TECHNICAL BULLETIN

ALPHA® OM-340 SOLDER PASTE

No-Clean, Lead-Free, Fine Feature, Zero-Halogen, Low HiP, Highly Pin-Testable

DESCRIPTION

ALPHA OM-340 is a lead-free, no-clean solder paste designed for a broad range of
applications. It provides best-in-class low defect rate for head-in-pillow defects combined with
excellent first pass yield on ICT/pin testing. ALPHA OM-340 also yields excellent print
capability performance across various board designs and, particularly with ultra-fine feature
repeatability and high “throughput” applications.
An outstanding reflow process window delivers superior soldering on CuOSP with excellent
coalescence on a broad range of deposit sizes and excellent random solder ball resistance and
mid-chip solder ball performance. ALPHA OM-340 is formulated to deliver excellent visual joint
cosmetics and best-in-class in circuit pin test yields. Additionally, ALPHA OM-340’s capability
of IPC-7095 Class 3 for voiding and ROL0 IPC classifications ensures maximum long-term
product reliability.

READ ENTIRE TECHNICAL DATA SHEET BEFORE USING THIS PRODUCT

FEATURES & BENEFITS

• Maximizes reflow yield for lead-free processing, allowing full alloy coalescence at circular
dimensions as small as 200 μm (8 mil) with 100 μm (4 mil) thick stencils
• Excellent print consistency with high process capability index across all board designs
• Print speeds of up to 150 mm/s (6 in/s), enabling a fast print cycle time and a high
throughput
• Wide reflow profile window with good solderability on various board / component finishes
• Excellent solder and flux cosmetics after reflow soldering
• Best-in-class low defect rate for head-in-pillow
• Best-in-class in circuit pin test yield
• Reduction in random solderballing levels, minimizing rework, and increasing first time yield
• Meets highest IPC-7095 voiding performance classification of Class 3
• Excellent reliability properties, halide-free material
• Compatible with either nitrogen or air reflow
• Zero-halogen (No halogen intentionally added to the formulation)

ALPHA OM-340 SOLDER PASTE

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PRODUCT INFORMATION

Alloys: SAC305, SAC405, Sn96Ag4, SACX® Plus 0307, SACX Plus 0807,
Innolot
Powder Size: Type 3, Type 4, Type 4.5, Type 5, & Type 6
Packaging Sizes: 500 gram jars, 6 & 12 inch cartridges and 10 cc & 30 cc dispense syringes
FluxGel: ALPHA OM-340 Flux Gel is available in 10 cc and 30 cc syringes for
rework applications.
Lead Free: Complies with RoHS Directive EU/2015/863

APPLICATION GUIDELINES

Formulated for both standard and fine pitch stencil printing, at print speeds of between 25
mm/sec (1 in/s) and 150 mm/sec (6 in/s), with stencil thickness of 100 μm (4 mil) to 150 μm (6
mil), particularly when used with ALPHA Stencils. Blade pressures should be 0.18 to 0.27 kg/cm
of blade (1.0 to 1.5 Ibs/in), depending upon the print speed. The higher the print speed
employed, the higher the blade pressure that is required. The reflow process window will give
high soldering yield with good cosmetics and minimized rework.

HALOGEN STATUS

Halogen Standards
Test
Standard Requirement Status
Method
JEITA ET-7304
< 1000 ppm Br, Cl, F in solder material
Definition of Halogen Free Pass
solids
Soldering Materials
Post Soldering Residues contain < 900 TM EN
IEC 612249-2-21 ppm each or total of < 1500 ppm Br or 14582 Pass
Cl from flame retardant source
JEDEC Post soldering residues contain < 1000
A Guideline for Defining ppm Br or Cl from flame retardant Pass
"Low Halogen" Electronics source
Zero-Halogen: No halogenated compounds have been intentionally added to this product

ALPHA OM-340 SOLDER PASTE

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TECHNICAL DATA

Category Results Procedures/Remarks

Chemical Properties
Flux Classification ROL0 IPC J-STD-004B
Halide-free (by titration).
Halide Content IPC J-STD-004B
Passes Ag Chromate Test
Pass, Zero Halogen - No
Halogen Content EN14582
halogen intentionally added
Pass, Low activity, no
Copper Mirror IPC J-STD-004B
breakthrough
Pass, Low activity, no
Copper Corrosion Test IPC J-STD-004B
corrosion
Electrical Properties

SIR
Pass, ≥ 108 ohm IPC J-STD-004A
(IPC 7 days @ 85 °C /85% RH)
SIR Pass, ≥108 ohms for 7 days
IPC J-STD-004B
(IPC 7 days @ 40 °C /90% RH) down to 100 µm spacing
SIR (Bellcore 96 hrs @ 35 °C
Pass, ≥ 1011 ohm GR78-Core
/85% RH)
Electromigration (Bellcore 96 Pass, (final > initial/10)
hrs @ 65 °C/85% RH 10V 500 GR78-Core
hrs)
Physical Properties
Color Clear, Colorless Flux Residue
Pass, Change of <1 g/mm2 IPC J-STD-005
over 24 hrs @ 25 ± 2 °C and
50 ± 10% Relative Humidity TM-650 2.4.44
Tack Life
Pass, Change of <10% when
stored at 25 ± 2 °C and 50 ± JIS Z 3284: Annex 9
10% Relative Humidity
Acceptable
IPC J-STD-005
(SAC305 and SAC405)
Solderball
Pass, Class I - 1 hour and DIN Standard 32 513,
72 hours 4.4
Stencil Life > 8 hours @ 50% RH, 25 °C (74 °F)

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Category Results Procedures/Remarks

Spread Pass JIS Z 3197: 1999 8.3.1.1
Pass, no bridging at 0.20 mm
IPC J-STD-005A
gap & above
Cold Slump (25 °C /50% RH)
Pass, no bridging at 0.20 mm
JIS Z 3284:1994 Annex 7
gap & above
Pass, no bridging at 0.25 mm
IPC J-STD-005A
gap & above
Hot Slump (150 °C/10 min)
Pass, no bridging at 0.40 mm
JIS Z 3284:1994 Annex 8
gap & above

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PROCESSING GUIDELINES

Storage and Handling Printing Reflow (See Fig 1 & 2) Cleaning

• Refrigerate to guarantee Stencil: Recommend ALPHA ATMOSPHERE: ALPHA OM-340

stability @ 0 to 10 °C (32 to 50 CUT, ALPHA NICKEL-CUT, Clean-dry air or residue is designed
°F) ALPHA TETRABOND, or nitrogen atmosphere. to remain on the
ALPHA FORM stencils @ board after reflow.
• Shelf life of refrigerated paste 0.100 to 0.150 mm (4 to 6
is 6 months. mil) thick for 0.4 to 0.5 mm PROFILE (SAC
• Paste can be stored for 2 (0.016 inch or 0.020 inch) Alloys): Acceptable If reflowed residue
weeks at room temperatures pitch. Stencil design is reflow / coalescence cleaning is required,
up to 25 °C (77 °F) prior to subject to many process for feature size down to the following
use. variables. Contact your local 8 mil (200 μm). IPC aqueous cleaners
ALPHA representative for Class III voiding are recommended:
• When refrigerated, warm-up
advice. obtained for both
of paste container to room In-line or Batch
straight ramp and soak
temperature for a minimum of Cleaners:
profiles.
4 hours. Paste must be >19 ALPHA BC-2200
Squeegee: Metal
°C (66 °F) before processing. Zestron Vigon A201
(recommended)
Verify paste temperature with Zestron Vigon A250
Compatible with most
a thermometer to ensure Zestron Vigon US
common surface
paste is at 19 °C (66 °F) or
Paste Roll: 1.5 to 2.0 cm finishes. (ENTEK HT,
greater before setup. In some
diameter and make additions ENTEK OM, Alpha Manual or solvent
conditions, up to 8 hours may
when roll reaches 1 cm (0.4 Star, ENIG, SACX cleaning:
be necessary to ensure paste
in) diameter (min). Max roll HASL) ALPHA SM-110
temperature is greater than 19
size will depend upon blade ALPHA SM-110E
°C prior to use. Printing can
be performed at temperatures NOTE 1: Refer to
up to 32 °C (89 °F). Pressure: 0.45 to 0.7 kg/in component and board Misprints and stencil
• Paste can be manually stirred supplier data for cleaning may be
before use. A rotating, thermal properties at done with the
centrifugal force mixing Speed: 25 to 150mm per elevated temperatures. following cleaners:
operation is not required. If a second (1 to 6 inches per Lower peak ALPHA SM-110E
rotating/centrifugal force second). temperatures require ALPHA SM-440
mixing is used, 30 to 60 longer TAL for Zestron Vigon
seconds at 300 RPM is improved joint SC200
adequate. Stencil Release Speed: cosmetics. Keeping the
3 to 10 mm/s peak temperature
• Do not remove worked paste
from stencil and mix with below 240 °C will lower
unused paste in jar. This will the amount of voiding.
Print Pump Head: Passes
alter rheology of unused
DEK ProFlow® compatibility
paste.
test

These are starting recommendations and all process settings should be reviewed independently.

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REFLOW PROFILES

ALPHA OM-340 SAC305 & Innolot Typical Reflow Profile Recommendation

Soak Profile: SAC305 and Innolot

Straight Ramp: SAC305 and Innolot

NOTE 2: The processing guidelines recommended and typical reflow profiles presented were
tested in the lab with acceptable performance. Optimization to each board application should
still be carried out by users to ensure best results.

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SAFETY & WARNING

It is recommended that the company/operator read and review the Safety Data Sheets for the
appropriate health and safety warnings before use. Safety Data Sheets are available at
MacdermidAlpha.com/assembly-solutions/knowledge-base.

CONTACT INFORMATION

To confirm this document is the most recent version, please contact

Assembly@MacDermidAlpha.com
www.macdermidalpha.com

North America Europe Asia

109 Corporate Blvd. Unit 2, Genesis Business Park 8/F., Paul Y. Centre
South Plainfield, NJ 07080, USA Albert Drive 51 Hung To Road
800.367.5460 Woking, Surrey, GU21 5RW, UK Kwun Tong, Kowloon, Hong Kong
01483.758400 852.3190.3100

Also read carefully warning and safety information on the Safety Data Sheet. This data sheet contains technical information required for safe and economical operation of this product. READ IT
THOROUGHLY PRIOR TO PRODUCT USE . Emergency safety directory assistance: US 1 202 464 2554, Europe + 44 1235 239 670, Asia + 65 3158 1074, Brazil 0800 707 7022 and 0800
172 020, Mexico 01800 002 1400 and (55) 5559 1588

DISCLAIMER: All statements, technical information and recommendations contained herein are based on tests we believe to be reliable, but the accuracy or completeness thereof is not
guaranteed. No statement or recommendation shall constitute a representation unless set forth in an agreement signed by officers of seller and manufacturer. NO WARRANTY OF
MERCHANTABILITY, WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE OR ANY IMPLIED WARRANTY IS MADE. The following warranty is made in lieu of such warranties and all
other warranties, express, implied, or statutory. Products are warranted to be free from defects in material and workmanship at the time sold. The sole obligation of seller and manufacturer
under this warranty shall be to replace any noncompliant product at the time sold. Under no circumstances shall manufacturer or seller be liable for any loss, damage or expense, direct,
indirect, incidental or consequential, arising out of the inability to use the product. Notwithstanding the foregoing, if products are supplied in response to a customer request that specifies
operating parameters beyond those stated above, or if products are used under conditions exceeding said parameters, the customer by acceptance or use thereof assumes all risk of product
failure and of all direct, indirect, incidental and consequential damages that may result from use of the products under such conditions, and agrees to exonerate, indemnify, defend and hold
harmless MacDermid, Incorporated and its affiliates therefrom. No suggestion for product use nor anything contained herein shall be construed as a recommendation to use any product in a
manner that infringes any patent or other intellectual property rights, and seller and manufacturer assume no responsibility or liability for any such infringement.

© 2019 MacDermid, Inc. and its group of companies. All rights reserved. “(R)” and “TM” are registered trademarks or trademarks of MacDermid, Inc. and its group of companies in the United States and/or
other countries.

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