example, the package top 113 is jointly made of materials that do not transmit infrared light, materials that transmit infrared light, materials that do not transmit visible light, and materials that transmit visible light. Specifically, the infrared light window 1131 and the structured light window 1132 , and the proximity sensing window 1133 are made of materials that transmit infrared light, the photosensitive window 1134 is made of materials that transmit visible light, and the remaining parts are made of materials that are impermeable to infrared light and materials that are impermeable to visible light. The light window 1131 and the structured light window 1132 can be formed with a lens structure to improve the emission angle of infrared light emitted from the infrared light window 1131 and the structured light window 1132, for example, the structured light window 1132 is formed with a concave lens structure so that the light passing through the structured light window The light of 1132 diverges and emits outward; the infrared light window 1131 is formed with a convex lens structure, so that the light passing through the infrared light window 1131 gathers and emits outward; the proximity sensing window 1133 can also be formed with a lens structure to improve proximity sensing. The infrared light emission angle of the window 1133 incident, for example, the proximity sensing window 1133 is formed with a convex lens structure so that the light incident by the proximity sensing window 1133 is gathered and projected onto the proximity sensor 1e; the photosensitive window 1134 can also be formed with a lens structure, In order to improve the emission angle of visible light incident from the photosensitive window 1134, for example, the photosensitive window 1134 is formed with a convex lens structure so that the light incident from the photosensitive window 1134 is collected and projected onto the photosensor 1h.

Please continue to refer to FIG. 5 , the first infrared light source 12 and the second infrared light source 13 can be formed on one chip 15 , further reducing the integrated volume of the first infrared light source 12 and the second infrared light source 13 , and the manufacturing process is relatively simple. The first infrared light source 12 and the second infrared light source 13 can emit infrared light. When both the first infrared light source 12 and the second infrared light source 13 are turned on and emit infrared light to the outside of the package housing 11 (as shown in FIG. 3 ), the infrared light passes through the infrared light window 1131 to be projected onto the surface of the object, and the electronic device 100 The infrared light camera 62 (as shown in Figure 1) receives the infrared light reflected by the object to obtain the image information of the object. At this time, the input and output module 10 is used as an infrared supplementary light (that is, for infrared supplementary light), and The first infrared light source 12 and the second infrared light source 13 jointly emit the infrared light for supplementary light to cover a larger luminous area, and the angle of view α of the infrared light for supplementary light can be 60 degrees-90 degrees, for example: supplementary light The viewing angle α of infrared light is 60 degrees, 65 degrees, 70 degrees, 75 degrees, 80 degrees, 82 degrees, 85 degrees, 87 degrees, or 90 degrees. When the second infrared light source 13 is turned off and the first infrared light source 12 emits infrared light to the outside of the package housing 11 (as shown in Figure 4), the infrared light passes through the infrared light window 1131 and reaches the surface of the object, and the proximity sensor 1e receives the infrared light received by the object. The reflected infrared light is used to detect the distance from the object to the electronic device 100. At this time, the input and output module 10 is used for proximity infrared distance measurement, and the infrared light emitted by the first infrared light source 12 for infrared distance measurement covers a relatively small light-emitting area. Small, the field angle β of infrared light for infrared distance measurement is 10 degrees -30 degrees, for example: the field angle β of infrared light for infrared distance measurement is 10 degrees, 15 degrees, 20 degrees, 25 degrees, or 30 degrees, etc. . In the embodiment of the present invention, the viewing angle refers to the range covered by the infrared light passing through the infrared light window 1131 and exiting from the package housing 11 .

When the input-output module 10 is used for infrared supplementary light and when it is used for near-infrared distance measurement, it can emit infrared light to the outside of the package casing 11 with different powers. The input and output module 10 is used to emit infrared light to the outside of the package casing 11 with the first power when approaching infrared distance measurement, and emits infrared light to the outside of the package casing 11 with the second power when the input and output module 10 is used for infrared supplementary light. , wherein the first power may be smaller than the second power.

The second infrared light source 13 is arranged around the first infrared light source 12 . The first infrared light source 12 and the second infrared light source 13 may be in the form of a circle, a ring, a square or a regular polygon as a whole. Can be: the first infrared light source 12 is a point light source, the second infrared light source 13 is also a point light source and the number is multiple (as shown in Figure 7); or the first infrared light source 12 is a point light source, and the second infrared light source 13 is Ring-shaped light source (as shown in Figure 8); or the first infrared light source 12 is a plurality of ring-shaped point sources of light, and the second infrared light source 13 is a ring-shaped light source; or the first infrared light source 12 is a plurality of ring-shaped point sources of light , the second infrared light source 13 is a point light source and the number is multiple (as shown in Figure 9); or the first infrared light source 12 is a ring light source; the second infrared light source 13 is a point light source and the number is multiple; or the first infrared light source The light source 12 is a ring light source; the second infrared light source 13 is a ring light source.

Please refer to FIG. 5 , the structured light projector 14 and the first infrared light source 12 and the second infrared light source 13 can be formed on a chip 15, further reducing the structure light projector 14 and the first infrared light source 12 and the second infrared light source 13. The volume after integration, and the preparation process is relatively simple. The structured light projector 14 can emit structured light outward, and the structured light can form an infrared laser speckle pattern, and the structured light is projected onto the surface of the target object, and the structure modulated by the target object is collected by the infrared light camera 62 (as shown in FIG. 1 ). The light pattern is obtained by analyzing and calculating the modulated structured light pattern to obtain a depth image of the target object (at this time, the structured light projector 14 is used for stereoscopic imaging). In the embodiment of the present invention, the structured light projector 14 includes a projector light source 141 , a mirror frame 142 , a projector lens 143 and a diffractive optical element (diffractive optical elements, DOE) 144 . The light beam emitted by the projector light source 141 is collimated or converged by the projector lens 143 and then expanded by the diffractive optical element 144 and emitted outward with a certain beam pattern. Specifically, the projector light source 141 may be formed on the chip 15, and the projector lens 143 and the diffractive optical element 144 may be fixed on the frame 1422, for example, fixed on the frame 142 by gluing.

The first infrared light source 12, the second infrared light source 13, and the structured light projector 14 can emit infrared light to the outside of the package housing 11 with different powers. Specifically, the structured light projector 14 and the first infrared light source 12 can emit infrared light at the same time. Infrared light while the second infrared light source 13 does not emit light, the input and output module 10 is used for stereo imaging and infrared distance measurement at the same time; it is also possible that the structured light projector 14 emits light while the first infrared light source 12 and the second infrared light source 13 do not emit light For light, the input and output module 10 is only used for stereoscopic imaging; it is also possible that the structured light projector 14 and the second infrared light source 13 do not emit light while the first infrared light source 12 emits light, and the input and output module 10 is only used for infrared distance measurement; It may also be that the first infrared light source 12 and the second infrared light source 13 emit infrared light at the same time, but the structured light projector 14 does not emit light, and the input and output module 10 is only used for infrared supplementary light during infrared imaging.

The structured light projector 14, the first infrared light source 12, the second infrared light source 13 and the proximity sensor 1e can be formed on a chip 15, further reducing the structure light projector 14, the first infrared light source 12, the second infrared light source 13 and the The integrated volume of the proximity sensor 1e, and the preparation process is relatively simple. The proximity sensor 1e receives the infrared light reflected by the object incident by the proximity sensing window 1133 to determine the distance from the object to the electronic device 100. Specifically, the proximity sensor 1e can receive the infrared light emitted by the first infrared light source 12 and reflected by the object. The light is also used to determine the distance from the object to the electronic device 100 .

The structured light projector 14, the first infrared light source 12, the second infrared light source 13, the proximity sensor 1e and the light sensor 1h can be formed on a chip 15, further reducing the number of structured light projectors 14, the first infrared light source 12, the second infrared light source The integrated volume of the two infrared light sources 13 , the proximity sensor 1e and the light sensor 1h is relatively simple. The photoreceptor 1h receives visible light in ambient light incident through the photosensitive window 1134 and detects the intensity of the visible light.

Please refer to FIG. 6, in the embodiment of the present invention, the input and output module 10 is formed with a ground pin 1a, a supplementary light pin 1b, a proximity light pin 1c, a structured light pin 1d, and a proximity sensor pin 1g. And photosensitive pin 1j. The ground pin 1a, the supplementary light pin 1b, the proximity light pin 1c, the structured light pin 1d, the proximity sensor pin 1g and the light sensing pin 1j can be formed on the package substrate 111. When the ground pin 1a and When the fill light pin 1b is enabled (that is, when the ground pin 1a and the fill light pin 1b are connected to the circuit conduction), the first infrared light source 12 and the second infrared light source 13 emit infrared light; When the pin 1a and the proximity lamp pin 1c are enabled (that is, when the connection circuit between the ground pin 1a and the proximity lamp pin 1c is turned on), the first infrared light source 12 emits infrared light. When the ground pin 1a and the structured light pin 1d are enabled (that is, when the ground pin 1a and the structured light pin 1d are connected to the circuit conduction), the structured light projector 14 emits infrared light. When the ground pin 1a, the proximity light pin 1c, and the structured light pin 1d are enabled (that is, when the ground pin 1a, the proximity light pin 1c, and the structured light pin 1d are connected to the circuit conduction), The structured light projector 14 emits infrared light while the first infrared light source 12 emits infrared light. When the ground pin 1a, the proximity light pin 1c, and the proximity sensing pin 1g are enabled (that is, the ground pin 1a, the proximity light pin 1c, and the proximity sensing pin 1g are connected to the circuit conduction ), the first infrared light source 12 emits infrared light, and the proximity sensor 1e detects the infrared light emitted by the first infrared light source 12 and reflected by the object as a basis for judging the distance from the object to the electronic device 100 . When the ground pin 1a and the light-sensing pin 1j are enabled (that is, when the grounding pin 1a and the light-sensing pin 1j are connected to the circuit and turned on), the light sensor 1h detects the intensity of visible light as a display of the control screen 90 basis for brightness.

Referring to FIG. 1 and FIG. 10 , the casing 20 can be used as an installation carrier for the input-output module 10 , or in other words, the input-output module 10 can be set in the casing 20 . The casing 20 can be the casing of the electronic device 100. In the embodiment of the present invention, the display screen 90 of the electronic device 100 can also be arranged inside the casing 20. Since the input-output module 10 of the embodiment of the present invention occupies a small volume Therefore, the volume for setting the display screen 90 in the case 20 can be correspondingly increased, so as to increase the screen-to-body ratio of the electronic device 100 . Specifically, the casing 20 includes a top 21 and a bottom 22, and the display screen 90 and the input/output module 10 are arranged between the top 21 and the bottom 22. When the user normally uses the electronic device 100, the top 21 is located above the bottom 22. , as shown in FIG. 1 , the input and output module 10 may be disposed between the display screen 90 and the top 21 . In other embodiments, the display screen 90 may be a full screen with a gap, the display screen 90 surrounds the input and output module 10 , and the input and output module 10 is exposed from the gap of the display screen 90 .

The casing 20 is also provided with an organic casing infrared through hole 23 , a casing structure light through hole 24 , a casing close to a light receiving through hole 25 and a casing light sensing through hole 26 . When the input-output module 10 is arranged in the casing 20, the first infrared light source 12 and the second infrared light source 13 correspond to the infrared through hole 23 of the casing, and the structured light projector 14 corresponds to the structured light through hole 24 of the casing, close to The sensor 1e corresponds to the close light receiving through hole 25 of the casing, and the photoreceptor 1h corresponds to the light sensing through hole 26 of the casing. Wherein the first infrared light source 12 and the second infrared light source 13 all correspond to the infrared through hole 23 of the casing, which means that the light emitted by the first infrared light source 12 and/or the second infrared light source 13 can pass through the infrared through hole 23 of the casing, specifically Specifically, both the first infrared light source 12 and the second infrared light source 13 may face the infrared through hole 23 of the casing, or the light emitted by the first infrared light source 12 and the second infrared light source 13 passes through the light guide device after being acted on. Through the infrared through hole 23 of the casing. The structured light projector 14 corresponds to the structured light through hole 24 of the casing in the same way, and details are not described here. The proximity sensor 1e corresponds to the close light-receiving through hole 25 of the casing, which means that the infrared light reflected by the object can pass through the close light-receiving through hole 25 of the casing and be incident on the proximity sensor 1e. Specifically, it can be the proximity sensor 1e and the machine The housing is facing the light-receiving through hole 25 , or the incident infrared light may pass through the housing close to the light-receiving through hole 25 and be incident on the proximity sensor 1e after being acted on by the light guide element. The photoreceptor 1h corresponds to the light-sensing hole 26 of the casing, which means that visible light can pass through the light-sensing hole 26 of the casing and be incident on the photosensor 1h. The hole 26 is directly opposite, and the incident light of visible light can pass through the light-sensing through-hole 26 of the housing and be incident on the light sensor 1h after being acted on by the light-guiding element. In the embodiment shown in FIG. 10 , the infrared through hole 23 of the casing, the structural light through hole 24 of the casing, the close light receiving through hole 25 of the casing and the light sensing through hole 26 of the casing may be spaced from each other. Of course, in other embodiments, any two or three of the infrared through hole 23 of the casing, the structural light through hole 24 of the casing, the close light receiving through hole 25 of the casing and the light sensing through hole 26 of the casing can also be are connected to each other; or, the infrared through hole 23 of the casing, the structural light through hole 24 of the casing, the light receiving through hole 25 of the casing and the light sensing through hole 26 of the casing can also be connected to each other.

The cover plate 30 may be transparent, and the material of the cover plate 30 may be transparent glass, resin, plastic, and the like. The cover plate 30 is arranged on the casing 20. The cover plate 30 includes an inner surface 32 combined with the casing 20 and an outer surface 31 opposite to the inner surface 32. The light emitted by the input and output module 10 passes through the inner surface 32 in turn. and the outer surface 31 through the cover plate 30 . In the embodiment shown in FIG. 10 , the cover plate 30 covers the infrared through hole 23 of the casing, the structural light through hole 24 of the casing, the close light receiving through hole 25 of the casing and the light sensing through hole 26 of the casing, and the cover plate 30 The inner surface 32 of the inner surface 32 is coated with an infrared transparent ink 40. The infrared transparent ink 40 has a higher transmittance to infrared light, for example, it can reach 85% or more, and has a higher attenuation rate to visible light, for example, it can Reaching more than 70%, it is difficult for the user to see the area covered by the infrared transparent ink 40 on the electronic device 100 with the naked eye during normal use. In particular, infrared transparent ink 40 may cover areas of inner surface 32 that do not correspond to display screen 90 .

Infrared transparent ink 40 can also block at least one of the casing infrared through hole 23, the casing structure light through hole 24 and the casing close to light receiving through hole 25, that is, the infrared transparent ink 40 can block the casing infrared through hole at the same time. Hole 23, case structure light through hole 24 and case are close to light receiving through hole 25 (as shown in FIG. The internal structure, the appearance of the electronic device 100 is more beautiful; the infrared transparent ink 40 can also cover the infrared through hole 23 of the casing and the light receiving through hole 25 close to the casing, and does not cover the light through hole 24 of the casing structure; the infrared transparent ink 40 can also cover the structural light through hole 24 of the casing and the light receiving through hole 25 close to the casing, and does not cover the infrared through hole 23 of the casing; the infrared transparent ink 40 can also cover the structural light through hole 24 of the casing and cover the casing Infrared through hole 23, and the housing is close to the light receiving through hole 25 without covering; or the infrared transparent ink 40 can also cover the structural light through hole 24 of the housing, and the infrared through hole 23 of the housing is not covered and the housing is close to the light receiving through hole Hole 25; infrared transparent ink 40 can also cover the infrared through hole 23 of the casing, and does not cover the light through hole 24 of the casing structure and the light receiving through hole 25 of the casing; or the infrared transparent ink 40 can also cover the structure of the casing The light through hole 24, and does not cover the infrared through hole 23 of the casing and the close light receiving through hole 25 of the casing; or the infrared transparent ink 40 can also cover the casing close to the light receiving through hole 25, and does not cover the infrared through hole of the casing 23 and cover casing structural light through hole 24.

Please refer to FIG. 1 , the receiver 70 is used to emit a sound wave signal when being excited by a power source, and the user can communicate through the receiver 70 .

In the embodiment shown in FIG. 1, the imaging module 60 includes a visible light camera 61 and an infrared light camera 62, and the centers of the input and output module 10, the infrared light camera 62, the visible light camera 61 and the receiver 70 are located on the same line segment. Specifically, from one end of the line segment to the other end are input and output module 10, visible light camera 61, receiver 70, infrared light camera 62 (as shown in Figure 11); Group 10, receiver 70, visible light camera 61, infrared light camera 62 (as shown in Figure 1), at this moment, visible light camera 61 and infrared light camera 62 can form dual camera; An optical camera 62 , an input and output module 10 , a receiver 70 , and a visible light camera 61 . Of course, the arrangement of the input and output module 10, the infrared camera 62, the receiver 70 and the visible light camera 61 is not limited to the above-mentioned examples, and there may be others, for example, the centers of the electronic components are arranged in an arc shape, and the centers are arranged in a rectangle. and other shapes.

To sum up, the electronic device 100 according to the embodiment of the present invention can be used for infrared distance measurement when the first infrared light source 12 and the proximity sensor 1e are turned on, and can be used for infrared supplementary light when the first infrared light source 12 and the second infrared light source 13 are turned on at the same time. And combined with the structured light projector 14, the proximity sensor 1e and the light sensor 1h, the input and output module 10 integrates the functions of emitting infrared light for infrared distance measurement, infrared supplementary light, stereoscopic imaging, infrared distance measurement and visible light intensity detection, Therefore, the input and output module 10 has a high degree of integration and a small volume, and the input and output module 10 saves space for realizing the functions of infrared distance measurement, infrared supplementary light, stereoscopic imaging and visible light intensity detection. In addition, since the structured light projector 14, the proximity sensor 1e, the light sensor 1h, the first infrared light source 12 and the second infrared light source 13 are carried on a package substrate 111, compared with the structured light projector and the proximity sensor , light sensor, near-infrared lamp, and infrared supplementary light need to be manufactured on different wafers and packaged on the PCB substrate, which improves the packaging efficiency.

Please refer to FIG. 5 , in some embodiments, the input-output module 10 further includes an infrared light source lens 17 , a proximity sensing lens 1f and a light-sensing lens 1i. The infrared light source lens 17 is disposed in the package housing 11 and corresponds to the first infrared light source 12 and the second infrared light source 13 . The proximity sensor lens 1f is disposed in the package case 11 and corresponds to the proximity sensor 1e. The photosensitive lens 1i is disposed in the package housing 11 and corresponds to the photosensor 1h. The infrared light emitted by the first infrared light source 12 or/and the second infrared light source 13 is converged into the infrared light window 1131 under the action of the infrared light source lens 17 to emit, reducing the amount of light emitted to other areas of the package side wall 112 and the package top 113 , it only needs to satisfy that the field angle α of the infrared light emitted by the first infrared light source 12 and the second infrared light source 13 for supplementary light after passing through the infrared light source lens 17 is 60°-90°, and that the first infrared light source 12 emits The field angle β of the infrared light used for infrared ranging after passing through the infrared light source lens 17 is 10°-30°. Specifically, the infrared light source lens 17 may be located on a transparent base, and more specifically, the infrared light source lens 17 may be integrally formed with the transparent base. Certainly, the input-output module 10 may not be provided with the infrared light source lens 17 . Similarly, when the infrared light reflected by the object entering through the proximity sensing window 1133 is incident on the proximity sensing lens 1f, the proximity sensing lens 1f will converge the infrared light to the proximity sensor 1e, reducing the transmission of infrared light to the proximity sensor 1e The amount of light outside the area. Similarly, when the visible light entering through the light-sensing window 1134 is incident on the light-sensing lens 1i, the light-sensing lens 1i converges the visible light to the light-sensing sensor 1h, reducing the amount of visible light transmitted to areas other than the light-sensing sensor 1h. Specifically, the infrared light source lens 17, the proximity sensing lens 1f and the photosensitive lens 1i can all be located on the same transparent substrate, and more specifically, the infrared source lens 17, the proximity sensing lens 1f and the photosensitive lens 1i can all be integrated with the transparent substrate Formed. Certainly, the input/output module 10 may only be provided with one of the infrared light source lens 17, the proximity sensing lens 1f, and the photosensitive lens 1i, or may not be provided with the infrared light source lens 17, the proximity sensing lens 1f, and the photosensitive lens 1i.

Please refer to FIG. 5 , in some embodiments, the input-output module 10 further includes a plurality of metal shielding plates 16, and the plurality of metal shielding plates 16 are located in the package housing 11, and the plurality of metal shielding plates 16 are respectively arranged at the second Between any two of the infrared light source 13, the structured light projector 14, the proximity sensor 1e and the light sensor 1h. When the center of the second infrared light source 13 , the center of the structured light projector 14 , the proximity sensor 1e and the photoreceptor 1h are located on the same line segment, the number of metal shielding plates 16 is three. For example, if one end of the line segment is followed by the second infrared light source 13, the structured light projector 14, the proximity sensor 1e, and the light sensor 1h, the three metal shielding plates 16 are respectively located between the second infrared light source 13 and the structured light projection. 14, between the structured light projector 14 and the proximity sensor 1e, and between the proximity sensor 1e and the light sensor 1h; if one end of the line segment to the other end is followed by the second infrared light source 13, the proximity sensor 1e, the structured light The projector 14 and the light sensor 1h, the three metal shielding plates 18 are respectively located between the second infrared light source 13 and the proximity sensor 1e, between the proximity sensor 1e and the structured light projector 14, and between the structured light projector 14 and the light sensor. Between the device 1h; if one end of the line segment to the other end is the structured light projector 14, the second infrared light source 13, the proximity sensor 1e and the photosensor 1h, the three metal baffles 18 are respectively located between the structured light projector 14 and the second infrared light source. Between the two infrared light sources 13, between the second infrared light source 13 and the proximity sensor 1e, and between the proximity sensor 1e and the light sensor 1h. The metal shading plate 16 is arranged between the structured light projector 14 and the second infrared light source 13. On the one hand, the metal shading plate 16 can shield the mutual electromagnetic interference between the structured light projector 14, the first infrared light source 12, and the second infrared light source 13. Interference, the luminous intensity and timing of the structured light projector 14 and the first infrared light source 12 and the second infrared light source 13 will not affect each other. On the other hand, the metal shielding plate 16 can be used to isolate the cavity where the structured light projector 14 is located In the cavity where the first infrared light source 12 and the second infrared light source 13 are located, light will not enter the other cavity from one cavity. The metal shielding plate 16 is located between the structured light projector 14 and the proximity sensor 1e, which can prevent the infrared light emitted by the structured light projector 14 from incident on the proximity sensor 1e, and can also shield the structured light projector 14 and the proximity sensor 1e from each other. electromagnetic interference. The metal shielding plate 16 is located between the second infrared light source 13 and the proximity sensor 1e, which can prevent the infrared rays emitted by the structured light projector 14 and the second infrared light source 13 from incident on the proximity sensor 1e, and can shield the second infrared light source 13 from the proximity sensor 1e. Electromagnetic interference between sensors 1e. The metal shielding plate 18 is located between the structured light projector 14 and the photoreceptor 1h, which can prevent the infrared rays initially emitted by the second infrared light source 13 from incident on the photoreceptor 1h, and can also shield the structured light projector 14 and the photoreceptor. 1h mutual electromagnetic interference. The metal shielding plate 18 is located between the light sensor 1h and the second infrared light source 13, which can prevent the infrared light emitted by the second infrared light source 13 from incident on the light sensor 1h, and can also shield the second infrared light source 13 and the light sensor. Electromagnetic interference between devices 1h. The metal shielding plate 18 is located between the proximity sensor 1e and the photoreceptor 1h, and can shield the electromagnetic interference between the proximity sensor 1e and the photoreceptor 1h.

Referring to FIG. 12 , in some embodiments, the I/O module 10 further includes an optical enclosure 18 . The optical enclosure 18 is made of light-transmitting material, and the optical enclosure 18 is formed on the package substrate 111 and located in the package housing 11 . The optical enclosure 18 wraps the first infrared light source 12 , the second infrared light source 13 , the proximity sensor 1e and the light sensor 1h. Specifically, the optical enclosure 18 can be formed by a glue injection molding process, and the optical enclosure 18 can be made of transparent thermosetting epoxy resin, so as not to soften easily during use, and the optical enclosure 18 can fix the first infrared light source 12 , the positions of the second infrared light source 13 , the proximity sensor 1e and the light sensor 1h , and make the first infrared light source 12 , the second infrared light source 13 , the proximity sensor 1e and the light sensor 1h difficult to shake in the package housing 11 .

Please refer to FIG. 13 , in some embodiments, the casing 20 is also provided with a casing sound hole (not shown), the cover plate 30 is also provided with a cover plate sound hole 35, and the receiver 70 and the cover plate sound hole 35 corresponds to the position of the casing sound hole. The centers of the input-output module 10 , the infrared camera 62 and the visible light camera 61 are located on the same line segment, and the receiver 70 is located between the line segment and the top 21 of the casing 20 .

The center of the receiver 70 is not located on the line segment, which saves the lateral space occupied by the electronic components (input and output module 10, infrared camera 62, visible light camera 61, etc.) on the cover plate 30. In the embodiment shown in FIG. 15 , the sound outlet hole 35 of the cover plate is opened at the edge of the cover plate 30 , and the sound outlet hole of the casing is opened near the top 21 .

Please refer to FIG. 14 , in some embodiments, the cover plate 30 can also be provided with a cover plate infrared through hole 33, the cover plate infrared through hole 33 corresponds to the casing infrared through hole 23, the first infrared light source 12 and/or The infrared light emitted by the second infrared light source 13 can pass through the infrared through hole 23 of the housing and exit the electronic device 100 through the infrared through hole 33 of the cover plate. At this time, infrared transparent ink 40 can be provided on the cover plate 30 corresponding to the structured light hole 24 of the casing, so that it is difficult for the user to see the structured light projector 14 inside the electronic device 100 through the structured light hole 24 of the casing; Infrared transparent ink 40 may also be provided on the cover plate 30 corresponding to the housing approaching the light receiving through hole 25, so that it is difficult for the user to see the proximity sensor 1e electronic device 100 inside the electronic device 100 through the housing approaching the light receiving through hole 25 The appearance is more beautiful.

Please refer to FIG. 15 , in some embodiments, the cover plate 30 can also be provided with a cover plate structured light through hole 34, the cover plate structured light through hole 34 corresponds to the casing structured light through hole 24, and the structured light projector 14 emits The infrared light can go out of the electronic device 100 through the structural light hole 34 of the cover plate after passing through the structural light hole 24 of the casing. At this time, infrared transparent ink 40 can be provided on the cover plate 30 corresponding to the infrared through hole 23 of the casing, so that it is difficult for the user to see the first infrared light source 12 and the second infrared light source 12 inside the electronic device 100 through the infrared through hole 23 of the casing. Infrared light source 13; the cover plate 30 can also be provided with infrared penetrating ink 40 at the position corresponding to the casing approaching the light-receiving through hole 25, so that it is difficult for the user to see the proximity sensor inside the electronic device 100 through the casing approaching the light-receiving through hole 25 1e, the appearance of the electronic device 100 is more beautiful.

Please refer to Fig. 16, in some embodiments, the cover plate 30 can also be provided with a cover plate close to the light receiving through hole 36, the cover plate close to the light receiving through hole 36, the casing close to the light receiving through hole 25 and the proximity sensor 1e. Correspondingly, the infrared light reflected by objects outside the electronic device 100 can be incident on the proximity sensor 1e after passing through the cover plate approaching the light receiving through hole 36 and the casing approaching the light receiving through hole 25 . At this time, infrared transparent ink 40 can be provided on the cover plate 30 corresponding to the structured light hole 24 of the casing, so that it is difficult for the user to see the structured light projector 14 inside the electronic device 100 through the structured light hole 24 of the casing; The position on the cover plate 30 corresponding to the infrared through hole 23 of the casing can also be provided with an infrared transparent ink 40, so that it is difficult for the user to see the first infrared light source 12 and the second infrared light source inside the electronic device 100 through the infrared through hole 23 of the casing. 13. The appearance of the electronic device 100 is more beautiful.

Please refer to FIG. 17 , in some embodiments, the cover plate 30 can also be provided with a cover plate light-sensing through hole 37, which corresponds to the light-sensing through hole 26 of the casing and the light sensor 1h. Visible light outside the electronic device 100 can be incident on the light sensor 1h after passing through the light-sensing through hole 37 of the cover plate and the light-sensing through hole 26 of the casing. At this time, infrared transparent ink 40 can be provided on the cover plate 30 corresponding to the structured light hole 24 of the casing, so that it is difficult for the user to see the structured light projector 14 inside the electronic device 100 through the structured light hole 24 of the casing; The position on the cover plate 30 corresponding to the infrared through hole 23 of the casing can also be provided with an infrared transparent ink 40, so that it is difficult for the user to see the first infrared light source 12 and the second infrared light source inside the electronic device 100 through the infrared through hole 23 of the casing. 13. Infrared transparent ink 40 may also be provided on the cover plate 30 corresponding to the case approaching the light-receiving through hole 25, so that it is difficult for the user to see the proximity sensor 1e inside the electronic device 100 through the case approaching the light-receiving through hole 25, The appearance of the electronic device 100 is more beautiful.

In the description of this specification, references to the terms "certain embodiments," "one embodiment," "some embodiments," "exemplary embodiments," "examples," "specific examples," or "some examples" To describe means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the described specific features, structures, materials or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include at least one of said features. In the description of the present invention, "plurality" means at least two, such as two, three, unless otherwise specifically defined.

Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present invention, those skilled in the art can make the above-mentioned The embodiments are subject to changes, modifications, substitutions and variations, the scope of the present invention is defined by the claims and their equivalents.

Claims (10)

1. An input and output module, characterized in that, the input and output module includes a package housing, a structured light projector, a first infrared light source, a second infrared light source arranged around the first infrared light source, and a proximity sensor and a light sensor, the package housing includes a package substrate, the structured light projector, the first infrared light source, the second infrared light source, the proximity sensor and the light sensor are packaged in the package Inside the casing and carried on the packaging substrate, when the second infrared light source is turned off and the first infrared light source emits infrared light to the outside of the packaging casing with the first power, the input and output module is used for infrared Distance measurement; when both the first infrared light source and the second infrared light source are turned on and emit infrared light to the outside of the packaging shell with the second power, the input and output modules are used for infrared supplementary light; the approaching The sensor is used to receive the infrared light reflected by the object to detect the distance of the object, and the light sensor is used to receive the visible light in the ambient light and detect the intensity of the visible light. 2. The input and output module according to claim 1, characterized in that, The first infrared light source is a point light source, and the second infrared light source is a point light source and the number is multiple; or The first infrared light source is a point light source, and the second infrared light source is a ring light source; or The first infrared light source is a plurality of ring-shaped point light sources, and the second infrared light source is a ring-shaped light source; or The first infrared light source is a plurality of circular point light sources, and the second infrared light source is a plurality of point light sources; or The first infrared light source is a ring light source; the second infrared light source is a point light source and the number is multiple; or The first infrared light source is a ring light source; the second infrared light source is a ring light source. 3. The input-output module according to claim 1, wherein the input-output module further comprises a chip, the structured light projector, the first infrared light source, the second infrared light source, the The proximity sensor and the light sensor are formed on one chip. 4. The input-output module according to claim 3, wherein the package housing further comprises a package side wall and a package top, and the package side wall extends from the package substrate and is connected to the package top Between the package substrate, an infrared light window, a structured light window, a proximity sensing window, and a photosensitive window are formed on the top of the package, and the infrared light window is connected to the first infrared light source and the second infrared light source Correspondingly, the structured light window corresponds to the structured light projector, the proximity sensing window corresponds to the proximity sensor, and the light sensing window corresponds to the light sensor. 5. The input-output module according to claim 3, characterized in that, the input-output module further comprises an infrared light source lens, and the infrared light source lens is arranged in the package housing and is connected to the first infrared light source corresponding to the second infrared light source; and/or The input-output module further includes a proximity sensing lens, the proximity sensing lens is disposed in the package housing and corresponds to the proximity sensor; and/or The input-output module further includes a light-sensing lens, the light-sensing lens is arranged in the package housing and corresponds to the light sensor. 6. The input-output module according to claim 1, wherein the input-output module further comprises an optical enclosure made of a light-transmitting material, the optical enclosure is formed on the packaging substrate and Located in the package housing, the optical enclosure wraps the first infrared light source, the second infrared light source, the proximity sensor and the light sensor. 7. The input-output module according to claim 1, characterized in that, the input-output module further comprises a plurality of metal shielding plates, the plurality of metal shielding plates are located in the package housing, and the plurality of metal shielding plates The metal shielding plate is respectively arranged between any two of the second infrared light source, the structured light projector, the proximity sensor and the light sensor. 8. An electronic device, characterized in that the electronic device comprises: chassis; and The input-output module according to any one of claims 1-7, wherein the input-output module is arranged in the casing. 9. The electronic device according to claim 8, characterized in that, the electronic device also includes a light-transmitting cover plate, and the casing is provided with an organic casing infrared through hole, a casing structure light through hole, and a casing close to The light-receiving through hole and the light-sensing through hole of the casing, the first infrared light source and the second infrared light source correspond to the infrared through hole of the casing, and the structured light projector communicates with the structured light of the casing Corresponding to the holes, the proximity sensor corresponds to the close light receiving through hole of the casing, the light sensor corresponds to the light sensing through hole of the casing, and the cover plate is arranged on the casing. 10. The electronic device according to claim 9, wherein the surface of the cover plate combined with the casing is formed with an infrared transparent ink that only transmits infrared light, and the infrared transparent ink blocks the At least one of the infrared through hole of the casing, the structural light through hole of the casing, and the close light receiving through hole of the casing.