CN108023984A - I/O modules and electronics - Google Patents

Abstract

The invention discloses an electronic device and an input/output module. The first infrared light source, the second infrared light source, the proximity sensor and the light sensor are all packaged in the packaging shell and are carried on the packaging substrate. When the second infrared light source is turned off, the first infrared light source emits infrared light to the outside of the packaging shell, and the input and output module is used for infrared distance measurement; when the first infrared light source and the second infrared light source are both started to emit infrared light to the outside of the packaging shell, the input and output module is used for infrared light supplement. The proximity sensor is used for receiving infrared light reflected by an object to detect the distance from the object to the input and output module, and the light sensor is used for receiving visible light in ambient light to detect the intensity of the visible light. A plurality of units are integrated into a single packaging body structure, the integration level of the input and output module is high, and the space for realizing the functions of infrared light supplement, infrared distance measurement and visible light intensity detection is saved.

Description

I/O modules and electronics

technical field

The invention relates to the technical field of consumer electronics, and more specifically, to an input and output module and an electronic device.

Background technique

As the functions supported by mobile phones become more and more diverse, the types and quantities of functional devices that need to be installed on mobile phones are also increasing. In order to realize functions such as distance detection, ambient light detection and user's facial 3D feature recognition, it is necessary Functional devices such as proximity sensors, ambient light sensors, infrared cameras, and structured light projectors are configured in the mobile phone, but in order to arrange many functional devices, it will take up too much space on the mobile phone.

Contents of the invention

Embodiments of the present invention provide an input and output module and an electronic device.

The input-output module according to the embodiment of the present invention includes a packaging case, a first infrared light source, a second infrared light source arranged around the first infrared light source, a proximity sensor, and a light sensor. The packaging case includes a packaging substrate, and the The first infrared light source, the second infrared light source, the proximity sensor and the light sensor are all packaged in the packaging case and carried on the packaging substrate. When the second infrared light source is turned off, the first When an infrared light source emits infrared light to the outside of the packaging casing with the first power, the input and output module is used for infrared distance measurement; when the first infrared light source and the second infrared light source are both turned on and the second When the power emits infrared light to the outside of the packaging shell, the input and output module is used for infrared supplementary light; the proximity sensor is used to receive the infrared light emitted by the first infrared light source reflected by the object to detect the The distance from the object to the input and output module, the photoreceptor is used to receive visible light in ambient light and detect the intensity of the visible light.

In some embodiments, the first infrared light source is a point light source, and the second infrared light source is a point light source and the number is multiple; or

The first infrared light source is a point light source, and the second infrared light source is a ring light source; or

The first infrared light source is a plurality of ring-shaped point light sources, and the second infrared light source is a ring-shaped light source; or

The first infrared light source is a plurality of circular point light sources, and the second infrared light source is a plurality of point light sources; or

The first infrared light source is a ring light source; the second infrared light source is a point light source and the number is multiple; or

The first infrared light source is a ring light source; the second infrared light source is a ring light source.

In some embodiments, the input-output module further includes a chip, and the first infrared light source, the second infrared light source, the proximity sensor, and the light sensor are all formed on one chip.

In some embodiments, the package housing further includes a package side wall and a package top, the package side wall extends from the package substrate and is connected between the package top and the package substrate, the package A light-emitting window, a proximity sensor window and a photosensitive window are formed on the top, the light-emitting window corresponds to the first infrared light source and the second infrared light source, the proximity sensor window corresponds to the proximity sensor, and the light-sensitive window corresponds to the proximity sensor. The window corresponds to the light sensor.

In some embodiments, the input-output module further includes a light source lens, the light source lens is disposed in the packaging housing and corresponds to the first infrared light source and the second infrared light source; and/or

The input-output module further includes a proximity sensor lens, the proximity sensor lens is disposed in the package housing and corresponds to the proximity sensor; and/or

The input-output module further includes a light-sensing lens, the light-sensing lens is arranged in the package housing and corresponds to the light sensor.

In some embodiments, the input-output module further includes a light source lens, a proximity sensor lens, and a light-sensing lens disposed in the package housing, and the light source lens is compatible with the first infrared light source and the second infrared light source. Corresponding to the infrared light source, the proximity sensor lens corresponds to the proximity sensor, the photosensitive lens corresponds to the photosensor, and the light source lens, the proximity sensor lens and the photosensitive lens are located on the same transparent substrate .

In some embodiments, the input and output module further includes a plurality of metal shielding plates, and the plurality of metal shielding plates are located in the package housing and located in the second infrared light source, the proximity sensor and the Any of the photoreceptors in between.

In some embodiments, the input-output module further includes an optical enclosure made of light-transmitting material, the optical enclosure is formed on the packaging substrate and located in the packaging housing, the optical enclosure The cover covers the first infrared light source, the second infrared light source, the proximity sensor and the light sensor.

In some embodiments, the input-output module further includes a plurality of light-emitting partitions, the plurality of light-emitting partitions are formed in the optical enclosure and located between the second infrared light source, the proximity sensor and Between any two of the photoreceptors.

In some embodiments, the input and output module is formed with a ground pin, a supplementary light pin, a proximity light pin, a proximity sensor pin and a photosensitive pin, and the ground pin and the proximity light When the pin is enabled, the first infrared light source emits infrared light; when the ground pin and the fill light pin are enabled, the first infrared light source and the second infrared light source emit infrared light Light; when the ground pin and the proximity sensor pin are enabled, the proximity sensor receives the infrared light emitted by the first infrared light source reflected by the object; the ground pin and the light sensor When the pin is enabled, the light sensor receives visible light from the environment.

An electronic device according to an embodiment of the present invention includes a casing and the above-mentioned input-output module, and the input-output module is arranged in the casing.

In some embodiments, the electronic device further includes a light-transmitting cover plate, and the casing is provided with through holes for the light source of the casing, through holes for the proximity sensor of the casing, and through holes for the light sensing of the casing. The light source and the second infrared light source correspond to the through hole of the light source of the casing, the proximity sensor corresponds to the through hole of the proximity sensor of the casing, and the photosensor corresponds to the light sensing through hole of the casing. The cover plate is arranged on the casing.

In some embodiments, the electronic device further includes a light-transmitting cover plate, and the casing is provided with through holes for the light source of the casing, through holes for the proximity sensor of the casing, and through holes for the light sensing of the casing. The light source and the second infrared light source correspond to the through hole of the light source of the casing, the proximity sensor corresponds to the through hole of the proximity sensor of the casing, and the photosensor corresponds to the light sensing through hole of the casing. The cover plate is arranged on the casing, and the surface combined with the cover plate and the casing is formed with an infrared transparent ink that only transmits infrared light, and the infrared transparent ink blocks the through hole of the light source of the casing and at least one of the casing proximity sensor through holes.

The electronic device and the input/output module according to the embodiment of the present invention can be used for proximity infrared distance measurement only when the first infrared light source is turned on and the proximity sensor is turned on, and can be used for infrared supplementary light when the first infrared light source and the second infrared light source are turned on at the same time. The light sensor can also be used for visible light intensity detection. In other words, the first infrared light source, the second infrared light source, the proximity sensor and the light sensor are integrated into a single package structure, so that the input and output modules integrate infrared ranging, infrared compensation Light and visible light intensity detection function. In addition, the first infrared light source, the second infrared light source, the proximity sensor and the light sensor are integrated into a single package structure, the integration of the input and output modules is relatively high, and the volume is small. , infrared ranging, and visible light intensity detection functions in the space.

Additional aspects and advantages of embodiments of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of embodiments of the invention.

Description of drawings

The above and/or additional aspects and advantages of the present invention will become apparent and comprehensible from the description of the embodiments in conjunction with the following drawings, wherein:

FIG. 1 is a schematic structural diagram of an electronic device according to some embodiments of the present invention;

2 is a perspective view of an input and output module of an electronic device according to some embodiments of the present invention;

3 to 4 are schematic diagrams of the states of the input and output modules of the electronic device according to some embodiments of the present invention;

5 is a schematic cross-sectional view of an input-output module of an electronic device according to some embodiments of the present invention;

6 to 8 are schematic diagrams of the distribution of the first infrared light source and the second infrared light source of the input-output module in some embodiments of the present invention;

9 is a partial perspective view of an input-output module of an electronic device according to some embodiments of the present invention;

10 is a partial cross-sectional schematic view of an electronic device according to some embodiments of the present invention;

11 is a schematic cross-sectional view of an input-output module of an electronic device according to some embodiments of the present invention;

Fig. 12 is a schematic structural diagram of an electronic device according to some embodiments of the present invention;

13 to 15 are partial cross-sectional schematic views of electronic devices according to some embodiments of the present invention.

Detailed ways

Embodiments of the present invention will be further described below in conjunction with the accompanying drawings. The same or similar reference numerals in the drawings represent the same or similar elements or elements having the same or similar functions throughout.

In addition, the embodiments of the present invention described below in conjunction with the accompanying drawings are exemplary, and are only used to explain the embodiments of the present invention, and should not be construed as limiting the present invention.

In the present invention, unless otherwise clearly specified and limited, the first feature may be in direct contact with the first feature or the first and second feature may be in direct contact with the second feature through an intermediary. touch. Moreover, "above", "above" and "above" the first feature on the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. "Below", "beneath" and "beneath" the first feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is less horizontally than the second feature.

Referring to FIG. 1 , an electronic device 100 according to an embodiment of the present invention includes a housing 20 , a cover 30 and electronic components. The electronic components include an input and output module 10 , an imaging module 60 , a receiver 70 and a structured light projector 80 . The electronic device 100 can be a mobile phone, a tablet computer, a notebook computer, a smart watch, a smart bracelet, an teller machine, etc. The embodiment of the present invention takes the electronic device 100 as an example for illustration. It can be understood that the specific form of the electronic device 100 can be other , without limitation here.

Please refer to FIG. 2 to FIG. 5 , the input and output module 10 is a single package structure, including a package housing 11 , a first infrared light source 12 , a second infrared light source 13 , a proximity sensor 50 and a light sensor 1a.

The package housing 11 is used to simultaneously package the first infrared light source 12, the second infrared light source 13, the proximity sensor 50 and the light sensor 1a, or in other words, the first infrared light source 12, the second infrared light source 13, the proximity sensor 50 and the light sensor 1a All are packaged in the packaging case 11 at the same time. The package case 11 includes a package substrate 111 , a package sidewall 112 and a package top 113 . The packaging case 11 can be made of electromagnetic interference (EMI) shielding material, so as to prevent external electromagnetic interference from affecting the input and output module 10 .

Please refer to FIG. 5 , the packaging substrate 111 is used to carry the first infrared light source 12 , the second infrared light source 13 , the proximity sensor 50 and the light sensor 1a. When manufacturing the input-output module 10, the first infrared light source 12, the second infrared light source 13, the proximity sensor 50 and the light sensor 1a can be formed on a chip 14, and then the first infrared light source 12, the second infrared light source 13, The proximity sensor 50 , the light sensor 1 a and the chip 14 are disposed together on the package substrate 111 , specifically, the chip 14 can be bonded on the package substrate 111 . At the same time, the packaging substrate 111 can also be used to connect with other components of the electronic device 100 (such as the casing 20 of the electronic device 100 , the main board, etc.), so as to fix the input-output module 10 in the electronic device 100 .

The package side wall 112 can be arranged around the first infrared light source 12, the second infrared light source 13, the proximity sensor 50 and the light sensor 1a, the package side wall 112 extends from the package substrate 111, and the package side wall 112 can be combined with the package substrate 111, preferably Specifically, the package sidewall 112 is detachably connected to the package substrate 111 , so that the first infrared light source 12 , the second infrared light source 13 , the proximity sensor 50 and the light sensor 1 a can be repaired after the package sidewall 112 is removed. The material of the package sidewall 112 may be a material that does not transmit infrared light, so as to prevent the infrared light emitted by the first infrared light source 12 and the second infrared light source 13 from passing through the package sidewall 112 .

The package top 113 is opposite to the package substrate 111 , and the package top 113 is connected to the package sidewall 112 . The package top 113 is formed with a light-emitting window 1131, a proximity sensor window 1134, and a photosensitive window 1132. The light-emitting window 1131 corresponds to the first infrared light source 12 and the second infrared light source 13, and the infrared light emitted by the first infrared light source 12 and the second infrared light source 13 The light passes through the light-emitting window 1131; the proximity sensor window 1134 corresponds to the proximity sensor 50, and the infrared light emitted by the first infrared light source 12 can pass through the proximity sensor window 1134 and be incident on the proximity sensor 50 after being reflected by the object; the photosensitive window 1132 corresponds to the photoreceptor 1a, and visible light can pass through the photosensitive window 1132 and be incident on the photoreceptor 1a. The package top 113 and the package sidewall 112 can be formed integrally or separately. In one example, the light-emitting window 1131 , the proximity sensor window 1134 and the photosensitive window 1132 are all through holes, and the material of the package top 113 is a material that does not transmit infrared light and visible light. In another example, the package top 113 is made of a material that is not transparent to infrared light, a material that is transparent to infrared light, a material that is not transparent to visible light, and a material that is transparent to visible light. Specifically, the light-emitting window 1131 is made of a material that is transparent to infrared light. The proximity sensing port window 1134 and the photosensitive window 1132 are made of materials that transmit visible light, and the rest of the parts are made of materials that are impermeable to infrared light and visible light. Further, the light emitting window 1131 can be formed with a lens structure to improve the light emission from the light. The infrared light emission angle emitted by the window 1131, for example, the light emitting window 1131 is formed with a concave lens structure, so that the light passing through the light emitting window 1131 is divergent and emitted outward; the light emitting window 1131 is formed with a convex lens structure, so that the light passing through the light emitting window 1131 is gathered Outward emission; Proximity sensor window 1134 is formed with a convex lens mechanism, so that the infrared light that passes through proximity sensor window 1134 gathers inwardly and is projected on the proximity sensor 50; Light-sensing window 1132 can also be formed with lens structure, to improve from light The incident visible light emission angle of the photosensitive window 1132, for example, the photosensitive window 1132 has a convex lens structure so that the light incident from the photosensitive window 1132 is gathered and projected onto the photosensor 1a.

Please refer to Fig. 6 to Fig. 8, the first infrared light source 12, the second infrared light source 13, the proximity sensor 50 and the light sensor 1a can all be formed on a chip 14, further reduce the first infrared light source 12, the second infrared light source 13 The volume integrated with the photoreceptor 1a, and the preparation process is relatively simple. The first infrared light source 12 and the second infrared light source 13 can emit infrared light. When both the first infrared light source 12 and the second infrared light source 13 are turned on and emit infrared light to the outside of the package housing 11, the infrared light passes through the light-emitting window 1131 to be projected onto the surface of the object, and the infrared camera 62 of the electronic device 100 receives the infrared light from the object. The reflected infrared light is used to obtain the image information of the object. At this time, the input and output module 10 is used for infrared supplementary light, and the first infrared light source 12 and the second infrared light source 13 jointly emit infrared light for supplementary light. The area is large, and the field angle α of the infrared light for supplementary light can be 60 degrees to 90 degrees. For example, the field angle α of the infrared light for supplementary light is 60 degrees, 65 degrees, 70 degrees, 75 degrees, 80 degrees, 82 degrees, 85 degrees, 87 degrees, or 90 degrees, etc. When the second infrared light source 13 is turned off and the first infrared light source 12 emits infrared light to the outside of the package housing 11, the infrared light passes through the light-emitting window 1131 and reaches the surface of the object, and the proximity sensor 50 receives the infrared light reflected by the object to detect the arrival of the object. The distance of the input and output module 10, at this moment, the input and output module 10 is used for infrared distance measurement, and the luminous area covered by the infrared light used for infrared distance measurement that the first infrared light source 12 emits is relatively small, and the infrared distance measurement is used for infrared distance measurement. The viewing angle β of light is 10°-30°, for example, the viewing angle β of infrared light for infrared distance measurement is 10°, 15°, 20°, 25°, or 30°. In the embodiment of the present invention, the viewing angle refers to the range covered by the infrared light passing through the light-emitting window 1131 and exiting the packaging case 11 . The photoreceptor 1 a receives visible light in the ambient light incident through the photosensitive window 1132 and detects the intensity of the visible light.

When the input and output module 10 is used for infrared supplementary light and for near-infrared distance measurement, it can emit infrared light to the outside of the package casing 11 with different powers. The input and output module 10 is used to emit infrared light to the outside of the package casing 11 with the first power when approaching infrared distance measurement, and emits infrared light to the outside of the package casing 11 with the second power when the input and output module 10 is used for infrared supplementary light. , wherein the first power may be smaller than the second power.

The second infrared light source 13 is arranged around the first infrared light source 12 . The first infrared light source 12 and the second infrared light source 13 may be in the form of a circle, a ring, a square or a regular polygon as a whole. Can be: the first infrared light source 12 is a point light source, the second infrared light source 13 is also a point light source and the number is multiple; or the first infrared light source 12 is a point light source, and the second infrared light source 13 is a ring light source; or the first infrared light source The light source 12 is a plurality of ring-shaped point light sources, and the second infrared light source 13 is a ring-shaped light source; or the first infrared light source 12 is a plurality of ring-shaped point light sources, and the second infrared light source 13 is a point light source and the number is multiple or the first infrared light source 12 is a ring light source; the second infrared light source 13 is a point light source and the number is multiple; or the first infrared light source 12 is a ring light source; the second infrared light source 13 is a ring light source. The proximity sensor 50 and the light sensor 1a are disposed on one side of the first infrared light source 12 and the second infrared light source 13 , that is, the proximity sensor 50 and the light sensor 1a are disposed outside the space surrounded by the second infrared light source 13 .

Please refer to FIG. 9 , in the embodiment of the present invention, a ground pin 15 , a fill light pin 16 , a proximity light pin 17 , a proximity sensor pin 1g and a photosensitive pin 1c are formed on the input/output module 10 . The ground pin 15, the fill light pin 16, the proximity light pin 17, the proximity sensor pin 1g and the photosensitive pin 1c can be formed on the packaging substrate 111, when the ground pin 15 and the fill light pin 16 are used When it is possible (that is, when the ground pin 15 and the supplementary light pin 16 are connected to the circuit conduction), the first infrared light source 12 and the second infrared light source 13 emit infrared rays; when the ground pin 15 and the proximity lamp pin 17 When enabled (that is, when the ground pin 15 and the proximity lamp pin 17 are connected to the circuit conduction), the first infrared light source 12 emits infrared light; when the ground pin and the proximity sensor pin 1g are enabled, the approach The sensor 50 receives the infrared light emitted by the first infrared light source 12 reflected by the object; ), the light sensor 1a detects the intensity of visible light as a basis for controlling the display brightness of the display screen 90 .

Referring to FIG. 1 , the casing 20 can be used as an installation carrier for the input-output module 10 , or in other words, the input-output module 10 can be set inside the casing 20 . The casing 20 can be the casing of the electronic device 100. In the embodiment of the present invention, the display screen 90 of the electronic device 100 can also be arranged inside the casing 20. Since the input-output module 10 of the embodiment of the present invention occupies a small volume Therefore, the volume for setting the display screen 90 in the case 20 can be correspondingly increased, so as to increase the screen-to-body ratio of the electronic device 100 . Specifically, the casing 20 includes a top 21 and a bottom 22, and the display screen 90 and the input/output module 10 are arranged between the top 21 and the bottom 22. When the user normally uses the electronic device 100, the top 21 is located above the bottom 22. , the input-output module 10 can be arranged between the display screen 90 and the top 21 . In other embodiments, the display screen 90 may be a full screen with a gap, the display screen 90 surrounds the input and output module 10 , and the input and output module 10 is exposed from the gap of the display screen 90 .

The casing 20 is also provided with an organic casing light source through hole 23 , a casing proximity sensor through hole 26 and a casing light sensing through hole 24 . When the input-output module 10 is arranged in the casing 20, the first infrared light source 12 and the second infrared light source 13 correspond to the light source through hole 23 of the casing, the proximity sensor 50 corresponds to the proximity sensor through hole 26 of the casing, and the light sensor 1a Corresponding to the photosensitive through hole 24 of the casing. Wherein the first infrared light source 12 and the second infrared light source 13 correspond to the light source through hole 23 of the casing, which means that the light emitted by the first infrared light source 12 and the second infrared light source 13 can pass through the light source through hole 23 of the casing, specifically, The first infrared light source 12 and the second infrared light source 13 are directly facing the light source through hole 23 of the casing, or the light emitted by the first infrared light source 12 and the second infrared light source 13 passes through the light source of the casing after being acted on by the light guide element. Through hole 23. The correspondence between the photoreceptor 1a and the light-sensing through hole 24 of the casing means that visible light can pass through the light-sensing through hole 24 of the casing and be incident on the photoreceptor 1a. The hole 24 is directly opposite, and the incident light of visible light can also pass through the light-sensing through-hole 24 of the casing and be incident on the light sensor 1a after being acted on by the light-guiding element. The proximity sensor 50 corresponds to the through hole 26 of the housing proximity sensor in the same way, and details will not be repeated here. The housing light source through hole 23 and the housing light sensing through hole 24 may be spaced apart from each other. Of course, in other embodiments, the housing light source through hole 23, the housing proximity sensor through hole 26 and the housing light sensing through hole 24 It can also be interconnected.

The cover plate 30 may be transparent, and the material of the cover plate 30 may be transparent glass, resin, plastic, and the like. The cover plate 30 is arranged on the casing 20. The cover plate 30 includes an inner surface 32 combined with the casing 20 and an outer surface 31 opposite to the inner surface 32. The light emitted by the input and output module 10 passes through the inner surface 32 in turn. and the outer surface 31 through the cover plate 30 . The cover plate 30 covers the casing light source through hole 23, the casing proximity sensor through hole 26 and the casing light sensing through hole 24, and the inner surface 32 of the cover plate 30 is coated with an infrared transparent ink 40, and the infrared transparent ink 40 pairs Infrared light has a relatively high transmittance, such as 85% or above, and a high attenuation rate of visible light, such as above 70%, making it difficult for the user to see the electronic device 100 with the naked eye during normal use. The area covered by infrared transparent ink 40 . In particular, infrared transparent ink 40 may cover areas of inner surface 32 that do not correspond to display screen 90 .

The infrared transparent ink 40 can also block at least one of the casing light source through hole 23 and the casing proximity sensor through hole 26, that is, the infrared transparent ink 40 can simultaneously cover the casing light source through hole 23 and the casing proximity sensor through hole 26. It is difficult for the user to see the internal structure of the electronic device 100 through the light source through hole 23 of the casing and the proximity sensor through hole 26 of the casing, and the appearance of the electronic device 100 is more beautiful; the infrared transparent ink 40 can also cover the light source through hole 23 of the casing The sensor through hole 26 of the casing is not covered; or the infrared light-transmitting ink can also cover the sensor through hole 26 of the casing without covering the light source through hole 23 of the casing.

Please refer to FIG. 1 , the receiver 70 is used to emit a sound wave signal when being excited by a power source, and the user can communicate through the receiver 70 . The structured light projector 80 is used for emitting structured light outwards, and the structured light is reflected after being projected on the object to be measured. The reflected structured light can be received by the infrared camera 62, and the processor of the electronic device 100 further analyzes it by the infrared camera 62. The received structured light is used to obtain the depth information of the measured object.

The imaging module 60 includes a visible light camera 61 and an infrared light camera 62. The centers of the input and output module 10, the infrared light camera 62, the visible light camera 61, the receiver 70 and the structured light projector 80 are located on the same line segment. Specifically, from one end of the line segment to the other end are the input and output module 10, the structured light projector 80, the receiver 70, the infrared light camera 62, and the visible light camera 61. At this time, the visible light camera 61 and the infrared light camera 62 can form a dual camera; or from one end of the line segment to the other end, the input and output module 10, the infrared camera 62, the receiver 70, the visible light camera 61, and the structured light projector 80; or from one end of the line segment to the other end, the infrared camera 62. Input and output module 10, receiver 70, visible light camera 61, structured light projector 80; or from one end to the other end of the line segment, the infrared camera 62, visible light camera 61, receiver 70, input and output module 10, structure The light projector 80, at this time, the visible light camera 61 and the infrared light camera 62 can form a dual camera. Of course, the arrangement of the input and output module 10, the infrared camera 62, the receiver 70, the visible light camera 61, and the structured light projector 80 is not limited to the above-mentioned examples, and there may be others, for example, the centers of the electronic components are arranged in a circular arc Shape, the center is arranged into a rectangle and other shapes.

To sum up, the electronic device 100 in the embodiment of the present invention can be used for proximity infrared distance measurement only when the first infrared light source 12 is turned on and the proximity sensor 50 is turned on, and can be used for infrared compensation when the first infrared light source 12 and the second infrared light source 13 are turned on at the same time. light, and the light sensor 1a can also be used for visible light intensity detection, in other words, the first infrared light source 12, the second infrared light source 13, the proximity light sensor 50 and the light sensor 1a are integrated into a single package structure, so that the input and output modules Group 10 integrates the function of emitting infrared light for infrared distance measurement, infrared supplementary light, and visible light intensity detection. In addition, the first infrared light source 12, the second infrared light source 13, the proximity light sensor 50 and the light sensor 1a are integrated into a single package structure, and the input and output module 10 has a high degree of integration and a small volume. 10 saves the space for realizing the functions of infrared supplementary light, infrared ranging, and intensity detection of visible light. In addition, since the first infrared light source 12, the second infrared light source 13, the proximity light sensor 50, and the light sensor 1a are all carried on the same packaging substrate 111, compared with the infrared fill light, proximity infrared lamp, proximity light The sensor 50 and the light sensor 1a need to be manufactured on different wafers and then assembled on the PCB substrate for packaging, which improves the packaging efficiency.

Please refer to FIG. 5 again. In some embodiments, the input/output module 10 further includes a light source lens 18 , a proximity sensor lens 1h and a photosensitive lens 1b. The light source lens 18 is disposed in the package housing 11 and corresponds to the first infrared light source 12 and the second infrared light source 13 . The proximity sensor lens 1 h is disposed within the package case 11 and corresponds to the proximity sensor 50 . The photosensitive lens 1b is disposed in the package housing 11 and corresponds to the photosensor 1a. The infrared light emitted by the first infrared light source 12 and the second infrared light source 13 is converged into the light-emitting window 1131 under the action of the light source lens 18 to emit, reducing the amount of light emitted to other areas of the package side wall 112 and the package top 113, only need to meet The field angle α of the infrared light used for supplementary light emitted by the first infrared light source 12 and the second infrared light source 13 after passing through the light source lens 18 is 60 degrees-90 degrees, and the infrared light emitted by the first infrared light source 12 is used for infrared distance measurement. The field angle β of the infrared light after passing through the light source lens 18 is 10°-30°. In the same way, when the infrared light emitted by the proximity infrared lamp 13 reflected by the object entering the proximity sensor window 1134 is incident on the proximity sensor lens 1h, the proximity sensor lens 1h reduces the amount of reflected infrared light transmitted to the proximity sensor 50. Similarly, when the visible light entering through the light-sensing window 1132 is incident on the light-sensing lens 1b, the light-sensing lens 1b will converge the visible light to the light sensor 1a, reducing the amount of visible light transmitted to the outside of the light sensor 1a. Specifically, the light source lens 18, the proximity sensor lens 1h and the photosensitive lens 1b can be located on a transparent substrate, more specifically, the light source lens 18 and the photosensitive lens 1b can be integrally formed with the transparent substrate. Of course, the input and output module 10 can also only be provided with one or more of the light source lens 18, the proximity sensor lens 1h and the photosensitive lens 1b; Photosensitive lens 1b.

Please refer to FIG. 5. In some embodiments, the input and output module 10 further includes a metal shielding plate 1d, and the metal shielding plate 1d is located in the package housing 11 and is located between the second infrared light source 13 and the proximity sensor 50, and the proximity sensor 50 and the proximity sensor 50. between photoreceptors 1a. The metal shielding plate 1d is located between the second infrared light source 13 and the photoreceptor 1a, which can prevent the first infrared light source 12 and the second infrared light source 13 from emitting infrared rays from incident on the photoreceptor 1a, and can also shield the first infrared light source 12 Electromagnetic interference between the photoreceptors 1a, between the second infrared light source 13 and the photoreceptor 1a, and between the proximity sensor 50 and the photoreceptor 1a.

Please refer to FIG. 11 , in some embodiments, the I/O module 10 further includes an optical enclosure 19 . The optical enclosure 19 is made of light-transmitting material, and the optical enclosure 19 is formed on the packaging substrate 111 and located in the packaging casing 11 . The optical enclosure 19 covers the first infrared light source 12 , the second infrared light source 13 , the proximity sensor 50 and the light sensor 1a. Specifically, the optical encapsulation 19 can be formed by a glue injection molding process, the optical encapsulation 19 can be made of transparent thermosetting epoxy resin, so that it is not easy to soften during use, and the optical encapsulation 19 can fix the first infrared light source 12 , the relative position between the second infrared light source 13, the proximity sensor 50 and the photoreceptor 1a, and make the first infrared light source 12, the second infrared light source 13, the proximity sensor 50 and the photoreceptor 1a not easy in the package housing 11 shaking.

Please refer to FIG. 11 , in some embodiments, the input-output module 10 further includes a plurality of light-emitting partitions 1e, and the plurality of light-emitting partitions 1e are formed in the optical enclosure 19 and located between the second infrared light source 13 and the proximity sensor 50. And between the proximity sensor 50 and the light sensor 1a. The light-emitting partition 1e can block the first infrared light source 12 and the second infrared light source 13 from emitting infrared light to be incident on the proximity sensor 50 and the photosensor 1a, and at the same time block the visible light entering from the photosensitive window 1132 and shooting to the photosensor 1a from affecting the first infrared light source. The first infrared light source 12 and the second infrared light source 13 emit light and the proximity sensor 50 receives reflected infrared light.

Please refer to FIG. 12 , in some embodiments, the casing 20 is also provided with a casing sound hole (not shown), the cover plate 30 is also provided with a cover plate sound hole 34, and the receiver 70 and the cover plate sound hole 34 corresponds to the position of the casing sound hole. The centers of the input and output module 10 , the infrared camera 62 , the visible light camera 61 and the structured light projector 80 are located on the same line segment, and the receiver 70 is located between the line segment and the top 21 of the casing 20 .

The center of the receiver 70 is not located on the line segment, which saves the horizontal space occupied by the electronic components (input and output module 10, infrared camera 62, visible light camera 61, structured light projector 80, etc.) on the cover plate 30. The sound outlet hole 34 of the cover plate is opened at the edge of the cover plate 30 , and the sound outlet hole of the casing is opened near the top 21 .

Please refer to FIGS. 13 to 15. In some embodiments, the cover plate 30 may also be provided with a cover plate light source through hole 33. The cover plate light source through hole 33 corresponds to the casing light source through hole 23. The first infrared light source 12 The infrared light emitted by the second infrared light source 13 can pass through the light source through hole 23 of the casing and exit the electronic device 100 through the light source through hole 33 of the cover plate.

In some embodiments, the cover plate 30 can also be provided with a cover plate proximity sensor through hole 37, the cover plate proximity sensor through hole 37 corresponds to the casing proximity sensor through hole 26, and the infrared light emitted by the first infrared lamp 12 passes through the object. After being reflected, it passes through the proximity sensor through hole 26 of the housing and can be incident on the proximity sensor 50 from the cover plate proximity sensor through hole 37 . At this time, infrared transparent ink 40 can be provided on the cover plate 30 corresponding to the through hole 26 of the proximity sensor of the casing, so that it is difficult for the user to see the proximity sensor 50 inside the electronic device 100 through the through hole 26 of the proximity sensor of the casing. The appearance of 100 is more beautiful.

In some embodiments, the cover plate 30 can also be provided with a light-sensing through hole 35 of the cover plate, which corresponds to the light-sensing through hole 24 of the casing and the light sensor 1a. Visible light can be incident on the photoreceptor 1a after passing through the light-sensing through hole 35 of the cover plate and the light-sensing through hole 24 of the casing.

In the description of this specification, references to the terms "certain embodiments," "one embodiment," "some embodiments," "exemplary embodiments," "examples," "specific examples," or "some examples" To describe means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the described specific features, structures, materials or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include at least one of said features. In the description of the present invention, "plurality" means at least two, such as two, three, unless otherwise specifically defined.

Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present invention, those skilled in the art can make the above-mentioned The embodiments are subject to changes, modifications, substitutions and variations, the scope of the present invention is defined by the claims and their equivalents.

Claims (13)

1. An input and output module, characterized in that, the input and output module includes a package housing, a first infrared light source, a second infrared light source arranged around the first infrared light source, a proximity sensor and a light sensor, The package housing includes a package substrate, the first infrared light source, the second infrared light source, the proximity sensor and the light sensor are all packaged in the package case and carried on the package substrate, when the The second infrared light source is turned off, and when the first infrared light source emits infrared light to the outside of the packaging casing with the first power, the input and output module is used for infrared distance measurement; when the first infrared light source and the When the second infrared light source is turned on and emits infrared light to the outside of the packaging shell with the second power, the input and output module is used for infrared supplementary light; the proximity sensor is used for receiving the light reflected by the object The infrared light emitted by the infrared light source is used to detect the distance from the object to the input-output module, and the light sensor is used to receive visible light in ambient light and detect the intensity of the visible light. 2. The input and output module according to claim 1, characterized in that, The first infrared light source is a point light source, and the second infrared light source is a point light source and the number is multiple; or The first infrared light source is a point light source, and the second infrared light source is a ring light source; or The first infrared light source is a plurality of ring-shaped point light sources, and the second infrared light source is a ring-shaped light source; or The first infrared light source is a plurality of circular point light sources, and the second infrared light source is a plurality of point light sources; or The first infrared light source is a ring light source; the second infrared light source is a point light source and the number is multiple; or The first infrared light source is a ring light source; the second infrared light source is a ring light source. 3. The input-output module according to claim 1, wherein the input-output module further comprises a chip, the first infrared light source, the second infrared light source, the proximity sensor and the light All sensors are formed on one chip. 4. The input-output module according to claim 3, wherein the package housing further comprises a package side wall and a package top, and the package side wall extends from the package substrate and is connected to the package top Between the package substrate and the package top, a light-emitting window, a proximity sensor window and a photosensitive window are formed, the light-emitting window corresponds to the first infrared light source and the second infrared light source, and the proximity sensor window Corresponding to the proximity sensor, the photosensitive window corresponds to the photoreceptor. 5. The input-output module according to claim 3, characterized in that, the input-output module further comprises a light source lens, the light source lens is arranged in the package housing and is connected to the first infrared light source and the corresponding to the second infrared light source; and/or The input-output module further includes a proximity sensor lens, the proximity sensor lens is disposed in the package housing and corresponds to the proximity sensor; and/or The input-output module further includes a light-sensing lens, the light-sensing lens is arranged in the package housing and corresponds to the light sensor. 6. The input-output module according to claim 3, wherein the input-output module further comprises a light source lens, a proximity sensor lens, and a photosensitive lens arranged in the package housing, and the light source lens and the The first infrared light source corresponds to the second infrared light source, the proximity sensor lens corresponds to the proximity sensor, the photosensitive lens corresponds to the light sensor, the light source lens, the proximity sensor lens It is located on the same transparent substrate as the photosensitive lens. 7. The input-output module according to claim 1, characterized in that, the input-output module further comprises a plurality of metal shielding plates, and the plurality of metal shielding plates are located in the package housing and on the second Between any two of the two infrared light sources, the proximity sensor and the light sensor. 8. The input-output module according to claim 1, wherein the input-output module further comprises an optical enclosure made of a light-transmitting material, the optical enclosure is formed on the packaging substrate and Located in the package housing, the optical enclosure wraps the first infrared light source, the second infrared light source, the proximity sensor and the light sensor. 9. The input-output module according to claim 8, characterized in that, the input-output module further comprises a plurality of light-emitting partitions, and the plurality of light-emitting partitions are formed in the optical enclosure and located at the between any two of the second infrared light source, the proximity sensor and the light sensor. 10. The input-output module according to any one of claims 1-9, characterized in that, the input-output module is formed with a ground pin, a supplementary light pin, a proximity light pin, a proximity sensor pin, etc. feet and light-sensing pins, when the ground pin and the proximity light pin are enabled, the first infrared light source emits infrared light; when the ground pin and the fill light pin are enabled , the first infrared light source and the second infrared light source emit infrared light; when the ground pin and the proximity sensor pin are enabled, the proximity sensor receives the first infrared light reflected by the object Infrared light emitted by the light source; when the ground pin and the photosensitive pin are enabled, the photosensor receives visible light in the environment. 11. An electronic device, characterized in that the electronic device comprises: chassis; and The input-output module according to any one of claims 1-10, wherein the input-output module is arranged in the casing. 12. The electronic device according to claim 11, characterized in that, the electronic device further comprises a light-transmitting cover plate, and the casing is provided with a through hole for the light source of the casing, a through hole for the proximity sensor of the casing, and a light of the casing. Sensing through holes, the first infrared light source and the second infrared light source correspond to the light source through holes of the casing, the proximity sensor corresponds to the proximity sensor through holes of the casing, and the light sensor corresponds to the through hole of the casing proximity sensor. The light-sensing through hole of the casing corresponds, and the cover plate is arranged on the casing. 13. The electronic device according to claim 11, characterized in that, the electronic device further comprises a light-transmitting cover plate, and the casing is provided with through holes for the light source of the casing, through holes for the proximity sensor of the casing, and light-emitting holes of the casing. Sensing through holes, the first infrared light source and the second infrared light source correspond to the light source through holes of the casing, the proximity sensor corresponds to the proximity sensor through holes of the casing, and the light sensor corresponds to the through hole of the casing proximity sensor. The light-sensing through hole of the casing corresponds, the cover plate is arranged on the casing, and the surface of the cover plate combined with the casing is formed with infrared transparent ink that only transmits infrared light, and the infrared transparent ink The ink blocks at least one of the through hole of the light source of the casing and the through hole of the proximity sensor of the casing.