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USD956706S1 - Heat sink for memory modules - Google Patents

Heat sink for memory modules Download PDF

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Publication number
USD956706S1
USD956706S1 US29/745,476 US202029745476F USD956706S US D956706 S1 USD956706 S1 US D956706S1 US 202029745476 F US202029745476 F US 202029745476F US D956706 S USD956706 S US D956706S
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US
United States
Prior art keywords
heat sink
memory modules
modules
memory
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/745,476
Inventor
Young Suk Chung
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Essencore Ltd
Original Assignee
Essencore Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Priority to US29/745,476 priority Critical patent/USD956706S1/en
Assigned to ESSENCORE LIMITED reassignment ESSENCORE LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHUNG, YOUNG SUK
Application granted granted Critical
Publication of USD956706S1 publication Critical patent/USD956706S1/en
Active legal-status Critical Current
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Description

FIG. 1 is a top, front perspective view of the heat sink for memory modules;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a top view thereof; and,
FIG. 7 is a bottom view thereof.

Claims (1)

    CLAIM
  1. The ornamental design for a heat sink for memory modules, as shown and described.
US29/745,476 2020-08-06 2020-08-06 Heat sink for memory modules Active USD956706S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/745,476 USD956706S1 (en) 2020-08-06 2020-08-06 Heat sink for memory modules

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/745,476 USD956706S1 (en) 2020-08-06 2020-08-06 Heat sink for memory modules

Publications (1)

Publication Number Publication Date
USD956706S1 true USD956706S1 (en) 2022-07-05

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US29/745,476 Active USD956706S1 (en) 2020-08-06 2020-08-06 Heat sink for memory modules

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US (1) USD956706S1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD964947S1 (en) * 2021-06-03 2022-09-27 Kingston Digital, Inc. Heat sink for memory module
USD1035597S1 (en) * 2022-12-15 2024-07-16 Kingston Digital, Inc. Heat sink for memory module
USD1066274S1 (en) * 2021-11-02 2025-03-11 Kingston Digital, Inc. Heat sink for memory module

Citations (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6377460B1 (en) * 1999-05-27 2002-04-23 Infineon Technologies Ag Electronic circuit having a flexible intermediate layer between electronic components and a heat sink
US20030011993A1 (en) * 2001-06-28 2003-01-16 Intel Corporation Heat transfer apparatus
US20030026076A1 (en) * 2001-08-06 2003-02-06 Wen-Chen Wei Memory heat sink device
USD531965S1 (en) * 2004-10-28 2006-11-14 Mushkin, Inc. Memory card heat sink
US20060268523A1 (en) * 2005-05-31 2006-11-30 Akust Technology Co., Ltd. Heat sink for memory
US7215551B2 (en) * 2004-09-29 2007-05-08 Super Talent Electronics, Inc. Memory module assembly including heat sink attached to integrated circuits by adhesive
US7312996B2 (en) * 2005-03-14 2007-12-25 Wan Chien Chang Heat sink for memory strips
US7457122B2 (en) * 2006-02-22 2008-11-25 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Memory module assembly including a clip for mounting a heat sink thereon
US20090034183A1 (en) * 2007-08-01 2009-02-05 Comptake Technology Co., Ltd. Cooling device for memory chips
US20090122481A1 (en) * 2007-11-09 2009-05-14 Chih-I Chang Memory heat sink device provided with extra heat sink area
US20090190304A1 (en) * 2008-01-29 2009-07-30 Meyer Iv George Anthony Cooling device for memory module
USD597966S1 (en) * 2008-10-09 2009-08-11 Asustek Computer Inc. Memory heat sink
US20090294099A1 (en) * 2008-05-30 2009-12-03 Comptake Technology Inc. Heat dispensing unit for memory chip
US7715197B2 (en) * 2008-06-05 2010-05-11 International Business Machines Corporation Coined-sheet-metal heatsinks for closely packaged heat-producing devices such as dual in-line memory modules (DIMMs)
US7738252B2 (en) * 2006-01-09 2010-06-15 Ocz Technology, Group, Inc. Method and apparatus for thermal management of computer memory modules
USD626521S1 (en) * 2010-03-23 2010-11-02 Comptake Technology Inc. Heat-dissipating device for memory
US20110088870A1 (en) * 2009-10-16 2011-04-21 Wen-Yi Lee Memory Heatsink Set With Supplementary Retaining Devices
US8411443B2 (en) * 2011-01-21 2013-04-02 Comptake Technology Inc. Slidingly-engaged heat-dissipating assembly for memory and memory device having the same
US20130186595A1 (en) * 2012-01-20 2013-07-25 Ming-Yang Hsieh Heat sink clip and method for forming the same
USD689829S1 (en) * 2013-01-02 2013-09-17 Comptake Technology Inc. Heat dissipating module of memory
US20140202675A1 (en) * 2013-01-22 2014-07-24 Comptake Technology Inc. Heat dissipation unit used in memory device
USD793400S1 (en) * 2016-05-09 2017-08-01 Kingston Digital, Inc. Heat sink for memory module
US10667431B1 (en) * 2019-04-29 2020-05-26 Hewlett Packard Enterprise Development Lp Memory module cooling

Patent Citations (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6377460B1 (en) * 1999-05-27 2002-04-23 Infineon Technologies Ag Electronic circuit having a flexible intermediate layer between electronic components and a heat sink
US20030011993A1 (en) * 2001-06-28 2003-01-16 Intel Corporation Heat transfer apparatus
US20030026076A1 (en) * 2001-08-06 2003-02-06 Wen-Chen Wei Memory heat sink device
US7215551B2 (en) * 2004-09-29 2007-05-08 Super Talent Electronics, Inc. Memory module assembly including heat sink attached to integrated circuits by adhesive
USD531965S1 (en) * 2004-10-28 2006-11-14 Mushkin, Inc. Memory card heat sink
US7312996B2 (en) * 2005-03-14 2007-12-25 Wan Chien Chang Heat sink for memory strips
US20060268523A1 (en) * 2005-05-31 2006-11-30 Akust Technology Co., Ltd. Heat sink for memory
US7738252B2 (en) * 2006-01-09 2010-06-15 Ocz Technology, Group, Inc. Method and apparatus for thermal management of computer memory modules
US7457122B2 (en) * 2006-02-22 2008-11-25 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Memory module assembly including a clip for mounting a heat sink thereon
US20090034183A1 (en) * 2007-08-01 2009-02-05 Comptake Technology Co., Ltd. Cooling device for memory chips
US20090122481A1 (en) * 2007-11-09 2009-05-14 Chih-I Chang Memory heat sink device provided with extra heat sink area
US20090190304A1 (en) * 2008-01-29 2009-07-30 Meyer Iv George Anthony Cooling device for memory module
US20090294099A1 (en) * 2008-05-30 2009-12-03 Comptake Technology Inc. Heat dispensing unit for memory chip
US7715197B2 (en) * 2008-06-05 2010-05-11 International Business Machines Corporation Coined-sheet-metal heatsinks for closely packaged heat-producing devices such as dual in-line memory modules (DIMMs)
USD597966S1 (en) * 2008-10-09 2009-08-11 Asustek Computer Inc. Memory heat sink
US20110088870A1 (en) * 2009-10-16 2011-04-21 Wen-Yi Lee Memory Heatsink Set With Supplementary Retaining Devices
USD626521S1 (en) * 2010-03-23 2010-11-02 Comptake Technology Inc. Heat-dissipating device for memory
US8411443B2 (en) * 2011-01-21 2013-04-02 Comptake Technology Inc. Slidingly-engaged heat-dissipating assembly for memory and memory device having the same
US20130186595A1 (en) * 2012-01-20 2013-07-25 Ming-Yang Hsieh Heat sink clip and method for forming the same
USD689829S1 (en) * 2013-01-02 2013-09-17 Comptake Technology Inc. Heat dissipating module of memory
US20140202675A1 (en) * 2013-01-22 2014-07-24 Comptake Technology Inc. Heat dissipation unit used in memory device
USD793400S1 (en) * 2016-05-09 2017-08-01 Kingston Digital, Inc. Heat sink for memory module
US10667431B1 (en) * 2019-04-29 2020-05-26 Hewlett Packard Enterprise Development Lp Memory module cooling

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD964947S1 (en) * 2021-06-03 2022-09-27 Kingston Digital, Inc. Heat sink for memory module
USD1066274S1 (en) * 2021-11-02 2025-03-11 Kingston Digital, Inc. Heat sink for memory module
USD1035597S1 (en) * 2022-12-15 2024-07-16 Kingston Digital, Inc. Heat sink for memory module

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