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WO1999019389A1 - Composite thermodurcissable moulable et son procede d'obtention - Google Patents

Composite thermodurcissable moulable et son procede d'obtention Download PDF

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Publication number
WO1999019389A1
WO1999019389A1 PCT/US1998/021748 US9821748W WO9919389A1 WO 1999019389 A1 WO1999019389 A1 WO 1999019389A1 US 9821748 W US9821748 W US 9821748W WO 9919389 A1 WO9919389 A1 WO 9919389A1
Authority
WO
WIPO (PCT)
Prior art keywords
molding composition
composition according
thermosetting
thermosetting molding
range
Prior art date
Application number
PCT/US1998/021748
Other languages
English (en)
Inventor
Martin Choate
Robert Peterson
Allen Halbritter
Jon Weispfenning
Gregory Almen
Original Assignee
Cytec Technology Corp.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cytec Technology Corp. filed Critical Cytec Technology Corp.
Priority to CA002306144A priority Critical patent/CA2306144A1/fr
Priority to KR1020007004038A priority patent/KR20010031139A/ko
Priority to JP2000515954A priority patent/JP2001520245A/ja
Priority to AU10875/99A priority patent/AU757196B2/en
Priority to EP98953530A priority patent/EP1023374A1/fr
Priority to BR9814819-2A priority patent/BR9814819A/pt
Publication of WO1999019389A1 publication Critical patent/WO1999019389A1/fr
Priority to NO20001925A priority patent/NO20001925L/no

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M8/00—Fuel cells; Manufacture thereof
    • H01M8/02—Details
    • H01M8/0202—Collectors; Separators, e.g. bipolar separators; Interconnectors
    • H01M8/0204—Non-porous and characterised by the material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M8/00—Fuel cells; Manufacture thereof
    • H01M8/02—Details
    • H01M8/0202—Collectors; Separators, e.g. bipolar separators; Interconnectors
    • H01M8/0204—Non-porous and characterised by the material
    • H01M8/0213—Gas-impermeable carbon-containing materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M8/00—Fuel cells; Manufacture thereof
    • H01M8/02—Details
    • H01M8/0202—Collectors; Separators, e.g. bipolar separators; Interconnectors
    • H01M8/0204—Non-porous and characterised by the material
    • H01M8/0223—Composites
    • H01M8/0226—Composites in the form of mixtures
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/30—Hydrogen technology
    • Y02E60/50—Fuel cells

Definitions

  • This invention relates generally to the field of thermoset composites, and more particularly to methods for making structures from thermoset composites having high thermal and electrical conductivity.
  • this invention relates to the starting materials from which such structures are formed, as well as to the methods of making such starting materials.
  • Structures having good thermal and electrical conductivity properties in a thin wall, sufficiently crack-resistant fabrication are useful for applications requiring such conductivity properties, such as for bi-polar plates for fuel cells.
  • a major problem long of concern to the art is ion leaching from bipolar plates into the fuel cell environment.
  • This ion leaching is problemmatic because it renders ineffective the membrane that separates stacked bi-polar plates in fuel cells. Ion leaching is promoted by the current charged, corrosive, acidic environment of the fuel cells.
  • known structures that comprise highly electrically and thermally conductive metals have largely proven ineffective for use as bi-polar plates in fuel cell applications.
  • Even known structures that incorporate substantial amounts of ionizable impurities i.e. , ionizable, conductive metals
  • An additional problem associated with the manufacture of such structures is high cost.
  • a further problem associated with such structures is their reduced processibility.
  • carbon-carbon based bipolar plates are generally machined into a bipolar plate, and then handled in a time and labor-intensive manner during the fuel cell assembly process to ensure that the brittle, fragile carbon-carbon thin bipolar plate does not crack or break.
  • thermosetting resin systems may be sufficiently packed with low cost fillers to make a
  • molding composition that can be formed into structures exhibiting good electrical and
  • thermosetting molding compositions comprising about 10 to about 30 wt-
  • thermosetting molding composition comprising mixing a low
  • thermosetting binder resin system and a filler under conditions selected to preserve the integrity of the filler and under conditions sufficient to wet-out the
  • thermosetting molding compositions are thermosetting molding compositions.
  • thermosetting molding compositions
  • thermosetting molding compositions thermosetting molding compositions, and subjecting the desired shape to conditions
  • thermosetting molding compositions
  • the invention has the following advantages.
  • the invention provides
  • compositions are non-reactive in the corrosive fuel cell environment, thereby
  • invention molding compositions comprise
  • thermosetting resins which have sufficiently low viscosity to enhance the
  • the invention methods of making molding compositions optionally enhance the thermal conductivity (i.e., thermal conductivity of no less than
  • the invention provides a molding composition that can be used to
  • the molding composition may be
  • the molding composition also has high electrical and
  • thermosetting resin In accordance with the invention, there are provided thermosetting resin
  • thermosetting binder resin system comprising a low viscosity thermosetting binder resin system
  • the low viscosity thermosetting binder resin system can be present in
  • the low viscosity thermosetting binder resin system is preferably present within the range from about 10 to about 30 wt-wt percent
  • composition for example, a range of about 15 to about 25 wt-wt
  • the filler may be present in different concentrations
  • filler is preferably present within the range from about 70 to about 90 wt-wt percent of
  • the invention composition for example, a range of about 75 to about 85 wt-wt percent
  • wt-wt percent means the amount of a particular
  • thermosetting resin composition means that the
  • amount of the filler present in the conductive thermosetting composition may be any
  • the term "the filler is ...
  • composition means that the amount of the filler present in the conductive
  • thermosetting composition may be any value in the particularly defined range of the
  • Fillers utilized in accordance with the invention include natural
  • thermosetting binder resin system under conditions selected to preserve the
  • thermosetting molding composition integrity of the filler to form a thermosetting molding composition
  • Preferred fillers include natural graphite
  • fillers may be electrically and thermally conductive.
  • Fillers may have varying shapes, size classifications, thicknesses, and
  • the fillers have an average size classification (mesh size)
  • fillers optionally have an average thickness within the fillers
  • carbon-based conductive fillers e.g., natural graphite
  • flake, synthetic graphite and the like optionally have an average purity (i.e.,
  • percentage carbon content as determined on a wt-wt percent basis) within a preferred range from about 90 percent pure to about 100 percent pure, with a presently preferred range of about about 95 percent pure to about 100 percent pure.
  • curing agent to the epoxy resin is optionally a predetermined phenolic-epoxy
  • thermosetting binder resin systems include epoxy vinyl ester resin systems,
  • epoxy vinyl ester resin systems contemplated for use in the practice of the invention
  • Epoxy vinyl ester resins include bis-A
  • n 0-5, wherein R, and R 2 are each independently selected from:
  • each R is independently selected from hydrogen and methyl.
  • Novolac type epoxy vinyl ester resins are resins having the following
  • each R is independently selected from hydrogen and methyl.
  • Epoxy vinyl ester resins contemplated for use in the invention are epoxy vinyl ester resins contemplated for use in the invention.
  • a viscosity within the range from about 200 centipoise to about 500
  • centipoise at 25°C with a presently preferred range of about 250 centipoise to about
  • thermosetting binder resin systems may be measured by any means known
  • the viscosity may be measured by the rotational viscometer procedure.
  • Exemplary epoxy vinyl ester resins include Derakane 470-300TM,
  • thermosetting binder resin systems include a low molecular weight phenolic
  • resin system optionally containing an amine curing agent.
  • the invention include phenolic novolac-based resins, resole-based resins, suitable
  • Phenolic novolac-based resins are resins that have the following generalized structure:
  • the invention optionally have a softening point within the range from about 60°C to
  • viscosity thermosetting binder resin systems is a temperature at which the particular
  • the softening point may be measured by any means known in the
  • the softening point may be
  • the softening point may be an indirect measure of the average molecular
  • Resole-based resins are resins which are reaction products of
  • resins include resins having the following generalized structure, and may or may not
  • each R is independently selected from hydrogen, formaldehyde, phenol,
  • condensation products of formaldehyde and phenol condensation products of formaldehyde and phenol, and suitable condensation
  • Exemplary resole-based resins include SC 1008 (commercially
  • An amine curing agent may optionally be added to low viscosity resin
  • binder systems comprising phenolic novolac-based resins. These amine curing agents
  • Hexamethylenetetraamine has the
  • hexamethylenetetraamine may be present in an amount within the range
  • hexamethylenetetraamine of about 7 wt-wt percent
  • thermosetting binder resin systems include combinations of low viscosity
  • phenolic novolac-based resins epoxidized cresolic novolac-based resins, bi-phenyl- based epoxy resins, dicyclopentadiene-based epoxy resins, bis-F type epoxy resins, bis-A type epoxy resins, any of the foregoing resins in solid or liquid form, and combinations thereof.
  • Preferred low viscosity epoxy resins include epoxidized
  • DEN 431TM and DEN 438TM commercially available from Dow Chemical Co ⁇ .
  • Phenolic novolac-based resins are resins having the previously
  • “Cresolic novolac-based resins” are resins having the following
  • Bin-phenyl-based epoxy resins are resins that have the following
  • 'Dicyclopentadiene-based epoxy resins are resins that have the
  • 'Bis-F type epoxy resins are resins that have the following structure:
  • 'Bis-A type epoxy resins are resins that have the following structure:
  • Exemplary ranges include a viscosity range of 2000
  • EW epoxy equivalent weight
  • epoxidized phenolic novolac-based resins have a preferred EEW range of 170 to 190,
  • the low viscosity epoxy resins optionally have a glass
  • transition temperature (T g ) within the range from about -40°C to about 170°C.
  • DEN 431TM DEN 438TM (each of which is commercially available
  • a molecular weight within the range from about 200 to about 600, for example, a range of about 300 to about 500, and a
  • HEW HE 5
  • HRJ 1166TM and HRJ 1583TM are useful in accordance with the invention.
  • resin functionalities e.g., epoxy functionalities
  • the number of epoxy functionalities in the low viscosity thermosetting binder resin system may be determined by dividing the weight of the epoxy-based precursor
  • component e.g., low viscosity epoxy resin
  • low viscosity thermosetting binder e.g., low viscosity thermosetting binder
  • Epoxy equivalent weight means the weight (in grams) of a
  • thermosetting binder resin system may be determined by dividing the weight of the
  • hydroxy-based precursor component e.g., low molecular weight phenolic resin
  • Hydro equivalent weight means the weight (in grams) of
  • the precursor e.g., low molecular weight phenolic resin curing agent which contains
  • thermosetting binder resin system useful in the low viscosity thermosetting binder resin system
  • the low viscosity thermosetting binder resin system may be any suitable thermosetting binder resin system.
  • the low viscosity thermosetting binder resin system may be any suitable thermosetting binder resin system.
  • a suitable catalyst system present in a wt-wt percent range from about 0.001
  • catalyst systems may vary depending on the resin and/or curing agent constituents of
  • thermosetting binder resin system Suitable catalyst systems for use with an epoxy vinyl ester resin system
  • resin system e.g., a phenolic novolac-based resin
  • resin system optionally containing an amine
  • curing agent include acids (with associated pHs) such as toluene sulfonic acid, phenol
  • the suitable catalyst system is selected
  • Such catalysts include urea-based catalysts, imidazole
  • catalysts tri-phenyl phosphine, phosphonium salt catalysts, tertiary amine catalysts,
  • Exemplary urea-based catalysts include diuron, monuron, phenuron, suitable
  • imidazole catalysts include 2-phenyl-N-phenyl-N-phenyl-N-phenyl-N-phenyl-N-phenyl-N-phenyl-N-phenyl-N-phenyl-N-phenyl-N-phenyl-N-phenyl-N-phenyl-N-phenyl-N-phenyl-N-phenyl-N-phenyl-N-phenyl-N
  • Exemplary tertiary amine catalysts include benzyl
  • BDMA dimethylamine
  • exemplary amine salt catalysts include benzyl
  • catalyst system for the low viscosity thermosetting binder resin system comprising a combination of a low viscosity epoxy resin and a low molecular weight phenolic resin
  • curing agent comprises a urea-based catalyst (e.g., diuron) present in a wt-wt percent
  • composition e.g., 2-phenyl - 4 - methyl imidazole
  • an imidazole catalyst e.g., 2-phenyl - 4 - methyl imidazole
  • wt-wt percent in a wt-wt percent range from about 0.001 wt-wt percent to about 0.5 wt-wt percent of
  • Exemplary mixtures include a presently preferred mixture
  • suitable catalyst systems permit the conductive thermosetting molding composition to substantially cure in no
  • the percentage level of cure of a material may be measured by
  • the ratio of the residual cure level to the total cure level is compared to the relevant area of the DSC curve for an uncured material (i.e., the total cure level), the ratio of the residual cure level to the total cure level, when
  • Suitable curing conditions include conditions that advance the
  • reaction conditions i.e., curing
  • temperature i.e., pressure
  • other reaction conditions e.g., presence
  • reaction products of the precursors oligomers, glycidyl amines, ethoxylated species,
  • cross-linked species e.g., addition products, including etherification, and condensation products
  • chain-extended species e.g., addition products, including
  • reaction products are applicable to a particular precursor.
  • Exemplary means for providing such suitable curing conditions include
  • Suitable molding temperatures include
  • Suitable molding pressures include pressures in a range from about 100 psi
  • thermosetting binder resin system may be any low viscosity thermosetting binder resin system.
  • composition As utilized herein, the term "internal release agent” means any one of the ingredients.
  • internal release agent means any one of the ingredients.
  • thermosetting molding composition which keeps the thermosetting molding composition from adhering to the
  • thermosetting molding composition may be shaped
  • Exemplary internal release agents include
  • thermosetting binder resin system may be any suitable combinations thereof, and the like. Further, the low viscosity thermosetting binder resin system may be any suitable combinations thereof, and the like. Further, the low viscosity thermosetting binder resin system may be any suitable combinations thereof, and the like. Further, the low viscosity thermosetting binder resin system may be any suitable combinations thereof, and the like. Further, the low viscosity thermosetting binder resin system may be any suitable combinations thereof, and the like. Further, the low viscosity thermosetting binder resin system may be any suitable combinations thereof, and the like. Further, the low viscosity thermosetting binder resin system may be any suitable combinations thereof, and the like. Further, the low viscosity thermosetting binder resin system may be any suitable combinations thereof, and the like. Further, the low viscosity thermosetting binder resin system may be any suitable combinations thereof, and the like. Further, the low viscosity thermosetting binder resin system may be any suitable combinations thereof, and the like. Further, the low viscosity thermosetting binder
  • binder resin system solvent present in a wt-wt percent range
  • composition for example, in a range from about 7 wt-wt percent to about 11 wt-wt
  • system solvent includes any solvent in which the low viscosity thermosetting binder
  • resin system may be at least partly soluble or miscible, and serves to further decrease
  • thermosetting molding composition the viscosity of the thermosetting molding composition.
  • Exemplary binder resin is ethylene glycol dimethacrylate
  • system solvents include acetone, methyl ethyl ketone, dichloromethane, suitable
  • thermosetting molding composition comprising mixing a binder resin
  • thermosetting molding composition formed is thermosetting molding composition formed
  • binder resin system solvent to less than about the cure temperature of the binder resin
  • thermosetting composition than 3 wt-wt percent of the conductive thermosetting composition.
  • Conditions selected to preserve the integrity of the filler include
  • composition has an electrical resistivity of no more than 0.005 Ohm-cm.
  • composition reduces the integrity of the filler particles, resulting in a
  • composition of Example 6 composition of Example 6.
  • the filler include a spraying of the binder resin system on to the conductive filler as
  • a folding mechanism e.g., continuous conveyor belt
  • wet-out means to intimately mix the
  • binder resin system with or fully disperse the binder resin system within the filler so
  • the conductive filler flakes may become sticky (due to the binder
  • thermosetting molding compositions may comprise at least one of:
  • At least one thin wall section in any desired polygonic or curvilinear shape is at least one thin wall section in any desired polygonic or curvilinear shape.
  • shape of the thin wall section is any shape which promotes use of the structure, which
  • the thin wall section comprises the thin wall section, as a bipolar plate.
  • the thickness of the thin wall section may be in the range from about
  • the thin wall section of the foregoing structure may further possess
  • the thin wall section of the structure is a thin wall section of the structure
  • the thin wall section of the structure is a structure's ultimate flexural strength.
  • the thin wall section of the structure is a structure's ultimate flexural strength.
  • An exemplary range for the flexural stress is in a range from about 2500 psi
  • the ultimate flexural strength of a structure may be measured by any
  • flexural strength may be measured by an ASTM flexural property procedure.
  • the thin wall section of the structure optionally has an
  • the thin wall is electrical resistivity of no more than about 0.0025 Ohm-cm.
  • the thin wall is electrical resistivity of no more than about 0.0025 Ohm-cm.
  • section of the structure has an electrical resistivity of no less than about 0.0001 Ohm-
  • Exemplary ranges include a range from about 0.0002 Ohm-cm to about 0.0025
  • Ohm-cm with a presently preferred range from about 0.00035 Ohm-cm to about
  • the electrical resistivity may be measured by any means known in the
  • structure may be measured by an ASTM electrical resistivity measurement procedure.
  • resistivity measurement procedure are hereby inco ⁇ orated herein by reference.
  • the thin wall section of the structure may have a thermal
  • the structure has an electrical resistivity of no less than about about 50 (W/m) K.
  • Exemplary ranges include a range from about 4.5 (W/m) K to about 20 (W/m) K, with
  • thermal conductivity may be measured by any means known in the
  • the structure may be measured by the flash method.
  • the flash method is published in the
  • thermosetting molding compositions
  • thermosetting molding comprising molding into a desired shape the foregoing thermosetting molding
  • composition and subjecting the desired shape to suitable curing conditions to form a
  • Molding of the structures is accomplished by any method that does not
  • molding composition to a value greater than about 0.005 Ohm-cm, including injection
  • the desired shape can be substantially cured by the desired shape
  • cured may be further cured by continued treatment at suitable curing conditions (e.g., baked in oven at about 350°F) for a sufficient time to substantially completely
  • thermosetting molding composition identified in Examples 2 - 5
  • Example 6 (subject to the modifications noted in Example 6), was made as
  • a specified amount of low viscosity epoxy resin e.g., DEN 431TM,
  • DEN 438TM was added to the mixing bowl of a Hobart Mixer,
  • thermosetting molding composition to make the electrically and thermally conductive thermosetting molding composition.
  • a first internal release agent e.g., Carnuba wax
  • a urea-based catalyst e.g., Carnuba wax
  • a second internal release agent e.g., zinc stearate
  • an imidazole e.g., imidazole
  • the mixer one at a time.
  • thermosetting binder resin system was removed from the mixer when completely
  • conductive filler e.g., natural graphite flake
  • thermosetting resin styrene resin
  • binder resin system e.g., 1-3 minutes for 2500 gram batch size.
  • thermosetting molding composition was tray dried
  • binder solvent level e.g., acetone
  • a 2500 gram batch of DEN 431 TM-based thermosetting molding composition was prepared according to the method of Example 1 so as to comprise the components shown in Table 1 below:
  • thermosetting molding composition A 2500 gram batch of DEN 431TM/438TM/Imidazole (2P4MZ) (0.044 wt-wt percent)-based thermosetting molding composition was made according to the method of Example 1 so as to comprise the components shown in Table 2 below:
  • thermosetting molding composition A 2500 gram batch of DEN 431TM/438TM/Imidazole (2P4MZ) [0.065 wt-wt percent] -based thermosetting molding composition was made according to the method of Example 1 so as to comprise the components shown in Table 3 below:
  • thermosetting molding composition A 2500 gram batch of DEN 431TM/438TM/No Imidazole (2P4MZ)- based thermosetting molding composition was made according to the method of Example 1 so as to comprise the components shown in Table 4 below:
  • thermosetting molding composition A 50 pound batch of EPON 828TM/DER 661TM-based thermosetting molding composition was made according to the method of Example 1, subject to the following modifications, so as to comprise the components shown in Table 5 below.
  • the mixer (a Hobart Mixer, Model No. V- 1401 , commercially available from Hobart, Inc., Troy, OH) was set to operate at speed setting number 3 (i.e., about 150 ⁇ m; the same speed setting on different mixers may yield different ⁇ ms) during the entire mixing process required to make the composition; 2.
  • the binder resin system component and the conductive filler component of the thermosetting molding composition were mixed for 30 minutes; and 3.
  • the batch size was 50 pounds (as noted above).
  • thermosetting molding compositions made in accordance with Examples 2 (Disk 1), 5
  • the electrical resistivity (e.g., reciprocal of electrical conductivity) of Disks 1 - 3 was determined by applying a known current and measuring a resultant voltage drop, in accordance with the ASTM electrical resistivity measurement
  • thermosetting molding compositions made in accordance with Examples 5 (Plate 1)

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electrochemistry (AREA)
  • Sustainable Energy (AREA)
  • Sustainable Development (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Composite Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Fuel Cell (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
  • Conductive Materials (AREA)

Abstract

L'invention porte sur un composite thermodurcissable conducteur fortement chargé pouvant s'utiliser comme plaques bipolaires et former des parois minces, et des structures electro-et-thermoconductrices d'une rigidité et d'une résistance suffisante pour s'adapter aux conditions dures des piles à combustibles.
PCT/US1998/021748 1997-10-14 1998-10-14 Composite thermodurcissable moulable et son procede d'obtention WO1999019389A1 (fr)

Priority Applications (7)

Application Number Priority Date Filing Date Title
CA002306144A CA2306144A1 (fr) 1997-10-14 1998-10-14 Composite thermodurcissable moulable et son procede d'obtention
KR1020007004038A KR20010031139A (ko) 1997-10-14 1998-10-14 전도성 열경화 성형조성물 및 그의 제조방법
JP2000515954A JP2001520245A (ja) 1997-10-14 1998-10-14 導電性熱硬化性成形組成物および該組成物の製造方法
AU10875/99A AU757196B2 (en) 1997-10-14 1998-10-14 Conductive thermoset molding composition and method for producing same
EP98953530A EP1023374A1 (fr) 1997-10-14 1998-10-14 Composite thermodurcissable moulable et son procede d'obtention
BR9814819-2A BR9814819A (pt) 1997-10-14 1998-10-14 Composições de moldagem determofixação de enchimento elevado e processopara produção das mesmas
NO20001925A NO20001925L (no) 1997-10-14 2000-04-13 Fylt herdeplastmateriale for støping og fremgangsmÕte for fremstilling av dette

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US6192097P 1997-10-14 1997-10-14
US60/061,920 1997-10-14

Publications (1)

Publication Number Publication Date
WO1999019389A1 true WO1999019389A1 (fr) 1999-04-22

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Application Number Title Priority Date Filing Date
PCT/US1998/021748 WO1999019389A1 (fr) 1997-10-14 1998-10-14 Composite thermodurcissable moulable et son procede d'obtention

Country Status (9)

Country Link
EP (1) EP1023374A1 (fr)
JP (1) JP2001520245A (fr)
KR (1) KR20010031139A (fr)
CN (1) CN1282349A (fr)
AU (1) AU757196B2 (fr)
BR (1) BR9814819A (fr)
CA (1) CA2306144A1 (fr)
NO (1) NO20001925L (fr)
WO (1) WO1999019389A1 (fr)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0933825A2 (fr) * 1998-01-19 1999-08-04 Toyota Jidosha Kabushiki Kaisha Séparateur pour pile à combustible et son procédé de fabrication
JP2000348740A (ja) * 1999-06-08 2000-12-15 Ibiden Co Ltd 固体高分子型燃料電池のセパレータ及びその製造方法
JP2001216976A (ja) * 2000-02-03 2001-08-10 Nisshinbo Ind Inc 燃料電池セパレータ及びその製造方法
WO2002021620A1 (fr) * 2000-09-04 2002-03-14 Nippon Steel Chemical Co., Ltd. Separateur pour pile a combustible, procede de production, et materiau utilise
WO2002065568A2 (fr) * 2001-02-14 2002-08-22 Mosaic Energy L.L.C. Agent de demoulage interne pour plaques bipolaires composites de faible cout
WO2002092659A1 (fr) * 2001-05-14 2002-11-21 Vantico Ag Composition de moulage pour la production de plaques bipolaires
EP1298748A2 (fr) * 2001-09-26 2003-04-02 Dainippon Ink And Chemicals, Inc. Plaque bipolaire pour pile à combustible, procédé de fabrication de la plaque bipolaire et pile à combustible utilisant la plaque bipolaire
US6905637B2 (en) 2001-01-18 2005-06-14 General Electric Company Electrically conductive thermoset composition, method for the preparation thereof, and articles derived therefrom
US7235192B2 (en) 1999-12-01 2007-06-26 General Electric Company Capped poly(arylene ether) composition and method
US7858696B2 (en) 2003-03-10 2010-12-28 Dic Corporation Conductive resin composition, process for production thereof, and fuel cell separators
US8674038B2 (en) 2007-09-27 2014-03-18 Nippon Skokubai Co., Ltd. Curable resin composition for molded bodies, molded body, and production method thereof

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AU2003209898A1 (en) 2002-03-20 2003-09-29 Dupont Canada Inc. Process for decreasing the resistivity of conductive flow field plates for use in fuel cells
JP4160328B2 (ja) * 2002-07-03 2008-10-01 本田技研工業株式会社 燃料電池用セパレータの製造方法
KR100597897B1 (ko) * 2004-06-19 2006-07-06 한국타이어 주식회사 연료전지 분리판 성형용 소재, 그의 제조방법과 이로부터제조된 연료전지 분리판 및 연료전지
WO2006084386A1 (fr) 2005-02-14 2006-08-17 Kelsan Technologies Corp. Compositions sous forme de bâton solide comprenant un plastique thermodurcissable
US8445416B2 (en) * 2007-01-26 2013-05-21 L.B. Foster Rail Technologies, Corp. Solid stick compositions comprising vinyl ester
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JP5509709B2 (ja) 2009-07-24 2014-06-04 日清紡ケミカル株式会社 燃料電池セパレータ
JP5257497B2 (ja) 2011-09-26 2013-08-07 日清紡ケミカル株式会社 燃料電池用多孔質セパレータ
JP6081959B2 (ja) * 2014-05-19 2017-02-15 ダイセルバリューコーティング株式会社 樹脂フィルム、積層体及びその製造方法並びに燃料電池の製造方法
CN105633419A (zh) * 2016-03-11 2016-06-01 常州博能新能源有限公司 一种用于氢燃料电池组的双极板及其制作工艺
CN109167072A (zh) * 2018-09-07 2019-01-08 米库玻璃纤维增强塑料泰州有限责任公司 一种石墨双极板制造工艺
CN109119641A (zh) * 2018-09-07 2019-01-01 米库玻璃纤维增强塑料泰州有限责任公司 一种导电塑料双极板制造工艺

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Cited By (19)

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EP0933825A2 (fr) * 1998-01-19 1999-08-04 Toyota Jidosha Kabushiki Kaisha Séparateur pour pile à combustible et son procédé de fabrication
EP0933825A3 (fr) * 1998-01-19 1999-09-22 Toyota Jidosha Kabushiki Kaisha Séparateur pour pile à combustible et son procédé de fabrication
US7172830B2 (en) 1998-01-19 2007-02-06 Toyota Jidosha Kabushiki Kaisha Separator for fuel cell and manufacturing method for the same
JP2000348740A (ja) * 1999-06-08 2000-12-15 Ibiden Co Ltd 固体高分子型燃料電池のセパレータ及びその製造方法
US7235192B2 (en) 1999-12-01 2007-06-26 General Electric Company Capped poly(arylene ether) composition and method
JP2001216976A (ja) * 2000-02-03 2001-08-10 Nisshinbo Ind Inc 燃料電池セパレータ及びその製造方法
GB2382457A (en) * 2000-09-04 2003-05-28 Nippon Steel Chemical Co Separator for fuel cell, process for producing the same, and material therefor
GB2382457B (en) * 2000-09-04 2004-03-31 Nippon Steel Chemical Co Separator for fuel cell, process for producing the same, and material therefor
WO2002021620A1 (fr) * 2000-09-04 2002-03-14 Nippon Steel Chemical Co., Ltd. Separateur pour pile a combustible, procede de production, et materiau utilise
US6905637B2 (en) 2001-01-18 2005-06-14 General Electric Company Electrically conductive thermoset composition, method for the preparation thereof, and articles derived therefrom
WO2002065568A3 (fr) * 2001-02-14 2002-11-14 Mosaic Energy L L C Agent de demoulage interne pour plaques bipolaires composites de faible cout
WO2002065568A2 (fr) * 2001-02-14 2002-08-22 Mosaic Energy L.L.C. Agent de demoulage interne pour plaques bipolaires composites de faible cout
WO2002092659A1 (fr) * 2001-05-14 2002-11-21 Vantico Ag Composition de moulage pour la production de plaques bipolaires
JP2008179786A (ja) * 2001-05-14 2008-08-07 Duresco Gmbh バイポーラプレート製造用成形組成物
US7695806B2 (en) 2001-05-14 2010-04-13 Duresco Gmbh Moulding composition for producing bipolar plates
EP1298748A2 (fr) * 2001-09-26 2003-04-02 Dainippon Ink And Chemicals, Inc. Plaque bipolaire pour pile à combustible, procédé de fabrication de la plaque bipolaire et pile à combustible utilisant la plaque bipolaire
EP1298748A3 (fr) * 2001-09-26 2006-06-21 Dainippon Ink And Chemicals, Inc. Plaque bipolaire pour pile à combustible, procédé de fabrication de la plaque bipolaire et pile à combustible utilisant la plaque bipolaire
US7858696B2 (en) 2003-03-10 2010-12-28 Dic Corporation Conductive resin composition, process for production thereof, and fuel cell separators
US8674038B2 (en) 2007-09-27 2014-03-18 Nippon Skokubai Co., Ltd. Curable resin composition for molded bodies, molded body, and production method thereof

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AU1087599A (en) 1999-05-03
CN1282349A (zh) 2001-01-31
BR9814819A (pt) 2001-11-13
JP2001520245A (ja) 2001-10-30
AU757196B2 (en) 2003-02-06
NO20001925D0 (no) 2000-04-13
CA2306144A1 (fr) 1999-04-22
EP1023374A1 (fr) 2000-08-02
NO20001925L (no) 2000-06-13

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