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APHBM2012SURKCGKC

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0% found this document useful (0 votes)
49 views4 pages

APHBM2012SURKCGKC

Uploaded by

Sói Ăn Rau
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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APHBM2012SURKCGKC

2.0 x 1.25 mm SMD Chip LED Lamp

DESCRIPTIONS PACKAGE DIMENSIONS


 The Hyper Red source color devices are made with
AlGaInP on GaAs substrate Light Emitting Diode
 The Green source color devices are made with
AlGaInP on GaAs substrate Light Emitting Diode
 Electrostatic discharge and power surge could
damage the LEDs
 It is recommended to use a wrist band or
anti-electrostatic glove when handling the LEDs
 All devices, equipments and machineries must be
electrically grounded

FEATURES
 2.0 mm x 1.25 mm SMD LED, 0.45 mm max. thickness
 Low power consumption
 Wide viewing angle
 Ideal for backlight and indicator
 Package: 2000 pcs / reel
 Moisture sensitivity level: 3
 Halogen-free
 RoHS compliant
RECOMMENDED SOLDERING PATTERN
APPLICATIONS (units : mm; tolerance : ± 0.1)
 Backlight
 Status indicator
 Home and smart appliances
 Wearable and portable devices
 Healthcare applications

ATTENTION
Observe precautions for handling
Notes:
electrostatic discharge sensitive devices 1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.1(0.004") unless otherwise noted.
3. The specifications, characteristics and technical data described in the datasheet are subject to
change without prior notice.
4. The device has a single mounting surface. The device must be mounted according to the specifications.

SELECTION GUIDE

Emitting Color Iv (mcd) @ 20mA [2] Viewing Angle [1]


Part Number Lens Type
(Material)
Min. Typ. 2θ1/2

120 250
■ Hyper Red (AlGaInP)
*40 *80
APHBM2012SURKCGKC Water Clear 120°
20 50
■ Green (AlGaInP)
*20 *50

Notes:
1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value.
2. Luminous intensity / luminous flux: +/-15%.
* Luminous intensity value is traceable to CIE127-2007 standards.

© 2021 Kingbright. All Rights Reserved. Spec No: DSAG7623 / 1203005979 Rev No: V.17A Date: 06/07/2021 Page 1 / 4
APHBM2012SURKCGKC
ELECTRICAL / OPTICAL CHARACTERISTICS at TA=25°C
Value
Parameter Symbol Emitting Color Unit
Typ. Max.

Hyper Red 645


Wavelength at Peak Emission IF = 20mA λpeak - nm
Green 574

Hyper Red 630


Dominant Wavelength IF = 20mA λdom [1] - nm
Green 570

Spectral Bandwidth at 50% Φ REL MAX Hyper Red 28


∆λ - nm
IF = 20mA Green 20

Hyper Red 35
Capacitance C - pF
Green 15

Hyper Red 1.95 2.5


Forward Voltage IF = 20mA VF [2] V
Green 2.1 2.5

Hyper Red 10
Reverse Current (VR = 5V) IR - µA
Green 10

Temperature Coefficient of λpeak Hyper Red 0.14


TCλpeak - nm/°C
IF = 20mA, -10°C ≤ T ≤ 85°C Green 0.12

Temperature Coefficient of λdom Hyper Red 0.05


TCλdom - nm/°C
IF = 20mA, -10°C ≤ T ≤ 85°C Green 0.08

Temperature Coefficient of VF Hyper Red -1.9


TCV - mV/°C
IF = 20mA, -10°C ≤ T ≤ 85°C Green -1.9
Notes:
1. The dominant wavelength (λd) above is the setup value of the sorting machine. (Tolerance λd : ±1nm. )
2. Forward voltage: ±0.1V.
3. Wavelength value is traceable to CIE127-2007 standards.
4. Excess driving current and / or operating temperature higher than recommended conditions may result in severe light degradation or premature failure.

ABSOLUTE MAXIMUM RATINGS at TA=25°C

Value
Parameter Symbol Unit
Hyper Red Green

Power Dissipation PD 75 75 mW

Reverse Voltage VR 5 5 V

Junction Temperature TJ 115 115 °C

Operating Temperature Top -40 To +85 °C

Storage Temperature Tstg -40 To +85 °C

DC Forward Current IF 30 30 mA

Peak Forward Current IFM [1] 185 150 mA

Electrostatic Discharge Threshold (HBM) - 3000 3000 V

Thermal Resistance (Junction / Ambient) Rth JA [2] 670 610 °C/W

Thermal Resistance (Junction / Solder point) Rth JS [2] 550 490 °C/W

Notes:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
2. Rt h JA ,Rt h JS Results from mounting on PC board FR4 (pad size ≥ 16 mm 2 per pad).
3. Relative humidity levels maintained between 40% and 60% in production area are recommended to avoid the build-up of static electricity – Ref JEDEC/JESD625-A and JEDEC/J-STD-033.

© 2021 Kingbright. All Rights Reserved. Spec No: DSAG7623 / 1203005979 Rev No: V.17A Date: 06/07/2021 Page 2 / 4
APHBM2012SURKCGKC
TECHNICAL DATA
RELATIVE INTENSITY vs. WAVELENGTH SPATIAL DISTRIBUTION
Green Red
100% -15° 0°
15°
Ta = 25 °C Ta = 25 °C
-30° 30°
Relative Intensity (a. u.)

80%
-45° 45°
60%

-60° 60°
40%

20%
-75° 75°

0%
350 400 450 500 550 600 650 700 750 800 -90° 90°
Wavelength (nm) 1.0 0.5 0.0 0.5 1.0

HYPER RED
Forward Current vs. Luminous Intensity vs. Forward Current Derating Curve Luminous Intensity vs.
Forward Voltage Forward Current Ambient Temperature

50 2.5 50 2.5
Permissible forward current (mA)
Luminous intensity normalised at

Luminous intensity normalised at


Ta = 25 °C Ta = 25 °C
Forward current (mA)

40 2.0 40 2.0

Ta = 25 °C
30 1.5 30 1.5
20 mA

20 1.0 20 1.0

10 0.5 10 0.5

0 0.0 0 0.0
1.5 1.7 1.9 2.1 2.3 2.5 0 10 20 30 40 50 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100
Forward voltage (V) Forward current (mA) Ambient temperature (°C) Ambient temperature (°C)

GREEN
Forward Current vs. Luminous Intensity vs. Forward Current Derating Curve Luminous Intensity vs.
Forward Voltage Forward Current Ambient Temperature

50 2.5 50 2.5
Permissible forward current (mA)
Luminous intensity normalised at

Luminous intensity normalised at

Ta = 25 °C Ta = 25 °C
Forward current (mA)

40 2.0 40 2.0
Ta = 25 °C

30 1.5 30 1.5
20 mA

20 1.0 20 1.0

10 0.5 10 0.5

0 0.0 0 0.0
1.5 1.7 1.9 2.1 2.3 2.5 0 10 20 30 40 50 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100
Forward voltage (V) Forward current (mA) Ambient temperature (°C) Ambient temperature (°C)

© 2021 Kingbright. All Rights Reserved. Spec No: DSAG7623 / 1203005979 Rev No: V.17A Date: 06/07/2021 Page 3 / 4
APHBM2012SURKCGKC
REFLOW SOLDERING PROFILE for LEAD-FREE SMD PROCESS TAPE SPECIFICATIONS (units : mm)

REEL DIMENSION (units : mm)

Notes:
1. Don't cause stress to the LEDs while it is exposed to high temperature.
2. The maximum number of reflow soldering passes is 2 times.
3. Reflow soldering is recommended. Other soldering methods are not recommended as they might
cause damage to the product.

PACKING & LABEL SPECIFICATIONS

PRECAUTIONARY NOTES
1. The information included in this document reflects representative usage scenarios and is intended for technical reference only.
2. The part number, type, and specifications mentioned in this document are subject to future change and improvement without notice. Before production usage customer should refer to
the latest datasheet for the updated specifications.
3. When using the products referenced in this document, please make sure the product is being operated within the environmental and electrical limits specified in the datasheet. If
customer usage exceeds the specified limits, Kingbright will not be responsible for any subsequent issues.
4. The information in this document applies to typical usage in consumer electronics applications. If customer's application has special reliability requirements or have life-threatening
liabilities, such as automotive or medical usage, please consult with Kingbright representative for further assistance.
5. The contents and information of this document may not be reproduced or re-transmitted without permission by Kingbright.
6. All design applications should refer to Kingbright application notes available at https://www.KingbrightUSA.com/ApplicationNotes

© 2021 Kingbright. All Rights Reserved. Spec No: DSAG7623 / 1203005979 Rev No: V.17A Date: 06/07/2021 Page 4 / 4

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