CUSTOMER : .

DATE : .
REV : REV. 0.0 .

SPECIFICATIONS FOR APPROVAL

395nm UV LED PKG

MODEL NAME : LEUVA33T00UL00

RoHS
Compliant

APPROVAL REMARK APPENDIX DESIGNED CHECKED APPROVED

2015.04.22 2015.04.22 2015.04.22
H.S DO C.W CHO H.H JEONG
 LGIT Confidential and Proprietary

TABLE OF CONTENTS

1. Features ----------------------------------- 2

2. Outline Dimensions ----------------------------------- 2

3. Applications ----------------------------------- 3

4. Absolute Maximum Ratings ----------------------------------- 3

5. Electro-Optical Characteristics ----------------------------------- 3

6. Bin Structures ----------------------------------- 4

7. Typical Characteristic Curves ----------------------------------- 5~6

8. Reliability Test Items and Conditions ----------------------------------- 7

9. Packing and Labeling of Products ----------------------------------- 8~11

10. Cautions on Use ----------------------------------- 12~16

11. Disclaimers ----------------------------------- 16

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 LGIT Confidential and Proprietary

1. Features

- Surface Mount Type : 3.40×3.40×2.37 (L×W×H, Unit : mm)

- Viewing Angle(Directivity) : Typical 130°

- Soldering Methods : Pb-Free IR-Reflow Soldering

2. Outline Dimensions
(Unit : mm)

③ ② ①

Anode Mark

Recommendable Soldering Pattern

(for Reflow Soldering)

Internal Circuit
Pad Configuration
Cathode Anode
① Anode Pad
③ ① ③ ② ①
② Thermal Pad
- +
③ Cathode Pad

Tolerances unless otherwise mentioned are ± 0.13 mm

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 LGIT Confidential and Proprietary

3. Applications
- UV Curing, UV Ink Curing, Photo-Catalyst, Sensor Light, etc.

4. Absolute Maximum Ratings

(Ta= 25℃)
Items Symbols Ratings Unit
Forward Current If 700 mA
Power Dissipation Pd 2.66 W
Operating Temperature Topr -10 ~ +85 ℃
Storage Temperature Tstg -40 ~ +100 ℃
Junction Temperature Tj <125 ℃
Soldering Temperature JEDEC-J-STD-020D
ESD Classification Class 2 (JESD22-A114)
※ Operating the LED beyond the listed maximum ratings may affect device reliability and cause permanent damage.
These or any other conditions beyond those indicated under recommended operating conditions are not implied.
The exposure to the absolute maximum rated conditions may affect device reliability.
※ The LEDs are not designed to be driven in reverse bias

5. Electro-Optical Characteristics
(Ta= 25℃)
Target Spec.
Items Symbol Condition Unit
Min. Typ. Max.
Forward Voltage Vf If = 500 mA 3.2 3.5 3.8 V

Radiant Flux Φe If = 500 mA 760 1000 1210 mW

Peak Wavelength Λp If = 500 mA 390 395 400 nm

Spectrum Half Width △λ If = 500 mA 9.0 - nm

Viewing Angle 2Θ1/2 If = 500 mA - 130 - deg

Thermal Resistance *1) Rth j-c If = 500 mA - 4.5 - °C/W

*1) Rthj-c = Thermal Resistance (Junction – Case)

※ These values are measured by the LG Innotek optical spectrum analyzer within the following tolerances.
- Forward Voltage(Vf) : ±0.1V
- Peak Wavelength(λp) : ±3.0nm
- Radiant Flux(Φe) : ±10%
※ Although all LEDs are tested by LG Innotek equipment, some values may vary slightly depending on the
conditions of the test equipment.

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6. Bin Structures

Items Rank Min Max Unit

Peak Wavelength U 390 400 nm

HP13 1100 1210

HP12 1000 1100

Radiant Flux HP11 910 1000 mW

HP10 830 910

HP9 760 830

V6 4.1 4.3

V5 3.9 4.1

V4 3.7 3.9
Forward Voltage V
V3 3.5 3.7

V2 3.3 3.5

V1 3.1 3.3

※ Forward Current = 500mA

※ Rank name method : Please refer to the following example

Rank Name : U-HP10-V2

- Peak Wavelength = T
- Radiant Flux = HP10
- Forward Voltage = V2

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 LGIT Confidential and Proprietary

7. Typical Characteristic Curves

■ Forward Voltage vs. Forward Current ■ Forward Current vs. Relative Radiant Flux

Ta = 25℃ Ta = 25℃
700 1.6

Relative Radiant Flux (a.u.)

Forward Current (mA)

600 1.4
500
1.2
400
1.0
300
0.8
200
100 0.6

0 0.4
2.9 3 3.1 3.2 3.3 3.4 3.5 3.6 3.7 200 300 400 500 600 700
Forward Voltage (V) Forward Current (mA)

■ Spectrum ■ Forward Current vs. Peak Wavelength

Ta = 25℃, If = 500mA Ta = 25℃

Relative Emission Intensity (a.u.)

400
Peak Wavelength (nm)

398

396

394

392

390
200 300 400 500 600 700
Peak Wavelength (nm) Forward Current (mA)

■ Radiation Characteristics
Radial
Theta / °
0 Ta = 25℃, If = 500mA

-45 45

-90 90
100 90 80 70 60 50 40 30 20 10 0 10 20 30 40 50 60 70 80 90 100

Photometric / %

Sequence1 - Phi=0 Sequence1 - Phi=90 Sequence2 - Phi=0 Sequence2 - Phi=90

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 LGIT Confidential and Proprietary

7. Typical Characteristic Curves

■ Ambient Temperature vs. Peak Wavelength ■ Ambient Temperature vs. Relative Radiant Flux
If = 500mA If = 500mA
400 1.2

Relative Radiant Flux (a.u.)

Peak Wavelength (nm)

398 1.1

1.0
396
0.9
394
0.8
392
0.7
390
25 35 45 55 65 75 85 0.6
25 35 45 55 65 75 85
Ambient Temperature (℃) Ambient Temperature (℃)

■ Ambient Temperature vs. Forward Voltage ■ Derating Curve

If = 500mA Tj = 125℃, Rth j-a≒ 10.0℃/W

3.6 800
700
Forward Current (mA)

3.5
600
3.4
500
3.3 400

3.2
300
200
3.1
100
3.0 0
-10 0 10 20 30 40 50 60 70 80 90 10 20 30 40 50 60 70 80 90
Ambient Temperature (℃)

※ The ambient temperature values for each graph are obtained with LG Innotek equipment.

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 LGIT Confidential and Proprietary

8. Reliability Test Items and Conditions

8-1. Failure Criteria

Criteria
Item Symbol Test Condition
Min. Max.

Forward Voltage Vf If = 500mA - Initial Value × 1.1

Radiant Flux Φe If = 500mA Initial Value × 0.7 -

8-2. Reliability Test

Test Hours/
No. Items Test Conditions
Cycles

Room Temperature Operating Life 1

1 Ta= 25℃, If = 500mA 1,000 Hours
(RTOL)
Room Temperature Operating Life 2
2 Ta= 25℃, If = 700mA 1,000 Hours
(RTOL)
High Temperature Operating Life
3 Ta= 85℃, If = 300mA 1,000 Hours
(HTOL)

4 Wet High Temperature Operating Life Ta = 60℃, RH = 90%, If = 450mA 500 Hours
(WHTOL)

Low Temperature Operating Life

5 Ta= -10℃, If = 500mA 1,000 Hours
(LTOL)
High Temperature Storage Life
6 Ta = 100℃ 1,000 Hours
(HTSL)
Low Temperature Storage Life
7 Ta = -40℃ 1,000 Hours
(LTSL)

8 Temperature Cycle -40℃(30min) ~ 100℃(30min) 100 Cycles

9 Vibration 100~2000~100Hz Sweep 4min. 48 Minutes

200m/s², 3 directions

R= 1.5kΩ, C= 100pF, 3 Times

10 Electrostatic Discharge Test Voltage= 2kV Negative/
, H.B.M.(Human Body Model) Positive
Moisture Sensitivity Level Tsld= 260℃, 3 Times
11
(MSL) Pre-condition : 60℃, RH= 60%, 168Hrs (Reflows)

※ All Samples are tested using LG Innotek Standard Metal PCB (25x25x1.5 mm3(L×W×H)) except MSL test .
※ All samples must pass each test item and all test items must be satisfied.

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 LGIT Confidential and Proprietary

9. Packing and Labeling of Products

9-1. Taping Outline Dimensions

 Reel
( Unit : mm )

 Packing Materials :
- Reel : Conductive PS (Black)
- Emboss Tape : Conductive PS (Black)
- Cover Tape : Conductive PET Base

 Tape

Polarity Direction in Pocket

- +
Cathode Anode

 Taping Arrangement

(End) (Start)

Unloaded Tape Mounted with LED Unloaded Tape Leading Part

(Min. 200mm) (500ea) (Min. 40mm) (150 ~ 600mm)

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 LGIT Confidential and Proprietary

9. Packing and Labeling of Products

9-2. Package and Label Structure

※. Label A
Specifying ‘Lot ID’, ‘Model Name’, ‘MES ID’, ‘RANK’, ‘Q’ty’, ‘Run No’.

Lot ID : PPWS03R063M000101

Model : LEUVA33U70UL00 Q’ty : 1000[pcs]

MES ID : UA00B Run No : O94501-030
40mm RANK : U-HP11-V2
LEUVA33U70UL00=U-HP11-V2=O94501-030

U-HP11-V2 LG Innotek Co., Ltd.

80mm

 Run No. indication

1 2 3 4 5 6 7 8 9
Code Manufacture Manufacture Manufacture Manufacture Serial No
Site Year Month Date
Paju :1 2014 : 4 1~9 : 1~9 ( 01~31) ( 001 ~ 999 )
Huizhou : 9 ··· 10 : A
2020 : 0 11 : B
2021 : 1 12 : C

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 LGIT Confidential and Proprietary

9. Packing and Labeling of Products

9-2. Package and Label Structure

※ Label C
Specifying Customer, Date, Model Name, Quantity, Customer Part Number, Outbox ID,
Rank/Rank Quantity

<Example>
Out Box Customer 2015.05.01

LEUVA33U70UL00 / 10,000
40mm HSO5501001

U-HP11-V2=10,000

80mm

 Box ID. Indication

1 2 3 4 5 6 7 8 9 10
Manufacture PKG Box Year Month Date Serial No
Site Site

Paju : P PKG : S, P Inner Box : I 2014 : 4 1~9 : 1~9 (01 ~ 31) (001 ~ 999)
Huizhou : H Outer Box : O ··· 10 : A
2020 : 0 11 : B
2021 : 1 12 : C

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 LGIT Confidential and Proprietary

9. Packing and Labeling of Products

9-3. Packing Specifications
Reeled products(Numbers of products are Max.1,000pcs) packed in a sealed-off and moisture-proof
aluminum bag with desiccants(Silica Gel). A Maximum four aluminum bags are packed in an outer box.
(Total Max. number of products are 10,000pcs)

Aluminum moisture
Label A proof bag Sealing Label A

Taping Reel

Pb-Free Sticker Silica Gel 1 Bag : 1 Reel / 1 Silica Gel Pb-Free Sticker

Sizes (mm)
Types
ⓐ ⓑ ⓒ
Outer Box 300 240 195
Tolerance : ±10mm
Outer Box

OPP Tape (50mm)

Label C

ⓒ
Pb-Free Mark

ⓐ ⓑ
Aluminum
Eye Safety
moisture
Caution Mark
-proof bag

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 LGIT Confidential and Proprietary

10. Cautions on Use

10-1. Moisture-Proof Package

-. The moisture in the SMD package may vaporize and expand during soldering.
-. The moisture can damage the optical characteristics of the LEDs due to the encapsulation.

10-2. During Storage

Conditions Temperature Humidity Time

Within 1 Year from
Before Opening Aluminum Bag 5℃ ~ 30℃ ＜ 50%RH
the Delivery Date
Storage
After Opening Aluminum Bag 5℃ ~ 30℃ ＜ 60%RH ≤ 672 hours

Baking 65 ± 5℃ ＜ 10%RH 10 ~ 24 hours

-. The LEDs should be stored in a clean environment. If the LEDs are stored for 3 months or more
after being shipped from LGIT, a sealed container with a nitrogen gas should be used for storage.
-. When storing the LEDs after opening aluminum bag, reseal with a moisture absorbent material
inside

10-3. During Usage

-. The LED should avoid direct contact with hazardous materials such as sulfur, chlorine, phthalate,
etc.
-. The metal parts on the LED can rust when exposed to corrosive gases. Therefore, exposure to
corrosive gases must be avoided during operation and storage.
-. The silver-plated metal parts also can be affected not only by the corrosive gases emitted inside of
the end-products but by the gases penetrated from outside environment.
-. Extreme environments such as sudden ambient temperature changes or high humidity that can
cause condensation must be avoided.

10-4. Cleaning
-. Do not use brushes for cleaning or organic solvents (i.e. Acetone, TCE, etc..) for washing as
they may damage the resin of the LEDs.
-. Isopropyl Alcohol(IPA) is the recommended solvent for cleaning the LEDs under the following
conditions.
Cleaning Condition : IPA, 25℃ max. × 60sec max.
-. Ultrasonic cleaning is not recommended.
-. Pretests should be conducted with the actual cleaning process to validate that the process will not
damage the LEDs.

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 LGIT Confidential and Proprietary

10. Cautions on Use

10-5. Thermal Management

-. The thermal design of the end product must be seriously considered, particularly at the beginning of
the system design process.
-. The generation of heat is greatly impacted by the input power, the thermal resistance of the circuit
boards and the density of the LED array combined with other components.

10-6. Static Electricity

-. Wristbands and anti-electrostatic gloves are strongly recommended and all devices, equipment and
machinery must be properly grounded when handling the LEDs, which are sensitive against static
electricity and surge.
-. Precautions are to be taken against surge voltage to the equipment that mounts the LEDs.
-. Unusual characteristics such as significant increase of current leakage, decrease of turn-on voltage,
or non-operation at a low current can occur when the LED is damaged.

10-7. Electrostatic Discharge (ESD)

- The LEDs are sensitive to static electricity or surge voltage and current.
The Electrostatic Discharge can damage a LED Chip.
Also, It can be affect a reliability belong to the life time of LED package.
When handling LEDs, the following measures against ESD are actively recommended :
1) Please wear a wrist strap, anti-static clothes, foot wear and gloves.
2) Please set up a grounded or anti-static paint floors, a grounded or the ability to surge protection
-workstation equipment and tools.
3) ESD protection- worktable/bench, mat made of a conductive materials.
- An appropriate grounding is required for all devices, equipment, and machinery used in product
assembly.
Please apply surge protection after review when designing of commercial products(Curing Module,
etc).
- If tools or equipment contain insulating materials such as glass or plastics,
the following measures against ESD are strongly recommended :
1) Dissipating static charge with conductive materials
2) Preventing charge generation with moisture
3) Plug in the ionizing blowers(ionizer) for neutralizing the charge
- The customer is advised to check if the LEDs are damaged by ESD when performing
the characteristics inspection of the LEDs in the application.
Damage of LED can be detected with a forward voltage checking(measuring) at low current(≤1mA).
- ESD damaged LEDs may have a current flow at a low voltage.
* Failure Criteria : Vf < 2.0V at If = 0.5mA

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 LGIT Confidential and Proprietary

10. Cautions on Use

10-8. Recommended Circuit

-. The current through each LED must not exceed the absolute maximum rating when designing the
circuits.
-. In general, there can be various forward voltages for LEDs. Different forward voltages in parallel via
a single resistor can result in different forward currents to each LED, which also can output different
luminous flux values. In the worst case, the currents can exceed the absolute maximum ratings
which can stress the LEDs. Matrix circuit with a single resistor for each LED is recommended to
avoid the luminous flux fluctuations.

L1 L2 L3 L1 L2 L3 L1 L2 L3
RL1 RL2 RL3

RL

Fig.1. Recommended Circuit in Parallel Mode : Fig.2. Abnormal Circuit :

Separate resistors must be used for each LED. Avoid this circuits! The current through the LEDs
may vary due to the variation in LED forward voltage.

-. The driving circuits must be designed to operate the LEDs by forward bias only.
-. Reverse voltages can damage the zener diode, which can cause the LED to fail.
-. A constant current LED driver is recommended to power the LEDs.

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10. Cautions on Use

10-9. Soldering Conditions

-. Reflow soldering is the recommended method for assembling LEDs on a circuit board.
-. LG Innotek does not guarantee the performance of the LEDs assembled by the dip soldering
method.
-. Recommended Soldering Profile (according to JEDEC J-STD-020D)

Profile Feature Pb-Free Assembly Pb-Based Assembly

Preheat / Soak
Temperature Min (Tsmin) 150℃ 100℃
Temperature Max (Tsmax) 200℃ 150℃
Maximum time(ts) from Tsmin to Tsmax 60~120 seconds 60~120 seconds
Ramp-up rate (TL to Tp) 3℃/ second max. 3℃/ second max.

Liquidous temperature (TL) 217℃ 183℃

Time (tL) maintained above TL 60~150 seconds 60~150 seconds

Maximum peak package body temperature (Tp) 260℃ 235℃

Time(tp) within 5℃ of the specified temperature (Tc) 30 seconds 20 seconds

Ramp-down rate (Tp to TL) 6℃/second max. 6℃/second max.

Maximum Time 25℃ to peak temperature 8 minutes max. 6 minutes max.

-. Reflow or hand soldering at the lowest possible temperature is desirable for the LEDs although
the recommended soldering conditions are specified in the above diagrams.
-. A rapid cooling process is not recommended for the LEDs from the peak temperature.
-. The silicone encapsulant at the top of the LED package is a soft surface, which can easily be
damaged by pressure. Precautions should be taken to avoid strong pressure on the silicone resin
when leveraging the pick and place machines.
-. Reflow soldering should not be done more than two times.

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10. Cautions on Use

10-10. Soldering Iron

-. The recommended condition is less than 5 seconds at 260℃.
-. The time must be shorter for higher temperatures. (+10℃ → -1sec).
-. The power dissipation of the soldering iron should be lower than 15W and the surface temperature
of the device should be controlled at or under 230℃.

10-11. Eye Safety Guidelines

-. Do not directly look at the light when the LEDs are on.
-. Proceed with caution to avoid the risk of damage to the eyes when examining the LEDs with optical
instruments.

10-12. Manual Handling

-. Use Teflon-type tweezers to grab the base of the LED and do not apply mechanical pressure on the
surface of the encapsulant.

11. Disclaimers

-. LG Innotek is not responsible for any damages or accidents caused if the operating or storage
conditions exceed the absolute maximum ratings recommended in this document.
-. The LEDs described in this document are intended to be operated by ordinary electronic equipment.
-. It is recommended to consult with LG Innotek when the environment or the LED operation is non-
standard in order to avoid any possible malfunctions or damage to product or risk of life or health.
-. Disassembly of the LED products for the purpose of reverse engineering is prohibited without prior
written consent from LG Innotek. All defected LEDs must be reported to LG Innotek and are not to
be disassembled or analyzed.
-. The product information can be modified and upgraded without prior notice.

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 LGIT Confidential and Proprietary

History of Revision

Revision Date Contents of Revision Change Remark

Rev. 0.0 15.03.01 New Establishment

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