CN105112957A - Platinum electroplating solution containing dipotassium tetrakis(nitrito-N)platinate and electroplating method adopting platinum electroplating solution - Google Patents
Platinum electroplating solution containing dipotassium tetrakis(nitrito-N)platinate and electroplating method adopting platinum electroplating solution Download PDFInfo
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- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 title claims abstract description 79
- 229910052697 platinum Inorganic materials 0.000 title claims abstract description 39
- 238000000034 method Methods 0.000 title claims abstract description 37
- 238000009713 electroplating Methods 0.000 title abstract description 24
- KCIDZIIHRGYJAE-YGFYJFDDSA-L dipotassium;[(2r,3r,4s,5r,6r)-3,4,5-trihydroxy-6-(hydroxymethyl)oxan-2-yl] phosphate Chemical compound [K+].[K+].OC[C@H]1O[C@H](OP([O-])([O-])=O)[C@H](O)[C@@H](O)[C@H]1O KCIDZIIHRGYJAE-YGFYJFDDSA-L 0.000 title abstract 4
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 title abstract 4
- 238000007747 plating Methods 0.000 claims abstract description 56
- 229910019142 PO4 Inorganic materials 0.000 claims abstract description 16
- 239000010452 phosphate Substances 0.000 claims abstract description 16
- GZJIQNJINXQYTG-UHFFFAOYSA-N 2-nitrooxybenzoic acid Chemical compound OC(=O)C1=CC=CC=C1O[N+]([O-])=O GZJIQNJINXQYTG-UHFFFAOYSA-N 0.000 claims abstract description 10
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims abstract description 9
- GVGUFUZHNYFZLC-UHFFFAOYSA-N dodecyl benzenesulfonate;sodium Chemical compound [Na].CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 GVGUFUZHNYFZLC-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229940080264 sodium dodecylbenzenesulfonate Drugs 0.000 claims abstract description 7
- 239000007788 liquid Substances 0.000 claims description 34
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims description 13
- 229910052700 potassium Inorganic materials 0.000 claims description 13
- 239000011591 potassium Substances 0.000 claims description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 239000002253 acid Substances 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 229910052715 tantalum Inorganic materials 0.000 claims description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- 239000010936 titanium Substances 0.000 claims description 2
- MNNHAPBLZZVQHP-UHFFFAOYSA-N diammonium hydrogen phosphate Chemical compound [NH4+].[NH4+].OP([O-])([O-])=O MNNHAPBLZZVQHP-UHFFFAOYSA-N 0.000 claims 1
- 229910000388 diammonium phosphate Inorganic materials 0.000 claims 1
- 235000019838 diammonium phosphate Nutrition 0.000 claims 1
- BNIILDVGGAEEIG-UHFFFAOYSA-L disodium hydrogen phosphate Chemical compound [Na+].[Na+].OP([O-])([O-])=O BNIILDVGGAEEIG-UHFFFAOYSA-L 0.000 claims 1
- 229910000397 disodium phosphate Inorganic materials 0.000 claims 1
- 235000019800 disodium phosphate Nutrition 0.000 claims 1
- 229940045641 monobasic sodium phosphate Drugs 0.000 claims 1
- AJPJDKMHJJGVTQ-UHFFFAOYSA-M sodium dihydrogen phosphate Chemical compound [Na+].OP(O)([O-])=O AJPJDKMHJJGVTQ-UHFFFAOYSA-M 0.000 claims 1
- 150000003839 salts Chemical class 0.000 abstract description 10
- 239000000654 additive Substances 0.000 abstract description 3
- 230000000996 additive effect Effects 0.000 abstract description 3
- 239000006185 dispersion Substances 0.000 abstract description 2
- WBIQQQGBSDOWNP-UHFFFAOYSA-N 2-dodecylbenzenesulfonic acid Chemical compound CCCCCCCCCCCCC1=CC=CC=C1S(O)(=O)=O WBIQQQGBSDOWNP-UHFFFAOYSA-N 0.000 abstract 2
- 229940060296 dodecylbenzenesulfonic acid Drugs 0.000 abstract 2
- 230000002378 acidificating effect Effects 0.000 abstract 1
- 239000003513 alkali Substances 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 description 38
- 238000000576 coating method Methods 0.000 description 38
- 238000005516 engineering process Methods 0.000 description 7
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000004070 electrodeposition Methods 0.000 description 3
- 150000003016 phosphoric acids Chemical class 0.000 description 3
- 230000010287 polarization Effects 0.000 description 3
- 238000004062 sedimentation Methods 0.000 description 3
- 238000005303 weighing Methods 0.000 description 3
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 238000005282 brightening Methods 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- -1 platinum ion Chemical class 0.000 description 2
- 238000010791 quenching Methods 0.000 description 2
- LPXPTNMVRIOKMN-UHFFFAOYSA-M sodium nitrite Chemical compound [Na+].[O-]N=O LPXPTNMVRIOKMN-UHFFFAOYSA-M 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- PAWQVTBBRAZDMG-UHFFFAOYSA-N 2-(3-bromo-2-fluorophenyl)acetic acid Chemical compound OC(=O)CC1=CC=CC(Br)=C1F PAWQVTBBRAZDMG-UHFFFAOYSA-N 0.000 description 1
- 241000238097 Callinectes sapidus Species 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 229910002651 NO3 Inorganic materials 0.000 description 1
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 description 1
- IOVCWXUNBOPUCH-UHFFFAOYSA-M Nitrite anion Chemical compound [O-]N=O IOVCWXUNBOPUCH-UHFFFAOYSA-M 0.000 description 1
- 229910000566 Platinum-iridium alloy Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- AZFNGPAYDKGCRB-XCPIVNJJSA-M [(1s,2s)-2-amino-1,2-diphenylethyl]-(4-methylphenyl)sulfonylazanide;chlororuthenium(1+);1-methyl-4-propan-2-ylbenzene Chemical compound [Ru+]Cl.CC(C)C1=CC=C(C)C=C1.C1=CC(C)=CC=C1S(=O)(=O)[N-][C@@H](C=1C=CC=CC=1)[C@@H](N)C1=CC=CC=C1 AZFNGPAYDKGCRB-XCPIVNJJSA-M 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 239000002671 adjuvant Substances 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000006258 conductive agent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000002659 electrodeposit Substances 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 210000003127 knee Anatomy 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- UUWCBFKLGFQDME-UHFFFAOYSA-N platinum titanium Chemical compound [Ti].[Pt] UUWCBFKLGFQDME-UHFFFAOYSA-N 0.000 description 1
- HWLDNSXPUQTBOD-UHFFFAOYSA-N platinum-iridium alloy Chemical class [Ir].[Pt] HWLDNSXPUQTBOD-UHFFFAOYSA-N 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 235000010289 potassium nitrite Nutrition 0.000 description 1
- 239000004304 potassium nitrite Substances 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 235000015598 salt intake Nutrition 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 235000010288 sodium nitrite Nutrition 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
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- Electroplating And Plating Baths Therefor (AREA)
Abstract
The invention discloses a platinum electroplating solution containing dipotassium tetrakis(nitrito-N)platinate and an electroplating method adopting the platinum electroplating solution. The platinum electroplating solution comprises 4-6 g/L of dipotassium tetrakis(nitrito-N)platinate which is measured by the content of platinum, 100-140 g/L of water-soluble phosphate which is measured by the content of phosphate radical, 4-8 mg/L of sodium dodecyl benzene sulfonate or dodecylbenzene sulfonic acid, and the balance of nitrosalicylic acid which can be utilized for adjusting the pH value of the platinum electroplating solution to be 1-2. Dipotassium tetrakis(nitrito-N)platinate is utilized as a platinum main salt, phosphate is utilized as a brightener salt, dodecylbenzene sulfonic acid is utilized as an additive, and nitrosalicylic acid is utilized for enabling the platinum electroplating solution to be acidic through adjustment of the pH value, so that the obtained platinum electroplating solution is relatively high in dispersion force and deep plating capability, and high in cathodic current efficiency and performance; when the platinum electroplating solution is adopted for electroplating under an alkali condition, the obtained plating is low in porosity, and high in brightness and quality.
Description
Technical field
The present invention relates to electroplatinizing technical field, particularly relate to a kind of platinum electroplate liquid and electro-plating method thereof of tetranitro potassium platinate.
Background technology
The superior performance of platinum (Pt), purposes is very extensive.In bullion industry, main as ornament and artwork.In chemical industry, in order to manufacture the catalyzer of senior chemical ware, platinum crucible, electrode and acceleration chemical reaction velocity.Platinum iridium alloy is the material manufacturing fountain pen nib.Especially in the automotive industry, the effect of platinum in vent gas treatment etc. can not be substituted, and consumption almost accounts for the half of platinum industry consumption.Due to.But platinum scarcity of resources, expensive, constrain the application of platinum electrode, thus replace pure platinum goods with platinum plated materials, both reduced costs, there is again the premium properties of platinum anode.
Chinese patent CN101016639 discloses a kind of platinum titanium basal body electric plating platinum coating technique, and this technique adopts Platinic chloride as electroplate liquid.Although this technique technique is comparatively simple, the current efficiency of this plating solution is lower, the poor-performing of plating solution, and the quality of coating is not good yet.
Summary of the invention
In view of this, one aspect of the present invention provides a kind of platinum electroplate liquid of tetranitro potassium platinate, and the plating solution performance of this electroplate liquid is better, and the quality of coating using this plating solution to obtain is higher.
A platinum electroplate liquid for tetranitro potassium platinate, comprises in platinum 4 ~ 6g/L tetranitro potassium platinate, in phosphate radical 100 ~ 140g/L water-soluble phosphate, 4 ~ 8mg/L Sodium dodecylbenzene sulfonate or Witco 1298 Soft Acid, described electroplate liquid pH can be made to be the nitrosalicylic acid of 1 ~ 2 consumption.
Wherein, comprise further in platinum 5.5g/L tetranitro potassium platinate, in phosphate radical 122g/L water-soluble phosphate, 6mg/L Sodium dodecylbenzene sulfonate or Witco 1298 Soft Acid, described electroplate liquid pH can be made to be the nitrosalicylic acid of 1.5 consumptions.
In this electroplate liquid, tetranitro potassium platinate is selected to be main salt.When the content of platinum ion is low, coating gray, even turns black, and improves main salts contg and can improve cathode current density accordingly, accelerates sedimentation velocity.But because platinum valency is high, platinum content will be strict controlled within the scope of 0.02 ~ 0.03mol/L, too high main salt also easily makes the coarse Sodium Nitrite of coating be common-ion effcet salt, can prevent the decomposition of P salt, can obtain the platinum coating of light; But to obtain thicker platinum coating, negative electrode should often movement, and plating piece also repeatedly should be taken out in midway, and wipe burr and plate, because internal stress constantly increases, the thickness depositing the platinum coating obtained in this kind of tank liquor is limited.Meanwhile, add ammonium nitrate and potassium nitrite or sodium as auxiliary salt, the minimizing of the nitrite or nitrate caused because of main salt consumption can be supplemented.
Using nitrosalicylic acid as acid regulator, it can improve cathodic polarization, makes the careful light of coating crystallization.
Take phosphoric acid salt as brightening agent.Phosphoric acid salt can obtain smooth, that glossiness is high, bonding force is good coating.
Except mentioned component, the present invention also can select suitable amounts other in this area the additive commonly used, the such as conven-tional adjuvants such as conductive agent, coordination agent, these all can not damage the characteristic of coating.
The present invention provides a kind of electro-plating method, the better performances of the electroplate liquid that the method adopts on the other hand, higher according to quality of coating prepared by the method.
Use an above-mentioned electroplate liquid electric plating method, comprise the following steps:
(1) electroplate liquid is prepared: in water, dissolve each feed composition form electroplate liquid, described often liter of electroplate liquid contains in platinum 4 ~ 6g tetranitro potassium platinate, in phosphate radical 100 ~ 140g water-soluble phosphate, 4 ~ 8mg Sodium dodecylbenzene sulfonate or Witco 1298 Soft Acid, and described electroplate liquid pH can be made to be the nitrosalicylic acid of 1 ~ 2 consumption;
(2) insert in described electroplate liquid with the base material of electroplated and pass into electric current, apply ultrasonic wave simultaneously and electroplate.
Wherein, described electric current is monopulse rectangular wave current; The pulsewidth of described monopulse rectangular wave current is 0.5 ~ 1ms, and dutycycle is 5 ~ 30%, and average current density is 2 ~ 4A/dm
2.
Wherein, in described step (2), the temperature of electroplate liquid is 80 ~ 90 DEG C.
Wherein, in described step (2), the time of plating is 20 ~ 40min.
Wherein, in described step (2), the anode of plating and the area ratio of negative electrode are (1 ~ 4): 1.
Wherein, in described step (2), described base material is nickel, titanium, tantalum, copper or silver.
Carry out under being plated on Ultrasonic Conditions in the present invention.Hyperacoustic applying mode can adopt ultrasonic generator.The present invention without particular requirement, can adopt commercially available to the concrete model of ultrasonic generator and structure.The hyperacoustic actual conditions of ultrasonic generator, such as ultrasonic power, frequency etc., also have no special requirements, and specifically can select according to practical situation.
Monopulse rectangular wave current is defined as at t
1passing into current density in time is J
pelectric current, at t
2without passing into electric current in time, it is a kind of intermittent pulse current.Dutycycle is defined as t
1/ (t
1+ t
2), frequency is 1/ (t
1+ t
2), mean current is defined as J
pt
1/ (t
1+ t
2).Compare with DC electrodeposition, thickness and the ion concentration distribution of electrostatic double layer all change; While adding electrochemical polarization, reduce concentration polarization, the direct effect of generation is, the coating that pulse plating obtains than DC electrodeposition coating evenly, crystallization is finer and closely woven.Moreover, pulse plating also has: hardness and the wear resistance of (1) coating are all high; (2) solution dispersibility and covering power good; (3) decrease the super plating of part edge, coating distributing homogeneity is good, can save plating solution usage quantity.
The present invention does not add restriction to the process of plating piece after the treatment process of the base material of electroplated before plating and plating, can take conventional pretreatment process, such as cleaning before copper plating, polishing etc.The selection of the electrode of plating also can adopt conventional method to carry out.
The present invention with tetranitro potassium platinate for the main salt of platinum, using phosphoric acid salt as brightening agent salt, take Witco 1298 Soft Acid as additive, be what regulate plating solution pH to be acidity with nitrosalicylic acid, the plating solution of acquisition is made to have good dispersion force and covering power thus, cathode efficiency is high, and plating solution performance is excellent.The porosity that employing electroplates the coating of acquisition in the basic conditions at plating solution is low, and luminance brightness is high, and quality of coating is good.
Embodiment
Technical scheme of the present invention is further illustrated below in conjunction with embodiment.
Embodiment 1
The formula of electroplate liquid is as follows:
Plating technology condition: the pulsewidth of monopulse rectangular wave current is 0.5ms, and dutycycle is 30%, and average current density is 2A/dm
2; Temperature is 80 DEG C, and electroplating time is 40min.
Embodiment 2
The formula of electroplate liquid is as follows:
Plating technology condition: the pulsewidth of monopulse rectangular wave current is 0.6ms, and dutycycle is 25%, and average current density is 2.5A/dm
2; Temperature is 80 DEG C, and electroplating time is 35min.
Embodiment 3
The formula of electroplate liquid is as follows:
Plating technology condition: the pulsewidth of monopulse rectangular wave current is 0.8ms, and dutycycle is 20%, and average current density is 3A/dm
2; Temperature is 80 DEG C, and electroplating time is 20min.
Embodiment 4
The formula of electroplate liquid is as follows:
Plating technology condition: the pulsewidth of monopulse rectangular wave current is 1ms, and dutycycle is 15%, and average current density is 3.5A/dm
2; Temperature is 85 DEG C, and electroplating time is 25min.
Embodiment 5
The formula of electroplate liquid is as follows:
Plating technology condition: the pulsewidth of monopulse rectangular wave current is 0.9ms, and dutycycle is 5%, and average current density is 4A/dm
2; Temperature is 85 DEG C, and electroplating time is 30min.
Embodiment 6
The formula of electroplate liquid is as follows:
Plating technology condition: the pulsewidth of monopulse rectangular wave current is 0.7ms, and dutycycle is 10%, and average current density is 3.5A/dm
2; Temperature is 85 DEG C, and electroplating time is 35min.
With reference to following methods, dispersive ability test is carried out to the plating solution of embodiment 1 ~ 6:
The dispersive ability of plating solution adopts far and near cathode method (Haring-Blue method) to measure.Measure the Hull groove that groove adopts the HullCell267ml model of Kocour company of the U.S., interior dimensions is 150mm × 50mm × 70mm.Negative electrode selects thickness to be the copper sheet of 0.5mm, and working face is of a size of 50mm × 50mm; Anode is plating nickel plate with holes; Plating electric current 1A, electroplating time 30min.
The dispersive ability calculation formula of plating solution is:
Dispersive ability=[K-(the Δ M of plating solution
1/ Δ M
2)]/(K-1) (result represents with percentage);
In formula, K is negative electrode far away to the distance of anode and nearly negative electrode to the ratio of distances constant of anode, and in this test, K gets 2; Δ M
1for the increment (g) after plating on nearly negative electrode; Δ M
2for the increment (g) after plating on negative electrode far away.
With reference to following methods, covering power test is carried out to the plating solution of embodiment 1 ~ 6:
Endoporus method is adopted to measure.Negative electrode selects internal diameter l10mm, and pipe range is the copper pipe of 50mm, and one end is closed.During test, the distance of the mouth of pipe and anode is fixed on 80mm, test current 0.2A, electroplating time 30min.According to following formulae discovery:
Covering power=endoporus coating length/pipe range (result represents with percentage).
With reference to following methods, current efficiency test is carried out to the plating solution of embodiment 1 ~ 6:
Copper voltameter method is adopted to measure.Negative electrode to be tested and copper voltameter cleaned and dry up rear electronic scale weighing, then insert in electrodeposit groove by two negative electrodes simultaneously, be energized 10 ~ 30min, take out and clean dry up after use electronic scale weighing.According to following formulae discovery:
Current efficiency=(1.186 × cathode quality to be measured)/(electrochemical equivalent of copper voltameter quality × cathodic deposition metal to be measured) × 100%.Here, electrochemical equivalent=molar mass ÷ (depositing ions valency × 26.8), unit is g.A
-1.h
-1.In this test, divalence Pt electrochemical equivalent is 3.640g.A
-1.h
-1.
Speed test is plated with reference to the plating solution of following methods to embodiment 1 ~ 6:
Mass method is adopted to measure sedimentation rate.Be 10 with sensitivity
-4electronic balance weighing sample plating before and after quality.By the acquisition sedimentation rate of poor quality of unit time, unit surface, press formulae discovery below:
Plating speed=(after plating before sample mass-plating sample mass)/(specimen surface to be plated long-pending × plating time).Each Data duplication is measured three times and is got its mean value.
Test with reference to the bonding force of following methods to the coating of embodiment 1 ~ 6:
The method adopting line to draw lattice measures the bonding force of coating, is specially: being 30 degree with one cutting edge by electrodeposition cladding, converted steel draws parallel lines or the 1mm that 2mm of being separated by drawn by cutter
2square lattice.Whether the coating observing line tilts or peels off.Should master the dynamics during line, a cutter just can scratch coating, arrives matrix metal.Adopt quench to measure the bonding force of coating, be specially: the test piece of having plated is placed in retort furnace quenching in the cold water being heated to 300 DEG C of insulation 30min taking-up immersion 10 DEG C immediately, observe coating and whether occur bubble and decortication phenomenon.
With reference to following methods, toughness test is carried out to the coating of embodiment 1 ~ 6:
Coating is stripped down, is bent to 180 °, and extrudes knee, observe coating and whether occur fracture.
With reference to following methods, porosity test is carried out to the coating of embodiment 1 ~ 6:
The large young pathbreaker of porosity is directly connected to the corrosion resisting property of coating, adopts paster method to press GB5935-86 standard detection.The etchant solution that the potassium ferricyanide solution of 10g/L and the sodium chloride solution of 20g/L are tested as porosity.Operation steps is: after wiped clean of being deoiled by coating surface, is close to coating surface with the filter paper soaking into etchant solution, and the two can not have gap.Buy the fully wetting filter paper of etchant solution solution by glass stick or degreasing swab stick, supplement a solution at interval of lmin, taken off by filter paper after 5min, dry after clean with distilled water flushing, record hole is counted.Be placed on cleaned glass plate and dry, the number of number Bluepoint.Substitute into formulae discovery voidage below:
Number/tested area (individual/the cm of porosity=spot
2);
When calculating number of apertures, do following calculating by spot diameter size: hot spot diameter is less than lmm, and with a porosimeter at often; Be greater than lmm and be less than 3mm often o'clock with three porosimeters; Be greater than 3mm and be less than 5mm, often with ten porosimeters.
With reference to following methods, Surface flat test is carried out to the coating of embodiment 1 ~ 6:
By the Hull groove of the HullCell267ml model with the Kocour company of the test piece U.S. after 200 order sand paperings evenly at 3A/dm
2dC current density carries out plating 10min at 25 DEG C of temperature, and whether then observe test piece has scratch.
To expose aptitude tests with reference to the coating of following methods to embodiment 1 ~ 6:
Adopt the Hull groove of the HullCell267ml model of Kocour company of the U.S. at 3A/dm
2after DC current density carries out plating 10min at 25 DEG C of temperature, observe the surface luminous intensity of coating.
The test result of the coating of embodiment 1 ~ 6 and comparative example and the performance of plating solution is as follows:
As can be seen from the above table, in embodiment 1 ~ 6, consider from the integration test effect of plating solution and coating, the dispersive ability of the formula plating solution of embodiment 6, covering power, current efficiency and plating speed, the porosity of coating and bonding force will be got well compared with other embodiment.Thus, this formula is screening formulation of the present invention, and the preferred plating conditions of its correspondence is the pulsewidth of monopulse rectangular wave current is 0.7ms, and dutycycle is 10%, and average current density is 3.5A/dm
2; Temperature is 85 DEG C, and electroplating time is 35min, and male and femal face is long-pending than being 3:1.
It should be noted that and understand, when not departing from the spirit and scope of accompanying claim the present invention for required protection, various amendment and improvement can be made to the present invention of foregoing detailed description.Therefore, the scope of claimed technical scheme is not by the restriction of given any specific exemplary teachings.
Below know-why of the present invention is described in conjunction with specific embodiments.These describe just in order to explain principle of the present invention, and can not be interpreted as limiting the scope of the invention by any way.Based on explanation herein, those skilled in the art does not need to pay performing creative labour can associate other embodiment of the present invention, and these modes all will fall within protection scope of the present invention.
Claims (9)
1. the platinum electroplate liquid of a tetranitro potassium platinate, it is characterized in that, comprise in platinum 4 ~ 6g/L tetranitro potassium platinate, in phosphate radical 100 ~ 140g/L water-soluble phosphate, 4 ~ 8mg/L Sodium dodecylbenzene sulfonate or Witco 1298 Soft Acid, described electroplate liquid pH can be made to be the nitrosalicylic acid of 1 ~ 2 consumption.
2. electroplate liquid according to claim 1, it is characterized in that, comprise in platinum 5.5g/L tetranitro potassium platinate, in phosphate radical 122g/L water-soluble phosphate, 6mg/L Sodium dodecylbenzene sulfonate or Witco 1298 Soft Acid, described electroplate liquid pH can be made to be the nitrosalicylic acid of 1.5 consumptions.
3. electroplate liquid according to claim 1, is characterized in that, described water-soluble phosphate be selected from diammonium hydrogen phosphate, Sodium phosphate dibasic, SODIUM PHOSPHATE, MONOBASIC any one or two or more.
4. an electric plating method, is characterized in that, comprises the following steps:
(1) electroplate liquid is prepared: in water, dissolve each feed composition form electroplate liquid, described often liter of electroplate liquid contains in platinum 4 ~ 6g tetranitro potassium platinate, in phosphate radical 100 ~ 140g water-soluble phosphate, 4 ~ 8mg Sodium dodecylbenzene sulfonate or Witco 1298 Soft Acid, and described electroplate liquid pH can be made to be the nitrosalicylic acid of 1 ~ 2 consumption;
(2) insert in described electroplate liquid with the base material of electroplated and pass into electric current, apply ultrasonic wave simultaneously and electroplate.
5. want the method described in 4 according to right, it is characterized in that, described electric current is monopulse rectangular wave current; The pulsewidth of described monopulse rectangular wave current is 0.5 ~ 1ms, and dutycycle is 5 ~ 30%, and average current density is 2 ~ 4A/dm
2.
6. method according to claim 4, is characterized in that, in described step (2), the temperature of electroplate liquid is 80 ~ 90 DEG C.
7. method according to claim 4, is characterized in that, in described step (2), the time of plating is 20 ~ 40min.
8. method according to claim 4, is characterized in that, in described step (2), the anode of plating and the area ratio of negative electrode are (1 ~ 4): 1.
9. method according to claim 4, is characterized in that, in described step (2), described base material is nickel, titanium, tantalum, copper or silver.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| RU2788909C1 (en) * | 2022-03-04 | 2023-01-25 | Акционерное общество "Екатеринбургский завод по обработке цветных металлов" | Method for manufacturing a catalyst by electrochemical deposition of platinum |
| CN115787011A (en) * | 2022-12-16 | 2023-03-14 | 西北有色金属研究院 | Electroplating solution and electroplating method for preparing platinum coating on the surface of titanium collector for hydrogen production by electrolysis of water |
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|---|---|---|---|---|
| CN102430199A (en) * | 2011-12-02 | 2012-05-02 | 李开华 | Preparation method of electrochemical treatment sensing element |
| CN103789764A (en) * | 2012-10-30 | 2014-05-14 | 三菱电机株式会社 | Method of manufacturing semiconductor device, and semiconductor device |
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- 2015-09-21 CN CN201510604080.6A patent/CN105112957A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102430199A (en) * | 2011-12-02 | 2012-05-02 | 李开华 | Preparation method of electrochemical treatment sensing element |
| CN103789764A (en) * | 2012-10-30 | 2014-05-14 | 三菱电机株式会社 | Method of manufacturing semiconductor device, and semiconductor device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2788909C1 (en) * | 2022-03-04 | 2023-01-25 | Акционерное общество "Екатеринбургский завод по обработке цветных металлов" | Method for manufacturing a catalyst by electrochemical deposition of platinum |
| CN115787011A (en) * | 2022-12-16 | 2023-03-14 | 西北有色金属研究院 | Electroplating solution and electroplating method for preparing platinum coating on the surface of titanium collector for hydrogen production by electrolysis of water |
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Application publication date: 20151202 |