USD597966S1 - Memory heat sink - Google Patents
Memory heat sink Download PDFInfo
- Publication number
- USD597966S1 USD597966S1 US29/325,985 US32598508F USD597966S US D597966 S1 USD597966 S1 US D597966S1 US 32598508 F US32598508 F US 32598508F US D597966 S USD597966 S US D597966S
- Authority
- US
- United States
- Prior art keywords
- heat sink
- memory heat
- memory
- view
- ornamental design
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Description
Claims (1)
- The ornamental design for memory heat sink, as shown and described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/325,985 USD597966S1 (en) | 2008-10-09 | 2008-10-09 | Memory heat sink |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/325,985 USD597966S1 (en) | 2008-10-09 | 2008-10-09 | Memory heat sink |
Publications (1)
Publication Number | Publication Date |
---|---|
USD597966S1 true USD597966S1 (en) | 2009-08-11 |
Family
ID=40934643
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/325,985 Expired - Lifetime USD597966S1 (en) | 2008-10-09 | 2008-10-09 | Memory heat sink |
Country Status (1)
Country | Link |
---|---|
US (1) | USD597966S1 (en) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100243203A1 (en) * | 2009-03-24 | 2010-09-30 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Cooling device for add-on card |
USD657756S1 (en) * | 2011-10-17 | 2012-04-17 | Corsair Memory, Inc. | Low profile heat spreader for a computer memory module |
USD660810S1 (en) * | 2011-10-17 | 2012-05-29 | Corsair Memory, Inc. | Heat spreader with fins for a computer memory module |
USD689829S1 (en) * | 2013-01-02 | 2013-09-17 | Comptake Technology Inc. | Heat dissipating module of memory |
USD717251S1 (en) * | 2012-07-18 | 2014-11-11 | Corsair Memory, Inc. | Heat spreader with fins and top bar on a memory module |
USD717744S1 (en) * | 2013-08-30 | 2014-11-18 | Corsair Memory, Inc. | Heat spreader on a memory module |
USD842304S1 (en) * | 2017-12-21 | 2019-03-05 | Corsair Memory, Inc. | Memory module |
USD868069S1 (en) * | 2017-06-29 | 2019-11-26 | V-Color Technology Inc. | Memory device |
USD897345S1 (en) * | 2018-12-07 | 2020-09-29 | Sung-Yu Chen | Double-data-rate SDRAM card |
USD954061S1 (en) * | 2018-12-07 | 2022-06-07 | Sung-Yu Chen | Double-data-rate SDRAM card |
USD956706S1 (en) * | 2020-08-06 | 2022-07-05 | Essencore Limited | Heat sink for memory modules |
USD962880S1 (en) * | 2020-08-06 | 2022-09-06 | Essencore Limited | Heat sink for memory modules |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030026076A1 (en) * | 2001-08-06 | 2003-02-06 | Wen-Chen Wei | Memory heat sink device |
US7151668B1 (en) * | 2004-10-28 | 2006-12-19 | Muskin, Inc. | Memory heat sink |
US7221569B2 (en) * | 2004-09-15 | 2007-05-22 | Comptake Technology Co., Ltd. | Memory heat-dissipating device |
US20070165382A1 (en) * | 2006-01-16 | 2007-07-19 | Nanya Technology Corporation | Heat sink assembly |
US7365985B1 (en) * | 2004-09-29 | 2008-04-29 | Super Talent Electronics, Inc. | Memory module assembly including heat sink attached to integrated circuits by adhesive |
US7375964B2 (en) * | 2006-03-25 | 2008-05-20 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Memory module assembly including a clamp for mounting heat sinks thereon |
US7391613B2 (en) * | 2006-05-12 | 2008-06-24 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Memory module assembly including a clamp for mounting heat sinks thereon |
US7532477B2 (en) * | 2007-01-22 | 2009-05-12 | June-On Co., Ltd. | Memory module and heat sink arrangement |
US20090122481A1 (en) * | 2007-11-09 | 2009-05-14 | Chih-I Chang | Memory heat sink device provided with extra heat sink area |
-
2008
- 2008-10-09 US US29/325,985 patent/USD597966S1/en not_active Expired - Lifetime
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030026076A1 (en) * | 2001-08-06 | 2003-02-06 | Wen-Chen Wei | Memory heat sink device |
US7221569B2 (en) * | 2004-09-15 | 2007-05-22 | Comptake Technology Co., Ltd. | Memory heat-dissipating device |
US7365985B1 (en) * | 2004-09-29 | 2008-04-29 | Super Talent Electronics, Inc. | Memory module assembly including heat sink attached to integrated circuits by adhesive |
US7151668B1 (en) * | 2004-10-28 | 2006-12-19 | Muskin, Inc. | Memory heat sink |
US20070165382A1 (en) * | 2006-01-16 | 2007-07-19 | Nanya Technology Corporation | Heat sink assembly |
US7375964B2 (en) * | 2006-03-25 | 2008-05-20 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Memory module assembly including a clamp for mounting heat sinks thereon |
US7391613B2 (en) * | 2006-05-12 | 2008-06-24 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Memory module assembly including a clamp for mounting heat sinks thereon |
US7532477B2 (en) * | 2007-01-22 | 2009-05-12 | June-On Co., Ltd. | Memory module and heat sink arrangement |
US20090122481A1 (en) * | 2007-11-09 | 2009-05-14 | Chih-I Chang | Memory heat sink device provided with extra heat sink area |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100243203A1 (en) * | 2009-03-24 | 2010-09-30 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Cooling device for add-on card |
USD657756S1 (en) * | 2011-10-17 | 2012-04-17 | Corsair Memory, Inc. | Low profile heat spreader for a computer memory module |
USD660810S1 (en) * | 2011-10-17 | 2012-05-29 | Corsair Memory, Inc. | Heat spreader with fins for a computer memory module |
USD761744S1 (en) | 2012-07-18 | 2016-07-19 | Corsair Memory, Inc. | Heat spreader with fins and top bar on a memory module |
USD717251S1 (en) * | 2012-07-18 | 2014-11-11 | Corsair Memory, Inc. | Heat spreader with fins and top bar on a memory module |
USD689829S1 (en) * | 2013-01-02 | 2013-09-17 | Comptake Technology Inc. | Heat dissipating module of memory |
USD717744S1 (en) * | 2013-08-30 | 2014-11-18 | Corsair Memory, Inc. | Heat spreader on a memory module |
USD868069S1 (en) * | 2017-06-29 | 2019-11-26 | V-Color Technology Inc. | Memory device |
USD842304S1 (en) * | 2017-12-21 | 2019-03-05 | Corsair Memory, Inc. | Memory module |
USD897345S1 (en) * | 2018-12-07 | 2020-09-29 | Sung-Yu Chen | Double-data-rate SDRAM card |
USD954061S1 (en) * | 2018-12-07 | 2022-06-07 | Sung-Yu Chen | Double-data-rate SDRAM card |
USD956706S1 (en) * | 2020-08-06 | 2022-07-05 | Essencore Limited | Heat sink for memory modules |
USD962880S1 (en) * | 2020-08-06 | 2022-09-06 | Essencore Limited | Heat sink for memory modules |
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