5mm Round full color LED
PART NO.: D+LED-LD5RGBS
ATTENTION
OBSERVE PRECAUTIONS
FOR HANDLING
ELECTROSTATIC
DISCHARGE
SENSITIVE
DEVICES
Features
Low power consumption
Excellent product quality and reliability
I,c. compatible
Lead-free device.
Applications
Status indicators
Commercial use
Backlights
Advertising Signs
Package Dimensions
Notes:
1. All dimensions are in millimeters.
2. Tolerance is 0.25 unless otherwise noted.
3. Lead spacing is measured where the leads emerge from the package.
4. Specifications are subject to change without notice.
Device Selection Guide
Part No.
Chip
D+LED-LD5RGBS
Lens color
Material
Emitted color
AlGaInP
Red
InGaN
Green
InGaN
Blue
Water clear
Absolute Maximum Ratings at TA=25C
Value
Parameter
Symbol
Power Dissipation
Red
Green
Unit
Blue
PD
150
mW
IF
30
mA
Forward Current
Operating Temperature
Topr
-40C To +85C
Storage Temperature
Tstg
-40C To +85C
Soldering Temperature*2
Tsol
260C For 5 Seconds
Notes:
*1: Pulse width0.1ms, Duty cycle1/10
*2:1.6mm below package base.
Electrical / Optical Characteristics at TA=25C
Symbol
Min.
Typ.
Max
Unit
Red
VF
3.50
5.0
Green
VF
3.50
5.0
Blue
VF
3.50
5.0
Red
625
nm
Green
525
nm
Blue
470
nm
21/2
15
Deg.
Parameter
Forward Voltage
Chromaticity Coordinates
Power Angle
Test Conditions
IF=20mA
IF=20mA
IF=20mA
Remarks:
If special sorting is required (e.g. binning based on forward voltage, luminous intensity, or dominant wavelength),
the typical accuracy of the sorting process is as follows:
1.Dominant Wavelength:+/-1nm
2.Chromatic Coordinates:+/-0.01
3. Luminous Intensity: +/-15%
4. Forward Voltage: +/-0.1V
5.The desiga and working Current for Led is not less than 2mA.
Typical Electrical/Optical Characteristics Curves
( Ta=25 Unless Otherwise Noted )
10
20
30
Output Current VS Periods
40
1.0
50
60
0.8
70
80
90
0.5
SPATIAL DISTRIBUTION
CAUTIONS:
1.Lead Forming & Assembly
Any lead forming or bending must be done before soldering, at normal temperature.
When forming leads, there must be a minimum of 3mm clearance between the base of the
LED lens and the lead bend.
Do not use the base of the lead frame as a fulcrum during lead forming.
Avoid bending the leads at the same point more than once.
During assembly onto PCB, the lead pitch of the LED must match the pitch of the mounting
holes on the PCB during component placement.
2.Cleaning:
Isopropyl alcohol or deionized water are recommended solvents for cleaning. When using other
solvents, it should be confirmed beforehand whether the solvents will dissolve the resin or not.
3.Storage
The storage ambient for the LEDs should not exceed 30 temperature or 70% relative humidity.
It is recommended that LEDs out of their original packaging are used within three months. For
extended storage out of their original packaging, it is recommended that the LEDs be stored in a
sealed container with appropriate desiccant or in desiccators with nitrogen ambient.
4.ESD ( Electrostatic Discharge)
Static Electricity or power surge will damage the LED.
The following procedures may decrease the possibility of ESD damage.
All production machinery and test instruments must be electrically grounded.
Use a conductive wrist band or anti-electrostatic glove when handling these LEDs.
Maintain a humidity level of 50% or higher in production areas.
Use anti-static packaging for transport and storage.
Revision History:
Rev. No.
Change description
Date
A/0
New-made specification
2010/08/23
Prepared by
Checked by
Approved by
