TC-1905022A(G)
STC0049P_3.0E
STC0049P_3.0E
M705-ULT369 Series
Technical Report
Senju Metal Industry Co.,Ltd.
Solder Technical Center
© 2019 Senju Metal Industry Co., Ltd. All rights reserved.
P 1 / 14
TC-1905022A(G)
STC0049P_3.0E
Content
01. Product Information
02. Solder Powder
2-1. Alloy Characteristic
2-2. SEM Image
03. Basic characteristics Test
3-1. Fluid Characteristic at Temperature
3-2. Viscosity Change by Continuous Printing
3-3. Slump Test
3-4. Tackiness Test
3-5. Solder Ball Test
3-6. Wetting Effect and De-wetting Test
3-7. Solder Expansion Test
3-8. Pot Life
04. Reliability
4-1. Cu Plate Corrosion Test
4-2. Cu Mirror Corrosion Test
4-3. Silver Chromate Paper Test
4-4. Fluoride Content Test
4-5. SIR Test and ECM Test
05. Processing Guidelines
06. Recommended Reflow Profile
07. Technical Data Sheet
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01. Product Information TC-1905022A(G)
STC0049P_3.0E
Product Characteristics
Next Generation Solder Paste
Newly designed to be state-of-the-art. More user-friendly,
achieving a high workability.
Low Void High Printability
The trend to high-capacity and high-speed ULT369 has a high printability. Especially the
communication puts heat radiation into focus. filling/releasing ability is increased. This contributes to
In this connection, voiding became an important
the printability at small openings and narrow pitches.
character in terms of soldering. ULT369 has a high
flowability. Voids are easily discharged from solder. ULT369 has an excellent temporal stability to achieve
Even in case of subdivided pattern, ULT369 is able to high productivity.
decrease the voiding.
Print Current Current
Opening Products 1 Products 2 ULT369 Small Opening Narrow Pitch
Divided Overall
High reflowability
・Electric parts become smaller and smaller, and require thus a smaller
solder powder size. Smaller solder powder oxidizes easily, affecting the
solderability. ULT369 can keep its solderability with high heat resistance.
・BGA Packages become thinner and thinner, bending more easily.
This can cause HiP (Head in Pillow) and NWO (Non-wet Open) issues. HiP Meltability
ULT369 overcomes those problems with its outstanding wettability.
・Its high wettability can help soldering difficult places like QFN edges.
NWO Wettability
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02. Solder Powder TC-1905022A(G)
STC0049P_3.0E
2-1. Alloy Characteristic
Alloy Name M705
Alloy Composition (%) Sn-Ag3.0-Cu0.5
Specific Gravity 7.4
Melting Temp. Solidus 217
(℃) Liquidus 220
Tensile Strength (MPa) 53.3
Elongation (%) 56
Young’s Module (GPa) 46.9
0.2 Yield Point (MPa) 39.4
CTE (ppm/ C) 21.7
Vickers Hardness (Hv) 17.9
2-2. SEM Image
Type4（20-38µm） Type5（15-25µm）
Almost no surface oxidation, spherical lead-free powder is used in all
ECO-solder paste products from SMIC.
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03. Basic Characteristics Test TC-1905022A(G)
STC0049P_3.0E
3-1. Fluid Characteristic at Temperature
300
250
Viscosity(Pa･s)
200
150
100
20 22 24 26 28 30
Temperature(℃)
Solder paste characteristics change corresponding to temperature. There is a tendency for viscosity to
become lower (softer) at high temperature. Slumping and/or spreading in the printing stage and solder
ball or bridging in reflow stage may potentially occur if the paste has lower viscosity. Conversely,
sticking to squeegee and/or clogging to stencil aperture may occur if viscosity is higher. Therefore,
suitable environmental conditions are preferred for this paste’s use. 25+/-3℃ temperature is usually
recommended for this product.
3-2. Viscosity Change by Continuous Printing
Printing Tact: 30sec/sheet Environment: 25℃50%RH
Viscosity measurement: PCU-205(Malcom)
Test cycle
Viscosity Continuous Viscosity Continuous Viscosity Storage at
measurement Printing (4h) measurement Printing (4h) measurement 0-10℃
200
180
Viscosity(Pa･s)
160
140
Refrigerated
120
storage
This product is excellent in
continuous printing,
100
0h 4h 8h 0h 4h 8h 0h 4h 8h 0h 4h 8h contributing thus to waste
One day Third day Fifth day Seventh day
reduction.
Number of days used
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03. Basic Characteristics Test TC-1905022A(G)
STC0049P_3.0E
3-3. Slump Test
Reference: JIS Z 3284 Stencil Thickness: 0.2mm
Heating Condition: 150℃3min (Chaｍber)
Cold Slump Hot Slump
Result: Under 0.2mm Result: Under 0.2mm
3-4. Tackiness Test
Reference: JIS Z 3284 Stencil Thickness: 0.2mm
Environment: 25℃50%RH
1.5
Tackiness(N)
0.5
0
0 4 8 12 16 20 24
Time(hour)
Also after 24hours the paste keeps a
tackiness of more than 1.0N.
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03. Basic Characteristics Test TC-1905022A(G)
STC0049P_3.0E
3-5. Solder Ball Test
Reference: JIS Z 3284 Stencil Thickness: 0.2mm
Environment: 25℃50%RH, 30℃90%RH Heating Condition: 270℃ (Solder Bath)
Initial 2hours 6hours 24hours
25℃50%RH
Result: rank1 Result: rank1 Result: rank1 Result: rank1
30℃90%RH
Result: rank1 Result: rank1 Result: rank1 Result: rank2
3-6. Wetting Effect and De-wetting Test
Reference: JIS Z 3284 Stencil Thickness 0.2mm
Heating Condition: 270℃(Solder Bath)
Result-1 Result-2
Result: Rank２
(Wetting the copper coupon without de-wetting)
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TC-1905022A(G)
STC0049P_3.0E
3-7. Solder Expansion Test
Reference: JIS Z 3197 Heating Condition: 270℃(Solder Bath)
Solder Specific Gravity: 7.39
D
h
Expansion ratio(%)
= (D – h) / D x 100
Paste Solder Solder Solder Expansion
Mean
N Weight Weight volume thickness ratio
(%)
(g) (g) (mm3) (mm) （％）
1 303.0 268.2 36.2 0.947 76.93
2 309.0 273.5 37.0 0.852 79.38
3 303.7 268.8 36.3 1.052 74.40 77.07
4 296.5 262.4 35.5 0.952 76.64
5 292.6 259.0 35.0 0.893 77.99
3-8. Pot Life
Environment: Keep at 0-10℃ Viscosity Measurement: PCU-205(Malcom)
250
200
Viscosity(Pa･s)
150
100
0 60 120 180
Storage days
The product is stable and can keep its
characteristics over a long period of time.
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04. Reliability TC-1905022A(G)
STC0049P_3.0E
4-1. Cu Plate Corrosion Test
Reference: JIS Z 3197 Environment: 40℃90%RH
Test Time: 72hours
NG sample
Initial After 72hours
Flux Residue Color Change
to White and Green
Result: PASS(No change of residue color)
4-2. Cu Mirror Corrosion Test
Reference: JIS Z 3197 Environment: 25℃50%RH
Test Time: 24hours
NG Sample
Right Side Mirror
Break Through
ULT369 WW Rosin
Result: PASS(No evidence of mirror breakthrough)
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TC-1905022A(G)
STC0049P_3.0E
4-3. Silver Chromate Paper Test
Reference: JIS Z 3197 Standard solution: Diethyl Amine HCl IPA Solution
NG Sample
Color Change to white or
off-white
ULT369 Diethyl Amin HCl
IPA Solution
Result: Pass(No evidence of color change)
4-4. Fluoride Content Test
Reference: JIS Z 3197
NG Sample
Color Change to Yellow
Result: Pass(No evidence of color change)
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04. Reliability TC-1905022A(G)
STC0049P_3.0E
4-5. SIR Test and ECM Test
Reference: JIS Z 3197 Environment: 85℃85%RH
Measure Voltage: DV100V Applied Voltage: DC45V
1.E+13
1.E+12
1.E+11
SIR(Ω)
1.E+10
1.E+09
Blank
1.E+08
ULT369
1.E+07
0 200 400 600 800 1000
Time(hour)
Blank
Time(hour)
No. 0 24 96 168 250 500 750 1000
1 3.98E+09 1.34E+10 1.16E+10 1.09E+10 9.87E+09 1.12E+10 1.17E+10 1.25E+10
2 7.66E+10 2.40E+10 1.70E+10 1.49E+10 1.45E+10 1.62E+10 1.58E+10 1.69E+10
3 4.03E+10 1.87E+10 1.43E+10 1.29E+10 1.22E+10 1.37E+10 1.38E+10 1.47E+10
Average 4.03E+10 1.87E+10 1.43E+10 1.29E+10 1.22E+10 1.37E+10 1.38E+10 1.47E+10
ULT369
Time(hour)
No. 0 24 96 168 250 500 750 1000
1 2.01E+09 2.60E+09 5.13E+09 6.12E+09 6.97E+09 7.75E+09 8.84E+09 1.01E+10
2 1.38E+09 1.97E+09 4.01E+09 4.95E+09 5.65E+09 7.69E+09 8.48E+09 9.31E+09
3 1.73E+09 1.98E+09 4.80E+09 6.03E+09 6.76E+09 8.51E+09 8.96E+09 9.86E+09
Average 1.71E+09 2.18E+09 4.65E+09 5.70E+09 6.46E+09 7.98E+09 8.76E+09 9.75E+09
NG Sample
Growth of Migration
Result: PASS(No migration)
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05. Processing Guidelines TC-1905022A(G)
STC0049P_3.0E
Handling
Item Recommended Remarks
Storage Condition Keep at 0-10℃ Unopened
Warm-up Prior to Use Min. 1hour at Room Temp. Do Not Open When Still Cold
Storage at
Max. 3 days At 30℃ or Lower
Room Temperature Prior to Use
Stirring Condition 30-60sec by Hand Mixing or
In Case of Jars
Before Processing Automatic Mixing
Operating Environment 22-28℃、30-70%RH ---
Stencil Life for
Up to 24hours ---
Continuous Printing
Abandon Time by
Up to 1hour ---
Printing Process
Idle Time
Up to 8hours ---
After Printing
Idle Time
Up to 8hours ---
After Mounting Components
Re-storage of Remaining
at 0-10℃ Only Once
Solder Paste in Container
Recommended Printing Process
Category Recommended Capable
Printer Type Open Squeegee Model Enclosed Squeegee System
Squeegee Blade Metal Urethane, Plastic
Squeegee Angle 60° 45-60°
Print Speed 30-50mm/sec 20-100mm/sec
Adjust not to Leave
Print Pressure 0.20-0.30N/mm
Paste on Stencil
Separation Speed 1.0-5.0 mm/sec < 10mm/sec
Paste Rolling Height 10-20mm ---
Operating Environment 22-28℃、30-70%RH ---
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06. Recommended Reflow ProfileTC-1905022A(G)
STC0049P_3.0E
Soak Reflow Profile * It can be used with Air condition.
Peak Temp.
C
Ramp Up Rate 2 240℃ (230-260℃)
220℃ 1-4℃/sec
Temperature
D Cooling Rate
180℃ B > 2℃/sec
Time Above 220℃ 40sec
(30-120sec)
150℃ A
Time Section A-B 80sec
(60-100sec)
Ramp Up Rate 1
1-4℃/sec Time
Category Lower Limit Recommend Upper Limit
-A Ramp Up Rate 1 1℃/sec 2℃/sec 4℃/sec
A Soak Zone Start Temp. 140℃ 150℃ 160℃
B Soak Zone End Temp. 160℃ 180℃ 200℃
A-B A-B Section Time 60sec 80sec 100sec
B-C Ramp Up Rate 2 1℃/sec 2℃/sec 4℃/sec
C Peak Temp. 230℃ 240℃ 260℃
D Time above 220℃ 30sec 40sec 120sec
Cooling Rate 2℃/sec --- ---
Ramp Reflow Profile * It can be used with Air condition.
Peak Temp.
C
240℃ (230-260℃)
220℃ B
Temperature
D Cooling Rate
Ramp Up Rate > 2℃/sec
1.2℃/sec (0.8-1.5℃/sec) Time Above 220℃ 40sec
(30-120sec)
40℃ A
Time
Category Lower Limit Recommend Upper Limit
A Ramp Start Temp. --- 40℃ ---
B Ramp End Temp. --- 220℃ ---
A-B Section Time 120sec 150sec 220sec
A-B
(Ramp Up Rate) (1.5℃/sec) (1.2℃/sec) (0.8℃/sec)
C Peak Temp. 230℃ 240℃ 260℃
D Time Above 220℃ 30sec 40sec 120sec
Cooling Rate 2℃/sec --- ---
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07. Technical Data Sheet TC-1905022A(G)
STC0049P_3.0E
M705-ULT369
Items Test Method
Type4 Type5
Solder Powder
Alloy Composition Sn-3.0Ag-0.5Cu ---
Melting Temperature 217-220℃ DSC
Powder Shape Spherical SEM
Particle Size 20-38μm 15-25μm SEM, Screen Method
Solder Paste
Flux Classification ROL0 J-STD-004B
Halogen Content Less than 500ppm EN 14582
Halide Content 0.02％ or less JIS Z 3197
Cu Plate Corrosion Test Pass JIS Z 3197
Cu Mirror Corrosion Test Pass JIS Z 3197
JIS Z 3197
Surface Insulation Resistance Test Over 1.0E+12Ω
(40℃/90%RH, 168hours)
Over 1.0E+9Ω JIS Z 3197
Electro Chemical Migration Test
No Migration (85℃/85%RH, 1000hours)
Flux Content 11.5% 11.7% JIS Z 3197
Viscosity 180 Pa･s JIS Z 3284
Thixotropic Index 0.60 JIS Z 3284
Slump Test Cold 0.2mm/Hot 0.2mm JIS Z 3284
Tackiness Test Over 1.0N within 24hours JIS Z 3284
Solder Ball Test Rank 1-2 JIS Z 3284
Unopened,
Validity 6 months
Keep at 0-10℃
※The values in this table are for reference.
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