CN201936874U - Double-sided graphics chip positive single packaging structure - Google Patents

Abstract

The utility model relates to a double-sided graphic chip front-loading single-chip packaging structure, the structure includes a base island (1), pins (2), plastic sealing compound (epoxy resin) (3) without filler, conductive or non-conductive Adhesive substance (6), chip (7), metal wire (8) and filler molding compound (epoxy resin) (9), the front side of the pin (2) extends to the side of the base island (1), the Filler-free molding compound (3) connects base island (1) and pin (2) lower periphery, pin (2) lower part and base island (1) lower part and pin (2) lower part and pin (2) lower part Connect into one, and make the size of the base island and the back of the pin smaller than the size of the base island and the front of the pin to form a structure of the base island and the pin with a large upper part and a smaller bottom. The unit is covered, and a column (10) is arranged on the back of the pin (2), and the root of the column (10) is embedded in the plastic sealing compound (3) without filler. The utility model can withstand ultra-high temperature during chip loading, and the lead frame will not be distorted due to different physical properties of different substances, and the problem of missing feet and shortening the length of metal wires will no longer occur.

Description

Double-sided graphics chip front-mount single-chip package structure

(1) Technical field

The utility model relates to a front-mounted single-chip package structure of a double-sided graphics chip. It belongs to the technical field of semiconductor packaging.

(2) Background technology

The traditional manufacturing method of the chip package structure is: after chemical etching and surface electroplating are performed on the front side of the metal substrate, the production of the lead frame is completed (as shown in FIG. 43 ). The backside of the leadframe is etched during the packaging process. This law has the following shortcomings:

Because only half-etching work is done on the front of the metal substrate before plastic sealing, and the plastic sealing material is only half a foot high to cover the pins during the plastic sealing process, so the binding ability between the plastic package and the pins becomes smaller. If the plastic package is considerate When the chip is not well attached to the PCB board, rework and re-attachment will easily cause the problem of foot drop (as shown in Figure 44). Especially when the type of molding compound is filled, because the relationship between the environment of the material in the production process and the stress change of the subsequent surface mount will cause vertical cracks between the metal and the molding compound, the characteristic is that the higher the filler ratio, the harder it is The more brittle the easier it is to crack.

In addition, due to the long distance between the chip and the pins, the length of the metal wire is relatively long, as shown in Figures 45-46, the cost of the metal wire is relatively high (especially the expensive pure gold metal wire); The length of the wire is longer, which makes the signal output speed of the chip slower (especially for storage products and calculations that require a large amount of data); The interference of parasitic resistance/capacitance and parasitic poles on the signal is also high; and because the distance between the chip and the pins is long, the volume and area of the package are large, the cost of materials is high, and there is more waste.

For this reason, the applicant previously applied for an invention patent titled "Based Island Lead Frame Structure and Its Production Method", and its application number is: 201010165476.0. Its main technical features are: use the back of the metal substrate to half-etch first, form a recessed half-etched area on the back of the metal substrate, and at the same time form the base island and the back of the pin relatively, and then fill and coat the half-etched area. Filler-free soft sealant, and bake at the same time, so that the filler-free soft sealant cures into a filler-free molding compound (epoxy resin) to wrap the backside of the pin. Then half etch is performed on the front side of the metal substrate, and at the same time, the base island and the front side of the pin are relatively formed. Its beneficial effects mainly include:

1) Since the area between the pins and the pins on the back of the metal substrate is embedded with a soft sealant without filler, the soft sealant without filler is different from the conventional sealant on the front side of the metal substrate in the plastic sealing process. There is a filler plastic compound (epoxy resin) that covers the entire height of the pins together, so the binding capacity between the plastic package and the pins becomes larger, and there will be no problem of falling feet, as shown in Figure 47.

2) Due to the method of separate etching operations on the front and back of the lead frame, a structure in which the size of the back pins is slightly smaller and the size of the front pins is slightly larger can be formed during the etching operation, while the upper and lower sizes of the same pin are different It is tighter and less likely to slip and fall when it is wrapped by a filler-free molding compound (epoxy resin).

3) Due to the application of the technology of separate etching on the back and front of the lead frame, the pins on the front of the lead frame can be extended to the side of the base island as much as possible, which greatly shortens the distance between the chip and the pins, as shown in Figures 47-48. The cost of such metal wires can also be greatly reduced (especially expensive pure gold metal wires).

4) Also because of the shortening of the metal wire, the signal output speed of the chip is also greatly increased (especially for storage products and calculations that require a large amount of data), and because the length of the metal wire is shortened, the metal wire The interference of the existing parasitic resistance/capacitance and parasitic poles to the signal is also greatly reduced.

5) Due to the use of pin extension technology, the distance between high pin count and high density pins can be easily produced, so that the volume and area of the package can be greatly reduced.

6) Because the volume after packaging is greatly reduced, it more directly reflects the substantial reduction of material costs and the reduction of material consumption also greatly reduces the environmental problems of waste and environmental protection.

However, there are still following deficiencies: before encapsulation, the wrapping pin operation of the backside of the lead frame without filler molding compound is carried out, and when the high-temperature chip loading and wiring operations on the front of the lead frame are carried out, the lead frame and the filler-free plastic sealant The physical properties of the two materials are different, the coefficients of expansion of the two materials are also different, and the thermal deformation at high temperature is different, which leads to distortion of the lead frame during subsequent chip mounting. Therefore, this kind of packaging structure cannot withstand ultra-high temperature (above 200° C.) during chip loading. In the past, the requirement of high temperature resistance was achieved by making the volume of the package body large, but now the volume of the package body is required to be smaller and the power is larger and larger, and it cannot withstand ultra-high temperature.

(3) Contents of the invention

The purpose of this utility model is to overcome the above-mentioned shortcomings, and to provide a lead frame that can withstand ultra-high temperature during chip loading and will not cause distortion of the lead frame due to different physical properties of different substances, and will not cause the problem of falling feet and can make the metal Double-sided graphics chips with shortened line length are mounted in single-chip package structure.

The purpose of this utility model is achieved like this: a kind of double-sided figure chip is adorned single encapsulation structure, comprises base island, pin, plastic encapsulant (epoxy resin) without filler, conductive or non-conductive bonding substance, chip, Metal wire and filler molding compound (epoxy resin), the front of the pin extends to the side of the base island, a first metal layer is arranged on the front of the base island and the pin, and the front of the base island and the pin The back side is provided with a second metal layer, and a chip is provided on the first metal layer on the front side of the base island through a conductive or non-conductive adhesive substance. The front side of the chip is connected with the first metal layer on the front side of the pin with a metal wire. The upper part of the base island and the pins, as well as the chip and the metal wires are encapsulated with filler molding compound (epoxy resin), the area around the base island and the pins, the area between the pins and the base island, and the pins and the pins. The area between the pins is embedded with an unfilled molding compound (epoxy) that connects the base island to the lower periphery of the pin, the lower portion of the pin to the lower portion of the base island, and the lead The lower part of the foot is integrated with the lower part of the pin, and the size of the base island and the back of the pin is smaller than the size of the base island and the front of the pin, forming a base island and pin structure with a large top and a small bottom, which is characterized by: the Filler molding compound (epoxy resin) covers the partial unit on the front of the pin, and a pillar is arranged on the back of the pin, and the root of the pillar is buried in the molding compound (epoxy resin) without filler.

The beneficial effects of the utility model are:

1. The lead frame is ultra-high temperature resistant (above 200°C)

Due to the use of double-sided graphic etching lead frame technology, the front and back double-sided etching of the lead frame is completed at one time. At the same time, when packaging, the high-temperature chip mounting and wiring on the front of the lead frame is performed first, and then the pin wrapping operation on the back of the lead frame is performed. There is only one material of the lead frame for chip loading and wiring. In the process of using ultra-high temperature, there is no impact caused by different expansion coefficients of various materials, which ensures the ultra-high temperature resistance (generally below 200°C) performance of the lead frame. .

2. It can ensure the strength of the lead frame

Because the pre-encapsulation is not done first, the pressure on the lead frame is high when the chip is loaded, and the lead frame will vibrate when the wire is bonded, and the lead frame will sag. The utility model adopts the design of pillars on the back of the lead frame to increase the strength of the lead frame when wiring.

3. Make sure that there will be no more problems with feet falling

Due to the use of double-sided etching technology, it is easy to plan, design and manufacture pin structures with upper and lower pins, and the upper and lower plastic molding compounds can tightly wrap the upper and lower pin structures together, so The binding ability between the plastic package and the pins becomes larger, and there will be no more problems of falling feet.

4. Make sure the length of the metal wire is shortened

1) Due to the application of the technology of simultaneous and separate etching on the back and front of the lead frame, the pins on the front of the lead frame can be extended as far as possible to the side of the area where the chip needs to be installed later, which greatly shortens the distance between the chip and the pin, such as As shown in Fig. 47 to Fig. 48, the length of the metal wire is also shortened, and the cost of the metal wire can also be greatly reduced (especially the expensive pure gold metal wire);

2) Also because the length of the metal wire is shortened, the signal output speed of the chip is also greatly increased (especially for storage products and calculations that require a large amount of data). The interference of the existing parasitic resistance/capacitance and parasitic poles to the signal is also greatly reduced.

5. The volume and area of the package can be greatly reduced

Due to the use of pin extension technology, it is easy to produce a high number of pins and a high-density pin-to-pin distance, so that the volume and area of the package can be greatly reduced.

6. Reduced material cost and material consumption

Because the volume after packaging is greatly reduced, it more directly reflects the substantial reduction in material costs and the reduction in the amount of materials used also greatly reduces the problem of waste and environmental protection.

7. The advantages of using a single package of local units are:

1) In different applications, the pins on the edge of the plastic package can be extended out of the plastic package.

2) The pins on the edge of the plastic package extend out of the plastic package to clearly check the soldering on the PCB.

3) The large area of the modular type will easily cause the deformation of the different shrinkage rates due to a variety of different material structures, and the single package of the local unit can completely disperse the different shrinkage rates of the different material structures. vertical deformation.

4) When a single package is cut and separated from the plastic package, because the thickness to be cut is only the thickness of the pin, the cutting speed can be much faster than that of the modular package structure, and the cutting blade is easy to cut because of the cutting thickness. It is thinner, so the life of the cutting blade is relatively longer.

(4) Description of drawings

1(A) to 1(R) are schematic diagrams of each process in Embodiment 1 of the double-sided graphics chip front-mounting single-chip packaging method of the present invention.

Fig. 2 is a structural schematic diagram of Embodiment 1 of the double-sided graphic chip front-mounted single-chip package structure of the present invention.

FIG. 3 is a top view of FIG. 2 .

4(A) to 4(R) are schematic diagrams of each process in Embodiment 2 of the double-sided graphics chip front-mounting single-chip packaging method of the present invention.

Fig. 5 is a structural schematic diagram of Embodiment 2 of the double-sided graphics chip front-mounted single-chip package structure of the present invention.

FIG. 6 is a top view of FIG. 5 .

7(A) to 7(R) are schematic diagrams of each process in Embodiment 3 of the double-sided graphics chip front-mounting single-chip packaging method of the present invention.

Fig. 8 is a structural schematic diagram of Embodiment 3 of the double-sided graphic chip front-mounted single-chip package structure of the present invention.

FIG. 9 is a top view of FIG. 8 .

10(A) to 10(R) are schematic diagrams of each process in Embodiment 4 of the double-sided graphics chip front-mounting single-chip packaging method of the present invention.

FIG. 11 is a structural schematic diagram of Embodiment 4 of the front-mounted single-chip package structure of the double-sided graphics chip of the present invention.

FIG. 12 is a top view of FIG. 11 .

13(A) to 13(R) are schematic diagrams of each process in Embodiment 5 of the front-mounting single-chip packaging method for double-sided graphics chips of the present invention.

Fig. 14 is a structural schematic diagram of Embodiment 5 of the front-mounted single-chip package structure of the double-sided graphics chip of the present invention.

FIG. 15 is a top view of FIG. 14 .

16(A) to 16(R) are schematic diagrams of each process in Embodiment 6 of the double-sided graphics chip front-mounting single-chip packaging method of the present invention.

Fig. 17 is a structural schematic diagram of Embodiment 6 of the front-mounted single-chip package structure of the double-sided graphics chip of the present invention.

FIG. 18 is a top view of FIG. 17 .

19(A) to 19(R) are schematic diagrams of each process in Embodiment 7 of the double-sided graphics chip front-mounting single-chip packaging method of the present invention.

Fig. 20 is a structural schematic diagram of Embodiment 7 of the front-mounted single-chip package structure of the double-sided graphics chip of the present invention.

FIG. 21 is a top view of FIG. 20 .

22(A) to 22(R) are schematic diagrams of each process in Embodiment 8 of the double-sided graphics chip front-mounting single-chip packaging method of the present invention.

Fig. 23 is a structural schematic diagram of Embodiment 8 of the double-sided graphics chip front-mounted single-chip package structure of the present invention.

FIG. 24 is a top view of FIG. 23 .

25(A) to 25(R) are schematic diagrams of each process in Embodiment 9 of the double-sided graphics chip front-mounting single-chip packaging method of the present invention.

Fig. 26 is a structural schematic diagram of Embodiment 9 of the double-sided graphics chip front-mounted single-chip package structure of the present invention.

FIG. 27 is a top view of FIG. 26 .

28(A) to 28(R) are schematic diagrams of each process in Embodiment 10 of the double-sided graphics chip front-mounting single-chip packaging method of the present invention.

FIG. 29 is a structural schematic diagram of Embodiment 10 of the double-sided graphics chip front-mounted single-chip package structure of the present invention.

FIG. 30 is a top view of FIG. 29 .

31(A) to 31(R) are schematic diagrams of each process in Embodiment 11 of the double-sided graphics chip front-mounting single-chip packaging method of the present invention.

Fig. 32 is a structural schematic diagram of Embodiment 11 of the front-mounted single-chip package structure of the double-sided graphics chip of the present invention.

FIG. 33 is a top view of FIG. 32 .

34(A) to 34(R) are schematic diagrams of each process in Embodiment 12 of the double-sided graphics chip front-mounting single-chip packaging method of the present invention.

Fig. 35 is a structural schematic diagram of Embodiment 12 of the double-sided graphics chip front-mounted single-chip package structure of the present invention.

FIG. 36 is a top view of FIG. 35 .

37(A) to 37(R) are schematic diagrams of each process in Embodiment 13 of the double-sided graphics chip front-mounting single-chip packaging method of the present invention.

Fig. 38 is a structural schematic diagram of Embodiment 13 of the double-sided graphics chip front-mounted single-chip package structure of the present invention.

FIG. 39 is a top view of FIG. 38 .

40(A) to 40(R) are schematic diagrams of each process in Embodiment 14 of the double-sided graphics chip front-mounting single-chip packaging method of the present invention.

Fig. 41 is a structural schematic diagram of Embodiment 14 of the double-sided graphics chip front-mounted single-chip package structure of the present invention.

FIG. 42 is a top view of FIG. 41 .

Fig. 43 is a working diagram of chemical etching and surface electroplating on the front side of a metal substrate in the past.

Fig. 44 is a diagram of a footfall formed in the past.

FIG. 45 is a schematic diagram of a conventional package structure.

FIG. 46 is a top view of 45 .

FIG. 47 is a schematic diagram of a second conventional package structure.

Figure 48 is a top view of 47.

Reference signs in the figure:

Base island 1, pins 2, molding compound without filler (epoxy resin) 3, first metal layer 4, second metal layer 5, conductive or non-conductive bonding substance 6, chip 7, metal wire 8, with filler Molding compound (epoxy resin) 9, pillar 10, metal substrate 11, photoresist film 12, photoresist film 13, photoresist film 14, photoresist film 15, ribs 16, photoresist film 17, Photoresist film 18; third base island 1.1, third base island 1.2, third base island 1.3, fourth base island 1.4.

(5) Specific implementation methods

The double-sided graphics chip of the utility model is installed with a single package structure as follows:

Example 1: Single base island single turn pin

Referring to Fig. 2 and Fig. 3, Fig. 2 is a structural schematic diagram of Embodiment 1 of the double-sided graphics chip front-mounted single-chip package structure of the present invention. FIG. 3 is a top view of FIG. 2 . As can be seen from Fig. 2 and Fig. 3, the double-sided graphic chip of the present invention is mounted on a single package structure, including base island 1, pin 2, plastic encapsulant (epoxy resin) 3 without filler, conductive or non-conductive bonding Substance 6, chip 7, metal wire 8 and filler molding compound (epoxy resin) 9, the front side of the pin 2 extends to the side of the base island 1, and the front side of the base island 1 and the pin 2 is provided with a first The metal layer 4 is provided with a second metal layer 5 on the back of the base island 1 and pins 2, and a chip 7 is provided on the first metal layer 4 on the front of the base island 1 through a conductive or non-conductive adhesive substance 6 , the front of the chip 7 is connected with the first metal layer 4 on the front of the pin 2 with a metal wire 8, and the top of the base island 1 and the pin 2 and the chip 7 and the metal wire 8 are externally encapsulated with a filler molding compound (epoxy Resin) 9, the filler molding compound (epoxy resin) 9 covers the local unit on the front of the pin 2, in the area around the base island 1 and the pin 2, between the pin 2 and the base island 1 The area and the area between the pin 2 and the pin 2 are embedded with a filler-free molding compound (epoxy resin) 3, and the filler-free molding compound (epoxy resin) 3 connects the base island 1 and the lower part of the pin 2 The periphery, the lower part of the pin 2 and the lower part of the base island 1, and the lower part of the pin 2 and the lower part of the pin 2 are connected into one body, and the size of the base island and the back of the pin is smaller than the size of the base island and the front of the pin, forming an upper part and a lower part The base island and pin structure, the pillar 10 is arranged on the back of the pin 2, and the root of the pillar 10 is embedded in the plastic encapsulant (epoxy resin) 3 without filler.

Its packaging method is as follows:

Step 1. Take the metal substrate

Referring to FIG. 1(A), take a metal substrate 11 with a suitable thickness. The material of the metal substrate can be changed according to the functions and characteristics of the chip, for example: copper, aluminum, iron, copper alloy or nickel-iron alloy.

Step 2. The front and back of the metal substrate are coated with photoresist film

Referring to FIG. 1(B), the front and back sides of the metal substrate are covered with photoresist films 12 and 13 that can be exposed and developed by coating equipment to protect the subsequent electroplating metal layer process. The photoresist film can be a dry photoresist thin film or a wet photoresist film.

Step 3: Expose/develop the photoresist film on the front of the metal substrate and open the window where the metal layer needs to be plated

Referring to FIG. 1(C), use exposure and development equipment to expose and develop the front of the metal substrate that has completed the photoresist film coating operation in step 2 to remove part of the photoresist film to expose the area on the front of the metal substrate that needs to be subsequently electroplated with a metal layer.

Step 4. Electroplating and coating the metal layer on the windowed area on the front of the metal substrate

Referring to FIG. 1(D), the first metal layer 4 is electroplated on the area where the window has been opened on the front side of the metal substrate in step 3, and the first metal layer 4 is placed on the front side of the base island 1 and the pin 2 .

Step 5. Remove the photoresist film on the front and back of the metal substrate

Referring to FIG. 1(E), remove the remaining photoresist film on the front side of the metal substrate and the photoresist film on the back side of the metal substrate.

Step 6. Cover the front and back of the metal substrate with photoresist film

Referring to FIG. 1(F), the front and back sides of the metal substrate are coated with photoresist films 14 and 15 that can be exposed and developed by coating equipment to protect the subsequent etching process. The photoresist film can be a dry photoresist thin film or a wet photoresist film.

Step 7. The photoresist film of the metal substrate is exposed/developed and opened in the area that needs to be etched on both sides

Referring to Figure 1(G), use the exposure and development equipment to expose and develop the front and back of the metal substrate that has completed the photoresist film coating operation in step 6 to remove part of the photoresist film to expose a part of the metal substrate for subsequent metal substrates Double-sided etching work.

Step 8. Metal substrate for double-sided etching

Referring to Fig. 1(H), after completing the exposure/development and window opening operation in step 7, the etching operation of each pattern is carried out on the front and back of the metal substrate, and the front and back of the base island 1 and pin 2 are etched, and at the same time Extend the front of the pins to the side of the base island as much as possible, and make the size of the back of the base island 1 and the pin 2 smaller than the front size of the base island 1 and the pin 2, forming a base island 1 and a lead with a large top and a small bottom. The pin 2 structure; and a column 10 is formed on the back of the pin 2, and a rib 16 is left between the base island 1 and the pin 2 and between the pin 2 and the pin 2.

Step 9. Remove the photoresist film on the front and back of the metal substrate

Referring to Figure 1 (I), the remaining photoresist films on the front and back of the metal substrate are all removed to form a lead frame.

Step ten, loading film

Referring to FIG. 1(J), the chip 7 is implanted on the first metal layer 4 on the front side of the base island 1 through a conductive or non-conductive adhesive substance 6 .

Step 11, hit the metal wire

Referring to FIG. 1(K), the semi-finished product that has completed the chip implantation operation is subjected to the metal wire 8 operation between the front side of the chip and the first metal layer on the front side of the pin.

Step 12. Encapsulate with filler molding compound (epoxy resin)

Referring to Figure 1(L), the front side of the semi-finished product that has been wired is partially encapsulated with filler molding compound (epoxy resin) 9, so that the partial unit area on the front side of pin 2 is exposed to filler molding compound (epoxy resin) 9. Carry out the curing operation after encapsulation by the plastic encapsulant, so that the base island and the upper part of the pin, as well as the outside of the chip and the metal wire are all encapsulated by the filler plastic encapsulant (epoxy resin).

Step 13: Coating photoresist film

Referring to FIG. 1(M), the front and back of the semi-finished product that has been encapsulated with filler molding compound (epoxy resin) are coated with photoresist films 17 and 18 that can be exposed and developed by coating equipment to protect subsequent etching process work. The photoresist film can be a dry photoresist thin film or a wet photoresist film.

Step 14. Expose/develop and open windows on the back of the semi-finished product that has been encapsulated with filler molding compound (epoxy resin)

Referring to Fig. 1(N), use the exposure and development equipment to expose and develop the back of the semi-finished product that has completed the coating operation of the photoresist film in step 13 and has completed the operation of encapsulating the filler molding compound (epoxy resin) to remove part of the photoresist film. In order to expose the connecting ribs 16 left after the double-sided etching of the metal substrate in step 8 and the pillars 10 formed on the back of the pins 2, in preparation for subsequent etching operations on the root of the pillars and the connecting ribs.

Step fifteen, the second etching operation

Referring to Figure 1(O), after completing the exposure/development and window opening operations in step fourteen, the etching operation of each pattern is performed on the back of the semi-finished product that is encapsulated with filler molding compound (epoxy resin), and the step eight metal The ribs 16 left after the double-sided etching of the substrate are all etched away. During this process, the roots of the pillars 10 will also be etched away to a relative thickness at the same time, so that the roots of the pillars do not expose the back of the encapsulated package structure, avoiding A circuit break occurs.

Step 16. Remove the photoresist film on the front and back of the semi-finished product

Referring to FIG. 1(P), the remaining photoresist film on the back of the semi-finished product and the photoresist film on the front of the semi-finished product after the etching operation in step 15 are all removed.

Step seventeen, encapsulating the plastic compound (epoxy resin) without filler

Referring to Figure 1(Q), the back of the semi-finished product that has completed the film removal operation described in step 16 is encapsulated with a filler-free molding compound (epoxy resin), and the curing operation is performed after the molding compound is encapsulated, so that the base island 1 and the peripheral area of pin 2, the area between pin 2 and base island 1, and the area between pin 2 and pin 2 are all embedded with no filler molding compound (epoxy resin) 3, the filler-free plastic molding compound

(Epoxy resin) 3 connect the base island 1 and the lower periphery of the pin 2, the lower part of the pin 2 and the lower part of the base island 1, and the lower part of the pin 2 and the lower part of the pin 2, and make the root of the column 10 embedded in the base Filler-free molding compound (epoxy resin) 3.

Special note: but also because there are many pillars 10 in the package, the structure in the package is stronger (like adding steel bars to concrete, which has both strength and toughness)

Step 18, the base island and the back of the pin and the front of the pin are electroplated with a metal layer

Referring to Fig. 1 (R), the base island and the back side of the pins that have completed step seventeen encapsulating no-filler molding compound and the pin 2 exposed with filler molding compound (epoxy resin) described in step twelve The electroplating and coating operations of the second metal layer 5 and the first metal layer 4 are respectively carried out in the local unit area on the front, and the electroplating material can be tin, nickel gold, nickel palladium gold...etc. metal materials.

Step nineteen, cut the finished product

Referring to Figure 2 and Figure 3, the semi-finished product that has completed the electroplating and coating of the second metal layer in step 18 is cut, so that the chips that were originally connected together in the form of an array assembly are separated one by one to obtain a double-sided The graphics chip is being installed in a single package structure.

Embodiment 2: sunken base island exposed type single-turn pin

Referring to Figures 4 to 6, Figures 4(A) to 4(R) are schematic diagrams of each process in Embodiment 2 of the double-sided graphics chip front-mounting single-chip packaging method of the present invention. Fig. 5 is a structural schematic diagram of Embodiment 2 of the double-sided graphics chip front-mounted single-chip package structure of the present invention. FIG. 6 is a top view of FIG. 5 . It can be seen from FIG. 4 , FIG. 5 and FIG. 6 that the only difference between Embodiment 2 and Embodiment 1 is that the base island 1 is a sunken base island, that is, the central area of the front of the base island 1 is sunken.

Embodiment 3: Embedded base island single-turn pin

Referring to Figures 7 to 9, Figures 7(A) to 7(R) are schematic diagrams of each process in Embodiment 3 of the double-sided graphic chip front-mount single-chip packaging method of the present invention. Fig. 8 is a structural schematic diagram of Embodiment 3 of the double-sided graphic chip front-mounted single-chip package structure of the present invention. FIG. 9 is a top view of FIG. 8 . It can be seen from Figure 7, Figure 8 and Figure 9 that the only difference between Embodiment 3 and Embodiment 1 is that the base island 1 is an embedded base island, that is, the back of the base island 1 is embedded with the non-filler The molding compound (epoxy resin) 3 inside.

Embodiment 4: Multi-bump base island exposed single-turn pin

Referring to Figures 10-12, Figures 10(A)-10(R) are schematic diagrams of each process in Embodiment 4 of the front-mounting single-chip packaging method for double-sided graphics chips of the present invention. FIG. 11 is a structural schematic diagram of Embodiment 4 of the front-mounted single-chip package structure of the double-sided graphics chip of the present invention. FIG. 12 is a top view of FIG. 11 . It can be seen from Figure 10, Figure 11 and Figure 12 that the difference between Embodiment 4 and Embodiment 1 is that the base island 1 is a multi-bump base island, that is, the surface of the base island 1 is provided with multiple bumps .

Embodiment 5: Multiple base island exposed single-turn pins

Referring to Figures 13-15, Figures 13(A)-13(R) are schematic diagrams of each process in Embodiment 5 of the front-mounting single-chip packaging method for double-sided graphics chips of the present invention. Fig. 14 is a structural schematic diagram of Embodiment 5 of the front-mounted single-chip package structure of the double-sided graphics chip of the present invention. FIG. 15 is a top view of FIG. 14 . It can be seen from FIGS. 13 to 15 that the difference between Embodiment 5 and Embodiment 1 lies in that: there are multiple base islands 1 , and the pin 2 has a single turn.

Embodiment 6: Multiple sunken base island exposed single-turn pins

Referring to Figures 16-18, Figures 16(A)-16(R) are schematic diagrams of each process in Embodiment 6 of the front-mounting single-chip packaging method for double-sided graphics chips of the present invention. Fig. 17 is a structural schematic diagram of Embodiment 6 of the front-mounted single-chip package structure of the double-sided graphics chip of the present invention. FIG. 18 is a top view of FIG. 17 . It can be seen from FIGS. 16 to 18 that the difference between Embodiment 6 and Embodiment 2 lies in that: there are multiple base islands 1 , and the pin 2 has a single turn.

Example 7: Multiple Buried Base Island Single Turn Pins

Referring to Figures 19-21, Figures 19(A)-19(R) are schematic diagrams of each process in Embodiment 7 of the front-mounting single-chip packaging method for double-sided graphics chips of the present invention. Fig. 20 is a structural schematic diagram of Embodiment 7 of the front-mounted single-chip package structure of the double-sided graphics chip of the present invention. FIG. 21 is a top view of FIG. 20 . It can be seen from FIGS. 19-21 that the difference between Embodiment 7 and Embodiment 3 lies in that: there are multiple base islands 1 , and the pin 2 has a single turn.

Embodiment 8: Multiple multi-bump base island exposed single-turn pins

Referring to Figures 22 to 24, Figures 22(A) to 22(R) are schematic diagrams of each process in Embodiment 8 of the double-sided graphics chip front-mounting single-chip packaging method of the present invention. Fig. 23 is a structural schematic diagram of Embodiment 8 of the double-sided graphics chip front-mounted single-chip package structure of the present invention. FIG. 24 is a top view of FIG. 23 . It can be seen from FIGS. 22 to 24 that the difference between Embodiment 8 and Embodiment 4 lies in that: there are multiple base islands 1 , and the pin 2 has a single turn.

Embodiment 9: base island exposed type and sunken base island exposed type single-turn pin

Referring to Figures 25-27, Figures 25(A)-25(R) are schematic diagrams of each process in Embodiment 9 of the front-mounting single-chip packaging method for double-sided graphics chips of the present invention. Fig. 26 is a structural schematic diagram of Embodiment 9 of the double-sided graphics chip front-mounted single-chip package structure of the present invention. FIG. 27 is a top view of FIG. 26 . It can be seen from Figures 25 to 27 that the difference between Embodiment 9 and Embodiment 1 is that: the base island 1 has two groups or multiple groups of base islands, one group is the first base island 1.1, and the other group is the first base island 1.1. For the second base island 1.2, the central area of the front of the second base island 1.2 sinks, and the first metal layer 4 is set on the front of the first base island 1.1 and the pin 2, and on the first base island 1.1, The second metal layer 5 is arranged on the back of the second base island 1.2 and the pin 2, and the chip 7 is arranged on the central sunken area of the front of the second base island 1.2 and the front of the first base island 1.1 through a conductive or non-conductive bonding substance 6, the chip 7. Both the front side and the first metal layer 4 on the front side of the pin 2 and between the chip 7 and the chip 7 are connected with a metal wire 8, in the peripheral area of the pin 2, between the pin 2 and the first base island 1.1 The area between the first base island 1.1 and the second base island 1.2, the area between the second base island 1.2 and pin 2, and the area between pin 2 and pin 2 are embedded with filler-free molding compound 3. The filler-free molding compound 3 connects the periphery of the lower part of the pin, the lower part of the pin 2 and the first base island 1.1, the lower part of the first base island 1.1 and the second base island 1.2, the second base island 1.2 and the lower part of the pin 2, and Pin 2 is integrally connected with the lower part of pin 2, said pin 2 has a single turn.

Embodiment 10: base island exposed type and embedded type base island single-turn pin

Referring to Figures 28-30, Figures 28(A)-28(R) are schematic diagrams of each process in Embodiment 10 of the double-sided graphics chip front-mounting single-chip packaging method of the present invention. FIG. 29 is a structural schematic diagram of Embodiment 10 of the double-sided graphics chip front-mounted single-chip package structure of the present invention. FIG. 30 is a top view of FIG. 29 . It can be seen from Figures 28 to 30 that the difference between Embodiment 10 and Embodiment 1 is that: the base island 1 has two groups or multiple groups of base islands, one group is the first base island 1.1, and the other group is the first base island 1.1. For the third base island 1.3, the first metal layer 4 is arranged on the front of the first base island 1.1, the third base island 1.3 and the pin 2, and the second metal layer 4 is arranged on the back of the first base island 1.1 and the pin 2. The metal layer 5, the front of the chip 7 and the first metal layer 4 on the front of the pin 2 and between the chip 7 and the chip 7 are all connected with a metal wire 8. In the area around the pin 2, the pin 2 and the first Area between base island 1.1, back of third base island 1.3, area between third base island 1.3 and first base island 1.1, area between third base island 1.3 and pin 2, and pin to pin Filler-free molding compound 3 is embedded in the area between, and the filler-free molding compound 3 connects the lower periphery of the pin, the pin 2 and the lower part of the first base island 1.1, the back of the third base island 1.3, and the back of the third base island 1.3 and The lower part of the first base island 1.1, the back of the third base island 1.3 and the lower part of the pin 2 and the lower part of the pin 2 are connected as a whole, and the pin 2 is provided with a single loop.

Embodiment 11: base island exposed type and multi-bump base island exposed type single-turn pin

Referring to Figures 31-33, Figures 31(A)-31(R) are schematic diagrams of each process in Embodiment 11 of the double-sided graphics chip front-mounting single-chip packaging method of the present invention. Fig. 32 is a structural schematic diagram of Embodiment 11 of the front-mounted single-chip package structure of the double-sided graphics chip of the present invention. FIG. 33 is a top view of FIG. 32 . It can be seen from Figures 31 to 33 that the difference between Embodiment 11 and Embodiment 1 is that: the base island 1 has two groups or multiple groups of base islands, one group is the first base island 1.1, and the other group is the first base island 1.1. It is the fourth base island 1.4, the front side of the fourth base island 1.4 is arranged in a multi-bump structure, in the area around the pin 2, the area between the pin 2 and the first base island 1.1, the first base island 1.1 The area between the island 1.1 and the fourth base island 1.4, the area between the fourth base island 1.4 and the pin 2, and the area between the pin 2 and the pin 2 are embedded with filler-free molding compound 3, the filler-free The plastic encapsulant (epoxy resin) 3 connects the lower periphery of the pin, the lower part of the pin 2 and the first base island 1.1, the lower part of the first base island 1.1 and the fourth base island 1.4, the fourth base island 1.4 and the lower part of the pin 2, and The pin 2 is integrally connected with the lower part of the pin 2, and the pin 2 is provided with a single circle.

Embodiment 12: Sunken base island exposed type and buried base island exposed type single-turn pin

Referring to Figures 34 to 36, Figures 34(A) to 34(R) are schematic diagrams of each process in Embodiment 12 of the double-sided graphics chip front-mounting single-chip packaging method of the present invention. Fig. 35 is a structural schematic diagram of Embodiment 12 of the double-sided graphics chip front-mounted single-chip package structure of the present invention. FIG. 36 is a top view of FIG. 35 . It can be seen from Figures 34 to 36 that the difference between Embodiment 12 and Embodiment 1 is that: the base island 1 has two groups or multiple groups of base islands, one group is the second base island 1.2, and the other group is the second base island 1.2. For the third base island 1.3, the central area of the front of the second base island 1.2 is sunken, and the chip 7 is arranged on the central sunken area of the front of the second base island 1.2 and the front of the third base island 1.3 through a conductive or non-conductive bonding substance 6 , in the peripheral area of the pin 2, the area between the pin 2 and the second base island 1.2, the back side of the third base island 1.3, the area between the back side of the second base island 1.2 and the second base island 1.2, the area between the second base island 1.2, The area between the back of the three-base island 1.3 and the pin 2 and the area between the pins are embedded with no filler molding compound 3, and the filler-free molding compound 3 connects the lower periphery of the pin, the pin 2 and the second pin. The lower part of the base island 1.2, the third base island 1.3, the third base island 1.3 and the lower part of the second base island 1.2, the back of the third base island 1.3 and the lower part of the pin 2 and the lower part of the pin 2 and the pin 2 are connected into one body, said Pin 2 is provided with a circle.

Embodiment 13: Sunken base island exposed type and multi-bump base island exposed type single-turn pin

Referring to Figures 37-39, Figures 37(A)-37(R) are schematic diagrams of each process in Embodiment 13 of the double-sided graphics chip front-mounting single-chip packaging method of the present invention. Fig. 38 is a structural schematic diagram of Embodiment 13 of the double-sided graphics chip front-mounted single-chip package structure of the present invention. FIG. 39 is a top view of FIG. 38 . It can be seen from Figures 37 to 39 that the difference between Embodiment 13 and Embodiment 1 is that: the base island 1 has two groups or multiple groups of base islands, one group is the second base island 1.2, and the other group is the second base island 1.2. For the fourth base island 1.4, the central area of the front of the second base island 1.2 sinks, the front of the fourth base island 1.4 is arranged in a multi-convex structure, and the fourth base island 1.4 and the front of the pin 2 are provided with a A metal layer 4, a second metal layer 5 is provided on the back of the second base island 1.2, the fourth base island 1.4 and the pin 2, and the central sinking area and the fourth base island on the front of the second base island 1.2 1.4 The front side is provided with a chip 7 through a conductive or non-conductive adhesive substance 6, in the peripheral area of the pin 2, the area between the pin 2 and the second base island 1.2, the second base island 1.2 and the fourth base island 1.4 The area between, the area between the fourth base island 1.4 and the pin 2, and the area between the pin 2 and the pin 2 are embedded with a filler-free molding compound 3, and the filler-free molding compound (epoxy resin) 3 Connect the lower periphery of the pin, pin 2 and the lower part of the second base island 1.2, the second base island 1.2 and the lower part of the fourth base island 1.4, the fourth base island 1.4 and the lower part of the pin 2, and the lower part of the pin 2 and the pin 2 Connected as one, the pin 2 is provided with a circle.

Embodiment 14: Embedded base island and multi-bump base island exposed single-turn pin

Referring to Figures 40-42, Figures 40(A)-40(R) are schematic diagrams of each process in Embodiment 14 of the double-sided graphics chip front-mounting single-chip packaging method of the present invention. Fig. 41 is a structural schematic diagram of Embodiment 14 of the double-sided graphics chip front-mounted single-chip package structure of the present invention. FIG. 42 is a top view of FIG. 41 . It can be seen from Figures 40 to 42 that the difference between Embodiment 14 and Embodiment 1 is that: the base island 1 has two groups or multiple groups of base islands, one group is the third base island 1.3, and the other group is the third base island 1.3. It is the fourth base island 1.4, the front of the fourth base island 1.4 is arranged in a multi-bump structure, and the first metal layer 4 is arranged on the front of the third base island 1.3, the fourth base island 1.4 and the pin 2, The second metal layer 5 is arranged on the back of the fourth base island 1.4 and the pin 2, in the peripheral area of the pin 2, the area between the pin 2 and the fourth base island 1.4, the third base island 1.3 The backside, the area between the second base island 1.2 and the fourth base island 1.4, the area between the third base island 1.3 and the pin 2, and the area between the pins are embedded with no filler molding compound 3, so The filler-free molding compound 3 connects the lower periphery of the pin, the lower part of the pin 2 and the fourth base island 1.4, the back of the third base island 1.3, the back of the third base island 1.3 and the lower part of the fourth base island 1.4, and the back of the third base island 1.3 The lower part of the pin 2 and the lower part of the pin 2 are integrally connected, and the pin 2 is provided with a circle.

Claims (12)

1. A double-sided graphics chip front-loading single-chip package structure, including a base island (1), pins (2), plastic packaging compound without filler (3), conductive or non-conductive bonding material (6), chip (7 ), metal wire (8) and filler molding compound (9), the front side of the pin (2) extends to the side of the base island (1), and is set on the front side of the base island (1) and the pin (2) There is a first metal layer (4), a second metal layer (5) is arranged on the back of the base island (1) and pins (2), and a first metal layer (4) is arranged on the front of the base island (1). ) is provided with a chip (7) through a conductive or non-conductive bonding substance (6), and the front of the chip (7) is connected with the first metal layer (4) on the front of the pin (2) with a metal wire (8). The upper part of the base island (1) and the pins (2) as well as the chip (7) and the metal wire (8) are encapsulated with a packing plastic compound (9), and the base island (1) and the pins (2) The peripheral area, the area between the pin (2) and the base island (1) and the area between the pin (2) and the pin (2) are embedded with a filler-free molding compound (3). The plastic sealing compound (3) of the filler connects the base island (1) and the lower periphery of the pin (2), the lower part of the pin (2) and the lower part of the base island (1), and the lower part of the pin (2) and the lower part of the pin (2) and make the size of the base island and the back side of the pin smaller than the size of the base island and the front side of the pin to form a base island and pin structure with a large top and a small bottom. It is characterized in that: the filler plastic compound (9) will The front part of the pin (2) is covered by a partial unit, and a pillar (10) is arranged on the back of the pin (2), and the root of the pillar (10) is embedded in the plastic sealing compound (3) without filler. 2. A double-sided graphic chip front-mount single-chip package structure according to claim 1, characterized in that the plastic sealing compound (3) without filler is exposed on the back of the base island (1). 3. A double-sided graphics chip front-mount single-chip package structure according to claim 1, characterized in that the front central area of the base island (1) is sunken. 4. A kind of double-sided graphics chip front-loading single-chip packaging structure according to claim 1, characterized in that the back side of the base island (1) is embedded in the plastic compound (3) without filler. 5. A double-sided graphics chip front-mount single-chip package structure according to claim 1, characterized in that the front side of the base island (1) is arranged in a multi-bump structure. 6. A double-sided graphics chip front-loading single-chip package structure according to any one of claims 1-5, characterized in that said base island (1) has multiple, pins (2) have a single circle. 7. A kind of double-sided graphics chip front-loading single package structure according to claim 1, characterized in that the base island (1) has two groups, one group is the first base island (1.1), and the other group is The second base island (1.2), the central area of the front of the second base island (1.2) sinks, and the first metal layer (4) is arranged on the front of the first base island (1.1) and the pin (2) , a second metal layer (5) is arranged on the back of the first base island (1.1), the second base island (1.2) and the pins (2), and the central sinking area on the front of the second base island (1.2) A chip (7) is provided on the front side of the first base island (1.1) through a conductive or non-conductive bonding substance (6), between the front side of the chip (7) and the first metal layer (4) on the front side of the pin (2) and the chip (7) is connected with the chip (7) by a metal wire (8), in the peripheral area of the pin (2), the area between the pin (2) and the first base island (1.1), the second The area between the first base island (1.1) and the second base island (1.2), the area between the second base island (1.2) and the pin (2) and between the pin (2) and the pin (2) Embedding non-filler molding compound (3) in the region, the filler-free molding compound (3) connects the lower periphery of the pin, the lower part of the pin (2) and the first base island (1.1), and the first base island (1.1) and the first base island (1.1) The lower part of the second base island (1.2), the lower part of the second base island (1.2) and the lower part of the pin (2) and the lower part of the pin (2) and the lower part of the pin (2) are connected into one body, and the pin (2) is provided with a single lock up. 8. A kind of double-sided graphics chip front-loading single package structure according to claim 1, characterized in that the base island (1) has two groups, one group is the first base island (1.1), and the other group is The third base island (1.3), the first metal layer (4) is arranged on the front of the first base island (1.1), the third base island (1.3) and the pin (2), and the first base island (1.1) and the back of the pin (2) are provided with a second metal layer (5), and a chip (7) is provided on the front of the base island (1) through a conductive or non-conductive bonding substance (6), and the chip (7) The front side and the first metal layer (4) on the front side of the pin (2) and between the chip (7) and the chip (7) are all connected with a metal wire (8), and the base island (1) and the pin ( 2) The upper part, the chip (7) and the metal wire (8) are encapsulated with a packing plastic compound (9), and in the peripheral area of the pin (2), the pin (2) and the first base island (1.1) The area between, the back of the third base island (1.3), the area between the second base island (1.2) and the first base island (1.1), the area between the third base island (1.3) and the pin (2) The area and the area between the pins are embedded with filler-free molding compound (3), and the filler-free molding compound (3) connects the lower periphery of the pin, the pin (2) and the lower part of the first base island (1.1) , the back of the third base island (1.3), the back of the third base island (1.3) and the bottom of the first base island (1.1), the back of the third base island (1.3) and the bottom of the pin (2) and the bottom of the pin (2) and The lower parts of the pins (2) are connected into one body, and the pins (2) are provided with a single turn. 9. A kind of double-sided graphics chip front-loading single package structure according to claim 1, characterized in that the base island (1) has two groups, one group is the first base island (1.1), and the other group is The fourth base island (1.4), the front of the fourth base island (1.4) is arranged in a multi-bump-like structure, in the peripheral area of the pin (2), the pin (2) and the first base island (1.1 ), the area between the first base island (1.1) and the fourth base island (1.4), the area between the fourth base island (1.4) and the pin (2), and the pin (2) and The area between the pins (2) is embedded with a filler-free molding compound (3), and the filler-free molding compound (3) connects the lower periphery of the pin, the lower part of the pin (2) and the first base island (1.1), The first base island (1.1) is connected to the lower part of the fourth base island (1.4), the fourth base island (1.4) is connected to the lower part of the pin (2) and the lower part of the pin (2) is connected to the lower part of the pin (2), and the Pin (2) is provided with a single turn. 10. A kind of double-sided graphic chip according to claim 1 is installed single package structure, it is characterized in that described base island (1) has two groups and also can be many groups of base islands, and one group is the second base island ( 1.2), the other group is the third base island (1.3), the front central area of the second base island (1.2) sinks, and the front central sinking area of the second base island (1.2) and the third base island (1.3 ) is provided with a chip (7) through a conductive or non-conductive adhesive substance (6), in the peripheral area of the pin (2), the area between the pin (2) and the second base island (1.2), The back side of the third base island (1.3), the area between the back side of the second base island (1.2) and the second base island (1.2), the area between the back side of the third base island (1.3) and the pins (2), and the leads The area between the pin and the pin is embedded with no filler molding compound (3), and the filler-free molding compound (3) connects the lower periphery of the pin, the lower part of the pin (2) and the lower part of the second base island (1.2), the third The base island (1.3), the third base island (1.3) and the lower part of the second base island (1.2), the back of the third base island (1.3) and the lower part of the pin (2), and the pin (2) and the pin (2) The lower part is connected as a whole, and the pin (2) is provided with a single turn. 11. A double-sided graphics chip front-loading single-chip package structure according to claim 1, characterized in that the base island (1) has two groups, one group is the second base island (1.2), and the other group is The fourth base island (1.4), the central area of the front of the second base island (1.2) sinks, and the front of the fourth base island (1.4) is arranged in a multi-convex structure, between the fourth base island (1.4) and A first metal layer (4) is provided on the front of the pin (2), and a second metal layer ( 5), a chip (7) is provided on the central sinking area of the front of the second base island (1.2) and the front of the fourth base island (1.4) through a conductive or non-conductive bonding substance (6), and a chip (7) is provided on the front of the pin (2) the peripheral area, the area between the pin (2) and the second base island (1.2), the area between the second base island (1.2) and the fourth base island (1.4), the fourth base island ( 1.4) The area between the pin (2) and the area between the pin (2) and the pin (2) is embedded with a filler-free molding compound (3), and the filler-free molding compound (3) will lead to The periphery of the lower part of the foot, the lower part of the pin (2) and the second base island (1.2), the lower part of the second base island (1.2) and the fourth base island (1.4), the lower part of the fourth base island (1.4) and the pin (2) And the pin (2) is integrally connected with the lower part of the pin (2), and the pin (2) is provided with a single turn. 12. A double-sided graphics chip front-loading single-chip package structure according to claim 1, characterized in that the base island (1) has two groups, one group is the third base island (1.3), and the other group is The fourth base island (1.4), the front of the fourth base island (1.4) is arranged in a multi-convex structure, and the third base island (1.3), the fourth base island (1.4) and the pins (2) A first metal layer (4) is provided on the front side of the base, a second metal layer (5) is provided on the back of the fourth base island (1.4) and the pin (2), and a second metal layer (5) is provided on the periphery of the pin (2) area, the area between the pin (2) and the fourth base island (1.4), the back of the third base island (1.3), the area between the second base island (1.2) and the fourth base island (1.4), the The area between the three-base island (1.3) and the pin (2) and the area between the pins are embedded with no filler molding compound (3), and the filler-free molding compound (3) surrounds the lower part of the pin , pin (2) and the bottom of the fourth base island (1.4), the back of the third base island (1.3), the back of the third base island (1.3) and the bottom of the fourth base island (1.4), the third base island (1.3) The back and the lower part of the pin (2) and the lower part of the pin (2) are integrally connected, and the pin (2) is provided with a single circle. the

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