CN106757208A - A kind of Ni-Pd alloy crosses liquid and its application - Google Patents
A kind of Ni-Pd alloy crosses liquid and its application Download PDFInfo
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- CN106757208A CN106757208A CN201611073004.8A CN201611073004A CN106757208A CN 106757208 A CN106757208 A CN 106757208A CN 201611073004 A CN201611073004 A CN 201611073004A CN 106757208 A CN106757208 A CN 106757208A
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- 239000007788 liquid Substances 0.000 title claims abstract description 26
- 229910001252 Pd alloy Inorganic materials 0.000 title claims abstract description 15
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims abstract description 42
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims abstract description 24
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 21
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 13
- COLNVLDHVKWLRT-QMMMGPOBSA-N L-phenylalanine Chemical compound OC(=O)[C@@H](N)CC1=CC=CC=C1 COLNVLDHVKWLRT-QMMMGPOBSA-N 0.000 claims abstract description 12
- 235000011114 ammonium hydroxide Nutrition 0.000 claims abstract description 12
- 125000003963 dichloro group Chemical group Cl* 0.000 claims abstract description 12
- DITXJPASYXFQAS-UHFFFAOYSA-N nickel;sulfamic acid Chemical compound [Ni].NS(O)(=O)=O DITXJPASYXFQAS-UHFFFAOYSA-N 0.000 claims abstract description 12
- COLNVLDHVKWLRT-UHFFFAOYSA-N phenylalanine Natural products OC(=O)C(N)CC1=CC=CC=C1 COLNVLDHVKWLRT-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000002904 solvent Substances 0.000 claims abstract description 12
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 claims abstract description 11
- 235000019270 ammonium chloride Nutrition 0.000 claims abstract description 11
- 239000008139 complexing agent Substances 0.000 claims abstract description 10
- -1 pH8.8 ~ 9.2 Substances 0.000 claims abstract description 9
- PSZYNBSKGUBXEH-UHFFFAOYSA-N naphthalene-1-sulfonic acid Chemical class C1=CC=C2C(S(=O)(=O)O)=CC=CC2=C1 PSZYNBSKGUBXEH-UHFFFAOYSA-N 0.000 claims abstract 2
- 238000009713 electroplating Methods 0.000 claims description 13
- KVBGVZZKJNLNJU-UHFFFAOYSA-N naphthalene-2-sulfonic acid Chemical class C1=CC=CC2=CC(S(=O)(=O)O)=CC=C21 KVBGVZZKJNLNJU-UHFFFAOYSA-N 0.000 claims description 10
- KWYJDIUEHHCHCZ-UHFFFAOYSA-N 3-[2-[bis(2-carboxyethyl)amino]ethyl-(2-carboxyethyl)amino]propanoic acid Chemical compound OC(=O)CCN(CCC(O)=O)CCN(CCC(O)=O)CCC(O)=O KWYJDIUEHHCHCZ-UHFFFAOYSA-N 0.000 claims description 7
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 7
- NLVWBYNKMPGKRG-ODZAUARKSA-N azane;(z)-but-2-enedioic acid Chemical compound N.OC(=O)\C=C/C(O)=O NLVWBYNKMPGKRG-ODZAUARKSA-N 0.000 claims description 6
- DVECLMOWYVDJRM-UHFFFAOYSA-N pyridine-3-sulfonic acid Chemical compound OS(=O)(=O)C1=CC=CN=C1 DVECLMOWYVDJRM-UHFFFAOYSA-N 0.000 claims description 6
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 4
- WXHLLJAMBQLULT-UHFFFAOYSA-N 2-[[6-[4-(2-hydroxyethyl)piperazin-1-yl]-2-methylpyrimidin-4-yl]amino]-n-(2-methyl-6-sulfanylphenyl)-1,3-thiazole-5-carboxamide;hydrate Chemical compound O.C=1C(N2CCN(CCO)CC2)=NC(C)=NC=1NC(S1)=NC=C1C(=O)NC1=C(C)C=CC=C1S WXHLLJAMBQLULT-UHFFFAOYSA-N 0.000 claims description 3
- 239000002253 acid Substances 0.000 claims description 2
- 229910021529 ammonia Inorganic materials 0.000 claims description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical group C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 claims 2
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 claims 1
- 238000005660 chlorination reaction Methods 0.000 claims 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 claims 1
- 239000011248 coating agent Substances 0.000 abstract description 12
- 238000000576 coating method Methods 0.000 abstract description 12
- 238000007747 plating Methods 0.000 abstract description 3
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 230000005587 bubbling Effects 0.000 abstract 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 7
- 229910052737 gold Inorganic materials 0.000 description 7
- 239000010931 gold Substances 0.000 description 7
- 229910000990 Ni alloy Inorganic materials 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 6
- 239000008199 coating composition Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 3
- 229960004889 salicylic acid Drugs 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 125000000020 sulfo group Chemical group O=S(=O)([*])O[H] 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 239000005864 Sulphur Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 229910000648 terne Inorganic materials 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/567—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of platinum group metals
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
Liquid, including following component are crossed the invention discloses a kind of Ni-Pd alloy：0.1 ~ 0.2mol/L of nickel sulfamic acid, the 0.4 ~ 0.5mol/L of ammino palladium of dichloro four, the mol/L of ammoniacal liquor 0.1 ~ 0.5, the mol/L of sal-ammoniac 0.01 ~ 0.03,0.001 ~ 0.003mol/L of isopropanol,β‑0.001 ~ 0.002mol/L of naphthalene sulfonic acids, 0.001 ~ 0.002mol/L of TYR, 0.002 ~ 0.003mol/L of phenylalanine, brightener, complexing agent, pH8.8 ~ 9.2, solvent is water.Plating palladium layers are examined under a microscope, palladium layers are careful, flawless, color is uniform, and coating is without peeling, bubbling phenomenon, and adhesive force is good.
Description
Technical field
The invention belongs to metal plating liquid technical field, and in particular to a kind of Ni-Pd alloy crosses liquid and its application.
Background technology
Gold plate is widely used in electronics industry, jewellery and horological industry.Development, people's lives water with electronics industry
Flat raising, it is necessary to gold amount it is increasing, for save resources, reduce product cost, countries in the world all take much arranges
Apply saving gold.The selection of cash equivalent material has caused the attention of people abroad, such as using electrosilvering, tin, terne metal, tin
The coating such as nickel alloy, palladium, palladium-nickel alloy replace gold or part cash equivalent coating.And, some replacement coating has been used for production.It is such as right
Quality of coating requirement connector higher, gold plate is replaced with palladium or palladium-nickel alloy coating, is applied in the industrial production.
China begins one's study to palladium-nickel alloy cash equivalent coating in late 1970s.Palladium-nickel alloy coating and proof gold coating
Compare, cost can reduce by 20%~80% (palladium valency is usually the l/3 of price of gold), be a kind of comparatively ideal cash equivalent coating.In recent years,
Domestic and international plating worker has made extensive work to aspects such as the performance test of palladium-nickel alloy coating and electroplating technologies, and obtains one
Determine effect.
The content of the invention
The technical problem to be solved in the present invention is to provide a kind of Ni-Pd alloy and crosses liquid and its application.
In order to solve the above technical problems, the present invention is adopted the following technical scheme that：
A kind of Ni-Pd alloy crosses liquid, including following component：
0.1~0.2mol/L of nickel sulfamic acid, the 0.4~0.5mol/L of ammino palladium of dichloro four, 0.1~0.5mol/L of ammoniacal liquor,
0.01~0.03mol/L of sal-ammoniac, 0.001~0.003mol/L of isopropanol, 0.001~0.002mol/L of beta-naphthalenesulfonic-acid, network ammonia
It is 0.001~0.002mol/L of acid, 0.002~0.003mol/L of phenylalanine, 0.001~0.002mol/L of pyridine-3-sulphonic acid, suitable
Butene dioic acid 0.03~0.04mol/L of ammonium, pH8.8~9.2, solvent is water.
Preferably, including following component：
Nickel sulfamic acid 0.15mol/L, the ammino palladium 0.4mol/L of dichloro four, ammoniacal liquor 0.3mol/L, sal-ammoniac 0.02mol/
L, isopropanol 0.002mol/L, beta-naphthalenesulfonic-acid 0.001mol/L, TYR 0.001mol/L, phenylalanine 0.002mol/L, light
Bright dose, complexing agent, pH8.8~9.2, solvent is water.
Preferably, including following component：
Nickel sulfamic acid 0.2mol/L, the ammino palladium 0.5mol/L of dichloro four, ammoniacal liquor 0.4mol/L, sal-ammoniac 0.02mol/L,
Isopropanol 0.002mol/L, beta-naphthalenesulfonic-acid 0.002mol/L, TYR 0.002mol/L, phenylalanine 0.002mol/L, light
Agent, complexing agent, pH8.8~9.2, solvent is water.
Preferably, including following component：
Nickel sulfamic acid 0.15mol/L, the ammino palladium 0.45mol/L of dichloro four, ammoniacal liquor 0.5mol/L, sal-ammoniac 0.01mol/
L, isopropanol 0.003mol/L, beta-naphthalenesulfonic-acid 0.0018mol/L, TYR 0.0015mol/L, phenylalanine 0.0026mol/L,
Brightener, complexing agent, pH8.8~9.2, solvent is water.
Wherein, described complexing agent be sulfosalicylic acid, ethylenediamine tetrapropionic acid, the mixture of triethanolamine, wherein, sulfo group
0.03~0.05mol/L of salicylic acid, 0.06~0.08mol/L of ethylenediamine tetrapropionic acid, 0.02~0.03mol/L of triethanolamine.
Wherein, described brightener be pyridine-3-sulphonic acid, the mixture of maleic acid ammonium, wherein, pyridine-3-sulphonic acid
0.001~0.002mol/L, 0.03~0.04mol/L of maleic acid ammonium.
The application that above-mentioned Ni-Pd alloy is crossed in the field of electroplating of liquid.
Wherein, electroplating temperature is 25~35 DEG C, and current density is 0.1~2.0A/dm 2, and voltage is 4~6V.
Beneficial effect：
The present invention provide palladium cross liquid electroplating technology it is simple, it is easy to expanding production, and utilization this cross liquid energy in metal zero
The high-purity light Ni-Pd alloy coating of part surface formation reason function admirable.
Specific embodiment
According to following embodiments, the present invention may be better understood.However, as it will be easily appreciated by one skilled in the art that real
Apply the content described by example and be merely to illustrate the present invention, without should also without limitation on sheet described in detail in claims
Invention.
Embodiment 1：Influences of the pH to coating composition and current efficiency.
Electroplate liquid composition is as follows：
Nickel sulfamic acid 0.15mol/L, the ammino palladium 0.4mol/L of dichloro four, ammoniacal liquor 0.3mol/L, sal-ammoniac 0.02mol/
L, isopropanol 0.002mol/L, beta-naphthalenesulfonic-acid 0.001mol/L, TYR 0.001mol/L, phenylalanine 0.002mol/L, sulphur
Base salicylic acid 0.04mol/L, ethylenediamine tetrapropionic acid 0.06mol/L, triethanolamine 0.02mol/L, pH8.8~9.2, solvent is
Water.
Electro-plating method：
The copper sheet that will be cleaned is put into palladium and crosses in liquid, and current density is 0.1~0.3A/dm 2, crosses 28 DEG C of liquid temperature degree, groove pressure
4V。
Electroplating effect：From table 1 it follows that pH value electroplating effect between 8.2~9.2.
Influences of the pH of table 1 to coating composition and current efficiency
Embodiment 2：
Electroplate liquid composition is as follows：
Nickel sulfamic acid 0.2mol/L, the ammino palladium 0.5mol/L of dichloro four, ammoniacal liquor 0.4mol/L, sal-ammoniac 0.02mol/L,
Isopropanol 0.002mol/L, beta-naphthalenesulfonic-acid 0.002mol/L, TYR 0.002mol/L, phenylalanine 0.002mol/L, sulfo group
Salicylic acid 0.05mol/L, ethylenediamine tetrapropionic acid 0.08mol/L, triethanolamine 0.03mol/L, pyridine-3-sulphonic acid 0.002mol/
L, maleic acid ammonium 0.04mol/L, pH8.8~9.2, solvent is water.
Electro-plating method：The copper alloy that will be cleaned is put into palladium and crosses in liquid, and current density is 0.1~0.5.A/dm 2, crosses liquid
35 DEG C of temperature, groove pressure 4V.
Electroplating effect：Current density effect in 0.5~1.0 is best as can be seen from Table 2.
Influence of the current density of table 2 to coating composition and current efficiency
Embodiment 3：
Electroplate liquid composition is as follows：
Nickel sulfamic acid 0.15mol/L, the ammino palladium 0.45mol/L of dichloro four, ammoniacal liquor 0.5mol/L, sal-ammoniac 0.01mol/
L, isopropanol 0.003mol/L, beta-naphthalenesulfonic-acid 0.0018mol/L, TYR 0.0015mol/L, phenylalanine 0.0026mol/L,
Sulfosalicylic acid 0.03mol/L, ethylenediamine tetrapropionic acid 0.07mol/L, triethanolamine 0.025mol/L, pyridine-3-sulphonic acid
0.0015mol/L, maleic acid ammonium 0.034mol/L, pH8.8~9.2, solvent is water.
Electro-plating method：
The copper alloy that will be cleaned is put into palladium and crosses in liquid, and current density is 0.1~0.5.A/dm 2, crosses liquid temperature degree 15~40
DEG C, groove pressure 4V.
Electroplating effect：Testing result is shown in Table 3
Influence of the temperature of table 2 to coating composition and current efficiency
Claims (8)
1. a kind of Ni-Pd alloy crosses liquid, it is characterised in that including following component：
0.1 ~ 0.2mol/L of nickel sulfamic acid, the 0.4 ~ 0.5mol/L of ammino palladium of dichloro four, the mol/L of ammoniacal liquor 0.1 ~ 0.5, chlorination
The mol/L of ammonia 0.01 ~ 0.03,0.001 ~ 0.003mol/L of isopropanol,β-0.001 ~ 0.002mol/L of naphthalene sulfonic acids, TYR 0.001
~ 0.002mol/L, 0.002 ~ 0.003mol/L of phenylalanine, brightener, complexing agent, pH8.8 ~ 9.2, solvent is water.
2. Ni-Pd alloy according to claim 1 crosses liquid, it is characterised in that including following component：
Nickel sulfamic acid 0.15mol/L, the ammino palladium 0.4mol/L of dichloro four, the mol/L of ammoniacal liquor 0.3, the mol/ of sal-ammoniac 0.02
L, isopropanol 0.002mol/L,β-Naphthalene sulfonic acids 0.001mol/L, TYR 0.001mol/L, phenylalanine 0.002mol/L, light
Bright dose, complexing agent, pH8.8 ~ 9.2, solvent is water.
3. Ni-Pd alloy according to claim 1 crosses liquid, it is characterised in that including following component：
Nickel sulfamic acid 0.2mol/L, the ammino palladium 0.5mol/L of dichloro four, the mol/L of ammoniacal liquor 0.4, the mol/ of sal-ammoniac 0.02
L, isopropanol 0.002mol/L,β-Naphthalene sulfonic acids 0.002mol/L, TYR 0.002mol/L, phenylalanine 0.002mol/L, light
Bright dose, complexing agent, pH8.8 ~ 9.2, solvent is water.
4. Ni-Pd alloy according to claim 1 crosses liquid it is characterised in that it includes following component：
Nickel sulfamic acid 0.15mol/L, the ammino palladium 0.45mol/L of dichloro four, the mol/L of ammoniacal liquor 0.5, sal-ammoniac 0.01
Mol/L, isopropanol 0.003mol/L,Beta-naphthalenesulfonic-acid0.0018mol/L, TYR 0.0015mol/L, phenylalanine
0.0026mol/L, brightener, complexing agent, pH8.8 ~ 9.2, solvent is water.
5. liquid is crossed according to any described Ni-Pd alloy of claim 1 ~ 4, it is characterised in that described complexing agent is sulfosalisylic
Acid, ethylenediamine tetrapropionic acid, the mixture of triethanolamine, wherein, the mol/L of sulfosalicylic acid 0.03 ~ 0.05, ethylenediamine tetrapropionic acid
0.06 ~ 0.08 mol/L, the mol/L of triethanolamine 0.02 ~ 0.03.
6. liquid is crossed according to any described Ni-Pd alloy of claim 1 ~ 4, it is characterised in that described brightener is pyridine -3-
The mixture of sulfonic acid, maleic acid ammonium, wherein, 0.001 ~ 0.002mol/L of pyridine-3-sulphonic acid, maleic acid ammonium 0.03 ~
0.04mol/L。
7. the application that any Ni-Pd alloy of claim 1 ~ 4 is crossed in the field of electroplating of liquid.
8. application according to claim 5, it is characterised in that electroplating temperature be 25 ~ 35 DEG C, current density be 0.1 ~
2.0A/dm 2, voltage is 4 ~ 6V.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611073004.8A CN106757208A (en) | 2016-11-29 | 2016-11-29 | A kind of Ni-Pd alloy crosses liquid and its application |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611073004.8A CN106757208A (en) | 2016-11-29 | 2016-11-29 | A kind of Ni-Pd alloy crosses liquid and its application |
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| CN106757208A true CN106757208A (en) | 2017-05-31 |
Family
ID=58904345
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| CN201611073004.8A Pending CN106757208A (en) | 2016-11-29 | 2016-11-29 | A kind of Ni-Pd alloy crosses liquid and its application |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107829114A (en) * | 2017-11-28 | 2018-03-23 | 江苏澳光电子有限公司 | A kind of terminal surfaces electroplate liquid and its application |
| CN107858718A (en) * | 2017-11-28 | 2018-03-30 | 江苏澳光电子有限公司 | A kind of palladium plating solution and its application for plastic surface galvanizing |
| CN107904631A (en) * | 2017-11-28 | 2018-04-13 | 江苏澳光电子有限公司 | A kind of plating solution and its application for stainless steel surface palladium plating |
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| CN101838830A (en) * | 2010-05-07 | 2010-09-22 | 厦门大学 | Electrolyte of electroplating palladium-nickel alloy |
| CN105401182A (en) * | 2015-10-14 | 2016-03-16 | 佛山科学技术学院 | Plating solution formula and electroplating method for electroplating thick palladium on stainless steel |
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- 2016-11-29 CN CN201611073004.8A patent/CN106757208A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101838830A (en) * | 2010-05-07 | 2010-09-22 | 厦门大学 | Electrolyte of electroplating palladium-nickel alloy |
| CN105401182A (en) * | 2015-10-14 | 2016-03-16 | 佛山科学技术学院 | Plating solution formula and electroplating method for electroplating thick palladium on stainless steel |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107829114A (en) * | 2017-11-28 | 2018-03-23 | 江苏澳光电子有限公司 | A kind of terminal surfaces electroplate liquid and its application |
| CN107858718A (en) * | 2017-11-28 | 2018-03-30 | 江苏澳光电子有限公司 | A kind of palladium plating solution and its application for plastic surface galvanizing |
| CN107904631A (en) * | 2017-11-28 | 2018-04-13 | 江苏澳光电子有限公司 | A kind of plating solution and its application for stainless steel surface palladium plating |
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