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CN101547770A - Cmp修整器和其制备方法 - Google Patents

Cmp修整器和其制备方法 Download PDF

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Publication number
CN101547770A
CN101547770A CNA2007800355219A CN200780035521A CN101547770A CN 101547770 A CN101547770 A CN 101547770A CN A2007800355219 A CNA2007800355219 A CN A2007800355219A CN 200780035521 A CN200780035521 A CN 200780035521A CN 101547770 A CN101547770 A CN 101547770A
Authority
CN
China
Prior art keywords
mentioned
protective layer
layer
metal
cmp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2007800355219A
Other languages
English (en)
Chinese (zh)
Inventor
山下哲二
力田直树
木村高志
尾久雅治
芦泽宏明
鸠野广典
常田昌广
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toto Ltd
Mitsubishi Materials Corp
Original Assignee
Toto Ltd
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toto Ltd, Mitsubishi Materials Corp filed Critical Toto Ltd
Publication of CN101547770A publication Critical patent/CN101547770A/zh
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
    • B24D3/08—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements for close-grained structure, e.g. using metal with low melting point
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
CNA2007800355219A 2006-09-25 2007-09-21 Cmp修整器和其制备方法 Pending CN101547770A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP258894/2006 2006-09-25
JP2006258894A JP4854445B2 (ja) 2006-09-25 2006-09-25 Ｃｍｐコンディショナおよびその製造方法

Publications (1)

Publication Number Publication Date
CN101547770A true CN101547770A (zh) 2009-09-30

Family

ID=39230018

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2007800355219A Pending CN101547770A (zh) 2006-09-25 2007-09-21 Cmp修整器和其制备方法

Country Status (6)

Country Link
US (1) US20090239454A1 (ja)
JP (1) JP4854445B2 (ja)
KR (1) KR20090074741A (ja)
CN (1) CN101547770A (ja)
TW (1) TW200902234A (ja)
WO (1) WO2008038583A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108237467A (zh) * 2016-12-23 2018-07-03 中芯国际集成电路制造(上海)有限公司 一种研磨垫的处理方法
CN109015339A (zh) * 2017-06-12 2018-12-18 中国砂轮企业股份有限公司 研磨工具及其制造方法
CN110091265A (zh) * 2018-01-29 2019-08-06 谢索尔钻石工业株式会社 研磨垫整理器的反镀制造方法及由此制造的研磨垫整理器
TWI806466B (zh) * 2022-03-03 2023-06-21 中國砂輪企業股份有限公司 拋光墊修整器及其製造方法

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2646973C (en) * 2008-12-18 2015-12-01 Sunnen Products Company Honing tool having enhanced wear resistance properties
US8512098B1 (en) * 2010-09-28 2013-08-20 Jeffrey Bonner Machining technique using a plated superabrasive grinding wheel on a swiss style screw machine
TWI422466B (zh) * 2011-01-28 2014-01-11 Advanced Surface Tech Inc 鑽石研磨工具及其製造方法
CN203390712U (zh) * 2013-04-08 2014-01-15 宋健民 化学机械研磨修整器
JP5681826B1 (ja) * 2014-06-16 2015-03-11 嘉五郎 小倉 軸芯測定装置
JP6453666B2 (ja) * 2015-02-20 2019-01-16 東芝メモリ株式会社 研磨パッドドレッサの作製方法
CN110634776B (zh) * 2019-09-18 2022-03-01 西安奕斯伟材料科技有限公司 一种硅片样品的制备装置及制备方法
CN110782779B (zh) * 2019-11-01 2022-05-13 Oppo广东移动通信有限公司 玻璃件及其表面抛光方法、玻璃壳体和电子设备
TWI823456B (zh) * 2022-07-01 2023-11-21 詠巨科技有限公司 修整組件、其製造方法及應用其的組合式修整器

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3334041A (en) * 1964-08-28 1967-08-01 Norton Co Coated abrasives
SE442305B (sv) * 1984-06-27 1985-12-16 Santrade Ltd Forfarande for kemisk gasutfellning (cvd) for framstellning av en diamantbelagd sammansatt kropp samt anvendning av kroppen
US4992082A (en) * 1989-01-12 1991-02-12 Ford Motor Company Method of toughening diamond coated tools
US5206083A (en) * 1989-09-18 1993-04-27 Cornell Research Foundation, Inc. Diamond and diamond-like films and coatings prepared by deposition on substrate that contain a dispersion of diamond particles
SE503038C2 (sv) * 1993-07-09 1996-03-11 Sandvik Ab Diamantbelagt skärande verktyg av hårdmetall eller keramik
US5551959A (en) * 1994-08-24 1996-09-03 Minnesota Mining And Manufacturing Company Abrasive article having a diamond-like coating layer and method for making same
US5688557A (en) * 1995-06-07 1997-11-18 Lemelson; Jerome H. Method of depositing synthetic diamond coatings with intermediates bonding layers
JPH1058306A (ja) * 1996-08-09 1998-03-03 Mitsubishi Materials Corp 研磨布のドレッシング装置および研磨布ドレッシング用砥石
US5921856A (en) * 1997-07-10 1999-07-13 Sp3, Inc. CVD diamond coated substrate for polishing pad conditioning head and method for making same
US6054183A (en) * 1997-07-10 2000-04-25 Zimmer; Jerry W. Method for making CVD diamond coated substrate for polishing pad conditioning head
JP2001210613A (ja) * 2000-01-27 2001-08-03 Allied Material Corp Ｃｍｐ用パッドコンディショナー
JP3609059B2 (ja) * 2002-04-15 2005-01-12 株式会社ノリタケスーパーアブレーシブ Ｃｍｐ加工用ドレッサ
JP4463084B2 (ja) * 2003-11-27 2010-05-12 株式会社オクテック ドレッシング工具
JP5070056B2 (ja) * 2004-09-23 2012-11-07 エレメント シックス （プロプライエタリイ）リミテッド 多結晶研磨材及びその製造方法
JP2007109767A (ja) * 2005-10-12 2007-04-26 Mitsubishi Materials Corp Ｃｍｐコンディショナおよびその製造方法
JP2007260886A (ja) * 2006-03-30 2007-10-11 Mitsubishi Materials Corp Ｃｍｐコンディショナおよびその製造方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108237467A (zh) * 2016-12-23 2018-07-03 中芯国际集成电路制造(上海)有限公司 一种研磨垫的处理方法
CN109015339A (zh) * 2017-06-12 2018-12-18 中国砂轮企业股份有限公司 研磨工具及其制造方法
CN109015339B (zh) * 2017-06-12 2020-09-18 中国砂轮企业股份有限公司 研磨工具及其制造方法
CN110091265A (zh) * 2018-01-29 2019-08-06 谢索尔钻石工业株式会社 研磨垫整理器的反镀制造方法及由此制造的研磨垫整理器
TWI806466B (zh) * 2022-03-03 2023-06-21 中國砂輪企業股份有限公司 拋光墊修整器及其製造方法

Also Published As

Publication number Publication date
JP4854445B2 (ja) 2012-01-18
US20090239454A1 (en) 2009-09-24
JP2008073825A (ja) 2008-04-03
TWI335854B (ja) 2011-01-11
TW200902234A (en) 2009-01-16
KR20090074741A (ko) 2009-07-07
WO2008038583A1 (fr) 2008-04-03

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Application publication date: 20090930