TECHNICAL BULLETIN
ALPHA® CVP-390
NO-CLEAN, LEAD-FREE SOLDER PASTE ZERO-HALOGEN, LOW VOIDS, FINE FEATURE,
EXCELLENT PIN TEST PERFORMANCE, SAC305, SAC405, & LOW AG CAPABLE
DESCRIPTION
ALPHA CVP-390 is a lead-free, Zero-halogen no-clean solder paste designed for applications where
residue with excellent pin testing property and ability to pass JIS Copper Corrosion test are required.
This product is also designed to enable consistent fine pitch printing capability, down to 180m circle
printed with 100m thickness stencil. Its excellent print volume deposit repeatability also provides value
by reducing defects associated with print process variability. Additionally, ALPHA CVP-390 achieves
IPC7095 Class III voiding performance.
FEATURES & BENEFITS
• Long Stencil Life: consistent performance for at least 8 hours of continuous printing without addition
of new paste
• Long, High Tack Force Life: ensures high pick-and-place yields, good self-alignment
• Wide Reflow Profile Window: allows best quality solderability of complicated, high density PWB
assemblies in both air and nitrogen reflow, using ramp and soak profiles, as high as 175 to 185°C
• Reduced Random Solder Ball Levels: minimizes rework and increases first time yield
• Excellent Coalescence and Wetting Performance: coalesced 180µm circle deposit, even at high
soak profile environment
• Excellent Solder Joint and Flux Residue Cosmetics: after reflow soldering, even using long/high
thermal soaking, without charring or burning
• Excellent Voiding Performance: Meets IPC7095 Class III Requirement
• Halogen Content: Zero Halogen, no halogen intentionally added
• Residue: Excellent Pin Testing property and Pass JIS Copper Corrosion Test
• Safe and Environmentally Friendly: Materials comply with RoHS and Halogen-free requirements
(see table below), as well as TOSCA & EINECS
PRODUCT INFORMATION
Alloys: SAC105, SAC305, SAC405, SACX Plus 0307 SMT,
SACX Plus 0807 SMT, Innolot, Maxrel Plus, Sn99.3/Cu0.7, 90Sn10Sb,
For other alloys, contact your local Alpha Sales Office
Powder Size: Type 3, Type 4, Type 4.5, Type 5
Packaging Sizes: 500 gram jars, 6” & 12” cartridges
Flux Gel: Flux gel is available in 10 and 30 cc syringes for rework applications
Lead Free: Complies with RoHS Directive 2011/65/EC
SM # 1068-18 2017-12-08
TECHNICAL BULLETIN
ALPHA® CVP-390
NO-CLEAN, LEAD-FREE SOLDER PASTE ZERO-HALOGEN, LOW VOIDS, FINE FEATURE,
EXCELLENT PIN TEST PERFORMANCE, SAC305, SAC405, & LOW AG CAPABLE
APPLICATION
Formulated for both standard and fine pitch stencil printing, at print speeds of between 25mm/sec (1”/sec)
and 150mm/sec (6”/sec), with stencil thickness of 0.100mm (0.004”) to 0.150mm (0.006”), particularly when
used in conjunction with ALPHA Stencils. Blade pressures should be 0.21-0.36 kg/cm of blade (1.25 -1.5
Ibs/inch), depending upon the print speed. The higher the print speed employed, the higher the blade
pressure that is required. The reflow process window will give high soldering yield with good cosmetics and
minimized rework.
HALOGEN STATUS
ALPHA CVP-390 is a Zero Halogen product and passes the standards listed in the Table below:
Halogen Standards
Standard Requirement Test Method Status
JEITA ET-7304
< 1000 ppm Br, Cl, F in solder
Definition of Halogen Free Pass
material solids
Soldering Materials
Post Soldering Residues contain
< 900 ppm each or total of < 1500 TM EN 14582
IEC 612249-2-21 Pass
ppm Br or Cl from flame retardant
source
JEDEC Post soldering residues contain
A Guideline for Defining "Low < 1000 ppm Br or Cl from flame Pass
Halogen" Electronics retardant source
Zero Halogen: No halogenated compounds have been intentionally added to this product
SM # 1068-18 2017-12-08
TECHNICAL BULLETIN
ALPHA® CVP-390
NO-CLEAN, LEAD-FREE SOLDER PASTE ZERO-HALOGEN, LOW VOIDS, FINE FEATURE,
EXCELLENT PIN TEST PERFORMANCE, SAC305, SAC405, & LOW AG CAPABLE
TECHNICAL DATA
CATEGORY RESULTS PROCEDURES/REMARKS
CHEMICAL PROPERTIES
Activity Level ROL0 IPC J-STD-004B
Halide Content Halide free (by IC) IPC J-STD-004B
Fluoride Spot Test Pass JIS-Z-3197-1999 8.1.4.2.4
Pass, Zero Halogen - No EN14582, by oxygen bomb combustion,
Halogen Test
halogen intentionally added Non-detectable (ND) at < 50 ppm
Ag Chromate Test Pass IPC J-STD-004B
Pass JIS-Z-3197-1999 8.1.4.2.3
Pass IPC J-STD-004B
Copper Mirror Test
Pass JIS-Z-3197-1999 8.4.2
Pass
(No evidence of Corrosion) IPC J-STD-004B
Copper Corrosion Test
Pass JIS-Z-3197-1999 8.4.1
(No evidence of Corrosion)
ELECTRICAL PROPERTIES
Water Extract Resistivity 13,400 ohm-cm JIS-Z-3197-1999 8.1.1
SIR IPC J-STD-004B TM-650 2.6.3.7
Pass
(7 days, 40°C/90%RH, 12 V bias) (Pass ≥ 1 x 108ohm)
Electromigration Bellcore GR78-CORE
(Bellcore 500 hrs @ 65°C/85%RH Pass
10V)
(Pass=final > initial/10)
JIS Electromigration
Pass JIS-Z-3197-1999 8.5.4
(1000 hours @ 85°C/85%RH 48V)
SM # 1068-18 2017-12-08
TECHNICAL BULLETIN
ALPHA® CVP-390
NO-CLEAN, LEAD-FREE SOLDER PASTE ZERO-HALOGEN, LOW VOIDS, FINE FEATURE,
EXCELLENT PIN TEST PERFORMANCE, SAC305, SAC405, & LOW AG CAPABLE
PHYSICAL PROPERTIES
PROCEDURES/
CATEGORY RESULTS
REMARKS
PHYSICAL PROPERTIES
Color Clear, Colorless Flux Residue
Pass, > 100gf over 24 hours at 25%, 50% and JIS Z-3284-1994, Annex 9
75 % Relative Humidity
Tack Force vs. Humidity
Pass, Change of <1g/mm2 over 24 hours at 25% IPC J-STD-005
and 75 % Relative Humidity TM-650 2.4.44
Tack Force at 32°C/35%RH, measured
> 100gf JIS Z-3284-1994, Annex 9
after 0, 1, 2, 3 & 4 hours print duration
Viscosity Stability at 25ºC for 20 days Pass Malcom Spiral Viscometer
Continuous Viscosity Measurement at
Pass Malcom Spiral Viscometer
25ºC for 24 hours
Coalescence Test Able to reflow at < 200 μm Cu pad circle size Internal
IPC J-STD-005
Solder Ball Preferred
TM-650 2.4.43
Rhesca Test, Test Time T2,
Wetting Time Pass 0.34 second
3 seconds
Spread 80% JIS-Z-3197-1999 8.3.1.1
Stencil Life >8 hours @ 50% RH 23°C (74°C)
No bridge for 0.2 mm space JIS-Z-3284-1994 Annex 7
Cold Slump IPC J-STD-005
Not tested
TM-650 2.4.35
No bridge for 0.4 mm space JIS-Z-3284-1994 Annex 8
Hot Slump IPC J-STD-005
Pass
TM-650 2.4.35
Dryness Test (Talc) Pass JIS-Z-3197-1999 8.5.1
SM # 1068-18 2017-12-08
TECHNICAL BULLETIN
ALPHA® CVP-390
NO-CLEAN, LEAD-FREE SOLDER PASTE ZERO-HALOGEN, LOW VOIDS, FINE FEATURE,
EXCELLENT PIN TEST PERFORMANCE, SAC305, SAC405, & LOW AG CAPABLE
SAFETY
While the ALPHA CVP-390 flux system is not considered toxic, its use in typical reflow will generate a small
amount of reaction and decomposition vapors. These vapors should be adequately exhausted from the
work area. Consult the SDS (available at www.AlphaAssembly.com) for all safety information.
STORAGE & HANDLING PRINTING REFLOW (see Fig. 1) CLEANING
1. Refrigerate to guarantee stability STENCIL: Recommend ATMOSPHERE: Clean-dry ALPHA CVP-390 residue
@ 0-10°C (32-50°F). When stored ALPHA CUT, ALPHA air or nitrogen atmosphere. is designed to remain on
under these conditions, the shelf NICKEL-CUT, ALPHA the board after reflow. If
life of CVP-390 is 6 months. TETRABOND®, or ALPHA PROFILE (SAC Alloys): reflowed residue cleaning
FORM stencils @ Straight Ramp: 0.7°C/sec & is required, Vigon® A201
2. Paste can be stored for 4 weeks 0.100mm - 0.150 mm (4-6 1.3°C/sec ramp profiles, 45 - (in line cleaning), Vigon A
at room temperature up to mil) thick for 0.4 - 0.5 mm 90 TAL. 250 (Batch Cleaning) or
25°C(77°F) prior to use (0.016” or 0.020”) pitch. Vigon US (Ultrasonic
Stencil design is subject to Soak: 155–175 °C, 60 to 100 Cleaning) are
3. When refrigerated, warm up many process variables. sec soak profiles have been recommended. Vigon is a
paste container to room Contact your local Alpha determined to give optimal registered trademark of
temperature for up to 4 hours. stencil site for advice. results. If required, good Zestron.
Paste must be 19°C (66°F) before results are also achievable
processing. Verify paste SQUEEGEE: with high soak temperature Misprints and stencil
temperature with a thermometer to Metal (recommended) profiles of 17 –185°C for 60 s. cleaning may be done with
ensure paste is at 19°C (66°F) or Typical peak temperature is IPA, ALPHA SM-110E,
greater before set up of printer. PRESSURE: 0.21 - 0.36 235 to 245°C. ALPHA SM-440, and
kg/cm of blade (1.25 -2.0 Bioact® SC-10E cleaners.
4. Paste can be manually stirred Ibs/inch) Note 1: Keeping the peak Bioact is a registered
before use. A rotating/Centrifugal temperature below 241ºC trademark of Petroferm.
force mixing operation is not SPEED: 25 – 150 mm per may reduce the number and
required. If a rotating/centrifugal second (1 – 6 inches per size of BGA and QFN voids.
force mixing is used, 30 - 60 second).
seconds at 300 RPM is adequate. Note 2: Refer to component
PASTE ROLL: 1.5-2.0 cm and board supplier data for
5. Do not remove worked paste diameter and make thermal properties at elevated
from stencil and mix with unused additions when roll reaches temperatures. Lower peak
paste in jar. This will alter the 1-cm (0.4”) diameter (min). temperatures require longer
rheology of unused paste. Max roll size will depend TAL for improved joint
upon blade. cosmetics.
6. These are starting
recommendations and all process STENCIL RELEASE
settings should be reviewed SPEED: 1 – 5 mm/sec.
independently.
LIFT HEIGHT: 8 – 14mm
(0.31- 0.55”)
SM # 1068-18 2017-12-08
TECHNICAL BULLETIN
ALPHA® CVP-390
NO-CLEAN, LEAD-FREE SOLDER PASTE ZERO-HALOGEN, LOW VOIDS, FINE FEATURE,
EXCELLENT PIN TEST PERFORMANCE, SAC305, SAC405, & LOW AG CAPABLE
Fig 1: ALPHA CVP-390 SAC305 Typical Reflow Profile
Parameter Guideline Additional Information
Atmosphere Air or N2
217 -221°C
SAC305
Melting Range
217 -225°C
SACX Plus™ 0807 SMT
Melting Range
217 - 227°C
SACX Plus™ 0307 SMT
Melting Range
Setting Zone* Optimal Dwell Period Extended window
40°C to 221oC 2:30 to 4:30 min. < 5:00 min.
170°C to 221°C 0:30 to 2:00 min < 2:30 min.
120°C to 221°C 1:25 to 3:00 min. < 3:30 min.
TAL (217 - 221°C) 45 - 90 sec. Not Recommended
Compatible with most common surface
finishes. (Entek HT, Entek OM, Alpha Star,
Peak temperature 235 - 245°C ENIG, SACX® HASL). Coldest point on the
PCB can be as low as 230°C.
Paste can withstand 250°C during reflow.
Recommended to prevent surface cracking
Joint cool down rate 1 - 6°C/second
issues.
Above recommendations are for SAC305.
For alternative alloys, please follow the liquidus temperature of the respective alloy
SM # 1068-18 2017-12-08
TECHNICAL BULLETIN
ALPHA® CVP-390
NO-CLEAN, LEAD-FREE SOLDER PASTE ZERO-HALOGEN, LOW VOIDS, FINE FEATURE,
EXCELLENT PIN TEST PERFORMANCE, SAC305, SAC405, & LOW AG CAPABLE
CONTACT INFORMATION
To confirm this is the most recent issue, please contact Alpha Assembly Solutions
www.AlphaAssembly.com
North America Europe Asia
300 Atrium Drive Unit 2, Genesis Business Park 8/F., Paul Y. Centre
Somerset, NJ 08873, USA Albert Drive 51 Hung To Road
800.367.5460 Woking, Surrey, GU21 5RW, UK Kwun Tong, Kowloon, Hong
01483.758400 Kong
852.3190.3100
Also read carefully warning and safety information on the Safety Data Sheet. This data sheet contains technical information required for safe and economical operation of this product. READ IT
THOROUGHLY PRIOR TO PRODUCT USE. Emergency directory assistance Chemtrec 1 - 800 - 424 - 9300.
DISCLAIMER: All statements, technical information and recommendations contained herein are based on tests we believe to be reliable, but the accuracy or completeness thereof is not
guaranteed. No statement or recommendation shall constitute a representation unless set forth in an agreement signed by officers of seller and manufacturer. NO WARRANTY OR
MERCHANTABILITY OR WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE IS MADE. The following warranty is made in lieu of such warranties and all other warranties, express,
implied, or statutory. Products are warranted to be free from defects in material and workmanship at the time sold. The sole obligation of seller and manufacturer under this warranty shall be to
replace any product defective at the time sold. Under no circumstances shall manufacturer or seller be liable for any loss, damage or expense, direct or consequential, arising out of the inability
to use the product. Notwithstanding the foregoing, if products are supplied in response to a customer request that specifies operating parameters beyond those stated above, or if produ cts are
used under conditions exceeding said parameters, the customer by acceptance or use thereof assumes all risk of product failure and of all direct, indirect and consequential damages that may
result from use of the products under conditions, and agrees to exonerate, indemnify and hold harmless MacDermid Incorporated therefrom. No suggestion for product use nor anything
contained herein shall be construed as a recommendation to use any product in infringement of any patent rights, and seller and manufacturer assume no responsibility or liability for any such
infringement.
® Registered Trademark of MacDermid Performance Solutions. ™ Trademark of MacDermid Performance Solutions.
© Platform Specialty Products Corporation and its subsidiaries 2016.
SM # 1068-18 2017-12-08
