USD573110S1 - Heat sink - Google Patents
Heat sink Download PDFInfo
- Publication number
- USD573110S1 USD573110S1 US29/282,736 US28273607F USD573110S US D573110 S1 USD573110 S1 US D573110S1 US 28273607 F US28273607 F US 28273607F US D573110 S USD573110 S US D573110S
- Authority
- US
- United States
- Prior art keywords
- heat sink
- view
- ornamental design
- elevation view
- sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Description
Claims (1)
- The ornamental design for a heat sink, as shown and described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/282,736 USD573110S1 (en) | 2007-07-27 | 2007-07-27 | Heat sink |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/282,736 USD573110S1 (en) | 2007-07-27 | 2007-07-27 | Heat sink |
Publications (1)
Publication Number | Publication Date |
---|---|
USD573110S1 true USD573110S1 (en) | 2008-07-15 |
Family
ID=39597051
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/282,736 Expired - Lifetime USD573110S1 (en) | 2007-07-27 | 2007-07-27 | Heat sink |
Country Status (1)
Country | Link |
---|---|
US (1) | USD573110S1 (en) |
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD672322S1 (en) * | 2011-12-28 | 2012-12-11 | Foxsemicon Integrated Technology, Inc. | Heat sink |
USD672728S1 (en) * | 2011-12-28 | 2012-12-18 | Foxsemicon Integrated Technology, Inc. | Heat sink |
USD672730S1 (en) * | 2012-03-13 | 2012-12-18 | Foxsemicon Integrated Technology, Inc. | Heat sink |
USD698740S1 (en) * | 2012-05-23 | 2014-02-04 | Alpoint Technologies, LLC | Heat sink |
USD715748S1 (en) * | 2013-11-26 | 2014-10-21 | Heatscape, Inc. | Inverted floating core heat sink |
USD795821S1 (en) * | 2016-02-22 | 2017-08-29 | Heatscape.Com, Inc. | Liquid cooling cold plate with diamond cut pin fins |
USD800674S1 (en) * | 2016-05-24 | 2017-10-24 | Asetek Danmark A/S | Cooling plate row for in-line memory |
USD800675S1 (en) * | 2016-05-24 | 2017-10-24 | Asetek Danmark A/S | Set of cooling plate rows for in-line memory |
USD803169S1 (en) * | 2016-02-22 | 2017-11-21 | Heatscape.Com, Inc. | Combined liquid cooling cold plate and vapor chamber |
USD804434S1 (en) * | 2016-06-15 | 2017-12-05 | Adda Corp. | Electronic component heatsink assembly |
US9867315B2 (en) | 2012-06-29 | 2018-01-09 | Asetek Danmark A/S | Server memory cooling apparatus |
USD819579S1 (en) * | 2016-07-22 | 2018-06-05 | Tsung-Hsien Huang | Heat sink |
US10021811B2 (en) | 2016-05-24 | 2018-07-10 | Asetek Danmark A/S | Single ended cooling module rows and assemblies for thermal management of in-line memory modules |
USD833988S1 (en) * | 2016-07-22 | 2018-11-20 | Tsung-Hsien Huang | Heat sink |
USD924186S1 (en) * | 2020-03-09 | 2021-07-06 | Cambricon Technologies Corporation Limited | Board card |
US11924996B2 (en) | 2020-09-30 | 2024-03-05 | Coolit Systems, Inc. | Liquid-cooling devices, and systems, to cool multi-chip modules |
Citations (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5519574A (en) | 1994-01-20 | 1996-05-21 | Sanyo Denki Co., Ltd. | Electronic component cooling apparatus |
US6269864B1 (en) * | 2000-02-18 | 2001-08-07 | Intel Corporation | Parallel-plate/pin-fin hybrid copper heat sink for cooling high-powered microprocessors |
US6411510B2 (en) | 2000-02-08 | 2002-06-25 | Sanyo Denki Co., Ltd. | Heat sink-equipped cooling apparatus |
US6470962B1 (en) * | 2001-08-24 | 2002-10-29 | Infortrend Technology Inc. | Retaining tool of heat radiator |
US6480383B2 (en) | 2000-09-29 | 2002-11-12 | Sanyo Denki Co., Ltd. | Electronic component cooling apparatus |
USD465462S1 (en) | 2001-07-24 | 2002-11-12 | Hsieh Hsin-Mao | Base for a heat dissipating assembly |
US6480387B1 (en) * | 2002-03-14 | 2002-11-12 | Hon Hai Precision Ind. Co., Ltd. | Heat sink assembly |
USD465771S1 (en) | 2001-07-24 | 2002-11-19 | Hsieh Hsin-Mao | Heat dissipating assembly |
USD474754S1 (en) | 2002-07-15 | 2003-05-20 | Delta Electronics Inc. | Heat sink |
US20030121643A1 (en) * | 2002-01-03 | 2003-07-03 | Connors Matthew Joseph | Bi-level heat sink |
US6621704B1 (en) * | 2002-04-18 | 2003-09-16 | Hon Hai Precision Ind. Co., Ltd. | Clip for heat sink |
USD481017S1 (en) | 2002-09-13 | 2003-10-21 | Delta Electronics Inc. | Heat sink |
US20050072558A1 (en) * | 2003-10-03 | 2005-04-07 | Aavid Thermalloy, Llc | Heat sink assembly and connecting device |
US6976525B2 (en) * | 2004-02-24 | 2005-12-20 | Asia Vital Component Co., Ltd. | Fastening device for a radiator |
US20060056159A1 (en) * | 2004-09-10 | 2006-03-16 | Foxconn Technology Co., Ltd. | Locking device for heat sink |
US20070074857A1 (en) * | 2005-10-05 | 2007-04-05 | Foxconn Technology Co., Ltd. | Heat sink with heat pipes |
US20070277957A1 (en) * | 2006-06-02 | 2007-12-06 | Hon Hai Precision Industry Co., Ltd. | Heat sink |
-
2007
- 2007-07-27 US US29/282,736 patent/USD573110S1/en not_active Expired - Lifetime
Patent Citations (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5519574A (en) | 1994-01-20 | 1996-05-21 | Sanyo Denki Co., Ltd. | Electronic component cooling apparatus |
US6411510B2 (en) | 2000-02-08 | 2002-06-25 | Sanyo Denki Co., Ltd. | Heat sink-equipped cooling apparatus |
US6269864B1 (en) * | 2000-02-18 | 2001-08-07 | Intel Corporation | Parallel-plate/pin-fin hybrid copper heat sink for cooling high-powered microprocessors |
US6480383B2 (en) | 2000-09-29 | 2002-11-12 | Sanyo Denki Co., Ltd. | Electronic component cooling apparatus |
USD465462S1 (en) | 2001-07-24 | 2002-11-12 | Hsieh Hsin-Mao | Base for a heat dissipating assembly |
USD465771S1 (en) | 2001-07-24 | 2002-11-19 | Hsieh Hsin-Mao | Heat dissipating assembly |
US6470962B1 (en) * | 2001-08-24 | 2002-10-29 | Infortrend Technology Inc. | Retaining tool of heat radiator |
US20030121643A1 (en) * | 2002-01-03 | 2003-07-03 | Connors Matthew Joseph | Bi-level heat sink |
US6480387B1 (en) * | 2002-03-14 | 2002-11-12 | Hon Hai Precision Ind. Co., Ltd. | Heat sink assembly |
US6621704B1 (en) * | 2002-04-18 | 2003-09-16 | Hon Hai Precision Ind. Co., Ltd. | Clip for heat sink |
USD474754S1 (en) | 2002-07-15 | 2003-05-20 | Delta Electronics Inc. | Heat sink |
USD481017S1 (en) | 2002-09-13 | 2003-10-21 | Delta Electronics Inc. | Heat sink |
US20050072558A1 (en) * | 2003-10-03 | 2005-04-07 | Aavid Thermalloy, Llc | Heat sink assembly and connecting device |
US6976525B2 (en) * | 2004-02-24 | 2005-12-20 | Asia Vital Component Co., Ltd. | Fastening device for a radiator |
US20060056159A1 (en) * | 2004-09-10 | 2006-03-16 | Foxconn Technology Co., Ltd. | Locking device for heat sink |
US20070074857A1 (en) * | 2005-10-05 | 2007-04-05 | Foxconn Technology Co., Ltd. | Heat sink with heat pipes |
US20070277957A1 (en) * | 2006-06-02 | 2007-12-06 | Hon Hai Precision Industry Co., Ltd. | Heat sink |
Non-Patent Citations (3)
Title |
---|
"Weekly Ascii", Jun. 22, 2004, vol. 494, p. 156, published by Ascii Corporation, received by National Center for Industrial Property Information and Training on Jun. 8, 2004. |
Official communication issued in the counterpart Japanese Application No. 2006-008877; mailed on Oct. 13, 2007. |
Otsuki et al.; "Fan"; U.S. Appl. No. 29/249,373, filed Oct. 4, 2006. |
Cited By (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD717745S1 (en) * | 2011-12-01 | 2014-11-18 | Alpoint Technologies, LLC | Heat sink |
USD672728S1 (en) * | 2011-12-28 | 2012-12-18 | Foxsemicon Integrated Technology, Inc. | Heat sink |
USD672322S1 (en) * | 2011-12-28 | 2012-12-11 | Foxsemicon Integrated Technology, Inc. | Heat sink |
USD672730S1 (en) * | 2012-03-13 | 2012-12-18 | Foxsemicon Integrated Technology, Inc. | Heat sink |
USD698740S1 (en) * | 2012-05-23 | 2014-02-04 | Alpoint Technologies, LLC | Heat sink |
US9867315B2 (en) | 2012-06-29 | 2018-01-09 | Asetek Danmark A/S | Server memory cooling apparatus |
USD715748S1 (en) * | 2013-11-26 | 2014-10-21 | Heatscape, Inc. | Inverted floating core heat sink |
USD795821S1 (en) * | 2016-02-22 | 2017-08-29 | Heatscape.Com, Inc. | Liquid cooling cold plate with diamond cut pin fins |
USD829673S1 (en) * | 2016-02-22 | 2018-10-02 | Heatscape.Com, Inc. | Combined liquid cooling cold plate and vapor chamber |
USD803169S1 (en) * | 2016-02-22 | 2017-11-21 | Heatscape.Com, Inc. | Combined liquid cooling cold plate and vapor chamber |
USD800675S1 (en) * | 2016-05-24 | 2017-10-24 | Asetek Danmark A/S | Set of cooling plate rows for in-line memory |
US10021811B2 (en) | 2016-05-24 | 2018-07-10 | Asetek Danmark A/S | Single ended cooling module rows and assemblies for thermal management of in-line memory modules |
USD800674S1 (en) * | 2016-05-24 | 2017-10-24 | Asetek Danmark A/S | Cooling plate row for in-line memory |
USD804434S1 (en) * | 2016-06-15 | 2017-12-05 | Adda Corp. | Electronic component heatsink assembly |
USD819579S1 (en) * | 2016-07-22 | 2018-06-05 | Tsung-Hsien Huang | Heat sink |
USD833988S1 (en) * | 2016-07-22 | 2018-11-20 | Tsung-Hsien Huang | Heat sink |
USD924186S1 (en) * | 2020-03-09 | 2021-07-06 | Cambricon Technologies Corporation Limited | Board card |
US11924996B2 (en) | 2020-09-30 | 2024-03-05 | Coolit Systems, Inc. | Liquid-cooling devices, and systems, to cool multi-chip modules |
US12363857B2 (en) | 2020-09-30 | 2025-07-15 | Coolit Systems, Inc. | Liquid-cooling devices, and systems, to cool multi-chip modules |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
USD573110S1 (en) | Heat sink | |
USD593512S1 (en) | Heat sink | |
USD561711S1 (en) | Heat sink | |
USD568829S1 (en) | Heat sink | |
USD569841S1 (en) | Ear-microphone | |
USD576385S1 (en) | Shoe | |
USD578536S1 (en) | Chip | |
USD579421S1 (en) | Heat sink | |
USD579019S1 (en) | Chip | |
USD582359S1 (en) | Heat dissipator | |
USD586763S1 (en) | Heat dissipation device | |
USD597966S1 (en) | Memory heat sink | |
USD575380S1 (en) | Sink | |
USD573109S1 (en) | Heat sink | |
USD579423S1 (en) | Heat sink | |
USD573701S1 (en) | Kitchen sink | |
USD567772S1 (en) | Heat sink | |
USD574938S1 (en) | Heat exchanger | |
USD615503S1 (en) | Heat sink | |
USD575379S1 (en) | Sink | |
USD564460S1 (en) | Heat sink fan | |
USD561123S1 (en) | Heat sink | |
USD585118S1 (en) | Sink | |
USD575856S1 (en) | Sink | |
USD570472S1 (en) | Impeller |