SENJU

SENJU LEAD FREE SOLDER

30 Rue du bois Moussay - 93240 STAINS

Tel : 01.48.36.84.01 Fax : 01.48.36.14.62
www.davumtmc.com
 We offer various forms of solder material to provide the future
Lead-Free Solder of connection through total solutions.

Senju Metal Industry Co., Ltd. (SMIC) commercialized the standard lead-free solder material M705 in 2000, making a
substantial contribution to eliminating lead from components and products. SMIC continues to develop and
commercialize various forms of solder material using our solder alloy development capabilities, high-level metal
processing technology, organic synthesis and viscoelasticity control technology, compounding technology,
soldering technology, unique casting/forging technology, and granulation technology, with the aim of offering total
solutions for soldering, including cost reduction, reliability enhancement, density enhancement, energy
conservation and environmental sustainability enhancement.

Continue to take on new challenges and keep evolving Changes the future of mounting
Flux Cored Solder … P3 Solder Preform … P11

Realizes next-generation mounting Realizes semiconductor mounting that is a step ahead

Solder Paste … P5 Solder Ball … P13

LIQUID FLUX

Created using our unique ultra-microfabrication technology Promises effective solder wettability
Transfer Solder Sheet … P8 Liquid Flux … P15

FLUX for SEMI- CONDUCTORS

Environmentally sustainable, using alloy composed

Takes advantage of organic synthesis technologies
of plentiful metals
Bar & Wire … P9 Flux for Semi-Conductors … P17
1 SMIC LEAD FREE SOLDER CATALOG 2
 ECO SOLDER
Reflow
CORED
Oven

GAO Delivers a good work environment and a beautiful appearance after soldering

Flux cored solder is a product in which flux is incorporated into the center Products are available in two types:
part of wire solder alloy GAO-ST that thoroughly supress burning and air bubbles Evaluation of residual air bubbles
and GAO-LF with an enhanced ability to suppress fumes
and irritating odors. Air bubbles

Recommended alloys；M24MT/ M24AP

Lead-free flux cored solder that continues to take on new challenges and keeps evolving
Evaluation of fuming after 3 seconds of soldering at 450°C Conventional product GAO-ST

● Workability-oriented (superior wettability, low fume/irritating odor) Grade A Evaluation of burning after 8 seconds of soldering at 380°C

ESC ESC21 NEO G AO

● Low temperature mounting Grade A

LEO

● Soft residue (migration countermeasure) Grade AA Conventional product GAO-ST GAO-LF Conventional product GAO-ST GAO-LF

FO RT E M ACR O S
● Reliability-oriented (high insulation) Grade AA

RMA98 R MA 0 2 R M A08 LSC LSC Realizes low spattering with low or

no Ag content CBF Ensures good wettability while
containing no halogen
● Halogen-free (Grade AA equivalent) LSC is a weakly active type general-purpose product with high We have two halogen-free products: CBF that satisfies the industry
insulation characteristics. standard and ZERO that contains absolutely no halides.
G A MMA ZER O CBF
It is a low spatter type product realized through accumulated technologies Our halogen-free products are marked by pink spools.
featuring high reliability, which is also suitable for soldering using robots.
2000 2015 0.8sec 1.2sec 1.6sec
Performance Comparison of the number of flux spattering
enhancement 0% Ag alloy products have
25
Conventional product
Conventional
also become available LSC
20 product

Number (pieces)
15
Solder iron tip temperature: 350°C
Wire diameter: φ0.8mm
10 ZERO
■ Select products according to your purpose or application
5

CBF: Chlorine and bromine contents are

・GAO series Guarantees good wettability and work environment ・MACROS Optimal for severe environments including automotive applications 0 no more than 900 ppm respectively.
M705 M35 M20
Low Ag No Ag CBF ZERO: Contains absolutely no halides.
・LEO Sn-Bi solder with a low melting point that realizes low ・CBF Ensures good wettability despite being halogen-free
temperature mounting
Recommended alloys；M20/M35 Recommended alloys；M705
・EFC Realizes narrow pitch soldering with ultra-fine wire
・LSC Guarantees high insulation reliability with accumulated
experience and results

Soft residue flux is optimal for

Active type General-purpose product GAO MACROS automotive applications LEO The first product in the industry capable
of soldering at 200°C
with condensation risk
Product for low temperature soldering LEO MACROS features flux Bending test LEO is capable of soldering at
residue that does not crack 200°C, realizing cost reduction
even under mechanical through the adoption of low
Weakly active type General-purpose product LSC bending or thermal stress, and heat-resistant substrates or
prevents electro-ionic migration components.
caused by condensation.
SMIC has succeeded in
Soft residue flux MACROS In addition, water repellency commercializing flux cored
and excellent adhesion to Thermal stress test solder using rigid and fragile Successfully-processed LEO
substrates help to prevent Sn-Bi alloy having poor
Halogen-free type CBF migration or corrosion under malleability by taking full
Target alloys；L20/L27
high temperature/high humidity advantage of its unique
load tests. processing and wire drawing
technologies.
Product for ultra-fine wire EFC Target alloys；M705

3 SMIC LEAD FREE SOLDER CATALOG 4

 ECO SOLDER
Reflow PASTE
Oven

Solder paste for semiconductor packaging

Solder paste is a product in which fine powder solder alloy and
flux component are mixed Residue-free solder paste
for semiconductor mounting
NRB series
Optimum for die bonding of power devices

Bump formation solder paste

Choose optimal solder pastes according to your purpose or application for for fine printing
BPS
the development of next-generation products

A halogen-free type is available for each product.

No-clean Residue-free type NRB Transfer Solder paste

for POP mounting
NSV320
Printing For die bonding WDA

For semiconductor
Clean For bump formation BPS
packaging NRB Realizes residue & cleaning free mounting with a non-rosin-type flux Recommended alloy；M705

For chip mounting NXC400

Comparison of flux residue after reflow soldering
No VAC 30000(Pa) 101.3

Transfer No-clean For POP mounting NSV320 Flux residue

Vacuum level（kPa）
NRB60 Random
No flux （P1）
residue Random

GLV
（P2）
Void reduction general-purpose type General paste for printing NRB70 20000(Pa) 10000(Pa) 5000(Pa) Random
（P3）
T1 T2 T3

For low Ag/Ag free LS720V Random（T1） Random（T2） Random（T3）

Random（t）
NRB70 produces
no flux residue even Realizes low spattering residue & void-free soldering with the vacuum
For fine component soldering RGS800 during N² reflow soldering. reflow oven SVR-625GT capable of controlling the vacuum degree

No-clean For low temperature soldering LT142

BPS Features good printability and forms even bumps with a small amount of voids Recommended alloys；
M705/M200

Uses flux residue as adhesive JPP Exhibits good wettability despite using fine powder,
forming bumps with a small amount of voids

Printing Residue-free type NRB

Solvent cleaning type NXC400

Clean Forms 120 μm pitch bumps using alloy powder Forms bumps with a small Conventional product
with an average particle size of 4 μm amount of voids
Water cleaning type WSG36
For SMT
General-purpose type NXD400 NSV320 Capable of transferring a sufficient amount of solder,
realizes POP mounting with high joint reliability
Recommended alloy；M705

Rapid heating type NXD300 Soldered with a sufficient

transfer amount

Dispensing No-clean
For low-temperature soldering NXD200
POP mounting with no unmelted joints Paste with an insufficient NSV320 with a sufficient
JPP Transfer Mounting Melting transfer amount transfer amount
Uses flux residue as adhesive

NOTE: About recommended alloys, please refer to the main alloys table on page 25.
5 SMIC LEAD FREE SOLDER CATALOG 6
 ECO SOLDER PASTE

Solder paste for SMT

PPS is a transfer solder material in which fine solder powder is
adhered to a film sheet
■ Flux developed along with the micronizing of powder grains
As powder grain becomes finer, the surface area and amount of oxidation increase. Therefore,
highly-active flux that suppresses reoxidation during reflow soldering is required.

2000
GRN360 （Pre Coated Powder Sheet）
Transfer solder sheet PPS
PPS is created through the development of a unique granulation method that enables the production
GWS
Type4 of micro-fine spherical powder.
Φ20～ 38μm

2010 S70G Tight tolerance solder powder

Type5
GLV Φ15～25μm
Type6
Φ5～15μm PPS
Film/adhesive
RGS800
2020 RGS800

Finer and narrower

■ Enables narrow pitch bump formation or jointing of narrow pitch patterns
pitch components
Metric 1005 type components 0603 type components 0402 type components 0201 type components
Film
Inch 0402 type components 0201 type components 01005 type components Not defined
Solder powder
Adhesive
Exhibits good wettability even
RGS800 with fine powder, enabling
mounting of 0201 components
GLV Significantly-reduced void generation
realized through the improvement of flux Peel
25 µm pitch

M705-RGS800 Type6
Ensures a sufficient amount of solder even GLV prevents void generation on large bottom termination components,
for micro patterns by adopting RGS800 and in which the temperature does not rise easily, and significantly reduces
Type 6 micro powder. unmelted solder balls in BGA soldering.
230℃ 240℃
Land
Enabling jointing of 0201 Substrate
components. Bonding /
Conventional Application of flux Reflow soldering/
product heat press Sheet peeling
Type4 Type5 Type6 for reflow soldering flux cleaning
(solder transfer)

25μm
JPK flux
GLV 0201 (Mechanical
components connection)
Insufficient print quantity Insufficient print quantity Sufficient print quantity PPS solder
(Electrical
connection)
Recommended alloy；M705 Target alloys；M705 / M794 / M758

25μm
Substrate
Realizes cost reduction through energy
LS720V Prevents void generation
by Low-Ag /Ag-free flux LT142 conservation by flux for alloys with
low melting points.
Bump formation at a 25 µm pitch Land at a 25 µm pitch Supports mounting of 0201 components
Reinforced by JPK flux

LS720 prevents void generation through LT142 features flux with an improved active component which enhances
enhanced wettability and improved the reflow properties of the Bi alloy that becomes very easily oxidized and
flux fluidity when melted. suppresses void generation.
Conventional
product ■ Supports next-generation semiconductor packaging by eliminating plating processes with bump formation on Cu pillars
Exhibits good Suppresses solder Suppresses
3.0% Ag wettability at 170°C ball generation void generation
Bump formation on Cu pillars Semiconductor packaging
M705
1.0% Ag LS720V
Price

Conventional Cu Pillar
M40 product PPS Bump
Cu Pillar
Peel
0.3% Ag Wafer
Flux
M47
Cu Pillar Wafer
0% Ag
Inexpensive LT142
M773
Substrate Substrate Substrate
Reflow
2000 2010 2015
Bonding / heat press Sheet peeling Reflow soldering/ Mounting soldering Jointing
Recommended alloys；M40/ M47/ M773 Target alloys；L20 / L27 flux cleaning

7 SMIC LEAD FREE SOLDER CATALOG 8

 ECO SOLDER
Reflow
BAR &Oven
WIRE

Material that generates little amount of dross

Solder bars are melted in a solder bath and used for packaging
of insertion components or terminal treatment of components ■ The MT series and AP series containing phosphorus and germanium thoroughly suppresses dross generation.

Sn-Cu-Ni Sn-Cu-Ni-P-Ge

Sn-Cu-Ni
The addition of
elements which
reduces the
amount of oxide
Clumped dross entraining solder Sn generation
Ag Ni-Cu compound component
(sherbet form) Dross generation
Entrained
solder
Down by about 50%
Solder components
M24AP Solder components
Oxide
Cu Sn Bi
Sn oxide Sn oxide

Smooth dross

To produce “1” product, the required amount of the conventional material is “2.95,” whereas only “1.59” is required when using the MT/AP series.

Sb Conventional product Sn-Cu-Ni M24AP Sn-Cu-Ni-P-Ge

Soldering Soldering
Input Output Input Output

Material Product Material Product

input input
Reliability-oriented Peak temperature 46% material reduction

M30
223℃
Sn-Ag Eutectic composition
General-purpose 1 1

219℃
Sn-Ag-Cu Eutectic composition M31 2.95 1.59
Dross Dross 0.59
（waste） 1.95 （waste）
3% Ag General-purpose specification M705
By suppressing dross, 46% of the usage amount is reduced and cost
reduction is promoted.
Overseas standard specification M710 / M714 / M715

1% Ag low-Ag specification M34 /M771

Sn-Zn-Al solder materials for aluminum jointing
0.3% Ag low-Ag specification M35
High thermal fatigue resistance
■ ALS A151 and A091 are solder materials for aluminum jointing that suppress galvanic corrosion.
M731
224℃
Sn-Ag-Cu-Sb High thermal fatigue resistance specification On light-weight and inexpensive aluminum, galvanic corrosion easily occurs due to the large potential difference from tin, causing jointing defects.
In ALS A151 and A091, galvanic corrosion is suppressed by the use of zinc, which has a small potential difference from tin.

Reoxidation is suppressed by adding a small amount of Al,

When using Sn-Ag solder, corrosion and peeling occurs after 25 hours reducing dross generation by more than 50%
Price-oriented

M20
229℃
Sn-Cu Eutectic composition

M24 MT/ M24AP

228℃
Sn-Cu-Ni 0% Ag low dross specification

For terminal treatment with copper

leaching countermeasure M760HT
Ｓｎ-Ａｇ系はんだ
Sn-Ag solder ALS A151 Conventional product ALS A151
Reliability-oriented
229℃
Sn-Bi -Cu 0% Ag No-Ag general-purpose specification M773 /M805
Galvanic corrosion is suppressed in Sn-Zn-Al solder Aluminum leaching is suppressed by the addition of small amount of Al
Corrosion test Dipped in 400°C molten solder
For terminal treatment
Sn-Cu-Ag M709/ M711
400 70
application with 0.5% Ag 350 60
High temperature mounting

Time till disconnection（sec）

300
ALS A091
243℃
M10 /M14
50
Sn-Sb
Joint strength (N)

～248℃ High melting point specification 250

40 ALS A151
Low temperature mounting 200 ALS A151
30
L20
141℃
Sn-Bi Eutectic composition 150
20
100
Sn-Ag solder 10
50 Conventional product
L27
140℃
Sn-Bi-Cu High drop impact reliability in Sn-Bi products
0 0
0 5 10 15 20 25 0.2 0.25 0.3 0.35 0.4
3% salt solution immersion time (hr) Wire diameter (mm)

9 SMIC LEAD FREE SOLDER CATALOG 10

 ECO SOLDER
Reflow
PREFORM
Oven

Application Examples
Preform realizes effective soldering by forming solder alloys into various shapes
Die bonding using a single layer or Ni ball contained preform suppresses void generation
Application1 and realizes mounting with high heat radiating effect. The need for flux is eliminated by
using a product with an HQ specification, enabling clean mounting even without cleaning.
Preform with HQ specification
Die
Preform with HQ Mounting with a small amount of voids is
Electrode possible without cleaning
Substrate specification
Forms various alloys or structural materials into various shapes so that soldering
can be performed in desired forms
Preform mounting Die mounting Heating / bonding

Single Layer Major forms

The basic type preform with high
The single layer or flux coated material is processed into a chip form and automatically mounted
Application 2
dimensional precision, which
guarantees stable soldering. on a pad lacking solder quantity through tape packaging, in order to supply solder and enhance
strength. SMIC’s unique chip surface processing technology increases the mounting precision.
Solder paste
Preform Sufficient amount of solder Insufficient amount of solder

Ni Ball Contained
Ni balls are contained inside the
preform to suppress sloping of the
Heating
solder surface by securing standoff.
Component
lacking solder quantity
When no preform is used

A ring shape preform is inserted into the terminals of the insertion component passing
Flux Cored
Flux is contained inside the preform
Application 3 through the through-holes of the substrate and locally heated by a laser or other methods
to eliminate the flux application
to perform soldering without causing thermal damage to the substrate or component.
process and improve wettability. Insertion component
Laser
Preform
Substrate

Flux Coated
Flux is applied on the preform
surface to eliminate the need for the
fixing process through its adhesive Mounting Heating Bonding
force and to achieve high-efficiency
production.
Alloys with different melting temperatures are laminated in a bimetal structure and bonded to a substrate
Application 4 with solder with a low melting point. By making solder that does not melt at the mounting temperature a part
Solder Coated Metal of the overcurrent detection circuit, the solder will melt and cut off the circuit when an abnormality occurs.
A solder layer is formed on the metal
Alloy A
surface, so as to achieve good （for cut-off fuse）
adhesive strength and structures
without voids in order to provide Preform that can perform melting
Alloy B
Multi-layer preform or bonding in two stages, such as a fuse
highly reliable processed products. （for substrate mounting）

High melting point material

(part of the circuit) Low melting point material The high melting point material
Multi Layer Mounting
(soldering) melts and cut off electricity.
Solder alloys with different physical
properties are clad-rolled. If the
melting points of the solder are Substrate Reflow Substrate
Overcurrent Substrate
different, two-stage bonding by (heating)
temperature can be performed.

The solder coated material is a product in which the surface of the base material that cannot
Application 5 easily be soldered or does not melt at the soldering temperature is coated with molten solder.
It is optimal for bonding to aluminum, applications requiring standoff, or for airtight sealing cases.
Surface treatment specification
Solder layer（one side or both sides）

Base material（ iron, aluminum, etc.）

General-purpose Suitable for flux application or mounting in a reducing atmosphere.
product S Standard Surface Condition Available in each product structure type. Solder layer
（various solder materials）
Solder B
Bonding material
Solder A

Oxide film on the surface is reduced by special processing to enable Securing standoff
Flux-free HQ High-Quality Surface Condition flux-free mounting or mounting in a reducing or inert atmosphere.

Base material Molten solder plating Soldering

11 SMIC LEAD FREE SOLDER CATALOG 12

 ECO SOLDER
Reflow Oven
BALL

M60 Using a softer material to buffer stress on solder bulk, M60 is optimal for applications
requiring high thermal fatigue resistance
Sn-2.3Ag-Ni-x
Solder ball features high sphericity, as well as guaranteed dimensions
In M60, the solder bulk is softer than typical SAC alloy with reducing Ag content to provide buffer against external stress, and
or tolerances Ni and x are added to improve the fracture mode by reforming the joint interface without losing the intermetallic compound
network that maintains the bulk strength after receiving a thermal stress load. As a result, a product that exhibits good
thermal fatigue resistance for the various surface finish.

Thermal fatigue characteristics Thermal fatigue characteristics M705 M60

(Cu-OSP substrate) (Electrolytic Ni/Au-plated substrate)
99.9 99.9

Products with various ball diameters and compositions are available to support Initial

Cumulative failure rate（％）

Cumulative failure rate（％）

cutting-edge semiconductor mounting stage
Compound Compound
10 10

Tight tolerance solder ball with diameters ranging from 760 to 20 µm are available. M61 M61

M60 After
Reliability-oriented
M705 M705 M60 test Compound
M770 dissipation Compound
M30
M770
Sn-Ag
1
Eutectic composition 1
1000 10000 1000 10000 -40/30min⇔125℃/30min,after 4000 cycles
Number of cycles Number of cycles
General-purpose
Owing to the addition of a slight amount of Ni and x,
Sn-Ag-Cu Eutectic composition M31 the compound network is maintained after receiving
a thermal stress load, securing the bulk strength.

3% Ag general-purpose
specification M705

Overseas standard specification M710 /M714/ M715 M758 With an improved joint interface, M758 is optimal for bump formation on wafers
Sn-3Ag-3Bi-0.8Cu-Ni
1% Ag Low-Ag specification M34 / M771 In M758, Bi is added to achieve solid solution strengthening and enhance bulk strength in addition to precipitation strengthening
in the Sn-Ag-Cu alloy, while reaction at the joint interface is controlled by the addition of a slight amount of Ni to achieve robust
joint strength, which makes the product optimal for bump formation on wafers where stress caused by differences in the thermal
0.3% Ag Low-Ag specification M35 expansion coefficients is large. In addition, M758 exhibits good wettability on packages with Cu plating.
High reliability specifications

Sn-Ag-Ni High thermal fatigue resistance specification M60 Thermal fatigue resistance on wafer Drop impact resistance on wafer
1.3
Spreading result
99.9 99.9
TCT Drop

Sn-Ag-Cu-Ni Thermal fatigue/drop impact resistance specification M770 M758 M758

1.2

Cumulative failure rate（％）

Cumulative failure rate（％）

SAC405 SAC405

Spreading（mm）
1.1

Sn-Ag-Bi-Cu Joint interface reaction control specification M758 10

SAC305
10 SAC305
1

High thermal fatigue resistance specification

Sn-Ag-Cu-Bi-Sb optimal for automotive applications M794 0.9

Price-oriented
1 1 0.8

M200
100 1,000 10,000 10 100 1,000
Sn-Cu Soft general-purpose alloy containing no Ag Number of cycles（cyc.） Number of drops (times)
SAC305 SAC405 M758

M758 exhibits superior thermal fatigue resistance compared to conventional products M758 exhibits good wettability on packages
High temperature mounting such as SAC305 or SAC405, due to solid solution strengthening by the addition of Bi. It with Cu plating.
Sn-Sb High melting point specification M10 / M14 exhibits equivalent or greater results in the drop impact resistance test.

Low temperature mounting

Sn-Bi Eutectic composition L20

Sn-Bi-Cu Drop impact resistance specification L27 M770 Achieving both thermal fatigue resistance and drop impact resistance simultaneously,
M770 is optimal for bump formation on substrate
Sn-2Ag-Cu-Ni
When Ag content is increased, the precipitation amount of compound (Ag3Sn) in solder increases, making the solder harder
and giving it greater mechanical strength. The opposite occurs when the Ag content is reduced. Utilizing this property, SMIC
LAS solder ball protects products from “soft errors” has developed M770, which achieves both thermal fatigue resistance and drop impact resistance simultaneously, by studying
the optimal Ag amount and a slight amount of additive.
Eutectic phase
Slight amounts of alpha rays or cosmic rays discharged from （Ag3Sn Cu6Sn5 compound） Sn phase

solder materials or semiconductor materials can rewrite Drop impact resistance property Thermal fatigue characteristics
(Cu-OSP substrate) (Cu-OSP substrate) M705
memory data, which is called a “soft error.” In particular, flip Strength
99.9 99.9
chip packages are highly sensitive to soft errors, and the Hardness
reduction of alpha rays is therefore required for solder

Cumulative failure rate（％）

Cumulative failure rate（％）

materials or other electronic mounting materials. An LAS Low Ag concentration High
solder ball is a material that meets such a requirement.
10 10
2%Ag 3%Ag M61
M770
■ Standard specification product ■ Special specification product M60
Diameter and tolerance；50～100μm±3μm
M60 M705 M770 M61
Various specifications are M705

Alpha count；Less than 0.002 cph/cm2 available upon request. M770

Please contact us for details. 1 1
Composition；M705 M200 1 10 100 1000 1000 10000
Number of drops (times) Number of cycles（cyc.）
M770 Soft/ M705 Hard/
high strength high strength

13 SMIC LEAD FREE SOLDER CATALOG 14

 POST FLUX

LIQUID FLUX Flux for components

Liquid flux is a liquid flux consisting of resins such as rosin,
and activators or solvents
Resin Rosin Active type No-clean/
solvent clean TY-8

Halogen-free SR-104SD-HF
Choose products that are effective for soldering according to your purpose or application
No-clean Halogen-free ES-Z series
■ Roles of flux
Reduced
No-clean/
Flux Oxide Flux Heat/O2 Flux Solder Weakly active type solvent clean ESR series

Solder
Halogen-free No.48 M
Base material Base material Base material

① Surface cleaning action ② Prevention of reoxidation ③ Promotion of wettability No-clean S series

Isolates oxides on the metal surface. Creates a thin film between air and the solder to Reduces the surface tension and promotes
protect the solder and base material surface. spreading through a capillary action.

Rosin
Organic acid Weakly active type
No-clean/
solvent clean Halogen-free ZR series

Liquid flux For PCBs

Water clean Halogen-free WF-1031
Flux For components

Flux for semiconductor For terminal treatment

Water-soluble
Organic acid Water-based Water clean Halogen-free WF-70 / WF-55

Water-soluble
Organic acid Water clean WF-27

Flux for PCBs

Flux for terminal treatment
・ESseries Promises high workability, including excellent wettability ・ESR series High reliability flux with high insulation property
Water-soluble
・PO-Z series Promises excellent workability despite containing no halogen ・EZR series Low residue flux that achieves a beautiful finish on the substrate surface Organic acid Solvent-based No-clean T-1
・ES-Zseries Realizes halogen-free and no-clean soldering ・WF series Eco-friendly flux that can be cleaned with water

Halogen-free T-5
No-clean/
Resin Rosin Active type solvent clean High workability ES series
ES series ES-Z series
The ES series are suitable for low Ag solders. Its good solder wettability The ES-Z series are halogen-free rosin fluxes. Its residue after soldering
No-clean Halogen-free ES-Z series prevents bridging. exhibits high reliability, making the series suitable for no-clean soldering.
The series also achieves good lusterless finishes on Sn-Cu solders, which The series contains only 900 ppm or less of chlorine (Cl) and bromine
enables easy and accurate appearance checks. Its flux residue is highly (Br), as no chlorine or bromine is intentionally added.
reliable and suitable for no-clean soldering.
Copper plate Copper plate
corrosion test result corrosion test result
Weakly active type No-clean/
solvent clean High reliability ESR series 1.E+15
Surface Insulation Resistance 40℃95％RH96hr
1.E+15
Surface Insulation Resistance 40℃95％RH96Ｈｒ

Control Control
1.E+14 1.E+14
ES-0307LS ES-Z-15
1.E+13 1.E+13

1.E+12 1.E+12
SIR (Ω)

SIR (Ω)
Rosin
Organic acid No-clean Low residue type EZR series 1.E+11
Initial stage
1.E+11
Initial stage
1.E+10 1.E+10

1.E+09 1.E+09

1.E+08 1.E+08
Water-soluble
WF series
0 24 96 168 500 1000 0 24 96 168 500 1000
Organic acid Solvent-based Water clean Time(hr) Time(hr)

Test Method：JIS Z 3197（2012) ８５℃/８５％RH/50V No corrosion Test Method：JIS Z 3197（2012) ８５℃/８５％RH/50V No corrosion

15 SMIC LEAD FREE SOLDER CATALOG 16

 FLUX for SEMI-CONDUCTORS
Reflow Oven

FLUX for SEMI-CONDUCTORS WF-6317 Low-volatile flux WF-6317 is a highly-active water-soluble flux with high heat resistance

Flux for semi-conductors is a liquid flux consisting of resins such as rosin,

and activators or solvents Removes flux residue even by water cleaning, and realizes zero residue when cleaned with 40°C warm water.

Solder ball
Suction head Suction head Suction head Suction head
Suction head Suction head
Flux
Package Package Package

Choose products that are effective for soldering according to your purpose or application. Flux Flux transfer Ball mounting Ball mounting /bonding

Contamination of the reflow oven is suppressed by the use of a low-volatile flux.

For connection to
1 substrates Ball mounting
For connection to substrates
1
Flux for (CSP mounting)
❷ For connection to wafers
For connection to
semi-conductors 2 wafers CSP mounting
WF-6317 Low-volatile /water clean

For bump shape JPK9 Low-volatile/no-clean

3 correction BGA mounting (reinforced strength)

901K5 Super-low-volatile/no-clean
Rosin Solvent clean Printing MB-T100
2 For connection to wafers
（HF）
For connection to
MB-T100
1 substrates (ball mounting) Halogen-free MB-T100
Rosin/solvent clean
WF-6317
WF-6317P Wafer Wafer JPK9 Non-rosin Water clean Printing Low-volatile type WF-6317P
Water-soluble/water clean
901K5

3 For bump shape correction

1
For connection to MB-T100 Highly-active MB-T100 reproduces dent-free spheres when balls are resolidified
SPK-3400 substrates (BGA mounting)
Low-volatile/water clean Highly-active and exhibits high heat resistance, and can be cleaned with a semi-aqueous cleaning liquid.
WF-6317
JPK9 A halogen-free product is also available.
PCB 901K5
No dent

Mounting Dent Dent appearance

Flux printing

❶ For connection to substrates

Wafer Wafer Wafer Wafer
Wafer

Flux printing Ball mounting Reflow soldering Flux removal Conventional product MB-T100
Rosin Solvent clean Printing GTN-68P Ball melting Ball resolidification

Transfer GTN-68
❸ For bump shape correction
No-clean Printing Halogen-free （HF）
GTN-68P
Rosin Solvent clean Spin coat 7200A
Transfer Halogen-free （HF）
GTN-68

Non-rosin No-clean Transfer Non-residue type NRF-S08 Non-rosin Water clean Spin coat Low-volatile type SPK-3400
Ultra-low-
residue type Reflow
specification 901K5

Thermocompression
SPK-3400 SPK-3400 forms even spherical bumps, and its flux residue can be removed by water-cleaning
bonding specification NRF-S13
A halogen-free flux that can be easily removed by water-cleaning even after high-temperature reflow soldering.

Low-volatile
thermosetting type JPK9 Solder
Flux (SPK-3400)
Flux residue (low-volatile)

❶ For connection to Water clean Printing Low-volatile type WF-6317P

substrates
Wafer Wafer Wafer Wafer

Ball CSP BGA

Transfer Low-volatile type WF-6317 Bump bonding SPK-3400 application Fusing After cleaning
Spray application Reflow Water clean
Substrate (spin coat application)

17 SMIC LEAD FREE SOLDER CATALOG 18

 SMIC SOLUTION

SMIC SOLUTION SMIC offers a wide variety of solutions to respond to

the requests of its customers

Semiconductor Solutions Automotive Solutions

Rear window equipped with hot wire

Cu Cored Ball ●Wire solder for glass GLS Series

Passive component mounting Plain bearing

●Lead-free Clean Metal
●Solvent clean Type5 solder paste
M10-PHW Solar panel
●Solder preform for replenishment ●Wire solder for aluminum ALS Series
Bump formation Power steering & ABS
0402 Type Chip Solder
●Halogen-free ultra-fine wire flux cored solder ●Solder ball/LAS ball with a 100µm or smaller diameter ●Residue-free solder paste NRB Series
CBF M705 ／ M200 Engine control unit
●Solder paste for cleaning WDA Series
●100µm or smaller diameter ●High reliability solder paste & ball
●Solder paste for solvent cleaning
Packaging Cu Cored Ball ／ Cu Ball M53 ／ M794 ／ M758 ／ M731 NXC400ZH
●Transfer solder sheet PPS ●Preform containing Ni balls HQ
●Achieves both thermal fatigue/drop impact resistance ●Solder paste for micro-bump formation M200-BPS ●Achieves both high heat resistance and Motor
Solder Ball M770
●Flux for ball formation MB-T100 high drop impact resistance
●Solder ball with high thermal fatigue resistance ●Flux cored solder with excellent wettability
M770
M60 M758 GAO Series
●Soft residue flux cored solder MACROS
●Exhibits high shape retention capability
Ball attaching (ball connection) ●No-clean/residue & void-free NRB Series Various sensors and automotive
Cu Cored Ball
●Solder paste for POP NSV320 Series ●Solder paste/flux for POP ●Solder paste containing Ni balls RAM Series electrical equipment
●Solder paste for joint reinforcement JPP
NSV320 ／ GTN-68 ●Significantly reduces voids even on ●Flux cored solder that realizes crack-free flux residue
●Ultra-low residue flux 901K5 Cu-OSP substrates
●Low-volatile water-soluble flux WF-6317
GLV Series MACROS
●Water-soluble flux WF-6317
●Flux that prevents whiskers ES-100SA
●Residue-free flux NRF-S08 ●Paste that prevents flux cracking G3000
●Replenishment of solder in TH parts Solder Preform
Component embedded mounting ●Joining material for copper pillars PPS
●Replenishment of solder for insertion components
●Ensures joints and spaces simultaneously Cu Cored Ball
Battery Solder Preform
●Maintains adhesion after re-heating RAM Series
●Electrode for batteries ●Reinforcement solder paste for SMT JPP Series
Pb Foil
●Flux residue blocks moisture Solder paste AWR Series
Soldering Equipment
Semiconductor packaging ●N2 reflow oven for semiconductor mounting Soldering Equipment
●Void prevention type no-clean solder paste GLV Series SNR-1346MB
SVR-625GTC
●Vacuum reflow oven that realizes void-free soldering
●No-clean Type5 solder paste M705-RGS800 ●Dust-free reflow oven CX- 430 Pump
MPF Series
●Flow soldering equipment for localized soldering to TH parts SOLZEUS
●Forms bumps with molten solder IMS
●Flux cored solder with excellent wettability GAO ●Reflow oven supporting super-high temperature SNR- 615H

High-Density Mounting Solutions Environmental Solutions

Microscopic component mounting VCM (camera module)

●Supports 0201 components M705-RGS800 Type6 ●Flux cored solder with no residue cracking
Environmentally-friendly Products
FORTE
Effective resource utilization Energy conservation (Climate change) Chemical substance control
Flexible substrate mounting
●Water-soluble solder paste ●Prevents waste (dross) generation ●Enables mounting at a low temperature range ●Makes SMIC one of the world’s leading companies
Medium-temperature substrate mounting WSG36 Series Flow Solder MT/AP Series Low Melting Point Lead-Free Alloy L20/L27 Lead-free products
●Using reduced amounts or no rare metals ●Enables mounting at a low temperature range ●Water clean solder paste that enables VOC prevention
●For joint reinforcement M705 - JPP
Low-Ag ／ No-Ag solder alloys Low Melting Point Solder Paste LT142 Series Solder Paste WSG Series
●Prevents non-wet failures M705-RGS800
Low temperature shield ●Recovers solder from dross at the manufacturing site ●Enables mounting at a low temperature range ●Suppresses fumes or irritating odors and ensures good
●Supports microscopic components M705-RGS800 Type6
case mounting Solder Recycle Machine SDS-5N Low Melting Point Flux Cored Solder LEO Series work environment
Flux Cored Solder GAO Series
●Low temperature Sn-Bi solder ●Reduces wear of the solder iron tip ●Reflow oven realized by a unique heat insulation structure
Cut-off fuse L20 ／ L27 Wear Resistant Alloy M86 SNR-GT Series ●No-clean solder paste that enables VOC prevention
●1005 Type Chip Solder No-Residue Solder Paste NRB Series
●For safety and security of battery circuits Solder Clad ●Reduces solder usage amount in microscopic component mounting ●Eliminates the need for a refrigerator
●Molten solder Coat Case Micro Solder Balls Room-Temperature Storable Paste S70GR ●No-clean solder paste that enables VOC prevention,
with flux residue that acts as an adhesive
●For low temperature joint reinforcement
Component terminal plating ●Reduces solder usage amount in microscopic component mounting ●Realizes energy conservation by local heating Solder Paste JPP Series
L20-JPP
Type 6,7, 8 Solder Pastes Solder Preform
●Electrode for plating Purealloy Anode ●No-clean solder paste that enables VOC prevention,
●Extends the life of water pipes ●Reduces work time by excellent wettability with flux residue that acts as an adhesive
●Media for barrel plating Solder Shot Flux JPK9
Solder replenishment Sn-Zn Alloy for Spraying Flux Cored Solder GAO Series
for TH parts ●Resource recovery using solder recycling systems ●Enables energy conservation by laser mounting ●Prevents dioxin generation
●Solder Preform Flux Cored Solder MACROS Series Halogen-Free Products
●Contributes to weight reduction of equipment ●All products are compliant with the new chemical
Narrow pitch substance control regulations
Solder for Aluminum Bonding ALS Series
connector mounting REACH Compliance
Semiconductor packaging (Registration, Evaluation, Authorization and Restriction of Chemicals)
●Flux cored solder with a 0.1 mm diameter
EFC ●Solder ball for outer M770 ●Eliminates the need for cleaning solvents
●Solder paste for bump BPS Series Water-Soluble Flux Products
●Transfer solder paste NSV320ZH
●Super active flux MB-T100
●Ultra-low residue flux 901K5
Earphones ●Transfer flux DELTALUX GTN-68
●High sound quality solder alloy ●Transfer solder sheet supporting narrow pitches PPS

19 SMIC LEAD FREE SOLDER CATALOG 20

 SMIC の技術

Technologies of SMIC Thermal fatigue-resistant alloys using three novel technologies

SMIC has developed cutting-edge thermal fatigue-resistant solder alloys

SMIC offers distinctive products to respond to requests of our customers

Ｍ53 Ｍ731 Ｍ758 Ｍ794 【 Joint interface reaction control technology 】

-40℃/30min. ⇔ +125℃/30min.
Addition of Ni improves the fragile diffusion layer of the joint
70 interface and ensures joint interface strength
M794
60 M758
M731
50
M53 SAC305

Joint strength（Ｎ）
Low-Ag / No-Ag Technology We have developed low-Ag/no-Ag solder alloys that achieve cost reduction 40 SAC305

30

We have solved the issue of material strength in low or no-Ag materials through a combination of solid solution strengthening and precipitation 20
strengthening technologies, and commercialized the resulting products. Thermal
10 fatigue
Low-Ag /no-Ag material evaluation using a chip resistor resistant
-40℃/30min⇔+85℃/30min 0 alloy
3.0%Ag 90 0 500 1000 1500 2000 2500 3000
1％Ag Number of cycles（cyc.)
Price M705 80 M40
M40

Shear strength（Ｎ）
70 3％Ag
1.0% Ag M705 Effect of solid
solution 【 Precipitation strengthening and solid solution strengthening combination technology 】 【 Sn grain coarsening suppression technology 】
strengthening
1％Ag
60
SAC107 Precipitation strengthening Solid solution strengthening
Through the addition of Ni/x, coarsening of crystal grains of Sn is
0.3％Ag Strength enhancement by intermetallic compounds Strength enhancement by the formation of a suppressed at initial and after TCT.
M47 50
SAC0307 （Cu6Sn5, Ag3Sn, etc.） solid solution with Sn (Sb/Bi/In, etc.)
0.3% Ag Solid solution atom Coarsening of the Sn structure is suppressed by
40
0 200 400 600 800 1000 1200 1400 1600 1800 2000
Sn phase
Intermetallic compounds
(solute atom)
Sn atom
interposing different alloy atoms into the grain
M35 0.3% Ag Number of cycles（cyc.)
(precipitation)
Solute atoms are dispersed boundaries to prevent strength reduction and cracking
M86 80
Compounds interposed at
grain boundaries give pinning
on an atomic level.
Compared to the state in which SAC305 M794
M773 effects and suppresses
deformation.
atoms are arrayed (lined)
homogenously, deformation is Initial 3000cyc. Initial 3000cyc.
0% Ag 70
3％Ag
Enlarged to
atomic level suppressed in the state in which
M705 foreign atoms are incorporated

Shear strength（Ｎ）
60 0％Ag because of resistance.
M20 M773
Sn
Sn
M24AP 0% Ag 50
Sn
Enlarged to
micron level
M773 40 Sn Solid solution status
M805 Sn-Cu-Ni-Ge of the solute metals Status with no solute metals

Flux cored & bar Solder Paste 30

20
Inexpensive 0 200 400 600 800 1000 1200 1400 1600
2000 2010 2020 Number of cycles（cyc.)

Flux residue working The technology that has changed the concept of soldering has achieved
as an adhesive joint strength enhancement or drop impact reduction
Short-time, low-temperature Short-time, low-temperature mounting enables the use of inexpensive
packaging technology low heat-resistant components or materials
Joint reinforcement of solder bumps by the JPK Series flux

A cost reduction is achieved by eco-friendly products that contribute to energy conservation in which mounting temperatures that have become higher Fixing disc
JPK8 Solder ball
JPK8 flux residue
in lead-free solders are made lower than those of conventional Sn-Pb solder. In addition, the JPP Series for joint reinforcement can increase
joint strength and drop impact resistance.
Reflow
Flux transfer Mounting Joint reinforcement by flux residue Jointing by JPK
Short-time low-temperature mounting using Sn-Bi solder Sn-Bi low-temperature lead-free
realizes energy conservation of more than 50% solder with high thermal fatigue resistance of the thermosetting resin
Profile comparison *Temperature cycle test result 2012R chip -40℃/30min⇔+85℃/30min
300 80.0
The JPP Series flux is optimal for joint reinforcement of chip components and improvement of drop impact resistance of low melting point Sn-Bi solder
250 Lower 70.0
Temperature（℃）

60.0 L27 L20

Sn-Ag-Cu material
Shear strength（Ｎ）

200
50.0
JP-Paste Chip
150 40.0
Land Flux
30.0 M705
100 PCB
Sn-Bi material Higher 20.0 Mount the chip The flux flows under the chip The flux spreads between the chip
50
10.0 after printing JP-Paste. due to the capillarity phenomenon. and substrate and solidifies.
0.0
The joint strength is enhanced. Jointing by a solder paste Jointing by a JPP Series paste
0
0 50 100 150 200 250 20 500 1000 1500 2000
Time (sec.) Profiles are examples. Number of cycles（cyc.)
L20-JPP achieves approx. 5 times as much drop
J20-JPP achieves better thermal fatigue resistance than that of SAC305 impact resistance as those of rosin type fluxes
L27 with high drop impact resistance Joint cross section of L20 that enables excellent bonding Thermal fatigue resistance test 3216R -40℃/30min⇔130℃/30min Thermal fatigue resistance test 1005R -40℃/30min⇔130℃/30min Drop impact resistance test
*Drop impact test 250 30 800
99.9 L20-JPP
700
200
Cumulative failure rate（%）

L20- JPP 600 SAC305

Shear strength(N)

Shear strength(N)
L20 L20- JPP 20
L27 Initial 150 500

400
10
100
300
10 L20
L20 200 L20
50
SAC305 100
After 2000 cyc. SAC305
1 0 0 0
1 10 100 0 500 1000 1500 2000 2500 3000 0 500 1000 1500 2000 2500 3000
L20 rosin type L20-JPP SAC305 rosin type
Drop Number Cycle Cycle

21 SMIC LEAD FREE SOLDER CATALOG 22

 SMIC の技術 SMIC の技術

SMIC’s advanced plating technology has allowed for easy securing Realized by an outstanding Ni granulation technology, unique Ni inclusion
Cu Cored Ball of space in 3D mounting Solder Containing Ni Balls technology, and a special surface processing technology

Cu ball A good grain size distribution of Ni balls contained in preforms or solder pastes ensures level and even thickness, maximizing the heat dissipation effect.
Usage example of Cu cored ball (3D mounting)
Ni plated layer
Cu cored ball (spacer) Preform containing Ni balls Wire ● High heat dissipation
Solder plated layer
Air layers in cracks disturb thermal conductivity and reduce the heat dissipation effect.

Bare chip Cracking due to a

Cracking caused Preform thin solder layer
Solder Bare chip by inclination

● Features Suppression of
Inclination Ni ball
electromigration Securing of space Heat dissipation
PKG PKG
Cross-sectional photos PKG
A level die bond mounting realizes highly reliable wire bonding. Good heat dissipation Ni ball

Solder plating Solder ball PCB PCB PCB Thickness is nearly the same
at all positions
Short
Ni plating Spherical and uniform Ni ball produced by SMIC’s unique production
Cu ball method achieves void suppression and level mounting
PKG PKG PKG

Cu ball
Solder preform Solder preform containing Ni balls
Cu cored ball PCB PCB PCB
Appearance and cross-sectional photos of M90 Secures adequate space Cu has good thermal
A B A B
Superior electromigration
(Sn-3Ag-0.5Cu plating) Cu cored ball resistance conductivity

SMIC product General product

160 160
Semiconductor Semiconductor Semiconductor

Solder thickness(μm)

Solder thickness(μm)
140
Usage example of Cu cored ball (substituting Cu pillar) Solder Ni ball Solder Ni ball Solder Ni ball
140
120 120
100 100
Solder plating Cu cored ball a
a a 80 80
60 60
Cu plating 40 40
20 20
M90 improves drop impact resistance through reforming Formation of the reaction layer with Ni suppresses void generation, 0 0
Cu pillar mounting Cu cored ball mounting and all positions have nearly uniform thickness. A B A B
of the joint interface by Ni in the Ni plating.

Alternative Paste to Composite technology realizes a solder paste that retains its shape after Conflict Mineral Free SMIC has declared its intention not to be complicit in environmental
High-Temperature Solder a repeated reflow processing, enabling hierarchical mounting destruction, terrorist activities or human rights violations

SMIC is the only company in the industry to participate in the EICC and to
During the soldering process, a reaction occurs between the solder powder (Sn) and metal filler and the compound of Sn and the filler creates a network, All the supplier smelters have been checked by audits to deliver be declared “conflict free” as a CFSI member
partially achieving a high-temperature joint. The same mounting profiles as those for normal SnAgCu solder can be applied. Although the solder part “conflict mineral free” products to our customers.
melts again after re-heating at 270°C or higher, the compound layer at the high temperature joint retains its shape and prevents dropping of the component.

Check by audit
Supplier
Conflict mineral
free materials SMIC

Conflict mineral
free products Customers As a CFSI member, we request that all supplier smelters participate in the Conflict-Free Smelter
Program.

Before reflow After reflow Cross-sectional photo after reflow

※EICC
（Electronic Industry Citizenship Coalition）
：A CSR alliance in the electronic industry.
※CFSI
（Conflict-Free Sourcing Initiative）
: An organization addressing the issue of conflict minerals.
Comparison of the component joint strength after repeated reflow processing Component retention property at 250°C
240℃ 254℃ 270℃
All SMIC products are conflict mineral free.

RAM
Retention

Ｍ７０５ Falls due to

own weight

The chip dropped where M705 was used, but it did not drop even at 270°C where RAM was used. Ｍ７０５ ＲＡＭ

23 SMIC LEAD FREE SOLDER CATALOG 24

 Main alloys and product forms of ECO SOLDER Automated Soldering Equipment

Melting tem.（ ℃） Form Built for superior

Convection Oven
ECOSOLDER Alloy composition（wt%) energy-conservationand
Solidus Liquidus

Convection Energy-saving Design

line
Peak
line
BAR CORE BALL PASTE PREFORM high productivity
SNR
SNR-GT Ser.
I
M-series Peak temperature: 200°C or higher GT
M705 Sn-3.0Ag-0.5Cu 217 219 220 ● ● ● ● ● Superior energy-saving and highly productive
general purpose reflow oven
M30 Sn-3.5Ag 221 223 223 ● ● ● ● ●
M31 Sn-3.5Ag-0.75Cu 217 219 219 ● ● ● ● ●

Vacuum Convection Oven

M714 Sn-3.8Ag-0.7Cu 217 219 220 ● ● ● ● ● Drastic void reduction
M715 Sn-3.9Ag-0.6Cu 217 219 226 ● ● ● ● ● by the vacuum zone
in the heating section

Reflow Ovens
M710 Sn-4.0Ag-0.5Cu 217 219 229 ● ● ● ● ● SVR
M34 Sn-1.0Ag-0.5Cu 217 219 227 ● ● ● ● ● SVR Ser.

Nitrogen Atmosphere
M771 Sn-1.0Ag-0.7Cu 217 219 224 ● ● ● ● ● Void-free design by knowledge of solder
material characteristics
M35 Sn-0.3Ag-0.7Cu 217 219 227 ● ● ● ● ●
M20 Sn-0.75Cu 227 229 229 ● ● ● ● ●
M24MT ● ● ●

Far-Infrared Oven
Sn-0.7Cu-Ni-P-Ge 228 230 230
Dust-free clean design
● ● ●

Semiconductor Application Design

M24AP Sn-0.6Cu-Ni-P-Ge 227 228 228
M40 Sn-1.0Ag-0.7Cu-Bi-In 211 222 222 ● ● CX CX-430
M47 Sn-0.3Ag-0.7Cu-0.5Bi-Ni 216 228 228 ● ● Clean furnace with minimal amount of dust:
M773 Sn-0.5Bi-0.7Cu-Ni 225 229 229 ● ● ● the most optimal for solder ball mounting on wafers

M805 Sn-0.3Bi-0.7Cu 225 229 229 ● ●

M53 Sn-3.0Ag-3.0Bi-3.0In 198 214 214 ● ●

Far Infrared Radiant Heat/

M794 Sn-3.4Ag-0.7Cu-3.2Bi-3.0Sb-Ni-x 210 221 221 ● ● ● Small-size oven compatible

Convection Oven
with low oxygen concentration
M731 Sn-3.9Ag-0.6Cu-3.0Sb 221 224 226 ● ● ● ●
M716 Sn-3.5Ag-0.5Bi-8.0In 196 208 214 ● ● SNR SNR-615 Ser.
M10 Sn-5.0Sb 240 243 243 ● ● ● ● ●
The H specification product can accommodate
M14 Sn-10Sb 245 248 266 ● ● ● ● ● profiles up to 420°C and is optimal for die
bonding of power devices
M709 Sn-0.5Ag-6.0Cu 217 226 378 ●
M760HT Sn-5.0Cu-0.15Ni-ｘ 228 229 365 ●

Air Atmosphere
● Stable pressure type

Flow Soldering Machines

M711 Sn-0.5Ag-4.0Cu 217 226 344
automatic soldering machine
M60 Sn-2.3Ag-Ni-x 221 222 225 ● SPF2
ECOPASCAL

Wave Solder
M770 Sn-2.0Ag-Cu-Ni 218 220 224 ●
M758 Sn-3.0Ag-3.0Bi-0.8Cu-Ni 205 215 215 ● ● ● ● SPF Ser.
●

Atmosphere
M84 Sn-3.0Ag-0.5Cu-Ni 219 223 324
Energy-saving Automatic Stable

Nitrogen
M85 Sn-0.3Ag-2.0Cu-Ni 218 231 332 ● SPF2 Pressure Flow (SPF) soldering system
I
M86 Sn-0.3Ag-0.7Cu-Ni 220 232 330 ● N

L-series Peak temperature: 200°C or lower

L20 Sn-58Bi 139 141 141 ● ● ● ● ●

Selective Wave Machine

Inline type
Static pressure type
● ● ● ● ●
Nitrogen Atmosphere
L27 Sn-40Bi-Cu-Ni 139 140 174 MPF
I local soldering machine
Peak temp. : Max. endothermic reaction point on DSC curve 2003ST
SOLZEUS
Some alloy compositions may not be available in certain forms with special product sizes and grades.
For inquiries regarding alloy compositions not listed above, please contact us by e-mail.

Round type MPF Ser.

Lead-free product Impurity standard (unit: percentage by mass) Static pressure type local soldering machine
MPF
Sb Cu Bi Zn Fe Al As Cｄ Ag In Ni Au Pb I realizes energy conservation and high
2007ST quality soldering
0.07 0.05 0.05 0.001 0.02 0.001 0.03 Less than 0.03 0.02 0.01 0.005 Less than
or less or less or less or less or less or less or less 0.002 or less or less or less or less 0.05

25 SMIC LEAD FREE SOLDER CATALOG 26