WO2004037880A1 - 固形シランカップリング剤組成物、その製造方法およびそれを含有する樹脂組成物 - Google Patents
固形シランカップリング剤組成物、その製造方法およびそれを含有する樹脂組成物 Download PDFInfo
- Publication number
- WO2004037880A1 WO2004037880A1 PCT/JP2003/009967 JP0309967W WO2004037880A1 WO 2004037880 A1 WO2004037880 A1 WO 2004037880A1 JP 0309967 W JP0309967 W JP 0309967W WO 2004037880 A1 WO2004037880 A1 WO 2004037880A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- coupling agent
- silane coupling
- group
- resin
- weight
- Prior art date
Links
- 239000006087 Silane Coupling Agent Substances 0.000 title claims abstract description 111
- 239000007787 solid Substances 0.000 title claims abstract description 67
- 239000000203 mixture Substances 0.000 title claims abstract description 36
- 239000011342 resin composition Substances 0.000 title claims abstract description 23
- 238000000034 method Methods 0.000 title description 7
- -1 methacryloyl Chemical group 0.000 claims abstract description 16
- 125000000524 functional group Chemical group 0.000 claims abstract description 10
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 claims abstract description 6
- 125000002883 imidazolyl group Chemical group 0.000 claims abstract description 6
- 125000005504 styryl group Chemical group 0.000 claims abstract description 6
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229920005989 resin Polymers 0.000 claims description 26
- 239000011347 resin Substances 0.000 claims description 26
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 21
- 239000005011 phenolic resin Substances 0.000 claims description 20
- 239000000843 powder Substances 0.000 claims description 20
- 238000000576 coating method Methods 0.000 claims description 16
- 239000011248 coating agent Substances 0.000 claims description 14
- 239000003566 sealing material Substances 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 238000001035 drying Methods 0.000 claims description 8
- 229920001568 phenolic resin Polymers 0.000 claims description 7
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 6
- 239000007795 chemical reaction product Substances 0.000 claims description 6
- 125000003396 thiol group Chemical group [H]S* 0.000 claims description 6
- 125000003277 amino group Chemical group 0.000 claims description 5
- 125000002147 dimethylamino group Chemical group [H]C([H])([H])N(*)C([H])([H])[H] 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 4
- 239000011259 mixed solution Substances 0.000 claims description 4
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 2
- 239000011256 inorganic filler Substances 0.000 claims description 2
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 2
- 150000002989 phenols Chemical class 0.000 claims 3
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 claims 1
- 239000000047 product Substances 0.000 claims 1
- 238000006243 chemical reaction Methods 0.000 abstract description 11
- 229910052751 metal Inorganic materials 0.000 abstract description 8
- 239000002184 metal Substances 0.000 abstract description 8
- 238000003860 storage Methods 0.000 abstract description 6
- 150000002739 metals Chemical class 0.000 abstract description 4
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 abstract description 4
- 239000004615 ingredient Substances 0.000 abstract description 2
- 229920002554 vinyl polymer Polymers 0.000 abstract description 2
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 abstract 1
- 239000007822 coupling agent Substances 0.000 description 16
- 239000003822 epoxy resin Substances 0.000 description 15
- 229920000647 polyepoxide Polymers 0.000 description 15
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 13
- 238000002156 mixing Methods 0.000 description 12
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 11
- 239000003795 chemical substances by application Substances 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 11
- 239000003973 paint Substances 0.000 description 8
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- ZDDUSDYMEXVQNJ-UHFFFAOYSA-N 1H-imidazole silane Chemical compound [SiH4].N1C=NC=C1 ZDDUSDYMEXVQNJ-UHFFFAOYSA-N 0.000 description 6
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 6
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 6
- 239000011541 reaction mixture Substances 0.000 description 6
- 229910000077 silane Inorganic materials 0.000 description 6
- 239000007788 liquid Substances 0.000 description 5
- 229920003986 novolac Polymers 0.000 description 5
- 238000003756 stirring Methods 0.000 description 5
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 4
- 238000001879 gelation Methods 0.000 description 4
- 125000005641 methacryl group Chemical group 0.000 description 4
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 150000007945 N-acyl ureas Chemical class 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 238000001938 differential scanning calorimetry curve Methods 0.000 description 3
- 239000012776 electronic material Substances 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 229910010272 inorganic material Inorganic materials 0.000 description 3
- 239000011147 inorganic material Substances 0.000 description 3
- 238000004898 kneading Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 3
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 3
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- ATHHXGZTWNVVOU-UHFFFAOYSA-N N-methylformamide Chemical compound CNC=O ATHHXGZTWNVVOU-UHFFFAOYSA-N 0.000 description 2
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 235000013869 carnauba wax Nutrition 0.000 description 2
- 239000004203 carnauba wax Substances 0.000 description 2
- 238000006482 condensation reaction Methods 0.000 description 2
- 230000001808 coupling effect Effects 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 239000008393 encapsulating agent Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 239000002932 luster Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000004570 mortar (masonry) Substances 0.000 description 2
- 125000000962 organic group Chemical group 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 239000013615 primer Substances 0.000 description 2
- 239000002987 primer (paints) Substances 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- LTQBNYCMVZQRSD-UHFFFAOYSA-N (4-ethenylphenyl)-trimethoxysilane Chemical compound CO[Si](OC)(OC)C1=CC=C(C=C)C=C1 LTQBNYCMVZQRSD-UHFFFAOYSA-N 0.000 description 1
- OUPZKGBUJRBPGC-UHFFFAOYSA-N 1,3,5-tris(oxiran-2-ylmethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound O=C1N(CC2OC2)C(=O)N(CC2OC2)C(=O)N1CC1CO1 OUPZKGBUJRBPGC-UHFFFAOYSA-N 0.000 description 1
- AICIYIDUYNFPRY-UHFFFAOYSA-N 1,3-dihydro-2H-imidazol-2-one Chemical compound O=C1NC=CN1 AICIYIDUYNFPRY-UHFFFAOYSA-N 0.000 description 1
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- IKYAJDOSWUATPI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propane-1-thiol Chemical compound CO[Si](C)(OC)CCCS IKYAJDOSWUATPI-UHFFFAOYSA-N 0.000 description 1
- LZMNXXQIQIHFGC-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CO[Si](C)(OC)CCCOC(=O)C(C)=C LZMNXXQIQIHFGC-UHFFFAOYSA-N 0.000 description 1
- XXCIGBFAFCNEOZ-UHFFFAOYSA-N 3-[ethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CCO[SiH](C)CCCOC(=O)C(C)=C XXCIGBFAFCNEOZ-UHFFFAOYSA-N 0.000 description 1
- URDOJQUSEUXVRP-UHFFFAOYSA-N 3-triethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C(C)=C URDOJQUSEUXVRP-UHFFFAOYSA-N 0.000 description 1
- LVNLBBGBASVLLI-UHFFFAOYSA-N 3-triethoxysilylpropylurea Chemical compound CCO[Si](OCC)(OCC)CCCNC(N)=O LVNLBBGBASVLLI-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- DOKUDBNHOKPYOJ-UHFFFAOYSA-N C1(=C(C(=CC=C1)C)C)OCCC[Si](OCC)(OCC)OCC Chemical compound C1(=C(C(=CC=C1)C)C)OCCC[Si](OCC)(OCC)OCC DOKUDBNHOKPYOJ-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 125000005370 alkoxysilyl group Chemical group 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 239000002981 blocking agent Substances 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- XGZGKDQVCBHSGI-UHFFFAOYSA-N butyl(triethoxy)silane Chemical compound CCCC[Si](OCC)(OCC)OCC XGZGKDQVCBHSGI-UHFFFAOYSA-N 0.000 description 1
- SXPLZNMUBFBFIA-UHFFFAOYSA-N butyl(trimethoxy)silane Chemical compound CCCC[Si](OC)(OC)OC SXPLZNMUBFBFIA-UHFFFAOYSA-N 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 125000001309 chloro group Chemical group Cl* 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000000113 differential scanning calorimetry Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000003631 expected effect Effects 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- INJVFBCDVXYHGQ-UHFFFAOYSA-N n'-(3-triethoxysilylpropyl)ethane-1,2-diamine Chemical compound CCO[Si](OCC)(OCC)CCCNCCN INJVFBCDVXYHGQ-UHFFFAOYSA-N 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- PXQLVRUNWNTZOS-UHFFFAOYSA-N sulfanyl Chemical class [SH] PXQLVRUNWNTZOS-UHFFFAOYSA-N 0.000 description 1
- MBSOYVMTSJAYPW-UHFFFAOYSA-N sulfanylsilane 3-trimethoxysilylpropane-1-thiol Chemical compound S[SiH3].CO[Si](OC)(OC)CCCS MBSOYVMTSJAYPW-UHFFFAOYSA-N 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- AYEKOFBPNLCAJY-UHFFFAOYSA-O thiamine pyrophosphate Chemical compound CC1=C(CCOP(O)(=O)OP(O)(O)=O)SC=[N+]1CC1=CN=C(C)N=C1N AYEKOFBPNLCAJY-UHFFFAOYSA-O 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- FRGPKMWIYVTFIQ-UHFFFAOYSA-N triethoxy(3-isocyanatopropyl)silane Chemical compound CCO[Si](OCC)(OCC)CCCN=C=O FRGPKMWIYVTFIQ-UHFFFAOYSA-N 0.000 description 1
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
- C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
- C08L61/14—Modified phenol-aldehyde condensates
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/14—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/63—Additives non-macromolecular organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3142—Sealing arrangements between parts, e.g. adhesion promotors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/13—Phenols; Phenolates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
Definitions
- the present invention relates to a solid silane coupling agent that improves the adhesion of a resin to a metal, an inorganic material, or an organic material, and improves the fluidity and storage stability of a resin composition, and a resin composition containing the same. It can be used in the fields of electronic materials, paints, primers, adhesives, etc.
- encapsulants used in electronic materials ⁇ powder Additives for powdered compositions such as paints, or liquid resin compositions that have a potential for curability but require storage stability when not heated Suitable for the field. Background art
- an epoxy resin composition in which a novolak epoxy resin is cured with a phenol novolak resin has conventionally been used as a semiconductor sealing resin.
- a method of surface treatment of a silane coupling agent or addition to the resin is generally employed.
- Epoxy-based, amino-based, and mercapto-based silane coupling agents have been effective for many years, and have been used for many years. In some cases, they are not satisfied with the situation.
- a liquid silane coupling agent causes problems in uniform mixing and handling. From such a point, a solid silane coupling agent has been desired, but is not currently on the market, and a liquid silane coupling agent has to be used.
- Patent Documents 1 to 6 It has already been proposed to mix and react a silane coupling agent and a phenol resin and use the resulting reaction product as a component of an epoxy resin composition for sealing materials.
- Such a reaction product can be pulverized in a solid state when the ratio of the silane coupling agent / phenol resin is low because the silane coupling agent is in a liquid state, but the ratio of the silane coupling agent is low. As the temperature increases, it gradually softens (decreases the softening point) and cannot be crushed.
- Patent Literatures 2 to 5 disclose methods for removing alcohol after mixing the silane coupling agent. The removal of alcohol increases the softening point, but a siloxane bond is formed by a condensation reaction between the silane coupling agents. It is difficult to achieve the expected effect of improving the adhesive strength due to gelation.
- a basic silane coupling agent containing at least one functional group of an amino group, a dimethylamino group, and an imidazole group is one in which an amino group, a dimethylamino group, or an imidazole group is used to hydrolyze an alkoxysilyl group in the silane coupling agent. The water in phenol is used as a catalyst for decomposition.
- Patent Literatures 2 to 5 disclose methods of reacting (mixing) a phenol resin with a silane coupling agent.
- the silane coupling agent and the phenol resin are mixed at a high temperature to produce alcohol.
- the number 0/0 of the silane coupling agent (the remainder phenolic resins) can solidify without the problem, the action of the phenolic resin curing agent of the silane cutlet coupling agent is too strong, resulting
- the resulting reactant is not a solid silane coupling agent, but a phenolic resin modified with a silane agent.
- Alcohol silane groups Si OR groups
- the phenol resin acts as a curing agent for the epoxy resin, if it is added to the epoxy resin yarn composition, the epoxy resin curing agent ratio will shift.
- the phenolic resin is a curing agent, the amount of the phenolic resin may be controlled, but in the case of other curing agents, there may be a problem in characteristics. Therefore, the content of the silane coupling agent in the solid coupling agent should be as high as possible.
- Patent Document 4 describes that the ratio of the silane coupling agent to phenol is 0.1 to 50% by weight, preferably 1 to 30% by weight. However, it is less than 10% by weight in actual examples because of the necessity of solidification. In addition, in Examples of Patent Documents 2, 3, and 5, the content of the silane coupling agent is 10% by weight or less.
- Patent Document 1 Japanese Patent Publication No. 7-17739
- Patent Document 2 Patent No. 2506220
- Patent Document 3 Japanese Patent Publication No. 7-94534
- Patent Document 4 JP-A-9-167427
- Patent Document 5 JP 2002-128867 A
- Patent Document 6 JP-A-59-181036 DISCLOSURE OF THE INVENTION
- the present invention proposes a solid silane coupling agent that is not genorized. Particularly, by adding the resin composition to a resin composition, the resin composition adheres to a substrate such as a metal. It is an object of the present invention to provide a solid silane coupling agent and a method for producing the same, which improve the properties and storage stability of the resin composition and the flowability at the time of melting, and a resin composition containing the coupling agent. It is intended to provide a powder coating material and a sealing material.
- the present inventors have conducted intensive studies and have found a solid silane coupling agent obtained by reacting the following (A) to (C).
- a non-gelatinized, pulverizable solid silane coupling agent composition comprising a reaction product of the following components.
- a method for producing a non-gelling and pulverizable solid silane coupling agent composition obtained by reacting at 60 ° C to 150 ° C and then drying at 90 ° C to 150 ° C. (4) Add the silane coupling agent of (A) above and a mixed solution of the silane coupling agent of (B) above and alcohol and react at 60 ° C to 150 ° C.
- Non-gelled, pulverizable solid silane coupling agent composition obtained by drying at ⁇ 150 ° C.
- a resin composition comprising the non-gelling and pulverizable solid silane coupling agent composition according to (1).
- a powder coating comprising the non-gelling, pulverizable solid silane coupling agent composition according to any one of (1), (4), (5) and (6).
- a sealing material comprising the non-gelling and pulverizable solid silane coupling agent composition according to any one of (1), (4), (5) and (6). Brief description of the drawings.
- FIG. 1 is a graph showing a DSC curve obtained in Example 8.
- FIG. 2 is a graph showing a DSC curve obtained in Example 8.
- FIG. 3 is a graph showing a DSC curve obtained in Example 8. BEST MODE FOR CARRYING OUT THE INVENTION
- the solid silane coupling agent of the present invention is a reaction product of the components (A), (B) and (C).
- this solid silane coupling agent In order to obtain this solid silane coupling agent, it is important to coexist an alcohol during the reaction.
- the reaction activity of the component (B) is so strong that hydrolysis and condensation are promoted and gelation occurs.
- the difference between the production method of the present invention and the conventional method is that alcohol is added when the above components (A), (B) and (C) are reacted, whereby (A) + ( It was confirmed that even if the total of the silane coupling agents of B) was added at 10% by weight or more, gelling did not occur. It has been confirmed that the silane coupling agent of the present invention is easy to be added to a powder coating material or a powdery sealing material because the silane coupling agent is solid and the powder frame is easy, and that the adhesion to metals and the like is also improved. Was. In addition, because it is solid, it has excellent storage stability (or its latent property, which does not react at room temperature, reacts when heated to cure, and therefore reacts when heated). The present invention is also applicable to the field of liquid resin compositions.
- ⁇ commercially available ones can be easily obtained.
- the basic silane coupling agent containing at least one functional group among the amino group, dimethylamino group and imidazole group of the component (B) used in the present invention is N-2 (aminoethyl) 3-A Minopropylmethyldimethoxysilane, N—2 (aminoethyl) 3-aminopropyltrimethoxysilane, N—2 (aminoethyl) 3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, 3- Aminopropyltriethoxysilane, N-pheninole 3-aminopropyltrimethoxysilane, N- (Burbenzyl) 1-2-aminoethyl-3-aminopropinoletrimethoxysilane or Japanese Unexamined Patent Publication No. 05-186479, 05-039295, JP-A-09-295988, JP-A-09-29613
- the phenolic conjugate used in the present invention has one or more phenolic hydroxyl groups in one molecule, and may have any softening point or melting point of 60 ° C or more.
- phenol resins such as bisphenol A, bisphenol F, polybutylphenol, phenol novolak resin, cresol novolak resin, bisphenol A nopolak resin, bisphenol F novolak resin, and aralkyl phenol resin. .
- the mixing ratio when reacting the above (A;), (B) and (C) is 1% by weight to 40% by weight: 1% by weight to 40% by weight: 50% by weight. /. ⁇ 90 weight. / 0 , more preferably 5 weights. /. 20% by weight: 5% by weight to 20% by weight: 60% by weight to 85% by weight. If the content of the silane coupling agent is large, it is difficult to solidify or pulverize, and it is easy to perform gelling. Therefore, (A) + (B) is preferably 40% by weight / 0 or less.
- the reaction is carried out while stirring (A), (B) and (C) in the presence of alcohol.
- Heating is performed at 60 ° C to 150 ° C.
- the silane coupling agent of (A) or the silane coupling agent of (B) is added as a mixed solution with alcohol, and then 60.
- the mixture is allowed to react while being stirred at C to 150 ° C for 10 minutes to 2 hours, and then dried at 90 ° C to 150 ° C for 5 minutes to 2 hours.
- methanol, ethanol, n- propanol, isopropanol, n-butanol, t-butanol, and the like can be used as phenol.
- organic group of the alcohol is too large, much will remain in the solid silane coupling agent even after drying, and the softening point will decrease. On the other hand, if the organic group of the alcohol is small, it will evaporate immediately upon drying, raising the softening point, but it is liable to genole. For this reason, more preferred alcohols are ethanol, n-propanol and isopropanol.
- the selection of the silane coupling agent as the component (A) is preferably performed according to the type of the resin composition using the silane coupling agent.
- a silane coupling agent containing a glycidyl group or a mercapto group is preferable.
- a vinyl group, a styryl group, a methacryl group, or an acryl group is used.
- a silane coupling agent containing a mercapto group is preferred.
- the adhesion of the resin to inorganic materials such as metal, glass, and ceramic can be improved.
- a luster include epoxy luster, atari resin, phenol resin, unsaturated polyester resin, urethane resin, silicone resin, polyimide resin, etc., and a sealing material using these resins. It can be used as an additive for laminates, resists, paints, primers, adhesives, etc.
- the coupling agent of the present invention since the coupling agent of the present invention is solid, it acts as a potential curing agent for a thermosetting resin such as an epoxy resin.
- the solid silane coupling agent of the present invention can be easily pulverized and added to a powder coating.
- the adhesion to the object to be coated can be improved.
- powder coatings include polyester resin powder coating, epoxy resin powder coating, acrylic resin powder coating, hybrid powder coating, polyurethane powder coating, and TGIC powder coating. is there.
- the solid silane coupling agent of the present invention is easily pulverized as described above, but after the pulverization, an anti-blocking agent such as silica may be added to prevent blocking.
- the silane coupling agent represented by the above (A) or (B) may be added to the resin composition in combination. You can also.
- a solid silane coupling agent was synthesized in the same manner as in Example 1 except that 5 g of 3-mercaptoprovir trimethoxysilane was changed to 10 g and 15 g of imidazole silane was changed to 10 g in Example 1. Got two. It was confirmed that the obtained solid force coupling agent 2 was soluble in DMF (dimethylform amide) and did not gel.
- a solid silane coupling agent 3 was synthesized in the same manner as in Example 1, except that 5 g of 3_mercaptoprovir trimethoxysilane was changed to 15 g and 15 g of imidazole silane was changed to 5 g. Got.
- the obtained solid force coupling agent 3 is DM F Methylformamide) and no gelation.
- a solid silane coupling agent 4 was obtained in the same manner as in Example 1 except that 3-mercaptoprovir trimethoxysilane was changed to 3-metaryloxypropyltrimethoxysilane. It was confirmed that the obtained solid coupling agent 4 was soluble in DMF (dimethylformamide) and did not gel. '
- a solid silane coupling agent 5 was obtained in the same manner as in Example 1 except that 3-mercaptoprovir trimethoxysilane was changed to 3-glycidoxypropyltrimethoxysilane in Example 1. It was confirmed that the obtained solid force coupling agent 5 was soluble in DMF (dimethylformamide) and did not gel.
- Example 6
- a solid silane coupling agent 6 was obtained in the same manner as in Example 1 except that 3-mercaptopropyl trimethoxysilane was changed to butyltrimethoxysilane in Example 1. It was confirmed that the obtained solid force coupling agent 6 was soluble in DMF (dimethylformamide) and did not gel.
- a solid silane coupling agent 7 was obtained in the same manner as in Example 1 except that imidazole silane was changed to 3-aminopropyltrimethoxysilane.
- the obtained solid coupling agent 7 was soluble in DMF (dimethylformamide), and it was confirmed that the solid coupling agent 7 was not subjected to genorei. ⁇
- a solid silane coupling agent 8 was obtained in the same manner as in Example 2 except that imidazole silane was added without mixing isopropyl alcohol in Example 2. It was confirmed that the obtained solid force coupling agent 8 did not dissolve in DMF (dimethylformamide) and was gelled.
- reaction initiation temperature with the epoxy resin is 75-80. C, indicating that it had latent hardening properties. It was also confirmed that the peak temperature of the exothermic reaction gradually increased as the mixing ratio of mercaptosilane (3-mercaptopropyltrimethoxysilane) and imidazolesilane increased. This means that the reactivity can be controlled by changing the mixing ratio, and the mixing ratio can be selected according to the intended use of the resin composition.
- Epoxy resin (biphenyl type, epoxy equivalent 192): 7.93 parts by weight
- Phenol resin (phenol nopolak, hydroxyl equivalent 106): 4.38 parts by weight
- TPP Curing accelerator
- Carbon black 0.20 parts by weight
- Carnauba wax 0.25 parts by weight
- Silane coupling agent is pack (The added silane coupling agent is shown below.)
- Kneading by heating a hot roll machine to 90 ° C.
- Heat kneading continued for about 4 minutes after the material turned black.
- silane coupling agent used.
- Example 9-1 As a silane coupling agent, 0.3 parts by weight of 3-glycidoxypropyltrimethoxysilane and 0.5 parts by weight of a solid silane coupling agent 1 were added.
- Example 9-2 As a silane coupling agent, 0.3 part by weight of 3-glycidoxypropyltrimethoxysilane and 0.5 part by weight of a solid silane coupling agent 2 were added.
- Example 9-13 2.0 parts by weight of a solid silane coupling agent 3 was added as a silane coupling agent.
- Comparative Example 3 As a silane coupling agent, 0.3 part by weight of 3-daricidoxypropyltrimethoxysilane was added.
- Comparative Example 4 As a silane coupling agent, 0.3 part by weight of 3-mercaptopropyl trimethoxysilane and 0.1 part by weight of imidazole silane were added. Adhesion was not evaluated because some aggregates were formed in the obtained sealing material.
- Comparative Example 5 3-Mercaptopropyltrimethoxysilane and a phenol resin were mixed and dried by a conventional method to prepare a reaction mixture containing 5% 3-mercaptopropylvirmethoxysilane. This reaction mixture was pulverized, and 2.0 parts by weight was added to the sealing material composition.
- 'A ring agent can be synthesized, and even if the solid' ring agent of the present invention is added to the resin composition of Comparative Example 3 (Examples 9-1 and 9-2), the sila coupling agent of Comparative Example 3 is also used. It was confirmed that the adhesive strength was improved even when the silane coupling agent of the present invention was replaced.
- the silane coupling agent composition of the present invention is solid and can be easily pulverized, it can be easily mixed uniformly with a resin, a powdery sealant, or a powder coating.
- the adhesion of the resin to which the resin is added to metals, inorganic materials, and organic materials can be improved.
- latent curability having excellent storage stability can be imparted.
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- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Sealing Material Composition (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Paints Or Removers (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Phenolic Resins Or Amino Resins (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP03762345A EP1469022B1 (en) | 2002-10-28 | 2003-08-05 | Solid silane coupling agent composition, process for producing the same, and resin composition containing the same |
CA002447858A CA2447858C (en) | 2002-10-28 | 2003-08-05 | Solid silane coupling agent composition, method for manufacturing the same, and resin composition containing the same |
US10/480,712 US7109273B2 (en) | 2002-10-28 | 2003-08-05 | Solid silane coupling agent composition, process for producing the same, and resin composition containing the same |
KR1020037016956A KR100575323B1 (ko) | 2002-10-28 | 2003-08-05 | 고형 실란커플링제 조성물, 그 제조방법, 그것을 함유하는 수지조성물, 수지경화물, 분체도료 및 봉지재료 |
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JP2002312712A JP2004143383A (ja) | 2002-10-28 | 2002-10-28 | 固形シランカップリング剤組成物、その製造方法およびそれを含有する樹脂組成物 |
JP2002-312712 | 2002-10-28 |
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EP (1) | EP1469022B1 (ja) |
JP (1) | JP2004143383A (ja) |
KR (1) | KR100575323B1 (ja) |
CN (1) | CN100357333C (ja) |
CA (1) | CA2447858C (ja) |
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KR100806420B1 (ko) * | 2001-12-29 | 2008-02-21 | 주식회사 케이씨씨 | 반도체소자 봉지용 에폭시 수지 조성물 |
JP2006342270A (ja) * | 2005-06-09 | 2006-12-21 | Osaka Univ | 有機無機ハイブリッド |
JP2007262235A (ja) * | 2006-03-28 | 2007-10-11 | Matsushita Electric Works Ltd | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
KR101049998B1 (ko) * | 2006-09-07 | 2011-07-19 | 미쓰이 가가쿠 가부시키가이샤 | 액정 실링제, 그것을 사용한 액정 표시 패널의 제조 방법 및 액정 표시 패널 |
KR100816679B1 (ko) * | 2006-12-13 | 2008-03-27 | 제일모직주식회사 | 천연섬유 강화 폴리유산 수지 조성물 |
EP2254960A1 (de) * | 2008-03-18 | 2010-12-01 | Nano-X GmbH | Verfahren zur herstellung eines hoch abriebfesten fahrzeuglackes, fahrzeuglack und dessen verwendung |
JP5449176B2 (ja) * | 2008-09-29 | 2014-03-19 | 三井化学株式会社 | 封止剤および封止部材、ならびに有機elデバイス |
JP5060648B1 (ja) * | 2011-09-30 | 2012-10-31 | 日本写真印刷株式会社 | 転写シート及び転写シートの製造方法 |
EP2838965A4 (en) * | 2012-04-17 | 2015-05-20 | Arkema Inc | AQUEOUS FLUOROPOLYMER GLASS COATING |
US9714191B2 (en) | 2012-04-17 | 2017-07-25 | Arkema Inc. | Process for coating a glass substrate with an aqueous fluoropolymer coating |
WO2014042289A1 (en) | 2012-09-14 | 2014-03-20 | Tokyo Ohka Kogyo Co., Ltd. | Heating medium composition for solar thermal power generation system |
JP6070589B2 (ja) * | 2014-01-24 | 2017-02-01 | 信越化学工業株式会社 | シランカップリング剤及びその製造方法、プライマー組成物並びに塗料組成物 |
JP2016176053A (ja) * | 2015-03-18 | 2016-10-06 | 関西ペイント株式会社 | 粉体塗料組成物及び塗膜形成方法 |
CN108530591B (zh) * | 2018-04-20 | 2020-10-02 | 苏州兴业材料科技股份有限公司 | 3d砂型打印用碱酚醛树脂的制备方法 |
CN114016288B (zh) * | 2021-12-07 | 2024-03-15 | 中国第一汽车股份有限公司 | 一种纤维帘线浸渍液及其制备方法和应用 |
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KR20040060856A (ko) | 2004-07-06 |
CN100357333C (zh) | 2007-12-26 |
CA2447858C (en) | 2009-06-02 |
CN1541231A (zh) | 2004-10-27 |
TWI254049B (en) | 2006-05-01 |
CA2447858A1 (en) | 2004-04-28 |
TW200406416A (en) | 2004-05-01 |
US20050165195A1 (en) | 2005-07-28 |
US7109273B2 (en) | 2006-09-19 |
EP1469022B1 (en) | 2012-10-03 |
EP1469022A4 (en) | 2006-02-01 |
KR100575323B1 (ko) | 2006-05-02 |
JP2004143383A (ja) | 2004-05-20 |
EP1469022A1 (en) | 2004-10-20 |
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