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JPH0150249B2 - - Google Patents

Info

Publication number
JPH0150249B2
JPH0150249B2 JP56005173A JP517381A JPH0150249B2 JP H0150249 B2 JPH0150249 B2 JP H0150249B2 JP 56005173 A JP56005173 A JP 56005173A JP 517381 A JP517381 A JP 517381A JP H0150249 B2 JPH0150249 B2 JP H0150249B2
Authority
JP
Japan
Prior art keywords
epoxy resin
epoxy
curing
properties
electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56005173A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57119947A (en
Inventor
Hirotoshi Iketani
Akiko Hatanaka
Shuichi Suzuki
Moryasu Wada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP517381A priority Critical patent/JPS57119947A/ja
Publication of JPS57119947A publication Critical patent/JPS57119947A/ja
Publication of JPH0150249B2 publication Critical patent/JPH0150249B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Organic Insulating Materials (AREA)
JP517381A 1981-01-19 1981-01-19 Epoxy resin composition Granted JPS57119947A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP517381A JPS57119947A (en) 1981-01-19 1981-01-19 Epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP517381A JPS57119947A (en) 1981-01-19 1981-01-19 Epoxy resin composition

Publications (2)

Publication Number Publication Date
JPS57119947A JPS57119947A (en) 1982-07-26
JPH0150249B2 true JPH0150249B2 (fr) 1989-10-27

Family

ID=11603841

Family Applications (1)

Application Number Title Priority Date Filing Date
JP517381A Granted JPS57119947A (en) 1981-01-19 1981-01-19 Epoxy resin composition

Country Status (1)

Country Link
JP (1) JPS57119947A (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59227146A (ja) * 1983-06-07 1984-12-20 Sharp Corp 樹脂封止型半導体装置
JPS6086790A (ja) * 1983-10-18 1985-05-16 松下電器産業株式会社 可撓性発熱線
JPH0725994B2 (ja) * 1986-11-21 1995-03-22 株式会社東芝 半導体装置封止用エポキシ樹脂組成物
JP2014129475A (ja) * 2012-12-28 2014-07-10 Kyoritsu Kagaku Sangyo Kk 熱カチオン重合性組成物

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56130953A (en) * 1980-03-17 1981-10-14 Shin Etsu Chem Co Ltd Epoxy resin composition for sealing semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56130953A (en) * 1980-03-17 1981-10-14 Shin Etsu Chem Co Ltd Epoxy resin composition for sealing semiconductor device

Also Published As

Publication number Publication date
JPS57119947A (en) 1982-07-26

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