TECHNICAL DATA SHEET

WP616 Solder Paste

Lead-Free, Water Soluble, Zero-Halogen

Product Description
Kester WP616 Solder Paste is a zero-halogen, lead-free, water soluble solder paste formula for
both nitrogen and air reflow applications. WP616 provides a combination of consistent print
performance at wide humidity levels, excellent solderability and ease of cleaning, while
maintaining a zero-halogen flux formulation. WP616 is a stable water soluble formula, providing
consistent stencil life, tack time and print definition. WP616 is classified as ORM0 flux under IPC
J-STD-004B.

Performance Characteristics:
 Superior reflow characteristics
 Classified as ORM0 per J-STD-004B
 Excellent activity and printability
 Zero-Halogen (none intentionally added)
 Wide reflow profile window with good solderability
 Reflowable in air and nitrogen conditions
 Cleaning can be accomplished with heated deionized water

RoHS Compliance
This product meets the requirements of the Restriction of Hazardous Substances (RoHS)
Directive. Additional RoHS information is located at
https://www.kester.com/downloads/environmental.

Physical Properties
(SAC 305 and SnAg, T4)

Viscosity (typical): 1700 poise

Malcom Viscometer @ 10 rpm and 25 °C

Slump Test: Pass

Tested to J-STD-005, IPC-TM-650, Method 2.4.35

Solder Ball Test: Pass

Tested to J-STD-005, IPC-TM-650, Method 2.4.43

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Wetting: Pass
Tested to J-STD-005, IPC-TM-650, Method 2.4.45

Reliability Properties
Copper Mirror: M
Tested to J-STD-004B, IPC-TM-650, Method 2.3.32

Copper Corrosion: L
Tested to J-STD-004B, IPC-TM-650, Method 2.6.15

Halogen Content: None Detected

Tested to J-STD-004B, IPC-TM-650, Method 2.3.41

Electrochemical Migration (ECM): Pass

Tested to J-STD-004B, IPC-TM-650, Method 2.6.14.1

Surface Insulation Resistance (SIR): Pass

Tested to J-STD-004B, IPC-TM-650, Method 2.6.3.7
Test Conditions: 40 °C, 90% RH, 7 days, 12.5V

Availability
Standard alloy availability for WP616 is Sn96.5Ag3.0Cu0.5 with Type 3 (T3), Type 4 (T4) and
Type 5 (T5) powder size distribution. T4 mesh size is recommended for standard and fine pitch
applications. T5 is recommended for ultra-fine pitch applications. WP616 is also compatible with
other SnAgCu and SnAg alloys in similar melting range to the listed alloy. For specific
packaging information, refer to Kester’s Solder Paste Packaging Chart for available sizes. The
appropriate alloy and powder size combination depends on the process variables and the
specific application. If you are looking for alloy or powder sizes currently not listed on Kester’s
Solder Paste Packaging Chart, please contact your Kester Sales or Technical Representative.

Printing Parameters
Below are process guidelines, and it is advisable to note that the optimum setting for a given
assembly may vary and this is dependent on the circuit board design, board thickness,
components used, and equipment used. A design of experiments is recommended to be done
to optimize the soldering process. In addition, incoming solderability inspection of circuit boards
and components is recommended as part of process control to maintain consistent soldering
performance and electrical reliability.

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Print Temperature Window 20 to 30 °C (68 to 86 °F) / 30 to 65% RH

Squeegee Angle 60° from horizontal
Speed 25 to 200 mm/sec (1 to 8 in/sec)
Pressure 1
0.18 to 0.27 kg/cm (1 to 1.5 lb/in)
Separation Speed 5 to 20 mm/sec
Stencil life 8 hours at 21 to 24 °C (70 to 75 °F) / 40 to 45% RH
1
Pressure should be increased with increasing print speed. First set the print speed. Then set
the pressure to the minimum required to clean the solder paste off of the stencil.

Recommended Reflow Profile

The recommended reflow profile for formula
made with SAC and SnAg alloys is shown here.
This profile is simply a guideline. WP616 has
excellent solderability and wetting across a wide
range of profiles, with similar performance in air
and nitrogen. Your optimal profile may be
different from the one shown based on your oven,
board and mix of defects. Contact Kester
Technical Support if you need additional profiling
advice.

Cleaning
WP616 is a water soluble formula. Its residues are best removed using automated cleaning
equipment (in-line or batch). Deionized water heated to 60 to 75 °C (140 to 165 °F) should be
used followed by a final rinse with deionized water. It is recommended to clean the circuit board
after each reflow cycle. Commercial cleaning agent can be used. Contact your supplier for
recommendations.

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Recycling Services
We provide safe and efficient recycling services to help companies meet their
environmental and legislative requirements and at the same time, maximize
the value of their waste streams.

Our service collects solder dross, solder scrap, and various forms of solder
paste waste. Please contact your local sales representative for recycling
capabilities in your area or link here.

Storage, Handling and Shelf Life

WP616 has a six-month shelf life when refrigerated. Refrigeration (0 to 10 °C/32 to 50 °F) is the
recommended storage condition for solder paste to maintain consistent viscosity, reflow
characteristics and overall performance. WP616 should be stabilized at room temperature prior
to printing. Please contact Kester Technical Support if you require additional advice with regards
to handling and storage of this material.

Health and Safety

This product, during handling or use, may be hazardous to your health or the environment.
Read the Safety Data Sheet and warning label before using this product. Safety Data Sheets
are available at this link.

Contact Information
To confirm this document is the most recent version, please contact
Assembly@MacDermidAlpha.com

North America Europe Asia Pacific

109 Corporate Blvd. Unit 2, Genesis Business Park 8/F., Paul Y. Centre
South Plainfield, NJ 07080, USA Albert Drive 51 Hung To Road
1.800.253.7837 Woking, Surrey, GU21 5RW, UK Kwun Tong, Kowloon, Hong Kong
44.01483.758400 852.3190.3100

Also read carefully warning and safety information on the Safety Data Sheet. This data sheet contains technical information required for safe and economical operation of this product. READ IT THOROUGHLY
PRIOR TO PRODUCT USE. Emergency safety directory assistance: US 1 202 464 2554, Europe + 44 1235 239 670, Asia + 65 3158 1074, Brazil 0800 707 7022 and 0800 172 020, Mexico 01800 002 1400 and (55)
5559 1588

DISCLAIMER: All statements, technical information and recommendations contained herein are based on tests we believe to be reliable, but the accuracy or completeness thereof is not guaranteed. No
statement or recommendation shall constitute a representation unless set forth in an agreement signed by officers of seller and manufacturer. NO WARRANTY OF MERCHANTABILITY, WARRANTY OF FITNESS
FOR A PARTICULAR PURPOSE OR ANY IMPLIED WARRANTY IS MADE. The following warranty is made in lieu of such warranties and all other warranties, express, implied, or statutory. Products are warranted to
be free from defects in material and workmanship at the time sold. The sole obligation of seller and manufacturer under this warranty shall be to replace any noncompliant product at the time sold. Under no
circumstances shall manufacturer or seller be liable for any loss, damage or expense, direct, indirect, incidental or consequential, arising out of the inability to use the product. Notwithstanding the foregoing, if
products are supplied in response to a customer request that specifies operating parameters beyond those stated above, or if products are used under conditions exceeding said parameters, the customer by
acceptance or use thereof assumes all risk of product failure and of all direct, indirect, incidental and consequential damages that may result from use of the products under such conditions, and agrees to
exonerate, indemnify, defend and hold harmless MacDermid, Incorporated and its affiliates therefrom. No suggestion for product use nor anything contained herein shall be construed as a recommendation to
use any product in a manner that infringes any patent or other intellectual property rights, and seller and manufacturer assume no responsibility or liability for any such infringement.

© 2019 MacDermid, Inc. and its group of companies. All rights reserved. “(R)” and “TM” are registered trademarks of MacDermid, Inc. and its group of companies in the United States and/or other countries.

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