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USD597966S1 - Memory heat sink - Google Patents

Memory heat sink Download PDF

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Publication number
USD597966S1
USD597966S1 US29/325,985 US32598508F USD597966S US D597966 S1 USD597966 S1 US D597966S1 US 32598508 F US32598508 F US 32598508F US D597966 S USD597966 S US D597966S
Authority
US
United States
Prior art keywords
heat sink
memory heat
memory
view
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/325,985
Inventor
Po-Wen Shih
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asustek Computer Inc
Original Assignee
Asustek Computer Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asustek Computer Inc filed Critical Asustek Computer Inc
Priority to US29/325,985 priority Critical patent/USD597966S1/en
Assigned to ASUSTEK COMPUTER INC. reassignment ASUSTEK COMPUTER INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SHIH, PO-WEN
Application granted granted Critical
Publication of USD597966S1 publication Critical patent/USD597966S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a perspective view of memory heat sink showing my new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a top view thereof; and,
FIG. 7 is a bottom view thereof.

Claims (1)

    CLAIM
  1. The ornamental design for memory heat sink, as shown and described.
US29/325,985 2008-10-09 2008-10-09 Memory heat sink Expired - Lifetime USD597966S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/325,985 USD597966S1 (en) 2008-10-09 2008-10-09 Memory heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/325,985 USD597966S1 (en) 2008-10-09 2008-10-09 Memory heat sink

Publications (1)

Publication Number Publication Date
USD597966S1 true USD597966S1 (en) 2009-08-11

Family

ID=40934643

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/325,985 Expired - Lifetime USD597966S1 (en) 2008-10-09 2008-10-09 Memory heat sink

Country Status (1)

Country Link
US (1) USD597966S1 (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100243203A1 (en) * 2009-03-24 2010-09-30 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Cooling device for add-on card
USD657756S1 (en) * 2011-10-17 2012-04-17 Corsair Memory, Inc. Low profile heat spreader for a computer memory module
USD660810S1 (en) * 2011-10-17 2012-05-29 Corsair Memory, Inc. Heat spreader with fins for a computer memory module
USD689829S1 (en) * 2013-01-02 2013-09-17 Comptake Technology Inc. Heat dissipating module of memory
USD717251S1 (en) * 2012-07-18 2014-11-11 Corsair Memory, Inc. Heat spreader with fins and top bar on a memory module
USD717744S1 (en) * 2013-08-30 2014-11-18 Corsair Memory, Inc. Heat spreader on a memory module
USD842304S1 (en) * 2017-12-21 2019-03-05 Corsair Memory, Inc. Memory module
USD868069S1 (en) * 2017-06-29 2019-11-26 V-Color Technology Inc. Memory device
USD897345S1 (en) * 2018-12-07 2020-09-29 Sung-Yu Chen Double-data-rate SDRAM card
USD954061S1 (en) * 2018-12-07 2022-06-07 Sung-Yu Chen Double-data-rate SDRAM card
USD956706S1 (en) * 2020-08-06 2022-07-05 Essencore Limited Heat sink for memory modules
USD962880S1 (en) * 2020-08-06 2022-09-06 Essencore Limited Heat sink for memory modules

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030026076A1 (en) * 2001-08-06 2003-02-06 Wen-Chen Wei Memory heat sink device
US7151668B1 (en) * 2004-10-28 2006-12-19 Muskin, Inc. Memory heat sink
US7221569B2 (en) * 2004-09-15 2007-05-22 Comptake Technology Co., Ltd. Memory heat-dissipating device
US20070165382A1 (en) * 2006-01-16 2007-07-19 Nanya Technology Corporation Heat sink assembly
US7365985B1 (en) * 2004-09-29 2008-04-29 Super Talent Electronics, Inc. Memory module assembly including heat sink attached to integrated circuits by adhesive
US7375964B2 (en) * 2006-03-25 2008-05-20 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Memory module assembly including a clamp for mounting heat sinks thereon
US7391613B2 (en) * 2006-05-12 2008-06-24 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Memory module assembly including a clamp for mounting heat sinks thereon
US7532477B2 (en) * 2007-01-22 2009-05-12 June-On Co., Ltd. Memory module and heat sink arrangement
US20090122481A1 (en) * 2007-11-09 2009-05-14 Chih-I Chang Memory heat sink device provided with extra heat sink area

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030026076A1 (en) * 2001-08-06 2003-02-06 Wen-Chen Wei Memory heat sink device
US7221569B2 (en) * 2004-09-15 2007-05-22 Comptake Technology Co., Ltd. Memory heat-dissipating device
US7365985B1 (en) * 2004-09-29 2008-04-29 Super Talent Electronics, Inc. Memory module assembly including heat sink attached to integrated circuits by adhesive
US7151668B1 (en) * 2004-10-28 2006-12-19 Muskin, Inc. Memory heat sink
US20070165382A1 (en) * 2006-01-16 2007-07-19 Nanya Technology Corporation Heat sink assembly
US7375964B2 (en) * 2006-03-25 2008-05-20 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Memory module assembly including a clamp for mounting heat sinks thereon
US7391613B2 (en) * 2006-05-12 2008-06-24 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Memory module assembly including a clamp for mounting heat sinks thereon
US7532477B2 (en) * 2007-01-22 2009-05-12 June-On Co., Ltd. Memory module and heat sink arrangement
US20090122481A1 (en) * 2007-11-09 2009-05-14 Chih-I Chang Memory heat sink device provided with extra heat sink area

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100243203A1 (en) * 2009-03-24 2010-09-30 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Cooling device for add-on card
USD657756S1 (en) * 2011-10-17 2012-04-17 Corsair Memory, Inc. Low profile heat spreader for a computer memory module
USD660810S1 (en) * 2011-10-17 2012-05-29 Corsair Memory, Inc. Heat spreader with fins for a computer memory module
USD761744S1 (en) 2012-07-18 2016-07-19 Corsair Memory, Inc. Heat spreader with fins and top bar on a memory module
USD717251S1 (en) * 2012-07-18 2014-11-11 Corsair Memory, Inc. Heat spreader with fins and top bar on a memory module
USD689829S1 (en) * 2013-01-02 2013-09-17 Comptake Technology Inc. Heat dissipating module of memory
USD717744S1 (en) * 2013-08-30 2014-11-18 Corsair Memory, Inc. Heat spreader on a memory module
USD868069S1 (en) * 2017-06-29 2019-11-26 V-Color Technology Inc. Memory device
USD842304S1 (en) * 2017-12-21 2019-03-05 Corsair Memory, Inc. Memory module
USD897345S1 (en) * 2018-12-07 2020-09-29 Sung-Yu Chen Double-data-rate SDRAM card
USD954061S1 (en) * 2018-12-07 2022-06-07 Sung-Yu Chen Double-data-rate SDRAM card
USD956706S1 (en) * 2020-08-06 2022-07-05 Essencore Limited Heat sink for memory modules
USD962880S1 (en) * 2020-08-06 2022-09-06 Essencore Limited Heat sink for memory modules

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