WO2014157247A1 - Composition durcissable - Google Patents
Composition durcissable Download PDFInfo
- Publication number
- WO2014157247A1 WO2014157247A1 PCT/JP2014/058359 JP2014058359W WO2014157247A1 WO 2014157247 A1 WO2014157247 A1 WO 2014157247A1 JP 2014058359 W JP2014058359 W JP 2014058359W WO 2014157247 A1 WO2014157247 A1 WO 2014157247A1
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- WIPO (PCT)
- Prior art keywords
- curable composition
- meth
- acrylate
- group
- weight
- Prior art date
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- 239000000203 mixture Substances 0.000 title claims abstract description 112
- 229920000642 polymer Polymers 0.000 claims abstract description 61
- -1 trimethoxysilyl group Chemical group 0.000 claims abstract description 61
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims abstract description 25
- 229920001577 copolymer Polymers 0.000 claims abstract description 16
- 125000003808 silyl group Chemical group [H][Si]([H])([H])[*] 0.000 claims abstract description 14
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims abstract description 10
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims abstract description 6
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims abstract description 5
- 229920000058 polyacrylate Polymers 0.000 claims description 26
- 150000001875 compounds Chemical class 0.000 claims description 25
- HGQSXVKHVMGQRG-UHFFFAOYSA-N dioctyltin Chemical compound CCCCCCCC[Sn]CCCCCCCC HGQSXVKHVMGQRG-UHFFFAOYSA-N 0.000 claims description 23
- 239000007822 coupling agent Substances 0.000 claims description 14
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 claims description 14
- 239000007795 chemical reaction product Substances 0.000 claims description 12
- LQRUPWUPINJLMU-UHFFFAOYSA-N dioctyl(oxo)tin Chemical compound CCCCCCCC[Sn](=O)CCCCCCCC LQRUPWUPINJLMU-UHFFFAOYSA-N 0.000 claims description 9
- 239000000047 product Substances 0.000 description 27
- 238000002844 melting Methods 0.000 description 23
- 230000008018 melting Effects 0.000 description 23
- 238000000034 method Methods 0.000 description 19
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 16
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 12
- 239000003381 stabilizer Substances 0.000 description 11
- 230000001070 adhesive effect Effects 0.000 description 10
- 239000003963 antioxidant agent Substances 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 238000003860 storage Methods 0.000 description 10
- 239000000853 adhesive Substances 0.000 description 9
- 239000011248 coating agent Substances 0.000 description 9
- 239000000945 filler Substances 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 229920003002 synthetic resin Polymers 0.000 description 9
- 239000000057 synthetic resin Substances 0.000 description 9
- RFFLAFLAYFXFSW-UHFFFAOYSA-N 1,2-dichlorobenzene Chemical compound ClC1=CC=CC=C1Cl RFFLAFLAYFXFSW-UHFFFAOYSA-N 0.000 description 8
- 229910000019 calcium carbonate Inorganic materials 0.000 description 8
- 239000003054 catalyst Substances 0.000 description 8
- 238000009833 condensation Methods 0.000 description 8
- 230000005494 condensation Effects 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 239000003795 chemical substances by application Substances 0.000 description 7
- 239000012024 dehydrating agents Substances 0.000 description 7
- 229920001451 polypropylene glycol Polymers 0.000 description 7
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 description 7
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 6
- 239000012964 benzotriazole Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 235000014113 dietary fatty acids Nutrition 0.000 description 6
- 239000000194 fatty acid Substances 0.000 description 6
- 229930195729 fatty acid Natural products 0.000 description 6
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 6
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- CQQXCSFSYHAZOO-UHFFFAOYSA-L [acetyloxy(dioctyl)stannyl] acetate Chemical compound CCCCCCCC[Sn](OC(C)=O)(OC(C)=O)CCCCCCCC CQQXCSFSYHAZOO-UHFFFAOYSA-L 0.000 description 5
- 230000003078 antioxidant effect Effects 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- 239000006096 absorbing agent Substances 0.000 description 4
- 125000003545 alkoxy group Chemical group 0.000 description 4
- 239000012298 atmosphere Substances 0.000 description 4
- 230000018044 dehydration Effects 0.000 description 4
- 238000006297 dehydration reaction Methods 0.000 description 4
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 4
- 150000004665 fatty acids Chemical class 0.000 description 4
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 4
- 239000004611 light stabiliser Substances 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000013008 thixotropic agent Substances 0.000 description 4
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 3
- 239000011094 fiberboard Substances 0.000 description 3
- 238000005227 gel permeation chromatography Methods 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 238000010526 radical polymerization reaction Methods 0.000 description 3
- 239000000565 sealant Substances 0.000 description 3
- 125000005372 silanol group Chemical group 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 239000002023 wood Substances 0.000 description 3
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 2
- CJLWOZPIRROUCU-UHFFFAOYSA-M C(CCCCCCCCC)(=O)[O-].C(CCCCCCC)[Sn+]CCCCCCCC Chemical compound C(CCCCCCCCC)(=O)[O-].C(CCCCCCC)[Sn+]CCCCCCCC CJLWOZPIRROUCU-UHFFFAOYSA-M 0.000 description 2
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 description 2
- 125000005370 alkoxysilyl group Chemical group 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- OCWYEMOEOGEQAN-UHFFFAOYSA-N bumetrizole Chemical compound CC(C)(C)C1=CC(C)=CC(N2N=C3C=C(Cl)C=CC3=N2)=C1O OCWYEMOEOGEQAN-UHFFFAOYSA-N 0.000 description 2
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 description 2
- 235000010354 butylated hydroxytoluene Nutrition 0.000 description 2
- 238000010538 cationic polymerization reaction Methods 0.000 description 2
- 238000006482 condensation reaction Methods 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- JQVDAXLFBXTEQA-UHFFFAOYSA-N dibutylamine Chemical compound CCCCNCCCC JQVDAXLFBXTEQA-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 230000002401 inhibitory effect Effects 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 2
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 125000001181 organosilyl group Chemical group [SiH3]* 0.000 description 2
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 2
- 239000002530 phenolic antioxidant Substances 0.000 description 2
- 239000011120 plywood Substances 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 230000002195 synergetic effect Effects 0.000 description 2
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 2
- 230000009974 thixotropic effect Effects 0.000 description 2
- 125000005369 trialkoxysilyl group Chemical group 0.000 description 2
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 2
- NBXZNTLFQLUFES-UHFFFAOYSA-N triethoxy(propyl)silane Chemical compound CCC[Si](OCC)(OCC)OCC NBXZNTLFQLUFES-UHFFFAOYSA-N 0.000 description 2
- PYOKUURKVVELLB-UHFFFAOYSA-N trimethyl orthoformate Chemical compound COC(OC)OC PYOKUURKVVELLB-UHFFFAOYSA-N 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- NDQXKKFRNOPRDW-UHFFFAOYSA-N 1,1,1-triethoxyethane Chemical compound CCOC(C)(OCC)OCC NDQXKKFRNOPRDW-UHFFFAOYSA-N 0.000 description 1
- HDPNBNXLBDFELL-UHFFFAOYSA-N 1,1,1-trimethoxyethane Chemical compound COC(C)(OC)OC HDPNBNXLBDFELL-UHFFFAOYSA-N 0.000 description 1
- JIHQDMXYYFUGFV-UHFFFAOYSA-N 1,3,5-triazine Chemical compound C1=NC=NC=N1 JIHQDMXYYFUGFV-UHFFFAOYSA-N 0.000 description 1
- SZMZIUKGERWEQD-UHFFFAOYSA-N 1-isocyanatopropyl(trimethoxy)silane Chemical compound O=C=NC(CC)[Si](OC)(OC)OC SZMZIUKGERWEQD-UHFFFAOYSA-N 0.000 description 1
- OTCWVYFQGYOYJO-UHFFFAOYSA-N 1-o-methyl 10-o-(1,2,2,6,6-pentamethylpiperidin-4-yl) decanedioate Chemical compound COC(=O)CCCCCCCCC(=O)OC1CC(C)(C)N(C)C(C)(C)C1 OTCWVYFQGYOYJO-UHFFFAOYSA-N 0.000 description 1
- SPSPIUSUWPLVKD-UHFFFAOYSA-N 2,3-dibutyl-6-methylphenol Chemical compound CCCCC1=CC=C(C)C(O)=C1CCCC SPSPIUSUWPLVKD-UHFFFAOYSA-N 0.000 description 1
- CJWNFAKWHDOUKL-UHFFFAOYSA-N 2-(2-phenylpropan-2-yl)phenol Chemical compound C=1C=CC=C(O)C=1C(C)(C)C1=CC=CC=C1 CJWNFAKWHDOUKL-UHFFFAOYSA-N 0.000 description 1
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 1
- ZMWRRFHBXARRRT-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-4,6-bis(2-methylbutan-2-yl)phenol Chemical compound CCC(C)(C)C1=CC(C(C)(C)CC)=CC(N2N=C3C=CC=CC3=N2)=C1O ZMWRRFHBXARRRT-UHFFFAOYSA-N 0.000 description 1
- IYAZLDLPUNDVAG-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-4-(2,4,4-trimethylpentan-2-yl)phenol Chemical compound CC(C)(C)CC(C)(C)C1=CC=C(O)C(N2N=C3C=CC=CC3=N2)=C1 IYAZLDLPUNDVAG-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- ZYAASQNKCWTPKI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propan-1-amine Chemical compound CO[Si](C)(OC)CCCN ZYAASQNKCWTPKI-UHFFFAOYSA-N 0.000 description 1
- STEYNUVPFMIUOY-UHFFFAOYSA-N 4-Hydroxy-1-(2-hydroxyethyl)-2,2,6,6-tetramethylpiperidine Chemical compound CC1(C)CC(O)CC(C)(C)N1CCO STEYNUVPFMIUOY-UHFFFAOYSA-N 0.000 description 1
- MUXOBHXGJLMRAB-UHFFFAOYSA-N Dimethyl succinate Chemical compound COC(=O)CCC(=O)OC MUXOBHXGJLMRAB-UHFFFAOYSA-N 0.000 description 1
- OKOBUGCCXMIKDM-UHFFFAOYSA-N Irganox 1098 Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)NCCCCCCNC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 OKOBUGCCXMIKDM-UHFFFAOYSA-N 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- DFPAKSUCGFBDDF-UHFFFAOYSA-N Nicotinamide Chemical group NC(=O)C1=CC=CN=C1 DFPAKSUCGFBDDF-UHFFFAOYSA-N 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 229910008051 Si-OH Inorganic materials 0.000 description 1
- 229910006358 Si—OH Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- XQBCVRSTVUHIGH-UHFFFAOYSA-L [dodecanoyloxy(dioctyl)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCCCCCC)(CCCCCCCC)OC(=O)CCCCCCCCCCC XQBCVRSTVUHIGH-UHFFFAOYSA-L 0.000 description 1
- UZFVQGTYOXJWTF-UHFFFAOYSA-L [octadecanoyloxy(dioctyl)stannyl] octadecanoate Chemical compound CCCCCCCCCCCCCCCCCC(=O)O[Sn](CCCCCCCC)(CCCCCCCC)OC(=O)CCCCCCCCCCCCCCCCC UZFVQGTYOXJWTF-UHFFFAOYSA-L 0.000 description 1
- KXKVLQRXCPHEJC-UHFFFAOYSA-N acetic acid trimethyl ester Natural products COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 125000004423 acyloxy group Chemical group 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 125000003302 alkenyloxy group Chemical group 0.000 description 1
- VWEMSUCCUQSLME-UHFFFAOYSA-N alkofanone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C(C=1C=CC=CC=1)CC(=O)C1=CC=CC=C1 VWEMSUCCUQSLME-UHFFFAOYSA-N 0.000 description 1
- 229950002429 alkofanone Drugs 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 125000003368 amide group Chemical group 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 125000002344 aminooxy group Chemical group [H]N([H])O[*] 0.000 description 1
- 238000010539 anionic addition polymerization reaction Methods 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- RSOILICUEWXSLA-UHFFFAOYSA-N bis(1,2,2,6,6-pentamethylpiperidin-4-yl) decanedioate Chemical compound C1C(C)(C)N(C)C(C)(C)CC1OC(=O)CCCCCCCCC(=O)OC1CC(C)(C)N(C)C(C)(C)C1 RSOILICUEWXSLA-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- XGZGKDQVCBHSGI-UHFFFAOYSA-N butyl(triethoxy)silane Chemical compound CCCC[Si](OCC)(OCC)OCC XGZGKDQVCBHSGI-UHFFFAOYSA-N 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 150000007942 carboxylates Chemical group 0.000 description 1
- 239000004359 castor oil Substances 0.000 description 1
- 235000019438 castor oil Nutrition 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- DGPFXVBYDAVXLX-UHFFFAOYSA-N dibutyl(diethoxy)silane Chemical compound CCCC[Si](OCC)(OCC)CCCC DGPFXVBYDAVXLX-UHFFFAOYSA-N 0.000 description 1
- AYOHIQLKSOJJQH-UHFFFAOYSA-N dibutyltin Chemical compound CCCC[Sn]CCCC AYOHIQLKSOJJQH-UHFFFAOYSA-N 0.000 description 1
- ZMAPKOCENOWQRE-UHFFFAOYSA-N diethoxy(diethyl)silane Chemical compound CCO[Si](CC)(CC)OCC ZMAPKOCENOWQRE-UHFFFAOYSA-N 0.000 description 1
- VVKJJEAEVBNODX-UHFFFAOYSA-N diethoxy-di(propan-2-yl)silane Chemical compound CCO[Si](C(C)C)(C(C)C)OCC VVKJJEAEVBNODX-UHFFFAOYSA-N 0.000 description 1
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 description 1
- AHUXYBVKTIBBJW-UHFFFAOYSA-N dimethoxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](OC)(OC)C1=CC=CC=C1 AHUXYBVKTIBBJW-UHFFFAOYSA-N 0.000 description 1
- YYLGKUPAFFKGRQ-UHFFFAOYSA-N dimethyldiethoxysilane Chemical compound CCO[Si](C)(C)OCC YYLGKUPAFFKGRQ-UHFFFAOYSA-N 0.000 description 1
- FFUUQWKRQSBSGU-UHFFFAOYSA-N dipropylsilicon Chemical compound CCC[Si]CCC FFUUQWKRQSBSGU-UHFFFAOYSA-N 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- MCPKSFINULVDNX-UHFFFAOYSA-N drometrizole Chemical compound CC1=CC=C(O)C(N2N=C3C=CC=CC3=N2)=C1 MCPKSFINULVDNX-UHFFFAOYSA-N 0.000 description 1
- 238000010828 elution Methods 0.000 description 1
- DFJDZTPFNSXNAX-UHFFFAOYSA-N ethoxy(triethyl)silane Chemical compound CCO[Si](CC)(CC)CC DFJDZTPFNSXNAX-UHFFFAOYSA-N 0.000 description 1
- WHHPBKGGWUPLBO-UHFFFAOYSA-N ethoxy-tri(propan-2-yl)silane Chemical compound CCO[Si](C(C)C)(C(C)C)C(C)C WHHPBKGGWUPLBO-UHFFFAOYSA-N 0.000 description 1
- CWAFVXWRGIEBPL-UHFFFAOYSA-N ethoxysilane Chemical compound CCO[SiH3] CWAFVXWRGIEBPL-UHFFFAOYSA-N 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- WBJINCZRORDGAQ-UHFFFAOYSA-N formic acid ethyl ester Natural products CCOC=O WBJINCZRORDGAQ-UHFFFAOYSA-N 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 230000003301 hydrolyzing effect Effects 0.000 description 1
- 238000006459 hydrosilylation reaction Methods 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 238000010551 living anionic polymerization reaction Methods 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- 239000002609 medium Substances 0.000 description 1
- ARYZCSRUUPFYMY-UHFFFAOYSA-N methoxysilane Chemical compound CO[SiH3] ARYZCSRUUPFYMY-UHFFFAOYSA-N 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- INJVFBCDVXYHGQ-UHFFFAOYSA-N n'-(3-triethoxysilylpropyl)ethane-1,2-diamine Chemical compound CCO[Si](OCC)(OCC)CCCNCCN INJVFBCDVXYHGQ-UHFFFAOYSA-N 0.000 description 1
- QMIREOCYHAFOPK-UHFFFAOYSA-N n,n'-bis(3-triethoxysilylpropyl)ethane-1,2-diamine Chemical compound CCO[Si](OCC)(OCC)CCCNCCNCCC[Si](OCC)(OCC)OCC QMIREOCYHAFOPK-UHFFFAOYSA-N 0.000 description 1
- KWCRBSAFZCVWGF-UHFFFAOYSA-N n,n'-bis(3-triethoxysilylpropyl)hexane-1,6-diamine Chemical compound CCO[Si](OCC)(OCC)CCCNCCCCCCNCCC[Si](OCC)(OCC)OCC KWCRBSAFZCVWGF-UHFFFAOYSA-N 0.000 description 1
- HZGIOLNCNORPKR-UHFFFAOYSA-N n,n'-bis(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCNCCC[Si](OC)(OC)OC HZGIOLNCNORPKR-UHFFFAOYSA-N 0.000 description 1
- IAUJBLTYWDIDKB-UHFFFAOYSA-N n,n'-bis(3-trimethoxysilylpropyl)hexane-1,6-diamine Chemical compound CO[Si](OC)(OC)CCCNCCCCCCNCCC[Si](OC)(OC)OC IAUJBLTYWDIDKB-UHFFFAOYSA-N 0.000 description 1
- RGZOACSRFUXKEQ-UHFFFAOYSA-N n,n'-bis[3-[dimethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)CCCNCCNCCC[Si](C)(OC)OC RGZOACSRFUXKEQ-UHFFFAOYSA-N 0.000 description 1
- FTQWRYSLUYAIRQ-UHFFFAOYSA-N n-[(octadecanoylamino)methyl]octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(=O)NCNC(=O)CCCCCCCCCCCCCCCCC FTQWRYSLUYAIRQ-UHFFFAOYSA-N 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- SSDSCDGVMJFTEQ-UHFFFAOYSA-N octadecyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 SSDSCDGVMJFTEQ-UHFFFAOYSA-N 0.000 description 1
- 125000006353 oxyethylene group Chemical group 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920002503 polyoxyethylene-polyoxypropylene Polymers 0.000 description 1
- 229920006327 polystyrene foam Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- APSBXTVYXVQYAB-UHFFFAOYSA-M sodium docusate Chemical group [Na+].CCCCC(CC)COC(=O)CC(S([O-])(=O)=O)C(=O)OCC(CC)CCCC APSBXTVYXVQYAB-UHFFFAOYSA-M 0.000 description 1
- 239000010421 standard material Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- UQMOLLPKNHFRAC-UHFFFAOYSA-N tetrabutyl silicate Chemical compound CCCCO[Si](OCCCC)(OCCCC)OCCCC UQMOLLPKNHFRAC-UHFFFAOYSA-N 0.000 description 1
- ZUEKXCXHTXJYAR-UHFFFAOYSA-N tetrapropan-2-yl silicate Chemical compound CC(C)O[Si](OC(C)C)(OC(C)C)OC(C)C ZUEKXCXHTXJYAR-UHFFFAOYSA-N 0.000 description 1
- ZQZCOBSUOFHDEE-UHFFFAOYSA-N tetrapropyl silicate Chemical compound CCCO[Si](OCCC)(OCCC)OCCC ZQZCOBSUOFHDEE-UHFFFAOYSA-N 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- ZQJYXISBATZORI-UHFFFAOYSA-N tributyl(ethoxy)silane Chemical compound CCCC[Si](CCCC)(CCCC)OCC ZQJYXISBATZORI-UHFFFAOYSA-N 0.000 description 1
- DENFJSAFJTVPJR-UHFFFAOYSA-N triethoxy(ethyl)silane Chemical compound CCO[Si](CC)(OCC)OCC DENFJSAFJTVPJR-UHFFFAOYSA-N 0.000 description 1
- BJDLPDPRMYAOCM-UHFFFAOYSA-N triethoxy(propan-2-yl)silane Chemical compound CCO[Si](OCC)(OCC)C(C)C BJDLPDPRMYAOCM-UHFFFAOYSA-N 0.000 description 1
- GKASDNZWUGIAMG-UHFFFAOYSA-N triethyl orthoformate Chemical compound CCOC(OCC)OCC GKASDNZWUGIAMG-UHFFFAOYSA-N 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- PZJJKWKADRNWSW-UHFFFAOYSA-N trimethoxysilicon Chemical group CO[Si](OC)OC PZJJKWKADRNWSW-UHFFFAOYSA-N 0.000 description 1
- 239000003981 vehicle Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/32—Polymers modified by chemical after-treatment
- C08G65/329—Polymers modified by chemical after-treatment with organic compounds
- C08G65/336—Polymers modified by chemical after-treatment with organic compounds containing silicon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/02—Polyalkylene oxides
Definitions
- the present invention relates to a curable composition that can be cured in a short time and is excellent in adhesiveness and storage stability.
- curable compositions containing a polymer having a crosslinkable hydrolyzable silyl group as a main component are known. Curable compositions are used in various applications as paints, coating agents, adhesives, pressure sensitive adhesives, sealants and sealants.
- crosslinkable hydrolyzable silyl group of the polymer is hydrolyzed by the atmosphere or moisture contained in the adherend, followed by dehydration condensation, whereby the curable composition is cured and bonded. Forms a cured product with excellent strength.
- Patent Document 1 discloses a curable composition containing a polyoxyalkylene polymer having a crosslinkable hydrolyzable silyl group. By using a polyoxyalkylene polymer, a curable composition that can be cured in a short time can be provided.
- the curable composition of Patent Document 1 can be cured in a short time, it has low adhesion. For this reason, the cured product of the curable composition does not have sufficient adhesion to various substrates.
- the curable composition of Patent Document 1 has low storage stability.
- the curable composition is often stored for several months in a warehouse or a storefront after the production.
- the curable composition of Patent Document 1 is stored for a long period of time, the viscosity of the curable composition is rapidly increased and coating is likely to be difficult.
- an object of the present invention is to provide a curable composition that can be cured in a short time and is excellent in adhesion and storage stability.
- the curable composition of the present invention comprises 100 parts by weight of a polyoxyalkylene polymer (A) having a trimethoxysilyl group, a hydrolyzable silyl group, and ethyl (meth) acrylate and n- Copolymer of butyl (meth) acrylate, or (meth) acrylate polymer (B) containing a copolymer of methyl (meth) acrylate and n-butyl (meth) acrylate, and dioctyltin compound It is characterized by containing.
- A polyoxyalkylene polymer having a trimethoxysilyl group, a hydrolyzable silyl group, and ethyl (meth) acrylate and n- Copolymer of butyl (meth) acrylate
- B containing a copolymer of methyl (meth) acrylate and n-butyl (meth) acrylate, and dioctyl
- the polyoxyalkylene polymer (A) has a trimethoxysilyl group (—Si (OCH 3 ) 3 ).
- the main chain skeleton of the polyoxyalkylene polymer (A) has the formula: — (RO) n — (wherein R represents an alkylene group having 1 to 14 carbon atoms, and n is the number of repeating units. It is preferable that the polymer contains a repeating unit represented by the following formula:
- the main chain skeleton of the polyoxyalkylene polymer may be composed of only one type of repeating unit, or may be composed of two or more types of repeating units. According to the polyoxyalkylene polymer (A) having such a main chain skeleton, the curing rate of the curable composition can be improved.
- the main chain skeleton of the polyoxyalkylene polymer (A) includes polyoxyethylene, polyoxypropylene, polyoxybutylene, polyoxytetramethylene, polyoxyethylene-polyoxypropylene copolymer, and polyoxypropylene-poly Examples thereof include oxybutylene copolymers. Of these, polyoxypropylene is preferable. According to polyoxypropylene, not only can the curing rate of the curable composition be improved, but also the adhesiveness of the curable composition can be improved, and the cured product obtained by curing the curable composition is excellent. Flexibility and extensibility can be imparted.
- the polyoxyalkylene polymer (A) preferably further has a urethane bond in addition to the trimethoxysilyl group.
- the urethane bond can promote the hydrolysis reaction and dehydration condensation reaction of the trimethoxysilyl group, thereby improving the curing rate of the curable composition.
- the urethane bond can impart polarity to the polyoxyalkylene polymer (A), thereby improving the adhesiveness of the curable composition.
- the polyoxyalkylene polymer (A) preferably has a trimethoxysilyl group at both ends of the main chain skeleton via urethane bonds. According to the polyoxyalkylene polymer (A) having a urethane bond in the vicinity of the trimethoxysilyl group, the curing rate and adhesiveness of the curable composition can be further improved.
- a polyoxyalkylene polymer (A) having a trimethoxysilyl group via urethane bonds at both ends of the main chain skeleton includes, for example, a prepolymer having hydroxy groups at both ends of the polyoxyalkylene chain, and trimethoxysilyl It is obtained by reacting a compound having a group and an isocyanate group.
- prepolymers having hydroxy groups at both ends of the polyoxyalkylene chain include poly (oxyethylene) glycol, poly (oxypropylene) glycol, poly (oxybutylene) glycol, poly (oxytetramethylene) glycol, and poly (oxyethylene).
- poly (oxyethylene) glycol poly (oxypropylene) glycol, poly (oxybutylene) glycol, poly (oxytetramethylene) glycol, and poly (oxyethylene).
- -Poly (oxypropylene) glycol and poly (oxypropylene) -poly (oxybutylene) glycol examples include poly (oxyethylene) glycol, poly (oxypropylene) glycol, poly (oxybutylene) glycol, poly (oxytetramethylene) glycol, and poly (oxyethylene).
- Examples of the compound having a trimethoxysilyl group and an isocyanate group include 1-isocyanate methyltrimethoxysilane, 2-isocyanateethyltrimethoxysilane, 3-isocyanatepropyltrimethoxysilane, 3-isocyanatebutyltrimethoxysilane, 3-isocyanatepentyltril. Examples include methoxysilane and 1-isocyanatopropyltrimethoxysilane.
- a prepolymer having hydroxy groups at both ends of the polyoxyalkylene chain By mixing a compound having a trimethoxysilyl group and an isocyanate group to obtain a mixture, and stirring the mixture to react the hydroxy group of the prepolymer with the isocyanate group of the compound to form a urethane bond. It can be carried out. Moreover, reaction can be accelerated
- the number average molecular weight of the polyoxyalkylene polymer (A) is preferably 5,000 to 50,000, more preferably 8,000 to 30,000, and particularly preferably 8,000 to 20,000. According to the polyoxyalkylene polymer (A) having a number average molecular weight of 5,000 or more, it is possible to further improve the adhesive force, mechanical strength, and extensibility of the cured product of the curable composition. In addition, according to the polyoxyalkylene polymer (A) having a number average molecular weight of 50,000 or less, the viscosity of the curable composition can be kept low, whereby excellent coating of the curable composition can be achieved. Sex can be secured.
- the number average molecular weight of the polyoxyalkylene polymer (A) is measured by conversion with polystyrene using a GPC (gel permeation chromatography) method. Specifically, after 6-7 mg of polyoxyalkylene polymer (A) is supplied to a test tube, orthodichlorobenzene (o-DCB) containing 0.05% by weight of dibutylhydroxytoluene (BHT) in the test tube The solution is added to prepare a diluted solution having a polyoxyalkylene polymer (A) concentration of 1 mg / mL.
- o-DCB orthodichlorobenzene
- BHT dibutylhydroxytoluene
- the diluted solution is shaken for 1 hour at 145 ° C. at a rotation speed of 25 rpm, and the polyoxyalkylene polymer (A) is dissolved in the o-DCB solution to obtain a measurement sample.
- the number average molecular weight of the polyoxyalkylene polymer (A) can be measured by the GPC method using this measurement sample.
- the number average molecular weight in the polyoxyalkylene polymer (A) can be measured by, for example, the following measuring apparatus and measuring conditions.
- Product name "HLC-8121GPC / HT" manufactured by TOSOH Measurement conditions Column: TSKgelGMHHR-H (20) HT ⁇ 3 TSKguardcolumn-HHR (30) HT ⁇ 1
- Detector Blythe refractometer Standard material: Polystyrene (Molecular weight: 500-8420000, manufactured by TOSOH) Elution conditions: 145 ° C
- the measurement of the weight average molecular weight of the (meth) acrylate polymer (B) described later can also be performed by the same method as the method for measuring the number average molecular weight of the polyoxyalkylene polymer (A) described above.
- the viscosity at 25 ° C. of the polyoxyalkylene polymer (A) is preferably 1,000 to 30,000 mPa ⁇ s, more preferably 4,000 to 25,000 mPa ⁇ s, and 5,000 to 15,000 mPa ⁇ s. Is particularly preferred. According to the polyoxyalkylene polymer (A) having a viscosity of 1,000 mPa ⁇ s or more, the adhesive force, mechanical strength, and extensibility of the cured product of the curable composition can be further improved.
- the viscosity of the curable composition can be kept low, whereby excellent coating of the curable composition is achieved. Sex can be secured.
- the viscosity of the polyoxyalkylene polymer (A) at 25 ° C. can be measured as follows. First, the polyoxyalkylene polymer (A) is allowed to stand at 25 ° C. for 24 hours, and then, according to JIS K7117-1, using a B-type viscometer under the condition of a rotation speed of 10 rpm. Thus, the viscosity of the polyoxyalkylene polymer (A) can be measured.
- polyoxyalkylene polymer (A) containing a trimethoxysilyl group a commercially available product can be used.
- a polyoxyalkylene polymer having a main chain skeleton of polyoxypropylene and having a trimethoxysilyl group at the end of the main chain skeleton and no urethane bond Exastar A2551 manufactured by Asahi Glass Co., Ltd .; Examples include Silyl SAX510, SAX520, SAX530, and SAX580 manufactured by Kaneka Corporation.
- Desmosal (registered trademark) XP2749 manufactured by Bayer Corporation can be used as a polyoxyalkylene polymer having a main chain skeleton of polyoxypropylene and having a trimethoxysilyl group at the end of the main chain skeleton via a urethane bond.
- Desmosal (registered trademark) XP2749 manufactured by Bayer Corporation can be used as a polyoxyalkylene polymer having a main chain skeleton of polyoxypropylene and having a trimethoxysilyl group at the end of the main chain skeleton via a urethane bond.
- the (meth) acrylate polymer (B) has a hydrolyzable silyl group.
- the hydrolyzable silyl group is a group in which 1 to 3 hydrolyzable groups are bonded to a silicon atom. According to the (meth) acrylate polymer (B), the adhesion of the curable composition is improved without inhibiting the improvement of the curing rate of the curable composition by the polyoxyalkylene polymer (A). Can do.
- the hydrolyzable group of the hydrolyzable silyl group is not particularly limited, and examples thereof include a hydrogen atom, a halogen atom, an alkoxy group, an acyloxy group, a ketoximate group, an amino group, an amide group, an acid amide group, an aminooxy group, and a mercapto group. Group, an alkenyloxy group, and the like.
- an alkoxysilyl group is preferable because the curing rate of the curable composition can be improved.
- alkoxysilyl groups include trialkoxysilyl groups such as trimethoxysilyl group, triethoxysilyl group, triisopropoxysilyl group, and triphenoxysilyl group; dimethoxysilyl groups such as dimethoxymethylsilyl group and diethoxymethylsilyl group and monoalkoxysilyl groups such as a methoxydimethoxysilyl group and an ethoxydimethylsilyl group.
- a trialkoxysilyl group is more preferable, and a trimethoxysilyl group is particularly preferable.
- the main chain skeleton of the (meth) acrylate polymer (B) is a copolymer of ethyl (meth) acrylate and n-butyl (meth) acrylate, or a copolymer of methyl (meth) acrylate and n-butyl (meth) acrylate.
- the adhesiveness of the curable composition can be improved without inhibiting the improvement of the curing rate of the curable composition by the polyoxyalkylene polymer (A). It can be improved further.
- the main chain skeleton of the (meth) acrylate polymer (B) is preferably a copolymer of ethyl acrylate and n-butyl acrylate.
- (meth) acrylate means a methacrylate or an acrylate.
- the polymerization method of the (meth) acrylate polymer (B) is not particularly limited, and a known method can be used.
- a free radical polymerization method an anionic polymerization method, a cationic polymerization method, a UV radical polymerization method, Various polymerization methods such as a living anionic polymerization method, a living cation polymerization method, and a living radical polymerization method may be mentioned.
- the method for introducing the hydrolyzable silyl group into the (meth) acrylate polymer (B) is not particularly limited.
- a copolymer of ethyl (meth) acrylate and n-butyl (meth) acrylate, or methyl It is possible to use a method of hydrosilylation by introducing a hydrosilane having a hydrolyzable silyl group after introducing an unsaturated group into the molecule of the copolymer of (meth) acrylate and n-butyl (meth) acrylate. it can.
- the weight average molecular weight of the (meth) acrylate polymer (B) is preferably 2,000 to 50,000, more preferably 2,500 to 10,000, and particularly preferably 2,500 to 5,000. According to the (meth) acrylate polymer (B) having a weight average molecular weight of 2,000 or more, it is possible to further improve the adhesive strength, mechanical strength, and extensibility of the cured product of the curable composition. In addition, according to the (meth) acrylate polymer (B) having a weight average molecular weight of 50,000 or less, the viscosity of the curable composition can be kept low, whereby an excellent coating of the curable composition can be achieved. Workability can be secured.
- the content of the (meth) acrylate polymer (B) in the curable composition is 10 to 100 parts by weight with respect to 100 parts by weight of the polyoxyalkylene polymer (A), but 10 to 60 parts by weight. Part is preferable, and 30 to 50 parts by weight is more preferable.
- the adhesiveness of the curable composition can be sufficiently improved.
- the high cure rate of a curable composition is securable by making content of the (meth) acrylate type polymer (B) in a curable composition into 100 weight part or less.
- the curable composition of the present invention contains a dioctyltin compound as a silanol condensation catalyst.
- the silanol condensation catalyst is a catalyst for promoting a dehydration condensation reaction between silanol groups.
- the silanol group means a hydroxy group ( ⁇ Si—OH) directly bonded to a silicon atom.
- the silanol group is formed by hydrolyzing a hydrolyzable silyl group such as a trimethoxysilyl group.
- Dioctyltin compounds include dioctyltin diacetate, dioctyltin monodecanate, dioctyltin bisethoxysilicate, dioctyltin diacetate, dioctyltin monodecanate, dioctyltin bisethoxysilicate, reaction product of dioctyltin oxide and alkoxysilane compound, and dioctyl The reaction material of a tin dicarboxylate and an alkoxysilane compound is also mentioned. According to these dioctyltin compounds, the adhesiveness and storage stability of the curable composition can be improved.
- a dioctyl tin compound may be used independently or 2 or more types may be used together.
- examples of the alkoxysilane compound include tetraalkoxysilanes such as tetramethoxysilane, tetraethoxysilane, tetrapropoxysilane, tetraisopropoxysilane, and tetrabutoxysilane, and hydrolysates thereof.
- Monoalkyltrialkoxysilanes such as triethoxymethylsilane, triethoxyethylsilane, triethoxypropylsilane, triethoxyisopropylsilane, triethoxybutylsilane and hydrolysates thereof; diethoxydimethylsilane, diethoxydiethylsilane, diethoxy; Dialkyl dialkoxysilanes and their hydrolysates such as dipropylsilane, diethoxydiisopropylsilane, and diethoxydibutylsilane; Chirushiran, ethoxy triethylsilane, triethoxy propyl silane, ethoxy triisopropylsilane, and the like trialkyl monoalkoxysilanes and hydrolysates thereof such as ethoxy tributyl silane.
- a reaction product of dioctyltin oxide and an alkoxysilane compound is formed by a reaction between a group represented by —Sn ( ⁇ O) — in dioctyltin oxide and an alkoxy group bonded to a silicon atom in the alkoxysilane compound. It is a compound.
- a reaction product of dioctyltin oxide and an alkoxysilane compound specifically, dioctyltin oxybisethoxysilicate, dioctyltin oxybismethoxysilicate, dioctyltin bis (triethoxysilicate), and dioctyltin bis (trimethoxysilicate) Etc.
- examples of dioctyltin dicarboxylate include dioctyltin diacetate, dioctyltin dilaurate, and dioctyltin distearate.
- the alkoxysilane compound may be the same as the alkoxysilane compound described above in the reaction product of dioctyltin oxide and alkoxysilane compound.
- a reaction product of dioctyltin dicarboxylate and an alkoxysilane compound is a compound formed by a reaction between a carboxylate group in dioctyltin dicarboxylate and an alkoxy group bonded to a silicon atom in the alkoxysilane compound. is there.
- a reaction product of dioctyltin dicarboxylate and alkoxysilane compound specifically, dioctyltin oxybisethoxysilicate, dioctyltin oxybismethoxysilicate, dioctyltin bis (triethoxysilicate), dioctyltin bis (trimethoxysilicate) ) And the like.
- dioctyltin compound a dioctyltin diacetate, a reaction product of dioctyltin oxide and an alkoxysilane compound is preferable, a reaction product of dioctyltin oxide and an alkoxysilane compound is more preferable, dioctyltin oxybisethoxysilicate, And dioctyltin bis (triethoxysilicate) are particularly preferred.
- the content of the dioctyltin compound in the curable composition is preferably 1 to 10 parts by weight and more preferably 1 to 5 parts by weight with respect to 100 parts by weight of the polyoxyalkylene polymer (A).
- the curable composition of the present invention preferably further contains an aminosilane coupling agent.
- the aminosilane coupling agent means a compound having a silicon atom having an alkoxy group bonded in one molecule and a functional group containing a nitrogen atom.
- aminosilane coupling agents include 3-aminopropyltrimethoxysilane, 3-aminopropylmethyldimethoxysilane, 3-aminopropyltriethoxysilane, and N-2- (aminoethyl) -3-aminopropyltrimethoxy.
- aminosilane coupling agents include 3-aminopropyltrimethoxysilane, N-2- (aminoethyl) -3-aminopropyltrimethoxysilane, and N-2- (aminoethyl) -3-aminopropyltrimethyl. Ethoxysilane is preferred, and N-2- (aminoethyl) -3-aminopropyltrimethoxysilane is more preferred. According to these aminosilane coupling agents, a synergistic effect with the (meth) acrylate polymer (B) can be easily obtained, and the adhesiveness of the curable composition can be further improved.
- the content of the aminosilane coupling agent in the curable composition is preferably 0.5 to 10 parts by weight and more preferably 1 to 5 parts by weight with respect to 100 parts by weight of the polyoxyalkylene polymer (A).
- the curable composition of the present invention preferably further contains a dehydrating agent. According to the dehydrating agent, when the curable composition is stored, the curable composition can be prevented from being cured by moisture contained in the air.
- dehydrating agents include silane compounds such as vinyltrimethoxysilane, dimethyldimethoxysilane, tetraethoxysilane, methyltrimethoxysilane, methyltriethoxysilane, tetramethoxysilane, phenyltrimethoxysilane, and diphenyldimethoxysilane; and methyl orthoformate And ester compounds such as ethyl orthoformate, methyl orthoacetate, and ethyl orthoacetate.
- dehydrating agents may be used alone or in combination of two or more. Of these, vinyltrimethoxysilane is preferable.
- the content of the dehydrating agent in the curable composition is preferably 0.5 to 20 parts by weight, more preferably 5 to 20 parts by weight, with respect to 100 parts by weight of the polyoxyalkylene polymer (A). 12 parts by weight is particularly preferred.
- the curable composition of the present invention preferably further contains a filler. According to the filler, a curable composition capable of obtaining a cured product having excellent mechanical strength can be provided.
- filler examples include calcium carbonate, magnesium carbonate, calcium oxide, hydrous silicic acid, anhydrous silicic acid, finely divided silica, calcium silicate, titanium dioxide, clay, talc, carbon black, and glass balloon. These fillers may be used alone or in combination of two or more. Of these, calcium carbonate is preferably used.
- the average particle size of calcium carbonate is preferably 0.01 to 5 ⁇ m, more preferably 0.05 to 2.5 ⁇ m. According to the calcium carbonate having such an average particle size, a cured product having excellent mechanical strength and extensibility can be obtained, and a curable composition having excellent adhesiveness can be obtained. Can be provided.
- Calcium carbonate is preferably surface-treated with a fatty acid or a fatty acid ester. According to the calcium carbonate surface-treated with a fatty acid, a fatty acid ester, or the like, thixotropic properties can be imparted to the curable composition and aggregation of calcium carbonate can be suppressed.
- the content of the filler in the curable composition is preferably 1 to 700 parts by weight and more preferably 10 to 200 parts by weight with respect to 100 parts by weight of the polyoxyalkylene polymer (A).
- the curable composition of the present invention preferably further contains a weathering stabilizer.
- a weathering stabilizer include an antioxidant, an ultraviolet absorber, and a light stabilizer.
- a weathering stabilizer may be used individually by 1 type, and may use 2 or more types together.
- antioxidants examples include hindered phenolic antioxidants, monophenolic antioxidants, bisphenolic antioxidants, and polyphenolic antioxidants. Of these, hindered phenol antioxidants are preferred. Specific examples of hindered phenol antioxidants include pentaerythritol tetrakis [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate] (melting point: 118 ° C.), octadecyl-3- (3 , 5-di-tert-butyl-4-hydroxyphenyl) propionate] (melting point 52 ° C.), and N, N′-hexane-1,6-diylbis [3- (3,5-di-tert-butyl-4 -Hydroxyphenylpropionamide)] (melting point: 158 ° C.), and octyl 3- (4-hydroxy-3,5-diisopropylphenyl) propionate (melting point: 5
- the content of the antioxidant in the curable composition is preferably 0.1 to 20 parts by weight, more preferably 0.3 to 10 parts by weight with respect to 100 parts by weight of the polyoxyalkylene polymer (A). .
- UV absorbers examples include benzotriazole UV absorbers and benzophenone UV absorbers. Of these, benzotriazole-based ultraviolet absorbers are preferred. Specific examples of the benzotriazole ultraviolet absorber include 2- (2H-benzotriazol-2-yl) -p-cresol (melting point 130 ° C.), 2- (2H-benzotriazol-2-yl) -4- 6-bis (1-methyl-1-phenylethyl) phenol (melting point 139 ° C.), 2- [5-chloro (2H) -benzotriazol-2-yl] -4-methyl-6- (tert-butyl) phenol (Melting point 139 ° C.), 2- (2H-benzotriazol-2-yl) -4,6-di-tert-pentylphenol (melting point 84 ° C.), and 2- (2H-benzotriazol-2-yl) -4 -(1,1,3,3-tetramethylbutyl) phenol (mel
- the content of the ultraviolet absorber in the curable composition is preferably 0.1 to 20 parts by weight, and more preferably 0.1 to 10 parts by weight with respect to 100 parts by weight of the polyoxyalkylene polymer (A). .
- light stabilizers include hindered amine light stabilizers. Specifically, a mixture of bis (1,2,2,6,6-pentamethyl-4-piperidyl) sebacate and methyl 1,2,2,6,6-pentamethyl-4-piperidyl sebacate (melting point: 10 ° C.
- the content of the light stabilizer in the curable composition is preferably 0.1 to 20 parts by weight, more preferably 0.1 to 10 parts by weight with respect to 100 parts by weight of the polyoxyalkylene polymer (A). .
- the melting point of the weather resistance stabilizer is preferably 10 ° C. or less, more preferably ⁇ 20 to 10 ° C., and particularly preferably ⁇ 20 to 5 ° C. According to the weather stabilizer having a melting point of 10 ° C. or lower, excellent adhesiveness can be imparted to the curable composition.
- the melting point of the weather stabilizer means the melting point of each weather stabilizer.
- the melting point of the weather stabilizer is a value measured by a visual method according to JIS K0064 (1922).
- the curable composition of the present invention may contain other additives such as a thixotropic agent, a pigment, a dye, and an anti-settling agent, a solvent, and the like in addition to the components described above.
- Another additive and solvent may be used individually by 1 type, and may use 2 or more types together.
- the thixotropic agent may be any one that can express thixotropic properties in the curable composition.
- Preferred examples of the thixotropic agent include hydrogenated castor oil, fatty acid bisamide, and fumed silica.
- the content of the thixotropic agent in the curable composition is preferably 0.1 to 200 parts by weight and more preferably 1 to 150 parts by weight with respect to 100 parts by weight of the polyoxyalkylene polymer (A).
- Production of the curable composition of the present invention includes a polyoxyalkylene polymer (A) containing a trimethoxysilyl group, a (meth) acrylate polymer (B) containing a hydrolyzable silyl group, and a dioctyltin compound.
- A polyoxyalkylene polymer
- B (meth) acrylate polymer
- dioctyltin compound e.g., a dioctyltin compound.
- other additives and solvents can be mixed by a predetermined weight ratio. Mixing is preferably performed under reduced pressure.
- the curable composition of the present invention is rapidly cured by moisture in the air or moisture contained in the adherend, and forms a cured product having excellent adhesion to various substrates.
- a substrate is not particularly limited, and is a fluorine resin, vinyl chloride resin, vinylidene chloride resin, polyethylene resin, polypropylene resin, polystyrene resin, ABS resin, polyamide resin, polyester resin, polyurethane resin, polyvinyl alcohol resin, Synthetic resin board containing synthetic resin such as ethylene-vinyl acetate copolymer resin, chlorinated polypropylene resin, and melamine resin; natural wood, plywood, medium density fiber board (MDF) particle board, rigid fiber board, semi-rigid fiber board, And wood such as laminated wood; inorganic boards; and metal plates containing metals such as aluminum, iron, stainless steel, and steel sheets.
- MDF medium density fiber board
- examples of the base material include a synthetic resin-coated metal plate in which at least a part of the surface of the metal plate is coated with a synthetic resin.
- examples of the synthetic resin used for the synthetic resin-coated metal plate include polyvinyl chloride resin, polyolefin resin, polyester resin, and fluorine resin.
- examples of the metal plate used for the synthetic resin-coated metal plate include metal plates made of metals such as aluminum, iron, stainless steel, and steel plates.
- the curable composition of this invention is used suitably for base materials, such as a synthetic resin board and a synthetic resin coating metal plate.
- base materials such as a synthetic resin board and a synthetic resin coating metal plate.
- Conventional curable compositions have low adhesion to these substrates, and can particularly demonstrate the effects of the present invention.
- the curable composition of the present invention since the curable composition of the present invention has excellent adhesiveness, it is used for civil engineering, architectural, vehicle, electrical products, electronic parts, miscellaneous goods, sealing agents, It can be used for various applications as a coating agent, a sealant and a sealing agent, and a coating agent and primer agent for civil engineering or building base materials.
- a curable composition was prepared by mixing the following components in a sealed stirrer until the mixture was uniform in a sealed stirrer so as to have the blending amounts shown in Table 1, respectively.
- Polyoxyalkylene polymer (A1) Polyoxyalkylene polymer (A1) having a main chain skeleton of polyoxypropylene and having trimethoxysilyl groups at both ends of the main chain skeleton via urethane bonds (viscosity at 25 ° C.
- Polyoxyalkylene polymer (A2) A polyoxyalkylene polymer (A2) having a main chain skeleton of polyoxypropylene, having a trimethoxysilyl group at both ends of the main chain skeleton and having no urethane bond (number average molecular weight 25,000, 25 Viscosity at 25,000 mPa ⁇ s, Silyl SAX580 manufactured by Kaneka Corporation) [(Meth) acrylate polymer (B1)] (Meth) acrylate polymer (B1) having a trimethoxysilyl group and the main chain skeleton being a copolymer of ethyl acrylate and n-butyl acrylate (Alfone US-6170, manufactured by Toagosei Co., Ltd., weight average molecular weight) 2,800) [(Meth)
- tack free time In accordance with JIS A5758, tack-free time (minutes) of the curable composition was measured in an environment of a temperature of 23 ° C. and a relative humidity of 50%.
- adherend As the adherend, a lauan plywood, a stainless steel plate, and a fluororesin-coated steel plate were prepared. A curable composition is applied on each adherend in a bead shape (width 5 mm, thickness 4 mm) and cured by leaving it to stand in an atmosphere of a temperature of 23 ° C. and a relative humidity of 50% for 7 days. Got. Then, the cured product is peeled from the adherend at a tensile speed of 100 mm / min from one end to the other end in the length direction with a finger, and the destruction state of the cured product at this time is visually confirmed. did.
- the cohesive failure of the cured product means a state in which the cured product is destroyed when the cured product is peeled from the adherend.
- cured material means the state which peeled in the interface of a to-be-adhered body and hardened
- test body was produced using the curable composition, and tensile adhesive strength T [N / mm ⁇ 2 >] was measured about this test body.
- a specific measurement procedure is as follows. A mortar plate (thickness 15 mm, length 70 mm ⁇ width 70 mm) was prepared as a base sample, and a polystyrene foam heat insulating plate (thickness 5 mm, length 40 mm ⁇ width 40 mm) was prepared as a finished sample. The curable composition was applied to the entire lower surface of the finished sample so that the coating thickness was 1 mm. After the finished samples were placed on the base sample, they were left in an environment of a temperature of 23 ° C.
- the test body by which the ground sample and the finishing sample were bonded together by the hardened
- the test specimen was subjected to a tensile bond strength test, and the maximum load P [N] until the bonded surface was broken was measured. Then, the tensile adhesive strength T [N / mm 2 ] was calculated by dividing the maximum load P [N] by the application area W (1600 [mm 2 ]) of the curable composition.
- the curable composition was filled in a container, sealed, and left in an atmosphere at a temperature of 23 ° C. for 1 day.
- the viscosity T 1 [mPa ⁇ s] at 23 ° C. of the curable composition after standing was measured using a viscometer (Brookfield B8U viscometer, rotor: No. 7, rotation speed: 10 rpm).
- the curable composition was filled in a container and sealed, and left in an atmosphere at a temperature of 50 ° C. for 28 days.
- the viscosity T 2 [mPa ⁇ s] at 23 ° C. of the curable composition after standing was measured in the same manner as described above.
- the curable composition of the present invention can be cured in a short time and is excellent in adhesiveness and storage stability. Therefore, such a curable composition is suitably used for bonding various adherends.
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Abstract
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JP2021017566A (ja) * | 2019-07-19 | 2021-02-15 | 日本ゼオン株式会社 | 保存安定性に優れるアクリルゴムベール |
JP7022800B1 (ja) | 2020-09-02 | 2022-02-18 | サンスター技研株式会社 | 接着剤組成物及び接着構造体 |
WO2025063292A1 (fr) * | 2023-09-22 | 2025-03-27 | 株式会社カネカ | Composition durcissable |
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DE102014212668A1 (de) | 2014-05-26 | 2015-11-26 | Sms Group Gmbh | Vorrichtung zum Wickeln eines Bandmaterials zu einem Coil |
CN106566301A (zh) * | 2016-11-13 | 2017-04-19 | 惠州市大亚湾科翔科技电路板有限公司 | 一种柔性线路板用固化型组合物 |
CN111902485A (zh) * | 2018-03-28 | 2020-11-06 | 株式会社钟化 | 加热固化型的固化物的制造方法和加热固化型的固化性组合物 |
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JP5791824B2 (ja) | 2015-10-07 |
CN105073894B (zh) | 2018-06-08 |
JP2015014014A (ja) | 2015-01-22 |
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