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USD573110S1 - Heat sink - Google Patents

Heat sink Download PDF

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Publication number
USD573110S1
USD573110S1 US29/282,736 US28273607F USD573110S US D573110 S1 USD573110 S1 US D573110S1 US 28273607 F US28273607 F US 28273607F US D573110 S USD573110 S US D573110S
Authority
US
United States
Prior art keywords
heat sink
view
ornamental design
elevation view
sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/282,736
Inventor
Takaya Otsuki
Takamasa Yamashita
Akira Hirakawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nidec Corp
Original Assignee
Nidec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nidec Corp filed Critical Nidec Corp
Priority to US29/282,736 priority Critical patent/USD573110S1/en
Assigned to NIDEC CORPORATION reassignment NIDEC CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HIRAKAWA, AKIRA, Otsuki, Takaya, YAMASHITA, TAKAMASA
Application granted granted Critical
Publication of USD573110S1 publication Critical patent/USD573110S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a front elevation view of a heat sink according to our new design;
FIG. 2 is a rear elevation view thereof;
FIG. 3 is a right side elevation view thereof;
FIG. 4 is a left side elevation view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a perspective view thereof; and,
FIG. 8 is another perspective view thereof.

Claims (1)

    CLAIM
  1. The ornamental design for a heat sink, as shown and described.
US29/282,736 2007-07-27 2007-07-27 Heat sink Expired - Lifetime USD573110S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/282,736 USD573110S1 (en) 2007-07-27 2007-07-27 Heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/282,736 USD573110S1 (en) 2007-07-27 2007-07-27 Heat sink

Publications (1)

Publication Number Publication Date
USD573110S1 true USD573110S1 (en) 2008-07-15

Family

ID=39597051

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/282,736 Expired - Lifetime USD573110S1 (en) 2007-07-27 2007-07-27 Heat sink

Country Status (1)

Country Link
US (1) USD573110S1 (en)

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD672322S1 (en) * 2011-12-28 2012-12-11 Foxsemicon Integrated Technology, Inc. Heat sink
USD672728S1 (en) * 2011-12-28 2012-12-18 Foxsemicon Integrated Technology, Inc. Heat sink
USD672730S1 (en) * 2012-03-13 2012-12-18 Foxsemicon Integrated Technology, Inc. Heat sink
USD698740S1 (en) * 2012-05-23 2014-02-04 Alpoint Technologies, LLC Heat sink
USD715748S1 (en) * 2013-11-26 2014-10-21 Heatscape, Inc. Inverted floating core heat sink
USD795821S1 (en) * 2016-02-22 2017-08-29 Heatscape.Com, Inc. Liquid cooling cold plate with diamond cut pin fins
USD800674S1 (en) * 2016-05-24 2017-10-24 Asetek Danmark A/S Cooling plate row for in-line memory
USD800675S1 (en) * 2016-05-24 2017-10-24 Asetek Danmark A/S Set of cooling plate rows for in-line memory
USD803169S1 (en) * 2016-02-22 2017-11-21 Heatscape.Com, Inc. Combined liquid cooling cold plate and vapor chamber
USD804434S1 (en) * 2016-06-15 2017-12-05 Adda Corp. Electronic component heatsink assembly
US9867315B2 (en) 2012-06-29 2018-01-09 Asetek Danmark A/S Server memory cooling apparatus
USD819579S1 (en) * 2016-07-22 2018-06-05 Tsung-Hsien Huang Heat sink
US10021811B2 (en) 2016-05-24 2018-07-10 Asetek Danmark A/S Single ended cooling module rows and assemblies for thermal management of in-line memory modules
USD833988S1 (en) * 2016-07-22 2018-11-20 Tsung-Hsien Huang Heat sink
USD924186S1 (en) * 2020-03-09 2021-07-06 Cambricon Technologies Corporation Limited Board card
US11924996B2 (en) 2020-09-30 2024-03-05 Coolit Systems, Inc. Liquid-cooling devices, and systems, to cool multi-chip modules

Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5519574A (en) 1994-01-20 1996-05-21 Sanyo Denki Co., Ltd. Electronic component cooling apparatus
US6269864B1 (en) * 2000-02-18 2001-08-07 Intel Corporation Parallel-plate/pin-fin hybrid copper heat sink for cooling high-powered microprocessors
US6411510B2 (en) 2000-02-08 2002-06-25 Sanyo Denki Co., Ltd. Heat sink-equipped cooling apparatus
US6470962B1 (en) * 2001-08-24 2002-10-29 Infortrend Technology Inc. Retaining tool of heat radiator
US6480383B2 (en) 2000-09-29 2002-11-12 Sanyo Denki Co., Ltd. Electronic component cooling apparatus
USD465462S1 (en) 2001-07-24 2002-11-12 Hsieh Hsin-Mao Base for a heat dissipating assembly
US6480387B1 (en) * 2002-03-14 2002-11-12 Hon Hai Precision Ind. Co., Ltd. Heat sink assembly
USD465771S1 (en) 2001-07-24 2002-11-19 Hsieh Hsin-Mao Heat dissipating assembly
USD474754S1 (en) 2002-07-15 2003-05-20 Delta Electronics Inc. Heat sink
US20030121643A1 (en) * 2002-01-03 2003-07-03 Connors Matthew Joseph Bi-level heat sink
US6621704B1 (en) * 2002-04-18 2003-09-16 Hon Hai Precision Ind. Co., Ltd. Clip for heat sink
USD481017S1 (en) 2002-09-13 2003-10-21 Delta Electronics Inc. Heat sink
US20050072558A1 (en) * 2003-10-03 2005-04-07 Aavid Thermalloy, Llc Heat sink assembly and connecting device
US6976525B2 (en) * 2004-02-24 2005-12-20 Asia Vital Component Co., Ltd. Fastening device for a radiator
US20060056159A1 (en) * 2004-09-10 2006-03-16 Foxconn Technology Co., Ltd. Locking device for heat sink
US20070074857A1 (en) * 2005-10-05 2007-04-05 Foxconn Technology Co., Ltd. Heat sink with heat pipes
US20070277957A1 (en) * 2006-06-02 2007-12-06 Hon Hai Precision Industry Co., Ltd. Heat sink

Patent Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5519574A (en) 1994-01-20 1996-05-21 Sanyo Denki Co., Ltd. Electronic component cooling apparatus
US6411510B2 (en) 2000-02-08 2002-06-25 Sanyo Denki Co., Ltd. Heat sink-equipped cooling apparatus
US6269864B1 (en) * 2000-02-18 2001-08-07 Intel Corporation Parallel-plate/pin-fin hybrid copper heat sink for cooling high-powered microprocessors
US6480383B2 (en) 2000-09-29 2002-11-12 Sanyo Denki Co., Ltd. Electronic component cooling apparatus
USD465462S1 (en) 2001-07-24 2002-11-12 Hsieh Hsin-Mao Base for a heat dissipating assembly
USD465771S1 (en) 2001-07-24 2002-11-19 Hsieh Hsin-Mao Heat dissipating assembly
US6470962B1 (en) * 2001-08-24 2002-10-29 Infortrend Technology Inc. Retaining tool of heat radiator
US20030121643A1 (en) * 2002-01-03 2003-07-03 Connors Matthew Joseph Bi-level heat sink
US6480387B1 (en) * 2002-03-14 2002-11-12 Hon Hai Precision Ind. Co., Ltd. Heat sink assembly
US6621704B1 (en) * 2002-04-18 2003-09-16 Hon Hai Precision Ind. Co., Ltd. Clip for heat sink
USD474754S1 (en) 2002-07-15 2003-05-20 Delta Electronics Inc. Heat sink
USD481017S1 (en) 2002-09-13 2003-10-21 Delta Electronics Inc. Heat sink
US20050072558A1 (en) * 2003-10-03 2005-04-07 Aavid Thermalloy, Llc Heat sink assembly and connecting device
US6976525B2 (en) * 2004-02-24 2005-12-20 Asia Vital Component Co., Ltd. Fastening device for a radiator
US20060056159A1 (en) * 2004-09-10 2006-03-16 Foxconn Technology Co., Ltd. Locking device for heat sink
US20070074857A1 (en) * 2005-10-05 2007-04-05 Foxconn Technology Co., Ltd. Heat sink with heat pipes
US20070277957A1 (en) * 2006-06-02 2007-12-06 Hon Hai Precision Industry Co., Ltd. Heat sink

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
"Weekly Ascii", Jun. 22, 2004, vol. 494, p. 156, published by Ascii Corporation, received by National Center for Industrial Property Information and Training on Jun. 8, 2004.
Official communication issued in the counterpart Japanese Application No. 2006-008877; mailed on Oct. 13, 2007.
Otsuki et al.; "Fan"; U.S. Appl. No. 29/249,373, filed Oct. 4, 2006.

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD717745S1 (en) * 2011-12-01 2014-11-18 Alpoint Technologies, LLC Heat sink
USD672728S1 (en) * 2011-12-28 2012-12-18 Foxsemicon Integrated Technology, Inc. Heat sink
USD672322S1 (en) * 2011-12-28 2012-12-11 Foxsemicon Integrated Technology, Inc. Heat sink
USD672730S1 (en) * 2012-03-13 2012-12-18 Foxsemicon Integrated Technology, Inc. Heat sink
USD698740S1 (en) * 2012-05-23 2014-02-04 Alpoint Technologies, LLC Heat sink
US9867315B2 (en) 2012-06-29 2018-01-09 Asetek Danmark A/S Server memory cooling apparatus
USD715748S1 (en) * 2013-11-26 2014-10-21 Heatscape, Inc. Inverted floating core heat sink
USD795821S1 (en) * 2016-02-22 2017-08-29 Heatscape.Com, Inc. Liquid cooling cold plate with diamond cut pin fins
USD829673S1 (en) * 2016-02-22 2018-10-02 Heatscape.Com, Inc. Combined liquid cooling cold plate and vapor chamber
USD803169S1 (en) * 2016-02-22 2017-11-21 Heatscape.Com, Inc. Combined liquid cooling cold plate and vapor chamber
USD800675S1 (en) * 2016-05-24 2017-10-24 Asetek Danmark A/S Set of cooling plate rows for in-line memory
US10021811B2 (en) 2016-05-24 2018-07-10 Asetek Danmark A/S Single ended cooling module rows and assemblies for thermal management of in-line memory modules
USD800674S1 (en) * 2016-05-24 2017-10-24 Asetek Danmark A/S Cooling plate row for in-line memory
USD804434S1 (en) * 2016-06-15 2017-12-05 Adda Corp. Electronic component heatsink assembly
USD819579S1 (en) * 2016-07-22 2018-06-05 Tsung-Hsien Huang Heat sink
USD833988S1 (en) * 2016-07-22 2018-11-20 Tsung-Hsien Huang Heat sink
USD924186S1 (en) * 2020-03-09 2021-07-06 Cambricon Technologies Corporation Limited Board card
US11924996B2 (en) 2020-09-30 2024-03-05 Coolit Systems, Inc. Liquid-cooling devices, and systems, to cool multi-chip modules
US12363857B2 (en) 2020-09-30 2025-07-15 Coolit Systems, Inc. Liquid-cooling devices, and systems, to cool multi-chip modules

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