TOIR-30a94cXAa
Lamp LED
Chip
Part Number Lens Color
Material Source Color
TOIR-30a94cXAa AlGaAs Infrared Blue Transparent
Features
• I.C. compatible.
• Low power consumption.
• Compatible with wave soldering process.
• 3mm diameter package.
• Long life, stable and reliable.
• RoHS compliant
Dimensions
Notes:
1. All dimensions are in millimeter.
2. Tolerance is ±0.25mm unless otherwise noted.
REV.: A-1 Prepared XY Xia(10053) Released Date:2017/03/28 ： GL1703010
Doc No： Page 1/7
Notes : Above specification may be changed without notices.
Absolute Maximum Rating @ Ta=25°C
Parameter Maximum Rating Unit
Continuous Forward Current 100 mA
Power Dissipation 75 mW
Reverse Voltage 5 V
Operating Temperature Range -40°C to +80°C
Storage Temperature Range -40°C to +100°C
Wave Soldering Profile For Lead-free Soldering 260°C for 5 Sec
Electrical / Optical Characteristic @ Ta=25°C
Parameter Symbol Min. Typ. Max. Unit Test Condition
Peak Wavelength λp - 940 - nm IF=50mA
Radiated Output Power Po 13.9 - 53 mW/Sr IF=50mA
Viewing Angle 2θ1/2 - 40 - deg IF=50mA
Spectral Line Half-Width △λ - 50 - nm IF=50mA
Forward Voltage VF 1.1 - 1.5 V IF=50mA
Reverse Current IR - - 10 uA VR=5V
REV.: A-1 Prepared XY Xia(10053) Released Date:2017/03/28 ： GL1703010
Doc No： Page 2/7
Notes : Above specification may be changed without notices.
Bin Code List for Reference
Radiant Intensity Unit：mW/Sr @50mA
Bin Code Min Max
A21 13.9 17.3
A22 17.3 21.7
A23 21.7 27.1
A24 27.1 33.9
A25 33.9 42.4
A26 42.4 53
Tolerance of Luminous Intensity on each bin is ±15％
Forward Voltage Unit：V@50mA
Bin Code Min Max
V1.1 1.1 1.3
V1.3 1.3 1.5
Tolerance for each Forward Voltage Bin is ±0.1V
REV.: A-1 Prepared XY Xia(10053) Released Date:2017/03/28 ： GL1703010
Doc No： Page 3/7
Notes : Above specification may be changed without notices.
Package Description
REV.: A-1 Prepared XY Xia(10053) Released Date:2017/03/28 ： GL1703010
Doc No： Page 4/7
Notes : Above specification may be changed without notices.
Reliability Test Project
Test Fail
Description Item Test criterion Test condition Qty
time Qty
Life test 1000
Life test JIS7021:B4 Ta=25℃±5℃，IF=50mA 20 0
(Room temperature) Hrs
JIS7021:B10
1000
High temperature store MIL-STD-202:210A Ta=85℃±5℃ 20 0
Hrs
MIL-STD-750:2031
1000
Low temperature store JIS7021:B12 Ta= -35℃±5℃ 20 0
Hrs
Ambience High temperature/ JIS7021:B11 Ta=85℃±5℃ 1000
20 0
test humidity test MIL-STD-202:103D RH=85% Hrs
JIS7021::B4 30min
50
Cold / Heat strike test MIL-STD-202:107D -10℃±5℃←→85℃±5℃ 20 0
Cycles
MIL-STD-750:1026 5min 5min
JIS7021:A3 5min 5min 5min
50
Cold and heat cycle test MIL-STD-202:107D -35℃～25℃～85℃～-35℃ 20 0
Cycles
MIL-STD-705:105E 30min 5min 30min 5min
Judging criterion
Experiment Criteria
Item Symbol
condition Min. Max.
Forward Voltage VF IF=50mA - Initial Datex1.1
Reverse Current IR VR=5V - 30µA
Luminous Intensity IV IF=50mA Initial Datex0.7 -
REV.: A-1 Prepared XY Xia(10053) Released Date:2017/03/28 ： GL1703010
Doc No： Page 5/7
Notes : Above specification may be changed without notices.
Cautions
LED bracket forming method :
1. The pin of led can be bent where is at least 3mm out of led colloid.
2. Must use fixture to deform the led bracket.
3. Finishing the forming of led bracket must be before soldering.
4. Guarantee the gap between two pin of led tallys with LED pads in PCB when forming.
Manual soldering :
The tip temperature of soldering iron don’t exceed 260℃；soldering time don’t exceed 3s and soldering
position must be 3mm out of led colloid。
Soldering temperature curve chart（figure A、figure B）:
REV.: A-1 Prepared XY Xia(10053) Released Date:2017/03/28 ： GL1703010
Doc No： Page 6/7
Notes : Above specification may be changed without notices.
ESD countermeasure
Static electricity and high volt can damage led. The production whose Die material is InGaN must strictly
required to prevent ESD, must put on static glove and static fillet. Soldering tool and the cover of device must
connect the ground, soldering condition follows the related stating of production specification manual.
Protecting countermeasure when over current
Need add the protecting resistor in circuit in order to avoid damaging led due to big current and voltage
fluctuation.
LED installation method
1. Pay attention to the led polarity and avoid installation wrong. LED can’t be close to euthermic component，
work condition should tally with it’s specification.
2. Don’t install the LED under the condition of the led pin deformation.
3. The led bracket don’t load any pressure when installing the led into PCB or fitting hole.
4. Must avoid any strike and force on led before the soldering temperature return to room temperature.
Storage time
1. LED can be stored for a year under the condition:
the temperature of 5℃～35℃ and humidity of RH60%, These production must be re-inspected and tested
before use if their storage time exceed a year.
2. If LED is exposed in air for a week under the condition:
the temperature of 5℃～35℃, humidity of RH60%，must place the led in the ambience of 65℃±5℃ for 24
hours and use it in 15 days for best.
Cleaning
Be careful of some chemical results in the led colloid fades and damage when using chemical clean the LED
such as chloroethylene, acetone etc. can use ethanol to wash or soak LED but the time don’t exceed 3
minutes.
Kinked
The kinked tooling scrape easily the pin of LED, where the led bracket is rusting easily, especial expose it in
moist air. To decrease the led bracket rust, suggest using plated tin led bracket.
REV.: A-1 Prepared XY Xia(10053) Released Date:2017/03/28 ： GL1703010
Doc No： Page 7/7
Notes : Above specification may be changed without notices.
