ZA200810662B - Cold-pressed sputter targets - Google Patents

Cold-pressed sputter targets

Info

Publication number: ZA200810662B
Authority: ZA; South Africa
Prior art keywords: cold; pressed; sputter targets; sputter; targets
Prior art date: 2006-06-01

Application number

ZA200810662A

Other languages

English (en)

Inventor

Markus Schultheis

Martin Weigert

Original Assignee

Heraeus Gmbh W C

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2006-06-01

Filing date

2008-12-18

Publication date

2009-12-30

2008-12-18 Application filed by Heraeus Gmbh W C filed Critical Heraeus Gmbh W C

2009-12-30 Publication of ZA200810662B publication Critical patent/ZA200810662B/xx

Classifications

- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/02—Compacting only

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Mechanical Engineering (AREA)
Chemical Kinetics & Catalysis (AREA)
Materials Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Manufacturing & Machinery (AREA)
Physical Vapour Deposition (AREA)
Powder Metallurgy (AREA)
Coating By Spraying Or Casting (AREA)

ZA200810662A 2006-06-01 2008-12-18 Cold-pressed sputter targets ZA200810662B (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
DE102006026005A DE102006026005A1 (de)	2006-06-01	2006-06-01	Kaltgepresste Sputtertargets

Publications (1)

Publication Number	Publication Date
ZA200810662B true ZA200810662B (en)	2009-12-30

Family

ID=38421730

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
ZA200810662A ZA200810662B (en)	2006-06-01	2008-12-18	Cold-pressed sputter targets

Country Status (9)

Country	Link
US (1)	US20090277777A1 (xx)
EP (1)	EP2024529A1 (xx)
JP (1)	JP2009538984A (xx)
KR (1)	KR20090031499A (xx)
CN (1)	CN101460650A (xx)
DE (1)	DE102006026005A1 (xx)
RU (1)	RU2008150855A (xx)
WO (1)	WO2007137824A1 (xx)
ZA (1)	ZA200810662B (xx)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE102007060306B4 (de) *	2007-11-29	2011-12-15	W.C. Heraeus Gmbh	Magnetische Shunts in Rohrtargets
KR101249566B1 (ko) *	2009-07-27	2013-04-01	제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤	Ｃｕ-Ｇａ 소결체 스퍼터링 타깃 및 동 타깃의 제조 방법
CN102234765B (zh) *	2010-04-23	2013-04-17	昆明物理研究所	一种生长碲镉汞薄膜的靶材制备方法
JP4948634B2 (ja)	2010-09-01	2012-06-06	Ｊｘ日鉱日石金属株式会社	インジウムターゲット及びその製造方法
WO2012074609A1 (en)	2010-11-30	2012-06-07	Dow Global Technologies Llc	Refurbishing copper and indium containing alloy sputter targets
US9150958B1 (en)	2011-01-26	2015-10-06	Apollo Precision Fujian Limited	Apparatus and method of forming a sputtering target
JP5140169B2 (ja)	2011-03-01	2013-02-06	Ｊｘ日鉱日石金属株式会社	インジウムターゲット及びその製造方法
JP5026611B1 (ja) *	2011-09-21	2012-09-12	Ｊｘ日鉱日石金属株式会社	積層構造体及びその製造方法
JP5074628B1 (ja) *	2012-01-05	2012-11-14	Ｊｘ日鉱日石金属株式会社	インジウム製スパッタリングターゲット及びその製造方法
KR20140054169A (ko)	2012-08-22	2014-05-08	제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤	인듐제 원통형 스퍼터링 타깃 및 그 제조 방법
WO2015002253A1 (ja) *	2013-07-05	2015-01-08	Ａｇｃセラミックス株式会社	スパッタリングターゲット及びその製造方法
WO2015004958A1 (ja)	2013-07-08	2015-01-15	Jx日鉱日石金属株式会社	スパッタリングターゲット及び、それの製造方法
JP2015017297A (ja) *	2013-07-10	2015-01-29	三菱マテリアル株式会社	Ｉｎ系円筒形スパッタリングターゲットおよびその製造方法
EP2947175A1 (en) *	2014-05-21	2015-11-25	Heraeus Deutschland GmbH & Co. KG	CuSn, CuZn and Cu2ZnSn sputter targets
US11450516B2 (en) *	2019-08-14	2022-09-20	Honeywell International Inc.	Large-grain tin sputtering target
AT18282U1 (de) *	2023-05-16	2024-08-15	Plansee Composite Mat Gmbh	Segmentiertes Ringtarget

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
AT388752B (de) *	1986-04-30	1989-08-25	Plansee Metallwerk	Verfahren zur herstellung eines targets fuer die kathodenzerstaeubung
DE4115663A1 (de) *	1991-05-14	1992-11-19	Leybold Ag	Verfahren zur herstellung eines targets, insbesondere eines rohrtargets einer sputtervorrichtung
FR2680799B1 (fr) *	1991-09-03	1993-10-29	Elf Aquitaine Ste Nale	Element de cible pour pulverisation cathodique, procede de preparation dudit element et cibles, notamment de grande surface, realisees a partir de cet element.
US5342571A (en) *	1992-02-19	1994-08-30	Tosoh Smd, Inc.	Method for producing sputtering target for deposition of titanium, aluminum and nitrogen coatings, sputtering target made thereby, and method of sputtering with said targets
WO1996036746A1 (fr) *	1995-05-18	1996-11-21	Asahi Glass Company Ltd.	Procede de production d'une cible de pulverisation
KR100567472B1 (ko) *	1995-08-31	2006-07-03	이노베이티브 스퍼터링 테크놀로지	무기공의 분말야금 합금 물품, 이의 제조 방법, 연속 플라즈마 스퍼터링 장치, 연속 플라즈마 스퍼터링 방법 및 ito 관상 타겟 제조 방법
JPH10270733A (ja) *	1997-01-24	1998-10-09	Asahi Chem Ind Co Ltd	ｐ型半導体、ｐ型半導体の製造方法、光起電力素子、発光素子
US6010583A (en) *	1997-09-09	2000-01-04	Sony Corporation	Method of making unreacted metal/aluminum sputter target
US6749103B1 (en) *	1998-09-11	2004-06-15	Tosoh Smd, Inc.	Low temperature sputter target bonding method and target assemblies produced thereby
JP4826066B2 (ja) *	2004-04-27	2011-11-30	住友金属鉱山株式会社	非晶質の透明導電性薄膜およびその製造方法、並びに、該非晶質の透明導電性薄膜を得るためのスパッタリングターゲットおよびその製造方法
US7833821B2 (en) *	2005-10-24	2010-11-16	Solopower, Inc.	Method and apparatus for thin film solar cell manufacturing

2006
- 2006-06-01 DE DE102006026005A patent/DE102006026005A1/de not_active Withdrawn
2007
- 2007-05-30 WO PCT/EP2007/004754 patent/WO2007137824A1/de active Application Filing
- 2007-05-30 CN CNA2007800201155A patent/CN101460650A/zh active Pending
- 2007-05-30 KR KR1020087025817A patent/KR20090031499A/ko not_active Withdrawn
- 2007-05-30 RU RU2008150855/02A patent/RU2008150855A/ru not_active Application Discontinuation
- 2007-05-30 US US12/296,462 patent/US20090277777A1/en not_active Abandoned
- 2007-05-30 EP EP07725645A patent/EP2024529A1/de not_active Withdrawn
- 2007-05-30 JP JP2009512483A patent/JP2009538984A/ja not_active Withdrawn
2008
- 2008-12-18 ZA ZA200810662A patent/ZA200810662B/xx unknown

Also Published As

Publication number	Publication date
DE102006026005A1 (de)	2007-12-06
US20090277777A1 (en)	2009-11-12
JP2009538984A (ja)	2009-11-12
EP2024529A1 (de)	2009-02-18
CN101460650A (zh)	2009-06-17
WO2007137824A1 (de)	2007-12-06
RU2008150855A (ru)	2010-07-20
KR20090031499A (ko)	2009-03-26

Publication	Publication Date	Title
ZA200810662B (en)	2009-12-30	Cold-pressed sputter targets
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GB0717797D0 (en)	2007-10-24	Radar system
GB0625545D0 (en)	2007-02-21	Radar system
GB0609979D0 (en)	2006-06-28	Target
ZA200903304B (en)	2010-07-28	Food composition
GB0616962D0 (en)	2006-10-04	Pigeon Line
SG126876A1 (en)	2006-11-29	Aluminum-based sputtering targets
SG129331A1 (en)	2007-02-26	Enhanced sputter target alloy compositions
DE602007003815D1 (en)	2010-01-28	Men
SG129330A1 (en)	2007-02-26	Enhanced magnetron sputtering target
TWI315749B (en)	2009-10-11	Sputter magnetron
EP1996619A4 (en)	2009-11-18	GPCR RECEPTORS USED AS TARGETS FOR ANGIOGENESIS
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GB2448674B (en)	2011-07-20	Sword targets
GB0703622D0 (en)	2007-04-04	Undergarments
GB2435504B (en)	2008-02-13	Target assembly
GB0612843D0 (en)	2006-08-09	Radar
AU2006901067A0 (en)	2006-03-16	Throw Away Period Panties
AU2006903972A0 (en)	2006-08-03	Throw away period panties
GB0604856D0 (en)	2006-04-19	Toilet target
GB0605855D0 (en)	2006-05-03	Anti-viral compositions