CN100561282C - 数码相机模组 - Google Patents
数码相机模组 Download PDFInfo
- Publication number
- CN100561282C CN100561282C CNB2005100372274A CN200510037227A CN100561282C CN 100561282 C CN100561282 C CN 100561282C CN B2005100372274 A CNB2005100372274 A CN B2005100372274A CN 200510037227 A CN200510037227 A CN 200510037227A CN 100561282 C CN100561282 C CN 100561282C
- Authority
- CN
- China
- Prior art keywords
- image sensing
- camera mould
- carrier
- lens barrel
- numerical camera
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000011521 glass Substances 0.000 claims description 2
- 241000269799 Perca fluviatilis Species 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/806—Optical elements or arrangements associated with the image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/804—Containers or encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/809—Constructional details of image sensors of hybrid image sensors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16151—Cap comprising an aperture, e.g. for pressure control, encapsulation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
- H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
Landscapes
- Transforming Light Signals Into Electric Signals (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Lens Barrels (AREA)
- Studio Devices (AREA)
Abstract
Description
Claims (14)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2005100372274A CN100561282C (zh) | 2005-09-09 | 2005-09-09 | 数码相机模组 |
US11/478,503 US7361880B2 (en) | 2005-09-09 | 2006-06-28 | Digital camera module for detachably mounting with flex printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2005100372274A CN100561282C (zh) | 2005-09-09 | 2005-09-09 | 数码相机模组 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1928605A CN1928605A (zh) | 2007-03-14 |
CN100561282C true CN100561282C (zh) | 2009-11-18 |
Family
ID=37854127
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005100372274A Expired - Fee Related CN100561282C (zh) | 2005-09-09 | 2005-09-09 | 数码相机模组 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7361880B2 (zh) |
CN (1) | CN100561282C (zh) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7498646B2 (en) * | 2006-07-19 | 2009-03-03 | Advanced Chip Engineering Technology Inc. | Structure of image sensor module and a method for manufacturing of wafer level package |
CN101261347A (zh) * | 2007-03-09 | 2008-09-10 | 鸿富锦精密工业(深圳)有限公司 | 相机模组及其制造方法 |
CN100545689C (zh) * | 2007-04-10 | 2009-09-30 | 鸿富锦精密工业(深圳)有限公司 | 相机模组 |
CN101359080B (zh) * | 2007-08-01 | 2011-02-02 | 鸿富锦精密工业(深圳)有限公司 | 相机模组 |
JP4413956B2 (ja) * | 2007-08-21 | 2010-02-10 | 新光電気工業株式会社 | カメラモジュール及び携帯端末機 |
CN101465344B (zh) * | 2007-12-18 | 2011-02-02 | 鸿富锦精密工业(深圳)有限公司 | 影像模组封装结构 |
US7966041B2 (en) * | 2008-01-30 | 2011-06-21 | Sony Ericsson Mobile Communications Ab | Pin mounting of camera module in a radio communication terminal |
CN101770059B (zh) * | 2008-12-27 | 2012-06-20 | 鸿富锦精密工业(深圳)有限公司 | 相机模组 |
CN101998035B (zh) * | 2009-08-24 | 2013-07-03 | 鸿富锦精密工业(深圳)有限公司 | 相机模组及其组装方法 |
CN101814480B (zh) * | 2010-04-16 | 2011-08-31 | 杭州矽力杰半导体技术有限公司 | 一种芯片封装结构及其封装方法 |
JP2012015995A (ja) * | 2010-05-31 | 2012-01-19 | Fujitsu Component Ltd | カメラモジュール及びその製造方法 |
CN102572229A (zh) * | 2010-12-29 | 2012-07-11 | 鸿富锦精密工业(深圳)有限公司 | 摄像模组 |
TWI429279B (zh) * | 2011-08-09 | 2014-03-01 | Hon Hai Prec Ind Co Ltd | 鏡頭模組 |
CN102809797B (zh) * | 2011-12-08 | 2015-01-14 | 苏州科达科技股份有限公司 | 一种精确调整监控产品镜头后焦距的机构 |
US20150103238A1 (en) * | 2013-10-11 | 2015-04-16 | Microsoft Corporation | Interface Geometry for Camera Mounting |
TWI766450B (zh) * | 2020-05-13 | 2022-06-01 | 大陸商廣州立景創新科技有限公司 | 影像擷取模組及其組裝方法 |
CN114402582B (zh) * | 2020-06-23 | 2023-08-22 | 宏启胜精密电子(秦皇岛)有限公司 | 镜头模组及其制作方法 |
TWI762093B (zh) * | 2020-12-18 | 2022-04-21 | 海華科技股份有限公司 | 可攜式電子裝置及其客製化影像擷取模組 |
CN116635769A (zh) | 2021-01-18 | 2023-08-22 | 三星电子株式会社 | 包括微型相机的可穿戴的电子装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3995293A (en) * | 1974-12-18 | 1976-11-30 | Fuji Photo Optical Co., Ltd. | Printed circuit for photographic cameras |
CN1664639A (zh) * | 2004-03-05 | 2005-09-07 | 鸿富锦精密工业(深圳)有限公司 | 数码相机模块 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001203913A (ja) * | 2000-01-21 | 2001-07-27 | Sony Corp | 撮像装置、カメラモジュール及びカメラシステム |
US6649834B1 (en) * | 2002-12-16 | 2003-11-18 | Kingpak Technology Inc. | Injection molded image sensor and a method for manufacturing the same |
US6680525B1 (en) * | 2003-01-09 | 2004-01-20 | Kingpak Technology Inc. | Stacked structure of an image sensor |
US20040251510A1 (en) * | 2003-06-10 | 2004-12-16 | Irving You | Package structure of an image sensor module |
US6870208B1 (en) * | 2003-09-24 | 2005-03-22 | Kingpak Technology Inc. | Image sensor module |
JP4606063B2 (ja) * | 2004-05-14 | 2011-01-05 | パナソニック株式会社 | 光学デバイスおよびその製造方法 |
US20050258518A1 (en) * | 2004-05-24 | 2005-11-24 | Advanced Semiconductor Engineering Inc. | Image sensor package module with a leadless leadframe between chips |
-
2005
- 2005-09-09 CN CNB2005100372274A patent/CN100561282C/zh not_active Expired - Fee Related
-
2006
- 2006-06-28 US US11/478,503 patent/US7361880B2/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3995293A (en) * | 1974-12-18 | 1976-11-30 | Fuji Photo Optical Co., Ltd. | Printed circuit for photographic cameras |
CN1664639A (zh) * | 2004-03-05 | 2005-09-07 | 鸿富锦精密工业(深圳)有限公司 | 数码相机模块 |
Also Published As
Publication number | Publication date |
---|---|
US7361880B2 (en) | 2008-04-22 |
CN1928605A (zh) | 2007-03-14 |
US20070057150A1 (en) | 2007-03-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: HON HAI PRECISION INDUSTRY CO., LTD. Free format text: FORMER OWNER: YANGXIN TECHNOLOGY CO., LTD. Effective date: 20121203 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20121203 Address after: 518109 Guangdong city of Shenzhen province Baoan District Longhua Town Industrial Zone tabulaeformis tenth East Ring Road No. 2 two Patentee after: Hongfujin Precise Industry (Shenzhen) Co., Ltd. Patentee after: Hon Hai Precision Industry Co., Ltd. Address before: 518109 Guangdong city of Shenzhen province Baoan District Longhua Town Industrial Zone tabulaeformis tenth East Ring Road No. 2 two Patentee before: Hongfujin Precise Industry (Shenzhen) Co., Ltd. Patentee before: Yangxin Technology Co., Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20091118 Termination date: 20160909 |