CN105386093A - Pt alkaline P salt electroplating bath and electroplating method thereof - Google Patents
Pt alkaline P salt electroplating bath and electroplating method thereof Download PDFInfo
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- CN105386093A CN105386093A CN201510605222.0A CN201510605222A CN105386093A CN 105386093 A CN105386093 A CN 105386093A CN 201510605222 A CN201510605222 A CN 201510605222A CN 105386093 A CN105386093 A CN 105386093A
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- 238000000034 method Methods 0.000 title claims abstract description 38
- 150000003839 salts Chemical class 0.000 title claims abstract description 28
- 238000009713 electroplating Methods 0.000 title abstract description 21
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 60
- 238000007747 plating Methods 0.000 claims abstract description 55
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 26
- LPXPTNMVRIOKMN-UHFFFAOYSA-M sodium nitrite Chemical compound [Na+].[O-]N=O LPXPTNMVRIOKMN-UHFFFAOYSA-M 0.000 claims abstract description 16
- 229910001631 strontium chloride Inorganic materials 0.000 claims abstract description 11
- AHBGXTDRMVNFER-UHFFFAOYSA-L strontium dichloride Chemical compound [Cl-].[Cl-].[Sr+2] AHBGXTDRMVNFER-UHFFFAOYSA-L 0.000 claims abstract description 11
- PAWQVTBBRAZDMG-UHFFFAOYSA-N 2-(3-bromo-2-fluorophenyl)acetic acid Chemical compound OC(=O)CC1=CC=CC(Br)=C1F PAWQVTBBRAZDMG-UHFFFAOYSA-N 0.000 claims abstract description 10
- AZFNGPAYDKGCRB-XCPIVNJJSA-M [(1s,2s)-2-amino-1,2-diphenylethyl]-(4-methylphenyl)sulfonylazanide;chlororuthenium(1+);1-methyl-4-propan-2-ylbenzene Chemical compound [Ru+]Cl.CC(C)C1=CC=C(C)C=C1.C1=CC(C)=CC=C1S(=O)(=O)[N-][C@@H](C=1C=CC=CC=1)[C@@H](N)C1=CC=CC=C1 AZFNGPAYDKGCRB-XCPIVNJJSA-M 0.000 claims abstract description 10
- 235000010289 potassium nitrite Nutrition 0.000 claims abstract description 10
- 239000004304 potassium nitrite Substances 0.000 claims abstract description 10
- 235000010288 sodium nitrite Nutrition 0.000 claims abstract description 8
- 229910052712 strontium Inorganic materials 0.000 claims abstract description 7
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000007788 liquid Substances 0.000 claims description 29
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 229910052715 tantalum Inorganic materials 0.000 claims description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- 239000010936 titanium Substances 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 abstract description 38
- 238000000576 coating method Methods 0.000 abstract description 38
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 abstract description 3
- 238000005282 brightening Methods 0.000 abstract description 3
- 239000003795 chemical substances by application Substances 0.000 abstract description 3
- 229910052708 sodium Inorganic materials 0.000 abstract description 3
- 239000011734 sodium Substances 0.000 abstract description 3
- 239000006185 dispersion Substances 0.000 abstract description 2
- 238000005516 engineering process Methods 0.000 description 7
- 238000000151 deposition Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000004070 electrodeposition Methods 0.000 description 3
- 238000004062 sedimentation Methods 0.000 description 3
- 238000005303 weighing Methods 0.000 description 3
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- -1 platinum ion Chemical class 0.000 description 2
- 230000010287 polarization Effects 0.000 description 2
- 238000010791 quenching Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 241000238097 Callinectes sapidus Species 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 229910002651 NO3 Inorganic materials 0.000 description 1
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 description 1
- IOVCWXUNBOPUCH-UHFFFAOYSA-M Nitrite anion Chemical compound [O-]N=O IOVCWXUNBOPUCH-UHFFFAOYSA-M 0.000 description 1
- 229910000566 Platinum-iridium alloy Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000002671 adjuvant Substances 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000006258 conductive agent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000002659 electrodeposit Substances 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 210000003127 knee Anatomy 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- YXVOBWSDHRTYCG-UHFFFAOYSA-N nitrous acid platinum Chemical compound [Pt].N(=O)O YXVOBWSDHRTYCG-UHFFFAOYSA-N 0.000 description 1
- UUWCBFKLGFQDME-UHFFFAOYSA-N platinum titanium Chemical compound [Ti].[Pt] UUWCBFKLGFQDME-UHFFFAOYSA-N 0.000 description 1
- HWLDNSXPUQTBOD-UHFFFAOYSA-N platinum-iridium alloy Chemical class [Ir].[Pt] HWLDNSXPUQTBOD-UHFFFAOYSA-N 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 235000015598 salt intake Nutrition 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
Abstract
The invention discloses Pt alkaline P salt electroplating bath and an electroplating method of the electroplating bath. The electroplating bath comprises, by platinum, 20-30 g/L of P salt, 90-110 g/L of ammonium nitrate, 8-12 g/L of potassium nitrite or sodium nitrite and 10-15 mg/L of strontium chloride by strontium. P salt serves as platinum main salt, the ammonium nitrate and the potassium nitrite or sodium are taken as auxiliary salt, and the strontium chloride serves as a brightening agent, so that the obtained electroplating bath has the good dispersion force and deep plating capacity, the current efficiency of a negative pole is high, and the performance of the plating bath is excellent. A coating obtained through electroplating of the electroplating bath under the alkaline condition is low in porosity, high in brightness and good in quality.
Description
Technical field
The present invention relates to electroplatinizing technical field, particularly relate to alkaline P salt electroplate liquid and the electro-plating method thereof of a kind of Pt.
Background technology
The superior performance of platinum (Pt), purposes is very extensive.In bullion industry, main as ornament and artwork.In chemical industry, in order to manufacture the catalyzer of senior chemical ware, platinum crucible, electrode and acceleration chemical reaction velocity.Platinum iridium alloy is the material manufacturing fountain pen nib.Especially in the automotive industry, the effect of platinum in vent gas treatment etc. can not be substituted, and consumption almost accounts for the half of platinum industry consumption.Due to.But platinum scarcity of resources, expensive, constrain the application of platinum electrode, thus replace pure platinum goods with platinum plated materials, both reduced costs, there is again the premium properties of platinum anode.
Chinese patent CN101016639 discloses a kind of platinum titanium basal body electric plating platinum coating technique, and this technique adopts Platinic chloride as electroplate liquid.Although this technique technique is comparatively simple, the current efficiency of this plating solution is lower, the poor-performing of plating solution, and the quality of coating is not good yet.
Summary of the invention
In view of this, one aspect of the present invention provides the alkaline P salt electroplate liquid of a kind of Pt, and the plating solution performance of this electroplate liquid is better, and the quality of coating using this plating solution to obtain is higher.
An alkaline P salt electroplate liquid of Pt, comprises in platinum 20 ~ 30g/LP salt, 90 ~ 110g/L ammonium nitrate, 8 ~ 12g/L potassium nitrite or Sodium Nitrite, in strontium 10 ~ 15mg/L strontium chloride.
Wherein, comprise further in platinum in platinum 26g/LP salt, 100g/L ammonium nitrate, 10g/L potassium nitrite or Sodium Nitrite, in strontium 13mg/L strontium chloride.
In this electroplate liquid, P salt is selected to be main salt.P salt and diamino two nitrous acid platinum, molecular formula is Pt (NO
2)
2(NH
3)
2.When the content of platinum ion is low, coating gray, even turns black, and improves main salts contg and can improve cathode current density accordingly, accelerates sedimentation velocity.But because platinum valency is high, platinum content will be strict controlled within the scope of 20 ~ 30g/L, too high main salt also easily makes the coarse Sodium Nitrite of coating be common-ion effcet salt, can prevent the decomposition of P salt, can obtain the platinum coating of light; But to obtain thicker platinum coating, negative electrode should often movement, and plating piece also repeatedly should be taken out in midway, and wipe burr and plate, because internal stress constantly increases, the thickness depositing the platinum coating obtained in this kind of tank liquor is limited.Meanwhile, add ammonium nitrate and potassium nitrite or sodium as auxiliary salt, the minimizing of the nitrite or nitrate caused because of main salt consumption can be supplemented.
Take strontium chloride as brightening agent.10 ~ 15mg/L strontium chloride can make coating have entire bright.
Except mentioned component, the present invention also can select suitable amounts other in this area the additive commonly used, such as conductive agent, etc. conven-tional adjuvants, these all can not damage the characteristic of coating.
The present invention provides a kind of electro-plating method, the better performances of the electroplate liquid that the method adopts on the other hand, higher according to quality of coating prepared by the method.
Use an above-mentioned electroplate liquid electric plating method, comprise the following steps:
(1) electroplate liquid is prepared: in water, dissolve each feed composition form electroplate liquid, described often liter of electroplate liquid contains in platinum 20 ~ 30gP salt, 90 ~ 110g ammonium nitrate, 8 ~ 12g potassium nitrite or Sodium Nitrite, in strontium 10 ~ 15mg strontium chloride;
(2) insert in described electroplate liquid with the base material of electroplated and pass into electric current, apply ultrasonic wave simultaneously and electroplate.
Wherein, described electric current is monopulse rectangular wave current; The pulsewidth of described monopulse rectangular wave current is 0.5 ~ 1ms, and dutycycle is 5 ~ 30%, and average current density is 0.5 ~ 3A/dm
2.
Wherein, in described step (2), the pH of electroplate liquid is 11 ~ 13.
Wherein, in described step (2), the temperature of electroplate liquid is 70 ~ 80 DEG C.
Wherein, in described step (2), the time of plating is 20 ~ 40min.
Wherein, in described step (2), the anode of plating and the area ratio of negative electrode are (1 ~ 4): 1.
Wherein, in described step (2), described base material is nickel, titanium, tantalum, copper or silver.
Carry out under being plated on Ultrasonic Conditions in the present invention.Hyperacoustic applying mode can adopt ultrasonic generator.The present invention without particular requirement, can adopt commercially available to the concrete model of ultrasonic generator and structure.The hyperacoustic actual conditions of ultrasonic generator, such as ultrasonic power, frequency etc., also have no special requirements, and specifically can select according to practical situation.
Monopulse rectangular wave current is defined as at t
1passing into current density in time is J
pelectric current, at t
2without passing into electric current in time, it is a kind of intermittent pulse current.Dutycycle is defined as t
1/ (t
1+ t
2), frequency is 1/ (t
1+ t
2), mean current is defined as J
pt
1/ (t
1+ t
2).Compare with DC electrodeposition, thickness and the ion concentration distribution of electrostatic double layer all change; While adding electrochemical polarization, reduce concentration polarization, the direct effect of generation is, the coating that pulse plating obtains than DC electrodeposition coating evenly, crystallization is finer and closely woven.Moreover, pulse plating also has: hardness and the wear resistance of (1) coating are all high; (2) solution dispersibility and covering power good; (3) decrease the super plating of part edge, coating distributing homogeneity is good, can save plating solution usage quantity.
The present invention does not add restriction to the process of plating piece after the treatment process of the base material of electroplated before plating and plating, can take conventional pretreatment process, such as cleaning before copper plating, polishing etc.The selection of the electrode of plating also can adopt conventional method to carry out.
The present invention is with P salt for the main salt of platinum, and using ammonium nitrate and potassium nitrite or sodium as auxiliary salt, take strontium chloride as brightening agent, make the plating solution of acquisition have good dispersion force and covering power thus, cathode efficiency is high, and plating solution performance is excellent.The porosity that employing electroplates the coating of acquisition in the basic conditions at plating solution is low, and luminance brightness is high, and quality of coating is good.
Embodiment
Technical scheme of the present invention is further illustrated below in conjunction with embodiment.
Embodiment 1
The formula of electroplate liquid is as follows:
Plating technology condition: the pulsewidth of monopulse rectangular wave current is 0.5ms, and dutycycle is 30%, and average current density is 0.5A/dm
2; PH is 11, and temperature is 70 DEG C, and electroplating time is 40min.
Embodiment 2
The formula of electroplate liquid is as follows:
Plating technology condition: the pulsewidth of monopulse rectangular wave current is 0.6ms, and dutycycle is 25%, and average current density is 0.8A/dm
2; PH is 13, and temperature is 80 DEG C, and electroplating time is 35min.
Embodiment 3
The formula of electroplate liquid is as follows:
Plating technology condition: the pulsewidth of monopulse rectangular wave current is 0.8ms, and dutycycle is 20%, and average current density is 3A/dm
2; PH is 12, and temperature is 70 DEG C, and electroplating time is 20min.
Embodiment 4
The formula of electroplate liquid is as follows:
Plating technology condition: the pulsewidth of monopulse rectangular wave current is 1ms, and dutycycle is 15%, and average current density is 2.5A/dm
2; PH is 11.5, and temperature is 75 DEG C, and electroplating time is 25min.
Embodiment 5
The formula of electroplate liquid is as follows:
Plating technology condition: the pulsewidth of monopulse rectangular wave current is 0.9ms, and dutycycle is 5%, and average current density is 2A/dm
2; PH is 12.5, and temperature is 75 DEG C, and electroplating time is 30min.
Embodiment 6
The formula of electroplate liquid is as follows:
Plating technology condition: the pulsewidth of monopulse rectangular wave current is 0.7ms, and dutycycle is 10%, and average current density is 1.5A/dm
2; PH is 12, and temperature is 75 DEG C, and electroplating time is 35min.
With reference to following methods, dispersive ability test is carried out to the plating solution of embodiment 1 ~ 6:
The dispersive ability of plating solution adopts far and near cathode method (Haring-Blue method) to measure.Measure the Hull groove that groove adopts the HullCell267ml model of Kocour company of the U.S., interior dimensions is 150mm × 50mm × 70mm.Negative electrode selects thickness to be the copper sheet of 0.5mm, and working face is of a size of 50mm × 50mm; Anode is plating nickel plate with holes; Plating electric current 1A, electroplating time 30min.
The dispersive ability calculation formula of plating solution is:
Dispersive ability=[K-(the Δ M of plating solution
1/ Δ M
2)]/(K-1) (result represents with percentage);
In formula, K is negative electrode far away to the distance of anode and nearly negative electrode to the ratio of distances constant of anode, and in this test, K gets 2; Δ M
1for the increment (g) after plating on nearly negative electrode; Δ M
2for the increment (g) after plating on negative electrode far away.
With reference to following methods, covering power test is carried out to the plating solution of embodiment 1 ~ 6:
Endoporus method is adopted to measure.Negative electrode selects internal diameter l10mm, and pipe range is the copper pipe of 50mm, and one end is closed.During test, the distance of the mouth of pipe and anode is fixed on 80mm, test current 0.2A, electroplating time 30min.According to following formulae discovery:
Covering power=endoporus coating length/pipe range (result represents with percentage).
With reference to following methods, current efficiency test is carried out to the plating solution of embodiment 1 ~ 6:
Copper voltameter method is adopted to measure.Negative electrode to be tested and copper voltameter cleaned and dry up rear electronic scale weighing, then insert in electrodeposit groove by two negative electrodes simultaneously, be energized 10 ~ 30min, take out and clean dry up after use electronic scale weighing.According to following formulae discovery:
Current efficiency=(1.186 × cathode quality to be measured)/(electrochemical equivalent of copper voltameter quality × cathodic deposition metal to be measured) × 100%.Here, electrochemical equivalent=molar mass ÷ (depositing ions valency × 26.8), unit is g.A
-1.h
-1.In this test, tetravalence Pt electrochemical equivalent is 1.820g.A
-1.h
-1.
Speed test is plated with reference to the plating solution of following methods to embodiment 1 ~ 6:
Mass method is adopted to measure sedimentation rate.Be 10 with sensitivity
-4electronic balance weighing sample plating before and after quality.By the acquisition sedimentation rate of poor quality of unit time, unit surface, press formulae discovery below:
Plating speed=(after plating before sample mass-plating sample mass)/(specimen surface to be plated long-pending × plating time).Each Data duplication is measured three times and is got its mean value.
Test with reference to the bonding force of following methods to the coating of embodiment 1 ~ 6:
The method adopting line to draw lattice measures the bonding force of coating, is specially: being 30 degree with one cutting edge by electrodeposition cladding, converted steel draws parallel lines or the 1mm that 2mm of being separated by drawn by cutter
2square lattice.Whether the coating observing line tilts or peels off.Should master the dynamics during line, a cutter just can scratch coating, arrives matrix metal.Adopt quench to measure the bonding force of coating, be specially: the test piece of having plated is placed in retort furnace quenching in the cold water being heated to 300 DEG C of insulation 30min taking-up immersion 10 DEG C immediately, observe coating and whether occur bubble and decortication phenomenon.
With reference to following methods, toughness test is carried out to the coating of embodiment 1 ~ 6:
Coating is stripped down, is bent to 180 °, and extrudes knee, observe coating and whether occur fracture.
With reference to following methods, porosity test is carried out to the coating of embodiment 1 ~ 6:
The large young pathbreaker of porosity is directly connected to the corrosion resisting property of coating, adopts paster method to press GB5935-86 standard detection.The etchant solution that the potassium ferricyanide solution of 10g/L and the sodium chloride solution of 20g/L are tested as porosity.Operation steps is: after wiped clean of being deoiled by coating surface, is close to coating surface with the filter paper soaking into etchant solution, and the two can not have gap.Buy the fully wetting filter paper of etchant solution solution by glass stick or degreasing swab stick, supplement a solution at interval of lmin, taken off by filter paper after 5min, dry after clean with distilled water flushing, record hole is counted.Be placed on cleaned glass plate and dry, the number of number Bluepoint.Substitute into formulae discovery voidage below:
Number/tested area (individual/the cm of porosity=spot
2);
When calculating number of apertures, do following calculating by spot diameter size: hot spot diameter is less than lmm, and with a porosimeter at often; Be greater than lmm and be less than 3mm often o'clock with three porosimeters; Be greater than 3mm and be less than 5mm, often with ten porosimeters.
With reference to following methods, Surface flat test is carried out to the coating of embodiment 1 ~ 6:
By the Hull groove of the HullCell267ml model with the Kocour company of the test piece U.S. after 200 order sand paperings evenly at 3A/dm
2dC current density carries out plating 10min at 25 DEG C of temperature, and whether then observe test piece has scratch.
To expose aptitude tests with reference to the coating of following methods to embodiment 1 ~ 6:
Adopt the Hull groove of the HullCell267ml model of Kocour company of the U.S. at 3A/dm
2after DC current density carries out plating 10min at 25 DEG C of temperature, observe the surface luminous intensity of coating.
The test result of the coating of embodiment 1 ~ 6 and comparative example and the performance of plating solution is as follows:
As can be seen from the above table, in embodiment 1 ~ 6, consider from the integration test effect of plating solution and coating, the dispersive ability of the formula plating solution of embodiment 6, covering power, current efficiency and plating speed, the porosity of coating and bonding force will be got well compared with other embodiment.Thus, this formula is screening formulation of the present invention, and the preferred plating conditions of its correspondence is the pulsewidth of monopulse rectangular wave current is 0.7ms, and dutycycle is 10%, and average current density is 1.5A/dm
2; PH is 12, and temperature is 75 DEG C, and electroplating time is 35min, and male and femal face is long-pending than being 3:1.
It should be noted that and understand, when not departing from the spirit and scope of accompanying claim the present invention for required protection, various amendment and improvement can be made to the present invention of foregoing detailed description.Therefore, the scope of claimed technical scheme is not by the restriction of given any specific exemplary teachings.
Below know-why of the present invention is described in conjunction with specific embodiments.These describe just in order to explain principle of the present invention, and can not be interpreted as limiting the scope of the invention by any way.Based on explanation herein, those skilled in the art does not need to pay performing creative labour can associate other embodiment of the present invention, and these modes all will fall within protection scope of the present invention.
Claims (9)
1. an alkaline P salt electroplate liquid of Pt, is characterized in that, comprises in platinum 20 ~ 30g/LP salt, 90 ~ 110g/L ammonium nitrate, 8 ~ 12g/L potassium nitrite or Sodium Nitrite, in strontium 10 ~ 15mg/L strontium chloride.
2. electroplate liquid according to claim 1, is characterized in that, comprises in platinum 26g/LP salt, 100g/L ammonium nitrate, 10g/L potassium nitrite or Sodium Nitrite, in strontium 13mg/L strontium chloride.
3. an electric plating method, is characterized in that, comprises the following steps:
(1) electroplate liquid is prepared: in water, dissolve each feed composition form electroplate liquid, described often liter of electroplate liquid contains in platinum 20 ~ 30gP salt, 90 ~ 110g ammonium nitrate, 8 ~ 12g potassium nitrite or Sodium Nitrite, in strontium 10 ~ 15mg strontium chloride;
(2) insert in described electroplate liquid with the base material of electroplated and pass into electric current, apply ultrasonic wave simultaneously and electroplate.
4. method according to claim 3, is characterized in that, described electric current is monopulse rectangular wave current; The pulsewidth of described monopulse rectangular wave current is 0.5 ~ 1ms, and dutycycle is 5 ~ 30%, and average current density is 0.5 ~ 3A/dm
2.
5. method according to claim 4, is characterized in that, in described step (2), the pH of electroplate liquid is 11 ~ 13.
6. method according to claim 4, is characterized in that, in described step (2), the temperature of electroplate liquid is 70 ~ 80 DEG C.
7. method according to claim 4, is characterized in that, in described step (2), the time of plating is 20 ~ 40min.
8. method according to claim 4, is characterized in that, in described step (2), the anode of plating and the area ratio of negative electrode are (1 ~ 4): 1.
9. method according to claim 4, is characterized in that, in described step (2), described base material is nickel, titanium, tantalum, copper or silver.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510605222.0A CN105386093A (en) | 2015-09-21 | 2015-09-21 | Pt alkaline P salt electroplating bath and electroplating method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108130566A (en) * | 2018-01-31 | 2018-06-08 | 西北有色金属研究院 | For the electroplate liquid and its electro-plating method of nickel base superalloy electroplating surface platinum layer |
| CN113755913A (en) * | 2021-09-30 | 2021-12-07 | 励福(江门)环保科技股份有限公司 | Acidic P salt plating solution for electroplating platinum and electroplating method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5310475A (en) * | 1990-06-29 | 1994-05-10 | Electroplating Engineers Of Japan, Limited | Platinum electroforming and platinum electroplating |
| CN1283711A (en) * | 1999-06-15 | 2001-02-14 | 香港生产力促进局 | Platinum electroforming/electrodeposition electrolyte and method |
| CN102220582A (en) * | 2010-04-13 | 2011-10-19 | 北京有色金属研究总院 | Platinum-plated titanium palladium alloy plate and preparation method thereof |
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2015
- 2015-09-21 CN CN201510605222.0A patent/CN105386093A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5310475A (en) * | 1990-06-29 | 1994-05-10 | Electroplating Engineers Of Japan, Limited | Platinum electroforming and platinum electroplating |
| CN1283711A (en) * | 1999-06-15 | 2001-02-14 | 香港生产力促进局 | Platinum electroforming/electrodeposition electrolyte and method |
| CN102220582A (en) * | 2010-04-13 | 2011-10-19 | 北京有色金属研究总院 | Platinum-plated titanium palladium alloy plate and preparation method thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108130566A (en) * | 2018-01-31 | 2018-06-08 | 西北有色金属研究院 | For the electroplate liquid and its electro-plating method of nickel base superalloy electroplating surface platinum layer |
| CN108130566B (en) * | 2018-01-31 | 2019-08-27 | 西北有色金属研究院 | Electroplating solution and electroplating method for nickel-based superalloy surface electroplating platinum layer |
| CN113755913A (en) * | 2021-09-30 | 2021-12-07 | 励福(江门)环保科技股份有限公司 | Acidic P salt plating solution for electroplating platinum and electroplating method thereof |
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