Electronics 1 Group

projects
ELC153S
Dear Students

Exciting stuff.

Here are the group projects:

1. LED running lights

2. LED Battery level indicator
3. LED Water level indicator
4. LED Temperature indicator
5. LED Traffic light

Due date: October 2024.

Submission requirements:
1. Must submit a report, signed by all members.
2. The report must be submitted via the blackboard submission link.
3. Physical project must be presented to the class during the October practical sessions. This must be
before the practical exam.
4. All this counts towards your practical work and your practical exam.
5. It definitely ticks off all the graduate attribute 3 development requirements.
Instructions:

1. All group members must work together. Each group forms 4 groups of ten.
2. You must submit a proposal of your project:
It must contain a theme, an abstract, index, list of components, a list of tools, equipment, a circuit
diagram, background, methodology, a Gantt chart, and finally a budget. Most importantly, references.
Use IEEE referencing style only.
3. You must use at least 10 LEDs for indicators. Indicators must be minimum three levels.
4. Group members must present their work progress at every practical session. The same members
cannot keep presenting.
5. You must try to do some programming as well. You are the computer class.
6. If you need components or programming boards, ask me.
7. You must use an Op-amp. The 741 must be used as a comparator.
NB: the star of the show is the L-E-D so it must shine!!!
L-7104SGD
T-1 (3mm) Solid State Lamp

DESCRIPTION PACKAGE DIMENSIONS

The Super Bright Green source color devices are
made with Gallium Phosphide Green Light Emitting
Diode

FEATURES

Low power consumption

Popular T-1 diameter package

General purpose leads

Reliable and rugged
Long life - solid state reliability

t

Available on tape and reel

h

RoHS compliant

i g
APPLICATIONS

r

Status indicator

b

Illuminator

Signage applications

g

Decorative and entertainment lighting

in

Commercial and residential architectural lighting

K Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.25(0.01") unless otherwise noted.
3. Lead spacing is measured where the leads emerge from the package.
4. The specifications, characteristics and technical data described in the datasheet are subject to change
without prior notice.

SELECTION GUIDE
Iv (mcd) @ 20mA [2] Viewing Angle [1]
Emitting Color
Part Number Lens Type
(Material)
Min. Typ. 2θ1/2

L-7104SGD ■ Super Bright Green (GaP) Green Diffused 18 40 50°

Notes:
1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value.
2. Luminous intensity / luminous flux: +/-15%.
3. Luminous intensity value is traceable to CIE127-2007 standards.

© 2020 Kingbright. All Rights Reserved. Spec No: DSAA3085 / 1101029079 Rev No: V.21B Date: 05/04/2020 Page 1 / 5
 L-7104SGD
ELECTRICAL / OPTICAL CHARACTERISTICS at TA=25°C
Value
Parameter Symbol Emitting Color Unit
Typ. Max.

Wavelength at Peak Emission IF = 20mA λpeak Super Bright Green 565 - nm

Dominant Wavelength IF = 20mA λdom [1] Super Bright Green 568 - nm

Spectral Bandwidth at 50% Φ REL MAX

∆λ Super Bright Green 30 - nm
IF = 20mA

Capacitance C Super Bright Green 15 - pF

Forward Voltage IF = 20mA VF [2] Super Bright Green 2.2 2.5 V

Reverse Current (VR = 5V) IR Super Bright Green - 10 µA

t
Temperature Coefficient of λpeak
TCλpeak Super Bright Green 0.1 - nm/°C
IF = 20mA, -10°C ≤ T ≤ 85°C

h
Temperature Coefficient of λdom
TCλdom Super Bright Green 0.06 - nm/°C
IF = 20mA, -10°C ≤ T ≤ 85°C

i g
Temperature Coefficient of VF
TCV Super Bright Green -2 - mV/°C

r
IF = 20mA, -10°C ≤ T ≤ 85°C

b
Notes:
1. The dominant wavelength (λd) above is the setup value of the sorting machine. (Tolerance λd : ±1nm. )
2. Forward voltage: ±0.1V.

g
3. Wavelength value is traceable to CIE127-2007 standards.
4. Excess driving current and / or operating temperature higher than recommended conditions may result in severe light degradation or premature failure.

in
ABSOLUTE MAXIMUM RATINGS at TA=25°C

K
Parameter Symbol Value Unit

Power Dissipation PD 62.5 mW

Reverse Voltage VR 5 V

Junction Temperature Tj 110 °C

Operating Temperature Top -40 To +85 °C

Storage Temperature Tstg -40 To +85 °C

DC Forward Current IF 25 mA

Peak Forward Current IFM [1] 140 mA

Electrostatic Discharge Threshold (HBM) - 8000 V

Thermal Resistance (Junction / Ambient) Rth JA [2] 680 °C/W

Thermal Resistance (Junction / Solder point) Rth JS [2] 460 °C/W

Lead Solder Temperature [3] 260°C For 3 Seconds

Lead Solder Temperature [4] 260°C For 5 Seconds

Notes:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
2. Rt h JA ,Rt h JS Results from mounting on PC board FR4 (pad size ≥ 16 mm 2 per pad).
3. 2mm below package base.
4. 5mm below package base.
5. Relative humidity levels maintained between 40% and 60% in production area are recommended to avoid the build-up of static electricity – Ref JEDEC/JESD625-A and JEDEC/J-STD-033.

© 2020 Kingbright. All Rights Reserved. Spec No: DSAA3085 / 1101029079 Rev No: V.21B Date: 05/04/2020 Page 2 / 5
 L-7104SGD
TECHNICAL DATA
RELATIVE INTENSITY vs. WAVELENGTH SPATIAL DISTRIBUTION

Green
100% 0°
-15° 15°
Ta = 25 °C Ta = 25 °C
Relative Intensity (a. u.)

80% -30° 30°

-45° 45°
60%

40% -60° 60°

20%
-75° 75°
0%
350 400 450 500 550 600 650 700 750 800
-90° 90°
Wavelength (nm)
1.0 0.5 0.0 0.5 1.0

SUPER BRIGHT GREEN

Forward Current vs. Luminous Intensity vs. Forward Current Derating Curve Luminous Intensity vs.
Forward Voltage Forward Current Ambient Temperature

t
50 2.5 50 2.5

Permissible forward current (mA)

Luminous intensity normalised at

Luminous intensity normalised

Ta = 25 °C Ta = 25 °C

h
Forward current (mA)

40 2.0 40 2.0

at Ta = 25 °C
g
30 1.5 30 1.5
20 mA

r i
20 1.0 20 1.0

b
10 0.5 10 0.5

g
0 0.0 0 0.0
1.7 1.9 2.1 2.3 2.5 2.7 0 10 20 30 40 50 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100

n
Forward voltage (V) Forward current (mA) Ambient temperature (°C) Ambient temperature (°C)

RECOMMENDED WAVE SOLDERING PROFILE

K i
Notes:
1. Recommend pre-heat temperature of 105°C or less (as measured with a thermocouple
attached to the LED pins) prior to immersion in the solder wave with a maximum solder bath
temperature of 260°C
2. Peak wave soldering temperature between 245°C ~ 255°C for 3 sec (5 sec max).
3. Do not apply stress to the epoxy resin while the temperature is above 85°C.
4. Fixtures should not incur stress on the component when mounting and during soldering process.
5. SAC 305 solder alloy is recommended.
6. No more than one wave soldering pass.

PACKING & LABEL SPECIFICATIONS

© 2020 Kingbright. All Rights Reserved. Spec No: DSAA3085 / 1101029079 Rev No: V.21B Date: 05/04/2020 Page 3 / 5
 L-7104SGD

PRECAUTIONS
Storage conditions
1. Avoid continued exposure to the condensing moisture environment and keep the product away from rapid transitions in ambient

t
temperature.
2. LEDs should be stored with temperature ≤ 30°C and relative humidity < 60%.

h
3. Product in the original sealed package is recommended to be assembled within 72 hours of opening.

g
Product in opened package for more than a week should be baked for 30 (+10/-0) hours at 85 ~ 100°C.

b r i
g
LED Mounting Method
1. The lead pitch of the LED must match the

in
pitch of the mounting holes on the PCB
during component placement.

K
Lead-forming may be required to insure
the lead pitch matches the hole pitch.
Refer to the figure below for proper lead
forming procedures.
Note 1-3: Do not route PCB trace in the contact area between the
leadframe and the PCB to prevent short-circuits.
" ○" Correct mounting method "x " Incorrect mounting method

2. When soldering wires to the LED, each wire joint should be separately insulated with heat-shrink tube to prevent short-circuit contact.
Do not bundle both wires in one heat shrink tube to avoid pinching the LED leads. Pinching stress on the LED leads may damage the
internal structures and cause failure.

3. Use stand-offs (Fig.1) or spacers (Fig.2) to securely position the LED above the PCB.
4. Maintain a minimum of 3mm clearance between the base of the LED lens and the first lead
bend (Fig. 3 ,Fig. 4).
5. During lead forming, use tools or jigs to hold the leads securely so that the bending force
will not be transmitted to the LED lens and its internal structures. Do not perform lead
forming once the component has been mounted onto the PCB. (Fig. 5 )

© 2020 Kingbright. All Rights Reserved. Spec No: DSAA3085 / 1101029079 Rev No: V.21B Date: 05/04/2020 Page 4 / 5
 L-7104SGD
Lead Forming Procedures
1. Do not bend the leads more than twice. (Fig. 6 )
2. During soldering, component covers and holders should leave
clearance to avoid placing damaging stress on the LED during
soldering. (Fig. 7)
3. The tip of the soldering iron should never touch the lens epoxy.
4. Through-hole LEDs are incompatible with reflow soldering.
5. If the LED will undergo multiple soldering passes or face other
processes where the part may be subjected to intense heat,
please check with Kingbright for compatibility.

h t
r i g
g b
K in

PRECAUTIONARY NOTES
1. The information included in this document reflects representative usage scenarios and is intended for technical reference only.
2. The part number, type, and specifications mentioned in this document are subject to future change and improvement without notice. Before production usage customer should refer to
the latest datasheet for the updated specifications.
3. When using the products referenced in this document, please make sure the product is being operated within the environmental and electrical limits specified in the datasheet. If
customer usage exceeds the specified limits, Kingbright will not be responsible for any subsequent issues.
4. The information in this document applies to typical usage in consumer electronics applications. If customer's application has special reliability requirements or have life-threatening
liabilities, such as automotive or medical usage, please consult with Kingbright representative for further assistance.
5. The contents and information of this document may not be reproduced or re-transmitted without permission by Kingbright.
6. All design applications should refer to Kingbright application notes available at https://www.Kingbright.com/application_notes

© 2020 Kingbright. All Rights Reserved. Spec No: DSAA3085 / 1101029079 Rev No: V.21B Date: 05/04/2020 Page 5 / 5
 Standard LED
Red Emitting Colour
Features:
• High intensity
• Standard T-1 3/4 diameter package
• General purpose leads
• Reliable and rugged

Package Dimensions:

Dimensions : Millimetres (Inches)

Specification Table
Chip Material Lens Colour Source Colour Part Number

AlGaAs Diffused Red MV5754A

Notes:

1. Tolerance is ±0.25 mm (0.01”) unless otherwise noted

2. Protruded resin under flange is 1 mm (0.04”) maximum
3. Lead spacing is measured where the leads emerge from the package

www.element14.com
www.farnell.com
www.newark.com

Page <1> 18/10/11 V1.1

 Standard LED
Red Emitting Colour
Absolute Maximum Ratings at Ta = 25°C

Parameter Maximum Unit

Power Dissipation 80 mW

Peak Forward Current

100
(1/10 Duty Cycle, 0.1 ms Pulse Width)
mA
Continuous Forward Current 20

Derating Linear From 50°C 0.4 mA / °C

Reverse Voltage 5 V

Operating Temperature Range -25°C to +80°C

Storage Temperature Range -40°C to +100°C

Lead Soldering Temperature

260°C for 5 s
(4 mm (0.157) Inches from Body)

Electrical Optical Characteristics at Ta = 25°C

Parameter Symbol Minimum Typical Maximum Unit Test Condition

Luminous Intensity Iv 40 mcd If = 20 mA (Note 1)

Viewing Angle 2θ1/2 25 Deg (Note 2)

Peak Emission Wavelength λp 640 nm If = 20 mA

Dominant Wavelength λd 635 nm If = 20 mA (Note 3)

Spectral Line Half-Width ∆λ 25 nm If = 20 mA

Forward Voltage Vf 2 2.5 V If = 20 mA

Reverse Current IR - - 100 µA VR = 5 V

Notes:

1. Luminous intensity is measured with a light sensor and filter combination that approximates the
CIE eye-response curve
2. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity
3. The dominant wavelength (λd) is derived from the CIE chromaticity diagram and represents the
single wavelength which defines the colour of the device

www.element14.com
www.farnell.com
www.newark.com

Page <2> 18/10/11 V1.1

 Standard LED
Red Emitting Colour
Typical Characteristics
IF - VF (Ta = 25°C) Relative Luminous Intensity - IF (Ta = 25°C)

Relative Luminous Intensity

Forward Current IF (mA)

Forward Voltage VF (V)

Forward Current IF (mA)
Wavelength Characteristics (Ta = 25°C)
Relative Luminous Intensity - Ta
Relative Luminous Intensity

Relative Luminous Intensity

Wavelength λ (nm)
Ambient Temperature Ta (°C)
IF - Ta
Directive Characteristics (Ta = 25°C)
Forward Current IF (mA)

Ambient Temperature Ta (°C)

Important Notice : This data sheet and its contents (the "Information") belong to the members of the Premier Farnell group of companies (the "Group") or are licensed to it. No licence is granted for the use of
it other than for information purposes in connection with the products to which it relates. No licence of any intellectual property rights is granted. The Information is subject to change without notice and replaces
all data sheets previously supplied. The Information supplied is believed to be accurate but the Group assumes no responsibility for its accuracy or completeness, any error in or omission from it or for any use
made of it. Users of this data sheet should check for themselves the Information and the suitability of the products for their purpose and not make any assumptions based on information included or omitted.
Liability for loss or damage resulting from any reliance on the Information or use of it (including liability resulting from negligence or where the Group was aware of the possibility of such loss or damage arising)
is excluded. This will not operate to limit or restrict the Group's liability for death or personal injury resulting from its negligence. Multicomp is the registered trademark of the Group. © Premier Farnell plc 2011.

www.element14.com
www.farnell.com
www.newark.com

Page <3> 18/10/11 V1.1

 Product Sample & Technical Tools & Support &
Folder Buy Documents Software Community

LM741
SNOSC25D – MAY 1998 – REVISED OCTOBER 2015

LM741 Operational Amplifier

1 Features 3 Description
•
1 Overload Protection on the Input and Output The LM741 series are general-purpose operational
amplifiers which feature improved performance over
• No Latch-Up When the Common-Mode Range is industry standards like the LM709. They are direct,
Exceeded plug-in replacements for the 709C, LM201, MC1439,
and 748 in most applications.
2 Applications
The amplifiers offer many features which make their
• Comparators application nearly foolproof: overload protection on
• Multivibrators the input and output, no latch-up when the common-
• DC Amplifiers mode range is exceeded, as well as freedom from
oscillations.
• Summing Amplifiers
• Integrator or Differentiators The LM741C is identical to the LM741 and LM741A
except that the LM741C has their performance
• Active Filters ensured over a 0°C to +70°C temperature range,
instead of −55°C to +125°C.

Device Information(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
TO-99 (8) 9.08 mm × 9.08 mm
LM741 CDIP (8) 10.16 mm × 6.502 mm
PDIP (8) 9.81 mm × 6.35 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.

Typical Application

R2

+Vsupply
R1
- V+

LM741 Output

Vinput + V-

-Vsupply

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM741
SNOSC25D – MAY 1998 – REVISED OCTOBER 2015 www.ti.com

Table of Contents
1 Features .................................................................. 1 7.3 Feature Description................................................... 7
2 Applications ........................................................... 1 7.4 Device Functional Modes.......................................... 8
3 Description ............................................................. 1 8 Application and Implementation .......................... 9
4 Revision History..................................................... 2 8.1 Application Information.............................................. 9
8.2 Typical Application ................................................... 9
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 4 9 Power Supply Recommendations...................... 10
6.1 Absolute Maximum Ratings ...................................... 4 10 Layout................................................................... 11
6.2 ESD Ratings.............................................................. 4 10.1 Layout Guidelines ................................................. 11
6.3 Recommended Operating Conditions....................... 4 10.2 Layout Example .................................................... 11
6.4 Thermal Information .................................................. 4 11 Device and Documentation Support ................. 12
6.5 Electrical Characteristics, LM741.............................. 5 11.1 Community Resources.......................................... 12
6.6 Electrical Characteristics, LM741A ........................... 5 11.2 Trademarks ........................................................... 12
6.7 Electrical Characteristics, LM741C ........................... 6 11.3 Electrostatic Discharge Caution ............................ 12
7 Detailed Description .............................................. 7 11.4 Glossary ................................................................ 12
7.1 Overview ................................................................... 7 12 Mechanical, Packaging, and Orderable
7.2 Functional Block Diagram ......................................... 7 Information ........................................................... 12

4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision C (October 2004) to Revision D Page

• Added Applications section, Pin Configuration and Functions section, ESD Ratings table, Feature Description
section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations
section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable
Information section ................................................................................................................................................................ 1
• Removed NAD 10-Pin CLGA pinout ..................................................................................................................................... 3
• Removed obselete M (S0-8) package from the data sheet ................................................................................................... 4
• Added recommended operating supply voltage spec ............................................................................................................ 4
• Added recommended operating temperature spec ................................................................................................................ 4

Changes from Revision C (March 2013) to Revision D Page

• Added Applications section, Pin Configuration and Functions section, ESD Ratings table, Feature Description
section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations
section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable
Information section ................................................................................................................................................................ 1
• Removed NAD 10-Pin CLGA pinout ..................................................................................................................................... 3
• Removed obselete M (S0-8) package from the data sheet ................................................................................................... 4
• Added recommended operating supply voltage spec ............................................................................................................ 4
• Added recommended operating temperature spec ................................................................................................................ 4

2 Submit Documentation Feedback Copyright © 1998–2015, Texas Instruments Incorporated

Product Folder Links: LM741

 LM741
www.ti.com SNOSC25D – MAY 1998 – REVISED OCTOBER 2015

5 Pin Configuration and Functions

LMC Package NAB Package

8-Pin TO-99 8-Pin CDIP or PDIP
Top View Top View

LM741H is available per JM38510/10101

Pin Functions
PIN
I/O DESCRIPTION
NAME NO.
INVERTING
2 I Inverting signal input
INPUT
NC 8 N/A No Connect, should be left floating
NONINVERTING
3 I Noninverting signal input
INPUT
OFFSET NULL
1, 5 I Offset null pin used to eliminate the offset voltage and balance the input voltages.
OFFSET NULL
OUTPUT 6 O Amplified signal output
V+ 7 I Positive supply voltage
V– 4 I Negative supply voltage

Copyright © 1998–2015, Texas Instruments Incorporated Submit Documentation Feedback 3

Product Folder Links: LM741
LM741
SNOSC25D – MAY 1998 – REVISED OCTOBER 2015 www.ti.com

6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1) (2) (3)
MIN MAX UNIT
LM741, LM741A ±22
Supply voltage V
LM741C ±18
(4)
Power dissipation 500 mW
Differential input voltage ±30 V
(5)
Input voltage ±15 V
Output short circuit duration Continuous
LM741, LM741A –50 125
Operating temperature °C
LM741C 0 70
LM741, LM741A 150
Junction temperature °C
LM741C 100
PDIP package (10 seconds) 260 °C
Soldering information
CDIP or TO-99 package (10 seconds) 300 °C
Storage temperature, Tstg –65 150 °C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) For military specifications see RETS741X for LM741 and RETS741AX for LM741A.
(3) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(4) For operation at elevated temperatures, these devices must be derated based on thermal resistance, and Tj max. (listed under “Absolute
Maximum Ratings”). Tj = TA + (θjA PD).
(5) For supply voltages less than ±15 V, the absolute maximum input voltage is equal to the supply voltage.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) ±400 V

(1) Level listed above is the passing level per ANSI, ESDA, and JEDEC JS-001. JEDEC document JEP155 states that 500-V HBM allows
safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
LM741, LM741A ±10 ±15 ±22
Supply voltage (VDD-GND) V
LM741C ±10 ±15 ±18
LM741, LM741A –55 125
Temperature °C
LM741C 0 70

6.4 Thermal Information

LM741
THERMAL METRIC (1) LMC (TO-99) NAB (CDIP) P (PDIP) UNIT
8 PINS 8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 170 100 100 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 25 — — °C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.

4 Submit Documentation Feedback Copyright © 1998–2015, Texas Instruments Incorporated

Product Folder Links: LM741

 LM741
www.ti.com SNOSC25D – MAY 1998 – REVISED OCTOBER 2015

6.5 Electrical Characteristics, LM741 (1)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
TA = 25°C 1 5 mV
Input offset voltage RS ≤ 10 kΩ
TAMIN ≤ TA ≤ TAMAX 6 mV
Input offset voltage
TA = 25°C, VS = ±20 V ±15 mV
adjustment range
TA = 25°C 20 200
Input offset current nA
TAMIN ≤ TA ≤ TAMAX 85 500
TA = 25°C 80 500 nA
Input bias current
TAMIN ≤ TA ≤ TAMAX 1.5 μA
Input resistance TA = 25°C, VS = ±20 V 0.3 2 MΩ
Input voltage range TAMIN ≤ TA ≤ TAMAX ±12 ±13 V
VS = ±15 V, VO = ±10 V, RL ≥ 2 TA = 25°C 50 200
Large signal voltage gain V/mV
kΩ TAMIN ≤ TA ≤ TAMAX 25
RL ≥ 10 kΩ ±12 ±14
Output voltage swing VS = ±15 V V
RL ≥ 2 kΩ ±10 ±13
Output short circuit current TA = 25°C 25 mA
Common-mode rejection ratio RS ≤ 10 Ω, VCM = ±12 V, TAMIN ≤ TA ≤ TAMAX 80 95 dB
Supply voltage rejection ratio VS = ±20 V to VS = ±5 V, RS ≤ 10 Ω, TAMIN ≤ TA ≤ TAMAX 86 96 dB
Transient Rise time 0.3 μs
TA = 25°C, unity gain
response Overshoot 5%
Slew rate TA = 25°C, unity gain 0.5 V/μs
Supply current TA = 25°C 1.7 2.8 mA
TA = 25°C 50 85
Power consumption VS = ±15 V TA = TAMIN 60 100 mW
TA = TAMAX 45 75

(1) Unless otherwise specified, these specifications apply for VS = ±15 V, −55°C ≤ TA ≤ +125°C (LM741/LM741A). For the
LM741C/LM741E, these specifications are limited to 0°C ≤ TA ≤ +70°C.

6.6 Electrical Characteristics, LM741A (1)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
TA = 25°C 0.8 3 mV
Input offset voltage RS ≤ 50 Ω
TAMIN ≤ TA ≤ TAMAX 4 mV
Average input offset voltage
15 μV/°C
drift
Input offset voltage
TA = 25°C, VS = ±20 V ±10 mV
adjustment range
TA = 25°C 3 30
Input offset current nA
TAMIN ≤ TA ≤ TAMAX 70
Average input offset
0.5 nA/°C
current drift
TA = 25°C 30 80 nA
Input bias current
TAMIN ≤ TA ≤ TAMAX 0.21 μA
TA = 25°C, VS = ±20 V 1 6
Input resistance MΩ
TAMIN ≤ TA ≤ TAMAX, VS = ±20 V 0.5
VS = ±20 V, VO = ±15 V, RL ≥ 2 TA = 25°C 50
Large signal voltage gain kΩ TAMIN ≤ TA ≤ TAMAX 32 V/mV
VS = ±5 V, VO = ±2 V, RL ≥ 2 kΩ, TAMIN ≤ TA ≤ TAMAX 10

(1) Unless otherwise specified, these specifications apply for VS = ±15 V, −55°C ≤ TA ≤ +125°C (LM741/LM741A). For the
LM741C/LM741E, these specifications are limited to 0°C ≤ TA ≤ +70°C.
Copyright © 1998–2015, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Links: LM741
LM741
SNOSC25D – MAY 1998 – REVISED OCTOBER 2015 www.ti.com

Electrical Characteristics, LM741A(1) (continued)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
RL ≥ 10 kΩ ±16
Output voltage swing VS = ±20 V V
RL ≥ 2 kΩ ±15
TA = 25°C 10 25 35
Output short circuit current mA
TAMIN ≤ TA ≤ TAMAX 10 40
Common-mode rejection ratio RS ≤ 50 Ω, VCM = ±12 V, TAMIN ≤ TA ≤ TAMAX 80 95 dB
Supply voltage rejection ratio VS = ±20 V to VS = ±5 V, RS ≤ 50 Ω, TAMIN ≤ TA ≤ TAMAX 86 96 dB
Transient Rise time 0.25 0.8 μs
TA = 25°C, unity gain
response Overshoot 6% 20%
(2)
Bandwidth TA = 25°C 0.437 1.5 MHz
Slew rate TA = 25°C, unity gain 0.3 0.7 V/μs
TA = 25°C 80 150
Power consumption VS = ±20 V TA = TAMIN 165 mW
TA = TAMAX 135

(2) Calculated value from: BW (MHz) = 0.35/Rise Time (μs).

6.7 Electrical Characteristics, LM741C (1)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
TA = 25°C 2 6 mV
Input offset voltage RS ≤ 10 kΩ
TAMIN ≤ TA ≤ TAMAX 7.5 mV
Input offset voltage
TA = 25°C, VS = ±20 V ±15 mV
adjustment range
TA = 25°C 20 200
Input offset current nA
TAMIN ≤ TA ≤ TAMAX 300
TA = 25°C 80 500 nA
Input bias current
TAMIN ≤ TA ≤ TAMAX 0.8 μA
Input resistance TA = 25°C, VS = ±20 V 0.3 2 MΩ
Input voltage range TA = 25°C ±12 ±13 V
VS = ±15 V, VO = ±10 V, RL TA = 25°C 20 200
Large signal voltage gain V/mV
≥ 2 kΩ TAMIN ≤ TA ≤ TAMAX 15
RL ≥ 10 kΩ ±12 ±14
Output voltage swing VS = ±15 V V
RL ≥ 2 kΩ ±10 ±13
Output short circuit current TA = 25°C 25 mA
Common-mode rejection ratio RS ≤ 10 kΩ, VCM = ±12 V, TAMIN ≤ TA ≤ TAMAX 70 90 dB
Supply voltage rejection ratio VS = ±20 V to VS = ±5 V, RS ≤ 10 Ω, TAMIN ≤ TA ≤ TAMAX 77 96 dB
Rise time 0.3 μs
Transient response TA = 25°C, Unity Gain
Overshoot 5%
Slew rate TA = 25°C, Unity Gain 0.5 V/μs
Supply current TA = 25°C 1.7 2.8 mA
Power consumption VS = ±15 V, TA = 25°C 50 85 mW

(1) Unless otherwise specified, these specifications apply for VS = ±15 V, −55°C ≤ TA ≤ +125°C (LM741/LM741A). For the
LM741C/LM741E, these specifications are limited to 0°C ≤ TA ≤ +70°C.

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7 Detailed Description

7.1 Overview
The LM74 devices are general-purpose operational amplifiers which feature improved performance over industry
standards like the LM709. It is intended for a wide range of analog applications. The high gain and wide range of
operating voltage provide superior performance in integrator, summing amplifier, and general feedback
applications. The LM741 can operate with a single or dual power supply voltage. The LM741 devices are direct,
plug-in replacements for the 709C, LM201, MC1439, and 748 in most applications.

7.2 Functional Block Diagram

7.3 Feature Description

7.3.1 Overload Protection
The LM741 features overload protection circuitry on the input and output. This prevents possible circuit damage
to the device.

7.3.2 Latch-up Prevention

The LM741 is designed so that there is no latch-up occurrence when the common-mode range is exceeded. This
allows the device to function properly without having to power cycle the device.

7.3.3 Pin-to-Pin Capability

The LM741 is pin-to-pin direct replacements for the LM709C, LM201, MC1439, and LM748 in most applications.
Direct replacement capabilities allows flexibility in design for replacing obsolete parts.

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7.4 Device Functional Modes

7.4.1 Open-Loop Amplifier
The LM741 can be operated in an open-loop configuration. The magnitude of the open-loop gain is typically large
thus for a small difference between the noninverting and inverting input terminals, the amplifier output will be
driven near the supply voltage. Without negative feedback, the LM741 can act as a comparator. If the inverting
input is held at 0 V, and the input voltage applied to the noninverting input is positive, the output will be positive.
If the input voltage applied to the noninverting input is negative, the output will be negative.

7.4.2 Closed-Loop Amplifier

In a closed-loop configuration, negative feedback is used by applying a portion of the output voltage to the
inverting input. Unlike the open-loop configuration, closed loop feedback reduces the gain of the circuit. The
overall gain and response of the circuit is determined by the feedback network rather than the operational
amplifier characteristics. The response of the operational amplifier circuit is characterized by the transfer function.

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8 Application and Implementation

NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.

8.1 Application Information

The LM741 is a general-purpose amplifier than can be used in a variety of applications and configurations. One
common configuration is in a noninverting amplifier configuration. In this configuration, the output signal is in
phase with the input (not inverted as in the inverting amplifier configuration), the input impedance of the amplifier
is high, and the output impedance is low. The characteristics of the input and output impedance is beneficial for
applications that require isolation between the input and output. No significant loading will occur from the
previous stage before the amplifier. The gain of the system is set accordingly so the output signal is a factor
larger than the input signal.

8.2 Typical Application

R2 = 4.7k

+Vsupply
R1 = 4.7k
- V+

LM741 Output

Vinput + V-

-Vsupply
Figure 1. LM741 Noninverting Amplifier Circuit

8.2.1 Design Requirements

As shown in Figure 1, the signal is applied to the noninverting input of the LM741. The gain of the system is
determined by the feedback resistor and input resistor connected to the inverting input. The gain can be
calculated by Equation 1:
Gain = 1 + (R2/R1) (1)

The gain is set to 2 for this application. R1 and R2 are 4.7-k resistors with 5% tolerance.

8.2.2 Detailed Design Procedure

The LM741 can be operated in either single supply or dual supply. This application is configured for dual supply
with the supply rails at ±15 V. The input signal is connected to a function generator. A 1-Vpp, 10-kHz sine wave
was used as the signal input. 5% tolerance resistors were used, but if the application requires an accurate gain
response, use 1% tolerance resistors.

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Typical Application (continued)

8.2.3 Application Curve
The waveforms in Figure 2 show the input and output signals of the LM741 non-inverting amplifier circuit. The
blue waveform (top) shows the input signal, while the red waveform (bottom) shows the output signal. The input
signal is 1.06 Vpp and the output signal is 1.94 Vpp. With the 4.7-kΩ resistors, the theoretical gain of the system
is 2. Due to the 5% tolerance, the gain of the system including the tolerance is 1.992. The gain of the system
when measured from the mean amplitude values on the oscilloscope was 1.83.

Figure 2. Waveforms for LM741 Noninverting Amplifier Circuit

9 Power Supply Recommendations

For proper operation, the power supplies must be properly decoupled. For decoupling the supply lines, a 0.1-µF
capacitor is recommended and should be placed as close as possible to the LM741 power supply pins.

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10 Layout

10.1 Layout Guidelines

As with most amplifiers, take care with lead dress, component placement, and supply decoupling in order to
ensure stability. For example, resistors from the output to an input should be placed with the body close to the
input to minimize pick-up and maximize the frequency of the feedback pole by minimizing the capacitance from
the input to ground. As shown in Figure 3, the feedback resistors and the decoupling capacitors are located close
to the device to ensure maximum stability and noise performance of the system.

10.2 Layout Example

Figure 3. LM741 Layout

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11 Device and Documentation Support

11.1 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.

11.2 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.

11.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

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www.ti.com 27-May-2022

PACKAGING INFORMATION

Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)

LM741C-MWC ACTIVE WAFERSALE YS 0 1 RoHS & Green Call TI Level-1-NA-UNLIM -40 to 85 Samples

LM741CN/NOPB ACTIVE PDIP P 8 40 RoHS & Green NIPDAU Level-1-NA-UNLIM 0 to 70 LM Samples

741CN

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.

(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.

(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 1
 PACKAGE OPTION ADDENDUM

www.ti.com 27-May-2022

Addendum-Page 2
 PACKAGE MATERIALS INFORMATION

www.ti.com 11-Feb-2022

TUBE

*All dimensions are nominal

Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm)
LM741CN/NOPB P PDIP 8 40 502 14 11938 4.32

Pack Materials-Page 1
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