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USD573109S1 - Heat sink - Google Patents

Heat sink Download PDF

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Publication number
USD573109S1
USD573109S1 US29/282,037 US28203707F USD573109S US D573109 S1 USD573109 S1 US D573109S1 US 28203707 F US28203707 F US 28203707F US D573109 S USD573109 S US D573109S
Authority
US
United States
Prior art keywords
heat sink
view
elevational view
ornamental design
same
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/282,037
Inventor
Masataka Mochizuki
Thang Nguyen
Roj Tacomkang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikura Ltd
Original Assignee
Fujikura Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikura Ltd filed Critical Fujikura Ltd
Priority to US29/282,037 priority Critical patent/USD573109S1/en
Assigned to FUJIKURA LTD. reassignment FUJIKURA LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MOCHIZUKI, MASATAKA, TACOMKANG, ROJ, NGUYEN, THANG
Application granted granted Critical
Publication of USD573109S1 publication Critical patent/USD573109S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a perspective view of the top, front and left side of a heat sink showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a right elevational view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof; and,
FIG. 6 is a exploded view thereof.
A rear elevational view is the same as the front elevational view.
A left elevational view is the same as the right elevational view.

Claims (1)

    CLAIM
  1. The ornamental design for a heat sink, as shown and described.
US29/282,037 2007-07-10 2007-07-10 Heat sink Expired - Lifetime USD573109S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/282,037 USD573109S1 (en) 2007-07-10 2007-07-10 Heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/282,037 USD573109S1 (en) 2007-07-10 2007-07-10 Heat sink

Publications (1)

Publication Number Publication Date
USD573109S1 true USD573109S1 (en) 2008-07-15

Family

ID=39597050

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/282,037 Expired - Lifetime USD573109S1 (en) 2007-07-10 2007-07-10 Heat sink

Country Status (1)

Country Link
US (1) USD573109S1 (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD587217S1 (en) * 2007-12-30 2009-02-24 Zalman Tech Co., Ltd. Radiator for a graphics card chipset
USD593511S1 (en) * 2008-07-18 2009-06-02 Foxconn Technology Co., Ltd. Heat dissipation device
USD597498S1 (en) * 2008-07-18 2009-08-04 Foxconn Technology Co., Ltd. Heat dissipation device
US20100051231A1 (en) * 2008-08-26 2010-03-04 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation apparatus having a heat pipe inserted therein
US20100051232A1 (en) * 2008-08-27 2010-03-04 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation apparatus incorporating a fan
US20100073878A1 (en) * 2008-09-24 2010-03-25 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation apparatus
US20100230074A1 (en) * 2009-03-13 2010-09-16 Hong Fu Jin Precision Industry (Shenzhen) Co. Ltd. Heat dissipation apparatus
US20110083830A1 (en) * 2009-10-12 2011-04-14 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
USD660256S1 (en) * 2011-02-25 2012-05-22 Zalman Tech Co., Ltd. Radiator for an electronic device
USD677636S1 (en) * 2011-11-23 2013-03-12 Zaonzi Co., Ltd. Heat-dissipating radiators for electronic apparatus

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060061970A1 (en) * 2004-09-20 2006-03-23 Zalman Tech Co., Ltd. Heatsink
US20060082972A1 (en) * 2004-10-20 2006-04-20 Kyoung-Ho Kim Heat radiating apparatus
US20060219386A1 (en) * 2005-04-01 2006-10-05 Delta Electronics, Inc. Heat dissipating assembly with composite heat dissipating structure
USD541757S1 (en) * 2005-12-19 2007-05-01 Zalman Tech Co., Ltd. Radiator for electronic parts
USD561711S1 (en) * 2006-12-08 2008-02-12 Thermaltake Technology Co., Ltd. Heat sink

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060061970A1 (en) * 2004-09-20 2006-03-23 Zalman Tech Co., Ltd. Heatsink
US20060082972A1 (en) * 2004-10-20 2006-04-20 Kyoung-Ho Kim Heat radiating apparatus
US20060219386A1 (en) * 2005-04-01 2006-10-05 Delta Electronics, Inc. Heat dissipating assembly with composite heat dissipating structure
USD541757S1 (en) * 2005-12-19 2007-05-01 Zalman Tech Co., Ltd. Radiator for electronic parts
USD561711S1 (en) * 2006-12-08 2008-02-12 Thermaltake Technology Co., Ltd. Heat sink

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD587217S1 (en) * 2007-12-30 2009-02-24 Zalman Tech Co., Ltd. Radiator for a graphics card chipset
USD593511S1 (en) * 2008-07-18 2009-06-02 Foxconn Technology Co., Ltd. Heat dissipation device
USD597498S1 (en) * 2008-07-18 2009-08-04 Foxconn Technology Co., Ltd. Heat dissipation device
US20100051231A1 (en) * 2008-08-26 2010-03-04 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation apparatus having a heat pipe inserted therein
US20100051232A1 (en) * 2008-08-27 2010-03-04 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation apparatus incorporating a fan
US20100073878A1 (en) * 2008-09-24 2010-03-25 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation apparatus
US20100230074A1 (en) * 2009-03-13 2010-09-16 Hong Fu Jin Precision Industry (Shenzhen) Co. Ltd. Heat dissipation apparatus
US20110083830A1 (en) * 2009-10-12 2011-04-14 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US8430153B2 (en) * 2009-10-12 2013-04-30 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device having heat sink enclosing conductive member therein
USD660256S1 (en) * 2011-02-25 2012-05-22 Zalman Tech Co., Ltd. Radiator for an electronic device
USD677636S1 (en) * 2011-11-23 2013-03-12 Zaonzi Co., Ltd. Heat-dissipating radiators for electronic apparatus

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