CN101838830A - Electrolyte of electroplating palladium-nickel alloy - Google Patents
Electrolyte of electroplating palladium-nickel alloy Download PDFInfo
- Publication number
- CN101838830A CN101838830A CN 201010168000 CN201010168000A CN101838830A CN 101838830 A CN101838830 A CN 101838830A CN 201010168000 CN201010168000 CN 201010168000 CN 201010168000 A CN201010168000 A CN 201010168000A CN 101838830 A CN101838830 A CN 101838830A
- Authority
- CN
- China
- Prior art keywords
- palladium
- salt
- nickel
- electroplating
- electrolytic solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
Abstract
The invention relates to electrolyte of an electroplating palladium-nickel alloy, in particular to electrolyte. The invention provides electrolyte which can electroplate bright, compact and needle-hole-free electroplating palladium-nickel alloy with different nickel contents (10 to 40 percent), which comprises major salt, complexing agent, additive, conductive salt and pH stabilizer; the major salt comprises a palladium salt and a nickel salt, calculating at the metal palladium, the content of the palladium salt is 1 to 10 g/L, and the mol ratio of the palladium salt and the nickel slat is 1: 1 to 3; the concentration of the complexing agent is 0.2 to 1.0 mol/L; the content of the additive is 0.01 to 1.0 g/L; the content of the conductive salt is 20 to 100 g/L; and the pH stabilizer is of 20 to 50 g/L boric acid or 30 to 90 g/L pyroborate.
Description
Technical field
The present invention relates to a kind of electrolytic solution, especially relate to a kind of electrolytic solution of electroplating palladium-nickel alloy.
Background technology
Gold utensil has good solidity to corrosion, electroconductibility and ductility, is widely used as the covering with paint metal of electric contactor and junctor in electronic industry.Price of gold lattice costliness, substitute, the saving cost of seeking gold plate have caused people's extensive concern.Many character of palladium are all similar with gold, and as solidity to corrosion, ductility etc., and the price of palladium is more cheap, and density is lower, and application cost is well below gold.Palldium alloy coating not only can make cost further reduce, and can also significantly reduce the suction hydrogen phenomenon of pure palladium coating, improves ductility, wear resistance, contact resistance and the luminance brightness etc. of palladium coating.Therefore, palladium and alloy thereof are considered to the most possible metal or alloy that replaces or save gold.
In addition, palladium and alloy thereof also can be used as high-grade ornament bottom, blocking layer, electrically contact coating, patch coating, be widely used in industries such as ornamental industry, electronic industry, micro electronmechanical processing.
Palladium and nickel belong to gang together, and character is approaching.The thermodynamic stability of Pd-Ni alloy is better.Because the low price of nickel, solidity to corrosion is better, and contact resistance is lower, so Pd-Ni alloy is a kind of palldium alloy of at present widespread usage.
At present, domestic research about electroplating palladium-nickel alloy is few.The emphasis of foreign study is, by the selection of complexing agent and additive, to reach high speed electrodeposition and the galvanized purpose of no ammonia.To electroplating high nickel content, again can be as requested, the research of electroplating the Technology of different Ni contents Pd-Ni alloy does not appear in the newspapers; The additive research that high nickel content and different Ni contents Pd-Ni alloy coating luminance brightness, compactness and porosity are played a decisive role does not appear in the newspapers yet.
In the Pd-Ni alloy, nickel content is bigger to the property effect of coating, and the Pd-Ni alloy coating of different Ni contents has different hardness, different thermodynamic stabilities, and different application is also arranged certainly.At present, the nickel mass content is that about 20% Pd-Ni alloy coating is widely used, but the Pd-Ni alloy of nickelic mass content is not seen industrial application.
For with a kind of plating bath, in the certain current density scope, electroplate the Pd-Ni alloy coating that obtains, the mass content of nickel is constant substantially.U.S. Pat .4849303 points out that behind a spot of iodide ion of adding, under different current densities, the nickel quality change is no more than 3% in the Pd-Ni alloy coating that obtains in the plating bath.
Summary of the invention
The present invention aims to provide the electrolytic solution of the electroplating palladium-nickel alloy of a kind of light that can electroplate out different nickel mass content (10%～40%), densification, free of pinholes.
The electrolytic solution of electroplating palladium-nickel alloy of the present invention comprises main salt, complexing agent, additive, conducting salt and pH stablizer; Described main salt comprises palladium salt and nickel salt, calculates with palladium metal, and the content of palladium salt is 1～10g/L, and in molar ratio, palladium salt: nickel salt is 1: (1～3); The concentration of described complexing agent is 0.2～1.0mol/L; Described content of additive is 0.01～1.0g/L; The content of described conducting salt is 20～100g/L; Described pH stablizer is 20～50g/L boric acid or 30～90g/L pyroborate.
Described palladium salt can be selected from least a in Palladous chloride, dichloro diamino palladium, dichloro four ammonia palladiums, sulfuric acid diamino palladium, sulfuric acid four ammonia palladiums, nitrous acid ammonia palladium, nitric acid ammonia palladium, the oxalic acid diamino palladium etc.
Optional at least a in single nickel salt, nickelous chloride, nickel sulfamic acid etc. of described nickel salt.
Described complexing agent can be selected from least a in ammoniacal liquor, quadrol, Padil, trolamine, thanomin, diethylene diamine, triethylene tetramine, citric acid and salt thereof, tartrate and the salt thereof etc.
Described additive can be selected from least a in propenyl thiocarbamide, nicotinic acid, nicotinic acid amide, pyridine trisulfonic acid, acrylamide, asccharin, benzene sulfinic acid sodium salt, propiolic alcohol, the butynediol etc.
Described conducting salt can be selected from least a in ammonium chloride, sodium-chlor, Repone K, sodium sulfate, ammonium sulfate, ammonium nitrate, the saltpetre etc.
Galvanized condition is: the bath pH value scope is 6.5～10; Current density is 0.1～2.0A/dm
2Bath temperature is 20～50 ℃; During electrolysis, middling speed stirs; Adopting platinized titanium net, graphite, stainless steel etc. is insoluble anode, and ratio of cathodic to anodic area is 1: (1～3).
The nickel mass content is the highest can to reach 40%.
Electrolytic solution of the present invention, palladium salt is mainly introduced with forms such as Palladous chloride, dichloro diamino palladium, dichloro four ammonia palladiums, sulfuric acid diamino palladium, sulfuric acid four ammonia palladiums, nitrous acid ammonia palladium, nitric acid ammonia palladium or oxalic acid diamino palladiums, and nickel salt is mainly introduced with forms such as single nickel salt, nickelous chloride or nickel sulfamic acids.The ratio of palladium and nickel content increases and increases along with the ratio of palladium salt and nickel salt in the plating bath in the coating, but after nickel mass content in the coating was above 40%, the nickel mass content substantially no longer changed with the further raising of nickel salt content in the plating bath.The content of palladium salt (in palladium metal) is 1～10g/L.Palladium content is high more in the plating bath, and plating speed is fast more, but the palladium loss is also big more; Palladium content is too low in the plating bath, then will often add palladium, and maintenance cost increases.Nickel salt is pressed palladium salt and nickel salt mol ratio 1: (1～3) adds.
Electrolytic solution of the present invention, complexing agent mainly are ammoniacal liquor, quadrol, Padil, trolamine, thanomin, diethylene diamine, triethylene tetramine, citric acid and salt thereof, one or more in tartrate and the salt thereof.Concentration is 0.2～1.0mol/L.In containing the electrolytic solution of these complexing agents, can obtain the Pd-Ni alloy coating of light.When using ammoniacal liquor, should note suitably reducing the volatilization of the temperature of plating bath and pH value with obstruction ammoniacal liquor as complexing agent.
Electrolytic solution of the present invention, additive mainly is one or more in propenyl thiocarbamide, nicotinic acid, nicotinic acid amide, pyridine trisulfonic acid, acrylamide, asccharin, benzene sulfinic acid sodium salt, sodium laurylsulfonate, propiolic alcohol or the butynediol, and content is 0.01～1.0g/L.Sodium laurylsulfonate had both played tensio-active agent, played brightening agent again, and propenyl thiocarbamide, acrylamide, asccharin, nicotinic acid amide, propiolic alcohol, butynediol, benzene sulfinic acid sodium salt etc. are brightening agents.When current density is high, also need add a spot of nicotinic acid, pyridine trisulfonic acid or nicotinic acid amide.Additive is used, and just can obtain the Pd-Ni alloy coating of light, densification, free of pinholes.
Electrolytic solution of the present invention, conducting salt are one or more in ammonium chloride, sodium-chlor, Repone K, sodium sulfate, ammonium sulfate, ammonium nitrate or the saltpetre.Content is 20～100g/L.
Electrolytic solution of the present invention, pH stablizer are 20～50g/L boric acid or 30～90g/L pyroborate.In this pH scope, the electrolytic solution stable in properties, the coating performance that obtains is superior.When bath pH value was on the low side, coating was the lime look; When bath pH value was higher, nickel content can reduce in the coating.
Plating condition of the present invention, electrolytic solution is weakly alkaline, and preferred pH value scope is 6.5～10.
Plating condition of the present invention, plating is at 0.1～2.0A/dm
2Current density under carry out.When current density was excessive, coating nickel content can reduce.This is because along with the raising of current density, the increase of palladium sedimentation velocity is greater than nickel deposition speed to be increased.But to a kind of plating bath, current density is at 0.1～2.0A/dm
2In the scope, the variation of the nickel mass content of the Pd-Ni alloy coating that obtains is no more than 4%.When current density was too small, electrodeposition efficiency reduced, and cost increases.
Plating condition of the present invention, temperature are 20～50 ℃.When temperature was too high, coating surface was sent out mist.Cross when low when temperature, the nickel mass content can reduce in the coating.
Form and the plating condition by regulating plating bath, can obtain the Pd-Ni alloy coating of different Ni contents, the nickel mass content is the highest can to reach 40%.Be used additive, can obtain the Pd-Ni alloy coating of different Ni contents, light, densification, free of pinholes.
Embodiment
Below provide the compound method (being upgraded to example) of the electrolytic solution of described electroplating palladium-nickel alloy to prepare 1:
1. main salt palladium salt is added and contain in the container of 100mL deionized water, heating, dropping ammonia stirs, and dissolving gets solution A;
2. main salt nickel salt is added and contain in the container of 100mL deionized water, heating is stirred, and dissolving gets solution B;
3. complexing agent, conducting salt and pH stablizer are added and contain in the container of 400mL deionized water, heating is stirred, and dissolving gets solution C;
4. solution A and solution B are added in the solution C, stir, get solution D;
5. additive is added and contain in the container of 100mL deionized water, heating is stirred, and after the dissolving, adds in the solution D, gets solution E;
6. with alkali lye such as ammoniacal liquor, sodium hydroxide or potassium hydroxide solution, add in the solution E, making its pH value scope is 6.5～10.Add deionized water, the cumulative volume that makes solution is 1000mL.
Embodiment 1
1) plating bath composition and plating condition are as follows
Dichloro diamino palladium (in palladium) 2g/L
Nickel sulfate hexahydrate 25g/L
Ammonium chloride 30～50g/L
Boric acid 40～50g/L
Ammoniacal liquor 30～60ml/L
Sodium laurylsulfonate 0.1～0.5g/L
Propiolic alcohol 0.05～0.4g/L
Asccharin 0.1～0.5g/L
PH (transferring) 6.5～8 with ammoniacal liquor
Current density 0.5～1A/dm
2
45 ℃ of temperature
Anode platinized titanium net
Negative electrode and anodic area were than 1: 2
Middling speed stirs in the electroplating process.
2) coating test result: referring to table 1, contact resistance evaluation criteria: SJ2431-84, general gold plate contact resistance is less than 0.6m Ω.
Table 1
Embodiment 2
1) plating bath composition and plating condition are as follows
Sulfuric acid four ammonia palladium (in palladium) 6g/L
Six water nickelous chloride 25g/L
Sodium-chlor 30～50g/L
Ten water sodium pyroborates, 50～80g/L
Quadrol 10～30g/L
Sodium laurylsulfonate 0.1～0.5g/L
Nicotinic acid 0.05～0.4g/L
Benzene sulfinic acid sodium salt 0.05～0.5g/L
PH (transferring) 6.5～7.5 with ammoniacal liquor
Current density 1～1.5A/dm
2
50 ℃ of temperature
Anode graphite
Negative electrode and anodic area were than 1: 2
Middling speed stirs in the electroplating process.
2) coating test result: referring to table 2.
Table 2
Embodiment 3
1) plating bath composition and plating condition are as follows
Nitrous acid ammonia palladium (in palladium) 8g/L
Nickel sulfamic acid 40g/L
Ammonium sulfate 30～60g/L
Boric acid 30～40g/L
Padil 15～30g/L
Acrylamide 0.2～0.5g/L
Nicotinic acid amide 0.05～0.4g/L
Sodium laurylsulfonate 0.05～0.5g/L
PH (transferring) 7～9 with ammoniacal liquor
Current density 1～1.5A/dm
2
30 ℃ of temperature
The anode stainless steel
Negative electrode and anodic area were than 1: 3
Middling speed stirs in the electroplating process.
2) coating test result: referring to table 3.
Table 3
Embodiment 4
1) plating bath composition and plating condition are as follows
Oxalic acid diamino palladium (in palladium) 10g/L
Nickel sulfate hexahydrate 45g/L
Repone K 30～50g/L
Ten water sodium pyroborates, 40～80g/L
Tripotassium Citrate 40～60g/L
Butynediol 0.1～0.5g/L
Pyridine trisulfonic acid 0.05～0.2g/L
Sodium laurylsulfonate 0.05～0.5g/L
PH (transferring) 6.5～8 with ammoniacal liquor
Current density 1～2A/dm
2
40 ℃ of temperature
The anode stainless steel
Negative electrode and anodic area were than 1: 2
Middling speed stirs in the electroplating process.
2) coating test result: referring to table 4.
Table 4
In the present invention, along with the increase of nickel mass content in the coating, the hardness of coating significantly increases, and wear resistance also significantly improves, thereby can improve it greatly as the work-ing life that electrically contacts coating.Nickelic mass content Pd-Ni alloy coating still has lower contact resistance, qualified weldability, and coating light, densification, free of pinholes reach the requirement of using fully on electronic industry.
In the present invention, same plating bath is 0.1～2.0A/dm in current density
2The coating that obtains in the scope, the variation of nickel mass content is no more than 4%.
The present invention is by the ratio and the proper technical conditions of palladium salt and nickel salt in the adjusting plating bath, and the mass content of nickel can change between 10%～40% as required in the Pd-Ni alloy coating that obtains, and can reach 40%.And the Pd-Ni alloy coating of the different nickel mass content that obtain all has lower contact resistance, qualified weldability, wear resistance preferably.
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101680004A CN101838830B (en) | 2010-05-07 | 2010-05-07 | Electrolyte of electroplating palladium-nickel alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101680004A CN101838830B (en) | 2010-05-07 | 2010-05-07 | Electrolyte of electroplating palladium-nickel alloy |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101838830A true CN101838830A (en) | 2010-09-22 |
| CN101838830B CN101838830B (en) | 2012-08-15 |
Family
ID=42742497
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010101680004A Expired - Fee Related CN101838830B (en) | 2010-05-07 | 2010-05-07 | Electrolyte of electroplating palladium-nickel alloy |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101838830B (en) |
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102658404A (en) * | 2012-05-11 | 2012-09-12 | 南昌航空大学 | Precision combined electrochemical machining method |
| CN102786100A (en) * | 2012-08-30 | 2012-11-21 | 贵研资源（易门）有限公司 | Synthetic method of palladium tetra-ammino sulfate |
| CN104244566A (en) * | 2014-09-16 | 2014-12-24 | 深圳市布局电路有限公司 | Circuit board with nickel and palladium alloy clad layer and production method of circuit board |
| CN106283136A (en) * | 2016-08-11 | 2017-01-04 | 江捷新 | Bullion white surface processes plating solution, preparation method and electro-plating method thereof |
| CN106400068A (en) * | 2016-11-29 | 2017-02-15 | 江苏澳光电子有限公司 | Plating solution for connecting terminal surface electroplating and application thereof |
| CN106480439A (en) * | 2016-11-29 | 2017-03-08 | 江苏澳光电子有限公司 | A kind of chemical nickel plating palldium alloy crosses liquid and its application |
| CN106521576A (en) * | 2016-11-29 | 2017-03-22 | 江苏澳光电子有限公司 | Plating solution for copper alloy surface palladium plating and application of plating solution |
| CN106757209A (en) * | 2016-11-29 | 2017-05-31 | 江苏澳光电子有限公司 | A kind of method of the chemical nickel plating palldium alloy for wiring board |
| CN106757203A (en) * | 2016-11-29 | 2017-05-31 | 江苏澳光电子有限公司 | A kind of molybdenum alloy surface chemical palladium-plating crosses liquid and its application |
| CN106757208A (en) * | 2016-11-29 | 2017-05-31 | 江苏澳光电子有限公司 | A kind of Ni-Pd alloy crosses liquid and its application |
| CN106757207A (en) * | 2016-11-29 | 2017-05-31 | 江苏澳光电子有限公司 | A kind of method for pcb board chemical nickel plating palldium alloy |
| CN106868571A (en) * | 2016-12-25 | 2017-06-20 | 句容亿格纳米材料厂 | A kind of nanometer molybdenum palladium titanium electroplate liquid and preparation method thereof |
| CN107176625A (en) * | 2017-04-19 | 2017-09-19 | 乐山东承新材料有限公司 | A kind of production method of the ammonia palladium of sulfuric acid four |
| CN107904631A (en) * | 2017-11-28 | 2018-04-13 | 江苏澳光电子有限公司 | A kind of plating solution and its application for stainless steel surface palladium plating |
| CN108864200A (en) * | 2018-08-06 | 2018-11-23 | 金川集团股份有限公司 | Plating one one step preparation method of ethylenediamine sulfate palladium |
| CN109183096A (en) * | 2018-11-08 | 2019-01-11 | 杭州云会五金电镀有限公司 | A kind of electroplating surface liquid and electroplating technology for alloy |
| CN110756924A (en) * | 2019-10-12 | 2020-02-07 | 哈尔滨飞机工业集团有限责任公司 | A kind of electrochemical cutting method of blade nickel-coated sheet |
| CN118563296A (en) * | 2024-05-17 | 2024-08-30 | 珠海斯美特电子材料有限公司 | Post-electroless nickel plating dip and preparation method and application thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1430683A (en) * | 2000-04-06 | 2003-07-16 | 法国梅塔勒科技公司 | Electrolytic solution for electrochemical deposit of palladium or its alloys |
| CN101240428A (en) * | 2007-11-23 | 2008-08-13 | 北京工业大学 | Preparation method of Pd-Ni double metal modified titanium catalytic electrode |
| CN101348928A (en) * | 2007-07-20 | 2009-01-21 | 罗门哈斯电子材料有限公司 | High Speed Process for Plating Palladium and Palladium Alloys |
-
2010
- 2010-05-07 CN CN2010101680004A patent/CN101838830B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1430683A (en) * | 2000-04-06 | 2003-07-16 | 法国梅塔勒科技公司 | Electrolytic solution for electrochemical deposit of palladium or its alloys |
| CN101348928A (en) * | 2007-07-20 | 2009-01-21 | 罗门哈斯电子材料有限公司 | High Speed Process for Plating Palladium and Palladium Alloys |
| CN101240428A (en) * | 2007-11-23 | 2008-08-13 | 北京工业大学 | Preparation method of Pd-Ni double metal modified titanium catalytic electrode |
Non-Patent Citations (2)
| Title |
|---|
| 《材料保护》 20021031 李斌 电镀钯镍合金研究进展 第256-258页 1-6 第35卷, 2 * |
| 《电镀与环保》 20041130 苑娟等 低速电沉积钯镍合金工艺的研究 第14-17页 1-6 第24卷, 第6期 2 * |
Cited By (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102658404A (en) * | 2012-05-11 | 2012-09-12 | 南昌航空大学 | Precision combined electrochemical machining method |
| CN102658404B (en) * | 2012-05-11 | 2014-04-16 | 南昌航空大学 | Precision combined electrochemical machining method |
| CN102786100A (en) * | 2012-08-30 | 2012-11-21 | 贵研资源（易门）有限公司 | Synthetic method of palladium tetra-ammino sulfate |
| CN104244566A (en) * | 2014-09-16 | 2014-12-24 | 深圳市布局电路有限公司 | Circuit board with nickel and palladium alloy clad layer and production method of circuit board |
| CN106283136A (en) * | 2016-08-11 | 2017-01-04 | 江捷新 | Bullion white surface processes plating solution, preparation method and electro-plating method thereof |
| CN106757208A (en) * | 2016-11-29 | 2017-05-31 | 江苏澳光电子有限公司 | A kind of Ni-Pd alloy crosses liquid and its application |
| CN106480439A (en) * | 2016-11-29 | 2017-03-08 | 江苏澳光电子有限公司 | A kind of chemical nickel plating palldium alloy crosses liquid and its application |
| CN106521576A (en) * | 2016-11-29 | 2017-03-22 | 江苏澳光电子有限公司 | Plating solution for copper alloy surface palladium plating and application of plating solution |
| CN106757209A (en) * | 2016-11-29 | 2017-05-31 | 江苏澳光电子有限公司 | A kind of method of the chemical nickel plating palldium alloy for wiring board |
| CN106757203A (en) * | 2016-11-29 | 2017-05-31 | 江苏澳光电子有限公司 | A kind of molybdenum alloy surface chemical palladium-plating crosses liquid and its application |
| CN106400068A (en) * | 2016-11-29 | 2017-02-15 | 江苏澳光电子有限公司 | Plating solution for connecting terminal surface electroplating and application thereof |
| CN106757207A (en) * | 2016-11-29 | 2017-05-31 | 江苏澳光电子有限公司 | A kind of method for pcb board chemical nickel plating palldium alloy |
| CN106868571A (en) * | 2016-12-25 | 2017-06-20 | 句容亿格纳米材料厂 | A kind of nanometer molybdenum palladium titanium electroplate liquid and preparation method thereof |
| CN107176625A (en) * | 2017-04-19 | 2017-09-19 | 乐山东承新材料有限公司 | A kind of production method of the ammonia palladium of sulfuric acid four |
| CN107904631A (en) * | 2017-11-28 | 2018-04-13 | 江苏澳光电子有限公司 | A kind of plating solution and its application for stainless steel surface palladium plating |
| CN108864200A (en) * | 2018-08-06 | 2018-11-23 | 金川集团股份有限公司 | Plating one one step preparation method of ethylenediamine sulfate palladium |
| CN108864200B (en) * | 2018-08-06 | 2020-12-11 | 金川集团股份有限公司 | One-step preparation method of ethylenediamine palladium sulfate for electroplating |
| CN109183096A (en) * | 2018-11-08 | 2019-01-11 | 杭州云会五金电镀有限公司 | A kind of electroplating surface liquid and electroplating technology for alloy |
| CN110756924A (en) * | 2019-10-12 | 2020-02-07 | 哈尔滨飞机工业集团有限责任公司 | A kind of electrochemical cutting method of blade nickel-coated sheet |
| CN110756924B (en) * | 2019-10-12 | 2021-02-09 | 哈尔滨飞机工业集团有限责任公司 | Electrochemical cutting method for nickel-coated blade |
| CN118563296A (en) * | 2024-05-17 | 2024-08-30 | 珠海斯美特电子材料有限公司 | Post-electroless nickel plating dip and preparation method and application thereof |
| CN118563296B (en) * | 2024-05-17 | 2025-01-21 | 珠海斯美特电子材料有限公司 | Chemical nickel-palladium-gold post-plating agent and its preparation method and application |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101838830B (en) | 2012-08-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101838830A (en) | Electrolyte of electroplating palladium-nickel alloy | |
| KR101502804B1 (en) | Pd and Pd-Ni electrolyte baths | |
| Ernst et al. | Electrodeposition of molydenum alloys from aqueous solutions | |
| JP6370380B2 (en) | Electrolyte for electrodeposition of silver-palladium alloy and deposition method thereof | |
| CN102817056A (en) | Electroplating process for lead wire frame palladium-nickel alloy plating layer | |
| CN102277601A (en) | Cyanogen-free silver-plating electroplating liquid containing auxiliary complexing agent | |
| CN101260549B (en) | Non-preplating type non-cyanide silver-plating electroplate liquid | |
| CN102492968A (en) | Copper plating method on brass base material | |
| CN103643265A (en) | Electroplating liquid for electrically depositing Cu-W-Co alloy coating and method thereof | |
| CN104611736A (en) | Succinimide silver plating solution and electroplating method | |
| US6743346B2 (en) | Electrolytic solution for electrochemical deposit of palladium or its alloys | |
| CN100424232C (en) | Nickel electric plating liquid | |
| JPS6250560B2 (en) | ||
| JP2007308801A (en) | Nickel/cobalt/phosphorus electroplating composition and its application | |
| JP2003530371A (en) | Palladium complex salts and their use for adjusting the palladium concentration in electrolytic baths for depositing palladium or one of its alloys | |
| CN105386094A (en) | Acid diamminebis(nitrito-n)-platinu electroplating solution of electroplated platinum and electroplating method of acid diamminebis(nitrito-n)-platinu electroplating solution | |
| CN105386093A (en) | Pt alkaline P salt electroplating bath and electroplating method thereof | |
| CA1050471A (en) | Electroplating of rhodium-ruthenium alloys | |
| CN105112955A (en) | Dinitrodiammineplatinum ammoniacal electroplating solution for acidic platinum plating and electroplating method adopting dinitrodiammineplatinum ammoniacal electroplating solution | |
| CN105441997A (en) | Glutamic-acid cyanide-free gold-plating electroplating liquid and electroplating method thereof | |
| CN105441995A (en) | Glucosaminic-acid cyanide-free gold-plating electroplating liquid and electroplating method thereof | |
| US3890210A (en) | Method and electrolyte for electroplating rhodium-rhenium alloys | |
| Xia et al. | Corrosion Resistance of Electrodeposited Nanocrystalline Ni from Citrate Baths | |
| JPS6070197A (en) | Silver alloy plating method | |
| KR20240050151A (en) | Pd-Co Alloy Plating Solution Compositions of Non-Ammonia for MEMS Probe and Plating Methods Using Thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120815 Termination date: 20180507 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |