CN102053482B - 防尘薄膜组件剥离用夹具及剥离方法 - Google Patents
防尘薄膜组件剥离用夹具及剥离方法 Download PDFInfo
- Publication number
- CN102053482B CN102053482B CN201010225329XA CN201010225329A CN102053482B CN 102053482 B CN102053482 B CN 102053482B CN 201010225329X A CN201010225329X A CN 201010225329XA CN 201010225329 A CN201010225329 A CN 201010225329A CN 102053482 B CN102053482 B CN 102053482B
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- dustproof film
- film component
- light shield
- adhesive linkage
- anchor clamps
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- HGAZMNJKRQFZKS-UHFFFAOYSA-N chloroethene;ethenyl acetate Chemical compound ClC=C.CC(=O)OC=C HGAZMNJKRQFZKS-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
- G03F1/64—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof characterised by the frames, e.g. structure or material, including bonding means therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/66—Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009-248548 | 2009-10-29 | ||
| JP2009248548A JP4879308B2 (ja) | 2009-10-29 | 2009-10-29 | ペリクル剥離用冶具および剥離方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102053482A CN102053482A (zh) | 2011-05-11 |
| CN102053482B true CN102053482B (zh) | 2012-11-21 |
Family
ID=43957952
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010225329XA Expired - Fee Related CN102053482B (zh) | 2009-10-29 | 2010-07-12 | 防尘薄膜组件剥离用夹具及剥离方法 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP4879308B2 (xx) |
| KR (1) | KR101564115B1 (xx) |
| CN (1) | CN102053482B (xx) |
| HK (1) | HK1155232A1 (xx) |
| TW (1) | TWI423382B (xx) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6125348B2 (ja) * | 2013-06-24 | 2017-05-10 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置および基板処理方法 |
| JP6376601B2 (ja) * | 2015-05-18 | 2018-08-22 | 信越化学工業株式会社 | ペリクル支持手段及びこれを用いたペリクル支持装置とペリクル装着方法 |
| US11183410B2 (en) * | 2017-04-24 | 2021-11-23 | Photronics, Inc. | Pellicle removal tool |
| CN110756403B (zh) * | 2019-10-08 | 2020-10-02 | 东莞市欧珀精密电子有限公司 | 一种显示屏组件擦胶的夹具及其加工方法 |
| JP7292420B2 (ja) * | 2019-12-13 | 2023-06-16 | 三井化学株式会社 | ペリクルのデマウント方法、及び、ペリクルのデマウント前処理装置 |
| JP7204009B2 (ja) * | 2019-12-13 | 2023-01-13 | 三井化学株式会社 | ペリクルのデマウント方法、及び、ペリクルのデマウント装置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101075088A (zh) * | 2006-05-15 | 2007-11-21 | 信越化学工业株式会社 | 防护薄膜组件及防护薄膜组件剥离装置 |
| CN101464626A (zh) * | 2007-12-18 | 2009-06-24 | Hap精密技术自动处理有限公司 | 从掩模板移除护膜的装置和方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01181036A (ja) * | 1988-01-14 | 1989-07-19 | Fujitsu General Ltd | 空気調和機の風向調節装置 |
| JPH02247651A (ja) * | 1989-03-20 | 1990-10-03 | Fujitsu Ltd | ペリクル除去装置 |
| JP2520964B2 (ja) * | 1989-09-25 | 1996-07-31 | 本田技研工業株式会社 | 複数ロ―ラ式シャシ―ダイナモメ―タ |
| JP2002131892A (ja) * | 2000-10-27 | 2002-05-09 | Asahi Kasei Electronics Co Ltd | ペリクルの剥離方法及びその装置 |
| JP2006146085A (ja) * | 2004-11-24 | 2006-06-08 | Shin Etsu Chem Co Ltd | 大型ペリクル |
| JP4677632B2 (ja) | 2005-07-08 | 2011-04-27 | レーザーテック株式会社 | ペリクルライナー又はペリクルの剥離装置、剥離方法及びパターン基板の製造方法 |
| JP2007241204A (ja) * | 2006-03-08 | 2007-09-20 | Sigma Meltec Ltd | ペリクル剥離方法および装置 |
| JP2007333910A (ja) * | 2006-06-14 | 2007-12-27 | Shin Etsu Chem Co Ltd | ペリクル |
| JP4999634B2 (ja) | 2007-05-08 | 2012-08-15 | 松下精機株式会社 | ペクリル剥離装置及びその方法 |
| WO2009008294A1 (ja) * | 2007-07-06 | 2009-01-15 | Asahi Kasei E-Materials Corporation | 大型ペリクルの枠体及び該枠体の把持方法 |
-
2009
- 2009-10-29 JP JP2009248548A patent/JP4879308B2/ja not_active Expired - Fee Related
-
2010
- 2010-05-17 KR KR1020100045927A patent/KR101564115B1/ko not_active Expired - Fee Related
- 2010-07-12 CN CN201010225329XA patent/CN102053482B/zh not_active Expired - Fee Related
- 2010-07-13 TW TW099122972A patent/TWI423382B/zh not_active IP Right Cessation
-
2011
- 2011-09-01 HK HK11109232.6A patent/HK1155232A1/xx not_active IP Right Cessation
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101075088A (zh) * | 2006-05-15 | 2007-11-21 | 信越化学工业株式会社 | 防护薄膜组件及防护薄膜组件剥离装置 |
| CN101464626A (zh) * | 2007-12-18 | 2009-06-24 | Hap精密技术自动处理有限公司 | 从掩模板移除护膜的装置和方法 |
Non-Patent Citations (3)
| Title |
|---|
| JP特开2007-17811A 2007.01.25 |
| JP特开2007-241204A 2007.09.20 |
| JP特开2008-304886A 2008.12.18 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20110047110A (ko) | 2011-05-06 |
| HK1155232A1 (en) | 2012-05-11 |
| JP4879308B2 (ja) | 2012-02-22 |
| KR101564115B1 (ko) | 2015-10-28 |
| JP2011095453A (ja) | 2011-05-12 |
| TW201115680A (en) | 2011-05-01 |
| TWI423382B (zh) | 2014-01-11 |
| CN102053482A (zh) | 2011-05-11 |
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