WO2004040629A1 - プラズマ化学蒸着装置における高周波プラズマの大面積均一化方法及び装置 - Google Patents
プラズマ化学蒸着装置における高周波プラズマの大面積均一化方法及び装置 Download PDFInfo
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- WO2004040629A1 WO2004040629A1 PCT/JP2002/011208 JP0211208W WO2004040629A1 WO 2004040629 A1 WO2004040629 A1 WO 2004040629A1 JP 0211208 W JP0211208 W JP 0211208W WO 2004040629 A1 WO2004040629 A1 WO 2004040629A1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32174—Circuits specially adapted for controlling the RF discharge
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/505—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
- C23C16/509—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges using internal electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
Definitions
- the present invention relates to a method and an apparatus for uniformizing large-area high-frequency plasma in a plasma chemical vapor deposition apparatus.
- the present invention is directed to the production of semiconductors such as amorphous silicon, microcrystalline silicon, polycrystalline thin film silicon, and silicon nitride used for solar cells and thin film transistors, etching of semiconductor films, and the like.
- fluorine radicals chestnut-learning (self-cleaning) plasma chemical vapor deposition apparatus is incorporated employed such as by NF 3 gas plasma deposited Amoru Fas silicon (a -.S i) (P 1 asma Ch em ical Va p ou r De Position), a method and an apparatus for uniformizing a large area of a high-frequency plasma.
- a-Si amorphous silicon
- microcrystalline silicon polycrystalline thin film silicon
- silicon nitride used for solar cells and thin film transistors
- etch semiconductor films amorphous silicon (hereinafter referred to as a-Si), microcrystalline silicon, polycrystalline thin film silicon, and silicon nitride used for solar cells and thin film transistors, and etch semiconductor films.
- High-frequency plasma generators in plasma-enhanced chemical vapor deposition systems used for self-cleaning silicon deposited in the chamber with NF 3 gas by using a film have a parallel plate type electrode and a ladder type electrode. There are two types.
- FIG. 6 shows an example of the configuration of an apparatus using a parallel plate type electrode, in which a substrate heating and supporting means 6 is installed in a plasma chemical vapor deposition apparatus 1 and is electrically grounded.
- the plate electrode 60 is set at a position separated by 2 Omm.
- an external high-frequency power supply 61 is connected to the plate electrode 60 via an impedance matching device 62 and a coaxial cable 63, and unnecessary plasma is generated on the side opposite to the surface facing the substrate heating support means 6. Place Earth Sino Red 5 so that it does not.
- a substrate 7 for forming an a-Si thin film is set on the substrate heating and supporting means 6 set at, for example, 200 ° C., and a silane (SiH 4 ) gas is supplied through the gas introduction pipe 64 at a flow rate of, eg, 50 sc. Introduced in cm and connected to vacuum exhaust pipe 65
- the pressure in the plasma chemical vapor deposition apparatus 1 is adjusted to, for example, 10 O mTorr.
- the impedance matching device 62 so that the high-frequency power is efficiently supplied to the plasma generating section and supplying the high-frequency power from the high-frequency power supply 61, the plasma 66 is generated between the substrate 7 and the plate electrode 60.
- SiH 4 is decomposed in the plasma 66 to form an a-Si film on the surface of the substrate 7. Therefore, for example, by forming a film in this state for about 10 minutes, an a-Si film having a required thickness is formed.
- FIG. 7 shows an example of the configuration of a device using the ladder-type electrode 70
- FIG. 8 is a view drawn from the direction A in FIG. 7 so that the structure of the ladder-type electrode 70 can be clearly understood.
- the ladder type electrode is described in detail in, for example, Japanese Patent Application Laid-Open No. 4-236781, and an electrode group in which a plurality of electrode rods are arranged in parallel as an electrode shape developed from the ladder type electrode. Is disclosed in Japanese Patent Application Laid-Open No. 111-11622 using a mesh-like electrode in which two electrodes are arranged perpendicularly.
- a substrate heating and supporting means 6 (not shown in FIG. 8) is installed in the plasma chemical vapor deposition apparatus 1 and is electrically grounded.
- a ladder-type electrode 70 is placed at a position, for example, 2 O mm away from 6.
- An external high-frequency power supply 61 is connected to the ladder electrode 70 via an impedance matching unit 62 and a coaxial cable 63, and unnecessary plasma is generated on the side opposite to the surface facing the substrate heating support means 6.
- the earth shield 5 is installed so as not to be damaged.
- a substrate 7 for forming an a-Si film is placed on the substrate heating and supporting means 6 set at, for example, 200 ° C., and a silane (SiH 4 ) gas is supplied from the gas supply pipe at a flow rate of, for example, 50 ° C. Introduce with sccm.
- the pressure in the plasma chemical vapor deposition apparatus 1 is adjusted to, for example, 10 OmTorr by the evacuation speed of a vacuum pump system connected to an evacuation pipe (not shown).
- the configuration example in Fig. 7 differs from the configuration example in Fig. 6 in that, first, a ladder-type electrode is used in which a circular cross-section electrode is assembled in a ladder shape without using a flat electrode.
- the raw material silane (SiH 4 ) gas flows freely between the electrode rods, and the raw material is supplied uniformly.
- the power is not supplied to one place of the electrode, but the plural ( Here, four points are used, so that plasma can be generated uniformly.
- the high-frequency plasma generator in the plasma chemical vapor deposition apparatus is configured as described above.
- thin-film semiconductors for solar cells and thin-film transistors for flat panel displays manufactured using the above-mentioned technologies have large areas (for example, 1.5X). (1.2 m) ⁇ Cost reduction by high-speed film formation and high quality such as low defect density and high crystallization rate are required. In addition, such large-area film formation causes deposition in the chamber. Also, self-cleaning of a-Si with NF 3 gas requires a large area and high-speed as well as film formation.
- film formation using high frequency has a drawback that uniform large-area film formation is difficult.
- the high-frequency wavelength is on the order of the size of the electrode, so that the standing wave on the electrode mainly due to the reflected wave generated at the electrode end, etc., and the voltage distribution due to the presence of floating inductance and capacitance
- the plasma becomes non-uniform due to the influence of the plasma and the mutual interference between the plasma and the high frequency, and as a result, the film formation becomes non-uniform.
- the film thickness distribution in the film formation becomes thin and non-uniform at the center.
- the NF 3 plasma used for self-cleaning is very unstable because the NF 3 gas is a negative gas (the property of easily adhering electrons), and the gas flow (plasma is generated downstream). And distribution due to differences in electrode spacing becomes uneven.
- Fig. 7 and Fig. 8 which are typical examples in the case of using a ladder-type electrode, show that, in addition to the use of a ladder-type electrode, standing waves that are remarkably generated by single-point feeding are also shown. It is characterized in that it is reduced by supplying power to four points. However, even in this case, if the electrode size exceeds 30 cm or the frequency exceeds 80 MHz, it becomes difficult to achieve uniform film formation.
- JP-A-2000-3878 JP-A-2000-58465, JP-A-2000-323329, and JP-A-2001-7028.
- JP-A-2000-58465 JP-A-2000-323329
- JP-A-2001-7028 JP-A-2001-7028.
- the conventional technology when plasma is generated using high frequency in a plasma chemical vapor deposition apparatus, the conventional technology generates a large area, uniform plasma for a very large substrate exceeding lmX lm, and generates a uniform plasma. No action could be taken.
- two different high-frequency waves are applied to two discharge electrodes.
- There are technologies to supply each for example, M. No isan, J. Pe 11 etier, ed., Microwave Ex cited P la sma s ⁇ fecnnology, 4, sec on d imp ressi on, p p. 401, Elsevier Science BV 1999.
- the purpose of this technology is to use one high frequency to generate plasma and the other high frequency to control the surface bias voltage of the insulating substrate, and to flow the active ions and the like into the substrate, and ⁇ Controlling the incident energy, which generates uniform plasma over a large area for a very large substrate exceeding lmX 1 m as in the present invention, which is completely different from the purpose of performing uniform processing. It is.
- the present invention has been made to solve the above problems, and is directed to a plasma chemical vapor deposition apparatus utilizing high frequency (VHF), wherein the plasma generation state is uniform over a large area. It is an object of the present invention to provide a method and an apparatus for uniformizing a large area of a high-frequency plasma in the above. Disclosure of the invention
- a first and a second power supply unit are provided at both ends of a discharge electrode, and a cycle in which high-frequency power of the same frequency is supplied to the first and the second power supply unit; Cycles in which high-frequency power of different frequencies are supplied alternately are performed, and the plasma generated at each cycle and generated at different locations of the standing wave makes the plasma generation status uniform over a large area when viewed on a time average. I did it.
- a large-area uniformizing method for high-frequency plasma in a plasma-enhanced chemical vapor deposition apparatus in which high-frequency power is supplied to a discharge electrode of the plasma-enhanced chemical vapor deposition apparatus to generate plasma.
- First and second power supply sections are provided at both ends of the discharge electrode, and a first cycle for supplying high frequency of the same frequency to the first and second power supply sections, and a second cycle for supplying high frequency of different frequencies to the first and second power supply sections.
- the two cycles were performed alternately, and the plasma generation status in each cycle (different standing wave positions) was made uniform over a large area when viewed on a time average.
- a device for effectively implementing the present invention a device provided on a discharge electrode
- a high-frequency power supply A for supplying a high frequency of a first frequency to the unit, frequency switching means for receiving and receiving a high frequency from the first and second oscillators and switching and outputting the same in an appropriate cycle
- a high-frequency power supply B for receiving the output of the discharge electrode and supplying power to the second power supply section of the discharge electrode
- the plasma generation status (the position where the standing wave is generated) is changed by the frequency difference of each switching cycle, and the time averaging is performed.
- the feature is that the plasma generation is made uniform over a large area.
- the cycle comes from both sides of the electrode.
- the waves resonate in the center and the plasma density increases, while when power of different frequencies is supplied, the waves coming from both sides of the electrode cancel each other out in the center and the plasma density decreases.
- the plasma generation status that is, the standing wave distribution on the discharge electrode becomes large and uniform when viewed on a time average, and the film thickness uniformity on a large area substrate and the self-clearing Uniform plasma distribution can be realized.
- the method invention and a preferred invention for carrying out the method invention, when one frequency in the second cycle is fluctuated with time, and when the plasma generation situation is intentionally changed and viewed on a time average, That the plasma generation is made uniform over a large area,
- the second oscillator is configured so that the oscillation frequency is variable.
- one of the frequencies is temporally varied in the second cycle in which high-frequency power of a different frequency is supplied, the plasma generation state changes in accordance with the variation, so that the plasma density is further averaged. Can be. Then, one frequency in the cycle of the different frequency, particularly one frequency of the high frequency used in the second cycle is the same as the frequency of the high frequency in the first cycle,
- the switching between the first and second cycles is alternately performed between 1 time / second and 1,000,000 times Z seconds.
- the time ratio between the first cycle and the second cycle should be changed depending on the pressure of the gas used and the type of gas.
- the present invention provides a method in which the high frequency of one of the frequencies supplied to the first or second power supply unit in the first cycle is phase-modulated, and the phase of the high frequency supplied to the other power supply unit is shifted. It is better to change the plasma generation status so that the plasma generation status is uniform over a large area when viewed on a time average.
- phase modulating means for modulating a phase of a high frequency supplied from the first oscillator to either the high frequency power supply A or the frequency switching means.
- the phase of one of the high-frequency waves is shifted from that of the other, so that a high-density part of the center of the discharge electrode formed when the same frequency is supplied to the discharge electrode Can be moved, and can be made uniform over time.
- a direct current bias is applied to a power supply portion of the discharge electrode to make the generated plasma density uniform over a large area.
- a means for applying a DC bias to the power supply portion of the discharge electrode By applying a DC bias to the power supply section of the discharge electrode, The sheath capacitance can be reduced, and the standing wave wavelength can be increased to average the plasma density.
- the present invention provides an arrangement in which the axial direction of the power supply cable to the first and second power supply units coincides with the axial direction of the discharge electrode, minimizes the current return distance, reduces power loss in the power supply unit, and expands the plasma area. It is good to aim.
- the axial direction of the power supply cable to the power supply section of the discharge electrode is aligned with the axial direction of the discharge electrode.
- the present invention by aligning the axial direction of the power supply cable to the power supply unit with the axial direction of the discharge electrode, the power supply power smoothly enters the discharge electrode, minimizes the current return distance, and reduces the power outlet at the power supply unit. It is possible to reduce the size and enlarge the plasma region. And further, the present invention
- a gas in which plasma tends to be uniform within a range that satisfies conditions such as a film forming speed by plasma enhanced chemical vapor deposition and a self-cleaning speed of plasma enhanced chemical vapor deposition device is introduced into the plasma enhanced chemical vapor deposition device. .
- This gas can be any one of N 2 , Ar, Kr, and Xe inert gases, or a plurality of them. It is preferable to combine the types.
- FIG. 1 is a schematic block diagram of one embodiment of a large-area uniformizing apparatus for high-frequency plasma in a plasma chemical vapor deposition apparatus according to the present invention.
- FIG. 2 is a diagram for explaining a case where the discharge electrode is configured in a ladder type.
- FIG. 3 is a diagram illustrating a connection configuration between a discharge electrode and a power supply cable according to the present invention.
- Fig. 4 illustrates the plasma generation when the power supply section of the discharge electrode is supplied with a high frequency of the same frequency and a high frequency of a different frequency at a ratio of 10 types from 0:10 to 9: 1.
- FIG. 4 illustrates the plasma generation when the power supply section of the discharge electrode is supplied with a high frequency of the same frequency and a high frequency of a different frequency at a ratio of 10 types from 0:10 to 9: 1.
- FIG. 5 is an explanatory diagram of a case where one high-frequency phase is shifted from the other phase when the same frequency is supplied to the power supply unit.
- FIG. 6 shows an example of a configuration of a conventional plasma chemical vapor deposition apparatus using a parallel plate type electrode.
- FIG. 7 is a configuration example of a conventional plasma chemical vapor deposition apparatus using a ladder-type electrode.
- FIG. 8 is a view for explaining the structure of a conventional ladder-type electrode. BEST MODE FOR CARRYING OUT THE INVENTION
- the basic configuration of the present invention is, for example, a plasma having an electrode size of 1.5 mx 1.2 m, a gas pressure of 12 to 20 Pa (90 to 15 OmT orr), and a high frequency power supply frequency of 6 OMHz class.
- the plasma chemical vapor deposition apparatus is provided with first and second power supply sections at both ends of the discharge electrode, and the same power supply section
- the cycle of supplying high frequency and the cycle of supplying high frequency of different frequency are alternately performed, and the plasma generation status, that is, discharge
- the standing wave distribution on the electrodes was made uniform over a large area.
- the present invention in order to make the plasma generation state uniform on a time average, the following six things can be carried out, and thereby, for a very large substrate exceeding lm X lm,
- the ratio of the time to supply the same frequency to the first and second power supply units and the time to supply different frequencies that is, change the duty ratio
- the phase of the high frequency power supplied to one of the power supply units may be shifted from the phase of the high frequency power supplied to the other power supply unit.
- FIG. 1 is a schematic block diagram of an embodiment of a large-area uniformizing device for high-frequency plasma in a plasma-enhanced chemical vapor deposition apparatus according to the present invention
- FIG. 2 is a diagram for explaining a case where a discharge electrode is configured in a ladder type.
- Fig. 3 is a configuration diagram when the axial direction at the outlet of the power supply cable is the same as the direction (axial direction) connecting the first and second power supply units.
- Fig. 4 is the power supply unit of the discharge electrode. Illustration of the plasma generation situation when high frequency of the same frequency and high frequency of different frequency are supplied at a ratio of 10 types from 0:10 to 9: 1.
- Fig. 5 shows the same frequency supplied to the power supply unit.
- FIG. 4 is an explanatory diagram in a case where one high-frequency phase is shifted from the other phase.
- Fig. 1 is a plasma-enhanced chemical vapor deposition apparatus with an airtight interior
- 2 is a discharge electrode
- 3 and 4 are the first and second power supply parts for supplying high frequency power to the discharge electrode 2
- 5 is unnecessary.
- the earth shield 6 is provided so as to prevent the generation of an intense plasma, and is installed at a distance of, for example, about 20 to 34 mm from the discharge electrode 2, and a mechanism (not shown) for holding and heating the substrate 7 and a mechanism for heating are provided.
- heating support means with a built-in heater, 8 communicates with the gas supply source (not shown), such as silane for deposition (S i H 4) the reaction gas such as NF 3 gas for gas and self-cleaning 9 gas introduction pipe for introducing, 1 0 the exhaust pipe, 1 1 evacuatable vacuum pump the internal pressure of the plasma chemical vapor deposition apparatus 1 to 1 X 1 0- 6 T orr extent, 1 2, 1 3 Is the RF amplifier that constitutes the first and second high frequency power supplies A and B, and 14 is the high frequency of 60 MHz, for example.
- the gas supply source not shown
- the reaction gas such as NF 3 gas for gas and self-cleaning 9 gas introduction pipe for introducing, 1 0 the exhaust pipe, 1 1 evacuatable vacuum pump the internal pressure of the plasma chemical vapor deposition apparatus 1 to 1 X 1 0- 6 T orr extent, 1 2, 1 3
- Is the RF amplifier that constitutes the first and second high frequency power supplies A and B, and 14 is the high frequency of 60
- a first high-frequency (RF) oscillator having a phase shifter that oscillates (RF) and sends it to a high-frequency power supply (RF amplifier) A and a switching switch 16, and has a phase shifter capable of phase-modulating either high-frequency power; 15 oscillates a radio frequency (RF) of 58.5 MHz, for example.
- a second radio frequency (RF) oscillator whose frequency can be varied, for example, from 58.5 MHz to 59.9 MHz, or from 60.1 MHz to 61.5 MHz. 16 is the first and second radio frequency oscillators.
- the switching switch 17 receives the high frequency from the first and second high-frequency oscillators 14 and 15 and switches the high-frequency power from the first and second high-frequency oscillators 14 and 15 by the switching switch 16.
- a function generator that changes the high-frequency time ratio, that is, the duty ratio, is a current return path.
- reference numeral 20 denotes one electrode when the discharge electrode 2 in FIG. 1 is formed of a ladder-type electrode, and reference numerals 21 and 22 denote a power supply for supplying high frequency to the discharge electrode 2 (20).
- Cable 23 is a DC power supply.
- the first high-frequency oscillator 14 oscillates a high frequency of, for example, 60 MHz as described above, and sends it to the high-frequency power supply A 12 and the switching switch 16, and the second high-frequency oscillator 15 outputs, for example, 58.5 MHz. Oscillates and sends it to the switch 16.
- the switching switch 16 switches between 6 OMHz sent from the first high-frequency oscillator 14 and 58.5 MHz sent from the second high-frequency oscillator 15 in a fixed cycle, and sends it to the high-frequency power source B 13 .
- the high-frequency power supply A 12 supplies a high frequency of 60 MHz to the first power supply unit 3, and the high-frequency power supply B 13 supplies the high frequency power of 6 OMHz and 58.5 MHz, which are switched in a constant cycle, to the second power supply unit 3.
- Power 4
- the switching between the 6 OMHz transmitted from the first high-frequency oscillator 14 and the second high-frequency oscillator 15 transmitted by the switching switch 16 switches the high-frequency of 58.5 MHz transmitted from the first high-frequency oscillator 14 to the gas pressure and gas type.
- the signal from the function generator 17 according to the gas condition allows the time ratio, that is, the duty ratio, to be changed.
- the first high-frequency oscillator 14 has a phase shifter inside, so that the high frequency sent to either the high-frequency power supply A12 or the switching switch 16 can be out of phase with the high frequency sent to the other,
- the second high-frequency oscillator 15 is configured so that its oscillation frequency can be varied, for example, from 58.5 MHz to 59.9 MHz, or from 60.1 MHz to 61.5 MHz.
- the discharge electrode 2 of the plasma chemical vapor deposition apparatus 1 is, for example, as shown in FIG.
- the first power supply unit 3 and the second power supply unit 4 are configured with, for example, 8 points each indicated by a black circle at both ends of the discharge electrode 2 as shown in the figure.
- a power supply cable for supplying high frequency power to the power supply section 3 or 4 of the discharge electrode 2 has an outlet as shown at 21 and 22 in FIG. 3 where one of the discharge ladder-type electrodes is shown as 20.
- the direction of the axis of the ladder electrode 20 is connected to the direction (axial direction) connecting the first and second power supply sections 3 and 4 of the ladder-type electrode 20.
- the discharge electrode 2 (20) has a DC bias. DC bias is applied from power supply 23.
- the discharge electrode 2 is of a ladder type, and the power supply units 3 and 4 have been described as having eight points.
- the number of points is not limited to 8 points, but the number of points can be set as required, such as 4 points or 16 points.
- the power supply cables 21 and 22 for supplying high frequency power to the power supply unit 3 or 4 of the discharge electrode 2 are connected in such a manner that the exit axial direction of the power supply cables 21 and 22 matches the axial direction of the discharge ladder electrode 20.
- the feeding power smoothly enters the ladder-type electrode 20, the current return distance is minimized, the power port at the feeding section is reduced, and the plasma region can be expanded.
- the power supply cables 21 and 22 may have any shape such as a coaxial cable, a parallel plate, and a parallel wire.
- the sheath capacitance of the discharge electrode 2 can be reduced, the voltage distribution tends to be uniform, the standing wave wavelength increases, and plasma Density can be averaged.
- the sheath capacitance means that a collection of electrons called a sheath is formed around the ladder-type electrode 20 in the process of generating the plasma, and this collection of electrons creates a state where a kind of insulation is maintained, resulting in DC current. No current flows, as if the capacitor were around the electrode.
- a negative DC bias was applied, the electrons diffused and the sheath capacitance could be reduced. As a result, the wavelength interval of the standing wave increases, and the plasma can be made uniform.
- a semiconductor film such as a-Si, microcrystalline silicon, polycrystalline thin film silicon, silicon nitride, or the like is deposited, and a film is deposited in a chamber by these manufacturing methods.
- the heating support set at 200 ° C Attach the substrate 7 to the step 6, introduce a reaction gas 9 such as silane (SiH 4 ) gas from the gas introduction pipe 8 at a flow rate of 50 sccm, for example, and adjust the exhaust speed of the vacuum pump 11 connected to the exhaust pipe 10.
- the pressure in the plasma chemical vapor deposition apparatus 1 is adjusted to, for example, 10 OmTorr.
- the first high-frequency oscillator 14 sends a high frequency of, for example, 60 MHz
- the second high-frequency oscillator 15 sends, for example, a 58.5 MHz high frequency, to the high-frequency power supply A12 and the switching switch 16, respectively.
- the switching switch 16 switches the high frequency power of 6 OMHz transmitted from the first high frequency oscillator 14 and the high frequency of 58.5 MHz transmitted from the second high frequency oscillator 15 in a constant cycle, and the high frequency power supply B 13 send.
- the high-frequency power supply A 12 supplies a high-frequency power of 6 OMHz to the first power supply unit 3
- the high-frequency power supply B 13 supplies a high-frequency power of 6 OMHz and 58.5 MHz to the second power supply unit 4. Power.
- the plasma generated at this time is generated when the same high frequency of 60 MHz is supplied to the first and second power supply units 3 and 4, and the high frequency of 6 OMHz is supplied to the first power supply unit 3 and the second power supply unit 4 As shown in Fig. 4, the situation is different between when a high frequency power of 58.5 MHz is supplied. That is, the graph shown in FIG. 4 shows that, as described above, the reaction gas 9 such as silane (SiH 4 ) gas is introduced into the plasma chemical vapor deposition apparatus 1 and the first and second power supply sections 3 of the discharge electrode 2 are formed.
- the reaction gas 9 such as silane (SiH 4 ) gas is introduced into the plasma chemical vapor deposition apparatus 1 and the first and second power supply sections 3 of the discharge electrode 2 are formed.
- the horizontal axis represents the distance from the first power supply unit 3 (O cm), and the right end (110 cm) corresponds to the second power supply unit 4.
- the vertical axis is the relative voltage of the plasma, The higher this value, the higher the plasma density.
- the line a in the figure indicates the time when the supplied frequency is different from 10 and the time when the same frequency is supplied is 0, that is, the plasma generation status only when the supplied frequency is different.
- the line also shows the case where the same frequency is 1 for the different frequency 9, and similarly the line n shows the case where the same frequency is 9 for the different frequency 1.
- the plasma density was highest at both ends of the discharge electrode 2, that is, near the power supply units 3 and 4, and the center was The plasma density is lowest in the part.
- n is the highest when the same frequency is supplied to the first and second power supply units 3 and 4
- the plasma density is highest at the center of the discharge electrode 2 and the power supply units 3 and 4 at both ends from the center. It decreases as the distance from the power supply increases, and rises slightly near the power supply sections 3 and 4.
- the time for feeding different frequencies to the first and second feeding units 3 and 4 and the time for feeding the same frequency are the same (5: 5), the plasma generation conditions of a and n are added.
- the plasma density is slightly higher at both ends of the discharge electrode 2, but a uniform plasma is generated over a wide area at the center.
- the graph in Fig. 4 shows that when high-frequency power of the same frequency is supplied to the power supply sections 3 and 4 at both ends of the discharge electrode 2 at a high frequency of 60 MHz, the plasma density increases at the center and different frequencies This indicates that when the high frequency is supplied, the density of the central part decreases, and by alternately performing this in an appropriate cycle, the plasma generation state can be made uniform over a large area.
- the switching of the cycle in which the power supply units 3 and 4 are alternately supplied with a high frequency having the same frequency and a different frequency can be switched from once a second to ten times.
- the oscillation frequency of the second high-frequency oscillator 15 is further increased, for example, from 58.5 MHz to 59.9 MHz, or from 60.1 MHz to 61.5 MHz. I will change it over time. Then, the frequency change can intentionally change the plasma generation status, and the plasma density can be further averaged over time.
- the phase shifter included in the first high-frequency oscillator 14 sends the high-frequency power to either the high-frequency power supply A 12 or the switching switch 16 to the other.
- the phase is shifted with respect to the high frequency. Then, for example, as shown by the solid line 50 in FIG. 5, in the power supply state where the plasma density becomes high at the center of the discharge electrode 2 when the phase is not shifted, the phase is shifted to thereby reduce the plasma density. High position
- the plasma density can be made uniform over a wider range.
- a signal is sent from the function generator 17 to the switching switch 16, and the first high-frequency oscillator 14 sent to the switching switch 16 is sent.
- the transmission time ratio of the high-frequency wave from the second high-frequency oscillator 15 and the high-frequency wave from the second high-frequency oscillator 15 to the high-frequency power supply B 13, that is, the duty ratio (Duty ratio) is changed as shown in FIG.
- the ratio (duty ratio) of the time during which high-frequency power of the same frequency is supplied to the first and second power supply units 3 and 4 of the discharge electrode 2 and the time during which high-frequency power of different frequencies is supplied is obtained.
- FIG. 4 it is possible to change the state of occurrence of plasma in various ways.
- uniform plasma is generated within a range that satisfies the conditions such as the film formation speed and the self-cleaning speed.
- N 2 , Ar, Kr, X By injecting any one of e or a combination of a plurality of them at an appropriate ratio (about 0.1 to 25%), more uniform film formation and self-cleaning can be realized.
- the embodiments described above may be used alone, By using a plurality of in combination, the effect can be further increased. That is, for example, the 6 OMHz sent from the first high-frequency oscillator 14 by the switching switch 16 and the second high-frequency oscillator 15 from the second high-frequency oscillator 15 according to gas conditions such as gas pressure and gas type.
- the high frequency switching duty ratio of the received 58.5 MHz is changed, and the high frequency power transmitted to either the high frequency power supply A 12 or the switching switch 16 by the phase shifter in the first high frequency oscillator 14 And the power supply cable for supplying high frequency power to the power supply section 3 or 4 of the discharge electrode 2 as shown in 21 and 22 in Fig. 3.
- the direction is the same as the direction (axial direction) connecting the first and second power supply parts 3 and 4 of the ladder-type electrode 20.
- the discharge electrode 2 (20) is connected to the DC bias power supply 23. This is a combination of applying a DC bias.
- the plasma density in the center can be made uniform by the control, and as shown in Fig. 5, the plasma density can be high.
- the plasma density can be high.
- Minimizing the current return distance reduces power loss in the feed section and expands the plasma area, and reduces the sheath capacitance of the discharge electrode 2 by applying a DC bias, resulting in a uniform voltage distribution and an increase in the standing wave wavelength.
- a composite effect such as averaging the plasma density can be obtained.
- the cycle of supplying high frequency power of the same frequency to the power supply sections provided at both ends of the discharge electrode in the plasma chemical vapor deposition apparatus and the cycle of supplying high frequency power of different frequencies are alternately performed.
- the ratio between the time for supplying the same frequency to the first and second power supply units and the time for supplying different frequencies is changed according to gas conditions such as gas pressure and gas type.
- the axial direction at the outlet of the power supply cable is the same as the direction (axial direction) connecting the first and second power supply units.
- the plasma chemical vapor deposition apparatus of the present invention even when the gas conditions such as the pressure condition and the flow rate condition change, the change of the high frequency power supply frequency, the change of the duty ratio, and the phase Uniform plasma can always be obtained with only soft adjustments such as modulation and application of DC bias, making it possible to perform high-speed, uniform film formation and uniform self-cleaning. As a result, it is possible to obtain significant results such as an improvement in the yield of film-forming products in large-area film forming and a reduction in cost.Furthermore, since there are few hardware adjustments, initial adjustments are easy and running costs can be reduced. It has a great effect.
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- General Chemical & Material Sciences (AREA)
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Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ES02777987T ES2367752T3 (es) | 2002-10-29 | 2002-10-29 | Procedimiento y dispositivo para generar plasma uniforme de alta frecuencia sobre un area de gran superficie. |
US10/494,528 US7205034B2 (en) | 2002-10-29 | 2002-10-29 | Method and device for generating uniform high-frequency plasma over large surface area used for plasma chemical vapor deposition apparatus |
EP02777987A EP1564794B1 (en) | 2002-10-29 | 2002-10-29 | Method and device for generating uniform high- frequency plasma over large surface area |
AU2002344594A AU2002344594B2 (en) | 2002-10-29 | 2002-10-29 | Method and device for generating uniform high-frequency plasma over large surface area used for plasma chemical vapor deposition apparatus |
PCT/JP2002/011208 WO2004040629A1 (ja) | 2002-10-29 | 2002-10-29 | プラズマ化学蒸着装置における高周波プラズマの大面積均一化方法及び装置 |
Applications Claiming Priority (1)
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PCT/JP2002/011208 WO2004040629A1 (ja) | 2002-10-29 | 2002-10-29 | プラズマ化学蒸着装置における高周波プラズマの大面積均一化方法及び装置 |
Publications (1)
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WO2004040629A1 true WO2004040629A1 (ja) | 2004-05-13 |
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Family Applications (1)
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PCT/JP2002/011208 WO2004040629A1 (ja) | 2002-10-29 | 2002-10-29 | プラズマ化学蒸着装置における高周波プラズマの大面積均一化方法及び装置 |
Country Status (5)
Country | Link |
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US (1) | US7205034B2 (ja) |
EP (1) | EP1564794B1 (ja) |
AU (1) | AU2002344594B2 (ja) |
ES (1) | ES2367752T3 (ja) |
WO (1) | WO2004040629A1 (ja) |
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- 2002-10-29 WO PCT/JP2002/011208 patent/WO2004040629A1/ja not_active Application Discontinuation
- 2002-10-29 ES ES02777987T patent/ES2367752T3/es not_active Expired - Lifetime
- 2002-10-29 EP EP02777987A patent/EP1564794B1/en not_active Expired - Lifetime
- 2002-10-29 AU AU2002344594A patent/AU2002344594B2/en not_active Ceased
- 2002-10-29 US US10/494,528 patent/US7205034B2/en not_active Expired - Fee Related
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EP1564794B1 (en) | 2011-07-06 |
AU2002344594B2 (en) | 2005-06-09 |
ES2367752T3 (es) | 2011-11-08 |
US20050255255A1 (en) | 2005-11-17 |
EP1564794A1 (en) | 2005-08-17 |
US7205034B2 (en) | 2007-04-17 |
EP1564794A4 (en) | 2007-08-08 |
AU2002344594A1 (en) | 2004-05-25 |
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