M MCP2551

High-Speed CAN Transceiver

Features Package Types
Supports 1 Mb/s operation PDIP/SOIC
Implements ISO-11898 standard physical layer
requirements
Suitable for 12V and 24V systems TXD 1 8 RS
Externally-controlled slope for reduced RFI
VSS 2 7 CANH

MCP2551
emissions
Detection of ground fault (permanent dominant) VDD 3 6 CANL
on TXD input
Power-on reset and voltage brown-out protection RXD 4 5 VREF
An unpowered node or brown-out event will not
disturb the CAN bus
Low current standby operation
Protection against damage due to short-circuit
conditions (positive or negative battery voltage)
Protection against high-voltage transients
Automatic thermal shutdown protection
Up to 112 nodes can be connected
High noise immunity due to differential bus
implementation
Temperature ranges:
- Industrial (I): -40C to +85C
- Extended (E): -40C to +125C

Block Diagram

VDD

TXD Thermal
Dominant Shutdown
VDD Detect

TXD Driver
Control

Slope Power-On CANH

RS
Control Reset
0.5 VDD

RXD GND
CANL
Receiver
VREF Reference
Voltage

VSS

2002 Microchip Technology Inc. Preliminary DS21667C-page 1

MCP2551
NOTES:

DS21667C-page 2 Preliminary 2002 Microchip Technology Inc.

 MCP2551
1.0 DEVICE OVERVIEW 1.4 Operating Modes
The MCP2551 is a high-speed CAN, fault-tolerant The RS pin allows three modes of operation to be
device that serves as the interface between a CAN pro- selected:
tocol controller and the physical bus. The MCP2551 High-Speed
provides differential transmit and receive capability for
Slope-Control
the CAN protocol controller and is fully compatible with
the ISO-11898 standard, including 24V requirements. It Standby
will operate at speeds of up to 1 Mb/s. These modes are summarized in Table 1-1.
Typically, each node in a CAN system must have a When in High-Speed or Slope-Control mode, the driv-
device to convert the digital signals generated by a CAN ers for the CANH and CANL signals are internally regu-
controller to signals suitable for transmission over the lated to provide controlled symmetry in order to
bus cabling (differential output). It also provides a buffer minimize EMI emissions.
between the CAN controller and the high-voltage spikes Additionally, the slope of the signal transitions on
that can be generated on the CAN bus by outside CANH and CANL can be controlled with a resistor con-
sources (EMI, ESD, electrical transients, etc.). nected from pin 8 (RS) to ground, with the slope propor-
tional to the current output at RS, further reducing EMI
1.1 Transmitter Function emissions.
The CAN bus has two states: Dominant and Reces-
sive. A dominant state occurs when the differential volt- 1.4.1 HIGH-SPEED
age between CANH and CANL is greater than a The High-Speed mode is selected by connecting the
defined voltage (e.g.,1.2V). A recessive state occurs RS pin to VSS. In this mode, the transmitter output driv-
when the differential voltage is less than a defined volt- ers have fast output rise and fall times to support high-
age (typically 0V). The dominant and recessive states speed CAN bus rates.
correspond to the low and high state of the TXD input
pin, respectively. However, a dominant state initiated 1.4.2 SLOPE-CONTROL
by another CAN node will override a recessive state on
the CAN bus. Slope-Control mode further reduces EMI by limiting the
rise and fall times of CANH and CANL. The slope, or
1.1.1 MAXIMUM NUMBER OF NODES slew rate (SR), is controlled by connecting an external
resistor (REXT) between RS and VOL (usually ground).
The MCP2551 CAN outputs will drive a minimum load The slope is proportional to the current output at the RS
of 45, allowing a maximum of 112 nodes to be con- pin. Since the current is primarily determined by the
nected (given a minimum differential input resistance of slope-control resistance value REXT, a certain slew rate
20 k and a nominal termination resistor value of is achieved by applying a respective resistance.
120). Figure 1-1 illustrates typical slew rate values as a
function of the slope-control resistance value.
1.2 Receiver Function
The RXD output pin reflects the differential bus voltage 1.4.3 STANDBY MODE
between CANH and CANL. The low and high states of The device may be placed in standby or SLEEP mode
the RXD output pin correspond to the Dominant and by applying a high-level to RS. In SLEEP mode, the
Recessive states of the CAN bus, respectively. transmitter is switched off and the receiver operates at
a lower current. The receive pin on the controller side
1.3 Internal Protection (RXD) is still functional but will operate at a slower rate.
CANH and CANL are protected against battery short- The attached microcontroller can monitor RXD for CAN
circuits and electrical transients that can occur on the bus activity and place the transceiver into normal oper-
CAN bus. This feature prevents destruction of the ation via the RS pin (at higher bus rates the first CAN
transmitter output stage during such a fault condition. message may be lost).

The device is further protected from excessive current

loading by thermal shutdown circuitry that disables the
output drivers when the junction temperature exceeds
a nominal limit of 165C. All other parts of the chip
remain operational and the chip temperature is lowered
due to the decreased power dissipation in the transmit-
ter outputs. This protection is essential to protect
against bus line short-circuit induced damage.

2002 Microchip Technology Inc. Preliminary DS21667C-page 3

MCP2551
TABLE 1-1: MODES OF OPERATION

Mode Current at Rs Pin Resulting Voltage at RS Pin

Standby -IRS < 10 A VRS > 0.75VDD
Slope-Control 10 A < -IRS < 200 A 0.4VDD < VRS < 0.6VDD
High-Speed -IRS < 610 A 0 < VRS < 0.3VDD

TABLE 1-2: TRANSCEIVER TRUTH TABLE

VDD VRS TXD CANH CANL Bus State( 1) RXD( 1)
4.5V VDD 5.5V VRS < 0.75VDD HIGH0 LOW Dominant 0
1 or floating
Not Driven Not Driven Recessive 1
VRS > 0.75VDD X
Not Driven Not Driven Recessive 1
VPOR < V DD < 4.5V VRS < 0.75VDD HIGH0 LOW Dominant 0
(See Note 3) 1 or floating
Not Driven Not Driven Recessive 1
VRS > 0.75VDD X
Not Driven Not Driven Recessive 1
0 < V DD < V POR X X
Not Driven/ Not Driven/ High Impedance X
No Load No Load
Note 1: If another bus node is transmitting a dominant bit on the CAN bus, then RXD is a logic 0.
2: X = dont care.
3: Device drivers will function, although outputs are not guaranteed to meet the ISO-11898 specification.

FIGURE 1-1: SLEW RATE VS. SLOPE-CONTROL RESISTANCE VALUE

25

20
Slew Rate V/uS

15

10

0
10 20 30 40 49 60 70 76 90 100 110 120
Resistance (k)

DS21667C-page 4 Preliminary 2002 Microchip Technology Inc.

 MCP2551
1.5 TXD Permanent Dominant 1.7.2 GROUND SUPPLY (VSS)
Detection Ground supply pin.
If the MCP2551 detects an extended low state on the
TXD input, it will disable the CANH and CANL output 1.7.3 SUPPLY VOLTAGE (VDD)
drivers in order to prevent the corruption of data on the Positive supply voltage pin.
CAN bus. The drivers are disabled if TXD is low for
more than 1.25 ms (minimum). This implies a maxi- 1.7.4 RECEIVER DATA OUTPUT (RXD)
mum bit time of 62.5 s (16 kb/s bus rate) allowing up
to 20 consecutive transmitted dominant bits during a RXD is a CMOS-compatible output that drives high or
multiple bit error and error frame scenario. The drivers low depending upon the differential signals on the
remain disabled as long as TXD remains low. A rising CANH and CANL pins and is usually connected to the
edge on TXD will reset the timer logic and enable the receiver data input of the CAN controller device. RXD
CANH and CANL output drivers. is high when the CAN bus is recessive and low in the
dominant state.
1.6 Power-on Reset
1.7.5 REFERENCE VOLTAGE (VREF)
When the device is powered on, CANH and CANL
Reference Voltage Output (Defined as VDD/2).
remain in a high-impedance state until V DD reaches the
voltage level VPORH. In addition, CANH and CANL will
1.7.6 CAN LOW (CANL)
remain in a high-impedance state if TXD is low when
VDD reaches VPORH. CANH and CANL will become The CANL output drives the low side of the CAN differ-
active only after TXD is asserted high. Once powered ential bus. This pin is also tied internally to the receive
on, CANH and CANL will enter a high-impedance state input comparator.
if the voltage level at VDD falls below V PORL, providing
voltage brown-out protection during normal operation. 1.7.7 CAN HIGH (CANH)
The CANH output drives the high side of the CAN dif-
1.7 Pin Descriptions
ferential bus. This pin is also tied internally to the
The 8-pin pinout is listed in Table 1-3. receive input comparator.

TABLE 1-3: MCP2551 PINOUT 1.7.8 SLOPE RESISTOR INPUT (RS)

Pin Pin The RS pin is used to select High-Speed, Slope-Control
Pin Function or Standby modes via an external biasing resistor.
Number Name
1 TXD Transmit Data Input
2 VSS Ground
3 VDD Supply Voltage
4 RXD Receive Data Output
5 VREF Reference Output Voltage
6 CANL CAN Low-Level Voltage I/O
7 CANH CAN High-Level Voltage I/O
8 RS Slope-Control Input

1.7.1 TRANSMITTER DATA INPUT (TXD)

TXD is a TTL compatible input pin. The data on this pin
is driven out on the CANH and CANL differential output
pins. It is usually connected to the transmitter data out-
put of the CAN controller device. When TXD is low,
CANH and CANL are in the dominant state. When TXD
is high, CANH and CANL are in the recessive state,
provided that another CAN node is not driving the CAN
bus with a dominant state. TXD has an internal pull-up
resistor (nominal 25 k to VDD).

2002 Microchip Technology Inc. Preliminary DS21667C-page 5

MCP2551
2.0 ELECTRICAL 2.1.5 DIFFERENTIAL VOLTAGE, VDIFF
CHARACTERISTICS (OF CAN BUS)
Differential voltage of the two-wire CAN bus, value
2.1 Terms and Definitions VDIFF = VCANH - VCANL.
A number of terms are defined in ISO-11898 that are
2.1.6 INTERNAL CAPACITANCE, CIN (OF
used to describe the electrical characteristics of a CAN
transceiver device. These terms and definitions are A CAN NODE)
summarized in this section. Capacitance seen between CANL (or CANH) and
ground during the recessive state when the CAN node
2.1.1 BUS VOLTAGE is disconnected from the bus (see Figure 2-1).
VCANL and V CANH, denoting the voltages of the bus line
wires, CANL and CANH, relative to ground of each 2.1.7 INTERNAL RESISTANCE, RIN (OF A
individual CAN node. CAN NODE)
Resistance seen between CANL (or CANH) and
2.1.2 COMMON MODE BUS VOLTAGE ground during the recessive state when the CAN node
RANGE is disconnected from the bus (see Figure 2-1).
Boundary voltage levels of VCANL and VCANH with
respect to ground, for which proper operation will occur, FIGURE 2-1: PHYSICAL LAYER
if up to the maximum number of CAN nodes are DEFINITIONS
connected to the bus.

2.1.3 DIFFERENTIAL INTERNAL ECU

CAPACITANCE, CDIFF (OF A CAN
NODE) RIN
CANL
Capacitance seen between CANL and CANH during
RDIFF CDIFF
the recessive state when the CAN node is RIN
disconnected from the bus (see Figure 2-1). CANH
CIN CIN
2.1.4 DIFFERENTIAL INTERNAL
GROUND
RESISTANCE, RDIFF (OF A CAN
NODE)
Resistance seen between CANL and CANH during the
recessive state when the CAN node is disconnected
from the bus (see Figure 2-1).

DS21667C-page 6 Preliminary 2002 Microchip Technology Inc.

 MCP2551
Absolute Maximum Ratings
VDD............................................................................................................................................................................. 7.0V
DC Voltage at TXD, RXD, VREF and VS .............................................................................................-0.3V to VDD + 0.3V
DC Voltage at CANH, CANL (Note 1).......................................................................................................... -42V to +42V
Transient Voltage on Pins 6 and 7 (Note 2)............................................................................................. -250V to +250V
Storage temperature ............................................................................................................................... -55C to +150C
Operating ambient temperature .............................................................................................................. -40C to +125C
Virtual Junction Temperature, TVJ (Note 3) ............................................................................................ -40C to +150C
Soldering temperature of leads (10 seconds) ....................................................................................................... +300C
ESD protection on CANH and CANL pins (Note 4) ................................................................................................... 6 kV
ESD protection on all other pins (Note 4) .................................................................................................................. 4 kV
Note 1: Short-circuit applied when TXD is high and low.
2: In accordance with ISO-7637.
3: In accordance with IEC 60747-1.
4: Classification A: Human Body Model.

NOTICE: Stresses above those listed under Maximum ratings may cause permanent damage to the device. This
is a stress rating only and functional operation of the device at those or any other conditions above those indicated in
the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods
may affect device reliability.

2002 Microchip Technology Inc. Preliminary DS21667C-page 7

MCP2551
2.2 DC Characteristics
Electrical Characteristics:
DC Specifications Industrial (I): TAMB = -40C to +85C VDD = 4.5V to 5.5V
Extended (E): TAMB = -40C to +125C VDD = 4.5V to 5.5V
Param
Sym Characteristic Min Max Units Conditions
No.
Supply:
D1 IDD Supply Current 75 mA Dominant; VTXD = 0.8V; VDD
D2 10 mA Recessive; VTXD = +2V;
RS = 47 k
D3 365 A -40C TAMB +85C,
Standby; (Note 2)
465 A -40C TAMB +125C,
Standby; (Note 2)
D4 V PORH High-level of the power-on reset 3.8 4.3 V CANH, CANL outputs are
comparator active when VDD > VPORH
D5 VPORL Low-level of the power-on reset 3.4 4.0 V CANH, CANL outputs are not
comparator active when VDD < VPORL
D6 V PORD Hysteresis of power-on reset 0.3 0.8 V Note 1
comparator
Bus Line (CANH; CANL) Transmitter:
D7 VCANH(r);VCANL(r) CANH, CANL Recessive bus 2.0 3.0 V VTXD = VDD; no load.
voltage
D8 IO(CANH)(reces) Recessive output current -2 +2 mA -2V < V(CAHL,CANH) < +7V,
IO( CANL)(reces) 0V <VDD < 5.5V
D9 -10 +10 mA -5V < V(CANL,CANH) < +40V,
0V <VDD < 5.5V
D10 VO(CANH) CANH dominant output voltage 2.75 4.5 V VTXD = 0.8V
D11 VO(CANL) CANL dominant output voltage 0.5 2.25 V VTXD = 0.8V
D12 VDIFF(r)(o) Recessive differential output -500 +50 mV VTXD = 2V; no load
voltage
D13 VDIFF (d)(o) Dominant differential output 1.5 3.0 V VTXD = 0.8V; VDD = 5V
voltage 40 < RL < 60 (Note 2)
D14 IO(SC)(CANH) CANH short-circuit output -200 mA VCANH = -5V
D15 current -100 mA VCANH = -40V, +40V. (Note 1)
(typical)
D16 IO(SC)(CANL)l CANL short circuit output current 200 mA VCANL = -40V, +40V. (Note 1)
Bus Line (CANH; CANL) Receiver: [TXD = 2V; pins 6 and 7 externally driven]
D17 VDIFF(r)(i) Recessive differential input -1.0 +0.5 V -2V < V(CANL, CANH) < +7V
voltage (Note 3)
-1.0 +0.4 V -12V < V(CANL, CANH ) < +12V
(Note 3)
D18 V DIFF(d)(i) Dominant differential input 0.9 5.0 V -2V < V(CANL, CANH) < +7V
voltage (Note 3)
1.0 5.0 V -12V < V(CANL, CANH) < +12V
(Note 3)
D19 V DIFF(h)(i) Differential input hysteresis 100 200 mV see Figure 2-4. (Note 1)
D20 RIN CANH, CANL common-mode 5 50 k
input resistance
D21 RIN(d) Deviation between CANH and -3 +3 % VCANH = VCANL
CANL common-mode input
resistance
Note 1: This parameter is periodically sampled and not 100% tested.
2: ITXD = IRXD = IVREF = 0 mA; 0V < VCANL < VDD; 0V < VCANH < VDD; VRS = VDD.
3: This is valid for the receiver in all modes, High-Speed, Slope-Control and standby.

DS21667C-page 8 Preliminary 2002 Microchip Technology Inc.

 MCP2551
2.2 DC Characteristics (Continued)
Electrical Characteristics:
DC Specifications (Continued) Industrial (I): TAMB = -40C to +85C VDD = 4.5V to 5.5V
Extended (E): TAMB = -40C to +125C VDD = 4.5V to 5.5V
Param
Sym Characteristic Min Max Units Conditions
No.
Bus Line (CANH; CANL) Receiver: [TXD = 2V; pins 6 and 7 externally driven]
D22 RDIFF Differential input resistance 20 100 k
D24 ILI CANH, CANL input leakage 150 A VDD < VPOR ;
current VCANH = VCANL = +5V
Transmitter Data Input (TXD):
D25 VIH High-level input voltage 2.0 V Output recessive
D26 VIL Low-level input voltage +0.8 V Output dominant
D27 IIH High-level input current -1 +1 A VTXD = VDD
D28 IIL Low-level input current -100 -400 A VTXD = 0V
Receiver Data Output (RXD):
D31 VOH High-level output voltage 0.7 V IOH = 8 mA
D32 VOL Low-level output voltage 0.8 V IOL = 8 mA
Voltage Reference Output (VREF ):
D33 VREF Reference output voltage 0.45 VDD 0.55 VDD V -50 A < IVREF < 50 A
Standby/Slope-Control (RS pin):
D34 VSTB Input voltage for standby mode 0.75 VDD V
D35 ISLOPE Slope-control mode current -10 -200 A
D36 V SLOPE Slope-control mode voltage 0.4 VDD 0.6 VDD V
Thermal Shutdown:
D37 TJ(sd) Shutdown junction temperature 155 180 o
C Note 1
D38 TJ (h) Shutdown temperature 20 30 o
C -12V < V(CANL, CANH) < +12V
hysteresis (Note 3)
Note 1: This parameter is periodically sampled and not 100% tested.
2: ITXD = IRXD = IVREF = 0 mA; 0V < VCANL < VDD; 0V < VCANH < VDD; VRS = VDD.
3: This is valid for the receiver in all modes, High-Speed, Slope-Control and standby.

FIGURE 2-2: TEST CIRCUIT FOR ELECTRICAL CHARACTERISTICS

VDD 0.1F

CANH
TXD

VREF CAN 60 100 pF

Transceiver
RXD
30 pF CANL
GND RS

Rext

Note: RS may be connected to V DD or GND via a load resistor depending on desired operating mode
as described in Section 1.7.8, Slope Resistor Input.

2002 Microchip Technology Inc. Preliminary DS21667C-page 9

MCP2551
FIGURE 2-3: TEST CIRCUIT FOR AUTOMOTIVE TRANSIENTS

CANH 500 pF
TXD

VREF CAN Schaffner

60
Transceiver Generator
RXD
CANL 500 pF
GND RS
Note: RS may be connected to VDD or
Rext GND via a load resistor depending
on desired operating mode as
described in Section 1.7.8

The wave forms of the applied transients shall be in accordance with ISO-7637, Part 1, test pulses 1, 2, 3a and 3b.

FIGURE 2-4: HYSTERESIS OF THE RECEIVER

RXD (receive data

VOH
output voltage)
VDIFF (r)(i) VDIFF (d)(i)

VOL
hysteresis
D19

0.5 0.9
VDIFF (V)

DS21667C-page 10 Preliminary 2002 Microchip Technology Inc.

 MCP2551
2.3 AC Characteristics

Electrical Characteristics:
AC Specifications Industrial (I): TAMB = -40C to +85CVDD = 4.5V to 5.5V
Extended (E): TAMB = -40C to +125CVDD = 4.5V to 5.5V
Param
Sym Characteristic Min Max Units Conditions
No.
1 tBIT Bit time 1 62.5 s VRS = 0V
2 fBIT Bit frequency 16 1000 kHz VRS = 0V
3 TtxL2bus(d) Delay TXD to bus active 70 ns -40C TAMB +125C,
VRS = 0V
4 TtxH2bus(r) Delay TXD to bus inactive 125 ns -40C TAMB +85C,
VRS = 0V
170 ns -40C TAMB +125C,
VRS = 0V
5 TtxL2rx(d) Delay TXD to receive active 130 ns -40C TAMB +125C,
VRS = 0V
250 ns -40C TAMB +125C,
RS = 47 k
6 TtxH2rx(r) Delay TXD to receiver 175 ns -40C TAMB +85C,
inactive VRS = 0V
225 ns -40C TAMB +85C,
RS = 47 k
235 ns -40C TAMB +125C,
VRS = 0V
400 ns -40C TAMB +125C,
RS = 47 k
7 SR CANH, CANL slew rate 5.5 8.5 V/s Refer to Figure 1-1;
RS = 47 k, (Note 1)
10 tWAKE Wake-up time from standby 5 s see Figure 2-6
(Rs pin)
11 TbusD2rx(s) Bus dominant to RXD Low 550 ns VRS = +4V; (see Figure 2-7)
(standby mode)
12 CIN(CANH) CANH; CANL input 20 pF 1 Mbit/s data rate;
CIN(CANL) capacitance (typical) VTXD = VDD, (Note 1)
13 CDIFF Differential input 10 pF 1 Mbit/s data rate
capacitance (typical) (Note 1)
14 TtxL2busZ TX Permanent Dominant 1.25 4 ms
Timer Disable Time
15 TtxR2pdt(res) TX Permanent Dominant 1 s Rising edge on TXD while
Timer Reset Time device is in permanent
dominant state
Note 1: This parameter is periodically sampled and not 100% tested.

2002 Microchip Technology Inc. Preliminary DS21667C-page 11

MCP2551
2.4 Timing Diagrams and Specifications

FIGURE 2-5: TIMING DIAGRAM FOR AC CHARACTERISTICS

VDD
TXD (transmit data
input voltage)
0V

VDIFF (CANH,
CANL differential 0.9V 0.5V
voltage)

RXD (receive data 0.7 VDD

0.3 VDD
output voltage) 3
5 4
6

FIGURE 2-6: TIMING DIAGRAM FOR WAKEUP FROM STANDBY

VRS Slope resistor

VDD
input voltage
0.6 VDD
0V
VRXD Receive data
output voltage
0.3 VDD

10
VTXD = 0.8V

FIGURE 2-7: TIMING DIAGRAM FOR BUS DOMINANT TO RXD LOW (STANDBY MODE)

1.5V
VDIFF, Differential 0.9V
voltage
0V

Receive data
output voltage
0.3 VDD

11

VRS = 4V; VTXD = 2V

DS21667C-page 12 Preliminary 2002 Microchip Technology Inc.

 MCP2551
3.0 PACKAGING INFORMATION
3.1 Package Marking Information

8-Lead PDIP (300 mil) Example:

XXXXXXXX MCP2551
XXXXXNNN I/P256
YYWW 0234

8-Lead SOIC (150 mil) Example:

XXXXXXXX MCP2551
XXXXYYWW I/SN0234
NNN 256

Legend: XX...X Customer specific information*

YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week 01)
NNN Alphanumeric traceability code

Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.

* Standard marking consists of Microchip part number, year code, week code, traceability code (facility
code, mask rev#, and assembly code). For marking beyond this, certain price adders apply. Please
check with your Microchip Sales Office.

2002 Microchip Technology Inc. Preliminary DS21667C-page 13

MCP2551
8-Lead Plastic Dual In-line (P) 300 mil (PDIP)

E1

n 1

A A2

L
c
A1

B1
p
eB B

Units INCHES* MILLIMETERS

Dimension Limits MIN NOM MAX MIN NOM MAX
Number of Pins n 8 8
Pitch p .100 2.54
Top to Seating Plane A .140 .155 .170 3.56 3.94 4.32
Molded Package Thickness A2 .115 .130 .145 2.92 3.30 3.68
Base to Seating Plane A1 .015 0.38
Shoulder to Shoulder Width E .300 .313 .325 7.62 7.94 8.26
Molded Package Width E1 .240 .250 .260 6.10 6.35 6.60
Overall Length D .360 .373 .385 9.14 9.46 9.78
Tip to Seating Plane L .125 .130 .135 3.18 3.30 3.43
Lead Thickness c .008 .012 .015 0.20 0.29 0.38
Upper Lead Width B1 .045 .058 .070 1.14 1.46 1.78
Lower Lead Width B .014 .018 .022 0.36 0.46 0.56
Overall Row Spacing eB .310 .370 .430 7.87 9.40 10.92
Mold Draft Angle Top 5 10 15 5 10 15
Mold Draft Angle Bottom 5 10 15 5 10 15
* Controlling Parameter
Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010 (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018

DS21667C-page 14 Preliminary 2002 Microchip Technology Inc.

 MCP2551
8-Lead Plastic Small Outline (SN) Narrow, 150 mil (SOIC)

E1

D
2

B n 1

h
45

c
A A2

L A1

Units INCHES* MILLIMETERS

Dimension Limits MIN NOM MAX MIN NOM MAX
Number of Pins n 8 8
Pitch p .050 1.27
Overall Height A .053 .061 .069 1.35 1.55 1.75
Molded Package Thickness A2 .052 .056 .061 1.32 1.42 1.55
Standoff A1 .004 .007 .010 0.10 0.18 0.25
Overall Width E .228 .237 .244 5.79 6.02 6.20
Molded Package Width E1 .146 .154 .157 3.71 3.91 3.99
Overall Length D .189 .193 .197 4.80 4.90 5.00
Chamfer Distance h .010 .015 .020 0.25 0.38 0.51
Foot Length L .019 .025 .030 0.48 0.62 0.76
Foot Angle 0 4 8 0 4 8
Lead Thickness c .008 .009 .010 0.20 0.23 0.25
Lead Width B .013 .017 .020 0.33 0.42 0.51
Mold Draft Angle Top 0 12 15 0 12 15
Mold Draft Angle Bottom 0 12 15 0 12 15
* Controlling Parameter
Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010 (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057

2002 Microchip Technology Inc. Preliminary DS21667C-page 15

MCP2551
NOTES:

DS21667C-page 16 Preliminary 2002 Microchip Technology Inc.

 MCP2551
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO. X /XX
Examples:
Device Temperature Package a) MCP2551-I/P: Industrial temperature,
Range PDIP package.
b) MCP2551-E/P: Extended temperature,
PDIP package.
Device: MCP2551= High-Speed CAN Transceiver c) MCP2551-I/SN: Industrial temperature,
SOIC package.
Temperature I = -40C to +85C d) MCP2551T-I/SN: Tape and Reel, Industrial
Range: E = -40C to +125C Temperature, SOIC package.
e) MCP2551T-E/SN: Tape and Reel,
Extended Temperature, SOIC package.
Package: P = Plastic DIP (300 mil Body) 8-lead
SN = Plastic SOIC (150 mil Body) 8-lead

Sales and Support

Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and
recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:

1. Your local Microchip sales office

2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
3. The Microchip Worldwide Site (www.microchip.com)

Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.

Customer Notification System

Register on our web site (www.microchip.com/cn) to receive the most current information on our products.

2002 Microchip Technology Inc. Preliminary DS21667C-page 17

MCP2551
NOTES:

DS21667C-page 18 Preliminary 2002 Microchip Technology Inc.

Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.

Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.

There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowl-
edge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

Microchip is willing to work with the customer who is concerned about the integrity of their code.

Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as unbreakable.

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products.

Information contained in this publication regarding device Trademarks

applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to The Microchip name and logo, the Microchip logo, K EELOQ,
ensure that your application meets with your specifications. MPLAB, PIC, PICmicro, PICSTART and PRO MATE are
No representation or warranty is given and no liability is registered trademarks of Microchip Technology Incorporated
assumed by Microchip Technology Incorporated with respect in the U.S.A. and other countries.
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such FilterLab, microID, MXDEV, MXLAB, PICMASTER, SEEVAL
and The Embedded Control Solutions Company are
use or otherwise. Use of Microchips products as critical com-
registered trademarks of Microchip Technology Incorporated
ponents in life support systems is not authorized except with
express written approval by Microchip. No licenses are con- in the U.S.A.
veyed, implicitly or otherwise, under any intellectual property
dsPIC, dsPICDEM.net, ECONOMONITOR, FanSense,
rights. FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP,
ICEPIC, microPort, Migratable Memory, MPASM, MPLIB,
MPLINK, MPSIM, PICC, PICDEM, PICDEM.net, rfPIC, Select
Mode and Total Endurance are trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.

Serialized Quick Turn Programming (SQTP) is a service mark

of Microchip Technology Incorporated in the U.S.A.

All other trademarks mentioned herein are property of their

respective companies.

2002, Microchip Technology Incorporated, Printed in the

U.S.A., All Rights Reserved.

Printed on recycled paper.

Microchip received QS-9000 quality system

certification for its worldwide headquarters,
design and wafer fabrication facilities in
Chandler and Tempe, Arizona in July 1999
and Mountain View, California in March 2002.
The Companys quality system processes and
procedures are QS-9000 compliant for its
PICmicro 8-bit MCUs, KEELOQ code hopping
devices, Serial EEPROMs, microperipherals,
non-volatile memory and analog products. In
addition, Microchips quality system for the
design and manufacture of development
systems is ISO 9001 certified.

2002 Microchip Technology Inc. DS21667C - page 19

M
WORLDWIDE SALES AND SERVICE
AMERICAS ASIA/PACIFIC Japan
Microchip Technology Japan K.K.
Corporate Office Australia
Benex S-1 6F
2355 West Chandler Blvd. Microchip Technology Australia Pty Ltd
3-18-20, Shinyokohama
Chandler, AZ 85224-6199 Suite 22, 41 Rawson Street
Kohoku-Ku, Yokohama-shi
Tel: 480-792-7200 Fax: 480-792-7277 Epping 2121, NSW
Kanagawa, 222-0033, Japan
Technical Support: 480-792-7627 Australia
Tel: 81-45-471- 6166 Fax: 81-45-471-6122
Web Address: http://www.microchip.com Tel: 61-2-9868-6733 Fax: 61-2-9868-6755
Korea
Rocky Mountain China - Beijing
Microchip Technology Korea
2355 West Chandler Blvd. Microchip Technology Consulting (Shanghai)
168-1, Youngbo Bldg. 3 Floor
Chandler, AZ 85224-6199 Co., Ltd., Beijing Liaison Office
Samsung-Dong, Kangnam-Ku
Tel: 480-792-7966 Fax: 480-792-4338 Unit 915
Seoul, Korea 135-882
Bei Hai Wan Tai Bldg.
Atlanta Tel: 82-2-554-7200 Fax: 82-2-558-5934
No. 6 Chaoyangmen Beidajie
3780 Mansell Road, Suite 130 Beijing, 100027, No. China Singapore
Alpharetta, GA 30022 Tel: 86-10-85282100 Fax: 86-10-85282104 Microchip Technology Singapore Pte Ltd.
Tel: 770-640-0034 Fax: 770-640-0307 200 Middle Road
China - Chengdu
#07-02 Prime Centre
Boston Microchip Technology Consulting (Shanghai) Singapore, 188980
2 Lan Drive, Suite 120 Co., Ltd., Chengdu Liaison Office Tel: 65-6334-8870 Fax: 65-6334-8850
Westford, MA 01886 Rm. 2401-2402, 24th Floor,
Tel: 978-692-3848 Fax: 978-692-3821 Ming Xing Financial Tower Taiwan
No. 88 TIDU Street Microchip Technology (Barbados) Inc.,
Chicago Taiwan Branch
333 Pierce Road, Suite 180 Chengdu 610016, China
Tel: 86-28-86766200 Fax: 86-28-86766599 11F-3, No. 207
Itasca, IL 60143 Tung Hua North Road
Tel: 630-285-0071 Fax: 630-285-0075 China - Fuzhou Taipei, 105, Taiwan
Microchip Technology Consulting (Shanghai) Tel: 886-2-2717-7175 Fax: 886-2-2545-0139
Dallas
Co., Ltd., Fuzhou Liaison Office
4570 Westgrove Drive, Suite 160
Addison, TX 75001
Unit 28F, World Trade Plaza EUROPE
No. 71 Wusi Road
Tel: 972-818-7423 Fax: 972-818-2924 Austria
Fuzhou 350001, China
Detroit Tel: 86-591-7503506 Fax: 86-591-7503521 Microchip Technology Austria GmbH
Tri-Atria Office Building Durisolstrasse 2
China - Shanghai A-4600 Wels
32255 Northwestern Highway, Suite 190 Microchip Technology Consulting (Shanghai)
Farmington Hills, MI 48334 Austria
Co., Ltd. Tel: 43-7242-2244-399
Tel: 248-538-2250 Fax: 248-538-2260 Room 701, Bldg. B Fax: 43-7242-2244-393
Kokomo Far East International Plaza
Denmark
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Microchip Technology Nordic ApS
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Regus Business Centre
Tel: 765-864-8360 Fax: 765-864-8387 Tel: 86-21-6275-5700 Fax: 86-21-6275-5060
Lautrup hoj 1-3
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Microchip Technology Consulting (Shanghai) Tel: 45 4420 9895 Fax: 45 4420 9910
18201 Von Karman, Suite 1090
Co., Ltd., Shenzhen Liaison Office France
Irvine, CA 92612
Rm. 15-16, 13/F, Shenzhen Kerry Centre, Microchip Technology SARL
Tel: 949-263-1888 Fax: 949-263-1338
Renminnan Lu Parc dActivite du Moulin de Massy
San Jose Shenzhen 518001, China 43 Rue du Saule Trapu
Microchip Technology Inc. Tel: 86-755-82350361 Fax: 86-755-82366086 Batiment A - ler Etage
2107 North First Street, Suite 590 China - Hong Kong SAR 91300 Massy, France
San Jose, CA 95131 Microchip Technology Hongkong Ltd. Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79
Tel: 408-436-7950 Fax: 408-436-7955 Unit 901-6, Tower 2, Metroplaza Germany
Toronto 223 Hing Fong Road Microchip Technology GmbH
6285 Northam Drive, Suite 108 Kwai Fong, N.T., Hong Kong Steinheilstrasse 10
Mississauga, Ontario L4V 1X5, Canada Tel: 852-2401-1200 Fax: 852-2401-3431 D-85737 Ismaning, Germany
Tel: 905-673-0699 Fax: 905-673-6509 India Tel: 49-89-627-144 0 Fax: 49-89-627-144-44
Microchip Technology Inc. Italy
India Liaison Office Microchip Technology SRL
Divyasree Chambers Centro Direzionale Colleoni
1 Floor, Wing A (A3/A4) Palazzo Taurus 1 V. Le Colleoni 1
No. 11, OShaugnessey Road 20041 Agrate Brianza
Bangalore, 560 025, India Milan, Italy
Tel: 91-80-2290061 Fax: 91-80-2290062 Tel: 39-039-65791-1 Fax: 39-039-6899883
United Kingdom
Microchip Ltd.
505 Eskdale Road
Winnersh Triangle
Wokingham
Berkshire, England RG41 5TU
Tel: 44 118 921 5869 Fax: 44-118 921-5820

11/15/02

DS21667C-page 20 2002 Microchip Technology Inc.