CN101958305B - Double-sided graphics chip front-mount module packaging structure and packaging method - Google Patents

Abstract

The invention relates to a double-side graph chip forward module package structure and a package method thereof. The structure comprises base islands (1), pins (2), unpacked molding compounds (epoxy resins) (3), conductive or non-conductive bonding materials (6), a chip (7), metal wires (8) and packed molding compounds (epoxy resins) (9), wherein the front sides of the pins (2) extend to draw near the base islands (1); and the unpacked molding compounds (3) connect the base islands (1) with the lower periphery of the pins, the lower parts of the pins (2) with the lower parts of the base islands (1), and the lower parts of the pins (2) into a whole and ensure the back size of the base islands and the pins to be less than the front size of the base islands and the pins to form a big end up base island and pin structure. The package structure is characterized in that columns (10) are arranged at the back of the pins (2) and the roots of the columns (10) are embedded in the unpacked molding compounds (3). The package structure can bear superhigh temperature during loading and can not undergo lead frame distorsion due to different physical properties of different substances, can avoid the problem of pin falling and can shorten the length of the metal wires.

Description

Double-sided graphics chip front-mount module packaging structure and packaging method

(1) Technical field

The invention relates to a package structure and a package method of a front-loading module for a double-sided graphics chip. It belongs to the technical field of semiconductor packaging.

(2) Background technology

The traditional manufacturing method of the chip packaging structure is: after chemical etching and surface electroplating are performed on the front side of the metal substrate, the production of the lead frame is completed (as shown in FIG. 85 ). The backside of the leadframe is etched during the packaging process. This law has the following shortcomings:

Because only half-etching work is done on the front of the metal substrate before plastic sealing, and the plastic sealing material is only half a foot high to cover the pins during the plastic sealing process, so the binding ability between the plastic package and the pins becomes smaller. If the plastic package is considerate When the chip is not well attached to the PCB board, rework and re-attachment will easily cause the problem of foot drop (as shown in Figure 86). Especially when the type of molding compound is filled, because the relationship between the environment of the material in the production process and the stress change of the subsequent surface mount will cause vertical cracks between the metal and the molding compound, the characteristic is that the higher the filler ratio, the harder it is The more brittle the easier it is to crack.

In addition, due to the long distance between the chip and the pins, the length of the metal wire is relatively long, as shown in Figures 87-88, the cost of the metal wire is relatively high (especially the expensive pure gold metal wire); The length of the wire is longer, which makes the signal output speed of the chip slower (especially for storage products and calculations that require a large amount of data); The interference of parasitic resistance/capacitance and parasitic poles on the signal is also high; and because the distance between the chip and the pins is long, the volume and area of the package are large, the cost of materials is high, and there is more waste.

For this reason, the applicant previously applied for an invention patent titled "Based Island Lead Frame Structure and Its Production Method", and its application number is: 201010165896.0. Its main technical features are: use the back of the metal substrate to half-etch first, form a recessed half-etched area on the back of the metal substrate, and at the same time form the base island and the back of the pin relatively, and then fill and coat the half-etched area. Filler-free soft sealant, and bake at the same time, so that the filler-free soft sealant cures into a filler-free molding compound (epoxy resin) to wrap the backside of the pin. Then half etch is performed on the front side of the metal substrate, and at the same time, the base island and the front side of the pin are relatively formed. Its beneficial effects mainly include:

1) Since the area between the pins and the pins on the back of the metal substrate is embedded with a soft sealant without filler, the soft sealant without filler is different from the conventional sealant on the front side of the metal substrate in the plastic sealing process. There is a filler plastic compound (epoxy resin) that covers the entire height of the pins together, so the binding capacity between the plastic package and the pins becomes larger, and there will be no problem of falling feet, as shown in Figure 89.

2) Due to the method of separate etching operations on the front and back of the lead frame, a structure in which the size of the back pins is slightly smaller and the size of the front pins is slightly larger can be formed during the etching operation, while the upper and lower sizes of the same pin are different It is tighter and less likely to slip and fall when it is wrapped by a filler-free molding compound (epoxy resin).

3) Due to the application of the technology of separately etching the back and front of the lead frame, the pins on the front of the lead frame can be extended to the side of the base island as much as possible, which greatly shortens the distance between the chip and the pins, as shown in Figures 89-90. The cost of such metal wires can also be greatly reduced (especially expensive pure gold metal wires).

4) Also because of the shortening of the metal wire, the signal output speed of the chip is also greatly increased (especially for storage products and calculations that require a large amount of data), and because the length of the metal wire is shortened, the metal wire The interference of the existing parasitic resistance/capacitance and parasitic poles to the signal is also greatly reduced.

5) Due to the use of pin extension technology, the distance between high pin count and high density pins can be easily produced, so that the volume and area of the package can be greatly reduced.

6) Because the volume after packaging is greatly reduced, it more directly reflects the substantial reduction of material costs and the reduction of material consumption also greatly reduces the environmental problems of waste and environmental protection.

However, there are still following deficiencies: before encapsulation, the wrapping pin operation of the backside of the lead frame without filler molding compound is carried out, and when the high-temperature chip loading and wiring operations on the front of the lead frame are carried out, the lead frame and the filler-free plastic sealant The physical properties of the two materials are different, the coefficients of expansion of the two materials are also different, and the thermal deformation at high temperature is different, which leads to distortion of the lead frame during subsequent chip mounting. Therefore, this kind of packaging structure cannot withstand ultra-high temperature (above 200° C.) during chip loading. In the past, the requirement of high temperature resistance was achieved by making the volume of the package body large, but now the volume of the package body is required to be smaller and the power is larger and larger, and it cannot withstand ultra-high temperature.

(3) Contents of the invention

The purpose of the present invention is to overcome the above disadvantages, to provide a lead frame that can withstand ultra-high temperature during chip loading and will not cause distortion of the lead frame due to different physical properties of different substances, and will not cause the problem of falling feet and can make the metal wire The packaging structure and packaging method of the double-sided graphics chip front-loading module with shortened length.

The object of the present invention is achieved like this: a kind of double-sided graphics chip front-loading module package structure, comprises base island, pin, no filler molding compound (epoxy resin), conductive or non-conductive bonding material, chip, metal wire and filled molding compound (epoxy resin), the front side of the pin extends to the side of the base island, the first metal layer is arranged on the front side of the base island and the pin, and the back side of the base island and the pin A second metal layer is provided, and a chip is provided on the first metal layer on the front side of the base island through a conductive or non-conductive adhesive substance, and the front side of the chip is connected with the first metal layer on the front side of the pin by a metal wire. The upper part of the base island and the pin, as well as the chip and the metal wire are encapsulated with filler molding compound (epoxy resin), and the area around the base island and the pin, the area between the pin and the base island, and the pin and the lead The area between the pins is embedded with an unfilled molding compound (epoxy) that connects the base island to the lower periphery of the pin, the lower portion of the pin to the lower portion of the base island, and the pin The lower part is integrated with the lower part of the pin, and the size of the base island and the back side of the pin is smaller than the size of the base island and the front side of the pin, forming a base island and pin structure with a large upper part and a smaller bottom part, which is characterized in that: in the lead A pillar is arranged on the back of the foot, and the root of the pillar is embedded in the plastic sealing compound (epoxy resin) without filler.

The packaging method of the double-sided graphics chip front-mounted module packaging structure of the present invention, the method comprises the following process steps:

Step 1. Take the metal substrate

Take a piece of metal substrate with appropriate thickness,

Step 2. The front and back of the metal substrate are coated with photoresist film

Use coating equipment to cover the front and back of the metal substrate with a photoresist film that can be exposed and developed,

Step 3: Expose/develop the photoresist film on the front of the metal substrate and open the window where the metal layer needs to be plated

Use exposure and development equipment to expose and develop the front of the metal substrate that has completed the photoresist film coating operation in step 2 to remove part of the photoresist film to expose the area that needs to be electroplated on the front of the metal substrate.

Step 4. Electroplating and coating the metal layer on the windowed area on the front of the metal substrate

The first metal layer is electroplated on the area where the window has been opened on the front of the metal substrate in step 3, and the first metal layer is placed on the front of the base island and the pin,

Step 5. Remove the photoresist film on the front and back of the metal substrate

Remove the remaining photoresist film on the front of the metal substrate and the photoresist film on the back of the metal substrate.

Step 6. Cover the front and back of the metal substrate with photoresist film

Use the coating equipment to cover the front and back of the metal substrate with a photoresist film that can be exposed and developed to protect the subsequent etching process.

Step 7. The photoresist film of the metal substrate is exposed/developed and opened in the area that needs to be etched on both sides

Use the exposure and development equipment to expose and develop the front and back of the metal substrate that has completed the photoresist film coating operation in step 6 to remove part of the photoresist film, so as to expose a part of the metal substrate for the subsequent double-sided etching of the metal substrate.

Step 8. Metal substrate for double-sided etching

After completing the exposure/development and window opening operations in step 7, the etching operation of each pattern is carried out on the front and back of the metal substrate to etch the front and back of the base island and the pins, and at the same time extend the front of the pins as much as possible to the Next to the base island, and make the size of the back side of the base island and the pin smaller than the front size of the base island and the pin, forming a base island and pin structure with a large top and a small bottom; and forming a pillar on the back of the pin, and There are ribs between the island and the pin and between the pin and the pin,

Step 9. Remove the photoresist film on the front and back of the metal substrate

Remove all the remaining photoresist film on the front and back of the metal substrate to make a lead frame,

Step ten, loading film

On the first metal layer on the front side of the base island of the lead frame made in step 9, the chip is implanted through a conductive or non-conductive adhesive substance,

Step 11, hit the metal wire

The semi-finished product that has completed the chip implantation operation is put into the metal line operation between the front side of the chip and the first metal layer on the front side of the pin,

Step 12. Encapsulate with filler molding compound (epoxy resin)

Encapsulate the front side of the semi-finished product that has been wired with filler molding compound (epoxy resin) 9, and perform curing operations after the molding compound is encapsulated, so that the base island and the upper part of the pin, as well as the outside of the chip and the metal wire are covered. Encapsulated with filler molding compound (epoxy resin),

Step 13: Coating photoresist film

Use the coating equipment to cover the front and back of the semi-finished product that has been encapsulated with filler molding compound (epoxy resin) with a photoresist film that can be exposed and developed to protect the subsequent etching process.

Step 14. Expose/develop and open windows on the back of the semi-finished product that has been encapsulated with filler molding compound (epoxy resin)

Use exposure and development equipment to expose and develop the back of the semi-finished product that has completed the process of covering the photoresist film in step 13 and has completed the operation of encapsulating the filler plastic compound to remove part of the photoresist film to expose the metal substrate left after the double-sided etching operation in step 8. Some connecting ribs and pillars formed on the back of the pins are used for subsequent etching of the root of the pillars and connecting ribs,

Step fifteen, the second etching operation

After completing the exposure/development and window opening operations in step 14, the etching operation of each pattern is performed on the back of the semi-finished product that is encapsulated with filler molding compound (epoxy resin), and the metal substrate in step 8 is left after the double-sided etching operation. Some even ribs are all etched away, and in this process, the roots of the pillars will also be etched away to a relative thickness at the same time, so that the roots of the pillars do not expose the back of the encapsulated package structure.

Step 16. Remove the photoresist film on the front and back of the semi-finished product

Remove the remaining photoresist film on the back of the semi-finished product and the photoresist film on the front of the semi-finished product after completing the etching operation in step 15,

Step seventeen, encapsulating the plastic compound (epoxy resin) without filler

Carry out the operation of encapsulating the plastic compound (epoxy resin) without filler on the back of the semi-finished product that has completed the film removal operation described in step 16, and perform the curing operation after the plastic compound encapsulation, so that the area around the base island and the pin, The area between the lead and the base island and the area between the lead and the lead are embedded with a filler-free molding compound (epoxy resin), and the filler-free molding compound (epoxy resin) connects the base island and the lead The periphery of the lower part, the lower part of the pin and the lower part of the base island, and the lower part of the pin and the lower part of the pin are connected into one body, and the root of the column is embedded in the plastic sealing compound (epoxy resin) without filler,

Step 18, the base island and the back of the pin are electroplated with a metal layer

Carrying out the second metal layer electroplating coating operation on the back of the base island and pins that have completed the operation of encapsulating the plastic compound without filler in step seventeen,

Step nineteen, cut the finished product

Cutting the semi-finished product that has completed the electroplating and coating of the second metal layer in step 18, so that the chips that were originally connected together in the form of an array assembly are separated one by one, and a double-sided graphics chip front-loading module package structure is obtained. finished product.

The beneficial effects of the present invention are:

1. The lead frame is ultra-high temperature resistant (above 200°C)

Due to the use of double-sided graphic etching lead frame technology, the front and back double-sided etching of the lead frame is completed at one time. At the same time, when packaging, the high-temperature chip mounting and wiring on the front of the lead frame is performed first, and then the pin wrapping operation on the back of the lead frame is performed. There is only one material of the lead frame for chip loading and wiring. In the ultra-high temperature process, there is no impact caused by the different expansion coefficients of various materials, which ensures the ultra-high temperature resistance (generally below 200°C) of the lead frame. .

2. It can ensure the strength of the lead frame

Because the pre-encapsulation is not done first, the pressure on the lead frame is high when the chip is loaded, and the lead frame will vibrate when the wire is bonded, and the lead frame will sag. The invention adopts the design of leaving pillars on the back of the lead frame to increase the strength of the lead frame when wiring.

3. Make sure that there will be no more problems with feet falling

Due to the use of double-sided etching technology, it is easy to plan, design and manufacture pin structures with upper and lower pins, and the upper and lower plastic molding compounds can tightly wrap the upper and lower pin structures together, so The binding ability between the plastic package and the pins becomes larger, and there will be no more problems of falling feet.

4. Make sure the length of the metal wire is shortened

1) Due to the application of the technology of simultaneous and separate etching on the back and front of the lead frame, the pins on the front of the lead frame can be extended as far as possible to the side of the area where the chip needs to be installed later, which greatly shortens the distance between the chip and the pin, such as As shown in Fig. 89-90, the length of the metal wire is also shortened, and the cost of the metal wire can be greatly reduced (especially the expensive pure gold metal wire);

2) Also because the length of the metal wire is shortened, the signal output speed of the chip is also greatly increased (especially for storage products and calculations that require a large amount of data). The interference of the existing parasitic resistance/capacitance and parasitic poles to the signal is also greatly reduced.

5. The volume and area of the package can be greatly reduced

Due to the use of pin extension technology, it is easy to produce a high number of pins and a high-density pin-to-pin distance, so that the volume and area of the package can be greatly reduced.

6. Reduced material cost and material consumption

Because the volume after packaging is greatly reduced, it more directly reflects the substantial reduction in material costs and the reduction in the amount of materials used also greatly reduces the problem of waste and environmental protection.

(4) Description of drawings

FIG. 1(A) to FIG. 1(R) are schematic diagrams of each process in Embodiment 1 of the front-mount module packaging method for double-sided graphics chips of the present invention.

FIG. 2 is a structural schematic diagram of Embodiment 1 of the packaging structure of a double-sided graphics chip front-mount module of the present invention.

FIG. 3 is a top view of FIG. 2 .

4(A) to 4(R) are schematic diagrams of each process in Embodiment 2 of the front-mount module packaging method for double-sided graphics chips of the present invention.

FIG. 5 is a structural schematic diagram of Embodiment 2 of the package structure of the double-sided graphic chip front-mount module of the present invention.

FIG. 6 is a top view of FIG. 5 .

7(A) to 7(R) are schematic diagrams of each process in Embodiment 3 of the front-mount module packaging method for double-sided graphic chips of the present invention.

FIG. 8 is a structural schematic diagram of Embodiment 3 of the packaging structure of the double-sided graphic chip front-mount module of the present invention.

FIG. 9 is a top view of FIG. 8 .

10(A) to 10(R) are schematic diagrams of each process in Embodiment 4 of the front-mount module packaging method for double-sided graphics chips of the present invention.

FIG. 11 is a structural schematic diagram of Embodiment 4 of the package structure of the double-sided graphic chip front-mount module of the present invention.

FIG. 12 is a top view of FIG. 11 .

13(A) to 13(R) are schematic diagrams of each process in Embodiment 5 of the packaging method of a double-sided graphic chip front-mount module of the present invention.

FIG. 14 is a structural schematic diagram of Embodiment 5 of the packaging structure of the double-sided graphic chip front-mount module of the present invention.

FIG. 15 is a top view of FIG. 14 .

16(A) to 16(R) are schematic diagrams of each process in Embodiment 6 of the front-mount module packaging method for double-sided graphics chips of the present invention.

FIG. 17 is a structural schematic diagram of Embodiment 6 of the package structure of the double-sided graphic chip front-mount module of the present invention.

FIG. 18 is a top view of FIG. 17 .

19(A) to 19(R) are schematic diagrams of each process in Embodiment 7 of the front-mount module packaging method for double-sided graphic chips of the present invention.

FIG. 20 is a structural schematic diagram of Embodiment 7 of the packaging structure of the double-sided graphic chip front-mount module of the present invention.

FIG. 21 is a top view of FIG. 20 .

22(A) to 22(R) are schematic diagrams of each process in Embodiment 8 of the packaging method for a double-sided graphic chip front-mount module of the present invention.

Fig. 23 is a structural schematic diagram of Embodiment 8 of the package structure of the double-sided graphic chip front-mount module of the present invention.

FIG. 24 is a top view of FIG. 23 .

25(A) to 25(R) are schematic diagrams of each process in Embodiment 9 of the front-mount module packaging method for double-sided graphic chips of the present invention.

Fig. 26 is a structural schematic diagram of Embodiment 9 of the package structure of the double-sided graphic chip front-mount module of the present invention.

FIG. 27 is a top view of FIG. 26 .

28(A) to 28(R) are schematic diagrams of each process in Embodiment 10 of the front-mount module packaging method for double-sided graphic chips of the present invention.

Fig. 29 is a structural schematic diagram of Embodiment 10 of the packaging structure of the double-sided graphic chip front-mount module of the present invention.

FIG. 30 is a top view of FIG. 29 .

31(A) to 31(R) are schematic diagrams of each process in Embodiment 11 of the front-mount module packaging method for double-sided graphic chips of the present invention.

FIG. 32 is a structural schematic diagram of Embodiment 11 of the package structure of the double-sided graphic chip front-mount module of the present invention.

FIG. 33 is a top view of FIG. 32 .

34(A) to 34(R) are schematic diagrams of each process in Embodiment 12 of the front-mount module packaging method for double-sided graphic chips of the present invention.

Fig. 35 is a structural schematic diagram of Embodiment 12 of the packaging structure of the double-sided graphic chip front-mount module of the present invention.

FIG. 36 is a top view of FIG. 35 .

37(A) to 37(R) are schematic diagrams of each process in Embodiment 13 of the front-mount module packaging method for double-sided graphic chips of the present invention.

Fig. 38 is a structural schematic diagram of Embodiment 13 of the packaging structure of the double-sided graphic chip front-mount module of the present invention.

FIG. 39 is a top view of FIG. 38 .

40(A) to 40(R) are schematic diagrams of each process in Embodiment 14 of the front-mount module packaging method for double-sided graphic chips of the present invention.

Fig. 41 is a structural schematic diagram of Embodiment 14 of the packaging structure of the double-sided graphic chip front-mount module of the present invention.

FIG. 42 is a top view of FIG. 41 .

43(A) to 43(R) are schematic diagrams of each process in Embodiment 15 of the packaging method of a double-sided graphic chip front-mount module of the present invention.

Fig. 44 is a structural schematic diagram of Embodiment 15 of the package structure of the double-sided graphic chip front-mount module of the present invention.

FIG. 45 is a top view of FIG. 44 .

46(A) to 46(R) are schematic diagrams of each process in Embodiment 16 of the front-mount module packaging method for double-sided graphics chips of the present invention.

Fig. 47 is a structural schematic diagram of Embodiment 16 of the package structure of the double-sided graphic chip front-mount module of the present invention.

FIG. 48 is a top view of FIG. 47 .

49(A) to 49(R) are schematic diagrams of each process in Embodiment 17 of the method for packaging a front-mount module for a double-sided graphic chip according to the present invention.

Fig. 50 is a structural schematic diagram of Embodiment 17 of the package structure of the double-sided graphic chip front-mount module of the present invention.

FIG. 51 is a top view of FIG. 50 .

52(A) to 52(R) are schematic diagrams of each process in Embodiment 18 of the front-mount module packaging method for double-sided graphics chips of the present invention.

Fig. 53 is a structural schematic diagram of Embodiment 18 of the package structure of the double-sided graphic chip front-mount module of the present invention.

FIG. 54 is a top view of FIG. 53 .

55(A) to 55(R) are schematic diagrams of each process in Embodiment 19 of the front-mount module packaging method for double-sided graphic chips of the present invention.

Fig. 56 is a structural schematic diagram of Embodiment 19 of the packaging structure of the double-sided graphic chip front-mount module of the present invention.

FIG. 57 is a top view of FIG. 56 .

58(A) to 58(R) are schematic diagrams of each process in Embodiment 20 of the front-mount module packaging method for double-sided graphic chips of the present invention.

Fig. 59 is a structural schematic diagram of Embodiment 20 of the package structure of the double-sided graphic chip front-mount module of the present invention.

FIG. 60 is a top view of FIG. 59 .

61(A) to 61(R) are schematic diagrams of each process in Embodiment 21 of the front-mount module packaging method for double-sided graphic chips of the present invention.

Fig. 62 is a structural schematic diagram of Embodiment 21 of the package structure of the double-sided graphic chip front-mount module of the present invention.

FIG. 63 is a top view of FIG. 62 .

64(A) to 64(R) are schematic diagrams of each process in Embodiment 22 of the front-mount module packaging method for double-sided graphic chips of the present invention.

Fig. 65 is a structural schematic diagram of Embodiment 22 of the package structure of the double-sided graphic chip front-mount module of the present invention.

FIG. 66 is a top view of FIG. 65 .

67(A) to 67(R) are schematic diagrams of each process in Embodiment 23 of the front-mount module packaging method for double-sided graphic chips of the present invention.

Fig. 68 is a structural schematic diagram of Embodiment 23 of the package structure of the double-sided graphic chip front-mount module of the present invention.

FIG. 69 is a top view of FIG. 68 .

70(A) to 70(R) are schematic diagrams of each process in Embodiment 24 of the front-mount module packaging method for double-sided graphic chips of the present invention.

Fig. 71 is a structural schematic diagram of Embodiment 24 of the packaging structure of the double-sided graphic chip front-mount module of the present invention.

FIG. 72 is a top view of FIG. 71 .

73(A) to 73(R) are schematic diagrams of each process in Embodiment 25 of the packaging method for a double-sided graphic chip front-mount module of the present invention.

Fig. 74 is a structural schematic diagram of Embodiment 25 of the package structure of the double-sided graphic chip front-mount module of the present invention.

FIG. 75 is a top view of FIG. 74 .

76(A) to 76(R) are schematic diagrams of each process of the twenty-sixth embodiment of the front-mount module packaging method for double-sided graphics chips of the present invention.

Fig. 77 is a structural schematic diagram of Embodiment 26 of the packaging structure of the double-sided graphic chip front-mount module of the present invention.

FIG. 78 is a top view of FIG. 77 .

79(A) to 79(R) are schematic diagrams of each process in Embodiment 27 of the front-mount module packaging method for double-sided graphics chips of the present invention.

Fig. 80 is a structural schematic diagram of Embodiment 27 of the package structure of a double-sided graphic chip front-mount module of the present invention.

FIG. 81 is a top view of FIG. 80 .

82(A) to 82(R) are schematic diagrams of each process in Embodiment 28 of the front-mount module packaging method for double-sided graphics chips of the present invention.

Fig. 83 is a structural schematic diagram of Embodiment 28 of the package structure of the double-sided graphic chip front-mount module of the present invention.

FIG. 84 is a top view of FIG. 83 .

Fig. 85 is a working diagram of chemical etching and surface electroplating on the front side of a metal substrate in the past.

Fig. 86 is a diagram of a footfall formed in the past.

Fig. 87 is a schematic diagram of a conventional package structure.

Figure 88 is a top view of 87.

FIG. 89 is a schematic diagram of a second conventional package structure.

Figure 90 is a top view of 89.

Reference signs in the figure:

Base island 1, pins 2, molding compound without filler (epoxy resin) 3, first metal layer 4, second metal layer 5, conductive or non-conductive bonding substance 6, chip 7, metal wire 8, with filler Molding compound (epoxy resin) 9, pillar 10, metal substrate 11, photoresist film 12, photoresist film 13, photoresist film 14, photoresist film 15, ribs 16, photoresist film 17, Photoresist film 18; third base island 1.1, third base island 1.2, third base island 1.3, fourth base island 1.4.

(5) Specific implementation methods

The packaging structure and packaging method of the double-sided graphics chip front-loading module of the present invention are as follows:

Example 1: Single base island single turn pin

Referring to FIG. 2 and FIG. 3 , FIG. 2 is a structural schematic diagram of Embodiment 1 of the packaging structure of the double-sided graphic chip front-mount module of the present invention. FIG. 3 is a top view of FIG. 2 . As can be seen from Fig. 2 and Fig. 3, the double-sided graphics chip front-loading module packaging structure of the present invention includes a base island 1, pins 2, plastic encapsulant (epoxy resin) 3 without filler, conductive or non-conductive bonding substance 6. Chip 7, metal wire 8 and filler molding compound (epoxy resin) 9, the front side of the pin 2 extends to the side of the base island 1, and the front side of the base island 1 and the pin 2 is provided with a first metal layer 4, a second metal layer 5 is provided on the back of the base island 1 and pins 2, and a chip 7 is provided on the first metal layer 4 on the front of the base island 1 through a conductive or non-conductive adhesive substance 6, The front of the chip 7 is connected with the first metal layer 4 on the front of the pin 2 with a metal wire 8, and the top of the base island 1 and the pin 2, as well as the chip 7 and the metal wire 8 are encapsulated with a filler molding compound (epoxy resin ) 9, the area between the base island 1 and the pin 2 periphery, the area between the pin 2 and the base island 1, and the area between the pin 2 and the pin 2 are embedded with a filler-free molding compound (ring Oxygen resin) 3, the filler-free molding compound (epoxy resin) 3 connects the base island 1 and the periphery of the lower part of the pin, the lower part of the pin 2 and the lower part of the base island 1, and the lower part of the pin 2 and the lower part of the pin 2 into one , and make the size of the base island and the back of the pin smaller than the size of the base island and the front of the pin to form a base island and pin structure with a large top and a small bottom. A pillar 10 is arranged on the back of the pin 2, and the roots of the pillar 10 are buried Put it into the molding compound (epoxy resin) 3 without filler.

Its packaging method is as follows:

Step 1. Take the metal substrate

Referring to FIG. 1(A), take a metal substrate 11 with a suitable thickness. The material of the metal substrate can be changed according to the functions and characteristics of the chip, for example: copper, aluminum, iron, copper alloy or nickel-iron alloy.

Step 2. The front and back of the metal substrate are coated with photoresist film

Referring to FIG. 1(B), the front and back sides of the metal substrate are covered with photoresist films 12 and 13 that can be exposed and developed by coating equipment to protect the subsequent electroplating metal layer process. The photoresist film can be a dry photoresist thin film or a wet photoresist film.

Step 3: Expose/develop the photoresist film on the front of the metal substrate and open the window where the metal layer needs to be plated

Referring to FIG. 1(C), use exposure and development equipment to expose and develop the front of the metal substrate that has completed the photoresist film coating operation in step 2 to remove part of the photoresist film to expose the area on the front of the metal substrate that needs to be subsequently electroplated with a metal layer.

Step 4. Electroplating and coating the metal layer on the windowed area on the front of the metal substrate

Referring to FIG. 1(D), the first metal layer 4 is electroplated on the area where the window has been opened on the front side of the metal substrate in step 3, and the first metal layer 4 is placed on the front side of the base island 1 and the pin 2 .

Step 5. Remove the photoresist film on the front and back of the metal substrate

Referring to FIG. 1(E), remove the remaining photoresist film on the front side of the metal substrate and the photoresist film on the back side of the metal substrate.

Step 6. Cover the front and back of the metal substrate with photoresist film

Referring to FIG. 1(F), the front and back sides of the metal substrate are coated with photoresist films 14 and 15 that can be exposed and developed by coating equipment to protect the subsequent etching process. The photoresist film can be a dry photoresist thin film or a wet photoresist film.

Step 7. The photoresist film of the metal substrate is exposed/developed and opened in the area that needs to be etched on both sides

Referring to Figure 1(G), use the exposure and development equipment to expose and develop the front and back of the metal substrate that has completed the photoresist film coating operation in step 6 to remove part of the photoresist film to expose a part of the metal substrate for subsequent metal substrates Double-sided etching work.

Step 8. Metal substrate for double-sided etching

Referring to Fig. 1(H), after completing the exposure/development and window opening operation in step 7, the etching operation of each pattern is carried out on the front and back of the metal substrate, and the front and back of the base island 1 and pin 2 are etched, and at the same time Extend the front of the pins to the side of the base island as much as possible, and make the size of the back of the base island 1 and the pin 2 smaller than the front size of the base island 1 and the pin 2, forming a base island 1 and a lead with a large top and a small bottom. The pin 2 structure; and a column 10 is formed on the back of the pin 2, and a rib 16 is left between the base island 1 and the pin 2 and between the pin 2 and the pin 2.

Step 9. Remove the photoresist film on the front and back of the metal substrate

Referring to Figure 1 (I), the remaining photoresist films on the front and back of the metal substrate are all removed to form a lead frame.

Step ten, loading film

Referring to FIG. 1(J), the chip 7 is implanted on the first metal layer 4 on the front side of the base island 1 through a conductive or non-conductive adhesive substance 6 .

Step 11, hit the metal wire

Referring to FIG. 1(K), the semi-finished product that has completed the chip implantation operation is subjected to the metal wire 8 operation between the front side of the chip and the first metal layer on the front side of the pin.

Step 12. Encapsulate with filler molding compound (epoxy resin)

Referring to Figure 1(L), the front side of the semi-finished product that has been wired is encapsulated with filler molding compound (epoxy resin) 9, and the curing operation is performed after the molding compound is encapsulated, so that the base island and the upper part of the pin and Both the chip and the metal wire are encapsulated by a filler plastic compound (epoxy resin).

Step 13: Coating photoresist film

Referring to FIG. 1(M), the front and back of the semi-finished product that has been encapsulated with filler molding compound (epoxy resin) are coated with photoresist films 17 and 18 that can be exposed and developed by coating equipment to protect subsequent etching process work. The photoresist film can be a dry photoresist thin film or a wet photoresist film.

Step 14. Expose/develop and open windows on the back of the semi-finished product that has been encapsulated with filler molding compound (epoxy resin)

Referring to Fig. 1(N), use the exposure and development equipment to expose and develop the back of the semi-finished product that has completed the coating operation of the photoresist film in step 13 and has completed the operation of encapsulating the filler molding compound (epoxy resin) to remove part of the photoresist film. In order to expose the connecting ribs 16 left after the double-sided etching of the metal substrate in step 8 and the pillars 10 formed on the back of the pins 2, in preparation for subsequent etching operations on the root of the pillars and the connecting ribs.

Step fifteen, the second etching operation

Referring to Figure 1(O), after completing the exposure/development and window opening operations in step fourteen, the etching operation of each pattern is performed on the back of the semi-finished product that is encapsulated with filler molding compound (epoxy resin), and the step eight metal The ribs 16 left after the double-sided etching of the substrate are all etched away. During this process, the roots of the pillars 10 will also be etched away to a relative thickness at the same time, so that the roots of the pillars do not expose the back of the encapsulated package structure, avoiding A circuit break occurs.

Step 16. Remove the photoresist film on the front and back of the semi-finished product

Referring to FIG. 1(P), the remaining photoresist film on the back of the semi-finished product and the photoresist film on the front of the semi-finished product after the etching operation in step 15 are all removed.

Step seventeen, encapsulating the plastic compound (epoxy resin) without filler

Referring to Figure 1(Q), the back of the semi-finished product that has completed the film removal operation described in step 16 is encapsulated with a filler-free molding compound (epoxy resin), and the curing operation is performed after the molding compound is encapsulated, so that the base island 1 and the peripheral area of pin 2, the area between pin 2 and base island 1, and the area between pin 2 and pin 2 are all embedded with no filler molding compound (epoxy resin) 3, the filler-free The molding compound (epoxy resin) 3 connects the base island 1 and the periphery of the lower part of the pin, the lower part of the pin 2 and the lower part of the base island 1, and the lower part of the pin 2 and the lower part of the pin 2, and makes the 10 roots of the pillars buried Put it into the molding compound (epoxy resin) 3 without filler.

Special note: but also because there are many pillars 10 in the package, the structure in the package is stronger (like adding steel bars to concrete, which has both strength and toughness)

Step 18, the base island and the back of the pin are electroplated with a metal layer

Referring to Fig. 1 (R), the second metal layer 5 electroplating coating operation is carried out on the back side of the base island and pins that have completed the operation of encapsulating the no-filler molding compound in step 17, and the electroplating material can be tin, nickel gold , nickel palladium gold.... and other metal materials.

Step nineteen, cut the finished product

Referring to Figure 2 and Figure 3, the semi-finished product that has completed the electroplating and coating of the second metal layer in step 18 is cut, so that the chips that were originally connected together in the form of an array assembly are separated one by one to obtain a double-sided The finished product of the graphics chip front-mounted module package structure.

Embodiment 2: sunken base island exposed type single-turn pin

Referring to Figures 4-6, Figures 4(A)-4(R) are schematic diagrams of each process in Embodiment 2 of the packaging method for a double-sided graphic chip front-mount module of the present invention. FIG. 5 is a structural schematic diagram of Embodiment 2 of the package structure of the double-sided graphic chip front-mount module of the present invention. FIG. 6 is a top view of FIG. 5 . It can be seen from FIG. 4 , FIG. 5 and FIG. 6 that the only difference between Embodiment 2 and Embodiment 1 is that the base island 1 is a sunken base island, that is, the central area of the front of the base island 1 is sunken.

Embodiment 3: Embedded base island single-turn pin

Referring to FIGS. 7 to 9, FIGS. 7(A) to 7(R) are schematic diagrams of each process in Embodiment 3 of the packaging method for a double-sided graphic chip front-mount module of the present invention. FIG. 8 is a structural schematic diagram of Embodiment 3 of the packaging structure of the double-sided graphic chip front-mount module of the present invention. FIG. 9 is a top view of FIG. 8 . It can be seen from Fig. 7, Fig. 8 and Fig. 9 that the only difference between Embodiment 3 and Embodiment 1 is that the base island 1 is an embedded type base island, that is, the back of the base island 1 is embedded with the non-filler The molding compound (epoxy resin) 3 inside.

Embodiment 4: Multi-bump base island exposed single-turn pin

Referring to Figures 10-12, Figures 10(A)-10(R) are schematic diagrams of each process in Embodiment 4 of the front-mount module packaging method for double-sided graphic chips of the present invention. FIG. 11 is a structural schematic diagram of Embodiment 4 of the package structure of the double-sided graphic chip front-mount module of the present invention. FIG. 12 is a top view of FIG. 11 . It can be seen from Figure 10, Figure 11 and Figure 12 that the difference between Embodiment 4 and Embodiment 1 is that the base island 1 is a multi-bump base island, that is, the surface of the base island 1 is provided with multiple bumps .

Embodiment 5: Base island exposed multi-turn pin

Referring to Figures 13-15, Figures 13(A)-13(R) are schematic diagrams of each process in Embodiment 5 of the front-mount module packaging method for double-sided graphic chips of the present invention. FIG. 14 is a structural schematic diagram of Embodiment 5 of the packaging structure of the double-sided graphic chip front-mount module of the present invention. FIG. 15 is a top view of FIG. 14 . It can be seen from FIGS. 13-15 that the difference between Embodiment 5 and Embodiment 1 lies in that the pin 2 has multiple turns.

Embodiment 6: sunken base island exposed multi-turn pin

Referring to Figures 16-18, Figures 16(A)-16(R) are schematic diagrams of each process in Embodiment 6 of the front-mount module packaging method for double-sided graphic chips of the present invention. FIG. 17 is a structural schematic diagram of Embodiment 6 of the package structure of the double-sided graphic chip front-mount module of the present invention. FIG. 18 is a top view of FIG. 17 . It can be seen from FIGS. 16-18 that the difference between Embodiment 6 and Embodiment 2 lies in that the pin 2 has multiple turns.

Embodiment 7: Embedded base island multi-turn pin

Referring to Figures 19-21, Figures 19(A)-19(R) are schematic diagrams of each process in Embodiment 7 of the packaging method of a double-sided graphic chip front-mount module of the present invention. FIG. 20 is a structural schematic diagram of Embodiment 7 of the packaging structure of the double-sided graphic chip front-mount module of the present invention. FIG. 21 is a top view of FIG. 20 . It can be seen from FIGS. 19-21 that the difference between Embodiment 7 and Embodiment 3 lies in that the pin 2 has multiple turns.

Embodiment 8: multi-bump base island exposed multi-turn pin

Referring to Figures 22-24, Figures 22(A)-22(R) are schematic diagrams of each process in Embodiment 8 of the front-mount module packaging method for double-sided graphic chips of the present invention. Fig. 23 is a structural schematic diagram of Embodiment 8 of the package structure of the double-sided graphic chip front-mount module of the present invention. FIG. 24 is a top view of FIG. 23 . It can be seen from FIGS. 22 to 24 that the difference between Embodiment 8 and Embodiment 4 lies in that the pin 2 has multiple turns.

Embodiment 9: Multiple base island exposed single-turn pins

Referring to Figures 25-27, Figures 25(A)-25(R) are schematic diagrams of each process in Embodiment 9 of the front-mount module packaging method for double-sided graphic chips of the present invention. Fig. 26 is a structural schematic diagram of Embodiment 9 of the package structure of the double-sided graphic chip front-mount module of the present invention. FIG. 27 is a top view of FIG. 26 . It can be seen from FIGS. 25 to 27 that the difference between Embodiment 9 and Embodiment 1 lies in that: there are multiple base islands 1 , and the pin 2 has a single turn.

Embodiment 10: Multiple sunken base island exposed single-turn pins

Referring to Figures 28-30, Figures 28(A)-28(R) are schematic diagrams of each process in Embodiment 10 of the front-mount module packaging method for double-sided graphics chips of the present invention. Fig. 29 is a structural schematic diagram of Embodiment 10 of the packaging structure of the double-sided graphic chip front-mount module of the present invention. FIG. 30 is a top view of FIG. 29 . It can be seen from FIGS. 28 to 30 that the difference between Embodiment 10 and Embodiment 2 lies in that: there are multiple base islands 1 , and the pin 2 has a single turn.

Example 11: Multiple Buried Base Island Single Turn Pins

Referring to Figures 31-33, Figures 31(A)-31(R) are schematic diagrams of each process in Embodiment 11 of the packaging method of a double-sided graphic chip front-mount module of the present invention. FIG. 32 is a structural schematic diagram of Embodiment 11 of the package structure of the double-sided graphic chip front-mount module of the present invention. FIG. 33 is a top view of FIG. 32 . It can be seen from FIGS. 31 to 33 that the difference between Embodiment 11 and Embodiment 3 lies in that: there are multiple base islands 1 , and the pin 2 has a single turn.

Embodiment 12: Multiple multi-bump base island exposed single-turn pins

Referring to Figures 34 to 36, Figures 34(A) to 34(R) are schematic diagrams of each process in Embodiment 12 of the method for packaging a double-sided graphic chip front-mount module according to the present invention. Fig. 35 is a structural schematic diagram of Embodiment 12 of the packaging structure of the double-sided graphic chip front-mount module of the present invention. FIG. 36 is a top view of FIG. 35 . It can be seen from FIGS. 34 to 36 that the difference between Embodiment 12 and Embodiment 4 lies in that: there are multiple base islands 1 , and the pin 2 has a single turn.

Embodiment 13: Multiple base island exposed multi-turn pins

Referring to Figures 37 to 39, Figures 37(A) to 37(R) are schematic diagrams of each process in Embodiment 13 of the packaging method for a double-sided graphic chip front-mount module of the present invention. Fig. 38 is a structural schematic diagram of Embodiment 13 of the packaging structure of the double-sided graphic chip front-mount module of the present invention. FIG. 39 is a top view of FIG. 38 . It can be seen from FIGS. 37 to 39 that the difference between Embodiment 13 and Embodiment 1 is that there are multiple base islands 1 and pins 2 have multiple turns.

Embodiment 14: Exposed multi-turn pins with multiple sinking base islands

Referring to Figures 40-42, Figures 40(A)-40(R) are schematic diagrams of each process in Embodiment 14 of the packaging method for a double-sided graphic chip front-mount module of the present invention. Fig. 41 is a structural schematic diagram of Embodiment 14 of the packaging structure of the double-sided graphic chip front-mount module of the present invention. FIG. 42 is a top view of FIG. 41 . It can be seen from FIGS. 40 to 42 that the difference between Embodiment 14 and Embodiment 2 lies in that there are multiple base islands 1 and pins 2 have multiple turns.

Example 15: Multiple Buried Base Island Multiturn Pins

Referring to Figures 43-45, Figures 43(A)-43(R) are schematic diagrams of each process in Embodiment 15 of the packaging method for a double-sided graphic chip front-mount module of the present invention. Fig. 44 is a structural schematic diagram of Embodiment 15 of the package structure of the double-sided graphic chip front-mount module of the present invention. FIG. 45 is a top view of FIG. 44 . It can be seen from FIGS. 43 to 45 that the difference between Embodiment 15 and Embodiment 3 lies in that there are multiple base islands 1 and pins 2 have multiple turns.

Embodiment 16: Multiple multi-bump base island exposed multi-turn pins

Referring to Figures 46-48, Figures 46(A)-46(R) are schematic diagrams of each process in Embodiment 16 of the front-mount module packaging method for double-sided graphics chips of the present invention. Fig. 47 is a structural schematic diagram of Embodiment 16 of the package structure of the double-sided graphic chip front-mount module of the present invention. FIG. 48 is a top view of FIG. 47 . It can be seen from FIGS. 46 to 48 that the difference between Embodiment 16 and Embodiment 4 lies in that: there are multiple base islands 1 , and the pins 2 have multiple turns.

Embodiment 17: base island exposed type and sunken base island exposed type single-turn pin

Referring to Figures 49-51, Figures 49(A)-49(R) are schematic diagrams of each process in Embodiment 17 of the packaging method for a double-sided graphic chip front-mount module of the present invention. Fig. 50 is a structural schematic diagram of Embodiment 17 of the package structure of the double-sided graphic chip front-mount module of the present invention. FIG. 51 is a top view of FIG. 50 . It can be seen from Figures 49 to 51 that the difference between Embodiment 17 and Embodiment 1 is that: the base island 1 has two groups or multiple groups of base islands, one group is the first base island 1.1, and the other group is the first base island 1.1. For the second base island 1.2, the central area of the front of the second base island 1.2 sinks, and the first metal layer 4 is set on the front of the first base island 1.1 and the pin 2, and on the first base island 1.1, The second metal layer 5 is arranged on the back of the second base island 1.2 and the pin 2, and the chip 7 is arranged on the central sunken area of the front of the second base island 1.2 and the front of the first base island 1.1 through a conductive or non-conductive bonding substance 6, the chip 7. Both the front side and the first metal layer 4 on the front side of the pin 2 and between the chip 7 and the chip 7 are connected with a metal wire 8, in the peripheral area of the pin 2, between the pin 2 and the first base island 1.1 The area between the first base island 1.1 and the second base island 1.2, the area between the second base island 1.2 and pin 2, and the area between pin 2 and pin 2 are embedded with filler-free molding compound 3. The filler-free molding compound 3 connects the periphery of the lower part of the pin, the lower part of the pin 2 and the first base island 1.1, the lower part of the first base island 1.1 and the second base island 1.2, the second base island 1.2 and the lower part of the pin 2, and Pin 2 is integrally connected with the lower part of pin 2, said pin 2 has a single turn.

Embodiment 18: Multi-turn pins with exposed base island and sunken base island exposed type

Referring to Figures 52-54, Figures 52(A)-52(R) are schematic diagrams of each process in Embodiment 18 of the front-mount module packaging method for double-sided graphic chips of the present invention. Fig. 53 is a structural schematic diagram of Embodiment 18 of the package structure of the double-sided graphic chip front-mount module of the present invention. FIG. 54 is a top view of FIG. 53 . It can be seen from FIGS. 52-54 that the difference between Embodiment 18 and Embodiment 17 lies in that the pin 2 has multiple turns.

Embodiment 19: base island exposed type and embedded type base island single-turn pin

Referring to Figures 55-57, Figures 55(A)-55(R) are schematic diagrams of each process in Embodiment 19 of the packaging method for a double-sided graphic chip front-mount module of the present invention. Fig. 56 is a structural schematic diagram of Embodiment 19 of the packaging structure of the double-sided graphic chip front-mount module of the present invention. FIG. 57 is a top view of FIG. 56 . It can be seen from Figures 55 to 57 that the difference between Embodiment 19 and Embodiment 1 is that: the base island 1 has two or more groups of base islands, one group is the first base island 1.1, and the other group is the first base island 1.1. For the third base island 1.3, the first metal layer 4 is arranged on the front of the first base island 1.1, the third base island 1.3 and the pin 2, and the second metal layer 4 is arranged on the back of the first base island 1.1 and the pin 2. The metal layer 5, the front of the chip 7 and the first metal layer 4 on the front of the pin 2 and between the chip 7 and the chip 7 are all connected with a metal wire 8. In the area around the pin 2, the pin 2 and the first Area between base island 1.1, back of third base island 1.3, area between third base island 1.3 and first base island 1.1, area between third base island 1.3 and pin 2, and pin to pin Filler-free molding compound 3 is embedded in the area between, and the filler-free molding compound 3 connects the lower periphery of the pin, the pin 2 and the lower part of the first base island 1.1, the back of the third base island 1.3, and the back of the third base island 1.3 and The lower part of the first base island 1.1, the back of the third base island 1.3 and the lower part of the pin 2 and the lower part of the pin 2 are connected as a whole, and the pin 2 is provided with a single loop.

Embodiment 20: base island exposed type and embedded type base island multi-turn pin

Referring to Figures 58-60, Figures 58(A)-58(R) are schematic diagrams of each process in Embodiment 20 of the packaging method for a double-sided graphic chip front-mount module of the present invention. Fig. 59 is a structural schematic diagram of Embodiment 20 of the package structure of the double-sided graphic chip front-mount module of the present invention. FIG. 60 is a top view of FIG. 59 . It can be seen from Figures 58-60 that the difference between Embodiment 20 and Embodiment 19 lies in that the pin (2) has multiple turns.

Embodiment 21: Exposed base island type and multi-bump base island exposed type single-turn pin

Referring to Figures 61-63, Figures 61(A)-61(R) are schematic diagrams of each process in Embodiment 21 of the front-mount module packaging method for double-sided graphic chips of the present invention. Fig. 62 is a structural schematic diagram of Embodiment 21 of the package structure of the double-sided graphic chip front-mount module of the present invention. FIG. 63 is a top view of FIG. 62 . It can be seen from Figures 61 to 63 that the difference between Embodiment 21 and Embodiment 1 is that: the base island 1 has two or more groups of base islands, one group is the first base island 1.1, and the other group is the first base island 1.1. It is the fourth base island 1.4, the front side of the fourth base island 1.4 is arranged in a multi-bump structure, in the area around the pin 2, the area between the pin 2 and the first base island 1.1, the first base island 1.1 The area between the island 1.1 and the fourth base island 1.4, the area between the fourth base island 1.4 and the pin 2, and the area between the pin 2 and the pin 2 are embedded with filler-free molding compound 3, the filler-free The plastic encapsulant (epoxy resin) 3 connects the lower periphery of the pin, the lower part of the pin 2 and the first base island 1.1, the lower part of the first base island 1.1 and the fourth base island 1.4, the fourth base island 1.4 and the lower part of the pin 2, and The pin 2 is integrally connected with the lower part of the pin 2, and the pin 2 is provided with a single circle.

Embodiment 22: Base island exposed type and multi-bump base island exposed multi-turn pin

Referring to Figures 64-66, Figures 64(A)-64(R) are schematic diagrams of each process in Embodiment 22 of the front-mount module packaging method for double-sided graphics chips of the present invention. Fig. 65 is a structural schematic diagram of Embodiment 22 of the package structure of the double-sided graphic chip front-mount module of the present invention. FIG. 66 is a top view of FIG. 65 . It can be seen from FIGS. 64 to 66 that the difference between Embodiment 22 and Embodiment 21 lies in that the pin 2 has multiple turns.

Embodiment 23: sunken base island exposed type and buried base island exposed type single-turn pin

Referring to Figures 67-69, Figures 67(A)-67(R) are schematic diagrams of each process in Embodiment 23 of the front-mount module packaging method for double-sided graphics chips of the present invention. Fig. 68 is a structural schematic diagram of Embodiment 23 of the package structure of the double-sided graphic chip front-mount module of the present invention. FIG. 69 is a top view of FIG. 68 . It can be seen from Figures 67 to 69 that the difference between Embodiment 23 and Embodiment 1 is that: the base island 1 has two groups or multiple groups of base islands, one group is the second base island 1.2, and the other group is the second base island 1.2. For the third base island 1.3, the central area of the front of the second base island 1.2 is sunken, and the chip 7 is arranged on the central sunken area of the front of the second base island 1.2 and the front of the third base island 1.3 through a conductive or non-conductive bonding substance 6 , in the peripheral area of the pin 2, the area between the pin 2 and the second base island 1.2, the back side of the third base island 1.3, the area between the back side of the second base island 1.2 and the second base island 1.2, the area between the second base island 1.2, The area between the back of the three-base island 1.3 and the pin 2 and the area between the pins are embedded with no filler molding compound 3, and the filler-free molding compound 3 connects the lower periphery of the pin, the pin 2 and the second pin. The lower part of the base island 1.2, the third base island 1.3, the third base island 1.3 and the lower part of the second base island 1.2, the back of the third base island 1.3 and the lower part of the pin 2 and the lower part of the pin 2 and the pin 2 are connected into one body, said Pin 2 is provided with a circle.

Embodiment 24: sunken base island exposed type and buried base island exposed multi-turn pin

Referring to Figures 70-72, Figures 70(A)-70(R) are schematic diagrams of each process in Embodiment 24 of the front-mount module packaging method for double-sided graphics chips of the present invention. Fig. 71 is a structural schematic diagram of Embodiment 24 of the packaging structure of the double-sided graphic chip front-mount module of the present invention. FIG. 72 is a top view of FIG. 71 . It can be seen from FIGS. 70-72 that the difference between Embodiment 24 and Embodiment 23 lies in that the pin 2 has multiple turns.

Embodiment 25: Sunken base island exposed type and multi-bump base island exposed single-turn pin

Referring to Figures 73 to 75, Figures 73(A) to 73(R) are schematic diagrams of each process in Embodiment 25 of the packaging method for a double-sided graphic chip front-mount module of the present invention. Fig. 74 is a structural schematic diagram of Embodiment 25 of the package structure of the double-sided graphic chip front-mount module of the present invention. FIG. 75 is a top view of FIG. 74 . It can be seen from Figures 73 to 75 that the difference between Embodiment 25 and Embodiment 1 is that: the base island 1 has two groups or multiple groups of base islands, one group is the second base island 1.2, and the other group is the second base island 1.2. For the fourth base island 1.4, the central area of the front of the second base island 1.2 sinks, the front of the fourth base island 1.4 is arranged in a multi-convex structure, and the fourth base island 1.4 and the front of the pin 2 are provided with a A metal layer 4, a second metal layer 5 is provided on the back of the second base island 1.2, the fourth base island 1.4 and the pin 2, and the central sinking area and the fourth base island on the front of the second base island 1.2 1.4 The front side is provided with a chip 7 through a conductive or non-conductive adhesive substance 6, in the peripheral area of the pin 2, the area between the pin 2 and the second base island 1.2, the second base island 1.2 and the fourth base island 1.4 The area between, the area between the fourth base island 1.4 and the pin 2, and the area between the pin 2 and the pin 2 are embedded with a filler-free molding compound 3, and the filler-free molding compound (epoxy resin) 3 Connect the lower periphery of the pin, pin 2 and the lower part of the second base island 1.2, the second base island 1.2 and the lower part of the fourth base island 1.4, the fourth base island 1.4 and the lower part of the pin 2, and the lower part of the pin 2 and the pin 2 Connected as one, the pin 2 is provided with a circle.

Embodiment 26: sunken base island exposed type and multi-bump base island exposed multi-turn pin

Referring to Figures 76-78, Figures 76(A)-76(R) are schematic diagrams of each process in Embodiment 26 of the packaging method for a double-sided graphic chip front-mount module of the present invention. Fig. 77 is a structural schematic diagram of Embodiment 26 of the packaging structure of the double-sided graphic chip front-mount module of the present invention. FIG. 78 is a top view of FIG. 77 . It can be seen from FIGS. 76 to 78 that the difference between Embodiment 26 and Embodiment 25 lies in that the pin 2 has multiple turns.

Embodiment 27: Embedded base island and multi-bump base island exposed single-turn pin

Referring to Figures 79-81, Figures 79(A)-79(R) are schematic diagrams of each process in Embodiment 27 of the packaging method for a double-sided graphic chip front-mount module of the present invention. Fig. 80 is a structural schematic diagram of Embodiment 27 of the package structure of a double-sided graphic chip front-mount module of the present invention. FIG. 81 is a top view of FIG. 80 . It can be seen from Figures 79 to 81 that the difference between Embodiment 27 and Embodiment 1 is that: the base island 1 has two groups or multiple groups of base islands, one group is the third base island 1.3, and the other group is the third base island 1.3. It is the fourth base island 1.4, the front of the fourth base island 1.4 is arranged in a multi-bump structure, and the first metal layer 4 is arranged on the front of the third base island 1.3, the fourth base island 1.4 and the pin 2, The second metal layer 5 is arranged on the back of the fourth base island 1.4 and the pin 2, in the peripheral area of the pin 2, the area between the pin 2 and the fourth base island 1.4, the third base island 1.3 The backside, the area between the second base island 1.2 and the fourth base island 1.4, the area between the third base island 1.3 and the pin 2, and the area between the pins are embedded with no filler molding compound 3, so The filler-free molding compound 3 connects the lower periphery of the pin, the lower part of the pin 2 and the fourth base island 1.4, the back of the third base island 1.3, the back of the third base island 1.3 and the lower part of the fourth base island 1.4, and the back of the third base island 1.3 The lower part of the pin 2 and the lower part of the pin 2 are integrally connected, and the pin 2 is provided with a circle.

Embodiment 28: Embedded base island and multi-bump base island exposed multi-turn pin

Referring to Figures 82 to 84, Figures 82(A) to 82(R) are schematic diagrams of each process in Embodiment 28 of the packaging method for a double-sided graphic chip front-mount module of the present invention. Fig. 83 is a structural schematic diagram of Embodiment 28 of the package structure of the double-sided graphic chip front-mount module of the present invention. FIG. 84 is a top view of FIG. 83 . It can be seen from FIGS. 82 to 84 that the difference between Embodiment 28 and Embodiment 27 lies in that the pin 2 has multiple turns.

Claims (15)

1. two-sided graphic chips formal dress module package structure; Comprise Ji Dao (1), pin (2), packless plastic packaging material (3), conduction or non-conductive bonding material (6), chip (7), metal wire (8) and filler plastic packaging material (9) is arranged; Said pin (2) front extends to Ji Dao (1) next door; Front at said Ji Dao (1) and pin (2) is provided with the first metal layer (4); The back side at said Ji Dao (1) and pin (2) is provided with second metal level (5); Upward be provided with chip (7) at said Ji Dao (1) front the first metal layer (4) through conduction or non-conductive bonding material (6); Chip (7) positive with pin (2) front the first metal layer (4) between be connected with metal wire (8); Outside the top of said Ji Dao (1) and pin (2) and chip (7) and metal wire (8), be encapsulated with filler plastic packaging material (9), zone between peripheral zone, pin (2) and the Ji Dao (1) of said Ji Dao (1) and pin (2) and the zone between pin (2) and the pin (2) are equipped with packless plastic packaging material (3), and said packless plastic packaging material (3) links into an integrated entity Ji Dao (1) and periphery, pin bottom, pin (2) bottom and Ji Dao (1) bottom and pin (2) bottom and pin (2) bottom; And make said Ji Dao and pin back side size less than Ji Dao and the positive size of pin; Form up big and down small Ji Dao and pin configuration, it is characterized in that: be provided with pillar (10) at said pin (2) back side, pillar (10) root is imbedded in the said packless plastic packaging material (3).

2. the method for packing of a two-sided according to claim 1 graphic chips formal dress module package structure is characterized in that said method comprises following processing step:

Step 1, get metal substrate

Get the suitable metal substrate of a slice thickness,

Step 2, metal substrate front and back side lining photoresistance glued membrane

Utilization by coating equipment in the front of metal substrate and the back side be covered respectively and can carry out the photoresistance glued membrane of exposure imaging,

The positive photoresistance glued membrane of step 3, metal substrate needs the exposure of plated metal layer region/develop and windows

The metal substrate front that utilizes exposure imaging equipment that step 2 is accomplished photoresistance glued membrane lining operation is carried out exposure imaging and is removed part photoresistance glued membrane, carries out the zone of electroplated metal layer to expose the positive follow-up needs of metal substrate,

The zone of having windowed in step 4, metal substrate front is carried out metal level and is electroplated lining

The first metal layer plating lining is carried out in zone to having windowed in metal substrate front in the step 3, and this first metal layer places the front of said Ji Dao and pin,

Photoresistance glued membrane striping is carried out at step 5, metal substrate front and the back side

The positive remaining photoresistance glued membrane of metal substrate and the photoresistance glued membrane at the metal substrate back side are all removed,

Step 6, metal substrate front and back side lining photoresistance glued membrane

Utilization by coating equipment in the front of metal substrate and the back side be covered respectively and can carry out the photoresistance glued membrane of exposure imaging, protecting follow-up etch process operation,

The photoresistance glued membrane of step 7, metal substrate needs the exposure of two-sided etching area/develop and windows

Exposure imaging removal part photoresistance glued membrane is carried out at the metal substrate front and the back side that utilize exposure imaging equipment that step 6 is accomplished photoresistance glued membrane lining operation, prepares against the two-sided etching operation of metal substrate that follow-up needs carry out to expose the localized metallic substrate,

Step 8, metal substrate carry out two-sided etching operation

After the exposure/development and windowing task of completing steps seven; The etching operation of promptly carrying out each figure at the front and the back side of metal substrate; Etch the front and back of Ji Dao and pin; Simultaneously the pin front is extended to next door, basic island as much as possible, and make the positive size of the back side size of said Ji Dao and pin, form up big and down small Ji Dao and pin configuration less than Ji Dao and pin; And form pillar at the pin back side, and at the company's of leaving muscle between Ji Dao and the pin and between pin and the pin,

Photoresistance glued membrane striping is carried out at step 9, metal substrate front and the back side

The photoresistance glued membrane that the metal substrate front and back is remaining all removes, and processes lead frame,

Step 10, load

On front, the basic island the first metal layer of the lead frame that step 9 is processed, carry out the implantation of chip through conduction or non-conductive bonding material,

Step 11, break metal wire

The semi-finished product of accomplishing chip implantation operation are carried out playing the metal wire operation between chip front side and the pin front the first metal layer,

Step 12, be encapsulated with the filler plastic packaging material

The semi-finished product front that routing is accomplished is encapsulated with the operation of filler plastic packaging material, and carries out the curing operation after plastic packaging material is sealed, and makes top and the chip of Ji Dao and pin and metal wire all had the filler plastic packaging material to seal outward,

Step 13, lining photoresistance glued membrane

Utilization by coating equipment will accomplish the half-finished front that is encapsulated with the operation of filler plastic packaging material and the back side be covered respectively the photoresistance glued membrane that can carry out exposure imaging with, protecting follow-up etch process operation,

Step 14, accomplish the exposure that the half-finished back side that is encapsulated with the operation of filler plastic packaging material needs etching area/develop and windowing

Exposure imaging removal part photoresistance glued membrane is carried out at the semi-finished product back side that is encapsulated with the operation of filler plastic packaging material of accomplishing that utilizes exposure imaging equipment that step 13 is accomplished photoresistance glued membrane lining operation; To expose company's muscle that leaves after the two-sided etching operation of step 8 metal substrate and the pillar that forms at the pin back side; Carry out the pillar root and connect muscle etching operation in order to follow-up needs

Step 15, the operation of etching for the second time

After the exposure/development and windowing task of completing steps 14; Promptly carry out the etching operation of each figure at the semi-finished product back side that completion is encapsulated with the operation of filler plastic packaging material; The company's muscle that leaves after the two-sided etching operation of step 8 metal substrate is all etched away; Root at pillar described in this process also can etch away relative thickness simultaneously, makes the pillar root not expose the encapsulating structure back side after sealing

Photoresistance glued membrane striping is carried out at step 10 six, semi-finished product front and the back side

Photoresistance glued membrane that the semi-finished product back side of completing steps 15 etching operations is remaining and the positive photoresistance glued membrane of semi-finished product all remove,

Step 10 seven, seal packless plastic packaging material

Packless plastic packaging material operation is sealed at the semi-finished product back side of completing steps 16 said striping operations; And carry out the curing operation after plastic packaging material is sealed; Make the peripheral zone of Ji Dao and pin; Packless plastic packaging material is all set in zone between pin and the basic island and the zone between pin and the pin; This packless plastic packaging material is peripheral with Ji Dao and pin bottom; Pin bottom and Ji Dao bottom and pin bottom and pin bottom link into an integrated entity; And said pillar root is imbedded in this packless plastic packaging material

The back side of step 10 eight, Ji Dao and pin is carried out metal level and is electroplated lining

The back side that completing steps 17 is sealed said Ji Dao and the pin of the operation of no filler plastic packaging material is carried out second metal level and is electroplated the lining operation,

Step 10 nine, cutting finished product

The semi-finished product of ten eight the second metal levels of completing steps being electroplated lining carry out cutting operation, make originally more than of chips that connect together with array formula aggregate mode independent, make two-sided graphic chips formal dress module package structure finished product.

3. the method for packing of a kind of two-sided graphic chips formal dress module package structure according to claim 2 is characterized in that Ji Dao (1) back side exposes said packless plastic packaging material (3).

4. the method for packing of a kind of two-sided graphic chips formal dress module package structure according to claim 2 is characterized in that Ji Dao (1) front middle section sinks.

5. the method for packing of a kind of two-sided graphic chips formal dress module package structure according to claim 2 is characterized in that Ji Dao (1) back side imbeds in the said packless plastic packaging material (3).

6. the method for packing of a kind of two-sided graphic chips formal dress module package structure according to claim 2 is characterized in that said Ji Dao (1) front is arranged to multi-convex point shape structure.

7. according to the method for packing of one of them described a kind of two-sided graphic chips formal dress module package structure of claim 2～6, it is single to it is characterized in that said Ji Dao (1) has, and pin (2) has many circles.

8. according to the method for packing of one of them described a kind of two-sided graphic chips formal dress module package structure of claim 2～6, it is a plurality of to it is characterized in that said Ji Dao (1) has, and pin (2) has individual pen.

9. according to the method for packing of one of them described a kind of two-sided graphic chips formal dress module package structure of claim 2～6, it is a plurality of to it is characterized in that said Ji Dao (1) has, and pin (2) has many circles.

10. the method for packing of a kind of two-sided graphic chips formal dress module package structure according to claim 2; It is characterized in that said Ji Dao (1) has two groups; One group is first Ji Dao (1.1); Another group is second Ji Dao (1.2); Said second Ji Dao (1.2) front middle section sinks; Front at said first Ji Dao (1.1) and pin (2) is provided with the first metal layer (4); The back side at said first Ji Dao (1.1), second Ji Dao (1.2) and pin (2) is provided with second metal level (5); Be provided with chip (7) in positive central sunken regions of second Ji Dao (1.2) and first Ji Dao (1.1) front through conduction or non-conductive bonding material (6); Chip (7) positive with pin (2) front the first metal layer (4) between and all use metal wire (8) to be connected between chip (7) and the chip (7); Nos filler plastic packaging material (3) is set in zone between zone, second Ji Dao (1.2) and pin (2) between zone, first Ji Dao (1.1) and second Ji Dao (1.2) between peripheral zone, pin (2) and first Ji Dao (1.1) of said pin (2) and the zone between pin (2) and the pin (2), and said no filler plastic packaging material (3) is peripheral with the pin bottom, pin (2) and first Ji Dao (1.1) bottom, first Ji Dao (1.1) and second Ji Dao (1.2) bottom, second Ji Dao (1.2) and pin (2) bottom and pin (2) and pin (2) bottom link into an integrated entity, and said pin (2) is provided with individual pen or encloses more.

11. the method for packing of a kind of two-sided graphic chips formal dress module package structure according to claim 2; It is characterized in that said Ji Dao (1) has two groups; One group is first Ji Dao (1.1); Another group is the 3rd Ji Dao (1.3); Front at said first Ji Dao (1.1) the 3rd Ji Dao (1.3) and pin (2) is provided with the first metal layer (4); The back side at said first Ji Dao (1.1) and pin (2) is provided with second metal level (5); Be provided with chip (7) in Ji Dao (1) front through conduction or non-conductive bonding material (6); Chip (7) positive with pin (2) front the first metal layer (4) between and all use metal wire (8) to be connected between chip (7) and the chip (7); Outside the top of said Ji Dao (1) and pin (2) and chip (7) and metal wire (8), be encapsulated with filler plastic packaging material (9); No filler plastic packaging material (3) is set in zone and the zone between pin and the pin between zone, the 3rd Ji Dao (1.3) and pin (2) between zone, the 3rd Ji Dao (1.3) back side, second Ji Dao (1.2) and first Ji Dao (1.1) between zone, pin (2) and first Ji Dao (1.1) of said pin (2) periphery, and said no filler plastic packaging material (3) is peripheral with the pin bottom, pin (2) links into an integrated entity with pin (2) bottom with first Ji Dao (1.1) bottom, the 3rd Ji Dao (1.3) back side, the 3rd Ji Dao (1.3) back side and first Ji Dao (1.1) bottom, the 3rd Ji Dao (1.3) back side and pin (2) bottom and pin (2), and said pin (2) is provided with individual pen or enclose more.

12. the method for packing of a kind of two-sided graphic chips formal dress module package structure according to claim 2; It is characterized in that said Ji Dao (1) has two groups; One group is first Ji Dao (1.1); Another group is the 4th Ji Dao (1.4); Said the 4th Ji Dao (1.4) is arranged to multi-convex point shape structure in the front; No filler plastic packaging material (3) is set in zone between zone, the 4th Ji Dao (1.4) and pin (2) between zone, first Ji Dao (1.1) and the 4th Ji Dao (1.4) between zone, pin (2) and first Ji Dao (1.1) of said pin (2) periphery and the zone between pin (2) and the pin (2); Said packless plastic packaging material (3) is peripheral with the pin bottom, pin (2) links into an integrated entity with pin (2) bottom with pin (2) bottom and pin (2) with the 4th Ji Dao (1.4) bottom, the 4th Ji Dao (1.4) with first Ji Dao (1.1) bottom, first Ji Dao (1.1), and said pin (2) is provided with individual pen or many circles.

13. the method for packing of a kind of two-sided graphic chips formal dress module package structure according to claim 2; It is characterized in that said Ji Dao (1) has two groups or organize Ji Dao more; One group is second Ji Dao (1.2); Another group is the 3rd Ji Dao (1.3); Said second Ji Dao (1.2) front middle section sinks; Be provided with chip (7) in positive central sunken regions of second Ji Dao (1.2) and the 3rd Ji Dao (1.3) front through conduction or non-conductive bonding material (6); No filler plastic packaging material (3) is set in zone and the zone between pin and the pin between zone, the 3rd Ji Dao (1.3) back side and pin (2) between zone, the 3rd Ji Dao (1.3) back side, the second Ji Dao back side (1.2) and second Ji Dao (1.2) between zone, pin (2) and second Ji Dao (1.2) of said pin (2) periphery; Said no filler plastic packaging material (3) is peripheral with the pin bottom, pin (2) links into an integrated entity with pin (2) bottom with second Ji Dao (1.2) bottom, the 3rd Ji Dao (1.3) back side and pin (2) bottom and pin (2) with second Ji Dao (1.2) bottom, the 3rd Ji Dao (1.3), the 3rd Ji Dao (1.3), and said pin (2) is provided with individual pen.

14. the method for packing of a kind of two-sided graphic chips formal dress module package structure according to claim 2; It is characterized in that said Ji Dao (1) has two groups; One group is second Ji Dao (1.2); Another group is the 4th Ji Dao (1.4); Said second Ji Dao (1.2) front middle section sinks; The 4th Ji Dao (1.4) is arranged to multi-convex point shape structure in the front; Front at said the 4th Ji Dao (1.4) and pin (2) is provided with the first metal layer (4); The back side at said second Ji Dao (1.2), the 4th Ji Dao (1.4) and pin (2) is provided with second metal level (5), is provided with chip (7) in positive central sunken regions of said second Ji Dao (1.2) and the 4th Ji Dao (1.4) front through conduction or non-conductive bonding material (6), and no filler plastic packaging material (3) is set in zone between zone, the 4th Ji Dao (1.4) and pin (2) between zone, second Ji Dao (1.2) and the 4th Ji Dao (1.4) between zone, pin (2) and second Ji Dao (1.2) of said pin (2) periphery and the zone between pin (2) and the pin (2); Said packless plastic packaging material (3) is peripheral with the pin bottom, pin (2) links into an integrated entity with pin (2) bottom with pin (2) bottom and pin (2) with the 4th Ji Dao (1.4) bottom, the 4th Ji Dao (1.4) with second Ji Dao (1.2) bottom, second Ji Dao (1.2), and said pin (2) is provided with individual pen or many circles.

15. the method for packing of a kind of two-sided graphic chips formal dress module package structure according to claim 2; It is characterized in that said Ji Dao (1) has two groups; One group is the 3rd Ji Dao (1.3); Another group is the 4th Ji Dao (1.4); Said the 4th Ji Dao (1.4) is arranged to multi-convex point shape structure in the front; Front at said the 3rd Ji Dao (1.3), the 4th Ji Dao (1.4) and pin (2) is provided with the first metal layer (4); The back side at said the 4th Ji Dao (1.4) and pin (2) is provided with second metal level (5); No filler plastic packaging material (3) is set in zone and the zone between pin and the pin between zone, the 3rd Ji Dao (1.3) and pin (2) between zone, the 3rd Ji Dao (1.3) back side, second Ji Dao (1.2) and the 4th Ji Dao (1.4) between zone, pin (2) and the 4th Ji Dao (1.4) of said pin (2) periphery; Said no filler plastic packaging material (3) is peripheral with the pin bottom, pin (2) links into an integrated entity with pin (2) bottom with the 4th Ji Dao (1.4) bottom, the 3rd Ji Dao (1.3) back side, the 3rd Ji Dao (1.3) back side and the 4th Ji Dao (1.4) bottom, the 3rd Ji Dao (1.3) back side and pin (2) bottom and pin (2), and said pin (2) is provided with individual pen or many circles.

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