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USD1054388S1 - Carrier substrate for handling - Google Patents

Carrier substrate for handling Download PDF

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Publication number
USD1054388S1
USD1054388S1 US29/835,098 US202229835098F USD1054388S US D1054388 S1 USD1054388 S1 US D1054388S1 US 202229835098 F US202229835098 F US 202229835098F US D1054388 S USD1054388 S US D1054388S
Authority
US
United States
Prior art keywords
handling
carrier substrate
view
elevational view
encircled portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/835,098
Inventor
Yoshinori Ogawa
Kazunori Kondo
Nobuaki Tomura
Nobuaki Matsumoto
Akira Sakamoto
Taichi KITAGAWA
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2021022501F external-priority patent/JP1727916S/en
Priority claimed from JP2021022502F external-priority patent/JP1724481S/en
Priority claimed from JP2021022499F external-priority patent/JP1718604S/en
Priority claimed from JP2021022497F external-priority patent/JP1724567S/en
Priority claimed from JP2021022498F external-priority patent/JP1718541S/en
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Assigned to SHIN-ETSU CHEMICAL CO., LTD. reassignment SHIN-ETSU CHEMICAL CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KITAGAWA, Taichi, KONDO, KAZUNORI, MATSUMOTO, NOBUAKI, OGAWA, YOSHINORI, SAKAMOTO, AKIRA, TOMURA, NOBUAKI
Application granted granted Critical
Publication of USD1054388S1 publication Critical patent/USD1054388S1/en
Active legal-status Critical Current
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Description

FIG. 1 is a perspective view of a first embodiment of a carrier substrate for handling, showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left-side elevational view thereof, the right-side elevational view being a mirror image thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is an enlarged view taken from encircled portion labeled, “FIG. 7 ,” in FIG. 1 ;
FIG. 8 is an enlarged view taken from encircled portion labeled, “FIG. 8 ,” in FIG. 1 ;
FIG. 9 is an enlarged view taken from encircled portion labeled, “FIG. 9 ,” in FIG. 2 ; and
FIG. 10 is an enlarged view taken from encircled portion labeled, “FIG. 10 ,” in FIG. 4 .
FIG. 11 is a perspective view of a second embodiment of a carrier substrate for handling, showing our new design;
FIG. 12 is a front elevational view thereof;
FIG. 13 is a rear elevational view thereof;
FIG. 14 is a left-side elevational view thereof, the right-side elevational view being a mirror image thereof;
FIG. 15 is a top plan view thereof;
FIG. 16 is a bottom plan view thereof;
FIG. 17 is an enlarged view taken from encircled portion labeled, “FIG. 17 ,” in FIG. 11 ; and,
FIG. 18 is an enlarged view taken from encircled portion labeled, “FIG. 18 ,” in FIG. 14 .
The evenly-spaced broken lines depict parts of the carrier substrate for handling that form no part of the claimed design. The dot-dash broken lines depict boundaries of the enlarged portion views shown in FIGS. 1, 2, 4, 7-11, 14, 17, and 18 , and form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a carrier substrate for handling as shown and described.
US29/835,098 2021-10-15 2022-04-15 Carrier substrate for handling Active USD1054388S1 (en)

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
JP2021-022499D 2021-10-15
JP2021022501F JP1727916S (en) 2021-10-15 2021-10-15 Carrier substrate for handling
JP2021022502F JP1724481S (en) 2021-10-15 2021-10-15 Carrier substrate for handling
JP2021022499F JP1718604S (en) 2021-10-15 2021-10-15 Carrier board for handling
JP2021-022497D 2021-10-15
JP2021022497F JP1724567S (en) 2021-10-15 2021-10-15 Carrier substrate for handling
JP2021-022498D 2021-10-15
JP2021-022501D 2021-10-15
JP2021-022502D 2021-10-15
JP2021022498F JP1718541S (en) 2021-10-15 2021-10-15 Carrier board for handling

Publications (1)

Publication Number Publication Date
USD1054388S1 true USD1054388S1 (en) 2024-12-17

Family

ID=93841431

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/835,098 Active USD1054388S1 (en) 2021-10-15 2022-04-15 Carrier substrate for handling

Country Status (1)

Country Link
US (1) USD1054388S1 (en)

Citations (47)

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US6815352B1 (en) * 1999-11-09 2004-11-09 Shin-Etsu Chemical Co., Ltd. Silicon focus ring and method for producing the same
JP2006310616A (en) 2005-04-28 2006-11-09 Shin Etsu Polymer Co Ltd Manufacturing method of stationary carrier
USD544452S1 (en) * 2005-09-08 2007-06-12 Tokyo Ohka Kogyo Co., Ltd. Supporting plate
USD552565S1 (en) * 2005-09-08 2007-10-09 Tokyo Ohka Kogyo Co., Ltd. Supporting plate
USD559805S1 (en) * 2005-08-12 2008-01-15 Tokyo Electron Limited Stage arm for a semiconductor wafer delivery apparatus
JP2008227107A (en) 2007-03-12 2008-09-25 Yokohama National Univ Method for moving microstructure
USD583394S1 (en) * 2006-12-15 2008-12-23 Tokyo Electron Limited Cover for a heater stage of a plasma processing apparatus
USD589474S1 (en) * 2007-06-06 2009-03-31 Tokyo Electron Limited Wafer holding member
USD589912S1 (en) * 2007-06-06 2009-04-07 Tokyo Electron Limited Wafer holding member
USD609652S1 (en) * 2008-07-22 2010-02-09 Tokyo Electron Limited Wafer attracting plate
USD614593S1 (en) * 2008-07-21 2010-04-27 Asm Genitech Korea Ltd Substrate support for a semiconductor deposition apparatus
US20100108500A1 (en) * 2008-10-31 2010-05-06 Applied Materials, Inc. Encapsulated sputtering target
US7943491B2 (en) 2004-06-04 2011-05-17 The Board Of Trustees Of The University Of Illinois Pattern transfer printing by kinetic control of adhesion to an elastomeric stamp
USD654883S1 (en) * 2010-10-21 2012-02-28 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
USD654884S1 (en) * 2010-10-21 2012-02-28 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
USD674759S1 (en) * 2010-08-19 2013-01-22 Epistar Corporation Wafer carrier
US8389320B2 (en) * 2007-03-20 2013-03-05 Sanyo Electric Co., Ltd. Method for fracturing semiconductor substrate, method for fracturing solar cell, and the solar cell
USD684551S1 (en) * 2011-07-07 2013-06-18 Phuong Van Nguyen Wafer polishing pad holder
US8551864B2 (en) * 2011-03-25 2013-10-08 Sumitomo Electric Industries, Ltd. Method of manufacturing semiconductor device
US8555492B2 (en) * 2009-12-30 2013-10-15 Harvatek Corporation Method for manufacturing a conductive substrate structure with conductive channels formed by using a two-sided cut approach
US8690135B2 (en) * 2006-12-18 2014-04-08 Camtek Ltd. Chuck and a method for supporting an object
USD708651S1 (en) * 2011-11-22 2014-07-08 Applied Materials, Inc. Electrostatic chuck
USD716742S1 (en) * 2013-09-13 2014-11-04 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD720313S1 (en) * 2014-06-16 2014-12-30 Emcore Solar Power, Inc. Semiconductor wafer with dicing positions for solar cell fabrication
USD723077S1 (en) * 2013-12-03 2015-02-24 Applied Materials, Inc. Chuck carrier film
USD724553S1 (en) * 2013-09-13 2015-03-17 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD753269S1 (en) * 2015-01-09 2016-04-05 Asm Ip Holding B.V. Top plate
TWD178145S (en) 2014-12-17 2016-09-11 日本碍子股份有限公司 Composite substrates
USD789888S1 (en) * 2016-01-08 2017-06-20 Asm Ip Holding B.V. Electrode plate for semiconductor manufacturing apparatus
USD793971S1 (en) * 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 14-pocket configuration
USD797067S1 (en) * 2015-04-21 2017-09-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD830981S1 (en) * 2017-04-07 2018-10-16 Asm Ip Holding B.V. Susceptor for semiconductor substrate processing apparatus
USD849422S1 (en) * 2014-12-17 2019-05-28 Ngk Insulators, Ltd. Composite substrate for acoustic wave device
TWI689017B (en) 2013-09-25 2020-03-21 新加坡商史達晶片有限公司 Semiconductor device and method of controlling warpage in reconstituted wafer
WO2020166184A1 (en) 2019-02-12 2020-08-20 信越化学工業株式会社 Microstructure transfer device, stamp head unit, stamp component for microstructure transfer, and method for transferring microstructure integrated component
TWD208179S (en) 2019-08-07 2020-11-11 日商國際電氣股份有限公司 Part of wafer boat for substrate processing equipment
USD908645S1 (en) * 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
USD924823S1 (en) * 2018-07-19 2021-07-13 Kokusai Electric Corporation Adiabatic plate for substrate processing apparatus
USD937329S1 (en) * 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD947802S1 (en) * 2020-05-20 2022-04-05 Applied Materials, Inc. Replaceable substrate carrier interfacing film
USD958094S1 (en) * 2019-07-29 2022-07-19 Samsung Display Co., Ltd. Display panel
USD966276S1 (en) * 2019-07-29 2022-10-11 Samsung Display Co., Ltd. Display module for wearable device
USD981970S1 (en) * 2021-03-04 2023-03-28 Kokusai Electric Corporation Substrate mounting plate for substrate processing apparatus
USD981972S1 (en) * 2021-03-22 2023-03-28 Kokusai Electric Corporation Adiabatic plate for substrate processing appratus
US11629407B2 (en) * 2019-02-22 2023-04-18 Asm Ip Holding B.V. Substrate processing apparatus and method for processing substrates
USD984972S1 (en) * 2021-03-29 2023-05-02 Beijing Naura Microelectronics Equipment Co., Ltd. Electrostatic chuck for semiconductor manufacture
US11664267B2 (en) * 2019-07-10 2023-05-30 Asm Ip Holding B.V. Substrate support assembly and substrate processing device including the same

Patent Citations (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6815352B1 (en) * 1999-11-09 2004-11-09 Shin-Etsu Chemical Co., Ltd. Silicon focus ring and method for producing the same
US7943491B2 (en) 2004-06-04 2011-05-17 The Board Of Trustees Of The University Of Illinois Pattern transfer printing by kinetic control of adhesion to an elastomeric stamp
JP2006310616A (en) 2005-04-28 2006-11-09 Shin Etsu Polymer Co Ltd Manufacturing method of stationary carrier
USD559805S1 (en) * 2005-08-12 2008-01-15 Tokyo Electron Limited Stage arm for a semiconductor wafer delivery apparatus
USD544452S1 (en) * 2005-09-08 2007-06-12 Tokyo Ohka Kogyo Co., Ltd. Supporting plate
USD552565S1 (en) * 2005-09-08 2007-10-09 Tokyo Ohka Kogyo Co., Ltd. Supporting plate
USD583394S1 (en) * 2006-12-15 2008-12-23 Tokyo Electron Limited Cover for a heater stage of a plasma processing apparatus
US8690135B2 (en) * 2006-12-18 2014-04-08 Camtek Ltd. Chuck and a method for supporting an object
JP2008227107A (en) 2007-03-12 2008-09-25 Yokohama National Univ Method for moving microstructure
US8389320B2 (en) * 2007-03-20 2013-03-05 Sanyo Electric Co., Ltd. Method for fracturing semiconductor substrate, method for fracturing solar cell, and the solar cell
USD589912S1 (en) * 2007-06-06 2009-04-07 Tokyo Electron Limited Wafer holding member
USD589474S1 (en) * 2007-06-06 2009-03-31 Tokyo Electron Limited Wafer holding member
USD614593S1 (en) * 2008-07-21 2010-04-27 Asm Genitech Korea Ltd Substrate support for a semiconductor deposition apparatus
USD609652S1 (en) * 2008-07-22 2010-02-09 Tokyo Electron Limited Wafer attracting plate
US20100108500A1 (en) * 2008-10-31 2010-05-06 Applied Materials, Inc. Encapsulated sputtering target
US8555492B2 (en) * 2009-12-30 2013-10-15 Harvatek Corporation Method for manufacturing a conductive substrate structure with conductive channels formed by using a two-sided cut approach
USD674759S1 (en) * 2010-08-19 2013-01-22 Epistar Corporation Wafer carrier
USD704155S1 (en) * 2010-08-19 2014-05-06 Epistar Corporation Wafer carrier
USD654884S1 (en) * 2010-10-21 2012-02-28 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
USD654883S1 (en) * 2010-10-21 2012-02-28 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
US8551864B2 (en) * 2011-03-25 2013-10-08 Sumitomo Electric Industries, Ltd. Method of manufacturing semiconductor device
USD684551S1 (en) * 2011-07-07 2013-06-18 Phuong Van Nguyen Wafer polishing pad holder
USD708651S1 (en) * 2011-11-22 2014-07-08 Applied Materials, Inc. Electrostatic chuck
USD716742S1 (en) * 2013-09-13 2014-11-04 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD724553S1 (en) * 2013-09-13 2015-03-17 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
TWI689017B (en) 2013-09-25 2020-03-21 新加坡商史達晶片有限公司 Semiconductor device and method of controlling warpage in reconstituted wafer
USD723077S1 (en) * 2013-12-03 2015-02-24 Applied Materials, Inc. Chuck carrier film
USD720313S1 (en) * 2014-06-16 2014-12-30 Emcore Solar Power, Inc. Semiconductor wafer with dicing positions for solar cell fabrication
TWD178145S (en) 2014-12-17 2016-09-11 日本碍子股份有限公司 Composite substrates
USD849422S1 (en) * 2014-12-17 2019-05-28 Ngk Insulators, Ltd. Composite substrate for acoustic wave device
USD753269S1 (en) * 2015-01-09 2016-04-05 Asm Ip Holding B.V. Top plate
USD793971S1 (en) * 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 14-pocket configuration
USD797067S1 (en) * 2015-04-21 2017-09-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD789888S1 (en) * 2016-01-08 2017-06-20 Asm Ip Holding B.V. Electrode plate for semiconductor manufacturing apparatus
USD830981S1 (en) * 2017-04-07 2018-10-16 Asm Ip Holding B.V. Susceptor for semiconductor substrate processing apparatus
USD924823S1 (en) * 2018-07-19 2021-07-13 Kokusai Electric Corporation Adiabatic plate for substrate processing apparatus
US20220124949A1 (en) 2019-02-12 2022-04-21 Shin-Etsu Chemical Co., Ltd. Microstructure-transfer apparatus, stamp head unit, stamp component for transferring microstructure, and method for transferring microstructure-integrated component
JP2020129638A (en) 2019-02-12 2020-08-27 信越化学工業株式会社 Microstructure transfer device, stamp head unit, microstructure transfer stamp part, and microstructure integrated part transfer method
WO2020166184A1 (en) 2019-02-12 2020-08-20 信越化学工業株式会社 Microstructure transfer device, stamp head unit, stamp component for microstructure transfer, and method for transferring microstructure integrated component
US11629407B2 (en) * 2019-02-22 2023-04-18 Asm Ip Holding B.V. Substrate processing apparatus and method for processing substrates
US11664267B2 (en) * 2019-07-10 2023-05-30 Asm Ip Holding B.V. Substrate support assembly and substrate processing device including the same
USD958094S1 (en) * 2019-07-29 2022-07-19 Samsung Display Co., Ltd. Display panel
USD966276S1 (en) * 2019-07-29 2022-10-11 Samsung Display Co., Ltd. Display module for wearable device
TWD208179S (en) 2019-08-07 2020-11-11 日商國際電氣股份有限公司 Part of wafer boat for substrate processing equipment
USD908645S1 (en) * 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
USD937329S1 (en) * 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD947802S1 (en) * 2020-05-20 2022-04-05 Applied Materials, Inc. Replaceable substrate carrier interfacing film
USD981970S1 (en) * 2021-03-04 2023-03-28 Kokusai Electric Corporation Substrate mounting plate for substrate processing apparatus
USD981972S1 (en) * 2021-03-22 2023-03-28 Kokusai Electric Corporation Adiabatic plate for substrate processing appratus
USD984972S1 (en) * 2021-03-29 2023-05-02 Beijing Naura Microelectronics Equipment Co., Ltd. Electrostatic chuck for semiconductor manufacture

Non-Patent Citations (10)

* Cited by examiner, † Cited by third party
Title
Jul. 27, 2023 Search Report from Notice of Allowance issued in Taiwanese Patent Application No. 112302142.
Jul. 27, 2023 Search Report from Notice of Allowance issued in Taiwanese Patent Application No. 112302143.
Jul. 28, 2023 Office Action issued in Chinese Patent Application No. 202230212056.9.
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Oct. 24, 2022 Search Report issued in Taiwanese Design Patent Application No. 111301793D02.
Oct. 24, 2022 Search Report issued in Taiwanese Design Patent Application No. 111301793D03.
Oct. 24, 2022 Search Report issued in Taiwanese Design Patent Application No. 111301793D04.
Wafer Carrier Trays,https://www.tedpella.com/storage-boxes-bags_html/wafer-carrier-trays.aspx, 2023. (Year: 2023). *

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