USD1054388S1 - Carrier substrate for handling - Google Patents
Carrier substrate for handling Download PDFInfo
- Publication number
- USD1054388S1 USD1054388S1 US29/835,098 US202229835098F USD1054388S US D1054388 S1 USD1054388 S1 US D1054388S1 US 202229835098 F US202229835098 F US 202229835098F US D1054388 S USD1054388 S US D1054388S
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- US
- United States
- Prior art keywords
- handling
- carrier substrate
- view
- elevational view
- encircled portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
The evenly-spaced broken lines depict parts of the carrier substrate for handling that form no part of the claimed design. The dot-dash broken lines depict boundaries of the enlarged portion views shown in FIGS. 1, 2, 4, 7-11, 14, 17, and 18 , and form no part of the claimed design.
Claims (1)
- The ornamental design for a carrier substrate for handling as shown and described.
Applications Claiming Priority (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021-022499D | 2021-10-15 | ||
JP2021022501F JP1727916S (en) | 2021-10-15 | 2021-10-15 | Carrier substrate for handling |
JP2021022502F JP1724481S (en) | 2021-10-15 | 2021-10-15 | Carrier substrate for handling |
JP2021022499F JP1718604S (en) | 2021-10-15 | 2021-10-15 | Carrier board for handling |
JP2021-022497D | 2021-10-15 | ||
JP2021022497F JP1724567S (en) | 2021-10-15 | 2021-10-15 | Carrier substrate for handling |
JP2021-022498D | 2021-10-15 | ||
JP2021-022501D | 2021-10-15 | ||
JP2021-022502D | 2021-10-15 | ||
JP2021022498F JP1718541S (en) | 2021-10-15 | 2021-10-15 | Carrier board for handling |
Publications (1)
Publication Number | Publication Date |
---|---|
USD1054388S1 true USD1054388S1 (en) | 2024-12-17 |
Family
ID=93841431
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/835,098 Active USD1054388S1 (en) | 2021-10-15 | 2022-04-15 | Carrier substrate for handling |
Country Status (1)
Country | Link |
---|---|
US (1) | USD1054388S1 (en) |
Citations (47)
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USD589474S1 (en) * | 2007-06-06 | 2009-03-31 | Tokyo Electron Limited | Wafer holding member |
USD589912S1 (en) * | 2007-06-06 | 2009-04-07 | Tokyo Electron Limited | Wafer holding member |
USD609652S1 (en) * | 2008-07-22 | 2010-02-09 | Tokyo Electron Limited | Wafer attracting plate |
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USD716742S1 (en) * | 2013-09-13 | 2014-11-04 | Asm Ip Holding B.V. | Substrate supporter for semiconductor deposition apparatus |
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USD723077S1 (en) * | 2013-12-03 | 2015-02-24 | Applied Materials, Inc. | Chuck carrier film |
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USD753269S1 (en) * | 2015-01-09 | 2016-04-05 | Asm Ip Holding B.V. | Top plate |
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USD789888S1 (en) * | 2016-01-08 | 2017-06-20 | Asm Ip Holding B.V. | Electrode plate for semiconductor manufacturing apparatus |
USD793971S1 (en) * | 2015-03-27 | 2017-08-08 | Veeco Instruments Inc. | Wafer carrier with a 14-pocket configuration |
USD797067S1 (en) * | 2015-04-21 | 2017-09-12 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD830981S1 (en) * | 2017-04-07 | 2018-10-16 | Asm Ip Holding B.V. | Susceptor for semiconductor substrate processing apparatus |
USD849422S1 (en) * | 2014-12-17 | 2019-05-28 | Ngk Insulators, Ltd. | Composite substrate for acoustic wave device |
TWI689017B (en) | 2013-09-25 | 2020-03-21 | 新加坡商史達晶片有限公司 | Semiconductor device and method of controlling warpage in reconstituted wafer |
WO2020166184A1 (en) | 2019-02-12 | 2020-08-20 | 信越化学工業株式会社 | Microstructure transfer device, stamp head unit, stamp component for microstructure transfer, and method for transferring microstructure integrated component |
TWD208179S (en) | 2019-08-07 | 2020-11-11 | 日商國際電氣股份有限公司 | Part of wafer boat for substrate processing equipment |
USD908645S1 (en) * | 2019-08-26 | 2021-01-26 | Applied Materials, Inc. | Sputtering target for a physical vapor deposition chamber |
USD924823S1 (en) * | 2018-07-19 | 2021-07-13 | Kokusai Electric Corporation | Adiabatic plate for substrate processing apparatus |
USD937329S1 (en) * | 2020-03-23 | 2021-11-30 | Applied Materials, Inc. | Sputter target for a physical vapor deposition chamber |
USD947802S1 (en) * | 2020-05-20 | 2022-04-05 | Applied Materials, Inc. | Replaceable substrate carrier interfacing film |
USD958094S1 (en) * | 2019-07-29 | 2022-07-19 | Samsung Display Co., Ltd. | Display panel |
USD966276S1 (en) * | 2019-07-29 | 2022-10-11 | Samsung Display Co., Ltd. | Display module for wearable device |
USD981970S1 (en) * | 2021-03-04 | 2023-03-28 | Kokusai Electric Corporation | Substrate mounting plate for substrate processing apparatus |
USD981972S1 (en) * | 2021-03-22 | 2023-03-28 | Kokusai Electric Corporation | Adiabatic plate for substrate processing appratus |
US11629407B2 (en) * | 2019-02-22 | 2023-04-18 | Asm Ip Holding B.V. | Substrate processing apparatus and method for processing substrates |
USD984972S1 (en) * | 2021-03-29 | 2023-05-02 | Beijing Naura Microelectronics Equipment Co., Ltd. | Electrostatic chuck for semiconductor manufacture |
US11664267B2 (en) * | 2019-07-10 | 2023-05-30 | Asm Ip Holding B.V. | Substrate support assembly and substrate processing device including the same |
-
2022
- 2022-04-15 US US29/835,098 patent/USD1054388S1/en active Active
Patent Citations (50)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6815352B1 (en) * | 1999-11-09 | 2004-11-09 | Shin-Etsu Chemical Co., Ltd. | Silicon focus ring and method for producing the same |
US7943491B2 (en) | 2004-06-04 | 2011-05-17 | The Board Of Trustees Of The University Of Illinois | Pattern transfer printing by kinetic control of adhesion to an elastomeric stamp |
JP2006310616A (en) | 2005-04-28 | 2006-11-09 | Shin Etsu Polymer Co Ltd | Manufacturing method of stationary carrier |
USD559805S1 (en) * | 2005-08-12 | 2008-01-15 | Tokyo Electron Limited | Stage arm for a semiconductor wafer delivery apparatus |
USD544452S1 (en) * | 2005-09-08 | 2007-06-12 | Tokyo Ohka Kogyo Co., Ltd. | Supporting plate |
USD552565S1 (en) * | 2005-09-08 | 2007-10-09 | Tokyo Ohka Kogyo Co., Ltd. | Supporting plate |
USD583394S1 (en) * | 2006-12-15 | 2008-12-23 | Tokyo Electron Limited | Cover for a heater stage of a plasma processing apparatus |
US8690135B2 (en) * | 2006-12-18 | 2014-04-08 | Camtek Ltd. | Chuck and a method for supporting an object |
JP2008227107A (en) | 2007-03-12 | 2008-09-25 | Yokohama National Univ | Method for moving microstructure |
US8389320B2 (en) * | 2007-03-20 | 2013-03-05 | Sanyo Electric Co., Ltd. | Method for fracturing semiconductor substrate, method for fracturing solar cell, and the solar cell |
USD589912S1 (en) * | 2007-06-06 | 2009-04-07 | Tokyo Electron Limited | Wafer holding member |
USD589474S1 (en) * | 2007-06-06 | 2009-03-31 | Tokyo Electron Limited | Wafer holding member |
USD614593S1 (en) * | 2008-07-21 | 2010-04-27 | Asm Genitech Korea Ltd | Substrate support for a semiconductor deposition apparatus |
USD609652S1 (en) * | 2008-07-22 | 2010-02-09 | Tokyo Electron Limited | Wafer attracting plate |
US20100108500A1 (en) * | 2008-10-31 | 2010-05-06 | Applied Materials, Inc. | Encapsulated sputtering target |
US8555492B2 (en) * | 2009-12-30 | 2013-10-15 | Harvatek Corporation | Method for manufacturing a conductive substrate structure with conductive channels formed by using a two-sided cut approach |
USD674759S1 (en) * | 2010-08-19 | 2013-01-22 | Epistar Corporation | Wafer carrier |
USD704155S1 (en) * | 2010-08-19 | 2014-05-06 | Epistar Corporation | Wafer carrier |
USD654884S1 (en) * | 2010-10-21 | 2012-02-28 | Tokyo Electron Limited | Top plate for reactor for manufacturing semiconductor |
USD654883S1 (en) * | 2010-10-21 | 2012-02-28 | Tokyo Electron Limited | Top plate for reactor for manufacturing semiconductor |
US8551864B2 (en) * | 2011-03-25 | 2013-10-08 | Sumitomo Electric Industries, Ltd. | Method of manufacturing semiconductor device |
USD684551S1 (en) * | 2011-07-07 | 2013-06-18 | Phuong Van Nguyen | Wafer polishing pad holder |
USD708651S1 (en) * | 2011-11-22 | 2014-07-08 | Applied Materials, Inc. | Electrostatic chuck |
USD716742S1 (en) * | 2013-09-13 | 2014-11-04 | Asm Ip Holding B.V. | Substrate supporter for semiconductor deposition apparatus |
USD724553S1 (en) * | 2013-09-13 | 2015-03-17 | Asm Ip Holding B.V. | Substrate supporter for semiconductor deposition apparatus |
TWI689017B (en) | 2013-09-25 | 2020-03-21 | 新加坡商史達晶片有限公司 | Semiconductor device and method of controlling warpage in reconstituted wafer |
USD723077S1 (en) * | 2013-12-03 | 2015-02-24 | Applied Materials, Inc. | Chuck carrier film |
USD720313S1 (en) * | 2014-06-16 | 2014-12-30 | Emcore Solar Power, Inc. | Semiconductor wafer with dicing positions for solar cell fabrication |
TWD178145S (en) | 2014-12-17 | 2016-09-11 | 日本碍子股份有限公司 | Composite substrates |
USD849422S1 (en) * | 2014-12-17 | 2019-05-28 | Ngk Insulators, Ltd. | Composite substrate for acoustic wave device |
USD753269S1 (en) * | 2015-01-09 | 2016-04-05 | Asm Ip Holding B.V. | Top plate |
USD793971S1 (en) * | 2015-03-27 | 2017-08-08 | Veeco Instruments Inc. | Wafer carrier with a 14-pocket configuration |
USD797067S1 (en) * | 2015-04-21 | 2017-09-12 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD789888S1 (en) * | 2016-01-08 | 2017-06-20 | Asm Ip Holding B.V. | Electrode plate for semiconductor manufacturing apparatus |
USD830981S1 (en) * | 2017-04-07 | 2018-10-16 | Asm Ip Holding B.V. | Susceptor for semiconductor substrate processing apparatus |
USD924823S1 (en) * | 2018-07-19 | 2021-07-13 | Kokusai Electric Corporation | Adiabatic plate for substrate processing apparatus |
US20220124949A1 (en) | 2019-02-12 | 2022-04-21 | Shin-Etsu Chemical Co., Ltd. | Microstructure-transfer apparatus, stamp head unit, stamp component for transferring microstructure, and method for transferring microstructure-integrated component |
JP2020129638A (en) | 2019-02-12 | 2020-08-27 | 信越化学工業株式会社 | Microstructure transfer device, stamp head unit, microstructure transfer stamp part, and microstructure integrated part transfer method |
WO2020166184A1 (en) | 2019-02-12 | 2020-08-20 | 信越化学工業株式会社 | Microstructure transfer device, stamp head unit, stamp component for microstructure transfer, and method for transferring microstructure integrated component |
US11629407B2 (en) * | 2019-02-22 | 2023-04-18 | Asm Ip Holding B.V. | Substrate processing apparatus and method for processing substrates |
US11664267B2 (en) * | 2019-07-10 | 2023-05-30 | Asm Ip Holding B.V. | Substrate support assembly and substrate processing device including the same |
USD958094S1 (en) * | 2019-07-29 | 2022-07-19 | Samsung Display Co., Ltd. | Display panel |
USD966276S1 (en) * | 2019-07-29 | 2022-10-11 | Samsung Display Co., Ltd. | Display module for wearable device |
TWD208179S (en) | 2019-08-07 | 2020-11-11 | 日商國際電氣股份有限公司 | Part of wafer boat for substrate processing equipment |
USD908645S1 (en) * | 2019-08-26 | 2021-01-26 | Applied Materials, Inc. | Sputtering target for a physical vapor deposition chamber |
USD937329S1 (en) * | 2020-03-23 | 2021-11-30 | Applied Materials, Inc. | Sputter target for a physical vapor deposition chamber |
USD947802S1 (en) * | 2020-05-20 | 2022-04-05 | Applied Materials, Inc. | Replaceable substrate carrier interfacing film |
USD981970S1 (en) * | 2021-03-04 | 2023-03-28 | Kokusai Electric Corporation | Substrate mounting plate for substrate processing apparatus |
USD981972S1 (en) * | 2021-03-22 | 2023-03-28 | Kokusai Electric Corporation | Adiabatic plate for substrate processing appratus |
USD984972S1 (en) * | 2021-03-29 | 2023-05-02 | Beijing Naura Microelectronics Equipment Co., Ltd. | Electrostatic chuck for semiconductor manufacture |
Non-Patent Citations (10)
Title |
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Jul. 27, 2023 Search Report from Notice of Allowance issued in Taiwanese Patent Application No. 112302142. |
Jul. 27, 2023 Search Report from Notice of Allowance issued in Taiwanese Patent Application No. 112302143. |
Jul. 28, 2023 Office Action issued in Chinese Patent Application No. 202230212056.9. |
Jun. 13, 2024 Office Action issued in Chinese Patent Application No. 202330659182.3. |
Oct. 24, 2022 Search Report issued in Taiwanese Design Patent Application No. 111301793. |
Oct. 24, 2022 Search Report issued in Taiwanese Design Patent Application No. 111301793D01. |
Oct. 24, 2022 Search Report issued in Taiwanese Design Patent Application No. 111301793D02. |
Oct. 24, 2022 Search Report issued in Taiwanese Design Patent Application No. 111301793D03. |
Oct. 24, 2022 Search Report issued in Taiwanese Design Patent Application No. 111301793D04. |
Wafer Carrier Trays,https://www.tedpella.com/storage-boxes-bags_html/wafer-carrier-trays.aspx, 2023. (Year: 2023). * |
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FEPP | Fee payment procedure |
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