CN101950726B - First-coating last-etching single package method for positively packaging double-sided graphic chip - Google Patents

Abstract

The invention relates to a double-sided graphic chip packaging method firstly plated and then engraved for a single chip. The method comprises the following process steps: taking a metal substrate; performing metal layer electroplating coating on the metal substrate; performing back etching of the metal substrate; Encapsulation of filler-free molding compound (epoxy resin) operations; metal substrate front etching operations; etching out the front of the base island and pins, and making the size of the back of the base island and pins smaller than the front of the base island and pins Size, forming a base island and pin structure with a large top and a small bottom; loading chips; punching metal wires; the front of the semi-finished product is partially encapsulated with filler plastic molding compound (epoxy resin), so that the partial unit area on the front of the pin is exposed with filler Molding compound (epoxy resin); backside of islands and pins, and front side of pins with metal plating; cutting. The chip packaging structure prepared by the method of the invention will no longer have the problem of pin drop and can shorten the length of the metal wire.

Description

Double-sided graphics chip front-mounting first plating and engraving single-chip packaging method

(1) Technical field

The invention relates to a single packaging method for a double-sided graphics chip, which is first plated and then engraved. It belongs to the technical field of semiconductor packaging.

(2) Background technology

The traditional manufacturing method of the chip package structure is: after chemical etching and surface electroplating are performed on the front side of the metal substrate, the production of the lead frame is completed (as shown in FIG. 43 ). The backside of the leadframe is etched during the packaging process. This law has the following shortcomings:

Because only half-etching work is done on the front of the metal substrate before plastic sealing, and the plastic sealing material is only half a foot high to cover the pins during the plastic sealing process, so the binding ability between the plastic package and the pins becomes smaller. If the plastic package is considerate When the chip is not well attached to the PCB board, rework and re-attachment will easily cause the problem of foot drop (as shown in Figure 44). Especially when the type of molding compound is filled, because the relationship between the environment of the material in the production process and the stress change of the subsequent surface mount will cause vertical cracks between the metal and the molding compound, the characteristic is that the higher the filler ratio, the harder it is The more brittle the easier it is to crack.

In addition, due to the long distance between the chip and the pins, the length of the metal wire is relatively long, as shown in Figures 45-46, the cost of the metal wire is relatively high (especially the expensive pure gold metal wire); The length of the wire is longer, which makes the signal output speed of the chip slower (especially for storage products and calculations that require a large amount of data); The interference of parasitic resistance/capacitance and parasitic poles on the signal is also high; and because the distance between the chip and the pins is long, the volume and area of the package are large, the cost of materials is high, and there is more waste.

(3) Contents of the invention

The purpose of the present invention is to overcome the above-mentioned disadvantages, to provide a double-sided graphic chip packaging method that does not have the problem of missing feet and can shorten the length of the metal wire.

The purpose of the present invention is achieved in this way: a double-sided graphics chip is mounted first and then engraved a single packaging method, said method comprising the following process steps:

Step 1. Take the metal substrate

Take a piece of metal substrate with appropriate thickness,

Step 2. The front and back of the metal substrate are coated with photoresist film

Use the coating equipment to cover the front and back of the metal substrate with photoresist film that can be exposed and developed to protect the subsequent electroplating metal layer process.

Step 3: Expose/develop the photoresist film on the front of the metal substrate and open the window where the metal layer needs to be plated

Use exposure and development equipment to expose and develop the front of the metal substrate that has completed the photoresist film coating operation in step 2 to remove part of the photoresist film to expose the area that needs to be electroplated on the front of the metal substrate.

Step 4. Electroplating and coating the metal layer on the windowed area on the front of the metal substrate

The first metal layer is electroplated on the area where the window has been opened on the front of the metal substrate in step 3, and the first metal layer is placed on the front of the base island and the pin,

Step 5. Remove the photoresist film on the front and back of the metal substrate

Remove the remaining photoresist film on the front of the metal substrate and the photoresist film on the back of the metal substrate.

Step 6. Cover the front and back of the metal substrate with photoresist film

Use the coating equipment to cover the front and back of the metal substrate with a photoresist film that can be exposed and developed to protect the subsequent etching process.

Step 7. Expose/develop the photoresist film on the back of the metal substrate and open the window for the area to be etched

Use exposure and development equipment to expose and develop the back of the metal substrate that has completed the photoresist film coating operation in step 6 to remove part of the photoresist film, so as to expose a part of the metal substrate for the subsequent metal substrate backside etching operation,

Step 8. Etching the back of the metal substrate

After completing the exposure/development and window opening operations in step 7, the etching operation of each pattern is performed on the back of the metal substrate to etch the base island and the back of the pins, and at the same time, the front of the pins is extended to the side of the base island as much as possible.

Step 9. Remove the photoresist film on the front and back of the metal substrate

Remove all the remaining photoresist film on the front and back of the metal substrate,

Step 10. Encapsulate the plastic compound (epoxy resin) without filler

Carry out the operation of encapsulating the plastic compound (epoxy resin) without filler on the back of the metal substrate that has completed the film removal operation described in step 9, and perform the curing operation after encapsulation of the plastic compound, so that the area around the base island and the pin, The area between the lead and the base island and the area between the lead and the lead are embedded with a filler-free molding compound (epoxy resin), and the filler-free molding compound (epoxy resin) connects the base island and the lead The periphery of the lower part, the lower part of the pin and the lower part of the base island, and the lower part of the pin and the lower part of the pin are connected into one body,

Step 11. Coating photoresist film

Use the coating equipment to cover the front and back of the metal substrate that has completed the encapsulation of the non-filler molding compound with a photoresist film that can be exposed and developed to protect the subsequent etching process.

Step 12: Expose/develop the area to be etched and open the window on the front side of the metal substrate that has completed the encapsulation of the non-filler molding compound

Use the exposure and development equipment to expose and develop the front side of the metal substrate that has completed the encapsulation of the non-filler plastic encapsulation operation in step 11 to remove part of the photoresist film, in preparation for the subsequent etching of the front side of the metal substrate.

Step 13. Etching the front side of the metal substrate

After completing the exposure/development and window opening operation in step 12, the etching operation of each pattern is carried out on the front of the metal substrate that has completed the operation of encapsulating the non-filler plastic encapsulant, and the front of the base island and the pin is etched out, and the base is made The size of the back side of the island and pins is smaller than the front size of the base island and pins, forming a base island and pin structure with a large top and a small bottom,

Step 14. Remove the photoresist film on the front and back of the metal substrate

Remove the remaining photoresist film on the front of the metal substrate and the photoresist film on the back of the metal substrate after step 13 etching to form a lead frame.

Step fifteen, loading film

Chip implantation is carried out on the first metal layer on the front side of the base island through a conductive or non-conductive adhesive substance,

Step 16, hit the metal wire

The semi-finished product that has completed the chip implantation operation is put into the metal line operation between the front side of the chip and the first metal layer on the front side of the pin,

Step 17. Encapsulate with filler molding compound (epoxy resin)

Partial unit encapsulation with filler molding compound (epoxy resin) on the front side of the semi-finished product that has been wired, so that the filler molding compound (epoxy resin) is exposed in the partial unit area on the front side of the pin, and the molding compound is encapsulated. Curing operation, so that the base island and the upper part of the pin, as well as the outside of the chip and the metal wire are encapsulated by a filler molding compound (epoxy resin),

Step 18, the base island and the back of the pin and the front of the pin are electroplated with a metal layer

For the back side of the base island and pins that have been encapsulated with filler molding compound (epoxy resin) in step 17 and the front part of the pins that are exposed with filler molding compound (epoxy resin) as described in step 17 The second metal layer and the first metal layer are respectively electroplated and coated in the area,

Step nineteen, cut the finished product

Cutting the semi-finished product that has completed the electroplating and coating of the second metal layer in step 18, so that the chips that were originally connected together in the form of an array assembly are separated one by one, and a double-sided graphic chip is mounted on a single package structure finished product.

The beneficial effects of the present invention are:

1. Ensure that there will be no more problems with feet falling

Since the lead frame adopts the double-sided etching process technology, it is easy to plan, design and manufacture the pin structure with large upper and lower pins, so that the upper and lower layers of plastic compound can tightly wrap the pin structure with large upper and lower pins. , so the binding ability between the plastic package and the pins becomes larger, and there will be no more problems of falling feet.

2. Ensure that the length of the metal wire is shortened

1) Due to the application of the technology of separate etching on the back and front of the lead frame, the pins on the front of the lead frame can be extended as far as possible to the side of the area where the chip needs to be installed later, which greatly shortens the distance between the chip and the pin, as shown in Figure 2 ~Figure 3, so the length of the metal wire is also shortened, and the cost of the metal wire can also be greatly reduced (especially the expensive pure gold metal wire);

2) Also because the length of the metal wire is shortened, the signal output speed of the chip is also greatly increased (especially for storage products and calculations that require a large amount of data). The interference of the existing parasitic resistance/capacitance and parasitic poles to the signal is also greatly reduced.

3. The volume and area of the package can be greatly reduced

Due to the use of pin extension technology, it is easy to produce a high number of pins and a high-density pin-to-pin distance, so that the volume and area of the package can be greatly reduced.

4. Reduced material cost and material consumption

Because the volume after packaging is greatly reduced, it more directly reflects the substantial reduction in material costs and the reduction in the amount of materials used also greatly reduces the problem of waste and environmental protection.

5. The advantages of using a single package of local units are:

1) In different applications, the pins on the edge of the plastic package can be extended out of the plastic package.

2) The pins on the edge of the plastic package extend out of the plastic package to clearly check the soldering on the PCB.

3) The large area of the modular type will easily cause the deformation of the different shrinkage rates due to a variety of different material structures, and the single package of the local unit can completely disperse the different shrinkage rates of the different material structures. vertical deformation.

4) When a single package is cut and separated from the plastic package, because the thickness to be cut is only the thickness of the pin, the cutting speed can be much faster than that of the modular package structure, and the cutting blade is easy to cut because of the cutting thickness. It is thinner, so the life of the cutting blade is relatively longer.

(4) Description of drawings

1(A) to 1(R) are schematic diagrams of each process in Embodiment 1 of the double-sided graphics chip packaging method of the present invention, first plating and then engraving a single chip.

Fig. 2 is a structural schematic diagram of Embodiment 1 of the double-sided graphics chip front-mounted single-chip package structure of the present invention.

FIG. 3 is a top view of FIG. 2 .

4(A) to 4(R) are schematic diagrams of each process in Embodiment 2 of the double-sided graphics chip packaging method of the present invention.

FIG. 5 is a structural schematic diagram of Embodiment 2 of the double-sided graphics chip front-mounted single-chip package structure of the present invention.

FIG. 6 is a top view of FIG. 5 .

7(A) to 7(R) are schematic diagrams of each process in Embodiment 3 of the packaging method for a double-sided graphics chip, first plated and then engraved, according to the present invention.

FIG. 8 is a structural schematic diagram of Embodiment 3 of the double-sided graphics chip front-mounted single-chip package structure of the present invention.

FIG. 9 is a top view of FIG. 8 .

10(A) to 10(R) are schematic diagrams of each process in Embodiment 4 of the double-sided graphics chip packaging method of the present invention, which is packaged first by plating and then engraved.

Fig. 11 is a structural schematic diagram of Embodiment 4 of the double-sided graphics chip front-mounted single-chip package structure of the present invention.

FIG. 12 is a top view of FIG. 11 .

13(A) to 13(R) are schematic diagrams of each process in Embodiment 5 of the double-sided graphics chip packaging method of the present invention.

Fig. 14 is a structural schematic diagram of Embodiment 5 of the double-sided graphics chip front-mounted single-chip package structure of the present invention.

FIG. 15 is a top view of FIG. 14 .

16(A) to 16(R) are schematic diagrams of each process in Embodiment 6 of the double-sided graphics chip packaging method of the present invention.

FIG. 17 is a schematic structural diagram of Embodiment 6 of the double-sided graphics chip front-mounted single-chip package structure of the present invention.

FIG. 18 is a top view of FIG. 17 .

19(A) to 19(R) are schematic diagrams of each process in Embodiment 7 of the double-sided graphics chip packaging method of the present invention, which is packaged first by plating and then engraved.

FIG. 20 is a structural schematic diagram of Embodiment 7 of the double-sided graphics chip front-mounted single-chip package structure of the present invention.

FIG. 21 is a top view of FIG. 20 .

22(A) to 22(R) are schematic diagrams of each process in Embodiment 8 of the double-sided graphics chip packaging method of the present invention, which is first plated and then engraved on a single chip.

Fig. 23 is a structural schematic diagram of Embodiment 8 of a front-mounted single-chip package structure of a double-sided graphics chip according to the present invention.

FIG. 24 is a top view of FIG. 23 .

25(A) to 25(R) are schematic diagrams of each process in Embodiment 5 of the double-sided graphics chip package method of the present invention, which is first plated and then engraved for a single chip.

Fig. 26 is a structural schematic diagram of Embodiment 5 of the double-sided graphics chip front-mounted single-chip package structure of the present invention.

FIG. 27 is a top view of FIG. 26 .

28(A) to 28(R) are schematic diagrams of each process in Embodiment 6 of the double-sided graphics chip packaging method of the present invention, which is packaged first by plating and then engraved.

Fig. 29 is a structural schematic diagram of Embodiment 6 of the double-sided graphics chip front-mounted single-chip package structure of the present invention.

FIG. 30 is a top view of FIG. 29 .

31(A) to 31(R) are schematic diagrams of each process in Embodiment 11 of the double-sided graphics chip packaging method of the present invention, which is packaged first by plating and then engraved.

Fig. 32 is a structural schematic diagram of Embodiment 11 of the double-sided graphics chip front-mounted single-chip package structure of the present invention.

FIG. 33 is a top view of FIG. 32 .

34(A) to 34(R) are schematic diagrams of each process in Embodiment 12 of the double-sided graphics chip packaging method of the present invention, which is packaged first and then engraved.

Fig. 35 is a structural schematic diagram of Embodiment 12 of the double-sided graphics chip front-mounted single-chip package structure of the present invention.

FIG. 36 is a top view of FIG. 35 .

37(A) to 37(R) are schematic diagrams of each process in Embodiment 13 of the double-sided graphics chip packaging method of the present invention.

Fig. 38 is a structural schematic diagram of Embodiment 13 of the double-sided graphics chip front-mounted single-chip package structure of the present invention.

FIG. 39 is a top view of FIG. 38 .

40(A) to 40(R) are schematic diagrams of each process in Embodiment 14 of the double-sided graphics chip packaging method of the present invention.

Fig. 41 is a structural schematic diagram of Embodiment 14 of the double-sided graphics chip front-mounted single-chip package structure of the present invention.

FIG. 42 is a top view of FIG. 41 .

Fig. 43 is a working diagram of chemical etching and surface electroplating on the front side of a metal substrate in the past.

Fig. 44 is a diagram of a footfall formed in the past.

Fig. 45 is a schematic diagram of a conventional package structure.

FIG. 46 is a top view of 45 .

Reference signs in the figure:

base island 1, pins 2, plastic encapsulant (epoxy resin) without filler) 3, first metal layer 4, second metal layer 5, conductive or non-conductive bonding substance 6, chip 7, metal wire 8, with Filler molding compound (epoxy resin) 9, metal substrate 10, photoresist film 11, photoresist film 12, photoresist film 13, photoresist film 14, photoresist film 15, photoresist film 16;

The third base island 1.1, the third base island 1.2, the third base island 1.3, and the fourth base island 1.4.

(5) Specific implementation methods

The double-sided graphics chip of the present invention is mounted first and then engraved with a single packaging method as follows:

Example 1: Single base island single turn pin

Referring to FIG. 2 and FIG. 3 , FIG. 2 is a structural schematic diagram of Embodiment 1 of the double-sided graphic chip front-mount single-chip package structure of the present invention. FIG. 3 is a top view of FIG. 2 . As can be seen from Fig. 2 and Fig. 3, the double-sided graphics chip of the present invention is mounted on a single package structure, including base island 1, pin 2, plastic encapsulant (epoxy resin) 3 without filler, conductive or non-conductive bonding substance 6. Chip 7, metal wire 8 and filler molding compound (epoxy resin) 9, the front of the pin 2 extends to the side of the base island 1 as much as possible, and the front of the base island 1 and the pin 2 is provided with The first metal layer 4 is provided with a second metal layer 5 on the back of the base island 1 and the pin 2, and a conductive or non-conductive adhesive substance 6 is provided on the first metal layer 4 on the front of the base island 1. Chip 7, the front of the chip 7 is connected with the first metal layer 4 on the front of the pin 2 with a metal wire 8, and the top of the base island 1 and the pin 2, as well as the chip 7 and the metal wire 8 are encapsulated with a filler plastic compound ( Epoxy resin) 9, the filler molding compound (epoxy resin) 9 covers the front part of the pin 2, in the area around the base island 1 and the pin 2, between the pin 2 and the base island 1 The area between the pin 2 and the pin 2 is embedded with a filler-free molding compound (epoxy resin) 3, and the filler-free molding compound (epoxy resin) 3 connects the base island 1 and the pin The periphery of the lower part, the lower part of the pin 2 and the lower part of the base island 1, and the lower part of the pin 2 and the lower part of the pin 2 are connected into one body, and the size of the base island and the back of the pin is smaller than the size of the base island and the front of the pin, forming an upper and a lower Small base island and pin structure.

Its packaging method is as follows:

Step 1. Take the metal substrate

Referring to FIG. 1(A), take a metal substrate 10 with an appropriate thickness. The material of the metal substrate can be changed according to the functions and characteristics of the chip, for example: copper, aluminum, iron, copper alloy or nickel-iron alloy.

Step 2. The front and back of the metal substrate are coated with photoresist film

Referring to FIG. 1(B), the front and back sides of the metal substrate are coated with photoresist films 11 and 12 that can be exposed and developed by coating equipment to protect the subsequent electroplating metal layer process. The photoresist film can be a dry photoresist thin film or a wet photoresist film.

Step 3: Expose/develop the photoresist film on the front of the metal substrate and open the window where the metal layer needs to be plated

Referring to FIG. 1(C), use exposure and development equipment to expose and develop the front of the metal substrate that has completed the photoresist film coating operation in step 2 to remove part of the photoresist film to expose the area on the front of the metal substrate that needs to be subsequently electroplated with a metal layer.

Step 4. Electroplating and coating the metal layer on the windowed area on the front of the metal substrate

Referring to FIG. 1(D), the first metal layer 4 is electroplated on the area where the window has been opened on the front side of the metal substrate in step 3, and the first metal layer 4 is placed on the front side of the base island 1 and the pin 2 .

Step 5. Remove the photoresist film on the front and back of the metal substrate

Referring to FIG. 1(E), remove the remaining photoresist film on the front side of the metal substrate and the photoresist film on the back side of the metal substrate.

Step 6. Cover the front and back of the metal substrate with photoresist film

Referring to FIG. 1(F), the front and back sides of the metal substrate are coated with photoresist films 13 and 14 that can be exposed and developed by coating equipment, so as to protect the subsequent etching process. The photoresist film can be a dry photoresist thin film or a wet photoresist film.

Step 7. Expose/develop the photoresist film on the back of the metal substrate and open the window for the area to be etched

Referring to Figure 1(G), use the exposure and development equipment to expose and develop the back of the metal substrate that has completed the photoresist film coating operation in step 6 to remove part of the photoresist film, so as to expose a part of the metal substrate for subsequent etching on the back of the metal substrate Operation.

Step 8. Etching the back of the metal substrate

Referring to Figure 1(H), after completing the exposure/development and window opening operations in step 7, the etching operation of each pattern is performed on the back of the metal substrate to etch the back of the base island 1 and pin 2, and at the same time, the front of the pin is etched. Extend as far as possible to the side of the base island.

Step 9. Remove the photoresist film on the front and back of the metal substrate

Referring to FIG. 1(I), the remaining photoresist films on the front and back of the metal substrate are all removed.

Step 10. Encapsulate the plastic compound (epoxy resin) without filler

Referring to Figure 1(J), the back of the metal substrate that has completed the film removal operation described in step 9 is encapsulated with no filler molding compound (epoxy resin), and the curing operation is performed after the molding compound is encapsulated, so that the base island 1 and the peripheral area of pin 2, the area between pin 2 and base island 1, and the area between pin 2 and pin 2 are all embedded with no filler molding compound (epoxy resin) 3, the filler-free The molding compound (epoxy resin) 3 connects the base island 1 and the periphery of the lower part of the pin, the lower part of the pin 2 and the lower part of the base island 1, and the lower part of the pin 2 and the lower part of the pin 2 into one body.

Step 11. Coating photoresist film

Referring to Fig. 1(K), use the coating equipment to coat the front and back of the metal substrate that has completed the encapsulation of the filler-free molding compound with photoresist films 15 and 16 that can be exposed and developed, so as to protect the subsequent etching process. . The photoresist film can be a dry photoresist thin film or a wet photoresist film.

Step 12: Expose/develop the area to be etched and open the window on the front side of the metal substrate that has completed the encapsulation of the non-filler molding compound

Referring to Figure 1(L), use the exposure and development equipment to expose and develop the front side of the metal substrate that has completed the encapsulation and non-filler molding compound operation in step 11 to remove part of the photoresist film for subsequent needs Perform front side etching of metal substrates.

Step 13. Etching the front side of the metal substrate

Referring to Figure 1(M), after completing the exposure/development and window opening operations in step 12, the etching operation of each pattern is performed on the front of the metal substrate that has completed the encapsulation of the non-filler plastic encapsulant, and the base island 1 and the pins are etched out 2, and make the size of the back side of the base island 1 and the pin 2 smaller than the front size of the base island 1 and the pin 2, forming a structure of the base island 1 and the pin 2 with a large top and a small bottom.

Step 14. Remove the photoresist film on the front and back of the metal substrate

Referring to FIG. 1(N), the remaining photoresist film on the front side of the metal substrate and the photoresist film on the back side of the metal substrate after step 13 etching is removed to form a lead frame.

Step 15, loading film

Referring to FIG. 1(O), the chip 7 is implanted on the first metal layer 4 on the front side of the base island 1 through a conductive or non-conductive adhesive substance 6 .

Step 16, hit the metal wire

Referring to FIG. 1(P), the semi-finished product that has completed the chip implantation operation is put into metal wire 8 between the front side of the chip and the first metal layer on the front side of the pin.

Step 17. Encapsulate with filler molding compound (epoxy resin)

Referring to Figure 1(Q), the front side of the semi-finished product that has been wired is partially encapsulated with filler molding compound 9, so that the filler molding compound (epoxy resin) 9 is exposed in the partial unit area on the front side of the pin 2, and plastic sealing is carried out. The curing operation after material encapsulation makes the base island and the upper part of the pin, as well as the outside of the chip and the metal wire all be encapsulated by a filler plastic encapsulant (epoxy resin).

Step 18, the base island and the back of the pin and the front of the pin are electroplated with a metal layer

Referring to Fig. 1 (R), the back side of the base island and pins that have completed step 17 encapsulation with filler molding compound (epoxy resin) and the exposed filler molding compound (epoxy resin) described in step 17 ) The partial unit area on the front side of the pin 2 of 9 is subjected to the electroplating and coating operation of the second metal layer 5 and the first metal layer 4 respectively, and the electroplating material can be tin, nickel gold, nickel palladium gold...etc. metal materials.

Step nineteen, cut the finished product

Referring to Figure 2 and Figure 3, the semi-finished product that has completed the electroplating and coating of the second metal layer in step 18 is cut, so that the chips that were originally connected together in the form of an array assembly are separated one by one to obtain a double-sided The graphics chip is being installed in a single package structure.

Embodiment 2: sunken base island exposed type single-turn pin

Referring to Figures 4 to 6, Figures 4(A) to 4(R) are schematic diagrams of each process in Embodiment 2 of the double-sided graphics chip packaging method of the present invention, first plated and then engraved. FIG. 5 is a structural schematic diagram of Embodiment 2 of the double-sided graphics chip front-mounted single-chip package structure of the present invention. FIG. 6 is a top view of FIG. 5 . It can be seen from FIG. 4 , FIG. 5 and FIG. 6 that the only difference between Embodiment 2 and Embodiment 1 is that the base island 1 is a sunken base island, that is, the central area of the front of the base island 1 is sunken.

Embodiment 3: Embedded base island single-turn pin

Referring to Figures 7 to 9, Figures 7(A) to 7(R) are schematic diagrams of each process in Embodiment 3 of the double-sided graphics chip packaging method of the present invention, first plating and then engraving a single chip. FIG. 8 is a structural schematic diagram of Embodiment 3 of the double-sided graphics chip front-mounted single-chip package structure of the present invention. FIG. 9 is a top view of FIG. 8 . It can be seen from Fig. 7, Fig. 8 and Fig. 9 that the only difference between Embodiment 3 and Embodiment 1 is that the base island 1 is an embedded type base island, that is, the back of the base island 1 is embedded with the non-filler The molding compound (epoxy resin) 3 inside.

Embodiment 4: Multi-bump base island exposed single-turn pin

Referring to Figures 10-12, Figures 10(A)-10(R) are schematic diagrams of each process in Embodiment 4 of the double-sided graphics chip packaging method of the present invention, which is first plated and then engraved. Fig. 11 is a structural schematic diagram of Embodiment 4 of the double-sided graphics chip front-mounted single-chip package structure of the present invention. FIG. 12 is a top view of FIG. 11 . It can be seen from Figure 10, Figure 11 and Figure 12 that the difference between Embodiment 4 and Embodiment 1 is that the base island 1 is a multi-bump base island, that is, the surface of the base island 1 is provided with multiple bumps .

Embodiment 5: Multiple base island exposed single-turn pins

Referring to Figures 13-15, Figures 13(A)-13(R) are schematic diagrams of each process in Embodiment 5 of the double-sided graphics chip packaging method of the present invention, which is packaged first by plating and then engraved. Fig. 14 is a structural schematic diagram of Embodiment 5 of the double-sided graphics chip front-mounted single-chip package structure of the present invention. FIG. 15 is a top view of FIG. 14 . It can be seen from FIGS. 13 to 15 that the difference between Embodiment 5 and Embodiment 1 lies in that: there are multiple base islands 1 , and the pin 2 has a single turn.

Embodiment 6: Multiple sunken base island exposed single-turn pins

Referring to Figures 16-18, Figures 16(A)-16(R) are schematic diagrams of each process in Embodiment 6 of the double-sided graphics chip packaging method of the present invention, which is packaged first by plating and then engraved. FIG. 17 is a schematic structural diagram of Embodiment 6 of the double-sided graphics chip front-mounted single-chip package structure of the present invention. FIG. 18 is a top view of FIG. 17 . It can be seen from FIGS. 16 to 18 that the difference between Embodiment 6 and Embodiment 2 lies in that: there are multiple base islands 1 , and the pin 2 has a single turn.

Example 7: Multiple Buried Base Island Single Turn Pins

Referring to Figures 19-21, Figures 19(A)-19(R) are schematic diagrams of each process in Embodiment 7 of the double-sided graphics chip packaging method of the present invention. FIG. 20 is a structural schematic diagram of Embodiment 7 of the double-sided graphics chip front-mounted single-chip package structure of the present invention. FIG. 21 is a top view of FIG. 20 . It can be seen from FIGS. 19-21 that the difference between Embodiment 7 and Embodiment 3 lies in that: there are multiple base islands 1 , and the pin 2 has a single turn.

Embodiment 8: Multiple multi-bump base island exposed single-turn pins

Referring to Figures 22-24, Figures 22(A)-22(R) are schematic diagrams of each process in Embodiment 8 of the packaging method for double-sided graphics chips of the present invention, which are first plated and then engraved on a single chip. Fig. 23 is a structural schematic diagram of Embodiment 8 of a front-mounted single-chip package structure of a double-sided graphics chip according to the present invention. FIG. 24 is a top view of FIG. 23 . It can be seen from FIGS. 22 to 24 that the difference between Embodiment 8 and Embodiment 4 lies in that: there are multiple base islands 1 , and the pin 2 has a single turn.

Embodiment 9: base island exposed type and sunken base island exposed type single-turn pin

Referring to Fig. 25-27, Fig. 25(A)-Fig. 25(R) are schematic diagrams of each process in Embodiment 9 of the packaging method for double-sided graphics chips of the present invention. Fig. 26 is a structural schematic diagram of Embodiment 9 of the double-sided graphics chip front-mounted single-chip package structure of the present invention. FIG. 27 is a top view of FIG. 26 . It can be seen from Figures 25 to 27 that the difference between Embodiment 9 and Embodiment 1 is that: the base island 1 has two groups or multiple groups of base islands, one group is the first base island 1.1, and the other group is the first base island 1.1. For the second base island 1.2, the central area of the front of the second base island 1.2 sinks, and the first metal layer 4 is set on the front of the first base island 1.1 and the pin 2, and on the first base island 1.1, The second metal layer 5 is arranged on the back of the second base island 1.2 and the pin 2, and the chip 7 is arranged on the central sunken area of the front of the second base island 1.2 and the front of the first base island 1.1 through a conductive or non-conductive bonding substance 6, the chip 7. Both the front side and the first metal layer 4 on the front side of the pin 2 and between the chip 7 and the chip 7 are connected with a metal wire 8, in the peripheral area of the pin 2, between the pin 2 and the first base island 1.1 The area between the first base island 1.1 and the second base island 1.2, the area between the second base island 1.2 and pin 2, and the area between pin 2 and pin 2 are embedded with filler-free molding compound 3. The filler-free molding compound 3 connects the periphery of the lower part of the pin, the lower part of the pin 2 and the first base island 1.1, the lower part of the first base island 1.1 and the second base island 1.2, the second base island 1.2 and the lower part of the pin 2, and Pin 2 is integrally connected with the lower part of pin 2, said pin 2 has a single turn.

Embodiment 10: base island exposed type and embedded type base island single-turn pin

Referring to Figures 28-30, Figures 28(A)-28(R) are schematic diagrams of each process in Embodiment 10 of the double-sided graphics chip packaging method of the present invention. Fig. 29 is a structural schematic diagram of Embodiment 10 of the double-sided graphics chip front-mounted single-chip package structure of the present invention. FIG. 30 is a top view of FIG. 29 . It can be seen from Figures 28 to 30 that the difference between Embodiment 10 and Embodiment 1 is that: the base island 1 has two groups or multiple groups of base islands, one group is the first base island 1.1, and the other group is the first base island 1.1. For the third base island 1.3, the first metal layer 4 is arranged on the front of the first base island 1.1, the third base island 1.3 and the pin 2, and the second metal layer 4 is arranged on the back of the first base island 1.1 and the pin 2. The metal layer 5, the front of the chip 7 and the first metal layer 4 on the front of the pin 2 and between the chip 7 and the chip 7 are all connected with a metal wire 8. In the area around the pin 2, the pin 2 and the first Area between base island 1.1, back of third base island 1.3, area between third base island 1.3 and first base island 1.1, area between third base island 1.3 and pin 2, and pin to pin Filler-free molding compound 3 is embedded in the area between, and the filler-free molding compound 3 connects the lower periphery of the pin, the pin 2 and the lower part of the first base island 1.1, the back of the third base island 1.3, and the back of the third base island 1.3 and The lower part of the first base island 1.1, the back of the third base island 1.3 and the lower part of the pin 2 and the lower part of the pin 2 are connected as a whole, and the pin 2 is provided with a single loop.

Embodiment 11: base island exposed type and multi-bump base island exposed type single-turn pin

Referring to Figures 31-33, Figures 31(A)-31(R) are schematic diagrams of each process in Embodiment 11 of the packaging method for double-sided graphics chips of the present invention. Fig. 32 is a structural schematic diagram of Embodiment 11 of the double-sided graphics chip front-mounted single-chip package structure of the present invention. FIG. 33 is a top view of FIG. 32 . It can be seen from Figures 31 to 33 that the difference between Embodiment 11 and Embodiment 1 is that: the base island 1 has two groups or multiple groups of base islands, one group is the first base island 1.1, and the other group is the first base island 1.1. It is the fourth base island 1.4, the front side of the fourth base island 1.4 is arranged in a multi-bump structure, in the area around the pin 2, the area between the pin 2 and the first base island 1.1, the first base island 1.1 The area between the island 1.1 and the fourth base island 1.4, the area between the fourth base island 1.4 and the pin 2, and the area between the pin 2 and the pin 2 are embedded with filler-free molding compound 3, the filler-free The plastic encapsulant (epoxy resin) 3 connects the lower periphery of the pin, the lower part of the pin 2 and the first base island 1.1, the lower part of the first base island 1.1 and the fourth base island 1.4, the fourth base island 1.4 and the lower part of the pin 2, and The pin 2 is integrally connected with the lower part of the pin 2, and the pin 2 is provided with a single circle.

Embodiment 12: Sunken base island exposed type and buried base island exposed type single-turn pin

Referring to Figures 34 to 36, Figures 34(A) to 34(R) are schematic diagrams of each process in Embodiment 12 of the double-sided graphics chip packaging method of the present invention. Fig. 35 is a structural schematic diagram of Embodiment 12 of the double-sided graphics chip front-mounted single-chip package structure of the present invention. FIG. 36 is a top view of FIG. 35 . It can be seen from Figures 34 to 36 that the difference between Embodiment 12 and Embodiment 1 is that: the base island 1 has two groups or multiple groups of base islands, one group is the second base island 1.2, and the other group is the second base island 1.2. For the third base island 1.3, the central area of the front of the second base island 1.2 is sunken, and the chip 7 is arranged on the central sunken area of the front of the second base island 1.2 and the front of the third base island 1.3 through a conductive or non-conductive bonding substance 6 , in the peripheral area of the pin 2, the area between the pin 2 and the second base island 1.2, the back side of the third base island 1.3, the area between the back side of the second base island 1.2 and the second base island 1.2, the area between the second base island 1.2, The area between the back of the three-base island 1.3 and the pin 2 and the area between the pins are embedded with no filler molding compound 3, and the filler-free molding compound 3 connects the lower periphery of the pin, the pin 2 and the second pin. The lower part of the base island 1.2, the third base island 1.3, the third base island 1.3 and the lower part of the second base island 1.2, the back of the third base island 1.3 and the lower part of the pin 2 and the lower part of the pin 2 and the pin 2 are connected into one body, said Pin 2 is provided with a circle.

Embodiment 13: Sunken base island exposed type and multi-bump base island exposed type single-turn pin

Referring to Figures 37 to 39, Figures 37(A) to 37(R) are schematic diagrams of each process in Embodiment 13 of the double-sided graphics chip packaging method of the present invention, first plated and then engraved. Fig. 38 is a structural schematic diagram of Embodiment 13 of the double-sided graphics chip front-mounted single-chip package structure of the present invention. FIG. 39 is a top view of FIG. 38 . It can be seen from Figures 37 to 39 that the difference between Embodiment 13 and Embodiment 1 is that: the base island 1 has two groups or multiple groups of base islands, one group is the second base island 1.2, and the other group is the second base island 1.2. For the fourth base island 1.4, the central area of the front of the second base island 1.2 sinks, the front of the fourth base island 1.4 is arranged in a multi-convex structure, and the fourth base island 1.4 and the front of the pin 2 are provided with a A metal layer 4, a second metal layer 5 is provided on the back of the second base island 1.2, the fourth base island 1.4 and the pin 2, and the central sinking area and the fourth base island on the front of the second base island 1.2 1.4 The front side is provided with a chip 7 through a conductive or non-conductive adhesive substance 6, in the peripheral area of the pin 2, the area between the pin 2 and the second base island 1.2, the second base island 1.2 and the fourth base island 1.4 The area between, the area between the fourth base island 1.4 and the pin 2, and the area between the pin 2 and the pin 2 are embedded with a filler-free molding compound 3, and the filler-free molding compound (epoxy resin) 3 Connect the lower periphery of the pin, pin 2 and the lower part of the second base island 1.2, the second base island 1.2 and the lower part of the fourth base island 1.4, the fourth base island 1.4 and the lower part of the pin 2, and the lower part of the pin 2 and the pin 2 Connected as one, the pin 2 is provided with a circle.

Embodiment 14: Embedded base island and multi-bump base island exposed single-turn pin

Referring to Figures 40-42, Figures 40(A)-40(R) are schematic diagrams of each process in Embodiment 14 of the double-sided graphics chip packaging method of the present invention. 41 is a structural schematic diagram of Embodiment 14 of the double-sided graphics chip front-mounted single-chip package structure of the present invention. FIG. 42 is a top view of 41 . It can be seen from Figures 40 to 42 that the difference between Embodiment 14 and Embodiment 1 is that: the base island 1 has two groups or multiple groups of base islands, one group is the third base island 1.3, and the other group is the third base island 1.3. It is the fourth base island 1.4, the front of the fourth base island 1.4 is arranged in a multi-bump structure, and the first metal layer 4 is arranged on the front of the third base island 1.3, the fourth base island 1.4 and the pin 2, The second metal layer 5 is arranged on the back of the fourth base island 1.4 and the pin 2, in the peripheral area of the pin 2, the area between the pin 2 and the fourth base island 1.4, the third base island 1.3 The backside, the area between the second base island 1.2 and the fourth base island 1.4, the area between the third base island 1.3 and the pin 2, and the area between the pins are embedded with no filler molding compound 3, so The filler-free molding compound 3 connects the lower periphery of the pin, the lower part of the pin 2 and the fourth base island 1.4, the back of the third base island 1.3, the back of the third base island 1.3 and the lower part of the fourth base island 1.4, and the back of the third base island 1.3 The lower part of the pin 2 and the lower part of the pin 2 are integrally connected, and the pin 2 is provided with a circle.

Claims (12)

1. a two-sided graphic chips formal dress plates earlier and afterwards carves single method for packing, and it is characterized in that: said method comprises following processing step:

Step 1, get metal substrate

Get the suitable metal substrate of a slice thickness,

Step 2, metal substrate front and back side lining photoresistance glued membrane

Utilization by coating equipment in the front of metal substrate and the back side be covered respectively and can carry out the photoresistance glued membrane of exposure imaging, protecting follow-up electroplated metal layer process operation,

The positive photoresistance glued membrane of step 3, metal substrate needs the exposure of plated metal layer region/develop and windows

The metal substrate front that utilizes exposure imaging equipment that step 2 is accomplished photoresistance glued membrane lining operation is carried out exposure imaging and is removed part photoresistance glued membrane, carries out the zone of electroplated metal layer to expose the positive follow-up needs of metal substrate,

The zone of having windowed in step 4, metal substrate front is carried out metal level and is electroplated lining

The first metal layer plating lining is carried out in zone to having windowed in metal substrate front in the step 3, and this first metal layer places the front of Ji Dao and pin,

Photoresistance glued membrane striping is carried out at step 5, metal substrate front and the back side

The positive remaining photoresistance glued membrane of metal substrate and the photoresistance glued membrane at the metal substrate back side are all removed,

Step 6, metal substrate front and back side lining photoresistance glued membrane

Utilization by coating equipment in the front of metal substrate and the back side be covered respectively and can carry out the photoresistance glued membrane of exposure imaging, protecting follow-up etch process operation,

The photoresistance glued membrane at step 7, the metal substrate back side needs the exposure of etching area/develop and windows

Exposure imaging removal part photoresistance glued membrane is carried out at the metal substrate back side that utilizes exposure imaging equipment that step 6 is accomplished photoresistance glued membrane lining operation, prepares against the metal substrate back etched operation that follow-up needs carry out to expose the localized metallic substrate,

Step 8, metal substrate carry out the back etched operation

After the exposure/development and windowing task of completing steps seven, promptly carry out the etching operation of each figure, etch the back side of Ji Dao and pin, simultaneously the pin front is extended to next door, basic island as much as possible at the back side of metal substrate,

Photoresistance glued membrane striping is carried out at step 9, metal substrate front and the back side

The photoresistance glued membrane that the metal substrate front and back is remaining all removes,

Step 10, seal packless plastic packaging material

Packless plastic packaging material operation is sealed at the metal substrate back side of completing steps nine said striping operations; And carry out the curing operation after plastic packaging material is sealed; Make zone and the zone between pin and the pin between Ji Dao and pin peripheral zone, pin and the basic island all set packless plastic packaging material; This packless plastic packaging material is peripheral with Ji Dao and pin bottom, pin bottom and Ji Dao bottom and pin bottom and pin bottom link into an integrated entity

Step 11, lining photoresistance glued membrane

Utilization by coating equipment in the front that will accomplish the metal substrate of sealing the operation of no filler plastic packaging material and the back side be covered respectively and can carry out the photoresistance glued membrane of exposure imaging, protecting follow-up etch process operation,

Step 12, the front of having accomplished the metal substrate of sealing the operation of no filler plastic packaging material need the exposure of etching area/develop and window

Exposure imaging removal part photoresistance glued membrane is carried out in the metal substrate front of sealing the operation of no filler plastic packaging material of accomplishing that utilizes exposure imaging equipment that step 11 is accomplished photoresistance glued membrane lining operation, carries out the operation of metal substrate front-side etch in order to follow-up needs,

Step 13, the operation of metal substrate front-side etch

After the exposure/development and windowing task of completing steps 12; Promptly carry out the etching operation of each figure in the metal substrate front that the operation of no filler plastic packaging material is sealed in completion; Etch the front of Ji Dao and pin; And make the positive size of the back side size of said Ji Dao and pin, form up big and down small Ji Dao and pin configuration less than Ji Dao and pin

Photoresistance glued membrane striping is carried out at step 14, metal substrate front and the back side

The positive remaining photoresistance glued membrane of the metal substrate of completing steps 13 etching operations and the photoresistance glued membrane at the metal substrate back side are all removed, process lead frame,

Step 15, load

On the first metal layer of front, basic island, carry out the implantation of chip through conduction or non-conductive bonding material,

Step 10 six, break metal wire

The semi-finished product of accomplishing chip implantation operation are carried out playing the metal wire operation between chip front side and the pin front the first metal layer,

Step 10 seven, be encapsulated with the filler plastic packaging material

The semi-finished product front that routing is accomplished is carried out local unit and is encapsulated with the operation of filler plastic packaging material; The positive local unit of pin zone is exposed the filler plastic packaging material is arranged; And carry out the curing operation after plastic packaging material is sealed; Make top and chip and the metal wire of Ji Dao and pin all had the filler plastic packaging material to seal outward

The back side of step 10 eight, Ji Dao and pin and the front of pin are carried out metal level and are electroplated lining

Completing steps 17 is encapsulated with the said positive local unit of the pin zones that the filler plastic packaging material is arranged of exposing of the back side and the step 10 seven of said Ji Dao and pin of filler plastic packaging material operation and carries out second metal level and the first metal layer respectively and electroplate the operation that is covered,

Step 10 nine, cutting finished product

The semi-finished product of ten eight the second metal levels of completing steps being electroplated lining carry out cutting operation, make originally more than of chips that connect together with array formula aggregate mode independent, make single encapsulating structure finished product of two-sided graphic chips formal dress.

2. a kind of two-sided graphic chips formal dress according to claim 1 plates earlier afterwards carves single method for packing, it is characterized in that Ji Dao (1) back side exposes said packless plastic packaging material (3).

3. a kind of two-sided graphic chips formal dress according to claim 1 plates earlier afterwards carves single method for packing, it is characterized in that Ji Dao (1) front middle section sinks.

4. a kind of two-sided graphic chips formal dress according to claim 1 plates earlier afterwards carves single method for packing, it is characterized in that Ji Dao (1) back side imbeds in the said packless plastic packaging material (3).

5. a kind of two-sided graphic chips formal dress according to claim 1 plates earlier afterwards carves single method for packing, it is characterized in that said Ji Dao (1) front is arranged to multi-convex point shape structure.

6. plate earlier according to one of them described a kind of two-sided graphic chips formal dress of claim 2～5 and afterwards carve single method for packing, it is a plurality of to it is characterized in that said Ji Dao (1) has, and pin (2) has individual pen.

7. a kind of two-sided graphic chips formal dress according to claim 1 plates earlier afterwards carves single method for packing; It is characterized in that said Ji Dao (1) has two groups; One group is first Ji Dao (1.1); Another group is second Ji Dao (1.2); Said second Ji Dao (1.2) front middle section sinks; Front at said first Ji Dao (1.1) and pin (2) is provided with the first metal layer (4); The back side at said first Ji Dao (1.1), second Ji Dao (1.2) and pin (2) is provided with second metal level (5); Be provided with chip (7) in positive central sunken regions of second Ji Dao (1.2) and first Ji Dao (1.1) front through conduction or non-conductive bonding material (6); Chip (7) positive with pin (2) front the first metal layer (4) between and all use metal wire (8) to be connected between chip (7) and the chip (7); Nos filler plastic packaging material (3) is set in zone between zone, second Ji Dao (1.2) and pin (2) between zone, first Ji Dao (1.1) and second Ji Dao (1.2) between peripheral zone, pin (2) and first Ji Dao (1.1) of said pin (2) and the zone between pin (2) and the pin (2), and said no filler plastic packaging material (3) links into an integrated entity periphery, pin bottom, pin (2) and first Ji Dao (1.1) bottom, first Ji Dao (1.1) and second Ji Dao (1.2) bottom, second Ji Dao (1.2) and pin (2) bottom and pin (2) and pin (2) bottom, and said pin (2) is provided with individual pen.

8. a kind of two-sided graphic chips formal dress according to claim 1 plates earlier afterwards carves single method for packing; It is characterized in that said Ji Dao (1) has two groups; One group is first Ji Dao (1.1); Another group is the 3rd Ji Dao (1.3); Front at said first Ji Dao (1.1) the 3rd Ji Dao (1.3) and pin (2) is provided with the first metal layer (4); The back side at said first Ji Dao (1.1) and pin (2) is provided with second metal level (5); Be provided with chip (7) in Ji Dao (1) front through conduction or non-conductive bonding material (6); Chip (7) positive with pin (2) front the first metal layer (4) between and all use metal wire (8) to be connected between chip (7) and the chip (7); Outside the top of said Ji Dao (1) and pin (2) and chip (7) and metal wire (8), be encapsulated with filler plastic packaging material (9); No filler plastic packaging material (3) is set in zone and the zone between pin and the pin between zone, the 3rd Ji Dao (1.3) and pin (2) between zone, the 3rd Ji Dao (1.3) back side, second Ji Dao (1.2) and first Ji Dao (1.1) between zone, pin (2) and first Ji Dao (1.1) of said pin (2) periphery, and said no filler plastic packaging material (3) is peripheral with the pin bottom, pin (2) links into an integrated entity with pin (2) bottom with first Ji Dao (1.1) bottom, the 3rd Ji Dao (1.3) back side, the 3rd Ji Dao (1.3) back side and first Ji Dao (1.1) bottom, the 3rd Ji Dao (1.3) back side and pin (2) bottom and pin (2), and said pin (2) is provided with individual pen.

9. the method for packing of single encapsulating structure of a kind of two-sided graphic chips formal dress according to claim 1; It is characterized in that said Ji Dao (1) has two groups; One group is first Ji Dao (1.1); Another group is the 4th Ji Dao (1.4); Said the 4th Ji Dao (1.4) is arranged to multi-convex point shape structure in the front; No filler plastic packaging material (3) is set in zone between zone, the 4th Ji Dao (1.4) and pin (2) between zone, first Ji Dao (1.1) and the 4th Ji Dao (1.4) between zone, pin (2) and first Ji Dao (1.1) of said pin (2) periphery and the zone between pin (2) and the pin (2); Said packless plastic packaging material (3) is peripheral with the pin bottom, pin (2) links into an integrated entity with pin (2) bottom with pin (2) bottom and pin (2) with the 4th Ji Dao (1.4) bottom, the 4th Ji Dao (1.4) with first Ji Dao (1.1) bottom, first Ji Dao (1.1), and said pin (2) is provided with individual pen.

10. a kind of two-sided graphic chips formal dress according to claim 1 plates earlier afterwards carves single method for packing; It is characterized in that said Ji Dao (1) has two groups also can be many group Ji Dao; One group is second Ji Dao (1.2); Another group is the 3rd Ji Dao (1.3); Said second Ji Dao (1.2) front middle section sinks; Be provided with chip (7) in positive central sunken regions of second Ji Dao (1.2) and the 3rd Ji Dao (1.3) front through conduction or non-conductive bonding material (6); No filler plastic packaging material (3) is set in zone and the zone between pin and the pin between zone, the 3rd Ji Dao (1.3) back side and pin (2) between zone, the 3rd Ji Dao (1.3) back side, the second Ji Dao back side (1.2) and second Ji Dao (1.2) between zone, pin (2) and second Ji Dao (1.2) of said pin (2) periphery; Said no filler plastic packaging material (3) is peripheral with the pin bottom, pin (2) links into an integrated entity with pin (2) bottom with second Ji Dao (1.2) bottom, the 3rd Ji Dao (1.3) back side and pin (2) bottom and pin (2) with second Ji Dao (1.2) bottom, the 3rd Ji Dao (1.3), the 3rd Ji Dao (1.3), and said pin (2) is provided with individual pen.

11. plating earlier, a kind of two-sided graphic chips formal dress according to claim 1 afterwards carves single method for packing; It is characterized in that said Ji Dao (1) has two groups; One group is second Ji Dao (1.2); Another group is the 4th Ji Dao (1.4); Said second Ji Dao (1.2) front middle section sinks; The 4th Ji Dao (1.4) is arranged to multi-convex point shape structure in the front; Front at said the 4th Ji Dao (1.4) and pin (2) is provided with the first metal layer (4); The back side at said second Ji Dao (1.2), the 4th Ji Dao (1.4) and pin (2) is provided with second metal level (5), is provided with chip (7) in positive central sunken regions of said second Ji Dao (1.2) and the 4th Ji Dao (1.4) front through conduction or non-conductive bonding material (6), and no filler plastic packaging material (3) is set in zone between zone, the 4th Ji Dao (1.4) and pin (2) between zone, second Ji Dao (1.2) and the 4th Ji Dao (1.4) between zone, pin (2) and second Ji Dao (1.2) of said pin (2) periphery and the zone between pin (2) and the pin (2); Said packless plastic packaging material (3) is peripheral with the pin bottom, pin (2) links into an integrated entity with pin (2) bottom with pin (2) bottom and pin (2) with the 4th Ji Dao (1.4) bottom, the 4th Ji Dao (1.4) with second Ji Dao (1.2) bottom, second Ji Dao (1.2), and said pin (2) is provided with individual pen.

12. plating earlier, a kind of two-sided graphic chips formal dress according to claim 1 afterwards carves single method for packing; It is characterized in that said Ji Dao (1) has two groups; One group is the 3rd Ji Dao (1.3); Another group is the 4th Ji Dao (1.4); Said the 4th Ji Dao (1.4) is arranged to multi-convex point shape structure in the front; Front at said the 3rd Ji Dao (1.3), the 4th Ji Dao (1.4) and pin (2) is provided with the first metal layer (4); The back side at said the 4th Ji Dao (1.4) and pin (2) is provided with second metal level (5); No filler plastic packaging material (3) is set in zone and the zone between pin and the pin between zone, the 3rd Ji Dao (1.3) and pin (2) between zone, the 3rd Ji Dao (1.3) back side, second Ji Dao (1.2) and the 4th Ji Dao (1.4) between zone, pin (2) and the 4th Ji Dao (1.4) of said pin (2) periphery, and said no filler plastic packaging material (3) is peripheral with the pin bottom, pin (2) links into an integrated entity with pin (2) bottom with the 4th Ji Dao (1.4) bottom, the 3rd Ji Dao (1.3) back side, the 3rd Ji Dao (1.3) back side and the 4th Ji Dao (1.4) bottom, the 3rd Ji Dao (1.3) back side and pin (2) bottom and pin (2), and said pin (2) is provided with individual pen.

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