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SPECIFICATION

PART NO. : MT6224-AHRG-A

5.0mm ROUND BI-COLOR LAMP (2 LEADS)

ATTENTION
OBSERVE PRECAUTION
FOR HANDLING
ELECTRO STATIC
SENSITIVE
DEVICES
 5.0mm ROUND BI-
MT6224-AHRG-A COLOR LAMP(3LEADS)

Description

This G/R lamp is made with AlGaAs/GaAs red chip and GaP/GaP green

chip and white diffused epoxy resin.

5.9
5.0

2.54±0.1

GREEN COMMON ORANGE

CATHODE ANODE CATHODE

Notes:
1. ALL DIMENSIONS ARE IN mm.

2. TOLERANCE IS ±0.25mm UNLESS OTHERWISE NOTED.

Description

LED Chip
Part No. Description
Material Emitting Color

GaP/GaP Green
MT6224-AHRG-A White diffused
AlGaAs/GaAs Red

REV.: 01 D ate: 2005/10/15 P age: 1/5

 5.0mm ROUND BI-
MT6224-AHRG-A COLOR LAMP(3LEADS)

Absolute Maximum Ratings at Ta=25℃

Parameter Symbol Rating Unit

Power Dissipation Pd 78 mW

Reverse Voltage VR 5 V

D.C. Forward Current If 30 mA

Reverse (Leakage) Current Ir 100 μA

Peak Current(1/10Duty Cycle,0.1ms Pulse Width.) If(Peak) 100 mA

Operating Temperature Range Topr. -25 to +85 ℃

Storage Temperature Range Tstg. -40 to +100 ℃

Lead Soldering Temp.(1.6mm from body) for 5 seconds 260 ℃

Electrical and Optical Characteristics: GREEN

Parameter Symbol Condition Min. Typ. Max. Unit

Luminous Intensity IV If=10mA 30.0 50.0 mcd

Forward Voltage Vf If=10mA 2.1 2.6 V

Peak Wavelength λP If=10mA 568 nm

Dominant Wavelength λD If=10mA 570 nm

Reverse (Leakage) Current Ir Vr=5V 100 µA

Viewing Angle 2θ1/2 If=10mA 70 deg

Spectrum Line Halfwidth ∆λ If=10mA 30 nm

NOTE: THE DATAS TESTED BY IS TESTER

REV.: 01 D ate: 2005/10/15 P age: 2/5

 5.0mm ROUND BI-
MT6224-AHRG-A COLOR LAMP(3LEADS)

Absolute Maximum Ratings at Ta=25℃

Parameter Symbol Rating Unit

Power Dissipation Pd 66 mW

Reverse Voltage VR 5 V

D.C. Forward Current If 30 mA

Reverse (Leakage) Current Ir 100 μA

Peak Current(1/10Duty Cycle,0.1ms Pulse Width.) If(Peak) 100 mA

Operating Temperature Range Topr. -25 to +85 ℃

Storage Temperature Range Tstg. -40 to +100 ℃

Lead Soldering Temp.(1.6mm from body) for 5 seconds 260 ℃

Electrical and Optical Characteristics: RED

Parameter Symbol Condition Min. Typ. Max. Unit

Luminous Intensity IV If=10mA 36.0 60.0 mcd

Forward Voltage Vf If=10mA 1.8 2.2 V

Peak Wavelength λP If=10mA 630 nm

Dominant Wavelength λD If=10mA 622 nm

Reverse (Leakage) Current Ir Vr=5V 100 µA

Viewing Angle 2θ1/2 If=10mA 70 deg

Spectrum Line Halfwidth ∆λ If=10mA 20 nm

NOTE: THE DATAS TESTED BY IS TESTER

REV.: 01 D ate: 2005/10/15 P age: 3/5

 5.0mm ROUND BI-
MT6224-AHRG-A COLOR LAMP(3LEADS)

Typical Electrical / Optical Characteristics Curves :

50
G 100
R R

Relative Luminous Intensity

40
80
Forward Current IF(mA)

30 G
60

20
40

10 20

0
1.2 1.6 2.0 2.4 2.8 3.2 0.0 10.0 20.0 30.0
Applied Voltage (V) Forward Current (mA)
FORWARD CURRENT VS.APPLIED VOLTAGE FORWARD CURRENT VS. LUMINOUS INTENSITY

0° 10° 20°

50 30°

40 40°
Forward Current IF(mA)

1.0
30 50°
0.9
60°
0.8
20 70°
80°
0.7 90°
10
0.5 0.3 0.1 0.2 0.4 0.6

0 20 40 60 80 100 RADIATION DIAGRAM

Temperature(。C)

REV.: 01 D ate: 2005/10/15 P age: 4/5

 5.0mm ROUND BI-
MT6224-AHRG-A COLOR LAMP(3LEADS)

Precautions:
TAKE NOTE OF THE FOLLOWING IN USE OF LED
1. Temperature in use
Since the light generated inside the LED needs to be emitted to outside efficiently, a resin with
high light transparency is used; therefore, additives to improve the heat resistance or moisture
resistance (silica gel , etc) which are used for semiconductor products such as transistors
cannot be added to the resin.
Consequently, the heat resistant ability of the resin used for LED is usually low; therefore,
please be careful on the following during use.

Avoid applying external force, stress, and excessive vibration to the resins and terminals at
high temperature. The glass transition temperature of epoxy resin used for the LED is
approximately 120-130℃.
At a temperature exceeding this limit, the coefficient of liner expansion of the resin doubles or
more compared to that at normal temperature and the resin is softened.
If external force or stress is applied at that time, it may cause a wire rupture.
2. Soldering
Please be careful on the following at soldering.
After soldering, avoided applying external force, stress, and excessive vibration until the
products go to cooling process (normal temperature), <Same for products with terminal leads>
(1) Soldering measurements:
Distance between melted solder side to bottom of resin shall be 1.6mm or longer.
(2) Solder dip: Preheat: 90℃ max. (Backside of PCB), Within 120 seconds
Solder bath: 250℃ max. (Solder temperature), Within 5 seconds
(3) Soldering iron : 250℃ max. (Temperature of soldering iron tip), Within 3 seconds
3. Insertion
Pitch of the LED leads and pitch of mounting holes need to be same
4. Others
Since the heat resistant ability of the LED resin is low, SMD components are used on the same
PCB, please mount the LED after adhesive baking process for SMD components. In case
adhesive baking is done after LED lamp insertion due to a production process reason, make
sure not to apply external force, stress, and excessive vibration to the LED and follow the
conditions below.
Baking temperature: 120℃ max. Baking time: Within 60 seconds
If soldering is done sequentially after the adhesive baking, please perform the soldering after cooling down
the LED to normal temperature.

REV.: 01 D ate: 2005/10/15 P age: 5/5